JP2011022302A - Electro-optical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device preventing damages such as generation of cracks and breakage caused by tensile stress on a substrate surface where light exits. <P>SOLUTION: An organic EL device 1 is provided which is equipped with: an organic EL panel 2 having an organic light emitting layer 26 held and sealed between an element substrate 20 and a sealing substrate 30, a display face 30a where light exits from the organic light emitting layer 26, and a back face 20a in the opposite side to the display face 30a; resin layers 51, 52 disposed to cover at least a side face and the back face 20a of the organic EL panel 2; an optical film 53 disposed opposing to the display face 30a via the resin layer 51 and having light-transmitting properties; a reinforcing layer 56 disposed opposing to the back face 20a via the resin layer 52; and further, a compressive stress layer 40 having light-transmitting property disposed on the display face 30a to cover the display face 30a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electro-optical device and an electronic apparatus.

  An organic electroluminescence device (hereinafter referred to as an organic EL device) is a thin and lightweight self-luminous device, and various electronic devices can be obtained by making such an organic EL device thinner and flexible. Application to is expected. Thus, as a method of making the electro-optical device thinner and flexible, a configuration of an electro-optical device in which a liquid crystal panel using a thin glass substrate is sandwiched between laminate films has been proposed. (For example, refer to Patent Document 1). Patent Document 1 describes that a similar structure can be applied to an organic EL device using an organic EL panel.

  However, in an electro-optical device using a thin glass substrate, when the glass substrate is processed thinly or when an external stress is applied to the electro-optical device, a fine crack may occur on the surface of the glass substrate. is there. Further, when a tensile stress or the like is applied from the outside, the cracks may expand to cause damage such as cracking or chipping of the glass substrate.

  In order to prevent such a thin glass substrate from being damaged, a compressive stress layer made of a material having a linear expansion coefficient of one digit or more larger than that of glass is formed on the surface of the element substrate where the driving element is not formed. A method of providing a (compressive stress applying layer) has been proposed (see, for example, Patent Document 2).

Japanese Patent No. 4131639 JP 2007-310417 A

  However, as in the method described in Patent Document 2, in a compressive stress layer formed of metal or the like, the light transmittance is significantly lower than that of a glass substrate. For this reason, there is a problem that it is difficult to provide such a compressive stress layer on the substrate on which light is emitted to prevent generation of cracks on the substrate surface due to external stress and damage such as cracks. Also, in a compressive stress layer made of a material such as metal that has a linear expansion coefficient larger than that of glass, substrate warpage may occur due to expansion and contraction due to temperature changes of the liquid crystal panel, or the compressive stress layer itself may be destroyed by cracking or peeling. There was a problem that it was easy.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electro-optical device according to this application example includes an electro-optical layer sandwiched between a pair of glass substrates, a first surface on the side where light is emitted from the electro-optical layer, and the first surface. An electro-optical panel having a second surface opposite to the first surface, a resin layer provided to cover at least the side surface of the electro-optical panel and the second surface, and the first surface A first surface layer having optical transparency disposed opposite to the second surface layer, and a second surface layer disposed opposite to the second surface via the resin layer, the first surface layer being disposed on the first surface. Is characterized in that a compressive stress layer having optical transparency is provided so as to cover the first surface.

  According to this configuration, the compressive stress layer is provided so as to cover the first surface on the light emission side of the electro-optical panel. For this reason, even if a tensile stress is applied to the surface of the glass substrate on the light emission side of the pair of glass substrates, the compression stress layer relieves them. Thereby, it is possible to suppress the occurrence of cracks on the surface of the glass substrate or damage such as cracking of the glass substrate due to external stress such as bending or weighting.

  Further, by laminating the first surface layer and the second surface layer through the resin layer, the periphery of the electro-optical panel is integrated and reinforced. As a result, even if the total thickness of each of the pair of glass substrates is made thinner, it is possible to provide an electro-optical device having bending resistance that does not break the electro-optical panel even if it is bent while being flexible.

  Application Example 2 In the electro-optical device according to the application example, the compressive stress layer may be made of an oxide of an inorganic material.

  According to this configuration, since the compressive stress layer is formed of an oxide of an inorganic material, it has higher light transmittance than a case where it is formed of a metal. Accordingly, for example, when the electro-optical device includes a touch panel, a compressive stress layer can be provided on the surface of the glass substrate on the light emission side of the electro-optical panel that is easily damaged by the contact.

  Application Example 3 In the electro-optical device according to the application example, the inorganic material may be at least one of aluminum, silicon, zinc, magnesium, titanium, zirconium, and tantalum.

  According to this configuration, since the compressive stress layer is composed of oxides of these inorganic materials, it is possible to form a compressive stress layer having light transmittance close to that of glass. Moreover, in the compressive stress layer comprised of oxides of these inorganic materials, a linear expansion coefficient close to that of glass can be obtained, so that the warpage of the glass substrate due to the stress of the compressive stress layer itself can be suppressed.

  Application Example 4 In the electro-optical device according to the application example described above, the resin layer includes the compression stress layer and the compression stress layer so as to cover a surface of the compression stress layer on the side where the first surface layer is disposed. It may be provided between the first surface layer.

  According to this configuration, since the resin layer is provided between the compressive stress layer and the first surface layer, the external stress applied to the first surface layer is transmitted to the compressive stress layer (glass substrate). In the meantime, it is relaxed by the resin layer. For this reason, damage to the glass substrate due to external stress can be more effectively suppressed. Moreover, since the difference in the linear expansion coefficient between the first surface layer and the compressive stress layer (glass substrate) is relaxed by the resin layer, the warp of the glass substrate can be suppressed.

  Application Example 5 In the electro-optical device according to the application example described above, the second surface layer may have a size that at least planarly covers the end of the electro-optical panel.

  According to this structure, the 2nd surface layer provided in the glass substrate side in which the compressive-stress layer is not provided has a magnitude | size which covers at least planarly to the edge part of an electro-optical panel. For this reason, the damage of the glass substrate in which the compressive stress layer is not provided with respect to external stresses, such as bending and a load, is suppressed. Moreover, the edge part of a glass substrate can be protected from external stresses, such as bending and a load.

  Application Example 6 In the electro-optical device according to the application example described above, the electro-optical device further includes a third surface layer disposed on the first surface side of the electro-optical panel, and the third surface layer includes: The size of the electro-optical panel may be at least planarly covered, and may have an opening that overlaps the area of the electro-optical panel where the light is emitted.

  According to this configuration, the third surface layer having a size that at least planarly covers the end of the electro-optical panel is further disposed on the glass substrate side on which the compressive stress layer is provided. For this reason, it is possible to protect the end portion of the glass substrate that is particularly susceptible to cracking and the like from external stresses such as bending and weighting. In addition, since the third surface layer has an opening that overlaps the area where the light of the electro-optic panel is emitted, the light from the electro-optic panel is not blocked by the third surface layer. Is injected into.

  Application Example 7 In the electro-optical device according to the application example, the first surface layer is disposed between the compressive stress layer and the third surface layer, and the resin layer is The third surface layer may be disposed so as to cover a side surface of the first surface layer and to be in contact with the resin layer and to overlap the peripheral portion of the first surface layer in a plane. .

  According to this configuration, the periphery of the electro-optical panel is integrated by the first surface layer, the second surface layer, and the third surface layer via the resin layer, so that the electro-optical device is more strongly reinforced. it can. In addition, since the third surface layer is disposed so as to overlap the peripheral portion of the first surface layer in a planar manner, the adhesion between the first surface layer and the resin layer can be more reliably prevented from external stress. Can hold.

  Application Example 8 In the electro-optical device according to the application example described above, a touch panel may be provided on the first surface layer side of the compressive stress layer.

  According to this configuration, it is possible to provide a thin, flexible electro-optical device with a touch panel. Since the touch panel is provided, a point load accompanying the operation of pressing the touch panel is applied to the first surface of the electro-optic panel from the first surface layer side, but the tensile stress due to the point load is relieved by the compressive stress layer. . Thereby, in an electro-optical device with a touch panel, damage to the glass substrate can be suppressed.

  Application Example 9 In the electro-optical device according to the application example described above, the touch panel may be a resistive film type touch panel.

  According to this configuration, an electro-optical device with a resistive film type touch panel can be provided.

  Application Example 10 In the electro-optical device according to the application example described above, the touch panel may be an acoustic pulse recognition type touch panel.

  According to this configuration, an electro-optical device with an acoustic pulse recognition type touch panel can be provided.

  Application Example 11 In the electro-optical device according to the application example described above, the first surface layer includes a surface treatment layer, and the surface treatment layer is a side on which the light of the first surface layer is emitted. May be arranged.

  According to this configuration, the first surface layer includes the surface treatment layer disposed on the light emission side. For this reason, the surface treatment layer can provide wear resistance, a function of suppressing reflection of external light, reflection, and the like.

  Application Example 12 In the electro-optical device according to the application example described above, the thickness of each of the pair of glass substrates may be 100 μm or less.

  According to this configuration, the thickness of each of the pair of glass substrates is 100 μm or less. Accordingly, the flexibility of the electro-optical device can be improved, and the electro-optical device can be made thinner and lighter.

