JP2011029545A - Stage unit, exposure apparatus, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage unit capable of suppressing temperature variation due to vaporization heat. <P>SOLUTION: A substrate stage 2 is configured to hold and move a substrate P to be subjected to immersion exposure using a liquid LQ, and includes a second groove part 42 provided at a periphery of the held substrate P to recover the liquid LQ, a discharge hole 45 provided in a bottom part 42a of the second groove part 42 to discharge the liquid LQ recovered by the second groove part 42 to the outside of the second groove part 42, and a float valve 51 made of a material having smaller specific gravity than the liquid LQ, arranged at the second groove part 42, and floating in accordance with the level of the liquid LQ retained in the second groove part 42 to open and close the discharge hole 45. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method.

  As an exposure apparatus used in a photolithography process, there is known an immersion exposure apparatus that exposes a substrate with exposure light through a liquid, as disclosed in Patent Document 1. The exposure apparatus includes a stage device that holds a substrate, and exposes the substrate held by the stage device.

US Patent Application Publication No. 2005/0219488

  In the immersion exposure apparatus, there is a possibility that liquid enters the space on the back side of the substrate, or the liquid adheres to the back side of the substrate. If the liquid is allowed to stand, there is a possibility that the substrate is thermally deformed, the stage device is thermally deformed, or the measurement results of various measuring devices are fluctuated due to the vaporization heat of the liquid. When such a problem occurs, there is a possibility that an exposure defect such as a defect occurs in a pattern formed on the substrate. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide a stage apparatus capable of suppressing the influence of heat of vaporization of a liquid. Another object of the present invention is to provide an exposure apparatus that can suppress the occurrence of exposure failure. Moreover, the aspect of this invention aims at providing the device manufacturing method which can suppress generation | occurrence | production of a defective device.

  According to the first aspect of the present invention, there is provided a stage device that holds and moves an object to be subjected to a predetermined process using a liquid, and is provided around the held object to collect the liquid. A liquid recovery groove, a bottom part of the liquid recovery groove, a discharge part for discharging the liquid recovered in the liquid recovery groove to the outside of the liquid recovery groove, and a material having a specific gravity smaller than that of the liquid. There is provided a stage device having a float valve that is disposed in the liquid recovery groove and floats and sinks according to the liquid level of the liquid stored in the liquid recovery groove to open and close the discharge part.

  According to the second aspect of the present invention, there is provided a stage device that holds and moves an object on which a predetermined process using a liquid is performed, and is provided around the held object to collect the liquid. A liquid recovery groove that is provided at a bottom portion of the liquid recovery groove and discharges the liquid recovered in the liquid recovery groove to the outside of the liquid recovery groove; And a lid member that is placed on the bottom of the cover and covers the discharge portion.

  According to a third aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the exposure apparatus including the stage device according to the first aspect or the second aspect.

  According to the fourth aspect of the present invention, a device manufacturing method using the exposure apparatus of the third aspect is provided.

  According to the present invention, the influence of heat of vaporization can be suppressed. Further, according to the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the present invention, it is possible to suppress the occurrence of defective devices.

It is a schematic block diagram which shows an example of the exposure apparatus EX which concerns on 1st Embodiment. FIG. 3 is a side sectional view showing the vicinity of the liquid immersion apparatus and the substrate stage according to the first embodiment. It is a top view showing typically the substrate table concerning a 1st embodiment. It is a sectional side view which shows the principal part of the substrate table which concerns on 1st Embodiment. It is a sectional side view which shows the principal part of the substrate table which concerns on 2nd Embodiment. It is a sectional side view which shows the principal part of the substrate table which concerns on 3rd Embodiment. It is a perspective view which shows the liquid guidance | induction part which concerns on 4th Embodiment. It is a sectional side view which shows the principal part of the substrate table which concerns on 4th Embodiment. It is a sectional side view which shows the principal part of the substrate table which concerns on 5th Embodiment. It is a top view which shows typically the substrate table which concerns on another embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. In FIG. 1, an exposure apparatus EX includes positional information of each stage 1 and 2, a mask stage 1 that can move while holding a mask M, a substrate stage (stage apparatus) 2 that can move while holding a substrate P, and the like. An interferometer system 7 for measuring, an illumination system IL for illuminating the mask M with the exposure light EL, and a projection optical system (optical system) PL for projecting an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P; And a control device 8 for controlling the operation of the entire exposure apparatus EX.

  In addition, the exposure apparatus EX includes a chamber apparatus 14 that forms an internal space 13 in which the substrate P is processed. The chamber device 14 is configured to be able to adjust the environment (including temperature, humidity, cleanliness, and pressure) of the internal space 13. In the present embodiment, the chamber device 14 adjusts the pressure of the internal space 13 to approximately atmospheric pressure.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask in which a predetermined pattern is formed on a transparent plate such as a glass plate using a light shielding film such as chromium. A reflective mask can also be used as the mask M. The substrate P is a substrate for manufacturing a device and includes a photosensitive film. The photosensitive film is a film of a photosensitive material (photoresist).

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. The exposure apparatus EX includes an immersion apparatus 9 that forms an immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a space filled with liquid. In the present embodiment, water (pure water) is used as the liquid LQ.

  In the present embodiment, the immersion space LS is such that the optical path of the exposure light EL emitted from the terminal optical element 10 closest to the image plane of the projection optical system PL is the liquid LQ among the plurality of optical elements of the projection optical system PL. Formed to be filled. The last optical element 10 has an exit surface 11 that emits the exposure light EL toward the image plane of the projection optical system PL. The immersion space LS is formed so that the optical path of the exposure light EL between the terminal optical element 10 and an object disposed at a position facing the exit surface 11 of the terminal optical element 10 is filled with the liquid LQ. The position facing the emission surface 11 includes the irradiation position of the exposure light EL emitted from the emission surface 11.

  The liquid immersion device 9 includes a liquid immersion member 20 that holds the liquid LQ. The liquid immersion member 20 is disposed in the vicinity of the last optical element 10. The liquid immersion member 20 has a lower surface 12. In the present embodiment, an object that can face the emission surface 11 can face the lower surface 12. When the surface of the object is disposed at a position facing the emission surface 11, at least a part of the lower surface 12 and the surface of the object are opposed. When the exit surface 11 and the surface of the object face each other, the liquid LQ can be held between the exit surface 11 of the last optical element 10 and the surface of the object. Further, when the lower surface 12 and the surface of the object face each other, the liquid LQ can be held between the lower surface 12 of the liquid immersion member 20 and the surface of the object. A liquid immersion space LS is formed by the liquid LQ held between the injection surface 11 and the lower surface 12 on one side and the surface of the object on the other side.

