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JP2011188145A - Manufacturing method of electronic device package, electronic device package, and oscillator - Google Patents

Manufacturing method of electronic device package, electronic device package, and oscillator Download PDF

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Publication number
JP2011188145A
JP2011188145A JP2010049878A JP2010049878A JP2011188145A JP 2011188145 A JP2011188145 A JP 2011188145A JP 2010049878 A JP2010049878 A JP 2010049878A JP 2010049878 A JP2010049878 A JP 2010049878A JP 2011188145 A JP2011188145 A JP 2011188145A
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Prior art keywords
base substrate
electronic device
substrate
device package
metal film
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JP5554092B2 (en
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Yoshifumi Yoshida
宜史 吉田
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Seiko Instruments Inc
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Seiko Instruments Inc
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Priority to JP2010049878A priority Critical patent/JP5554092B2/en
Priority to TW100104894A priority patent/TWI517310B/en
Priority to EP11156692A priority patent/EP2363374A3/en
Priority to US13/039,967 priority patent/US20110215429A1/en
Priority to CN201110051220.3A priority patent/CN102194712B/en
Priority to KR1020110019330A priority patent/KR101841767B1/en
Publication of JP2011188145A publication Critical patent/JP2011188145A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/031—Anodic bondings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Micromachines (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device package manufacturing method by which a base substrate of insulating material and a cover substrate of insulating material can be bonded together via a metal film by anodic bonding in a stable manner. <P>SOLUTION: The electronic device package manufacturing method includes the steps of: forming a metal film on both surfaces of a cover substrate 3 so that the metal film on one surface and a metal surface on the other surface may conduct with each other; aligning and superimposing the cover substrate 3 and a base substrate 2; and bonding the base substrate 2 and the cover substrate 3 together by anodic bonding by bringing an electrode plate 21 to be connected to a negative electrode into contact with the base substrate 2 on a surface opposite to a surface bonded to the cover substrate 3, bringing an electrode plate 22 to be connected a positive electrode into contact with the cover substrate 3 on a surface opposite to a surface bonded to the base substrate 2, and applying a voltage between the electrode plate 22 to be connected to a positive electrode and the electrode plate 21 to be connected to a negative electrode. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、接合された２枚の基板の間に形成されたキャビティ内に電子デバイスが封止された表面実装型（ＳＭＤ）のパッケージに関するものである。特に２枚の基板を陽極接合するための構造について提案する。   The present invention relates to a surface mount type (SMD) package in which an electronic device is sealed in a cavity formed between two bonded substrates. In particular, a structure for anodic bonding of two substrates is proposed.

近年、携帯電話や携帯情報端末機器には、表面実装型の小型パッケージを用いた電子デバイスが多く用いられている。この中で、振動子やＭＥＭＳ、ジャイロセンサ、加速度センサなど、中空のキャビティ構造のパッケージが必要な部品も多い。中空のキャビティ構造のパッケージには、絶縁物のベース基板と絶縁物の蓋基板とが金属膜を介して接合された構造が知られている。また接合方法も、共晶結合やシーム接合、陽極接合が知られている（特許文献１参照）。   2. Description of the Related Art In recent years, many electronic devices using surface-mounted small packages have been used for mobile phones and portable information terminal devices. Among these, there are many parts that require a package having a hollow cavity structure, such as a vibrator, a MEMS, a gyro sensor, and an acceleration sensor. A package having a hollow cavity structure is known in which an insulating base substrate and an insulating lid substrate are bonded via a metal film. Also, eutectic bonding, seam bonding, and anodic bonding are known as bonding methods (see Patent Document 1).

ここで従来の絶縁物のベース基板と絶縁物の蓋基板とが金属膜を介して陽極接合されたパッケージの製造方法について説明する。特に、複数のパッケージ要素が１枚のシート状のベース基板上にアレイ状に形成され、蓋基板をベース基板に接合した後に１つ１つのパッケージに分割する製法について説明する。   A conventional method for manufacturing a package in which an insulating base substrate and an insulating lid substrate are anodically bonded via a metal film will be described. In particular, a manufacturing method will be described in which a plurality of package elements are formed in an array on a single sheet-like base substrate, and the lid substrate is bonded to the base substrate and then divided into individual packages.

図８に示すように従来の電子デバイスパッケージは、電子デバイス４７と、凹部が形成されたベース基板４１と、平板状の蓋基板４２と、ベース基板４１と蓋基板４２とを接合するための接合膜である金属膜４９と、から構成されている。ベース基板４１には凹部が形成され、蓋基板４２でベース基板４１を封止することでキャビティ４６が構成される。電子デバイス４７はキャビティ４６内に収納される。   As shown in FIG. 8, a conventional electronic device package includes an electronic device 47, a base substrate 41 having a recess, a flat lid substrate 42, and a junction for joining the base substrate 41 and the lid substrate 42 together. And a metal film 49 which is a film. A recess is formed in the base substrate 41, and the base substrate 41 is sealed with the lid substrate 42 to form the cavity 46. The electronic device 47 is accommodated in the cavity 46.

ベース基板４１は、可動イオンを含む絶縁物、例えばガラス材料などで構成され、凹部を有するように形成されている。ベース基板４１の表面には電子デバイス４７を実装するための配線４３が実装される電子デバイス４７の数に応じて形成され、ベース基板４１の対応する裏面には外部電極４５が形成されている。ベース基板４１の表面の配線４３と裏面の外部電極４５とを接続するために、パッケージの任意の場所に貫通孔及びこれを埋める貫通電極４４が形成され、貫通電極４４を介して配線４３と外部電極４５とが接続されている。   The base substrate 41 is made of an insulator containing movable ions, such as a glass material, and is formed to have a recess. On the front surface of the base substrate 41, wirings 43 for mounting the electronic devices 47 are formed according to the number of electronic devices 47 to be mounted, and on the corresponding back surface of the base substrate 41, external electrodes 45 are formed. In order to connect the wiring 43 on the front surface of the base substrate 41 and the external electrode 45 on the back surface, a through hole and a through electrode 44 filling the same are formed at an arbitrary position of the package. The electrode 45 is connected.