  Application Example 13 In the electro-optical device according to the application example described above, the resin layer may be made of a material mainly composed of polyethylene or a polyethylene copolymer.

  According to this configuration, polyethylene has a low water absorption rate, has good insulating properties, flexibility, and transparency, and is a copolymer, so that the adhesiveness is improved, so that it is suitable as a material for the resin layer.

  Application Example 14 An electronic apparatus according to this application example includes the electro-optical device described above.

  According to this configuration, since it is possible to suppress damage such as cracks or cracks on the surface of the glass substrate due to external stress, it is possible to provide an electronic apparatus having an electro-optical device that is thin and has both flexibility and bending resistance. .

1 is a perspective view showing a schematic configuration of an organic EL device according to a first embodiment. 1 is a plan view showing a schematic configuration of an organic EL device according to a first embodiment. 1 is a cross-sectional view showing a schematic configuration of an organic EL device according to a first embodiment. 1 is a block diagram showing an electrical configuration of an organic EL panel according to a first embodiment. Sectional drawing which shows schematic structure of the organic electroluminescent panel which concerns on 1st Embodiment. The figure explaining generation | occurrence | production of the crack by tensile stress. The figure explaining relaxation of the stress by a compression stress layer. Sectional drawing which shows schematic structure of the organic EL apparatus which concerns on 2nd Embodiment. Sectional drawing which shows schematic structure of the organic EL apparatus which concerns on 3rd Embodiment. Sectional drawing which shows schematic structure of the organic EL apparatus which concerns on 4th Embodiment. FIG. 14 illustrates an example of an electronic device.

  The present embodiment will be described below with reference to the drawings. In each of the drawings to be referred to, in order to show the configuration in an easy-to-understand manner, the layer thickness, dimensional ratio, angle, and the like of each component are appropriately changed. In each drawing to be referred to, some elements, wiring, connection portions, and the like are omitted.

(First embodiment)
<Outline of organic EL device>
First, an outline of an organic EL device as an electro-optical device according to the first embodiment will be described with reference to the drawings. FIG. 1 is a perspective view illustrating a schematic configuration of the organic EL device according to the first embodiment. FIG. 2 is a plan view showing a schematic configuration of the organic EL device according to the first embodiment. FIG. 3 is a cross-sectional view illustrating a schematic configuration of the organic EL device according to the first embodiment. Specifically, FIG. 3 is a cross-sectional view taken along the line AA ′ in FIG.

  As shown in FIG. 1, an organic EL device 1 as an electro-optical device according to the first embodiment includes an organic EL panel 2 as an electro-optical panel, resin layers 51 and 52, and a first surface layer. An optical film 53, a reinforcing layer 56 as a second surface layer, and flexible printed circuit boards 46a, 46b, and 46c are provided. Hereinafter, the flexible printed circuit boards 46a, 46b, and 46c are referred to as FPCs 46a, 46b, and 46c. In addition, the FPCs 46a, 46b, and 46c are collectively referred to as an FPC 46.

  The organic EL panel 2 is located between the optical film 53 and the reinforcing layer 56. The optical film 53 and the reinforcing layer 56 are disposed to face each other, and are in close contact with each other by the resin layer 51 and the resin layer 52 interposed therebetween. The optical film 53 is located on the side from which light is emitted from the organic EL panel 2. A region where light from the organic EL panel 2 is emitted is referred to as a display region 2a. The organic EL device 1 performs display in the display area 2a.

  As shown in FIG. 2, the organic EL device 1 has a rectangular planar shape. The outer shape of the resin layer 51, the resin layer 52, the optical film 53, and the reinforcing layer 56 is one size larger than the outer shape of the organic EL panel 2 in plan view, and is large enough to cover at least the end of the organic EL panel 2 in plan view. That's it.

  The FPCs 46a, 46b, 46c are arranged side by side on the organic EL panel 2, and the FPC 46a is located between the FPCs 46b, 46c. Each of the FPCs 46 a, 46 b, 46 c has a protruding portion that protrudes outside the organic EL device 1. A plurality of terminals (not shown) for connecting to external devices are formed at the ends of these overhanging portions. A driving IC (Integrated Circuit) 47 is mounted on the FPC 46a.

  As shown in FIG. 3, the organic EL panel 2 includes an element substrate 20 and a sealing substrate 30 as a pair of glass substrates. An organic light emitting layer 26 (see FIG. 5) as an electro-optical layer is sandwiched between the element substrate 20 and the sealing substrate 30. In the display area 2 a of the organic EL panel 2, light is emitted from the organic light emitting layer 26 to the sealing substrate 30 side. A surface of the sealing substrate 30 on which light from the organic light emitting layer 26 is emitted, that is, a surface facing the optical film 53 is referred to as a display surface 30a as a first surface.

  The element substrate 20 is disposed to face the sealing substrate 30. The surface opposite to the sealing substrate 30 (display surface 30a) of the element substrate 20 is referred to as a back surface 20a as a second surface. The element substrate 20 protrudes from the sealing substrate 30 on one side. The organic EL panel 2 is a so-called thin organic EL panel using a thin glass substrate as a base material for the element substrate 20 and the sealing substrate 30. Details of the structure of the organic EL panel 2 will be described later.

  The compressive stress layer 40 is provided on the sealing substrate 30 so as to cover the display surface 30a. The compressive stress layer 40 relaxes the tensile stress generated on the display surface 30a of the sealing substrate 30 due to external stress such as bending or weight applied to the organic EL device 1, and cracks are generated on the display surface 30a of the sealing substrate 30. And a function of suppressing the sealing substrate 30 from being damaged such as cracking.

  Since the compressive stress layer 40 is provided on the display surface 30a of the sealing substrate 30 on the side from which light is emitted from the organic EL element 8 in the organic EL panel 2, the compressive stress layer 40 is formed of a material having light permeability close to that of glass. Is desirable. The compressive stress layer 40 is preferably formed of a material that can obtain a predetermined compressive stress and has a linear expansion coefficient close to that of glass.

  The material of the compressive stress layer 40 is preferably an oxide of an inorganic material. For example, at least one of oxides of aluminum, silicon, zinc, magnesium, titanium, zirconium, and tantalum can be suitably used. By using these materials, light transmittance close to that of glass can be obtained. In order to increase the film density of the compressive stress layer 40, an oxynitride of the above material may be used as the material of the compressive stress layer 40. Further, although the light transmittance is slightly lowered, nitrides of the above materials can be used.

  These materials have a linear expansion coefficient of about 0 ppm / ° C. to 5 ppm / ° C., which is close to glass having a linear expansion coefficient of about 4 ppm / ° C. For this reason, since the difference of the dimensional change amount accompanying a temperature change between the sealing substrate 30 and the compressive stress layer 40 is small, the warping of the sealing substrate 30 is suppressed, and the compressive stress applied by the compressive stress layer 40 is suppressed. The change is small.

  The compressive stress value of the compressive stress layer 40 may be 100 MPa or more. However, in order to prevent cracking of the compressive stress layer 40 and peeling from the sealing substrate 30, it is preferably 2 GPa or less. Moreover, in order to suppress the curvature of the sealing substrate 30 due to the compressive stress of the compressive stress layer 40 itself, the compressive stress value is preferably 500 MPa or less.

The compressive stress value increases as the film density of the compressive stress layer 40 increases. The film density of the compressive stress layer 40 is preferably 1.5 g / cm ³ or more. Moreover, the layer thickness of the compressive stress layer 40 should just be 50 nm or more. However, in order to prevent cracking of the compressive stress layer 40 and peeling from the sealing substrate 30, the thickness is preferably 500 nm or less. Further, since the light transmittance decreases as the thickness of the compressive stress layer 40 increases, it is preferable that the thickness of the compressive stress layer 40 is optically thinner.

  The resin layer 51 is disposed on the display surface 30 a side of the organic EL panel 2 and covers the side surfaces of the sealing substrate 30 and the compressive stress layer 40 and the surface of the compressive stress layer 40. The resin layer 52 is disposed on the back surface 20 a side of the organic EL panel 2 and covers the side surface and the surface of the element substrate 20. That is, the resin layers 51 and 52 are provided so as to cover and seal the surfaces of the organic EL panel 2 and the compressive stress layer 40.

The resin layers 51 and 52 have a function of protecting the organic EL panel 2 by adhering to and holding the organic EL panel 2 and the compressive stress layer 40, the FPC 46, the optical film 53, and the reinforcing layer 56 together. ing. Accordingly, the resin layers 51 and 52 are required to have good adhesiveness with these constituent members and flexibility that can alleviate differences in external stress and thermal deformation between the constituent members. For flexibility, for example, a density of 0.9g / cm ³ ~1.1g / cm ³ or so, it is desirable that the Young's modulus of about 0.01GPa～1GPa.

  Further, the resin layers 51 and 52 have water resistance for preventing moisture from entering the organic EL element 8 from the outside, insulation and heat resistance for fixing the FPC 46, and the organic EL element 8 is heated to a high temperature during bonding. Low temperature weldability is also required to prevent exposure. Furthermore, when the resin layers 51 and 52 cover the display surface 30a of the organic EL panel 2, good light transmittance is also required.