  In the present embodiment, the object that can face the emission surface 11 and the lower surface 12 includes an object that can move within a predetermined plane including the irradiation position of the exposure light EL. In the present embodiment, the object includes at least one of the substrate stage 2 and the substrate P held on the substrate stage 2. In the present embodiment, the substrate stage 2 is movable on the guide surface 5 of the base member 6. In the present embodiment, the guide surface 5 is substantially parallel to the XY plane. The substrate stage 2 holds the substrate P and can move along the guide surface 5 in the XY plane including the irradiation position of the exposure light EL.

  In the present embodiment, the immersion space LS is formed so that a partial region (local region) on the surface of the substrate P disposed at a position facing the emission surface 11 and the lower surface 12 is covered with the liquid LQ. The interface (meniscus, edge) of the liquid LQ is formed between the surface of the substrate P and the lower surface 12. That is, in the present embodiment, the exposure apparatus EX sets the immersion space LS so that a part of the area on the substrate P including the projection area PR of the projection optical system PL is covered with the liquid LQ when the substrate P is exposed. Adopt the local immersion method to be formed.

  The illumination system IL illuminates a predetermined illumination region IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 includes a first drive system 3 that moves the mask stage 1 and a mask holding unit 15 that holds the mask M in a releasable manner. In the present embodiment, the mask holding unit 15 holds the mask M so that the pattern formation surface (lower surface) of the mask M and the XY plane are substantially parallel. The first drive system 3 includes an actuator such as a linear motor. In the present embodiment, the mask stage 1 is movable in three directions, ie, the X axis, the Y axis, and the θZ direction, with the mask M held by the mask holding unit 15.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The plurality of optical elements of the projection optical system PL are held by a lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is substantially parallel to the Z axis. Further, the projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 includes a second drive system 4 that moves the substrate stage 2, a stage body 16, and a substrate table 17 that is mounted on the stage body 16 and can hold the substrate P. The stage body 16 is supported by the gas bearing in a non-contact manner on the guide surface 5 and is movable on the guide surface 5 in the XY directions. The substrate stage 2 holds the substrate P and has a predetermined guide surface 5 including a position facing the exit surface 11 and the lower surface 12 on the light exit side of the last optical element 10 (image surface side of the projection optical system PL). It can move in the area.

  The second drive system 4 includes an actuator such as a linear motor, and a coarse motion system 4A capable of moving the stage body 16 on the guide surface 5 in the X axis, Y axis, and θZ directions, and a voice coil motor, for example. A fine movement system 4B including an actuator and capable of moving the substrate table 17 in the Z-axis, θX, and θY directions with respect to the stage main body 16 is provided. The substrate table 17 is moved in the X axis, Y axis, Z axis, θX, θY, and θZ directions while holding the substrate P by the operation of the second drive system 4 including the coarse movement system 4A and the fine movement system 4B. It can move in one direction.

The interferometer system 7 measures positional information of the mask stage 1 and the substrate stage 2 in the XY plane. The interferometer system 7 includes a laser interferometer 7A that measures position information of the mask stage 1 in the XY plane, and a laser interferometer 7B that measures position information of the substrate stage 2 in the XY plane. The laser interferometer 7A irradiates measurement light onto the reflection surface 1R disposed on the mask stage 1, and uses the measurement light via the reflection surface 1R to mask the mask stage 1 (X-axis, Y-axis, and θZ directions). The position information of the mask M) is measured.
The laser interferometer 7B irradiates measurement light onto the reflection surface 2R disposed on the substrate stage 2 (substrate table 17), and uses the measurement light via the reflection surface 2R to perform the X-axis, Y-axis, and θZ directions. The position information of the substrate stage 2 (substrate P) is measured.

  In the present embodiment, a focus / leveling detection system (not shown) for detecting position information on the surface of the substrate P held on the substrate stage 2 is disposed. The focus / leveling detection system detects position information on the surface of the substrate P in the Z-axis, θX, and θY directions.

  When the substrate P is exposed, the position information of the mask stage 1 is measured by the laser interferometer 7A, and the position information of the substrate stage 2 is measured by the laser interferometer 7B. The control device 8 operates the first drive system 3 based on the measurement result of the laser interferometer 7 </ b> A, and executes position control of the mask M held on the mask stage 1. Further, the control device 8 operates the second drive system 4 based on the measurement result of the laser interferometer 7B and the detection result of the focus / leveling detection system to control the position of the substrate P held on the substrate stage 2. Execute.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus that projects an image of the pattern of the mask M onto the substrate P while moving the mask M and the substrate P in synchronization with each other in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 8 controls the mask stage 1 and the substrate stage 2 so that the mask M and the substrate P are scanned in the XY plane intersecting the optical path (optical axis AX) of the exposure light EL. Move in the direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P.

  Next, the liquid immersion device 9 and the substrate stage 2 will be described with reference to FIGS. 1 and 2. FIG. 2 is a side sectional view showing the vicinity of the liquid immersion device 9 and the substrate stage 2.

  The liquid immersion member 20 is an annular member. The liquid immersion member 20 is disposed around the last optical element 10. As shown in FIG. 2, the liquid immersion member 20 has an opening 9 </ b> K through which the exposure light EL passes at a position facing the emission surface 11. The liquid immersion member 20 includes a supply port 21 that can supply the liquid LQ and a recovery port 22 that can recover the liquid LQ.

The supply port 21 can supply the liquid LQ in order to form the immersion space LS.
The supply port 21 is disposed at a predetermined position of the liquid immersion member 20 so as to face the optical path in the vicinity of the optical path of the exposure light EL. The supply port 21 is connected to the liquid supply device 24 via the flow path 23. The liquid supply device 24 can deliver a clean and temperature-adjusted liquid LQ. The flow path 23 includes a supply flow path formed inside the liquid immersion member 20 and a flow path formed by a supply pipe connecting the supply flow path and the liquid supply device 24. The liquid LQ delivered from the liquid supply device 24 is supplied to the supply port 21 via the flow path 23.