蓋基板４２は、ベース基板４１と同様に可動イオンを含む絶縁物、例えばガラス材料などで構成され、平板状に形成されている。ベース基板４１と蓋基板４２とが接合されてキャビティ４６を形成する際、ベース基板４１と蓋基板４２とが接する部分には接合膜としての金属膜４９が形成されている。本来はベース基板４１と蓋基板４２とが接する部分のみに金属膜４９を形成すればよいが、工程の簡素化を考慮した場合、図８（Ｄ）に示すように蓋基板４２の片面全面に金属膜４９を形成する。   Similar to the base substrate 41, the lid substrate 42 is made of an insulator containing movable ions, such as a glass material, and is formed in a flat plate shape. When the base substrate 41 and the lid substrate 42 are bonded to form the cavity 46, a metal film 49 as a bonding film is formed at a portion where the base substrate 41 and the lid substrate 42 are in contact with each other. Originally, the metal film 49 may be formed only on the portion where the base substrate 41 and the lid substrate 42 are in contact with each other. However, in consideration of the simplification of the process, as shown in FIG. A metal film 49 is formed.

製造方法について説明する。ウェハ状のベース基板４１に複数の電子デバイス４７が実装できるように凹型のキャビティ４６を複数形成し、その後、電子デバイス４７を実装するための配線４３と外部電極４５と貫通電極４４とを形成する（図８（Ａ））。次にキャビティ４６内に電子デバイス４７を実装し、電子デバイス４７と配線４３とをワイヤボンディングによるワイヤ４８で接続する（図８（Ｂ））。平板状の蓋基板４２（図８（Ｃ））の片面に接合膜としての金属膜４９を形成する（図８（Ｄ））。この金属膜として適しているのは、アルミ、クロム、シリコン、銅などである。   A manufacturing method will be described. A plurality of concave cavities 46 are formed on the wafer-like base substrate 41 so that a plurality of electronic devices 47 can be mounted, and then wiring 43, external electrodes 45, and through electrodes 44 for mounting the electronic devices 47 are formed. (FIG. 8 (A)). Next, the electronic device 47 is mounted in the cavity 46, and the electronic device 47 and the wiring 43 are connected by a wire 48 by wire bonding (FIG. 8B). A metal film 49 as a bonding film is formed on one surface of the flat lid substrate 42 (FIG. 8C) (FIG. 8D). Suitable examples of the metal film include aluminum, chromium, silicon, and copper.

そして、ベース基板４１と蓋基板４２とをアライメントして重ね合せ、陽極接合を行う。陽極接合では図８（Ｅ）に示すように、アライメントされたベース基板４１と蓋基板４２とをヒータ兼電極の基板５０、５１で挟み込む。そして金属膜４９に接触するように正極プローブ５２をセットし、ヒータ兼電極の基板５０、５１の温度を上昇させて、正極プローブ５２とヒータ兼電極の基板５０との間に電圧を印加することにより、ベース基板４１と蓋基板４２とが金属膜４９を介して接合される。後はダイシング装置等でパッケージ要素を個別に切断し、個々の電子デバイスパッケージが完成する。   Then, the base substrate 41 and the lid substrate 42 are aligned and overlapped to perform anodic bonding. In anodic bonding, as shown in FIG. 8E, the aligned base substrate 41 and lid substrate 42 are sandwiched between substrates 50 and 51 serving as heaters and electrodes. Then, the positive electrode probe 52 is set so as to be in contact with the metal film 49, the temperature of the heater / electrode substrates 50, 51 is raised, and a voltage is applied between the positive electrode probe 52 and the heater / electrode substrate 50. Thus, the base substrate 41 and the lid substrate 42 are bonded via the metal film 49. Thereafter, the package elements are individually cut by a dicing apparatus or the like to complete individual electronic device packages.

特開平０９−００２８４５号公報JP 09-002845 A

しかしながら、従来の電子デバイスパッケージの製造方法には、以下の課題が残されている。まず、陽極接合を行うとき、正極プローブ５２を接合膜である金属膜４９の一部に接触させているが、金属膜４９のシート抵抗が高い場合、ウェハである蓋基板４２の全面を同じ電位に維持することが難しく、ウェハ面内で接合強度にバラツキを生じるという課題があった。シート抵抗を下げる対策として、金属膜４９の膜厚を厚くして抵抗値を下げる対策を採用したりしている。しかし金属膜４９の膜厚を厚くしてしまうと、金属膜４９とベース基板４１との接合強度が低下してしまう。さらに蓋基板４２の片面に金属膜４９を形成するため、金属膜４９の膜厚が厚いと、蓋基板４２が反ってしまうという課題がある。   However, the following problems remain in the conventional method for manufacturing an electronic device package. First, when performing anodic bonding, the positive electrode probe 52 is brought into contact with a part of the metal film 49 that is a bonding film. When the sheet resistance of the metal film 49 is high, the entire surface of the lid substrate 42 that is a wafer has the same potential. Therefore, there is a problem that the bonding strength varies within the wafer surface. As a measure for reducing the sheet resistance, a measure for reducing the resistance value by increasing the thickness of the metal film 49 is employed. However, when the thickness of the metal film 49 is increased, the bonding strength between the metal film 49 and the base substrate 41 is lowered. Furthermore, since the metal film 49 is formed on one surface of the lid substrate 42, there is a problem that if the metal film 49 is thick, the lid substrate 42 is warped.

