JP2011031301A - Fluid feeding apparatus and fluid feeding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fluid feeding apparatus which can control the discharge rate of a fluid even if it takes time until the fluid is discharged after the fluid is pressurized in a vessel, and to provide a fluid feeding method. <P>SOLUTION: When a control signal indicating the shutoff of solder supply is outputted, the driver of a motor 122 drives the motor 122 so that the motor 122 rotates in a direction reverse to the previous rotation. A drive pulley 123 also rotates reversely, and interlocking with it, a vertical drive pulley 126 and a rotary drive pulley 125 also rotate reversely so that a piston 106 moves in the direction of coming out of the vessel while the piston 106 and the vessel are relatively rotated in the direction reverse to the previous rotation. This enables the discharge rate of the fluid to be controlled adequately. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a fluid supply apparatus and a fluid supply method for supplying a fluid such as solder applied to a printed circuit board.

  2. Description of the Related Art Conventionally, a solder printing machine that forms a solder pattern by applying cream solder to a land or the like of a printed circuit board is known. This solder printer incorporates a solder supply device for supplying cream solder. For example, there is a solder supply device described in Patent Document 1 (see FIG. 2 in Patent Document 1).

  In the solder supply apparatus described in Patent Document 1, a supply assembly is used. The supply assembly includes a supply container in which solder is accommodated, a supply container that accommodates and fixes the supply container, and a discharge adapter that includes a piston that is fitted into an opening of the supply container. In addition, the solder supply device is provided with a drive mechanism for pressing the supply container.

  The supply assembly is mounted on the solder supply apparatus so that the opening side of the supply container faces downward. At the time of supplying the solder, the supply container is pressed by the drive mechanism and moved toward the piston inserted in the supply container. The discharge adapter is fixed. Therefore, when the supply container moves, the discharge adapter enters the supply container fixed to the supply container, and pressure is applied to the solder in the supply container. The discharge adapter is provided with a discharge port, and the solder receiving the pressure is supplied to the printed circuit board or the like through the discharge port.

JP 2004-306102 A

  However, in the solder supply apparatus described in Patent Document 1, it takes time until the solder is discharged from the tube after receiving pressure from the piston. For this reason, ingenuity is required in order to adjust and supply the solder discharge amount.

  In view of the circumstances as described above, an object of the present invention is to provide a fluid supply capable of adjusting the discharge amount of the fluid even when it takes time until the fluid is discharged after receiving pressure in the container. It is to provide an apparatus and a fluid supply method.

In order to achieve the above object, a fluid supply apparatus according to an aspect of the present invention includes a piston, a piston support part, a container support part, and a drive mechanism.
The piston has a through hole.
The piston support part supports the piston.
The container support portion adjusts a discharge amount of the fluid so that the piston is inserted into the container in order to discharge the fluid from the container through the through hole of the piston. For this purpose, at least one of the container support part and the piston support part is driven so that the piston moves relatively away from the container.

In this fluid supply apparatus, when the piston relatively moves in the direction in which the piston is removed from the container, the pressure received by the fluid in the container is reduced. Therefore, for example, by moving the piston as described above during the discharge of the fluid and stopping the discharge of the fluid, the discharge amount of the fluid can be adjusted.
For example, according to the following invention, since the resistance of the piston to the container when the piston moves is small, the piston can be easily moved as described above.

  The drive mechanism is configured such that the piston is inserted into the container while the container and the piston rotate relatively to discharge the fluid from the container through the through hole of the piston. In addition, by driving at least one of the container support part and the piston support part, the following effects can be obtained. That is, the resistance of the piston to the container when the piston is inserted is reduced by inserting the piston into the container while the container and the piston are relatively rotated. Therefore, for example, even with a small drive mechanism including a small motor with a small output, the piston can be reliably inserted into the container, and the fluid can be reliably supplied.

The piston may include a seal member that is provided at an end of the piston and has a tapered outer peripheral surface that increases in outer periphery diameter in a direction in which the piston is inserted.
Since the resistance of the piston to the container when the piston is inserted is small, the sealing member as described above can be provided at the end of the piston. By this sealing member, the fluid in the container can be sufficiently scraped and discharged.

The fluid supply apparatus may further include a nozzle and an opening / closing mechanism.
The nozzle has an internal flow path communicating with the through hole.
The opening / closing mechanism can open and close the internal flow path.

  In this fluid supply apparatus, the fluid is discharged through the internal flow path of the nozzle. When the fluid is discharged, the internal flow path is closed by the opening / closing mechanism, so that the fluid is easily separated from the nozzle. Moreover, the supply amount of the fluid can be adjusted by closing the internal flow path of the nozzle at the expected timing.

The nozzle may have a discharge end including a tapered surface such that a diameter of an outer periphery decreases in a direction in which the fluid is discharged. In this case, the opening / closing mechanism may close the internal flow path by pressing the discharge end portion.
Since the discharge end from which the fluid is discharged has the tapered surface, the fluid is easily separated from the nozzle when the internal flow path is closed by the opening / closing mechanism.

The opening / closing mechanism may include a pair of opening / closing members.
The pair of opening / closing members includes a pressing end portion that presses the nozzle and a notch formed in the pressing end portion, and presses the nozzle so as to sandwich the nozzle.