  The recovery port 22 can recover at least a part of the liquid LQ on the object facing the lower surface 12 of the liquid immersion member 20 from above the object. In the present embodiment, the recovery port 22 is disposed around the opening 9K. The recovery port 22 is disposed at a predetermined position of the liquid immersion member 20 that can face the surface of the object. A porous member 25 made of a plate-like porous body including a plurality of holes (openings or pores) is disposed in the recovery port 22. The porous member 25 includes a mesh filter in which a large number of small holes are formed in a mesh shape. In the present embodiment, the lower surface 12 of the liquid immersion member 20 includes the lower surface of the porous member 25. The recovery port 22 is connected to the first liquid recovery device 27 via the flow path 26. The first liquid recovery device 27 includes a vacuum system and can recover the liquid LQ by suction. The flow path 26 includes a recovery flow path formed inside the liquid immersion member 20 and a flow path formed by a recovery pipe connecting the recovery flow path and the first liquid recovery device 27. The liquid LQ recovered from the recovery port 22 is recovered by the first liquid recovery device 27 via the flow path 26.

  In the present embodiment, the control device 8 executes the liquid recovery operation by the first liquid recovery device 27 in parallel with the liquid supply operation by the liquid supply device 24, whereby the terminal optical element 10 and the liquid immersion member 20 are The liquid immersion space LS can be formed with the liquid LQ between the terminal optical element 10 and the liquid immersion member 20 and the opposing object. During the exposure of the substrate P, the liquid LQ is held between the liquid immersion member 20 and the substrate P so that the optical path of the exposure light EL emitted from the exit surface 11 of the last optical element 10 is filled with the liquid LQ.

  The substrate table 17 includes a first holding unit 31 that holds the substrate P. In the present embodiment, the substrate table 17 includes a second holding unit 32 around the first holding unit 31. The first holding unit 31 faces the back surface (lower surface) of the substrate P and holds the back surface of the substrate P. The second holding portion 32 faces the back surface (lower surface) of the plate member T and holds the back surface of the plate member T.

  The substrate table 17 has a base material 18. Each of the first holding unit 31 and the second holding unit 32 is provided on the upper surface 19 of the base material 18 that can face the back surface of the substrate P and the back surface of the plate member T.

  The plate member T has an opening TH in which the substrate P can be disposed. The plate member T held by the second holding unit 32 is disposed around the substrate P held by the first holding unit 31.

  In the present embodiment, the surface of the substrate P is liquid repellent with respect to the liquid LQ. As shown in FIG. 2, in the present embodiment, the substrate P includes a base material W such as a semiconductor wafer such as a silicon wafer and a photosensitive film Rg formed on the base material W. In the present embodiment, the surface of the substrate P includes the surface of the photosensitive film Rg. In the present embodiment, the photosensitive film Rg is liquid repellent with respect to the liquid LQ. The contact angle of the surface of the substrate P with respect to the liquid LQ is, for example, 90 degrees or more. The surface of the substrate P may be formed with a protective film that covers the photosensitive film Rg. The protective film is a film also called a top coat film, and protects the photosensitive film Rg from the liquid LQ.

In the present embodiment, the surface of the plate member T is liquid repellent with respect to the liquid LQ.
As shown in FIG. 2, in this embodiment, the plate member T includes a base material Tb made of metal such as stainless steel and a film Tf of a liquid repellent material formed on the base material Tb. In the present embodiment, the surface of the plate member T includes the surface of the film Tf of the liquid repellent material. Examples of the liquid repellent material include PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), and Teflon (registered trademark). The plate member T itself may be formed of a liquid repellent material. In the present embodiment, the contact angle of the surface of the plate member T with respect to the liquid LQ is, for example, 90 degrees or more.

  In the present embodiment, the first holding unit 31 includes a so-called pin chuck mechanism, and holds the substrate P in a releasable manner. In the present embodiment, the first holding part 31 is arranged on the upper surface 19 of the base material 18 and is arranged around the first support part 33 on the upper surface 19 and a plurality of first support parts 33 that support the back surface of the substrate P. The first rim portion 34 having an annular upper surface facing the back surface of the substrate P, and the first suction port 35 that is disposed inside the first rim portion 34 on the upper surface 19 and sucks gas. Each of the plurality of first support portions 33 has a pin shape (convex shape). The first rim portion 34 is formed in an annular shape having substantially the same shape as the outer shape of the substrate P. The upper surface of the first rim portion 34 faces the peripheral region (edge region) on the back surface of the substrate P. A plurality of first suction ports 35 are provided on the upper surface 19 inside the first rim portion 34. Each of the first suction ports 35 is connected to a suction device (not shown) including a vacuum system or the like. The control device 8 uses the suction device to exhaust the gas in the first space surrounded by the back surface of the substrate P, the first rim portion 34 and the base material 18 through the first suction port 35, and The substrate P is sucked and held by the first support portion 33 by setting one space to a negative pressure. Further, the substrate P can be released from the first holding part 31 by stopping the suction operation by the suction device connected to the first suction port 35.

The second holding portion 32 also includes a so-called pin chuck mechanism and holds the plate member T so as to be releasable. In the present embodiment, the second holding portion 32 is disposed around the first rim portion 34 on the upper surface 19, and has a second rim portion 36 having an annular upper surface facing the back surface of the plate member T, and a second rim portion 36 on the upper surface 19. The second rim portion 36 is disposed around the rim portion 36 and has a third rim portion 37 having an annular upper surface facing the back surface of the plate member T, and the upper surface 19 between the second rim portion 36 and the third rim portion 37. A plurality of second support portions 38 that support the back surface of the plate member T, and a second suction port 39 that is disposed on the upper surface 19 between the second rim portion 36 and the third rim portion 37 and sucks gas. Including. Each of the plurality of second support portions 38 has a pin shape (convex shape). The upper surface of the second rim portion 36 faces the inner edge region (inner edge region) on the back surface of the plate member T in the vicinity of the opening TH.
The upper surface of the third rim portion 37 faces the outer edge region (outer edge region) of the back surface of the plate member T. A plurality of second suction ports 39 are provided on the upper surface 19 between the second rim portion 36 and the third rim portion 37. Each of the second suction ports 39 is connected to a suction device (not shown) including a vacuum system. The control device 8 uses the suction device to cause the gas in the second space surrounded by the back surface of the plate member T, the second rim portion 36, the third rim portion 37, and the base material 18 to pass through the second suction port 39. The plate member T is sucked and held by the second support portion 38 by evacuating and making the second space have a negative pressure. In addition, the plate member T can be released from the second holding portion 32 by stopping the suction operation by the suction device connected to the second suction port 39. Instead of detachably holding the plate member T by the second holding portion 32, a flat portion having the same height as the surface of the substrate P held by the first holding portion 31 may be formed on the base material 18 itself. I do not care.