また、正極プローブ５２を金属膜４９の一部に接触させるために、図８（Ｅ）に示すようにベース基板４１と蓋基板４２とをずらして正極プローブ５２を接触させなければならない。このため、ベース基板４１と蓋基板４２とのアライメントには大きな制約があるという課題がある。特に、蓋基板４２側にパターンが形成されたパッケージの場合、アライメント時の制約はウェハからの製品取り個数に大きく影響するという課題がある。   Further, in order to bring the positive electrode probe 52 into contact with a part of the metal film 49, the positive electrode probe 52 must be brought into contact with the base substrate 41 and the lid substrate 42 as shown in FIG. 8E. For this reason, there is a problem that alignment between the base substrate 41 and the lid substrate 42 is greatly restricted. In particular, in the case of a package in which a pattern is formed on the lid substrate 42 side, there is a problem that restrictions during alignment greatly affect the number of products taken from the wafer.

本発明は、このような事情に考慮してなされたもので、その目的は、絶縁物のベース基板と絶縁物の蓋基板とを金属膜を介して安定的に陽極接合できる電子デバイスパッケージの製造方法を提供することである。   The present invention has been made in view of such circumstances, and an object thereof is to manufacture an electronic device package capable of stably anodically bonding an insulating base substrate and an insulating lid substrate via a metal film. Is to provide a method.

本発明に係る電子デバイスパッケージの製造方法は、可動イオンを含む絶縁物からなるベース基板と、前記ベース基板に対向させた状態で該ベース基板に接合される可動イオンを含む絶縁物からなる蓋基板と、前記ベース基板と前記蓋基板との間に複数形成されたキャビティ内のそれぞれに収納されるとともに前記ベース基板上に実装された電子デバイスと、を備えた電子デバイスパッケージの製造方法において、前記蓋基板の両面に互いに導通する金属膜を形成する工程と、前記蓋基板と前記ベース基板とをアライメントして重ね合せる工程と、前記ベース基板における前記蓋基板に接合される面とは反対の面に一方の電極板を接触させ、前記蓋基板における前記ベース基板に接合される面とは反対の面に他方の電極板を接触させ、前記一方の電極板と前記他方の電極板との間に電圧を印加することで前記ベース基板と前記蓋基板とを前記金属膜を介して陽極接合する工程と、を備えたものである。   An electronic device package manufacturing method according to the present invention includes a base substrate made of an insulator containing movable ions, and a lid substrate made of an insulator containing movable ions bonded to the base substrate in a state of being opposed to the base substrate. And an electronic device housed in each of a plurality of cavities formed between the base substrate and the lid substrate and mounted on the base substrate. A step of forming metal films that are electrically connected to each other on both sides of the lid substrate, a step of aligning and overlapping the lid substrate and the base substrate, and a surface opposite to a surface of the base substrate to be bonded to the lid substrate One electrode plate is brought into contact with the other electrode plate, and the other electrode plate is brought into contact with the surface of the lid substrate opposite to the surface bonded to the base substrate. A step of anodic bonding via the metal film and the lid substrate and the base substrate by applying a voltage between the electrode plates and the other electrode plate in which with a.

本発明に係る電子デバイスパッケージの製造方法によれば、蓋基板となるウェハの両面に互いに導通する金属膜を形成している。そのため、蓋基板におけるベース基板に対して接合される面とは反対の面に電極板を接触させることができ、接合部の電位を確実に維持することができるという効果がある。特に金属膜の材料としてシート抵抗の高い金属を用いたり、非常に薄い金属膜を用いたりする場合に有効である。また金属膜の材料としてシート抵抗の高い金属を用いた場合、金属膜の厚みを厚くする必要がなくなるため、金属膜による蓋基板の反りを抑えることができ、ベース基板と蓋基板のアライメント精度を向上させることができるという効果がある。また蓋基板におけるベース基板に接合される面とは反対の面に電極を接触させればよいため、ベース基板と蓋基板とのアライメントに大きな制約がかかることもなくなる。   According to the method for manufacturing an electronic device package of the present invention, metal films that are electrically connected to each other are formed on both surfaces of a wafer that is to be a lid substrate. Therefore, the electrode plate can be brought into contact with the surface of the lid substrate that is opposite to the surface that is bonded to the base substrate, and the potential of the bonded portion can be reliably maintained. This is particularly effective when a metal having a high sheet resistance is used as the material of the metal film or a very thin metal film is used. In addition, when a metal with a high sheet resistance is used as the material of the metal film, it is not necessary to increase the thickness of the metal film, so that the warpage of the lid substrate due to the metal film can be suppressed, and the alignment accuracy between the base substrate and the lid substrate is improved. There is an effect that it can be improved. In addition, since it is only necessary to bring the electrode into contact with the surface of the lid substrate that is opposite to the surface to be bonded to the base substrate, there is no great restriction on the alignment between the base substrate and the lid substrate.

さらに陽極接合時、蓋基板におけるベース基板に接合される面とは反対の面全面に電極板を接触させると、蓋基板を覆っている金属膜の効果だけでなく、絶縁物である蓋基板の容量による電荷のやり取り効果もあるため、陽極接合時に移動する電荷量が増加し、より強固な接合強度を得ることができるという効果がある。   Further, when the electrode plate is brought into contact with the entire surface of the lid substrate opposite to the surface to be bonded to the base substrate during anodic bonding, not only the effect of the metal film covering the lid substrate but also the lid substrate as an insulator is brought into contact. Since there is also an effect of exchanging electric charges due to the capacity, there is an effect that the amount of electric charge that moves at the time of anodic bonding increases, and a stronger bonding strength can be obtained.

