JP2011028116A - Electro-optical device, manufacturing method thereof, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device which has excellent moisture-proof performance by preventing a substrate from being cracked, and to provide a manufacturing method thereof. <P>SOLUTION: The electrophoretic display device 1 includes an electro-optical panel 10 holding an electrophoretic layer 31 between an element substrate 2 and a surface protection substrate 4, and also includes a first sealant 61 which is disposed between the pair of substrates 2 and 4 so as to surround the electrophoretic layer 31 and seals up the electrophoretic layer 31 between the substrates 2 and 4, and a second sealing layer 62 formed to cover at least a part of a side wall surface of the first sealant 61. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electro-optical device, a manufacturing method thereof, and an electronic apparatus.

  The electrophoretic display device includes a substrate (hereinafter referred to as an element substrate) on which an electric circuit such as a TFT element is formed, a transparent sheet having a transparent conductive film (common electrode), an electrophoretic layer composed of a plurality of microcapsules, and an adhesive layer. An electrophoretic display panel configured by pasting together an electrophoretic sheet is provided (for example, Patent Document 1).

  Such an electrophoretic display panel has a structure in which moisture resistance with respect to the electrophoretic layer is ensured by sealing a resin between a surface protective substrate and an element substrate bonded to the surface side (for example, Patent Document 2).

JP 2005-114822 A JP 2005-529361 A

However, in the case of the above structure, when a glass substrate is used as the element substrate or the surface protection substrate, the glass may be cracked or the sealing material may be peeled off depending on the use environment.
In an environmental resistance test and an impact test for an electro-optic display device having a sealing material made of a resin material, cracks are generated from the end face of the element substrate or the surface protection substrate due to thermal expansion or contraction of each laminated member. Sometimes. When such a crack exists in the element substrate or the surface protection substrate, there is a problem that moisture enters from there and causes display deterioration. In addition, if the crack becomes larger, there is a problem that the drive layer of the element substrate is damaged and malfunction occurs.

  In addition, if the sealing width is widened, the stress is dispersed and cracking can be prevented. However, the sealing width cannot be easily widened because it affects the shape of the final product, and it is small. In order to realize this, a narrower sealing width is required. However, if the sealing width is narrowed, the moisture-proof performance is reduced. Moreover, in order to prevent generation | occurrence | production of a crack, although using the sealing material which consists of a low stress acrylic resin is also considered, there is also a problem in moisture-proof performance in this case.

  The present invention has been made in view of the above-described problems of the prior art. An electro-optical device, a manufacturing method thereof, and an electronic apparatus that prevent cracks from occurring on the substrate and have excellent moisture-proof performance are provided. One of the purposes is to provide it.

In order to solve the above problems, an electro-optical device of the present invention is an electro-optical device including an electro-optical panel in which an electro-optical layer is sandwiched between a pair of substrates, and around the electro-optical layer. The resin layer is disposed between the pair of substrates so as to surround the resin layer and seals the electro-optic layer between the substrates, and is formed so as to cover at least a part of the side wall surface of the resin layer. And a plating layer.
According to the present invention, since the plating layer is formed so as to cover at least a part of the side wall surface of the resin layer, an electro-optical device having excellent moisture-proof performance can be obtained. Since the moisture-proof performance can be reinforced by the plating layer, the width of the resin layer in plan view can be reduced by that amount. Thereby, it is possible to suppress the deformation of the substrate due to the stress at the time of contraction of the resin layer, and it is possible to prevent the substrate from cracking.

Moreover, it is preferable that the said plating layer is connected to the metal pattern each formed on the said pair of board | substrate.
According to the present invention, since the plating layer is connected to the metal patterns respectively formed on the pair of substrates, high sealing performance with respect to the electrophoretic layer can be obtained.

Moreover, it is preferable that the said plating layer grows by using as a nucleus the metal pattern each formed on the said pair of board | substrate.
According to the present invention, since the plating layer is grown with the metal patterns formed on the pair of substrates as nuclei, it is possible to prevent moisture from entering from the interface between the plating layer and the substrate surface, and to prevent moisture. It is possible to increase the sex.