  As a material for such resin layers 51 and 52, a resin mainly composed of polyethylene can be preferably used. Moreover, in order to improve adhesiveness more, it is more preferable that it is a copolymer partly having a polar group.

  More specifically, ethylene-vinyl acetate copolymer (EVA) or ethylene-methyl methacrylate copolymer (EMMA), ethylene-hydroxyalkyl methacrylate copolymer, ethylene-alkoxyethyl methacrylate copolymer, ethylene -Aminoethyl methacrylate copolymer, ethylene-hydroxyglycidyl methacrylate copolymer, ethylene-vinyl alcohol copolymer (EVOH), ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMAA) ) Or ethylene-alkyl acrylate copolymer is preferably used. A copolymer obtained by combining two or more of these (for example, ethylene-vinyl acetate-vinyl alcohol copolymer) or a mixture thereof may be used.

  Moreover, in order to improve heat resistance, you may contain hardening components, such as amine compounds, such as an epoxy compound, an isocyanate compound, and a polyethyleneimine, as a crosslinking agent. In addition, when using the material which has the carboxyl group which is not esterified, such as ethylene-acrylic acid copolymer (EAA) and ethylene-methacrylic acid copolymer (EMAA), among ethylene copolymers, low temperature weldability In addition, although it has excellent adhesion, it may corrode the copper wiring of the FPC 46, etc., it is preferable to crosslink with heat in combination with a crosslinking component such as an epoxy curing agent so that acrylic acid does not remain.

  The thickness of each of the resin layers 51 and 52 is preferably 20 μm to 100 μm. If the thickness of the resin layers 51 and 52 is less than 20 μm, the coverage and fillability of the step including the gap at the end of the organic EL panel 2 and the step between the organic EL panel 2 and the FPC 46 are lowered. If the thickness of the resin layers 51 and 52 is greater than 100 μm, the total thickness of the organic EL device 1 is increased. Furthermore, in consideration of the material cost of the resin layers 51 and 52 and the ease of laminating (workability), it is more preferably in the range of 20 μm to 50 μm.

  Since the resin layer 51 is provided between the compressive stress layer 40 (sealing substrate 30) and the optical film 53, external stress applied to the optical film 53 is transmitted to the compressive stress layer 40 (sealing substrate 30). In the meantime, it is relaxed by the resin layer 51. Similarly, since the resin layer 52 is provided between the element substrate 20 and the reinforcing layer 56, the external stress applied to the reinforcing layer 56 is relaxed by the resin layer 52 while being transmitted to the element substrate 20. .

  For this reason, damage to the organic EL panel 2 (the sealing substrate 30 and the element substrate 20) due to external stress can be more effectively suppressed. Further, since the difference in the linear expansion coefficient between the optical film 53 and the compressive stress layer 40 (sealing substrate 30) and between the reinforcing layer 56 and the element substrate 20 is alleviated by the resin layers 51 and 52, organic Warpage of the EL panel 2 (the sealing substrate 30 and the element substrate 20) can be suppressed.

  Further, the resin layers 51 and 52 are arranged so as to sandwich the FPC 46 therebetween. The resin layers 51 and 52 are in close contact with the organic EL panel 2, the FPC 46, the optical film 53, and the reinforcing layer 56, and hold them together, and from the outside of the organic EL device 1, the organic EL panel 2 (organic EL It has a function of preventing moisture from entering the element 8).

  The optical film 53 is disposed to face the display surface 30a of the organic EL panel 2 with the resin layer 51 interposed therebetween. The optical film 53 has a size that covers the end of the organic EL panel 2 in a planar manner. The optical film 53 has a function as a reinforcing member that prevents the organic EL panel 2 from being damaged and a function as a surface film that protects the surface of the resin layer 51. The optical film 53 is required to have good light transmittance as a surface film. The optical film 53 includes a base material 54 serving as a base of the optical film 53 and a surface treatment layer 55.

  The base material 54 functions as a reinforcing member in the optical film 53. The reinforcing member preferably has a Young's modulus of about 1 GPa to 10 GPa. When the Young's modulus is higher than 10 GPa, it becomes difficult to bend and the flexibility is lowered. As the material of the base material 54, any of resin materials such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), TAC (triacetyl cellulose), and COP (cyclic olefin polymer) can be used. These resin materials have good light transmittance.

  These resin materials have a linear expansion coefficient of about 20 ppm / ° C. to 60 ppm / ° C., and the amount of dimensional change accompanying temperature change is larger than that of glass. Therefore, the thickness of the base material 54 is preferably set to about 12 μm to 50 μm so that the warp of the organic EL panel 2 (sealing substrate 30) due to the difference in the dimensional change accompanying the temperature change can be suppressed.

  The optical film 53 preferably has functions such as wear resistance, suppression of external light reflection, and prevention of dirt adhesion (fingerprints and dust adhesion) as a surface film, and the surface treatment layer 55 has these functions. Bear. The surface treatment layer 55 is a hard coat layer such as PMMA (Polymethyl Methacrylate). The surface treatment layer 55 is formed to a thickness of about several μm.

  The surface treatment layer 55 includes an antireflection layer (AR) in which inorganic oxides having different refractive indexes are laminated to suppress external light reflection, a low antireflection layer (LR) made of a low refractive index fluororesin, and a surface. It may be an antiglare layer provided with unevenness, an antistatic layer that prevents adhesion of dust or the like, an oil repellent layer that suppresses adhesion of sebum, or the like.

  The reinforcing layer 56 is disposed to face the back surface 20a of the organic EL device 1 with the resin layer 52 interposed therebetween. The reinforcing layer 56 has a size that covers the end of the organic EL panel 2 in a planar manner. The reinforcing layer 56 has a function as a reinforcing member for preventing the organic EL panel 2 from being damaged when an external stress such as bending or dropping is applied to the organic EL device 1. The reinforcing layer 56 also has a function of restoring the original shape like a spring when the organic EL device 1 is bent by an external stress.

  The reinforcing layer 56 functions to reinforce the end portions of the element substrate 20 and the sealing substrate 30 that are prone to cracking due to external stress, and to prevent the organic EL panel 2 from warping due to the multilayer structure of components having different linear expansion coefficients. Have. Further, the reinforcing layer 56 is generated from the toughness (tensile resistance) for suppressing the element substrate 20 and the sealing substrate 30 from bending to the fracture limit point (limit radius), and the organic EL panel 2. The heat dissipation etc. for radiating the heat which is needed are also calculated | required.

As a material of such a reinforcing layer 56, a material having a high Young's modulus (10 GPa or more), a low linear expansion coefficient (10 ppm / ° C. or less), and a high thermal conductivity (10 W / m · k or more). Is preferred. In this embodiment, CFRP (Carbon Fiber Reinforced Plastics) having both excellent tensile strength and heat dissipation is used as the material of the reinforcing layer 56. Since CFRP is composed of a binder resin and carbon fiber, it has a low density (1.5 g / cm ^{3 to} 2.0 g / cm ³ ), a high tensile strength (1000 MPa or more), and a lightweight layer. Suitable as 56 materials.

  Although not shown, CFRP is a composite material made of carbon fiber and resin. Carbon fiber aligned in one direction is impregnated with thermosetting resin such as epoxy resin or phenol resin, or thermoplastic such as polyester. It is a composite material in which two or more precursors (carbon fiber layers) called prepregs are laminated and cured in different directions. In the present embodiment, when the extending direction of one layer of carbon fiber is about 0 °, the extending direction of the carbon fiber is about 0 °, about 90 °, about 0 °, and about 90 °. A configuration in which four layers are laminated is adopted. Note that the number of layers and the order of stacking are not limited to this form.

  Moreover, since the carbon fiber of CFRP is high-purity carbon, the thermal conductivity is 20 W / m · k to 60 W / m · k, and glass (1 W / m · k) or general-purpose plastic (about 0.5 W / m)・ Higher than k). Therefore, when CFRP is used as the material of the reinforcing layer 56, sufficient heat dissipation can be obtained.

  In addition, as a material for the reinforcing layer 56, invar having a physical property close to CFRP (an iron alloy having a Ni content of 30% to 50%), titanium, a titanium alloy, or the like may be used. If invar is used, the reinforcing layer 56 can be made thinner.

  Even when an external stress is applied to the organic EL device 1 by arranging the optical film 53 and the reinforcing layer 56 so as to cover the end of the organic EL panel 2 in a plane, the organic EL panel 2 ( Damage to the end portions of the element substrate 20 and the sealing substrate 30) is suppressed.

  The FPC 46 (only the FPC 46 a is shown in FIG. 3) is disposed between the resin layers 51 and 52. The FPC 46 is, for example, a flexible substrate in which a copper foil wiring is formed on a polyimide film base material. The portion of the FPC 46 opposite to the protruding portion that protrudes from the organic EL device 1 is an electrode (not shown) formed on the portion where one side of the element substrate 20 protrudes from the sealing substrate 30 with an anisotropic conductive adhesive film or the like. ) Is electrically connected.