本発明に係る電子デバイスパッケージの一実施形態を示す斜視図である。It is a perspective view showing one embodiment of an electronic device package concerning the present invention. 本発明に係る電子デバイスパッケージの一実施形態を示す断面図である。It is sectional drawing which shows one Embodiment of the electronic device package which concerns on this invention. 本発明に係る電子デバイスパッケージの製造方法の一実施形態を示すフロー工程図である。It is a flow process figure showing one embodiment of a manufacturing method of an electronic device package concerning the present invention. 本発明に係る電子デバイスパッケージの製造方法の一実施形態を示す断面工程図である。It is sectional process drawing which shows one Embodiment of the manufacturing method of the electronic device package which concerns on this invention. 本発明に係る電子デバイスパッケージの製造方法の一実施形態を示す断面工程図である。It is sectional process drawing which shows one Embodiment of the manufacturing method of the electronic device package which concerns on this invention. 本発明に係る電子デバイスパッケージの別の一実施形態を示す断面図である。It is sectional drawing which shows another one Embodiment of the electronic device package which concerns on this invention. 本発明に係る発振器の一実施形態を示す図である。It is a figure which shows one Embodiment of the oscillator based on this invention. 従来の電子デバイスパッケージの断面工程図である。It is sectional process drawing of the conventional electronic device package.

以下、本発明に係る実施形態を、図１から図５を参照して説明する。本実施形態の電子デバイスパッケージ１は、図１及び図２に示すように、ベース基板２と蓋基板３とが２層に積層された箱状に形成されており、内部のキャビティ５内に電子デバイス４が収納された表面実装型パッケージである。電子デバイス４とは、ＬＳＩやＭＥＭＳ、センサ、圧電振動子、あるいはその複合体である。   Hereinafter, embodiments according to the present invention will be described with reference to FIGS. 1 to 5. As shown in FIGS. 1 and 2, the electronic device package 1 of the present embodiment is formed in a box shape in which a base substrate 2 and a lid substrate 3 are laminated in two layers, and an electronic device package 1 has an electron inside the cavity 5. It is a surface mount type package in which the device 4 is housed. The electronic device 4 is an LSI, MEMS, sensor, piezoelectric vibrator, or complex thereof.

ベース基板２及び蓋基板３は共に可動イオンを含む絶縁物、例えばソーダ石灰ガラスからなる絶縁基板である。図１及び図２に示す例では、ベース基板２に電子デバイス４が収まる矩形状の凹部（キャビティ）５が形成され、蓋基板３は平板状に形成されている。凹部５は、両基板２、３が重ね合わされたときに、電子デバイス４を収納するキャビティ５となる凹部である。そして、ベース基板２は、この凹部５を蓋基板３側に対向させた状態で該蓋基板３に対して接合膜である金属膜６を介して陽極接合されている。   Both the base substrate 2 and the lid substrate 3 are insulating substrates made of an insulator containing movable ions, for example, soda lime glass. In the example shown in FIGS. 1 and 2, a rectangular recess (cavity) 5 in which the electronic device 4 can be accommodated is formed on the base substrate 2, and the lid substrate 3 is formed in a flat plate shape. The recess 5 is a recess that becomes a cavity 5 that houses the electronic device 4 when the substrates 2 and 3 are overlapped. The base substrate 2 is anodically bonded to the lid substrate 3 through a metal film 6 as a bonding film with the recess 5 facing the lid substrate 3 side.

図２に示すように電子デバイス４と外部電極１０とを電気的に接続するために貫通電極９がベース基板２に形成されている。貫通電極９を通すための貫通孔は、キャビティ５内に開口するように形成されている。図２では、貫通孔は略一定の径を維持しながらベース基板２を真っ直ぐに貫通した貫通孔を例に挙げて説明するが、この場合に限られず、例えばベース基板２の下面に向かって漸次径が縮径あるいは拡径するテーパー状に形成しても構わない。いずれにしても、ベース基板２を貫通していれば良い。   As shown in FIG. 2, a through electrode 9 is formed on the base substrate 2 in order to electrically connect the electronic device 4 and the external electrode 10. A through hole for passing through the through electrode 9 is formed to open into the cavity 5. In FIG. 2, the through-hole is described as an example of a through-hole that penetrates straight through the base substrate 2 while maintaining a substantially constant diameter. However, the present invention is not limited to this case. For example, the through-hole gradually decreases toward the lower surface of the base substrate 2. You may form in the taper shape which a diameter reduces or expands. In any case, it only has to penetrate the base substrate 2.

そして貫通孔には、該貫通孔を埋めるように貫通電極９が形成されている。この貫通電極９は、貫通孔を完全に塞いでキャビティ５内の気密を維持していると共に、外部電極１０と電子デバイス４とを電気的に導通させる役割を担っている。貫通孔と貫通電極９との隙間はベース基板２のガラス材料と熱膨張係数を合わせたガラスフリット材を用いて完全に塞がれている。   A through electrode 9 is formed in the through hole so as to fill the through hole. The through electrode 9 completely closes the through hole to maintain airtightness in the cavity 5 and plays a role of electrically connecting the external electrode 10 and the electronic device 4. The gap between the through hole and the through electrode 9 is completely closed by using a glass frit material having a thermal expansion coefficient combined with the glass material of the base substrate 2.