Moreover, it is preferable that the said resin layer consists of a resin material with a smaller elastic modulus or thermal stress than an epoxy resin.
According to the present invention, the stress of the sealing portion can be favorably dispersed by the resin layer made of the resin material having a smaller elastic modulus or thermal stress than the epoxy resin. Thereby, it can prevent that a stress is locally applied to a sealing part in an environmental resistance test and an impact test, and can prevent that a crack generate | occur | produces in a board | substrate effectively.

Moreover, it is preferable that the whole side wall surface of the said resin layer is covered with the said plating layer.
According to the present invention, since the entire side wall surface of the resin layer is covered with the plating layer, it is possible to ensure high moisture resistance.

Moreover, it is preferable that the width | variety of the said resin layer in planar view of the site | part in which the said plating layer is formed is smaller than the width of the said resin layer in planar view of the site | part in which the said plating layer is not formed.
According to the present invention, the resin layer in a region where the plating layer is not formed needs to have a large (wide) width in plan view in order to ensure moisture resistance alone, but the plating layer of the present invention is sealed. Since the sealing property is high, sufficient moisture resistance can be ensured even if the width of the resin layer where the plating layer is formed is reduced (narrow) in plan view. Therefore, it is possible to prevent the apparatus from being enlarged by reducing the width of the resin layer on which the plating layer is formed.

The manufacturing method of the electro-optical display device of the present invention includes a step of forming a metal pattern on each of the pair of substrates prior to the step of bonding the pair of substrates via the electro-optical layer, and the plating In the step of forming a layer, the plating layer is grown from the metal pattern.
According to the present invention, since the plating layer is formed so as to cover at least a part of the side wall surface of the resin layer surrounding the electro-optical layer, an electro-optical device having excellent moisture-proof performance can be manufactured. . Since the moisture-proof performance can be reinforced by the plating layer, the width of the resin layer in plan view can be reduced by that amount. Thereby, it is possible to suppress the deformation of the substrate due to the stress at the time of contraction of the resin layer, and it is possible to prevent the substrate from cracking.

Further, it is preferable to have a step of forming a metal pattern on each of the pair of substrates prior to the step of bonding the pair of substrates via the electro-optic layer.
According to the present invention, since the metal patterns are respectively formed on the pair of substrates, it is possible to form a plating layer having high adhesion to each substrate surface. Thereby, it is possible to prevent moisture from entering from the interface between the plating layer and the substrate surface, and to improve moisture resistance.

An electro-optical device according to the present invention includes the electro-optical device described above.
According to the present invention, a highly reliable electronic apparatus can be obtained by including an electro-optical device having excellent moisture-proof performance.

1 is a plan view showing an overall configuration of an electrophoretic display device according to a first embodiment. Sectional drawing which shows the structure along the AA cross section of FIG. 5 is a flowchart of a method for manufacturing the electrophoretic display device of the first embodiment. Sectional drawing which shows the manufacturing process of an electrophoretic display device. Sectional drawing which shows the manufacturing process of an electrophoretic display device. Sectional drawing which shows the whole structure of the electrophoretic display device of 2nd Embodiment. Another embodiment of the electrophoretic display device. FIG. 11 illustrates a watch which is an example of an electronic device. FIG. 11 illustrates electronic paper which is an example of an electronic device. FIG. 11 illustrates an electronic notebook which is an example of an electronic device.

  Embodiments of the present invention will be described below with reference to the drawings. In each drawing used for the following description, the scale of each member is appropriately changed to make each member a recognizable size.

(First embodiment)
FIG. 1 is a plan view showing the overall configuration of the electrophoretic display device according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a configuration along the AA cross section in the electrophoretic display device of the first embodiment.
As shown in FIGS. 1 and 2, the electrophoretic display device 1 includes an electrophoretic display panel 10, a surface protection substrate 4, a connection substrate 5, and a sealing unit 60.
The electrophoretic display device 1 has a configuration in which an electrophoretic sheet 3 is attached to an element substrate 2. Further, the surface protection substrate 4 is disposed on the transparent sheet 30 of the electrophoresis sheet 3, and the connection substrate 5 is disposed on the element substrate 2 on the side opposite to the electrophoresis sheet 3. A sealing portion 60 is provided between the element substrate 2 and the surface protection substrate 4 so as to surround the electrophoretic layer 31.