  In this fluid supply apparatus, the nozzle is pressed by the pair of opening / closing members so as to close the internal flow path of the nozzle. A notch is formed in the pressing end portions of the pair of opening and closing members, and when the internal flow path is closed, the deformation of the nozzle is suppressed by the notch. The size of the cutout may be appropriately set within a range in which the internal flow path is closed.

A fluid supply method according to an aspect of the present invention includes a piston having a through hole, a piston support portion that supports the piston, a container support portion that can support a container in which a fluid is accommodated, A drive mechanism capable of driving at least one of the container and the piston so that the piston is inserted into the container in order to discharge the fluid from the container through the through hole of the piston; Using the fluid supply device with the drive mechanism so that the insertion distance is larger than the set insertion distance, which is the insertion distance of the piston into the container, corresponding to a preset fluid supply amount. The fluid is discharged by relatively inserting the piston into the container.
Then, using the fluid supply device, the piston is removed from the container by the drive mechanism before the discharge is stopped so that the discharge of the fluid is stopped at a supply amount corresponding to the set insertion distance. At least one of the container and the piston is driven in a direction in which the valve is relatively removed.

A fluid supply method according to another aspect of the present invention includes a piston having a through hole, a piston support part that supports the piston, a container support part that can support a container in which the fluid is accommodated, A fluid supply device including a drive mechanism that drives at least one of the container and the piston to discharge the fluid from the container, and the container and the piston are inserted into the container. By driving at least one of the pistons, the fluid is discharged from the container through the through hole of the piston.
Then, before the discharge of the fluid is stopped, at least one of the container support part and the piston support part is driven in a direction in which the piston is relatively removed from the container.

  As described above, according to the present invention, it is possible to appropriately adjust the discharge amount of the fluid even when it takes time until the fluid is discharged after receiving pressure in the container.

It is a typical figure showing composition of a fluid application device concerning one embodiment of the present invention. It is a schematic diagram which shows the structure of the board | substrate support mechanism shown in FIG. It is a typical perspective view which shows the fluid supply apparatus and squeegee mechanism of this embodiment. It is a typical front view of the fluid supply apparatus and squeegee mechanism shown in FIG. It is a typical side view of the fluid supply apparatus and squeegee mechanism shown in FIG. It is a typical side view of the fluid supply apparatus and squeegee mechanism shown in FIG. It is a typical top view of the fluid supply apparatus and squeegee mechanism shown in FIG. It is typical sectional drawing which shows the piston of this embodiment. It is typical sectional drawing which showed the edge part on the opposite side of the edge part by the side of the container of the piston fixed to the piston support part. It is the schematic diagram which expanded and showed the nozzle and opening-and-closing member which are shown in FIG. It is a typical perspective view which shows the squeegee of this embodiment. It is the typical top view which looked at the squeegee shown in FIG. 11 from upper direction. It is a block diagram which shows the structure of the control system of the fluid application | coating apparatus of this embodiment. It is the block diagram which showed the control system of the fluid supply apparatus and the squeegee mechanism among the block diagrams shown in FIG. It is a flowchart which shows operation | movement of the fluid application | coating apparatus of this embodiment. It is typical sectional drawing which shows the piston and seal member which were inserted in the container. It is the top view which showed typically the movement of the solder at the time of applying a solder with a squeegee. It is the perspective view which showed the modification of the drive mechanism of the fluid application | coating apparatus of this embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[Configuration of fluid coating apparatus]
FIG. 1 is a schematic diagram showing a configuration of a fluid coating apparatus according to an embodiment of the present invention. The fluid coating device 150 is a device for supplying solder as a fluid to the substrate 2 via the screen 1. The fluid application device 150 includes the fluid supply device 100, a squeegee mechanism 170, a fixing mechanism 10 that fixes the screen 1, and a substrate support mechanism 20 that supports the substrate 2.

  The fixing mechanism 10 includes a plurality of clamps 11 that hold the end 3 of the screen 1, and the screen 1 is fixed by the clamps 11. The screen 1 is fixed to the lower side of the fluid supply device 100 and the squeegee mechanism 170 so as to face them. The screen 1 is formed with pattern holes (not shown).

  FIG. 2 is a schematic diagram showing the configuration of the substrate support mechanism 20. The substrate support mechanism 20 includes a stage mechanism 21 and a stage moving mechanism 22 that moves the stage mechanism 21. The stage mechanism 21 includes a transport belt 23 and a suction block mechanism 24 that can move up and down. The suction block mechanism 24 supports the substrate 2 transported by the transport belt 23 and moves the substrate 2 above the transport belt 23.

  The stage moving mechanism 22 moves the stage mechanism 21 in the surface direction of the substrate 2 (X direction and Y direction shown in FIG. 2), and rotates the stage mechanism 21 around the Z direction shown in FIG. Have The stage moving mechanism 22 has an air cylinder 26, and the stage mechanism 21 is moved in the vertical direction (Z direction) by the air cylinder 26. The stage moving mechanism 22 has a plurality of stoppers 27 provided around the moving unit 25.

  As shown in FIG. 1, the fluid coating apparatus 150 includes a camera unit 4 and a cleaning unit 5. The camera unit 4 and the cleaning unit 5 have a structure that can move along the guide rail 6. The camera unit 4 recognizes an alignment mark (not shown) provided on the substrate 2 for positioning the substrate 2. A cleaning paper 7 is attached to the cleaning unit 5, and the lower surface of the screen 1 (surface on the substrate 2 side) is cleaned by the cleaning paper 7.