  In the present embodiment, the first holding unit 31 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The second holding unit 32 holds the plate member T so that the surface of the plate member T and the XY plane are substantially parallel. In the present embodiment, the surface of the substrate P held by the first holding unit 31 and the surface of the plate member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). Is). The surface of the substrate P and the surface of the plate member T can face the emission surface 11 and the lower surface 12. In the present embodiment, the surface of the plate member T includes the upper surface of the substrate stage 2 (substrate table 17) that can face the emission surface 11 and the lower surface 12.

  Further, in the present embodiment, a predetermined gap is provided between the surface (edge) of the substrate P held by the first holding unit 31 and the surface (inner edge) of the plate member T held by the second holding unit 32. A gap G is formed. In the present embodiment, as shown in FIG. 2, the immersion space LS formed by the liquid LQ from the supply port 21 may be formed across the surface of the substrate P and the surface of the plate member T. That is, in the present embodiment, the immersion space LS may be formed on the gap G. In the present embodiment, the size of the gap G is determined so that the liquid LQ supplied from the supply port 21 does not enter the gap G due to the surface tension of the liquid LQ. The size of the gap G is, for example, 1 mm or less. Each of the surface of the substrate P on one side forming the gap G and the surface of the plate member T on the other side is liquid repellent with respect to the liquid LQ, and the gap G is optimized by optimizing the size of the gap G. Infiltration of the liquid LQ from is suppressed.

Note that the peripheral region on the surface of the substrate P may not be liquid repellent, and in that case, the intrusion of the liquid LQ from the gap G may not be suppressed.
Hereinafter, a structure for draining the liquid LQ that has entered through the gap G provided in the substrate table 17 of the present embodiment will be described with reference to FIGS. FIG. 3 is a plan view schematically showing the substrate table 17. FIG. 4 is a side sectional view showing a main part of the substrate table 17.

  The substrate table 17 includes a groove portion 40 (liquid recovery groove) for recovering the liquid LQ leaked from the gap G formed around the substrate P held by the substrate table 17 (first holding portion 31). . The groove part 40 of the present embodiment includes a first groove part 41 that receives the liquid LQ leaked from the gap G, and a second groove part 42 that collects and stores a predetermined amount of the liquid LQ received by the first groove part 41.

  As described above, although the size of the gap G is optimized and the liquid LQ is prevented from entering the gap G, the liquid LQ may enter the space below the gap G from the gap G. The liquid LQ supplied to the surface of the substrate P and the surface of the plate member T can be recovered by the recovery port 22 of the liquid immersion device 9. On the other hand, the liquid LQ that has entered the space below the gap G from the gap G is used. It is difficult to recover at the recovery port 22. In this embodiment, since the groove part 40 is arrange | positioned at the substrate table 17, the liquid LQ which permeated into the space on the back surface side of the substrate P from the gap G can be received by the groove part 40 and collected.

  The first groove portion 41 is disposed in a predetermined region of the upper surface 19 of the base material 18. In the present embodiment, the first groove portion 41 is disposed around the first rim portion 34. More specifically, the first groove portion 41 of this embodiment is disposed between the first rim portion 34 of the first holding portion 31 and the second rim portion 36 of the second holding portion 32. As shown in FIG. 3, the first groove portion 41 has a ring shape in the XY plane.

  In the present embodiment, the first groove portion 41 is disposed at a position facing the peripheral region (edge region) on the back surface of the substrate P and the inner edge region (inner edge region) on the back surface of the plate member T. That is, in the present embodiment, the first groove portion 41 is disposed below the gap G. In other words, the first groove portion 41 is disposed so as to face the gap G.

  The second groove portion 42 is disposed in a predetermined area of the first groove portion 41. That is, in the present embodiment, the second groove portion 42 is disposed around the first rim portion 34. More specifically, the second groove portion 42 of the present embodiment is disposed between the first rim portion 34 of the first holding portion 31 and the second rim portion 36 of the second holding portion 32.

  In the present embodiment, the second groove portion 42 is disposed at a position facing the peripheral region (edge region) on the back surface of the substrate P and the inner edge region (inner edge region) on the back surface of the plate member T. That is, in the present embodiment, the second groove portion 42 is disposed below the gap G. In other words, the second groove portion 42 is disposed so as to face the gap G.

  In the present embodiment, as shown in FIG. 3, a plurality of second groove portions 42 are arranged at equal intervals on the bottom 41 a of the ring-shaped first groove portion 41. The second groove portion 42 is a hole-shaped groove that is dug a predetermined distance vertically downward from the bottom 41 a of the first groove portion 41. The second groove portion 42 opens at the bottom 41a of the first groove portion 41, and is configured to collect a predetermined amount of liquid LQ that has flowed down from the opening. Note that the opening of the second groove portion 42 is narrowed by a predetermined amount by a locking portion 43 (see FIG. 4 described later).

In the groove part 40 of the present embodiment, a liquid guiding part 44 that guides the liquid LQ to the second groove part 42 is provided. A plurality of liquid guiding portions 44 are laid on the bottom 41 a of the first groove portion 41 so as to straddle the adjacent second groove portions 42. Further, the end portion of the liquid guiding portion 44 extends to the inside of the second groove portion 42 so as to contact the side wall of the second groove portion 42. The liquid guiding part 44 is formed of a lyophilic porous member having a large number of pores, and absorbs the liquid LQ received by the first groove part 41 and guides it to the opening of the second groove part 42. It has become.
The liquid guiding portion 44 of the present embodiment is formed from porous ceramics. In addition, as long as the porous body which forms the liquid induction | guidance | derivation part 44 is a raw material which has many holes (pores), you may use porous body plastic, a porous body metal (for example, a sintered metal, foam metal), etc.

  As shown in FIG. 4, the bottom portion 42 a of the second groove portion 42 is provided with a discharge hole (discharge portion) 45 that discharges the liquid LQ collected by the second groove portion 42 to the outside of the second groove portion 42. The discharge hole 45 of the present embodiment extends a predetermined distance vertically downward from the bottom 42a of the second groove 42. The discharge hole 45 communicates between the second groove portion 42 and the internal flow path 46 and discharges the liquid LQ from the bottom 42 a to the internal flow path 46.