  In the electrophoretic display device 1, a region where the pixel electrodes 25 are arranged is a display region 7 in a plan view. In the display area 7, the formation area of each pixel electrode 25 in a plan view is a pixel area, and an image such as a still image or a moving image is displayed for each pixel area. The periphery of the display area 7 is a non-display area 8 where no image is displayed.

  The element substrate 2 includes a base material 20, a drive layer 21, drive circuit elements 22 and 23, and terminals 27. The base material 20 is a plate-like member having a thickness of about 30 μm to 100 μm, for example. As a constituent material of the base material 20, for example, an inorganic substrate such as a glass substrate, a quartz substrate, a silicon substrate, a gallium arsenide substrate, polyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), Examples thereof include a plastic substrate (resin substrate) composed of polycarbonate (PC), polyethersulfone (PES), aromatic polyester (liquid crystal polymer), and the like.

  The drive layer 21 is a layer provided in a region overlapping the electrophoretic sheet 3 in a plan view on the inner surface 20a of the substrate 20. A planar formation region of the drive layer 21 substantially coincides with the display region 7, and the drive circuit elements 22 and 23 are provided on the peripheral portion (non-display region 8) of the drive layer 21. These drive circuit elements 22 and 23 are electrically connected to data lines and scanning lines, and supply signals to the drive layer 21.

  The drive layer 21 includes an insulating layer 24, a plurality of pixel electrodes 25, and a plurality of switching elements 26. The pixel electrodes 25 are electrodes arranged in a matrix, for example, in plan view. The switching element 26 is an element provided for each pixel electrode 25. A data line, a scanning line, and the like (not shown) are connected to the switching element 26. The insulating layer 24 is formed on the base material 20 so as to cover these parts.

  The terminal 27 is provided in a region on the inner surface 20 a of the base material 20 that is separated from the electrophoretic sheet 3 in plan view. A plurality of terminals 27 are arranged along one side of the element substrate 2. A wiring group (not shown) is connected to the terminal 27. The wiring group is connected to, for example, the scanning line and the data line.

The electrophoretic sheet 3 includes a transparent sheet 30, a common electrode 35, an electrophoretic layer 31, and an adhesive layer 33.
The transparent sheet 30 is a light-transmitting sheet that holds the electrophoretic layer 31 and has a thickness of about 25 μm to 200 μm. Examples of the constituent material of the transparent sheet 30 include materials having high light transmittance such as polyethylene terephthalate (PET), polyethersulfone (PES), and polycarbonate (PC). For example, a moistureproof sheet (not shown) or the like may be disposed on the surface 30a of the transparent sheet 30.

The common electrode 35 is an electrode made of a conductive material having high light transmittance such as ITO.
The common electrode 35 is formed over almost the entire inner surface 30 b of the transparent sheet 30. The vertical conductive material 9 is connected to the common electrode 35. The vertical conduction member 9 is electrically connected to the element substrate 2. The common electrode 35 is in a state of being electrically connected to the element substrate 2 through the vertical conductive member 9.

The electrophoretic layer 31 has a plurality of microcapsules 32.
The microcapsule 32 is a substantially spherical capsule in which an electrophoretic dispersion is enclosed, and the diameter of each capsule is substantially the same (30 μm to 100 μm). Examples of the material constituting the capsule wall film of the microcapsule 32 include compounds such as a gum arabic / gelatin composite film, a urethane resin, a urea resin, and a urea resin. The electrophoretic dispersion liquid enclosed in the microcapsule 32 includes a plurality of electrophoretic particles and a liquid phase dispersion medium for dispersing the electrophoretic particles.