[Configuration of fluid supply device]
FIG. 3 is a schematic perspective view showing the fluid supply device 100 and the squeegee mechanism 170 of the present embodiment. 4 to 7 are a schematic front view (FIG. 4), a side view (FIGS. 5 and 6), and a top view (FIG. 7) of the fluid supply device 100 and the squeegee mechanism 170 shown in FIG. 3. .

  The fluid supply apparatus 100 includes a container support unit 104, a piston support unit 102, and a drive mechanism 103 that drives the container support unit 104 and the piston support unit 102.

  The container support unit 104 can hold the solder contained in the container (see the container 30 in FIG. 16) and marketed together with the container as in the supply device described in Japanese Patent Application Laid-Open No. 2004-306102. It is configured. Specifically, the container support portion 104 is formed in a shape that covers the bottom surface (upper surface in the drawing) and side surfaces of the container. The container support portion 104 is disposed below the support block 101 and is provided to be rotatable with respect to the support block 101.

  The container and container support portion 104 has a structure in which an opening is provided on one side. The container is fixed by a ring-shaped fixing member 105 provided in the opening of the container support portion 104, and the container rotates integrally with the container support portion 104 when the container support portion 104 rotates. The container support portion 104 is supported by the support block 101 so that the opening of the container faces downward (side on which the substrate 2 is disposed). The container support part 104 is formed according to the shape of the container, and is made of a metal such as aluminum, stainless steel, or iron.

  The piston support portion 102 is fixed on a piston support block 112 that faces the support block 101 from below. A piston 106 that can be inserted into the container is fixed to the piston support portion 102.

  FIG. 8 is a schematic cross-sectional view showing the piston 106. The piston 106 is formed with a through hole 106d serving as a solder flow path in a direction (Z direction shown in FIG. 8) to be fitted into the container. The through-hole 106d is formed so as to be positioned substantially at the center of the end surface 109 fitted into the container.

  A seal member 107 is provided at an end portion 106a of the piston 106 fitted into the container so as to surround the end portion 106a, and the seal member 107 is fitted inside the container. The end portion 106a of the piston 106 is removable from the piston main body 106b, and is screwed by a screw 108 provided in a screw hole 106c inside the piston main body 106b. The seal member 107 is fixed by being sandwiched between the piston main body 106b and the end portion 106a.

  As shown in FIG. 8, the seal member 107 has a tapered outer peripheral surface 110 whose outer diameter increases in the direction in which the piston 106 is fitted (Z direction). As the seal member 107, for example, an elastic member such as urethane or silicon is used. As the piston 106, for example, a metal such as aluminum, stainless steel, or iron is used. The piston 106 and the seal member 107 are formed according to the shape of the container. For example, an O-ring may be used as the seal member 107. Further, in the present embodiment, the end surface 109 of the piston 106 is planar, but the end surface 109 may have a concave shape that is inclined toward the through hole 106d located substantially at the center.

  FIG. 9 is a schematic cross-sectional view showing an end portion of the piston 106 fixed to the piston support portion 102 on the side opposite to the end portion 106a. An end 111 opposite to the end 106a has a tubular shape. The inside of the tubular end portion 111 becomes a part of the through hole 106d. The piston support part 102 is formed with a through hole (not shown) through which the end part 111 passes.

  A nozzle 113 made of, for example, silicon rubber or the like is attached to the end 111, and the internal flow path of the nozzle 113 communicates with the through hole 106d. The solder in the container is discharged to the outside through the through hole 106d of the piston 106 and the internal flow path of the nozzle 113.

  As shown in FIG. 9, an opening / closing mechanism 114 that sandwiches the nozzle 113 is provided below the piston support block 112. The opening / closing mechanism 114 has a pair of opening / closing members 115a and 115b, and air cylinders 120a and 120b connected to the opening / closing members 115a and 115b. The open / close members 115a and 115b are closed by the air cylinders 120a and 120b, and the nozzle 113 is pressed as shown in FIG. 9B. Thereby, the internal flow path of the nozzle 113 is closed.

  When the solder is ejected from the nozzle 113, the ejected solder is easily separated from the nozzle 113 by closing the internal flow path of the nozzle 113 as described above. Moreover, the supply amount of solder can be adjusted by closing the internal flow path of the nozzle 113 at a predetermined timing. Further, for example, by keeping the internal flow path closed while the solder is not discharged, air can be prevented from entering the container. Thereby, it can prevent that a solder oxidizes. Moreover, it can prevent that a foreign material mixes in a container.

  FIG. 10 is a schematic view showing the nozzle 113 and the opening / closing members 115a and 115b in an enlarged manner. As shown in FIG. 10A, the discharge end portion 116 (the portion surrounded by the broken line in FIG. 10A) of the nozzle 113 from which the solder is discharged is in the direction in which the solder is discharged (downward in the Z direction). A tapered surface 116a is formed so that the diameter of the outer periphery decreases. The portion P (outer peripheral side surface) immediately above the tapered surface 116a is pressed by the opening / closing members 115a and 115b, so that the solder is more easily separated from the nozzle 113. This is considered to be due to the fact that the contact area between the nozzle 113 and the solder is reduced by providing the tapered surface 116a.