  The internal flow path 46 is provided inside the substrate table 17 (base material 18). The internal flow path 46 communicates with the lower end of the discharge hole 45 and receives the liquid LQ discharged from the discharge hole 45, and the liquid LQ in the first internal flow path 47 is transferred to the substrate table 17. And a second internal channel 48 that leads to a predetermined position on the side surface on the Y side. As shown in FIG. 3, the first internal flow path 47 has a ring shape having substantially the same diameter as the first groove portion 41 in the XY plane.

  The second internal channel 48 communicates with a part of the bottom of the first internal channel 47. The second internal flow path 48 has a lower height relationship than the first internal flow path 47. That is, according to the internal flow path 46 of the present embodiment, the liquid LQ received in the first internal flow path 47 can flow out to the second internal flow path 48 by its own weight. The second internal channel 48 is connected to the second liquid recovery device 49 at a predetermined position on the side surface on the −Y side of the substrate table 17. The second liquid recovery device 49 includes a drainage recovery pipe 50 connected to a vacuum system (not shown) and the second internal flow path 48. The second liquid recovery device 49 communicates with the internal flow path 46 and is configured to be able to suck the liquid LQ through the internal flow path 46.

  As shown in FIG. 4, the second groove portion 42 is provided with a float valve 51 that opens and closes the discharge hole 45 by floating and sinking according to the liquid level of the liquid LQ stored in the second groove portion 42. The second groove portion 42 is provided with a locking portion 43 that restricts the movement of the float valve 51 in the floating direction. The locking portion 43 restricts the movement of the float valve 51 from the second groove portion 42 to the first groove portion 41 by restricting the opening of the second groove portion 42 by a predetermined amount (see the float valve 51 shown on the left side of FIG. 4). The locking portion 43 forms a storage space S for storing a predetermined amount of the liquid LQ in the second groove portion 42 by narrowing the opening of the second groove portion 42 by a predetermined amount.

  The float valve 51 is disposed in the storage space S. The float valve 51 is made of a material having a specific gravity smaller than that of the liquid LQ. Since the liquid LQ of this embodiment is water (pure water), the float valve 51 of this embodiment is formed of a resin material such as polyethylene or polypropylene having a specific gravity of about 0.9. The liquid LQ of the present embodiment is water (pure water). However, when another liquid is used, the specific gravity of the liquid LQ differs, so that the material of the float valve 51 depends on the specific gravity of the selected liquid. Is preferably selected as appropriate.

  The float valve 51 moves in the Z-axis direction along the second groove portion 42 between the locking portion 43 and the bottom portion 42 a according to the liquid level of the liquid LQ stored in the second groove portion 42. More specifically, the float valve 51 closes the discharge hole 45 and stores the liquid LQ in the second groove portion 42 to a predetermined liquid level (see the float valve 51 shown on the right side of FIG. 4), and the predetermined liquid level. When exceeding, it is configured to be movable between an open position (see the float valve 51 shown in the center or left side of FIG. 4) that floats from the closed position and opens the discharge hole 45.

  The float valve 51 of the present embodiment has a substantially disc shape, and is configured such that one surface 52a facing the bottom portion 42a can come into contact with the bottom portion 42a so as to include a position where the discharge hole 45 is provided. . Further, the other surface 52 b of the float valve 51 is provided with a convex portion 53 that can come into contact with the back side (−Z side) of the locking portion 43 so as to surround the opening of the second groove portion 42. The convex portion 53 has a ring shape. Moreover, the convex part 53 is tapering off toward the standing direction.

Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described.
The control device 8 loads the substrate P before exposure onto the first holding unit 31 using a predetermined transport device. The substrate P is held by the first holding unit 31. Further, the plate member T is held by the second holding portion 32 at a predetermined timing before the substrate P is held.

  In order to perform immersion exposure on the substrate P held by the first holding unit 31, the control device 8 includes at least one of the last optical element 10 and the immersion member 20 on one side, and the substrate P and the plate member T on the other side. An immersion space LS is formed with the liquid LQ between them. Thereby, the optical path of the exposure light EL between the last optical element 10 and the substrate P is filled with the liquid LQ.

In a state where the optical path of the exposure light EL is filled with the liquid LQ, the control device 8 emits the exposure light EL from the illumination system IL. The exposure light EL emitted from the illumination system IL illuminates the mask M.
The exposure light EL that has passed through the mask M is irradiated onto the substrate P via the projection optical system PL and the liquid LQ in the immersion space LS. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  When the immersion space LS is formed on the gap G, the liquid LQ may enter from the gap G. In the present embodiment, the liquid LQ that has entered from the gap G flows down toward the groove portion 40 that is disposed so as to face the gap G. The liquid LQ that has flowed down to a position corresponding to the second groove portion 42 of the groove portion 40 is immediately collected and stored in the second groove portion 42. On the other hand, the liquid LQ that has flowed down to a position corresponding to the first groove portion 41 of the groove portion 40 is guided to the second groove portion 42 by the liquid guiding portion 44 and is collected and stored in the second groove portion 42.

  That is, the liquid LQ that has flowed down to a position corresponding to the first groove portion 41 of the groove portion 40 contacts the liquid guide portion 44 laid on the bottom portion 41a. The liquid LQ in contact with the liquid guiding part 44 is absorbed into the liquid guiding part 44 made of a porous member. The liquid LQ absorbed in the liquid guiding part 44 circulates in the liquid guiding part 44 by capillary force. Then, the liquid LQ flows to the end of the liquid guiding part 44 extending to the inside of the second groove part 42, and drops from the end of the liquid guiding part 44 by its own weight and is collected in the second groove part 42. .