  Examples of liquid dispersion media include water, alcohol solvents, various esters, ketones, aliphatic hydrocarbons, alicyclic hydrocarbons, aromatic hydrocarbons, halogenated hydrocarbons, carboxylates, and other various oils. It is possible to use a mixture of a surfactant or the like alone or a mixture thereof.

  As the electrophoretic particles, organic or inorganic particles (polymer or colloid) having a property of moving by electrophoresis due to a potential difference in a liquid phase dispersion medium can be used. Specifically, black pigments such as carbon black and aniline black, white pigments such as titanium dioxide, monoazo azo pigments, yellow pigments such as isoindolinone, monoazo azo pigments, red pigments such as quinacridone red, phthalocyanine One or more of blue pigments such as blue and green pigments such as phthalocyanine green can be used. These pigments include electrolytes, surfactants, metal soaps, resins, rubbers, oils, varnishes, charge control agents composed of particles such as compounds, titanium-based coupling agents, aluminum-based coupling agents, silanes as necessary. A dispersant such as a system coupling agent, a lubricant, a stabilizer, and the like can be added.

  In the microcapsule 32, for example, two types of electrophoretic particles of titanium dioxide which is a white pigment and carbon black which is a black pigment are encapsulated, one of which is negatively charged and the other of which is positively charged. Of course, other electrophoretic particles may be used, or only one type of electrophoretic particle may be used, and the electrophoretic particles may be moved to the common electrode side or the pixel electrode side so that display can be performed.

  The adhesive layer 33 is an adhesive that also serves as a binder. As the adhesive layer 33, for example, it is preferable to use an adhesive having good affinity for the capsule wall film of the microcapsule 32 and excellent adhesion to the pixel electrode 25.

  The surface protection substrate 4 is a substrate that is disposed on the surface 30 a of the transparent sheet 30 via an adhesive layer 36. Examples of the constituent material of the surface protective substrate 4 include a material having high light transmittance, excellent flatness, and being hardly scratched, such as an acrylic resin. In addition to the acrylic resin, for example, glass is suitable. Specifically, inorganic glass, crystal glass, sapphire glass, acrylic glass, or the like can be used. The surface protection substrate 4 is configured to cover the electrophoretic layer 31 together with the element substrate 2 and the transparent sheet 30, and this configuration can more reliably prevent moisture from entering the electrophoretic layer 31.

  The connection substrate 5 has a base material 50 and terminals 51. The connection substrate 5 is a rectangular plate-like member disposed on the outer surface 20b of the base material 20 of the element substrate 2, and is provided at a position overlapping the surface protection substrate 4 in plan view. As shown in FIGS. 1 and 2, the connection substrate 5 is formed to have a size that protrudes to the outer peripheral side of the electrophoretic display panel 10 and partially extends to the outer peripheral side of the surface protection substrate 4. The terminal 51 is provided in a region partially protruding outside the electrophoretic display panel 10, and is electrically connected to the terminal 27 on the electrophoretic display panel 10 side via a wire 111. The connection substrate 5 also has a function as a support substrate that supports the electrophoretic display panel 10.

  The sealing portion 60 is a portion that seals the electrophoretic layer 31, and is disposed between the peripheral portions of the element substrate 2 and the surface protection substrate 4 of the electrophoretic display panel 10. It is formed so as to surround the direction. The sealing part 60 is composed of a first sealing material 61 made of a resin layer and a second sealing material 62 made of a metal plating layer, and double sealing is performed by such a sealing part 60. It is structured. The first sealing material 61 covers the entire side wall surface of the electrophoretic layer 31, and the second sealing material 62 covers the entire side wall surface of the first sealing material 61.

  The material of the first sealing material 61 is preferably a material having a smaller elastic modulus (thermal stress) than the epoxy resin, for example, ABS, polypropylene (PP), polyacetal (POM), polycarbonate (PC), polyamide (PA). 6 Nylon, polyester terephthalate (PET), polybutylene terephthalate (PBT), modified polyphenylene ether (MPPE), modified polyphenylene oxide (PPO), polysulfone (PSF), polyethersulfone (PES), polyetherimide (PEI), Examples include polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyarylate (liquid crystal polymer), polyimide (PI) and the like.