上記実施の形態では貫通孔と貫通電極９との隙間をガラスフリット材で塞いでいるが、それに限定されるわけではなく、導電性接着剤や樹脂系の充填材を用いても構わない。しかし、長期的な信頼性を考慮すると、導電性接着剤や樹脂系の充填材は経時変化やアウトガスの発生を引き起こすため、貫通孔と貫通電極９の隙間を塞ぐにはガラスフリット材あるいはガラス材そのものが望ましい。   In the above embodiment, the gap between the through hole and the through electrode 9 is closed with a glass frit material, but the present invention is not limited to this, and a conductive adhesive or a resin-based filler may be used. However, considering long-term reliability, conductive adhesives and resin-based fillers cause aging and outgassing, so glass frit materials or glass materials are used to close the gaps between the through holes and the through electrodes 9. It is desirable.

次に本発明に係る一実施形態の電子デバイスパッケージの製造方法について図３のフロー工程図、図４及び図５を参照して説明する。   Next, a method of manufacturing an electronic device package according to an embodiment of the present invention will be described with reference to the flowchart of FIG. 3 and FIGS. 4 and 5.

まず、ベース基板２については、ウェハ状の絶縁基板を研磨、エッチングして目的の厚みにし、洗浄を行う（Ｓ１０）。次に平板状の絶縁物であるベース基板２にキャビティ５となる凹部を形成する（Ｓ１１）。凹部の形成方法については、フォトリソグラフィによるエッチングでの形成やプレス加工による形成など、方法は問わない。次に、キャビティ５の底部に貫通孔を形成する。貫通孔の形成方法については、フォトリソグラフィによるエッチングでの形成やプレス加工による形成など、方法は問わない（Ｓ１２）。そして、キャビティ５の底部表面に電子デバイス４を実装するための配線８を形成する（Ｓ１３）。次にキャビティ５の底部に形成された貫通孔に貫通電極９を形成する（Ｓ１４）。さらにキャビティ５の底部表面とは反対の面に外部電極１０を形成する（Ｓ１５）。外部電極１０まで形成されたベース基板２が図４（Ｄ）に示されている。   First, with respect to the base substrate 2, the wafer-like insulating substrate is polished and etched to a target thickness, and cleaning is performed (S10). Next, a recess to be a cavity 5 is formed in the base substrate 2 which is a flat insulator (S11). The method for forming the recesses is not particularly limited, such as formation by etching using photolithography or formation by pressing. Next, a through hole is formed in the bottom of the cavity 5. The method for forming the through hole is not particularly limited, such as formation by etching using photolithography or formation by pressing (S12). Then, wiring 8 for mounting the electronic device 4 is formed on the bottom surface of the cavity 5 (S13). Next, the through electrode 9 is formed in the through hole formed in the bottom of the cavity 5 (S14). Further, the external electrode 10 is formed on the surface opposite to the bottom surface of the cavity 5 (S15). The base substrate 2 formed up to the external electrode 10 is shown in FIG.

一方、蓋基板３については、ウェハ状の絶縁基板を研磨、エッチングして目的の厚みにし、洗浄を行う（Ｓ２０）。次に図４（Ｂ）に示すように平板状の蓋基板３の片方の表面全体と蓋基板３の厚み方向の側面とに接合膜としての金属膜６を形成する（Ｓ２１）。金属膜６の形成方法としては、蒸着法やスパッタリング法、ＣＶＤ法などが用いられる。金属膜６には、Ａｌ、Ｓｉ、Ｃｒなどが用いられ、その厚さは２００Å〜２０００Åの範囲に設定されている。次に図４（Ｃ）に示すように、蓋基板３の他方の表面全体と蓋基板３の厚み方向の側面とに接合膜としての金属膜６を形成する（Ｓ２２）。形成する方法としては、同様に蒸着法やスパッタリング法、ＣＶＤ法などを用いて形成する。金属膜には、Ａｌ、Ｓｉ、Ｃｒなどが用いられ、その厚さは２００Å〜２０００Åの範囲に設定されている。これにより、蓋基板３の表裏両面の全面に金属膜６が形成され、表面の金属膜６と裏面の金属膜６とが蓋基板３の側面の全面に形成された金属膜６を介して互いに導通した状態となる。つまり、蓋基板３が金属膜６によって覆われた状態となる。   On the other hand, the lid substrate 3 is cleaned by polishing and etching the wafer-like insulating substrate (S20). Next, as shown in FIG. 4B, a metal film 6 as a bonding film is formed on the entire surface of one side of the flat lid substrate 3 and the side surface in the thickness direction of the lid substrate 3 (S21). As a method for forming the metal film 6, an evaporation method, a sputtering method, a CVD method, or the like is used. For the metal film 6, Al, Si, Cr or the like is used, and its thickness is set in a range of 200 to 2000 mm. Next, as shown in FIG. 4C, a metal film 6 as a bonding film is formed on the entire other surface of the lid substrate 3 and the side surface in the thickness direction of the lid substrate 3 (S22). As a method of forming, similarly, a vapor deposition method, a sputtering method, a CVD method, or the like is used. For the metal film, Al, Si, Cr, or the like is used, and the thickness is set in a range of 200 to 2000 mm. As a result, the metal film 6 is formed on the entire front and back surfaces of the lid substrate 3, and the metal film 6 on the front surface and the metal film 6 on the back surface are mutually connected via the metal film 6 formed on the entire side surface of the lid substrate 3. It becomes a conductive state. That is, the lid substrate 3 is covered with the metal film 6.