  Here, the mechanical strength is insufficient only by the connection with the anisotropic conductive adhesive film, but the FPC 46 is held between the optical film 53 and the reinforcing layer 56 via the resin layers 51 and 52, so that flexibility and Strength is ensured. Thereby, it is not necessary to fix and reinforce the connecting portion of the FPC with a silicon resin (adhesive) or the like as in the past. In the present embodiment, the driving IC 47 is disposed in the overhanging portion of the FPC 46 a, but the driving IC 47 may be disposed in the organic EL device 1.

  With such a configuration, the organic EL device 1 has both flexibility that can be bent and practical strength that the organic EL panel 2 does not break even when bent. Further, the compressive stress layer 40 provided on the display surface 30a of the sealing substrate 30 of the organic EL panel 2 is relaxed by the compressive stress layer 40 even if a tensile stress is applied to the display surface 30a. Damage is suppressed.

<Configuration of organic EL panel>
Next, the configuration of the organic EL panel 2 according to the first embodiment will be described with reference to the drawings. FIG. 4 is a block diagram showing an electrical configuration of the organic EL panel according to the first embodiment. FIG. 5 is a cross-sectional view illustrating a schematic configuration of the organic EL panel according to the first embodiment. FIG. 5 corresponds to a cross section taken along the line AA ′ of FIG.

  As shown in FIG. 4, the organic EL panel 2 is an active matrix type organic EL panel using a thin film transistor (hereinafter referred to as TFT) as a switching element. The organic EL panel 2 includes an element substrate 20, a scanning line 16 provided on the element substrate 20, a signal line 17 extending in a direction intersecting the scanning line 16, and a power supply line 18 extending in parallel with the signal line 17. And.

  In the organic EL panel 2, the pixels 6 are arranged in a region surrounded by the scanning lines 16 and the signal lines 17. The pixels 6 are arranged in a matrix along the extending direction of the scanning lines 16 and the extending direction of the signal lines 17. The pixel 6 has, for example, a substantially rectangular planar shape. The pixel 6 is the minimum display unit of the organic EL panel 2.

  The pixel 6 includes a switching TFT 11, a driving TFT 12, a storage capacitor 13, an anode 25, a cathode 27, and an organic light emitting layer 26 as an electro-optical layer. The organic light emitting layer 26 includes a light emitting layer that emits light when excited by recombination of holes and electrons injected by an electric field. The organic light emitting layer 26 may have a multilayer structure including layers other than the light emitting layer. For example, the organic light emitting layer 26 may include a hole transport layer, a light emitting layer, and an electron transport layer. Further, a hole injection layer or an electron injection layer may be further included. The anode 25, the cathode 27, and the organic light emitting layer 26 constitute an organic electroluminescence element (organic EL element) 8.

  Connected to the signal line 17 is a data line driving circuit 14 including a shift register, a level shifter, a video line, and an analog switch. Further, a scanning line driving circuit 15 having a shift register and a level shifter is connected to the scanning line 16.

  In the organic EL panel 2, when the scanning line 16 is driven and the switching TFT 11 is turned on, the image signal supplied via the signal line 17 is held in the holding capacitor 13 and driven according to the state of the holding capacitor 13. The on / off state of the TFT 12 is determined. When electrically connected to the power supply line 18 via the driving TFT 12, a drive current flows from the power supply line 18 to the anode 25, and further a current flows to the cathode 27 through the organic light emitting layer 26. The light emitting layer of the organic light emitting layer 26 emits light with a luminance corresponding to the amount of current flowing between the anode 25 and the cathode 27.

  As shown in FIG. 5, the organic EL panel 2 includes a circuit element layer 21, a planarization layer 22, a partition wall 23, a reflection layer 24, an anode 25, an organic light emitting layer 26, on an element substrate 20. A cathode 27, an electrode protective layer 28, an organic buffer layer 31, a gas barrier layer 29, a sealing substrate 30, a sealing resin layer 32, a sealing material 33, a color filter 34, and a light shielding layer 35. I have. The organic EL panel 2 is a top emission type in which light emitted from the organic light emitting layer 26 is emitted to the display surface 30a side.

  The element substrate 20 is made of inorganic glass. In the present embodiment, alkali-free glass is used as the material for the element substrate 20. The thickness of the element substrate 20 is about 5 μm to 50 μm, and preferably 5 μm to 20 μm. In the present embodiment, the element substrate 20 uses a glass substrate having a thickness of about 0.3 mm to 0.7 mm as a material, and is bonded to the sealing substrate 30 and then is etched, mechanically polished, chemically polished, or the like. Processed to a thickness of.

  In addition, since the organic EL panel 2 is a top emission type, as the material of the element substrate 20, either a light transmissive material or a non-light transmissive material may be used.

  The circuit element layer 21 is provided on the element substrate 20. The circuit element layer 21 includes a driving TFT 12 and a wiring portion. The driving TFT 12 is provided corresponding to the pixel 6. The planarization layer 22 is provided on the circuit element layer 21 and alleviates unevenness of the surface due to the driving TFT 12 and the wiring portion. The planarizing layer 22 includes a reflective layer 24 so as to overlap the anode 25 in a planar manner. The reflective layer 24 is made of a metal material having light reflectivity, and is made of, for example, an aluminum alloy.

  An anode 25 is provided on the planarizing layer 22. The anode 25 is made of a metal oxide conductive film having optical transparency such as ITO (Indium Tin Oxide). The material of the anode 25 may be IZO (Indium Zinc Oxide) (registered trademark). The anode 25 is electrically connected to the drain terminal of the driving TFT 12 of the circuit element layer 21 for each pixel 6.

  In addition, since the organic EL panel 2 is a top emission type, the material of the anode 25 may not necessarily have light transmittance. Further, when a material that does not transmit light is used as the material of the anode 25, the reflective layer 24 may not be provided.

  The partition wall 23 is provided on the planarization layer 22 and partitions the region of the pixel 6. The partition wall 23 is made of acrylic resin or the like.

  The organic light emitting layer 26 is formed so as to cover the anode 25 and the partition wall 23. In the present embodiment, the organic light emitting layer 26 includes a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer that are sequentially stacked (shown as one layer in FIG. 5). The hole injection layer is formed of, for example, a triarylamine (ATP) multimer, and the hole transport layer is formed of, for example, a triphenylamine derivative (TPD).

The emission color of the light emitting layer is white. As the white luminescent material, a styrylamine-based luminescent material, anthracene-based dopamine (blue), a styrylamine-based luminescent material, or rubrene-based dopamine (yellow) is used. The electron transport layer is formed of, for example, an aluminum quinolinol complex (Alq ³ ). Each layer of the organic light emitting layer 26 is sequentially formed using, for example, a vacuum deposition method.

  The cathode 27 is provided on the organic light emitting layer 26. The cathode 27 has optical transparency, and is formed of, for example, an alloy of magnesium and silver (Mg—Ag alloy). An electron injection buffer layer made of lithium fluoride (LiF) or the like may be provided under the cathode 27.

  The electrode protective layer 28 is provided so as to cover the cathode 27 and the partition wall 23. The electrode protective layer 28 is made of, for example, a silicon compound such as silicon oxide or silicon oxynitride in consideration of light transmittance, adhesion, water resistance, gas barrier properties, and the like. Further, the thickness of the electrode protective layer 28 is preferably 100 nm or more, and the upper limit of the thickness is preferably 400 nm or less in order to prevent the generation of cracks due to the stress generated by covering the partition wall 23. The electrode protective layer 28 is formed using PVD (physical vapor deposition), CVD (chemical vapor deposition), ion plating, or the like.

  An organic buffer layer 31 and a gas barrier layer 29 are stacked on the electrode protective layer 28. The organic buffer layer 31 is made of a thermosetting epoxy resin or the like. The organic buffer layer 31 relaxes the uneven portion of the electrode protective layer 28 that reflects the shape of the partition wall 23. The organic buffer layer 31 has a function of relieving stress generated by warping and volume expansion of the element substrate 20 and preventing peeling of the electrode protective layer 28 and cracking of the gas barrier layer 29. The thickness of the organic buffer layer 31 is preferably about 3 μm to 5 μm. The organic buffer layer 31 is formed using, for example, a vacuum screen printing method, a slit coating method, an ink jet method, or the like.

  The gas barrier layer 29 is made of the same material as that of the electrode protective layer 28 and functions as a sealing member that prevents moisture and oxygen from entering the organic EL element 8 from the outside. The gas barrier layer 29 is formed by the same method as the electrode protective layer 28.

  The sealing substrate 30 is disposed opposite to the surface side of the element substrate 20 where the organic EL element 8 is formed, that is, the surface side where the gas barrier layer 29 is formed. The sealing substrate 30 is bonded to the gas barrier layer 29 on the element substrate 20 via the sealing material 33 and the sealing resin layer 32. The sealing substrate 30 is made of light-transmitting inorganic glass. In this embodiment, non-alkali glass is used as the material of the sealing substrate 30.