  Examples of the material of the second sealing material 62 include nickel, chromium, palladium, tin, and Au. The plating layer 62B constituting the second sealing material 62 is connected to the metal patterns 62A and 62A formed on the element substrate 2 and the surface protection substrate 4, and is grown using the metal patterns 62A and 62A as nuclei. Is. In the present embodiment, it is assumed that the metal patterns 62A and 62A are included in the plating layer of the present invention.

(Operation of electrophoretic display device)
Next, the operation of the electrophoretic display device 1 configured as described above will be briefly described.
When a voltage is applied between the pixel electrode 25 and the common electrode 35 so that the voltage of the common electrode 35 becomes relatively high, the positively charged black electrophoretic particles are out of the pixels in the microcapsule 32 by the Coulomb force. It is drawn toward the electrode 25 side. On the other hand, negatively charged white electrophoretic particles are attracted toward the common electrode 35 in the microcapsule 32 by Coulomb force. As a result, white electrophoretic particles are collected on the transparent sheet 30 side in the microcapsule 32, and the color (white) of the white electrophoretic particles is displayed in the display area 7 of the electrophoretic display device 1. The Rukoto.

  On the contrary, when a voltage is applied between the pixel electrode 25 and the common electrode 35 so that the potential of the pixel electrode 25 becomes relatively high, the negatively charged white electrophoretic particles are moved to the pixel electrode 25 side by Coulomb force. Be drawn to. On the other hand, the positively charged black electrophoretic particles are attracted toward the common electrode 35 by the Coulomb force. As a result, the black electrophoretic particles gather on the transparent sheet 30 side in the microcapsule 32, and the color (black) of the black electrophoretic particles is displayed in the display area 7 of the electrophoretic display device 1. It will be.

  According to the electrophoretic display device 1 of the present embodiment, the first sealing material 61 made of a resin material and the metal plating formed so as to cover the entire side wall surface in the circumferential direction of the first sealing material 61. The electrophoretic display device having excellent moisture proof performance by preventing the element substrate 2 and the surface protective substrate 4 from cracking by having the second sealing material 62 made of layers. 1 can be used.

  That is, since the first sealing material 61 of the present embodiment is made of a resin material having a smaller elastic modulus (thermal stress) than the epoxy resin, the stress of the sealing portion can be efficiently dispersed, and as a result, the use In the environmental temperature change, environmental resistance test, impact test, etc. for the electrophoretic display device 1, it is possible to prevent local stress from being applied to the sealed portion due to thermal expansion or contraction of each of the laminated members. It becomes possible. Thereby, it can prevent effectively that a crack generate | occur | produces between board | substrates 2 and 4 and the outstanding moisture-proof property is obtained.

  Even if the moisture-proof performance of the resin itself is slightly lower than that of the epoxy resin, the second sealing material 62 made of a plating layer is provided outside the first sealing material 61 in the present embodiment. The moisture-proof performance for the migration layer 31 is sufficiently ensured. As described above, the double sealing structure of the first sealing material 61 and the second sealing material 62 ensures a high moisture-proof property for the electrophoretic layer 31.

  Furthermore, since the sealing performance of the second sealing material 62 is high, the width of the first sealing material 61 made of a resin material can be reduced. Thereby, since a sealing structure can be taken, without enlarging sealing width conventionally, it can prevent that an apparatus enlarges, and size reduction can be implement | achieved.

(Production method)
Next, a manufacturing method of the electrophoretic display device 1 having the above configuration will be described.
When the electrophoretic display device 1 is manufactured, a plurality of electrophoretic display panel assemblies are first formed using a large substrate, and the plurality of electrophoretic display devices 1 are separated into pieces by cutting the aggregate. A so-called multi-chamfering technique is used.

  FIG. 3 is a flowchart showing the manufacturing process of the electrophoretic display device, and FIGS. 4 and 5 are schematic cross-sectional views showing the manufacturing process of the electrophoretic display device. 4 and 5, attention is paid to a specific panel region P, but the same process is simultaneously performed in other panel regions P.