そして、図４（Ｅ）に示すように、電子デバイス４をベース基板２のキャビティ５内に収納してベース基板２上に実装する（Ｓ３０）。図４ではワイヤ７を用いたワイヤボンディングで配線８と電子デバイス４とを接続しているが、必ずしもこの工法に限定されるわけではなく、フリップチップボンディングや半田接合など、電気の導通が確保される接続工法であればいずれでも良い。   Then, as shown in FIG. 4E, the electronic device 4 is accommodated in the cavity 5 of the base substrate 2 and mounted on the base substrate 2 (S30). In FIG. 4, the wiring 8 and the electronic device 4 are connected by wire bonding using the wire 7, but this is not necessarily limited to this method, and electrical conduction such as flip chip bonding and solder bonding is ensured. Any connection method may be used.

金属膜６の膜厚を２００Å〜２０００Åの範囲とするのは膜形成の安定性及び接合強度との関係によるものである。膜厚２００Å以下では、絶縁物と金属膜６との密着強度が弱いため、接合強度を確保するためには２００Å以上の膜厚が必要である。一方、２０００Å以上の膜厚にすると、接合強度が膜の分子間結合力によって左右されてしまうため、陽極接合としての効果が薄れてしまう。   The reason why the thickness of the metal film 6 is in the range of 200 to 2000 mm is due to the relationship between the stability of film formation and the bonding strength. When the film thickness is 200 mm or less, the adhesion strength between the insulator and the metal film 6 is weak. Therefore, a film thickness of 200 mm or more is necessary to ensure the bonding strength. On the other hand, when the film thickness is 2,000 mm or more, the bonding strength is affected by the intermolecular bonding force of the film, so the effect as anodic bonding is diminished.

次に図５（Ａ）に示すように、電子デバイス４が実装された状態のベース基板２と金属膜６が形成された蓋基板３とを、金属膜６を介した状態で陽極接合する（Ｓ３１）。ここで、図４及び図５に示す例では、ベース基板２は蓋基板３に対して重ね合わせ可能な大きさに形成されている。   Next, as shown in FIG. 5A, the base substrate 2 on which the electronic device 4 is mounted and the lid substrate 3 on which the metal film 6 is formed are anodically bonded via the metal film 6 ( S31). Here, in the example shown in FIGS. 4 and 5, the base substrate 2 is formed in a size that can be superimposed on the lid substrate 3.

陽極接合では、まず蓋基板３とベース基板２とをアライメントして重ね合せる。次にベース基板２における蓋基板３と接合される面とは反対の面全面にカーボン等で形成された負電極板２１を接触させ、蓋基板３におけるベース基板２と接合される面とは反対の面全面にカーボン等で形成された正電極板２２を接触させる。さらに正電極板２２と負電極板２１との間に一定の荷重を印加する。この状態で正電極板２２、負電極板２１、ベース基板２、及び蓋基板３をヒータ等で２００〜３００℃に加熱し、正電極板２２と負電極板２１との間に５００〜１０００Ｖの電圧を印加してベース基板２と蓋基板３とを陽極接合する。   In anodic bonding, first, the lid substrate 3 and the base substrate 2 are aligned and overlapped. Next, the negative electrode plate 21 made of carbon or the like is brought into contact with the entire surface of the base substrate 2 opposite to the surface bonded to the lid substrate 3, so that the surface of the lid substrate 3 opposite to the surface bonded to the base substrate 2 is opposite. A positive electrode plate 22 made of carbon or the like is brought into contact with the entire surface of the substrate. Further, a certain load is applied between the positive electrode plate 22 and the negative electrode plate 21. In this state, the positive electrode plate 22, the negative electrode plate 21, the base substrate 2, and the lid substrate 3 are heated to 200 to 300 ° C. with a heater or the like, and 500 to 1000 V is provided between the positive electrode plate 22 and the negative electrode plate 21. A voltage is applied to anodic bond the base substrate 2 and the lid substrate 3.

この状態では、ウェハ状のベース基板２とウェハ状の蓋基板３とが接合されてなる１枚のウェハ内に複数の電子デバイスパッケージ要素が存在している。そこで図５（Ｂ）に示すように、ダイシングソーやワイヤーソーを用いて、電子デバイスパッケージ１を個別に切断する（Ｓ３２）。電子デバイスパッケージ１を個別に切断した状態の断面図が図２に示されている。個別に切断された電子デバイスパッケージ１では蓋基板３の厚み方向側面に金属膜６は形成されていない。これは、電子デバイスパッケージ１を個別に切断する前のウェハ状態のとき、蓋基板３の最外周部の厚み方向側面の全面に接合膜が形成されていて、蓋基板３におけるベース基板２との接合面側の金属膜６と接合面とは反対側の金属膜６とが外周部の側面で接続していたためである。これにより陽極接合時の金属膜６の電位固定や電荷の移動をスムーズに行うことができるが、陽極接合が終了した後では、蓋基板３の厚み方向側面の金属膜６は必要ないので、個別に切断された電子デバイスパッケージ１では蓋基板３の厚み方向側面に金属膜６は形成されていない。つまり、個別に切断された電子デバイスパッケージ１では、蓋基板３の両面の全面に形成された金属膜６は互いに導通していない。その後、内部の電気特性検査を行うことで電子デバイスパッケージ１が製造される（Ｓ３３）。   In this state, a plurality of electronic device package elements exist in one wafer formed by bonding the wafer-like base substrate 2 and the wafer-like lid substrate 3. Therefore, as shown in FIG. 5B, the electronic device package 1 is individually cut using a dicing saw or a wire saw (S32). FIG. 2 shows a cross-sectional view of the electronic device package 1 cut individually. In the electronic device package 1 cut individually, the metal film 6 is not formed on the side surface in the thickness direction of the lid substrate 3. This is because when the electronic device package 1 is in a wafer state before being individually cut, a bonding film is formed on the entire surface of the outermost peripheral portion of the lid substrate 3 in the thickness direction. This is because the metal film 6 on the bonding surface side and the metal film 6 on the opposite side of the bonding surface are connected on the side surface of the outer peripheral portion. This makes it possible to fix the potential of the metal film 6 and move charges smoothly during anodic bonding. However, after the anodic bonding is completed, the metal film 6 on the side surface in the thickness direction of the lid substrate 3 is not necessary. In the electronic device package 1 cut into two, the metal film 6 is not formed on the side surface in the thickness direction of the lid substrate 3. That is, in the electronic device package 1 cut individually, the metal films 6 formed on the entire surfaces of both surfaces of the lid substrate 3 are not electrically connected to each other. Thereafter, the electronic device package 1 is manufactured by performing an internal electrical characteristic inspection (S33).