The liquid guiding part 44 of the present embodiment not only guides the liquid LQ from the first groove part 41 to the second groove part 42, but also causes the liquid LQ to exceed the capacity in a certain second groove part 42 as shown on the left side of FIG. When this occurs, the excess liquid LQ is guided from the specific second groove portion 42 to the adjacent second groove portion 42.
That is, since the liquid guide part 44 of this embodiment is provided so as to straddle the adjacent second groove part 42, the surplus liquid LQ generated when the capacity of the specific second groove part 42 exceeds the specific second groove part 42 is guided from one end of the liquid guiding portion 44 extending to the inside of 42 to the other end of the liquid guiding portion 44 that is sucked up by the capillary force and still extends to the inside of the adjacent second groove portion 42 having sufficient capacity. Is done. In addition, when the capacity | capacitance of the induced | guided | derived 2nd groove part 42 has exceeded capacity, the liquid LQ is induced | guided | derived to the 2nd groove part 42 adjacent further. For this reason, the liquid LQ that has entered from the gap G is recovered in the second groove 42 without the liquid LQ remaining in the first groove 41.

  Therefore, according to the present embodiment, the liquid LQ that has entered through the gap G remains, for example, in the space between the first rim portion 34 and the second rim portion 36, or the back surface of the substrate P and the first holding portion 31. Between the back surface of the substrate P and at least one of the first holding portions 31, or between the back surface of the plate member T and the second holding portion 32, or the back surface of the plate member T. And it can suppress remaining in at least one of the 2nd holding | maintenance part 32. FIG. Further, according to the present embodiment, the liquid LQ that has flowed down to the position corresponding to the first groove portion 41 of the groove portion 40 is absorbed into the liquid guiding portion 44, so that the substrate stage 2 is accelerated or decelerated (for example, at the time of a step). It is possible to prevent the liquid LQ from jumping up.

A float valve 51 is disposed in the second groove portion 42. The float valve 51 performs gas-liquid separation that allows the liquid LQ to be discharged from the discharge hole 45 and restricts gas (outside air) from being discharged from the discharge hole 45.
The float valve 51 is positioned at the closed position until the liquid LQ that has flowed down and stored in the second groove portion 42 (the storage space S) exceeds a predetermined liquid level. The float valve 51 located at the closed position closes the discharge hole 45 by contacting the bottom portion 42a. When the stored liquid LQ exceeds a predetermined liquid level, the float valve 51 having a specific gravity smaller than that of the liquid LQ moves from the closed position to the open position by buoyancy. The float valve 51 located at the open position opens the discharge hole 45 by being separated from the bottom 42a. When the discharge hole 45 is opened, the liquid LQ stored in the second groove portion 42 is discharged from the discharge hole 45 of the bottom portion 42 a by its own weight and flows into the internal flow path 46 provided inside the substrate table 17. When the liquid level of the liquid LQ in the second groove portion 42 is lowered by the discharge of the liquid LQ from the discharge hole 45, the float valve 51 is lowered together with the liquid level and comes into contact with the bottom 42a before the liquid LQ is completely discharged. The discharge hole 45 is closed. For this reason, the discharge of the gas from the discharge hole 45 can be regulated, and only the liquid LQ can be discharged.

  Therefore, according to this embodiment, since the discharge of the gas from the discharge hole 45 can be regulated and only the liquid LQ can be discharged from the discharge hole 45, the vaporization of the liquid LQ is suppressed, and an adverse effect caused by the vaporization is suppressed. Can be effectively suppressed. For example, when the liquid LQ and the gas are both discharged from the discharge hole 45, the gas flows into the internal flow path 46, so that the liquid LQ is easily vaporized in the internal flow path 46, and there is a possibility that heat of vaporization is generated. Get higher. On the other hand, when only the liquid LQ is discharged from the discharge hole 45, no gas flows into the internal flow path 46, and the internal flow path 46 immediately reaches a saturated state. Therefore, the liquid LQ is less likely to be vaporized in the internal flow path 46, and generation of heat of vaporization can be suppressed. That is, in this embodiment, since gas is not discharged together with the liquid LQ from the discharge hole 45, the temperature of the substrate P changes due to the vaporization of the liquid LQ that has entered through the gap G, and the temperature of the plate member T changes. Or the temperature change of the base material 18 can be effectively suppressed.

  The liquid LQ that has flowed into the internal flow path 46 is recovered by a second liquid recovery device 49 that is driven at a predetermined timing under the control of the control device 8. For example, after the exposure of the substrate P is completed, the control device 8 drives the second liquid recovery device 49 when unloading the exposed substrate P from the first holding unit 31 using a predetermined transport device. The liquid LQ flowing into the internal flow path 46 is collected. Note that the drive timing of the second liquid recovery device 49 may be during the exposure of the substrate P, but it is preferable that the exposure of the substrate P is completed in consideration of the influence of vibration and the like.

  As described above, according to this embodiment, the substrate stage 2 that holds and moves the substrate P on which immersion exposure using the liquid LQ is performed, is provided around the held substrate P. A second groove portion 42 for collecting the liquid LQ, a discharge hole 45 provided in the bottom portion 42a of the second groove portion 42 for discharging the liquid LQ collected in the second groove portion 42 to the outside of the second groove portion 42, and the liquid LQ. And a float valve 51 that opens and closes the discharge hole 45 by floating and sinking according to the liquid level of the liquid LQ stored in the second groove portion 42. By adopting the configuration, the influence of the heat of vaporization of the liquid LQ can be suppressed. Therefore, the occurrence of exposure failure can be suppressed, and the occurrence of defective devices can be suppressed.

Second Embodiment
Next, a second embodiment of the present invention will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
FIG. 5 is a side sectional view showing the main part of the substrate table 17 according to the second embodiment. 5 shows the same part as the side sectional view in FIG.

  A guide portion 60 that guides the movement of the float valve 51 is provided in the second groove portion of the second embodiment. The guide part 60 of the second embodiment has a cylindrical shape and is erected at the center of the bottom part 42 a of the second groove part 42. The guide 60 extends vertically upward from the bottom 42a within a range that does not exceed the storage space S. A through hole 54 through which the guide portion 60 can be inserted is formed at the center of the float valve 51 shown in FIG. The float valve 51 is arranged in the second groove portion 42 with the through hole 54 inserted through the guide portion 60. As shown in FIG. 5, the installation position of the discharge hole 45 is changed to a position that avoids the installation position of the guide portion 60.

  According to this configuration, the float valve 51 can move in the Z-axis direction along the guide portion 60, and thus can float and sink in a fixed posture. Therefore, according to this configuration, when the float valve 51 moves from the open position to the closed position, the posture is disturbed, and the float valve 51 may be turned over or stuck to the side wall of the second groove portion 42. Can be eliminated. That is, according to the second embodiment, the float valve 51 can appropriately close the discharge hole 45, and the discharge of gas from the discharge hole 45 can be reliably regulated.