  When forming the aggregate of the electrophoretic display device 1, the electrophoretic sheet 3 is attached to each panel region P of the mother glass substrate 110 that is an aggregate of the element substrates 2. Each panel region P having the electrophoretic sheet 3 becomes the electrophoretic display device 1.

The manufacturing method of the electrophoretic display device of this embodiment will be described in detail below.
As shown in FIG. 4, the manufacturing method of the electrophoretic display device of the present embodiment includes a drive layer forming step S1, a connecting substrate bonding step S2, an electrophoretic sheet attaching step S3, a surface protective substrate bonding step S4, Sealing part formation process S5. Note that the manufacturing process order shown here is an example, and the order may be changed as appropriate.

In the driving layer forming step S1, as shown in FIG. 4A, first, a plurality of panel regions P are set on the surface 110a of the mother glass substrate 110, and switching elements are arranged in the display region 7 of each panel region P. 26 and the like, and the drive circuit elements and terminals 27, wirings connected to these, and the like are formed in the non-display area 8, and a metal pattern 62A serving as a catalyst core for plating in a plating process described later is formed. In this way, the nucleation process is performed on each substrate surface. In addition, it is preferable to perform the activation process of each metal pattern 62A as needed.
Thereafter, an insulating layer 24, a pixel electrode 25, a switching element 26, and the like are further formed to obtain the drive layer 21.

  On the other hand, in the mother surface protection substrate 140, a plurality of panel regions P are set on the surface 140a, and the non-display region 8 of each panel region P is located at a position facing the above-described metal pattern 62A on the mother glass substrate 110 side. Then, the metal pattern 62A having the same pattern shape is formed.

  Next, in the connection substrate bonding step S2, as shown in FIG. 4B, the mother connection substrate 120 is attached to the back surface 110b of the mother glass substrate 110 via an unillustrated adhesive tape or the like. The terminals 51 of the mother connection substrate 120 are aligned and pasted so that the terminals 51 are exposed to the outside of the mother glass substrate 110. After the mother connection substrate 120 is pasted, the wire 27 connects the terminal 27 of the mother glass substrate 110 and the terminal 51 of the mother connection substrate 120 at an appropriate time. In the present embodiment, wire connection is performed after the sealing portion 60 is formed in a later step (FIG. 5C).

  Next, in the electrophoresis sheet pasting step S3, as shown in FIG. 4B, the prepared electrophoresis sheets 3 are pasted on the display areas 7 in the panel areas P of the mother glass substrate 110, respectively. wear.

  Next, in the surface protective substrate bonding step S4, as shown in FIG. 4C, the mother surface protective substrate 140 is bonded onto the electrophoretic sheet 3 via the adhesive layer 33. At this time, alignment adjustment between the substrates 110 and 140 is performed by comparing and observing the metal pattern 62A formed on the mother glass substrate 110 and the metal pattern 62A formed on the mother surface protection substrate 140. In this way, the mother surface protection substrate 140 is bonded so that the metal patterns 62A and 62A formed on the substrates 110 and 140 face each other.

Next, in the sealing part forming step S <b> 5, the sealing part 60 that double seals the electrophoretic layer 31 with the first sealing material 61 and the second sealing material 62 is formed.
First, as shown in FIG. 5A, the first sealing material 61 is formed between the peripheral portions of the mother glass substrate 110 and the mother surface protection substrate 140. Here, it forms so that the circumference | surroundings of the electrophoretic layer 31 may be enclosed, and it forms inside these metal patterns 62A and 62A so that the surface of metal patterns 62A and 62A may be exposed.
Here, a resin material having a smaller elastic modulus than the above-described epoxy resin is dissolved, and the dissolved resin is spread by the capillary force between the mother glass substrate 110 and the mother surface protective substrate 140, and the resin is injected. .

  Next, the dissolved resin is dried and solidified. By solidifying the resin, the mother glass substrate 110 in contact with the resin and the mother surface protection substrate 140 are fixed in a bonded state.