ここでベース基板２と蓋基板３を陽極接合する効果について説明する。これまでセラミック基板を用いたベース基板では電子デバイス１つ１つに蓋を接合する必要があった。そのため、ベース基板と蓋との接合時にベース基板に大きな圧力が掛かり、接合面の幅が小さいと圧力に耐えることができず、割れや欠けを生じるという課題があった。本実施形態の電子デバイスパッケージ１は、ベース基板２と蓋基板３との接合に陽極接合を用いているため、複数の電子デバイス４を同時に接合することができる。このため、接合時に１つ１つのベース基板に印加される圧力は小さくなり、接合面が小さくても割れや欠けを生じることはない。このため、小型化のパッケージを作るには非常に有効である。   Here, the effect of anodic bonding of the base substrate 2 and the lid substrate 3 will be described. Until now, it was necessary to bond a lid to each electronic device in a base substrate using a ceramic substrate. For this reason, a large pressure is applied to the base substrate when the base substrate and the lid are bonded, and if the width of the bonding surface is small, the pressure cannot be endured, and there is a problem that cracks and chips occur. Since the electronic device package 1 of the present embodiment uses anodic bonding for bonding the base substrate 2 and the lid substrate 3, a plurality of electronic devices 4 can be bonded simultaneously. For this reason, the pressure applied to each base substrate at the time of joining becomes small, and even if the joining surface is small, cracks and chips are not generated. Therefore, it is very effective for making a small package.

なお、本発明の技術範囲は上記実施の形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。上述した実施形態では、ベース基板２における蓋基板３が接合される接合面側に、電子デバイス４が収納されるキャビティ５となる矩形状の凹部が形成されているが、これに限定されることはない。例えば、図６に示すように、蓋基板３におけるベース基板２が接合される接合面側に、電子デバイス４が収納されるキャビティ５となる矩形状の凹部が形成されていてもよい。ベース基板２にキャビティ５を形成する場合、ベース基板２上の電子デバイス４を実装するための配線８の形成が難しいことがあるため、図６に示すように蓋基板３にキャビティ５を形成する方がより簡便に配線８を形成できることがある。   The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. In the above-described embodiment, the rectangular concave portion serving as the cavity 5 in which the electronic device 4 is accommodated is formed on the side of the base substrate 2 where the lid substrate 3 is bonded. However, the present invention is limited to this. There is no. For example, as illustrated in FIG. 6, a rectangular concave portion serving as a cavity 5 in which the electronic device 4 is accommodated may be formed on the bonding surface side of the lid substrate 3 to which the base substrate 2 is bonded. When the cavity 5 is formed in the base substrate 2, it may be difficult to form the wiring 8 for mounting the electronic device 4 on the base substrate 2, so the cavity 5 is formed in the lid substrate 3 as shown in FIG. 6. In some cases, the wiring 8 can be formed more easily.

次に、本発明に係る発振器の一実施形態について、図７を参照しながら説明する。本実施形態の発振器１００は、図７に示すように、電子デバイス４として例えば水晶からなる圧電振動片を用いた電子デバイスパッケージ１（圧電振動子）を、集積回路１０１に電気的に接続された発振子として構成したものである。この発振器１００は、コンデンサ等の電子部品１０２が実装された基板１０３を備えている。基板１０３には、発振器用の上記集積回路１０１が実装されており、この集積回路１０１の近傍に、電子デバイスパッケージ１（圧電振動子）が実装されている。これら電子部品１０２、集積回路１０１及び電子デバイスパッケージ１（圧電振動子）は、図示しない配線パターンによってそれぞれ電気的に接続されている。なお、各構成部品は、図示しない樹脂によりモールドされている。   Next, an embodiment of an oscillator according to the present invention will be described with reference to FIG. As shown in FIG. 7, the oscillator 100 according to the present embodiment is configured such that an electronic device package 1 (piezoelectric vibrator) using a piezoelectric vibrating piece made of, for example, quartz as an electronic device 4 is electrically connected to an integrated circuit 101. It is configured as an oscillator. The oscillator 100 includes a substrate 103 on which an electronic component 102 such as a capacitor is mounted. On the substrate 103, the integrated circuit 101 for the oscillator is mounted, and the electronic device package 1 (piezoelectric vibrator) is mounted in the vicinity of the integrated circuit 101. The electronic component 102, the integrated circuit 101, and the electronic device package 1 (piezoelectric vibrator) are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