  FIG. 10B is a view of the pair of opening / closing members 115a and 115b as viewed from below, and the nozzle 113 and the internal flow path 116b are illustrated between the opening / closing members 115a and 115b. As shown in FIG. 10B, notches 120a and 120b are formed in the pressing end portions 119a and 119b of the opening / closing members 115a and 115b that press the nozzle 113, respectively. Therefore, when the nozzle 113 is pressed against the opening / closing members 115a and 115b (see FIG. 9B), the deformation of the nozzle 113 is suppressed by the notches 120a and 120b. Thereby, deterioration and damage of the nozzle 113 can be prevented. Further, it can be prevented that the nozzle 113 pressed many times by the opening / closing members 115a and 115b is plastically deformed and the internal flow path 116b is not secured even when the opening / closing members 115a and 115b are opened.

  The sizes of the notches 120a and 120b may be appropriately set within a range in which the internal flow path 116b is closed when the nozzle 113 is pressed. In FIG. 10B, the shapes of the notches 120a and 120b are formed in a rectangular shape, but are not limited to this, and may be formed in an arc shape or an elliptical arc shape.

  As shown in FIGS. 3 to 6, a flat portion 106 e having a flat surface is formed on the side surface of the piston 106. By irradiating the flat surface portion 106e with, for example, a laser and detecting the reflection, it is possible to confirm whether the piston 106 is properly disposed. Further, the plane portion 106e makes it easy to carry the piston 106.

  3 to 6 show a state where the piston 106 and the seal member 107 are not fitted in the container in order to make the piston 106 and the seal member 107 easy to see. From this state, the container support 104 and the piston support 102 may be driven, and the piston 106 may be fitted into the container. Alternatively, the piston 106 may be fitted into a container accommodated in the container support 104, and the container support 104 and the piston 106 may be disposed on the support block 101 and the piston support 102 in this state.

  The drive mechanism 103 includes a motor 122, a drive pulley 123 provided on the rotation shaft of the motor 122, and two driven pulleys connected to the drive pulley 123 via a belt 124. The two driven pulleys include a rotary drive pulley 125 and a vertical drive pulley 126. The motor 122 is supported by the support plate 132 so as to be disposed below the support plate 132. The support plate 132 is fixed to the support block 101 directly or indirectly. A drive shaft (not shown) of the motor 122 passes through the support plate 132 and is connected to the drive pulley 123.

  As shown in FIGS. 3 to 6, the drive pulley 123 is disposed on the support plate 132. The rotational drive pulley 125 and the vertical drive pulley 126 are disposed on the support block 101. The rotation drive pulley 125 is provided above the container support unit 104, and the rotation shaft 127 of the rotation drive pulley 125 is connected to the container support unit 104. The vertical drive pulley 126 is disposed on the rear side of the rotary drive pulley 125, and the teeth of the vertical drive pulley 126 and the teeth of the rotary drive pulley 125 are engaged with each other. Further, a tension member 128 that prevents the belt 124 from sagging is provided between the drive pulley 123 and the rotary drive pulley 125.

  A feed screw 129 is attached as a rotation shaft of the vertical drive pulley 126, and an upper end of the feed screw 129 is fixed to the frame 130. For example, two guide shafts 131 are connected to the lower portion of the frame 130 in the vertical direction. A drive mechanism 103, a support plate 132, a support block 101, and a container are attached to the two guide shafts 131 through an attachment portion 132 so as to be integrally movable up and down. That is, when the vertical drive pulley 126 rotates, the drive mechanism 103, the support plate 132, the support block 101, and the container move up and down integrally with respect to the frame 130. As a result, the drive mechanism 103, the support plate 132, the support block 101, and the container move up and down integrally with the piston 106. As the feed screw 129, for example, a trapezoidal screw or a ball screw may be used.

  As shown in FIGS. 3 to 7, the squeegee mechanism 170 of the present embodiment is attached to the lower part of the fluid supply device 100 and moves integrally with the fluid supply device 100 along the guide rail 28 shown in FIG. 1. It is possible. The fluid supply device 100 and the squeegee mechanism 170 are connected to the guide rail 28 by a connecting member 121 provided on the back side thereof.

  The squeegee mechanism 170 has a pair of squeegees 171 and 172, and air cylinders 173 and 174 are connected to the squeegees 171 and 172, respectively. The air cylinders 173 and 174 allow the squeegees 171 and 172 to move up and down, respectively. Since the squeegees 171 and 172 have the same configuration, the squeegee 171 will be described.

  FIG. 11 is a schematic perspective view showing the squeegee 171. The squeegee 171 includes an attachment portion 175 attached to the squeegee mechanism 170, a main squeegee 171a, and a pair of sub-squeegees 171b provided at both ends of the main squeegee 171a. The main squeegee 171a and the sub squeegee 171b are connected via a spring member 176, and the sub squeegee 171b can move up and down with respect to the main squeegee 171a. The squeegee surface 177 a that is in contact with the screen 1 of the main squeegee 171 a is inclined with respect to the screen 1 by a predetermined angle. The squeegee surfaces 177b of the pair of sub-squeegees 171b are also inclined at a predetermined angle with respect to the screen 1.

  FIG. 12 is a schematic top view of the squeegee 171 viewed from above. In FIG. 12, the squeegee surfaces 177a and 177b described above are illustrated as the main squeegee 171a and the sub squeegee 171b for convenience of explanation. As shown in FIG. 12, the pair of sub-squeegees 171b are provided at a predetermined angle α with respect to the extending direction of the main squeegee 171a. Further, the outer end 178b of the sub squeegee 171b is located outside the both ends 178a of the main squeegee 171a. The inner end 179b of the sub squeegee 171b is located inside the both ends 178a of the main squeegee 171a.