  The thickness of the sealing substrate 30 is about 5 μm to 50 μm, and preferably 5 μm to 20 μm. The sealing substrate 30 is processed to the above-described thickness by etching, mechanical polishing, chemical polishing, or the like using a glass substrate having a thickness of about 0.3 mm to 0.7 mm as a material, similar to the element substrate 20. The In the organic EL panel 2, a glass substrate having a gas barrier property higher than that of a plastic substrate is used for the element substrate 20 and the sealing substrate 30, and flexibility is given by reducing the thickness of these glass substrates. .

  The sealing material 33 is disposed in a non-display area between the element substrate 20 and the sealing substrate 30 and is provided in a frame shape along the outer periphery of the sealing substrate 30. The sealing material 33 is made of a material having a low moisture permeability. As the material of the sealing material 33, for example, a highly adhesive adhesive in which an acid anhydride is added as a curing agent to an epoxy resin and a silane coupling agent is added as an accelerator can be used.

  The sealing resin layer 32 is provided so as to fill a region surrounded by the element substrate 20, the sealing substrate 30, and the sealing material 33 without a gap. The sealing resin layer 32 is made of a highly light-transmitting resin such as acrylic, epoxy, or urethane. Considering heat resistance and water resistance, it is preferable to use an epoxy resin as the material of the sealing resin layer 32.

  The color filter 34 is provided on the organic EL element 8 side of the sealing substrate 30. The color filter 34 includes a color filter 34R corresponding to red (R) light, a color filter 34G corresponding to green (G) light, and a color filter 34B corresponding to blue (B) light. If the colors to be used are not distinguished, they are also simply called color filters 34). The color filter 34 is provided so as to overlap the organic EL element 8 in a plan view.

  A light shielding layer 35 is provided so as to partition the color filters 34R, 34G, and 34B. The light shielding layer 35 is disposed so as to correspond to the partition wall 23. The light shielding layer 35 is made of a material having a light shielding property, and is made of, for example, Cr (chromium). An overcoat layer may be provided so as to cover the color filter 34 and the light shielding layer 35.

  The organic EL panel 2 includes a pixel 6R that emits red light, a pixel 6G that emits green light, and a pixel 6B that emits blue light. Also called). The color filters 34R, 34G, 34B are arranged corresponding to the pixels 6R, 6G, 6B.

  White light emitted by the organic EL element 8 is transmitted through the color filters 34R, 34G, and 34B, so that light of three different colors R, G, and B is emitted from the pixels 6R, 6G, and 6B. One pixel group is configured by the pixels 6R, 6G, and 6B, and various colors can be displayed by appropriately changing the luminance of the pixels 6R, 6G, and 6B in each pixel group. Therefore, an organic EL panel capable of full color display or full color light emission can be provided.

  In the organic EL panel 2, light emitted from the organic light emitting layer 26 to the cathode 27 side is emitted to the display surface 30a side. Further, the light emitted from the organic light emitting layer 26 to the anode 25 side is reflected by the reflective layer 24 and emitted to the display surface 30a side.

<Method for manufacturing organic EL device>
Next, an outline of a method for manufacturing the organic EL device according to the first embodiment will be described. First, the organic EL panel 2 is formed using a known method. In this embodiment, a glass substrate having a thickness of 0.3 mm to 0.7 mm is used as the element substrate 20 and the sealing substrate 30.

  Next, the element substrate 20 and the sealing substrate 30 of the organic EL panel 2 are processed and thinned to a predetermined thickness, for example, 5 μm to 20 μm. As a method of processing the element substrate 20 and the sealing substrate 30, for example, etching using an aqueous solution in which hydrofluoric acid (hydrofluoric acid) is diluted can be applied. The etching solution may be an aqueous solution such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, or a mixture thereof.

  As an etching method, it may be immersed in a tank in which the etching solution is circulated, or the etching solution may be shower irradiated. Further, mechanical polishing, chemical polishing, or the like may be applied as a method for processing the element substrate 20 and the sealing substrate 30. The processed surface of the element substrate 20 is the back surface 20a, and the processed surface of the sealing substrate 30 is the display surface 30a.

  Next, the compressive stress layer 40 is formed on the display surface 30 a of the sealing substrate 30. As a method of forming the compressive stress layer 40, a sputtering method using plasma or an ion plating method is suitable. As a conventional method for forming a compressive stress layer, there is known a method in which a flame (flame) treatment is performed on a glass surface, the glass surface is heated to several hundred degrees, and then rapidly cooled to generate a compressive stress. However, in such a method, the lifetime of the organic EL panel 2 (organic EL element 8) is remarkably shortened by being exposed to a high temperature.

  On the other hand, according to the sputtering method or ion plating method using plasma, the compressive stress layer 40 is formed without being exposed to a high temperature that degrades the life of the organic EL panel 2 (organic EL element 8). it can. Further, by such a forming method, the compressive stress layer 40 having a high film density (high compressive stress) can be formed, and good adhesion to the sealing substrate 30 can be obtained. The inorganic oxide particles may be diluted with a solvent and dispersed, and the compressive stress layer 40 may be formed using a coating method such as a spray method.

  Next, FPCs 46a, 46b, and 46c are connected to one side of the element substrate 20 of the organic EL panel 2. Then, the reinforcing layer 56 is disposed with the resin layer 52 interposed on the back surface 20a side of the organic EL panel 2, and the optical film 53 is disposed and laminated with the resin layer 51 interposed on the display surface 30a side. At this time, the resin layer 52, the organic EL panel 2 to which the FPC 46 is connected, the resin layer 51, and the optical film 53 are superposed on the reinforcing layer 56 in this order.

  Then, it pressurizes from the reinforcement layer 56 side and the optical film 53 side, heats in the range of 80 to 120 degreeC, and crimps | bonds. As a method of thermocompression bonding, a method using a hot plate type parallel plate or a pair of heat and pressure rollers is preferable. Further, a vacuum pressure bonding apparatus may be used. In addition, when the resin layers 51 and 52 contain a crosslinking component, it is preferable to anneal at about 100 ° C. to complete the crosslinking.

Here, since the resin layers 51 and 52 made of a resin mainly composed of polyethylene have little initial adhesive force at room temperature and air bubbles are easily removed, alignment is possible in a state where each component is stacked in advance. However, since the adhesive force is developed by heating, a multilayer structure can be formed by a single thermocompression laminate. For this reason, production efficiency is good and mass productivity is excellent.
Thus, the organic EL device 1 is completed.

<Stress relaxation function of compressive stress layer>
Next, the stress relaxation function of the compressive stress layer 40 will be described with reference to the drawings. 6A and 6B are diagrams for explaining the generation of cracks due to tensile stress. Specifically, it is a cross-sectional view of the sealing substrate 30 taken along the line AA ′ in FIG. However, in FIGS. 6A and 6B, it is assumed that the compressive stress layer 40 is not provided on the display surface 30a. FIGS. 7A and 7B are diagrams illustrating stress relaxation by the compressive stress layer. Specifically, it is an enlarged view of a portion B in FIG.

  In general, a glass substrate is relatively strong against compressive stress, but has a very weak property against tensile stress compared to compressive stress. When tensile stress is applied to the glass substrate, cracks may occur on the surface of the glass substrate or the glass substrate may be broken. As in this embodiment, in an electro-optical device in which a glass substrate is made thin and flexible, there is an increased risk of tensile stress being applied to the glass substrate due to external stress such as bending or impact.

  FIG. 6A shows a state in which no tensile stress is applied to the sealing substrate 30. Here, it is assumed that fine cracks 37 are present on the display surface 30 a of the sealing substrate 30. The display surface 30a of the sealing substrate 30 is a surface on the side subjected to processing such as etching, mechanical polishing, or chemical polishing when the thickness of the sealing substrate 30 is processed to be thin. Therefore, such fine cracks 37 may exist on the display surface 30a.

  FIG. 6B shows a state in which the stress F1 indicated by the solid arrow is applied to the sealing substrate 30 from the outside, and the sealing substrate 30 is bent convexly toward the display surface 30a. As shown in FIG. 6B, when the sealing substrate 30 is bent in a convex shape toward the display surface 30a, tensile stress is applied to the display surface 30a. Then, when this tensile stress is concentrated on the crack 37, it expands and becomes a larger crack 37a. If the crack 37a further expands, the sealing substrate 30 may be cracked. In addition, a crack 38 may be newly generated on the display surface 30a due to the tensile stress.

  In this embodiment, since the compressive stress layer 40 is provided on the display surface 30a, the compressive stress F2 is applied to the display surface 30a of the sealing substrate 30 by the compressive stress layer 40 as shown in FIG. Applied. Therefore, even if a tensile stress is applied to the display surface 30a due to the stress F1, the tensile stress is relieved by the opposing compression stress F2. Thereby, even if the fine crack 37 exists in the display surface 30a, the expansion is suppressed and generation | occurrence | production of a new crack is also suppressed.

  As shown in FIG. 7B, when a point load F3 is applied from the resin layer 51 (optical film 53) side, a tensile stress is applied to the display surface 30a by the point load F3. However, since the tensile stress is relaxed by the compressive stress F2 opposing the tensile stress, the expansion of the crack 37 and the generation of a new crack can be suppressed.