Next, as shown in FIG. 5B, a second sealing material 62 is formed so as to surround the first sealing material 61. Here, after forming the metal patterns 62A and 62A in each panel region P, the structure is immersed in a plating solution to perform a plating process. Then, a plating layer 62B is formed between the metal patterns 62A and 62A by growing the plating film formed on the surfaces of the metal patterns 62A and 62A. Thus, the 2nd sealing material 62 which consists of a metal plating layer is formed in the outer side of the 1st sealing material 61, and the sealing part 60 is obtained.
In addition, it is desirable to prevent these from being plated by forming a mask on the terminals 27 and 51 in advance before performing the plating process.

  Next, the mother surface protection substrate 140, the mother glass substrate 110, the mother connection substrate 120, and the sealing portion 60 are cut by a cutting member such as a dicing blade (not shown). After these cuttings, individual electrophoretic display devices 1 as shown in FIG. 5C are obtained.

  According to the manufacturing method of the electrophoretic display device 1 of the present embodiment, by previously forming the metal patterns 62A and 62A serving as the catalyst for the plating process on the opposing surfaces of the opposing substrates 120 and 140, respectively. The plating layer 62B (second sealing material 62) can be formed favorably between the glass substrates. That is, since the second sealing material 62 having high adhesion to each substrate can be formed, it is possible to prevent moisture from entering from the interface between the second sealing material 62 and the substrate surface, High moisture proof performance can be obtained.

(Second Embodiment)
FIG. 6 is a cross-sectional view of the electrophoretic display device of the second embodiment.
The electrophoretic display device described above has a configuration in which all four sides of the electrophoretic display panel 10 are sealed by the sealing portion 60, but the electrophoretic display device of this embodiment has a plurality of terminals 27. , 51 is different in that the sealing part 60 is not formed on the side 10a. A resin sealing layer 63 made of an epoxy resin is formed only on the side 10a. In addition, the sealing width W1 of the resin sealing layer 63 in plan view is wider than the sealing width W2 of the sealing portion 60 on the other side 10b.

Thus, according to the structure of this embodiment, since a wire connection part can be covered with resin, the said part can be protected and it becomes possible to maintain a favorable connection. Since the resin sealing layer 63 made of an epoxy resin is formed only on one side (side 10a) of the electrophoretic display panel 10, occurrence of cracks in the element substrate 2, the connection substrate 5, and the surface protection substrate 4 depending on the use environment or the like. Can be effectively prevented.
Further, since the sealing width of the resin sealing layer 63 is widened, sufficient moisture resistance can be ensured similarly to the sealing portion 60.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

  For example, as shown in FIG. 7, it is desirable to improve the moisture resistance by forming the sealing portion 60 to the edge side of the element substrate 2 and the surface protection substrate 4.

  In the second embodiment, the resin sealing layer 63 is formed on the side where the terminals 27 and 51 are formed in the electrophoretic display panel 10, and the sealing part 60 including the plating layer is formed on the other three sides. However, a configuration in which the sealing portion 60 is formed only on at least one side of the electrophoretic display panel 10 and the resin sealing layer 63 is formed on the remaining side may be employed. Even with this configuration, it is possible to prevent the occurrence of cracks on the substrate as compared with the prior art.

  In the above embodiment, the electro-optical device including the electrophoretic display device 1 has been described as an example. However, the present invention can be applied to any electro-optical device including an electro-optical layer. For example, the present invention is also applied to an electro-optical device including a display device such as a TN (Twisted Nematic) liquid crystal display, an STN (Super TN) liquid crystal display, a ferroelectric liquid crystal display, a cholesteric liquid crystal display, a toner display, and a twist ball display. be able to.

  Furthermore, the electro-optical device of the present invention is not limited to the electrophoretic display device and the liquid crystal device described above, and can be applied to other electro-optical devices. Examples of other electro-optical devices include organic EL devices, inorganic EL devices, plasma display devices, field emission display devices, and LEDs.