  The fluid supply device 100 or the squeegee mechanism 170 is provided with a rolling diameter detection sensor (not shown) that measures the rolling diameter when the solder supplied to the screen is applied. The rolling diameter detection sensor irradiates, for example, laser or ultrasonic waves toward the solder, detects light or ultrasonic waves reflected from the solder surface, and thereby detects the radius of curvature of the solder surface being rolled. The rolling detection sensor may be provided anywhere as long as the solder rolling diameter can be measured. For example, a rolling diameter detection sensor may be provided integrally with the squeegee 171 and the rolling diameter of solder applied by the squeegee 172 may be measured.

  Further, the fluid supply device 100 or the squeegee mechanism 170 is provided with a solder temperature detection sensor (not shown) that measures the temperature of the surface of the solder being rolled. The solder temperature detection sensor measures the temperature of the solder surface by detecting infrared rays emitted from the solder surface being rolled. As such a solder temperature detection sensor, for example, a non-contact type thermistor, a non-contact type thermomobile comprising a plurality of thermocouples, or the like is used. The solder temperature detection sensor may be provided anywhere as long as the temperature of the solder surface can be detected. For example, a solder temperature detection sensor may be provided at the same position as the rolling diameter detection sensor.

[Control system for fluid application equipment]
FIG. 13 is a block diagram showing the configuration of the control system of the fluid coating apparatus 150. As shown in FIG. 14 is a block diagram showing a control system of the fluid supply device 100 and the squeegee mechanism 170 in the block diagram shown in FIG.

  As shown in FIGS. 13 and 14, the drive of the stage mechanism 21, the stage moving mechanism 22, the camera unit 4, the fluid supply apparatus 100, and the squeegee mechanism 170 described above is controlled by a controller 133. In the present embodiment, the controller 133 also controls the temperature adjustment unit 134 that adjusts the temperature in the room where the fluid coating apparatus 150 is installed.

  FIG. 14 shows a temperature adjuster 135 included in the temperature adjustment unit 134, and this temperature adjuster 135 is controlled by the controller 133 to adjust the temperature in the room.

  For example, the controller 133 and the drivers of the respective units may be realized by hardware, or may be realized by both software and hardware. Typically, the hardware is a CPU (Central Processing Unit), MPU (Micro Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), DSP (Digital Signal Processor), FPGA (Field Programmable Gate Array). ), Application Specific Integrated Circuit (ASIC), Network Interface Card (NIC), Wireless NIC (WNIC), and the like. Various programs constituting the software are stored in a ROM or other storage device. The controller 133 may be provided in the fluid coating apparatus 150 or may be provided in a device different from the fluid coating apparatus 150. When the controller 133 is provided in another device, a control signal may be output from the other device to the fluid coating apparatus 150 by wire or wirelessly.

[Operation of fluid coating device]
Operation | movement of the fluid application | coating apparatus 150 of this embodiment is demonstrated. First, the operation of the fluid supply apparatus 100 that supplies solder onto the screen 1 will be described, and then the overall operation of the fluid application apparatus 150 will be described.

[Operation of fluid supply device]
The controller 133 outputs a control signal for supplying solder to the driver of the motor 122 shown in FIGS. 3 to 7, and the motor 122 rotates. As a result, the driving pulley 123 rotates, and the vertical driving pulley 126 rotates in conjunction with the rotation of the driving pulley 123, and the container is moved downward. Thereby, the piston 106 moves relatively upward in the container. In conjunction with the rotation of the drive pulley 123, the rotation drive pulley 125 also rotates, so that the container moved downward moves downward while being rotated by the rotation drive pulley 125. Therefore, the piston 106 moves upward while relatively rotating in the container. Thereby, the solder in the container receives pressure, and the solder is supplied through the through hole 106d of the piston 106. Solder is supplied between the squeegees 171 and 172 of the squeegee mechanism 170 shown in FIG.

  Further, the piston 106 is inserted into the container while the container and the piston 106 are relatively rotated, thereby reducing the resistance of the piston 106 to the container. Therefore, even if a small motor with a small output is used as the motor 122, for example, the piston 106 can be reliably inserted into the container. Thereby, the drive mechanism 103 can be reduced in size and solder can be supplied reliably.

  In this embodiment, the container can be used as it is without transferring the solder to another container. Thereby, workability | operativity at the time of apply | coating a fluid improves. Moreover, although the solder adhering to the spatula etc. used when transferring a solder is discarded, since there is no such solder disposal, the amount of solder disposal can be reduced.

  FIG. 16 is a schematic cross-sectional view showing the piston 106 and the seal member 107 inserted into the container. Generally, the internal shape of the container 30 is such that the opening area decreases toward the bottom. That is, as the piston 106 is inserted, the inner diameter of the container 30 gradually decreases.

  The seal member 107 provided at the end 106 a of the piston 106 has a tapered outer peripheral surface 110. Since the outer peripheral surface 110 has elasticity, the outer peripheral surface 110 is deformed so as to follow the internal shape of the container 30 having a smaller diameter. Thereby, the solder 31 in the container 30 can be sufficiently scraped and discharged.