  As described above, in the present embodiment, the compressive stress layer 40 is provided on the display surface 30a even when a fine crack 37 is generated on the display surface 30a when the thickness of the sealing substrate 30 is reduced. Therefore, the expansion of the crack 37 is suppressed. Therefore, various methods can be applied as a method of processing the sealing substrate 30 to be thin, and the degree of freedom in selecting the processing method is improved.

  Such tensile stress is not only caused by external stress applied to the organic EL device 1, but also the sealing substrate 30 is convex on the display surface 30a side due to the elastic force of the reinforcing layer 56, the difference in linear expansion coefficient, or the like. It can be generated by bending. In the present embodiment, since the compressive stress layer 40 is provided on the display surface 30a, even when a tensile stress is generated on the display surface 30a by the reinforcing layer 56, the tensile stress can be relaxed by the compressive stress layer 40. it can.

  According to the configuration of the organic EL device 1 according to the first embodiment, the following effects can be obtained.

  (1) Since the compressive stress layer 40 is provided so as to cover the display surface 30a of the sealing substrate 30, even if a tensile stress is applied to the display surface 30a, the compressive stress layer 40 relaxes. For this reason, it is possible to suppress the occurrence of cracks on the display surface 30a of the sealing substrate 30 or damage such as cracking of the sealing substrate 30 due to external stress such as bending or weighting.

  Since the compressive stress layer 40 is formed of an inorganic oxide, it has light transmittance close to that of glass. Thereby, the compressive stress layer 40 can be provided on the display surface 30 a of the sealing substrate 30 on the side where light is emitted from the organic light emitting layer 26 in the organic EL panel 2.

  Further, since the linear expansion coefficient of the forming material of the compressive stress layer 40 is close to the linear expansion coefficient of glass, the difference in dimensional change between the sealing substrate 30 and the compressive stress layer 40 is small with respect to temperature change. Thereby, while the curvature of the sealing substrate 30 accompanying a temperature change is suppressed, the change of the compressive stress applied by the compressive stress layer 40 can also be made small. Furthermore, since the organic EL panel 2 (organic EL element 8) is not exposed to a high temperature in the process of forming the compressive stress layer 40, the lifetime deterioration of the organic EL panel 2 (organic EL element 8) can be suppressed.

  (2) In the organic EL device 1, the periphery of the organic EL panel 2 is integrated and reinforced by laminating the optical film 53 and the reinforcing layer 56 via the resin layers 51 and 52. Accordingly, even if the total thickness of the element substrate 20 and the sealing substrate 30 is made thinner, the organic EL device 1 has bending resistance so that the organic EL panel 2 is not broken even if it is bent while being flexible. Can provide.

  (3) Since the periphery of the organic EL panel 2 (organic EL element 8) is sealed by the resin layers 51 and 52 having water resistance, moisture and the like enter the organic EL panel 2 (organic EL element 8) from the outside. Is suppressed. Further, since the reinforcing layer 56 has a heat dissipation property, it is possible to effectively dissipate heat even in the case of a large screen panel that has a large amount of current supplied to the organic EL panel 2 and easily generates heat. Thereby, since the lifetime fall of the organic EL element 8 by a water | moisture content or a heat | fever is suppressed, the organic EL apparatus 1 with high reliability can be provided.

  (4) Since the optical film 53 and the reinforcing layer 56 are laminated via the insulating resin layers 51 and 52 so as to sandwich the FPC 46, the connecting portion of the FPC 46 and the FPC 46 can be reinforced, and the conventional connecting portion can be reinforced. The liquid mold adhesive used can be dispensed with. Thereby, the FPC 46 can be made thinner and the strength of the connecting portion can be improved.

(Second Embodiment)
Next, an outline of the organic EL device according to the second embodiment will be described with reference to the drawings. The organic EL device according to the second embodiment is different from the organic EL device according to the first embodiment in that the organic EL device further includes a reinforcing layer 58 as a third surface layer. The configuration is the same. FIG. 8 is a cross-sectional view illustrating a schematic configuration of the organic EL device according to the second embodiment. FIG. 8 corresponds to a cross section taken along line AA ′ of FIG. Constituent elements common to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

<Organic EL device>
As shown in FIG. 8, the organic EL device 101 according to the second embodiment includes an organic EL panel 2, a compressive stress layer 40, FPCs 46a, 46b, and 46c, resin layers 51 and 52, and an optical film 53. The reinforcing layer 56 and the reinforcing layer 58 as a third surface layer are provided.

  In the present embodiment, the optical film 53 is larger than at least the display area 2 a of the organic EL panel 2 and has a size that substantially overlaps the sealing substrate 30 in plan view. The side surface of the optical film 53 is covered with the resin layer 51.

  The reinforcing layer 58 is provided on the surface treatment layer 55 side of the optical film 53 and is disposed so as to face the reinforcing layer 56 with the resin layers 51 and 52 interposed therebetween.

  Similar to the reinforcing layer 56, the reinforcing layer 58 is a reinforcing member that prevents breakage of the most easily damaged end portion of the organic EL panel 2 when an external stress such as bending or dropping is applied to the organic EL device 101. And when the organic EL device 101 is bent by an external stress, it also has a function of restoring the original shape like a spring, heat dissipation, and the like.

  Since the reinforcing layer 58 is disposed so as to face the reinforcing layer 56, the function of reinforcing the organic EL device 101 and the toughness such as high tensile strength are suppressed in order to suppress bending to the fracture limit point. More strengthened. Furthermore, by arranging the reinforcing layer 58 so as to face the reinforcing layer 56, stresses generated by the respective elastic forces of the reinforcing layers 56 and 58, the difference in linear expansion coefficient between other components, and the like can be obtained. Alleviated.

  The reinforcing layer 58 has a so-called frame shape provided with an opening 58a. The frame shape is a shape that covers the organic EL panel 2 so as to have an opening 58a that planarly overlaps the display region 2a of the organic EL panel 2. In the opening 58a, the light emitted by the organic EL panel 2 is emitted outside the organic EL device 101.

  Furthermore, it is preferable that the opening 58 a of the reinforcing layer 58 is provided in a shape along the outline of the display region 2 a, and the end of the reinforcing layer 58 covers the end of the organic EL panel 2. With such a configuration, together with the reinforcing layer 56, the edge of the element substrate 20 and the sealing substrate 30 that are prone to cracking when external stress is applied to the organic EL device 101 is reinforced from the display surface 30a side. Can do.

  The reinforcing layer 58 is preferably in contact with the resin layer 51 and disposed so as to planarly overlap the peripheral portion of the optical film 53, that is, in a shape straddling the resin layer 51 and the optical film 53. With such a shape, even when an external stress is applied to the organic EL device 101, the adhesion between the side surface of the optical film 53 and the resin layer 51 can be maintained.

  As the material of the reinforcing layer 58, as in the reinforcing layer 56, any material such as CFRP or Invar can be used. Further, the materials of the reinforcing layers 56 and 58 may be the same material, or different materials may be used in combination, for example, invar is used for one of the reinforcing layers 56 and 58 and CFRP is used for the other.

  The method for manufacturing the organic EL device 101 is substantially the same as the method for manufacturing the organic EL device 1 according to the first embodiment. In the laminating step, the reinforcing layer 56 is disposed with the resin layer 52 interposed on the back surface 20a side of the organic EL panel 2, and the optical film 53 and the reinforcing layer 58 are disposed with the resin layer 51 interposed on the display surface 30a side. Place and laminate. At this time, the reinforcing layer 58 is disposed so as to overlap the peripheral edge of the optical film 53 in a planar manner. Thereby, the organic EL device 101 can be manufactured.

  According to the configuration of the organic EL device 101 according to the second embodiment, the following effects can be obtained in addition to the effects of the first embodiment.

  Since the periphery of the organic EL panel 2 is integrated by the optical film 53, the reinforcing layer 56, and the reinforcing layer 58 via the resin layers 51 and 52, the organic EL device 101 can be reinforced more firmly. In addition, since the reinforcing layer 58 and the reinforcing layer 56 are disposed to face each other from the display surface 30a side and the back surface 20a side, the end portion of the organic EL panel 2 is not damaged when an external stress such as bending or dropping is applied. It can be prevented more effectively.

  In the present embodiment, the reinforcing layer 58 is in contact with the resin layer 51 and the peripheral portion of the optical film 53, but is not limited to such a form. Even in a region where the reinforcing layer 58 overlaps the peripheral portion of the optical film 53 in a plan view, the resin layer 51 may be interposed between the reinforcing layer 58 and the optical film 53. With such a configuration, since the reinforcing layer 58 is in contact with only the resin layer 51, there is no step between the resin layer 51 and the optical film 53 compared to the case in which both the resin layer 51 and the optical film 53 are in contact. The adhesion of the reinforcing layer 58 can be further enhanced.

  Further, in the present embodiment, a configuration in which the reinforcing layer 58 does not overlap the peripheral portion of the optical film 53, that is, a configuration in which the optical film 53 is provided in the opening 58a may be employed. With such a configuration, the reinforcing layer 58 and the optical film 53 do not overlap, so that the organic EL device 101 can be made thinner.