<Third Embodiment>
Next, a third embodiment of the present invention will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
FIG. 6 is a side sectional view showing the main part of the substrate table 17 according to the third embodiment. 6 shows the same part as the side sectional view in FIG.

  The liquid guiding part 44 of the third embodiment is provided so as to cover the entire opening of the second groove part 42. According to this configuration, only the liquid LQ that has passed through the liquid guiding portion 44 formed of the porous member is guided to the second groove portion 42. Moreover, according to this structure, inflow of the gas (outside air) to the 2nd groove part 42 can be suppressed, and the influence of the heat of vaporization by the liquid LQ stored in the 2nd groove part 42 can be suppressed. In the third embodiment, the liquid guiding portion 44 covers the opening of the second groove portion 42 to restrict the movement of the float valve 51 in the floating direction instead of the locking portion 43 of the above-described embodiment. It has become.

  The float valve 51 of the third embodiment has a truncated cone shape in which one surface 52a facing the bottom portion 42a is larger than the other surface 52b and gradually decreases in diameter from one surface 52a to the other surface 52b. ing. A columnar guide portion 60 is connected to the center portion of the surface 52 a of the float valve 51. The guide portion 60 of the third embodiment is configured to guide the movement of the float valve 51 by moving integrally with the float valve 51 while loosely fitting in the discharge hole 45. The guide portion 60 is made of a metal material heavier than the float valve 51 such as SUS or titanium so that a constant posture can be maintained even when the float valve 51 floats.

  Further, in the third embodiment, there is provided a seal portion 61 that seals between the float valve 51 and the discharge hole 45 in a liquid-tight manner when the float valve 51 closes the discharge hole 45. The seal portion 61 is provided at a contact portion where the float valve 51 and the bottom portion 42a are in contact with each other. In addition, the seal part 61 of this embodiment consists of a ring-shaped rubber packing, and is provided in the bottom part 42a so that the circumference | surroundings of the discharge hole 45 may be enclosed.

  That is, according to the third embodiment, since the guide portion 60 and the discharge hole 45 are loosely fitted, the float valve 51 can be moved along the discharge hole 45 in the Z-axis direction. It is possible to float and sink. In addition, since the guide part 60 moves in the state loosely fitted in the discharge hole 45, the guide part 60 does not block the discharge hole 45. Furthermore, when the float valve 51 closes the discharge hole 45, the seal portion 61 seals the space between the float valve 51 and the discharge hole 45 in a liquid-tight manner, so that a predetermined amount is provided in the second groove portion 42 without liquid leakage. It becomes possible to store the liquid LQ.

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
FIG. 7 is a perspective view showing a liquid guiding part 44 according to the fourth embodiment. FIG. 8 is a side cross-sectional view showing the main part of the substrate table 17 according to the fourth embodiment. 8 shows the same part as the side sectional view in FIG.

  As shown in FIG. 8, the float valve 51 of the fourth embodiment has a spherical shape. Moreover, the bottom part 42a of the 2nd groove part 42 of 4th Embodiment becomes a funnel shape which diameter-reduces as it goes to the perpendicular downward direction. According to this configuration, when the float valve 51 moves from the open position to the closed position, the float valve 51 can be guided toward the discharge hole 45 along the shape of the bottom portion 42a. Therefore, according to this configuration, the float valve 51 can appropriately close the discharge hole 45, and the discharge of gas from the discharge hole 45 can be reliably regulated.

As shown in FIGS. 7 and 8, the liquid guiding part 44 of the fourth embodiment includes a mountain block 44 a having an inclined part 44 a 1 inclined downward toward the second groove part 42, and a lyophilic property to the inclined part 44 a 1. And a coating layer 44b that imparts
A plurality of mountain blocks 44 a are provided on the bottom 41 a of the first groove 41 so as to straddle the adjacent second grooves 42. In addition, the end portion of the mountain block 44 a extends to the inside of the second groove portion 42 so as to contact the side wall of the second groove portion 42. In the fourth embodiment, the chevron block 44a restricts the movement of the float valve 51 in the floating direction instead of the locking portion 43 of the above-described embodiment by narrowing the opening of the second groove portion 42 by a predetermined amount. It is the composition to do.

The coating layer 44b is formed of a ceramic coating agent that forms a lyophilic coating film, particularly an aqueous metal salt-based coating agent that is highly lyophilic. The coating layer 44b forms a highly lyophilic film (for example, a contact angle with water of 3 to 20 degrees) as if fine particles are spread on the inclined portion 44a1.
According to the fourth embodiment, the liquid LQ that has entered from the gap G can be guided to the second groove portion 42 by the inclined portion 44a1 of the mountain block 44a. Further, since the lyophilicity is imparted to the inclined portion 44a1 by the coating layer 44b, the liquid LQ does not become a polka dot, and the liquid LQ can be effectively dropped into the second groove portion.

<Fifth Embodiment>
Next, a fifth embodiment of the present invention will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
FIG. 9 is a side sectional view showing the main part of the substrate table 17 according to the fifth embodiment. 9 shows the same part as the side sectional view in FIG.

  In the fifth embodiment, a lid member 70 is used instead of the float valve 51. The lid member 70 has flexibility and is configured to be placed on the bottom part 42 a of the second groove part 42 and cover the discharge hole 45. The lid member 70 includes an edge portion 71 that contacts the bottom portion 42 a so as to surround the discharge hole 45. The edge portion 71 has a ring shape. The lid member 70 of the present embodiment is formed of a member having a specific gravity heavier than that of the liquid LQ, for example, a titanium ring (specific gravity 4.5), and floats and sinks depending on the liquid level of the liquid LQ stored in the second groove 42. It has a configuration that does not. At least one of the contact surfaces of the edge portion 71 and the bottom portion 42a has a predetermined flatness.