このように構成された発振器１００において、圧電振動子に電圧を印加すると、該圧電振動子内の圧電振動片が振動する。この振動は、圧電振動片が有する圧電特性により電気信号に変換されて、集積回路１０１に電気信号として入力される。入力された電気信号は、集積回路１０１によって各種処理がなされ、周波数信号として出力される。これにより、圧電振動子が発振子として機能する。また、集積回路１０１の構成を、例えば、ＲＴＣ（リアルタイムクロック）モジュール等を要求に応じて選択的に設定することで、時計用単機能発振器等の他、当該機器や外部機器の動作日や時刻を制御したり、時刻やカレンダー等を提供したりする機能を付加することができる。   In the oscillator 100 configured as described above, when a voltage is applied to the piezoelectric vibrator, the piezoelectric vibrating piece in the piezoelectric vibrator vibrates. This vibration is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece and input to the integrated circuit 101 as an electric signal. The input electrical signal is subjected to various processes by the integrated circuit 101 and is output as a frequency signal. Thereby, the piezoelectric vibrator functions as an oscillator. Further, by selectively setting the configuration of the integrated circuit 101, for example, an RTC (real-time clock) module or the like according to a request, the operation date and time of the device and external device in addition to a single-function oscillator for a clock, etc. A function for controlling the time, providing a time, a calendar, and the like can be added.

１…電子デバイスパッケージ
２…ベース基板
３…リッド基板
４…電子デバイス
５…キャビティ
６…金属膜（接合膜）
７…ワイヤ
８…配線
９…貫通電極
１０…外部電極
２１…負電極板
２２…正電極板 DESCRIPTION OF SYMBOLS 1 ... Electronic device package 2 ... Base substrate 3 ... Lid substrate 4 ... Electronic device 5 ... Cavity 6 ... Metal film (bonding film)
7 ... wire 8 ... wiring 9 ... through electrode 10 ... external electrode 21 ... negative electrode plate 22 ... positive electrode plate

Claims (6)

可動イオンを含む絶縁物からなるベース基板と、前記ベース基板に対向させた状態で該ベース基板に接合される可動イオンを含む絶縁物からなる蓋基板と、前記ベース基板と前記蓋基板との間に複数形成されたキャビティ内のそれぞれに収納されるとともに前記ベース基板上に実装された電子デバイスと、を備えた電子デバイスパッケージの製造方法において、
前記蓋基板の両面に互いに導通する金属膜を形成する工程と、
前記蓋基板と前記ベース基板とをアライメントして重ね合せる工程と、
前記ベース基板における前記蓋基板に接合される面とは反対の面に一方の電極板を接触させ、前記蓋基板における前記ベース基板に接合される面とは反対の面に他方の電極板を接触させ、前記正電極板と前記負電極板との間に電圧を印加することで前記ベース基板と前記蓋基板とを前記金属膜を介して陽極接合する工程と、
を備えた電子デバイスパッケージの製造方法。 A base substrate made of an insulator containing movable ions, a lid substrate made of an insulator containing movable ions bonded to the base substrate in a state of being opposed to the base substrate, and between the base substrate and the lid substrate In an electronic device package manufacturing method comprising: an electronic device housed in each of a plurality of cavities formed and mounted on the base substrate;
Forming a conductive metal film on both sides of the lid substrate;
Aligning and overlapping the lid substrate and the base substrate;
One electrode plate is brought into contact with the surface of the base substrate opposite to the surface to be joined to the lid substrate, and the other electrode plate is brought into contact with the surface of the lid substrate opposite to the surface to be joined to the base substrate. And anodically bonding the base substrate and the lid substrate through the metal film by applying a voltage between the positive electrode plate and the negative electrode plate;
An electronic device package manufacturing method comprising: 前記一方の電極板を前記ベース基板における前記蓋基板に接合される面とは反対の面全面に接触させ、前記他方の電極板を前記蓋基板における前記ベース基板に接合される面とは反対の面全面に接触させる請求項１に記載の電子デバイスパッケージの製造方法。   The one electrode plate is brought into contact with the entire surface of the base substrate opposite to the surface bonded to the lid substrate, and the other electrode plate is opposite to the surface bonded to the base substrate of the lid substrate. The manufacturing method of the electronic device package of Claim 1 made to contact the whole surface. 前記金属膜がアルミ、クロム、シリコン、銅、またはこれらの組み合わせである請求項１または請求項２に記載の電子デバイスパッケージの製造方法   The method for manufacturing an electronic device package according to claim 1, wherein the metal film is aluminum, chromium, silicon, copper, or a combination thereof. 前記金属膜の膜厚が、２００Å〜２０００Åの範囲に設定されていることを特徴とする請求項１〜請求項３のいずれか１項に記載の電子デバイスパッケージの製造方法   4. The method of manufacturing an electronic device package according to claim 1, wherein a thickness of the metal film is set in a range of 200 to 2000 mm. 5. 可動イオンを含む絶縁物からなるベース基板と、
両面に金属膜が形成され、前記ベース基板に対向させた状態で該ベース基板に陽極接合されることにより前記ベース基板との間にキャビティを形成する、可動イオンを含む絶縁物からなる蓋基板と、
前記キャビティ内に収納されるとともに前記ベース基板上に実装された電子デバイスと、
を備えた電子デバイスパッケージ。 A base substrate made of an insulator containing movable ions;
A lid substrate made of an insulating material including movable ions, wherein a metal film is formed on both surfaces and a cavity is formed between the metal substrate and the base substrate by being anodically bonded to the base substrate; ,
An electronic device housed in the cavity and mounted on the base substrate;
Electronic device package with 前記電子デバイスが圧電振動片である請求項１〜５のいずれか１項に記載の電子デバイスパッケージと、
前記電子デバイスパッケージが発振子として電気的に接続される集積回路と、
を備えた発振器。 The electronic device package according to any one of claims 1 to 5, wherein the electronic device is a piezoelectric vibrating piece.
An integrated circuit in which the electronic device package is electrically connected as an oscillator; and
With an oscillator.
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