(Third embodiment)
Next, an outline of an organic EL device according to the third embodiment will be described with reference to the drawings. The organic EL device according to the third embodiment is different from the organic EL device according to the second embodiment in that it further includes a touch panel, but the other configurations are the same. FIG. 9 is a cross-sectional view illustrating a schematic configuration of an organic EL device according to the third embodiment. FIG. 9 corresponds to a cross section taken along the line AA ′ of FIG. Constituent elements common to the second embodiment are denoted by the same reference numerals and description thereof is omitted.

<Organic EL device>
As shown in FIG. 9, the organic EL device 102 according to the third embodiment includes an organic EL panel 2, a compressive stress layer 40, FPCs 46a, 46b, and 46c, resin layers 51, 52, and 59, and an optical film. 53, a reinforcing layer 56, a reinforcing layer 58, and a touch panel 60 are provided. The organic EL device 102 is an organic EL device with a touch panel.

  The touch panel 60 is provided on the optical film 53 side of the compressive stress layer 40. The touch panel 60 is one size larger than the display area 2a of the organic EL panel 2 in plan view. The touch panel 60 includes an optical film 53, a substrate 61, electrodes 62 and 63, a sealing material 64, a spacer 65, and a flexible printed circuit board 66 (hereinafter referred to as FPC 66). In the present embodiment, the optical film 53 serves as a film on the operation surface side of the touch panel 60.

  The touch panel 60 is a resistive film type touch panel that detects the coordinates of the input position from a change in resistance value that occurs when the electrodes 62 and 63 come into contact with each other. In the touch panel 60, when the surface of the optical film 53 (surface treatment layer 55) serving as an operation surface is pressed with a fingertip, a touch pen 68, or the like, the optical film 53 is bent and the electrodes 62 and 63 are brought into contact with each other to cause a change in resistance value. By detecting this resistance value change as a potential change, the coordinates of the input position are detected.

  The touch panel 60 has light transmittance, and an image displayed on the display area 2 a of the organic EL panel 2 is observed through the touch panel 60. A desired operation can be performed by touching (pushing) a desired part in an image displayed in the display area 2a, for example, a plurality of operation buttons, an operation bar, a program icon, or the like. An outline of the configuration of the touch panel 60 will be described. A known configuration can be applied to the touch panel 60.

  The substrate 61 is a glass substrate made of inorganic glass, and is made of alkali-free glass in this embodiment. The substrate 61 is bonded and fixed to the surface of the compressive stress layer 40. The electrode 62 is provided on the surface of the substrate 61 on the optical film 53 side. The optical film 53 and the substrate 61 are bonded and integrated by a sealing material 64 formed on the peripheral edge thereof. On one side of the substrate 61, an FPC 66 is provided. The FPC 66 has a protruding portion that protrudes outside the organic EL device 102, and a terminal (not shown) for connecting to an external device is formed at the end of the protruding portion.

  The electrode 63 is provided on the surface of the optical film 53 on the substrate 61 side so as to face the electrode 62. The electrodes 62 and 63 are made of, for example, ITO, and are composed of a plurality of electrodes formed in stripes or planes. A plurality of dot-like spacers 65 are arranged between the electrodes 62 and 63. The spacer 65 holds the gap between the electrodes 62 and 63 so that the electrodes 62 and 63 are inadvertently placed outside the desired region in the event of an erroneous contact due to bending or bending of the organic EL device 102 or an input operation. Prevent contact.

  In the present embodiment, a resin layer 59 is further provided in addition to the resin layers 51 and 52. The resin layer 59 is disposed between the resin layer 51 and the reinforcing layer 58. In addition, the resin layer 59 is disposed so as to sandwich the FPC 66 of the touch panel 60 between the resin layer 51 and the resin layer 51. The resin layer 59 is made of the same material as the resin layers 51 and 52.

  The method for manufacturing the organic EL device 102 is substantially the same as the method for manufacturing the organic EL device 101 according to the second embodiment. In the laminating step, the reinforcing layer 56 is disposed with the resin layer 52 interposed on the back surface 20a side of the organic EL panel 2, and the touch panel 60 and the reinforcing layer 58 are disposed with the resin layers 51 and 59 interposed on the display surface 30a side. Place and laminate.

  At this time, the resin layer 51 covers the side surfaces of the sealing substrate 30, the compressive stress layer 40, and the substrate 61, the resin layer 59 covers the side surface of the optical film 53, and the FPC 66 between the resin layer 51 and the resin layer 59. Arrange so as to sandwich. The resin layer 51 and the resin layer 59 may be provided with openings corresponding to these substrates and films. Thereby, the organic EL device 102 can be manufactured.

  According to the configuration of the organic EL device according to the third embodiment, the following effects are obtained in addition to the effects in the second embodiment.

  Since the touch panel 60 is provided, it is possible to provide an organic EL device 102 that has a touch panel and is thin and flexible. In the organic EL device 102, when an input operation or the like of the touch panel 60 is performed, the surface of the touch panel 60 (optical film 53) is pressed, so that a point weight F3 as shown in FIG. In addition, a tensile stress is applied to the display surface 30a by this point weight F3. However, in this embodiment, the substrate 61 of the touch panel 60 is positioned instead of the resin layer 51 shown in FIG.

  As described above, in the electro-optical device provided with the touch panel, the point load is applied to the electro-optical panel by the input operation of the touch panel, so that the tensile stress is applied to the glass substrate as compared with the electro-optical device not provided with the touch panel. Risk increases. On the other hand, in this embodiment, since the compressive stress layer 40 is provided on the display surface 30a, the tensile stress is relieved when the compressive stress F2 opposes the tensile stress applied to the display surface 30a. Therefore, the expansion of the crack 37 and the generation of a new crack can be suppressed.

  Even if the point load applied to the sealing substrate 30 is increased by making the thickness of the optical film 53 thinner, the compressive stress layer 40 is provided on the display surface 30a of the sealing substrate 30. The tensile stress generated on the display surface 30 a due to the load is relaxed by the compressive stress layer 40. Therefore, the detection performance of the input operation position on the touch panel 60 can be improved by making the thickness of the optical film 53 thinner than when the compressive stress layer 40 is not provided.

  Note that a touch panel other than the resistive film type may be used as the touch panel 60. For example, even in a capacitive touch panel that performs input by recognizing a change in capacitance by contact with an object, light transmittance on the display surface 30a side can be secured by using a matrix-like ITO electrode. Can be used.

(Fourth embodiment)
Next, an outline of an organic EL device according to the fourth embodiment will be described with reference to the drawings. The organic EL device according to the fourth embodiment is different from the organic EL device according to the third embodiment in the touch panel system, but the other configurations are the same. FIG. 10 is a cross-sectional view illustrating a schematic configuration of an organic EL device according to the fourth embodiment. FIG. 10 corresponds to a cross section taken along line AA ′ of FIG. Constituent elements common to the third embodiment are denoted by the same reference numerals and description thereof is omitted.

<Organic EL device>
As shown in FIG. 10, the organic EL device 103 according to the fourth embodiment includes an organic EL panel 2, a compressive stress layer 40, FPCs 46a, 46b, and 46c, resin layers 51, 52, and 59, and an optical film. 53, a reinforcing layer 56, a reinforcing layer 58, and a touch panel 70 are provided. The organic EL device 103 is an organic EL device with a touch panel provided with a touch panel 70 instead of the touch panel 60.

  The touch panel 70 is provided on the optical film 53 side of the organic EL panel 2. The touch panel 70 includes a sealing substrate 30, a plurality of piezo sensors 74 provided around the display area 2a, and a flexible printed circuit board 72 (hereinafter referred to as FPC 72). In the present embodiment, the sealing substrate 30 provided with the compressive stress layer 40 also serves as a substrate for the touch panel 70. The touch panel 70 is an acoustic pulse recognition type touch panel that detects the coordinates of the input position by converting the surface vibration of the sealing substrate 30 (compressive stress layer 40) into an electrical signal by the piezo sensor 74 and detecting it.

  The piezo sensor 74 is adhesively fixed on the display surface 30 a of the sealing substrate 30, that is, on the surface of the compressive stress layer 40, and is positioned between the compressive stress layer 40 and the optical film 53. Piezo sensors 74 are provided outside the display area 2a, for example, at four locations corresponding to each side of the sealing substrate 30. An FPC 72 is provided on one side of the sealing substrate 30. The FPC 72 is connected to the piezo sensor 74 and has a protruding portion that protrudes outside the organic EL device 103. A terminal (not shown) for connecting to an external device is formed at the end of the protruding portion. Has been. The FPC 72 is sandwiched and fixed between the resin layer 51 and the resin layer 59.

  In the touch panel 70, when the surface of the optical film 53 (surface treatment layer 55) serving as an operation surface is pressed with a fingertip, a touch pen 68, or the like, the optical film 53 is bent and comes into contact with the sealing substrate 30 (compressive stress layer 40). The stop substrate 30 vibrates. At this time, the time from when the surface vibration (acoustic pulse wave) of the sealing substrate 30 is transmitted to each piezo sensor 74 varies depending on the position of the piezo sensor 74. Based on the signal, the coordinates of the input position from which the acoustic pulse is generated are detected.