In the fifth embodiment, the liquid LQ stored in the second groove portion 42 is oozed out from a minute gap between the edge portion 71 and the bottom portion 42a, and only the liquid LQ is discharged from the discharge hole 45 to perform gas-liquid separation. Do. In combination with the driving of the second liquid recovery device 49, the discharge timing of the liquid LQ can be adjusted, and more reliable gas-liquid separation can be performed. For example, when the internal flow path 46 is in a negative pressure state by driving the second liquid recovery device 49, the lid member 70 is pressed against the bottom portion 42a and deformed, and the edge portion 71 and the bottom portion 42a come into close contact with each other. At this time, a minute gap between the edge portion 71 and the bottom portion 42a is crushed, and a predetermined amount of liquid LQ is stored in the second groove portion 42. Further, when the driving of the second liquid recovery device 49 is stopped, the pressed state is released, and the liquid LQ accumulated in the second groove portion 42 starts to ooze from between the edge portion 71 and the bottom portion 42a. Thus, the timing of discharging the liquid LQ can be adjusted by driving the second liquid recovery device 49.
Therefore, according to the fifth embodiment, the influence of the heat of vaporization of the liquid LQ can be suppressed. Moreover, according to the fifth embodiment, it is possible to suppress the occurrence of exposure failure and suppress the occurrence of defective devices.

  In each of the above-described embodiments, the second groove portion 42 is provided around the substrate P. However, as shown in FIG. 10, the measurement plate 80X and the measurement plate 80Y are arranged around the plate member T. In the case where the second groove portion 42 is provided around the plate member T, around the measurement plate 80X, and around the measurement plate 80Y, a configuration may be adopted. According to this configuration, it is possible to effectively recover the liquid LQ that has entered between the plates. The measurement plate 80X and the measurement plate 80Y are scales for an encoder system as disclosed in JP 2009-124140 A, and grid lines are formed at a predetermined pitch.

  In each of the above-described embodiments, the projection optical system PL fills the light path on the exit side (image plane side) of the last optical element 10 with the liquid LQ, but this is disclosed in International Publication No. 2004/019128. As shown, a projection optical system in which the optical path on the incident side (member surface side) of the last optical element 10 is also filled with the liquid LQ can be employed.

In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient.
The liquid LQ is preferably a liquid LQ that is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the projection optical system or a photosensitive material (photoresist) film that forms the surface of the substrate. For example, as the liquid LQ, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, cedar oil, or the like can be used. A liquid LQ having a refractive index of about 1.6 to 1.8 may be used.
Furthermore, an optical element (such as a terminal optical element) of the projection optical system PL that is in contact with the liquid LQ may be formed of a material having a refractive index higher than that of quartz and fluorite (for example, 1.6 or more). In addition, various fluids such as a supercritical fluid can be used as the liquid LQ. For example, when the exposure light EL is F2 laser light, the F2 laser light does not transmit water, so that the liquid LQ can transmit F2 laser light, such as perfluorinated polyether (PFPE), fluorine Fluorine-based fluids such as system oils can be used.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus that scans and exposes the pattern of the mask M by synchronously moving the mask M and the substrate P, the mask M and the substrate P are stationary. Thus, the present invention can be applied to a step-and-repeat projection exposure apparatus in which the pattern of the mask M is collectively exposed and the substrate P is sequentially moved stepwise.

  Further, in step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system, the reduced image of the second pattern is transferred to the first pattern using the projection optical system. Partial exposure may be performed on the substrate P in a lump (stitch type lump exposure apparatus).

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, and can be widely applied to an exposure apparatus for manufacturing a liquid crystal display element or a display.

  In each of the above-described embodiments, the positional information of the mask stage 1 and the substrate stage 2 is measured using the interferometer system 7 including the laser interferometers 7A and 7B. You may use the encoder system which detects the scale (diffraction grating) provided in each stage 1 and 2. FIG. In this case, it is good also as a hybrid system provided with both an interferometer system and an encoder system.

  In each of the above embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX according to the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 11, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage (stage apparatus), 9 ... Liquid immersion apparatus, 42 ... 2nd groove part (liquid recovery groove), 42a ... Bottom part, 43 ... Locking part 43 ... Liquid guide part, 44a1 ... Inclination part, 45 ... Discharge hole (Discharge part), 61 ... seal part, 60 ... guide part, 70 ... lid member, 80X ... measurement plate (object), 80Y ... measurement plate (object), EL ... exposure light, EX ... exposure apparatus, LQ ... liquid, P: substrate (object), PL: projection optical system (optical system), T: plate member (object)

Claims (14)

A stage device that holds and moves an object on which a predetermined process using a liquid is performed,
A liquid recovery groove provided around the held object for recovering the liquid;
A discharge part that is provided at the bottom of the liquid recovery groove and discharges the liquid recovered in the liquid recovery groove to the outside of the liquid recovery groove;
A float valve that is formed of a material having a specific gravity smaller than that of the liquid and is arranged in the liquid recovery groove and opens and closes according to the liquid level of the liquid stored in the liquid recovery groove to open and close the discharge unit. A stage apparatus characterized by that.   The stage apparatus according to claim 1, further comprising a guide portion that guides movement of the float valve.   The stage apparatus according to claim 2, wherein the guide unit moves integrally with the float valve while loosely fitting to the discharge unit.   The stage device according to any one of claims 1 to 3, further comprising a locking portion that restricts the movement of the float valve in the floating direction.   It is disposed at a contact portion between the float valve and the bottom portion, and has a seal portion that seals between the float valve and the discharge portion in a liquid-tight manner when the float valve closes the discharge portion. The stage device according to any one of claims 1 to 4.   The stage apparatus according to claim 1, further comprising a liquid guide portion that guides the liquid to the liquid recovery groove.   The stage device according to claim 6, wherein the liquid guiding portion has an inclined portion that is inclined downward toward the liquid recovery groove.   The stage apparatus according to claim 6 or 7, wherein the liquid guiding part has lyophilicity.   The stage apparatus according to any one of claims 6 to 8, wherein the liquid guide part includes a porous member. A stage device that holds and moves an object on which a predetermined process using a liquid is performed,
A liquid recovery groove provided around the held object for recovering the liquid;
A discharge part that is provided at the bottom of the liquid recovery groove and discharges the liquid recovered in the liquid recovery groove to the outside of the liquid recovery groove;
A stage device comprising: a lid member that is flexible and is placed on a bottom portion of the liquid recovery groove and covers the discharge portion. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising the stage apparatus according to claim 1.   The exposure apparatus according to claim 11, wherein the object is the substrate. An optical system for emitting the exposure light;
The liquid immersion device according to claim 11 or 12, further comprising a liquid immersion device for liquid immersion between the optical system and the substrate so as to fill an optical path of the exposure light emitted from the optical system with the liquid. The exposure apparatus described.   The device manufacturing method using the exposure apparatus as described in any one of Claims 11-13.

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