  When such a seal member 107 is provided, the resistance of the piston 106 to the container 30 may increase. However, in the fluid supply apparatus 100 of this embodiment, since the resistance of the piston 106 to the container 30 is small, the sealing member 107 as described above can be provided at the end portion 106a of the piston 106.

  When a control signal for stopping the supply of solder is output from the controller 133 to the driver of the motor 122, the driver of the motor 122 drives the motor 122 so that the motor 122 rotates in the opposite direction. The driving pulley 123 also rotates in the reverse direction, and the vertical driving pulley 126 and the rotation driving pulley 125 also rotate in reverse in conjunction with this. As a result, the piston 106 and the container are moved in the direction in which the piston 106 comes out of the container while rotating in the reverse direction. When the piston 106 moves in the direction to escape from the container, the pressure received by the solder in the container decreases.

  It takes time until the solder is discharged from the nozzle 113 after receiving pressure by the piston 106. Therefore, for example, the distance at which the piston 106 is inserted is set to be large, and the motor 122 is rotated in reverse in accordance with the timing at which the discharge of the solder is stopped at the intended supply amount. Thereby, the time taken for the discharge of solder can be shortened. In this way, the amount of solder discharged can be adjusted by driving the motor 122 and moving the piston 106 up and down. As described above, since the resistance of the piston 106 to the container when the piston 106 moves is small, the piston 106 can be easily moved as described above.

  Further, when the controller 133 outputs a control signal to stop the supply of solder to the driver of the opening / closing mechanism 114, the opening / closing mechanism 114 is driven. Then, in accordance with the expected timing, the nozzle 113 is sandwiched between the pair of opening / closing members 115a and 115b (see FIG. 9), and the internal flow path of the nozzle 113 is closed. Thereby, the discharged solder is separated from the nozzle 113.

  The overall operation of the fluid coating apparatus 150 will be described. FIG. 15 is a flowchart showing the operation of the fluid coating apparatus 150. The stage moving mechanism 22 is driven, and the stage moving mechanism 22 moves the stage mechanism 21 toward the substrate carry-in section 29 provided on the camera section 4 side shown in FIG. The conveyance belt 23 of the stage mechanism 21 is driven, and thereby the substrate 2 is carried into the conveyance belt 23 from the substrate carry-in portion 29. Thereafter, the stage moving mechanism 22 moves the stage mechanism 21 to a predetermined position, and the substrate 2 is moved to a position above the suction block mechanism 24 by the transport belt 23 (step 101).

  The suction block mechanism 24 is raised and the substrate 2 is held. The suction block mechanism 24 is connected to a vacuum pump (not shown), and the substrate 2 is sucked and held by the suction block mechanism 24 by operating the vacuum pump. The substrate 2 is lifted above the conveyor belt 23 by the suction block mechanism 24. At this time, the substrate 2 may be fixed by a substrate fixing portion (not shown), and the substrate 2 may be pressed by the suction block mechanism 24 to correct the deflection or warpage of the substrate 2.

  The camera unit 4 moves above the substrate 2 held by the suction block mechanism 24, and the alignment mark on the substrate 2 is recognized by the camera unit 4 (step 102). Position information of the alignment mark is transmitted to the controller 133, and the stage moving mechanism 22 corrects the position of the stage mechanism 21 based on the position information. When the position of the stage mechanism 21 is corrected, the air cylinder 26 of the stage moving mechanism 22 is operated, and the stage mechanism 21 is moved upward. The stage mechanism 21 stops at a position where the stopper 27 of the stage moving mechanism 22 contacts the stage mechanism 21 and the substrate 2 contacts the lower surface of the screen 1 (step 103).

  In the present embodiment, the stage mechanism 21 is moved so that the substrate 2 contacts the lower surface of the screen 1. However, the stage mechanism 21 may be moved so that the substrate 2 is arranged at a distance from the screen 1. In this case, for example, by providing a needle nozzle or the like on the lower surface of the screen 1, solder can be supplied to the substrate on which the component is mounted via the needle nozzle.

  The air cylinders 173 and 174 are driven by the controller 133, and one of the squeegees 171 and 172 is moved upward, and the other is brought into contact with the screen 1. Then, the squeegee mechanism 170 and the fluid supply apparatus 100 whose driving are controlled by the controller 133 are moved together. As a result, solder is applied on the screen 1 and a predetermined solder pattern is printed on the substrate 2 (step 104).

  When the squeegee mechanism 170 moves from the right side to the left side as viewed in FIG. 2, the squeegee 172 is moved upward and the squeegee 171 contacts the screen 1. Then, solder is applied by the squeegee 171. When the squeegee mechanism 170 moves from the left side to the right side as viewed in FIG. 2, the squeegee 171 is moved upward and the squeegee 172 is moved downward and brought into contact with the screen 1. The squeegee 172 applies solder.

  FIG. 17 is a top view schematically showing the movement of the solder when the solder is applied by the squeegee 171. When the squeegee 171 moves in the direction of the dashed arrow shown in FIG. 17, the solder is moved onto the screen 1 by the main squeegee 171a while rolling in that direction. At this time, solder may leak outside the both ends 178a of the main squeegee 171a (solid line arrows shown in FIG. 17). However, a pair of sub-squeegees 171b are provided at both ends 178a of the main squeegee 171a. The sub-squeegee 171b collects the laterally leaked solder at the center on the back side of the main squeegee 171a. The collected solder is applied onto the screen 1 by a squeegee 172 opposite to the squeegee 171 when the moving direction of the squeegee mechanism 170 is reversed, for example. Thereby, the solder leaked from the main squeegee 171a can be reused effectively, and the amount of solder discarded can be reduced.