[Electronics]
Next, the case where the electrophoretic display device 1 of the above embodiment is applied to an electronic device will be described.
FIG. 8 is a front view of the wrist watch 1000. The wrist watch 1000 includes a watch case 1002 and a pair of bands 1003 connected to the watch case 1002.
A display unit 1005 including the electrophoretic display device 1 of the above embodiment, a second hand 1021, a minute hand 1022, and an hour hand 1023 are provided on the front surface of the watch case 1002. On the side surface of the watch case 1002, a crown 1010 and an operation button 1011 are provided as operation elements. The crown 1010 is connected to a winding stem (not shown) provided inside the case, and is integrally provided with the winding stem so that it can be pushed and pulled in multiple stages (for example, two stages) and can be rotated. . The display unit 1005 can display a background image, a character string such as date and time, or a second hand, a minute hand, and an hour hand.

  FIG. 9 is a perspective view illustrating a configuration of the electronic paper 1100. An electronic paper 1100 includes the electrophoretic display device 1 of the above embodiment in a display area 1101. The electronic paper 1100 is flexible and includes a main body 1102 made of a rewritable sheet having the same texture and flexibility as conventional paper.

  FIG. 10 is a perspective view showing the configuration of the electronic notebook 1200. An electronic notebook 1200 is obtained by bundling a plurality of the electronic papers 1100 and sandwiching them between covers 1201. The cover 1201 includes display data input means (not shown) for inputting display data sent from an external device, for example. Thereby, according to the display data, the display content can be changed or updated while the electronic paper is bundled.

  According to the wristwatch 1000, the electronic paper 1100, and the electronic notebook 1200, the electrophoretic display device 1 that can increase the reliability of the electrophoretic display device without increasing the sealing width inside the device is mounted. Electronic devices 1000, 1100, and 1200 having excellent display characteristics can be obtained.

  In addition, said electronic device is an example of the electronic device which concerns on this invention, Comprising: The technical scope of this invention is not limited. For example, the electrophoretic display device according to the present invention can be suitably used for a display unit of an electronic device such as a mobile phone or a portable audio device.

DESCRIPTION OF SYMBOLS 1 ... Electrophoretic display device (electro-optical device), 2 ... Element substrate, 4 ... Surface protection substrate, 31 ... Electrophoretic layer (electro-optical layer), 10 ... Electrophoretic display panel (electro-optical panel), 61 ... 1st Sealing layer (resin layer), 62 ... second sealing layer (plating layer), 62A ... metal pattern, 1000 ... watch (electronic device), 1100 ... electronic paper (electronic device), 1200 ... electronic notebook (electronic device)

Claims (9)

An electro-optical device including an electro-optical panel in which an electro-optical layer is sandwiched between a pair of substrates,
A resin layer disposed between the pair of substrates so as to surround the electro-optic layer and sealing the electro-optic layer between the substrates;
An electro-optical device comprising: a plating layer formed so as to cover at least a part of the side wall surface of the resin layer.   The electro-optical device according to claim 1, wherein the plating layer is connected to a metal pattern formed on each of the pair of substrates. 3. The electro-optical device according to claim 1, wherein the plating layer is grown using the metal pattern as a nucleus. The electro-optical device according to claim 1, wherein the resin layer is made of a resin material having a smaller elastic modulus or thermal stress than an epoxy resin. The electro-optical device according to claim 1, wherein the entire side wall surface of the resin layer is covered with the plating layer.   The width of the resin layer in a plan view of a portion where the plating layer is formed is smaller than a width of the resin layer in a plan view of a portion where the plating layer is not formed. 6. The electro-optical device according to any one of items 5 to 5. Bonding a pair of substrates through an electro-optic layer;
Forming a resin layer between the pair of substrates so as to surround the electro-optic layer;
And a step of forming a plating layer so as to cover at least part of the side wall surface of the resin layer. Prior to the step of bonding a pair of substrates through the electro-optic layer,
Forming a metal pattern on each of the pair of substrates,
8. The method of manufacturing an electro-optical device according to claim 7, wherein the plating layer is grown from the metal pattern in the step of forming the plating layer. An electronic apparatus comprising the electro-optical device according to claim 1.

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