  Here, in order to satisfactorily transmit the acoustic pulse wave to the piezo sensor 74, the Young's modulus of the compressive stress layer 40 is preferably higher than the Young's modulus of glass, for example, 100 GPa or more. By making the Young's modulus of the compressive stress layer 40 higher than the Young's modulus of glass, the detection performance of the input operation position on the touch panel 70 can be improved.

  In the method of manufacturing the organic EL device 103, the touch panel 60 may be replaced with the touch panel 70 in the lamination process of the organic EL device 102 according to the third embodiment.

  According to the configuration of the organic EL device according to the fourth embodiment, the following effects are obtained in addition to the effects in the third embodiment.

  Since the sealing substrate 30 also serves as the substrate of the touch panel 70, the organic EL device 103 can be made thinner than the organic EL device 102 according to the third embodiment, and light emitted from the organic EL panel 2 can be reduced. The transmittance can be increased.

(Electronics)
FIG. 11 illustrates an example of an electronic device. Specifically, FIG. 11A is a schematic configuration diagram of a display as an example of an electronic device, and FIG. 11B is a schematic configuration diagram of an information portable terminal as an example of the electronic device.

  A display 1000 shown in FIG. 11A is a book-type display using the organic EL device 1 (1A, 1B) as an electro-optical device as electronic paper. The display 1000 is provided with a hinge portion 1001 having a connector (not shown) that can be connected to the FPC 46 of the organic EL device 1 (1A, 1B) at a portion corresponding to a book binding margin.

  A connector is attached to the hinge portion 1001 so as to be rotatable about a rotation axis. By rotating the connector, the organic EL device 1 (1A, 1B) can be turned to turn ordinary paper. Yes. A plurality of organic EL devices 1 (1A, 1B) may be detachably connected to the hinge part 1001. As a result, the necessary number of organic EL devices can be attached and detached as in the case of loose leaves.

  A personal digital assistant (PDA) 2000 shown in FIG. 11B includes a plurality of operation buttons 2001, a power switch 2002, and the organic EL device 1 as an electro-optical device. In the portable information terminal 2000, when the power switch 2002 is turned on and a plurality of operation buttons 2001 are operated, various types of information such as an address book and a schedule book are displayed on the organic EL device 1.

  The organic EL device of the present invention is not limited to the book type display described above, and can be mounted on various electronic devices. Electronic devices include, for example, personal computers, digital still cameras, viewfinder type or monitor direct view type digital video cameras, car navigation systems, in-vehicle displays, pagers, electronic notebooks, calculators, word processors, workstations, videophones, POS terminals And devices equipped with a touch panel.

  Furthermore, the organic EL device of the present invention can also be used as a light source or illumination device for devices other than display devices, for example, an exposure head of a printer head. In addition, you may replace the organic EL apparatus 1 with the organic EL apparatus in each embodiment and a modification.

  As mentioned above, although embodiment of this invention was described, various deformation | transformation can be added with respect to the said embodiment in the range which does not deviate from the meaning of this invention. As modifications, for example, the following can be considered.

(Modification 1)
Although the organic EL panel of the said embodiment was a structure from which a white luminescent color was obtained with an organic light emitting layer, it is not limited to said form. The organic EL panel may be configured to obtain R, G, and B emission colors.

  For example, the organic light emitting layer 26 may have a so-called three-color coating method in which light emitting layers of R, G, and B are formed for each of the pixels 6R, 6G, and 6B. In this case, the color filter 34 may not be provided. Even if it is such a structure, the effect similar to said each embodiment can be acquired.

(Modification 2)
Although the organic EL panel of the said embodiment was the structure provided with the electrode protective layer laminated | stacked on the organic EL element, the organic buffer layer, and the gas barrier layer, it is not limited to said form. This is because the solid sealing structure that protects the organic EL element with the thin film sealing layer having a gas blocking function can realize flexibility resistance that cannot be achieved by the hollow structure, and the thin film sealing layer can be appropriately selected depending on the panel structure.

  For example, the organic EL panel may be configured to include one thin film sealing layer on the organic EL element, or one or more thin films on the electrode protective layer, the organic buffer layer, and the gas barrier layer. The structure provided with the sealing layer may be sufficient. Even if it is such a structure, the effect similar to said each embodiment can be acquired.

(Modification 3)
The organic EL panel of the above embodiment has an active matrix type configuration, but is not limited to the above form. The organic EL panel may be a passive (simple) matrix type.

  In this case, the circuit element layer 21 is unnecessary, and the organic light emitting layer 26 is sandwiched between the scan electrode and the data electrode. For example, the scan electrode is formed on the element substrate 20 side, and the data electrode is formed on the sealing substrate 30 side. The scan electrodes and the data electrodes are formed so as to extend in the intersecting directions so as to form a lattice shape in a plane. Even if it is such a structure, the effect similar to said each embodiment can be acquired.

(Modification 4)
The electro-optical device of the above embodiment has a configuration including an organic EL panel as an electro-optical panel, but is not limited to the above-described form. The electro-optical device may include a liquid crystal panel in which a liquid crystal layer is sandwiched between a pair of substrates as an electro-optical panel. The electro-optical device may include an electrophoretic panel including an electrophoretic layer between a pair of substrates as an electro-optical panel. As described above, the thin electro-optical panel having the electro-optical layer sandwiched between the pair of substrates can obtain the same effects as those of the above embodiments.

(Modification 5)
The electro-optical devices of the third embodiment and the fourth embodiment are configured to include a resistive film type or capacitive type touch panel, or an acoustic pulse recognition type touch panel, but are limited to the above form. Not. The electro-optical device may have a configuration including a touch panel of another method such as an infrared method, an ultrasonic surface acoustic wave method, or an electromagnetic induction method as a touch panel. Even if it is such a structure, the effect similar to the said embodiment can be acquired.

  DESCRIPTION OF SYMBOLS 1,101,102,103 ... Organic EL apparatus as an electro-optical device, 2 ... Organic EL panel as an electro-optical panel, 20 ... Element board | substrate as a pair of glass substrate, 20a ... The back surface as a 2nd surface, 26 ... an organic light emitting layer as an electro-optical layer, 30 ... a sealing substrate as a pair of glass substrates, 30a ... a display surface as a first face, 40 ... a compressive stress layer, 51, 52, 59 ... a resin layer, 53 ... Optical film as first surface layer, 55... Surface treatment layer, 56. Reinforcing layer as second surface layer, 58. Reinforcing layer as third surface layer, 58 a... Opening, 60 and 70. 1000 ... Display as an electronic device, 2000 ... Portable information terminal as an electronic device.

Claims (14)

An electro-optical layer sandwiched between a pair of glass substrates; a first surface on a side from which light is emitted from the electro-optical layer; and a second surface opposite to the first surface. An electro-optic panel;
A resin layer provided to cover at least the side surface of the electro-optical panel and the second surface;
A light-transmitting first surface layer disposed opposite to the first surface;
A second surface layer disposed opposite to the second surface via the resin layer,
An electro-optical device, wherein a compressive stress layer having optical transparency is provided on the first surface so as to cover the first surface. The electro-optical device according to claim 1,
The electro-optical device, wherein the compressive stress layer is made of an oxide of an inorganic material. The electro-optical device according to claim 2,
The electro-optical device, wherein the inorganic material is at least one of aluminum, silicon, zinc, magnesium, titanium, zirconium, and tantalum. The electro-optical device according to any one of claims 1 to 3,
The resin layer is provided between the compressive stress layer and the first surface layer so as to cover a surface of the compressive stress layer on the side where the first surface layer is disposed. An electro-optical device. The electro-optical device according to claim 1,
The electro-optical device, wherein the second surface layer has a size that at least planarly covers up to an end of the electro-optical panel. The electro-optical device according to any one of claims 1 to 5,
A third surface layer disposed on the first surface side of the electro-optical panel;
The third surface layer is sized to cover at least the end of the electro-optical panel in a planar manner, and has an opening that overlaps the area of the electro-optical panel from which the light is emitted. An electro-optical device. The electro-optical device according to claim 6,
The first surface layer is disposed between the compressive stress layer and the third surface layer;
The resin layer is provided so as to cover a side surface of the first surface layer,
The electro-optical device, wherein the third surface layer is in contact with the resin layer and is disposed so as to overlap with a peripheral portion of the first surface layer. The electro-optical device according to any one of claims 1 to 7,
An electro-optical device, wherein a touch panel is provided on the first surface layer side of the compressive stress layer. The electro-optical device according to claim 8,
The electro-optical device, wherein the touch panel is a resistive film type touch panel. The electro-optical device according to claim 8,
The electro-optical device, wherein the touch panel is an acoustic pulse recognition type touch panel. The electro-optical device according to claim 1,
The first surface layer includes a surface treatment layer;
The electro-optical device, wherein the surface treatment layer is disposed on the light emission side of the first surface layer. The electro-optical device according to claim 1,
Each of the pair of glass substrates has an thickness of 100 μm or less. The electro-optical device according to any one of claims 1 to 12,
The electro-optical device, wherein the resin layer is made of a material mainly composed of polyethylene or a polyethylene copolymer.   An electronic apparatus comprising the electro-optical device according to claim 1.

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