  Further, in this embodiment, since the fluid supply device 100 can be downsized, a moving mechanism that moves the fluid supply device 100 and the squeegee mechanism 170 integrally as described above can be easily realized. Can do. Since the fluid supply device 100 and the squeegee mechanism 170 move integrally, the solder can be supplied efficiently when the solder is applied. Further, since solder can be supplied between the squeegees 171 and 172, the solder is efficiently applied without increasing the stroke of the squeegee mechanism 170.

  In the fluid coating apparatus 150 of the present embodiment, when the solder is printed, the temperature adjustment unit 134 adjusts the temperature in the room where the fluid coating apparatus 150 is installed (step 105). As shown in FIG. 14, the solder temperature detection sensor 136 measures the temperature of the solder surface, and the temperature information is transmitted to the controller 133. If the controller 133 determines that the room temperature is high based on the received temperature information, the controller 133 issues an air cooling command to the temperature controller 135 to lower the room temperature (step 106). If it is determined that the room temperature is normal, the room temperature is not adjusted. In this way, the temperature of the solder surface is monitored, and the temperature in the room is adjusted according to the temperature of the solder surface that has been rolled up and raised. This enables more precise solder temperature control.

  Further, when the solder is printed, the rolling diameter is measured by the rolling diameter detection sensor 137 (step 107). When the rolling diameter falls below a preset reference, the information is transmitted to the controller 133 as rolling diameter information. Thereby, the diameter of the solder ring when the solder is printed is monitored. While the solder is being applied by the rolling diameter detection sensor 137, the rolling diameter of the solder may always be measured, or may be measured at a predetermined timing.

  When the solder printing on the substrate 2 is completed, the stage mechanism 21 is first moved downward by the stage moving mechanism 22, and the substrate 2 is placed on the transport belt 23 of the stage mechanism 21. The substrate 2 is moved by the transport belt 23, and the stage mechanism 21 is also moved by the stage moving mechanism 22 toward the substrate carry-out unit 32 provided on the cleaning unit 5 side shown in FIG. The substrate 2 is moved from the transport belt 23 to the substrate unloading section 32, and the substrate 2 is unloaded from the fluid coating apparatus 150 by the substrate unloading section 32 (step 108).

  In the present embodiment, when the substrate 2 is unloaded in step 108, the solder is supplied based on the roll diameter information transmitted to the controller 133 (step 109). As shown in FIG. 14, the controller 133 that has received the rolling diameter information determines that the amount of solder on the screen 1 is insufficient, and issues a solder supply command to the motor 122 to supply the solder (step 110). When rolling diameter information is not transmitted from the rolling diameter detection sensor 137, it is determined that there is a necessary amount of solder on the screen 1, and no solder is supplied.

  In this way, the rolling diameter of the solder is monitored, and a necessary amount of solder is supplied onto the screen 1, so that the rolling diameter of the solder becomes constant. If it does so, the quantity of the solder with which the pattern hole of the screen 1 is filled will be stabilized, and the printing quality of solder will improve. In the present embodiment, since the solder is supplied when the substrate 2 is discharged, not during the printing of the solder on the substrate 2, the working time can be shortened.

  As shown in FIG. 15, it is determined that the amount of solder on the screen 1 is insufficient, and when the solder is supplied, the amount of solder in the container is detected by the motor 122 (step 111). Since the amount of solder in the container is determined by the amount of piston 106 inserted into the container, the amount of piston 106 inserted is detected as solder amount information. For example, a servo motor is used as the motor 122, and the insertion amount of the piston 106 is detected by information on the number of pulses of the motor 122 and an encoder value. Based on the solder amount information, a case exchange signal is transmitted from the motor 122 to the controller 133 as shown in FIG.

  As shown in step 112, when the controller 133 receives the case exchange signal and determines that the amount of solder in the container is insufficient, this is notified by a display such as a buzzer or a display. Thereby, after the board | substrate 2 is conveyed, a container is replaced | exchanged manually (step 113). If the case replacement signal is not transmitted from the motor 122, it is determined that there is a sufficient amount of solder in the container, and no display such as a buzzer or a display is performed.

  Note that, in the program for operating the fluid coating apparatus 150, Steps 101 to 109 are executed. After it is determined in Step 109 that the rolling diameter is insufficient, the solder is supplied by the fluid supply apparatus 100 for the first time.

  In the present embodiment, the supply of solder is automatically performed by the drive mechanism 103, and the container is manually replaced. Therefore, the fluid application device 150 stops mainly when the container is replaced, and does not stop when the solder is supplied. Thereby, the working time by the fluid coating apparatus 150 is shortened. Moreover, since the inside of the fluid coating apparatus 150 is exposed to the outside mainly when the case is replaced, it is possible to prevent foreign matter from adhering to the screen 1 and the substrate 2.

  In the present embodiment, solder is used as the fluid. However, a flux, ACP (Anisotropic Conductive Paste), NCP (Non-Conductive Paste), or a conductive paste such as copper may be used as the fluid.

<Modification>
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  For example, FIG. 18 is a perspective view showing a modified example of the drive mechanism 103 of the fluid coating device 150. In this drive mechanism 103, two of a drive pulley 123 and a rotation drive pulley 125 provided on the rotation shaft of the motor are connected by a belt 124. The rotation driving pulley 125 includes a first pulley 125 a and a second pulley 125 b, and the first pulley 125 a and the driving pulley 123 are connected via a belt 124. As a result, the drive pulley 123 and the rotary drive pulley 125 rotate in conjunction with each other.

  The first pulley 125 a and the second pulley 125 b have a common rotating shaft 127, and the rotating shaft 127 is connected to the container support portion 104. The teeth of the second pulley 125b and the teeth of the vertical drive pulley 126 are engaged with each other, whereby the rotary drive pulley 125 and the vertical drive pulley 126 rotate in conjunction with each other. The vertical drive pulley 126 rotates with the feed screw 129 as a rotation axis.

  Thus, if each pulley 123, 125, and 126 rotates in conjunction with a motor, the structure of each pulley 123, 125, and 126 may be set suitably. Further, the number of motors and pulleys used as the drive mechanism 103 is not limited. In this embodiment, the pulleys 123, 125, and 126 are rotated by one motor, which is advantageous for downsizing the drive mechanism 103.

  Alternatively, the drive mechanism 103 may be driven by a plurality of gears instead of such a belt drive.

  In the embodiment described above, the container support and the container rotate. However, the container support portion may be fixed so as not to rotate on the support block, and the piston supported by the piston support portion may rotate. Even if the fluid supply apparatus having such a configuration is used, the same effects as those of the embodiment described above can be obtained.

  Moreover, the fluid supply apparatus or the squeegee mechanism may be provided with a discharge sensor that detects the discharge of solder from the container. For example, the squeegee 171 shown in FIG. 4 is provided with a laser emitting portion, and the squeegee 172 is provided with a laser incident portion. Then, laser irradiation is performed between the squeegees 171 and 172, whereby the discharge of solder is detected.

  For example, a purchased container may contain air. When the container is attached to the fluid supply apparatus for the first time, even if the motor rotates, the air may only be discharged and solder may not be discharged. Therefore, when the container is mounted for the first time, the motor rotates at a predetermined position on the screen, and the discharge of the solder is confirmed by the discharge sensor. Thereby, when the fluid supply apparatus operates, the solder is reliably supplied.

  As a modification of the fluid coating device 150 described above, a device including a squeegee block is also conceivable. Solder is supplied to the squeegee block by the fluid supply device 100 described above.

DESCRIPTION OF SYMBOLS 1 ... Screen 2 ... Board | substrate 30 ... Container 100 ... Fluid supply apparatus 102 ... Piston support part 103 ... Drive mechanism 104 ... Container support part 106 ... Piston 106d ... Through-hole 106a ... End part of piston 107 ... Seal member 110 ... Seal member 113 ... Nozzle 114 ... Opening / closing mechanism 115a, 115b ... Opening / closing member 116 ... Discharge end 116a ... Tapered surface 116b ... Internal flow path 119a, 119b ... Pressing end 122 ... Motor 123 ... Drive pulley 124 ... Belt 125 ... Rotation Drive pulley 126 ... Vertical drive pulley 127 ... Rotation shaft of rotary drive pulley 129 ... Feed screw 130 ... Frame 150 ... Fluid application device 170 ... Squeegee mechanism 171, 172 ... Squeegee

Claims (6)

A piston having a through hole;
A piston support for supporting the piston;
A container support capable of supporting a container containing a fluid,
The piston is inserted into the container to discharge the fluid from the container through the through-hole of the piston, and the discharge from the container is adjusted to adjust the discharge amount of the fluid. A fluid supply apparatus comprising: a drive mechanism that drives at least one of the container support portion and the piston support portion so that the piston moves relatively away. The fluid supply apparatus according to claim 1,
The fluid supply device according to claim 1, wherein the piston includes a seal member that is provided at an end of the piston and has a tapered outer peripheral surface that increases in diameter toward the direction in which the piston is inserted. The fluid supply apparatus according to claim 1 or 2,
A fluid supply apparatus, wherein the fluid is solder. A piston having a through-hole, a piston support for supporting the piston, a container support capable of supporting a container containing a fluid, and the flow from the container through the through-hole of the piston. In order to discharge the body, a fluid supply device including a drive mechanism capable of driving at least one of the container and the piston so that the piston is inserted into the container is set in advance. The piston is relatively inserted into the container by the drive mechanism so that the insertion distance is larger than a set insertion distance that is an insertion distance of the piston into the container corresponding to the supplied amount of fluid. And discharging the fluid,
Using the fluid supply apparatus, the piston is relatively moved from the container by the drive mechanism before the discharge is stopped so that the discharge of the fluid is stopped at a supply amount corresponding to the set insertion distance. A fluid supply method in which at least one of the container and the piston is driven in a direction to be removed. A piston having a through hole; a piston support for supporting the piston; a container support capable of supporting a container containing a fluid; and driving at least one of the container and the piston to form the container And a drive mechanism for discharging the fluid from the container, and driving at least one of the container and the piston so that the piston is inserted into the container. Causing the fluid to be discharged from the container through a through hole;
A fluid supply method of driving at least one of the container support part and the piston support part in a direction in which the piston is relatively removed from the container before the discharge of the fluid is stopped. A fluid supply method according to claim 4 or 5,
A fluid supply method, wherein the fluid is solder.

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