JP2011000625A - Widefield epi-illumination type beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain highly accurate machining and confirming, for example, in quality control through proper beam control and image recording, on the basis of precise positional control and recognition of irradiation state through image processing by placing a camera coaxially with a beam operation axis.SOLUTION: Plane mirrors are mounted on an arc relative to an arbitrary irradiation range, with beams distributed from the center of the arc, and horizontal divided emission is performed on a workpiece surface at a focal distance less than an irradiation width to the workpiece. The positions of the respective plane mirrors are those of the equal focal distance and at an angle reflecting the beams from the center vertically to the workpiece. The control is performed such that the imaging axis of the camera is placed coaxially with the beams. The beams are emitted by obtaining a position and class information of the target from the image, and manipulation of the position and output of the beams are performed by determination from the image of the situation.

Description

The present invention relates to an apparatus for accurately moving an optical path focal point to an arbitrary portion of a belt shape, and relates to an apparatus that uses a mirror surface to move and position a work surface at high speed for processing and inspection.

  With the development of laser beam processing machines, there are processing machines such as laser markers, laser cutting machines, and laser welding machines. Also, glass sealers such as laser solder welders and solar cells that are required for lead-free solder have been developed. In particular, laser markers using galvanometer mirrors are used in mass production all over the world.

Contents of issues in the summary of Japanese Patent Publication 2000-334594 Method for laser soldering of Japanese Patent Application Laid-Open No. 10-296434

  Conventional laser markers and laser processing machines are roughly divided into the following two methods. When irradiating a focused beam over a wide range, adjust the focal length with an Fθ lens, or provide a focus adjustment mechanism before shaking with a mirror and shake the beam with a galvanometer mirror (hereinafter referred to as the shaking method) There is a method of moving the irradiation head or workpiece with a robot or stage (hereinafter referred to as a moving method).

In the swing method, since the beam spreads in a fan shape, it cannot be irradiated perpendicularly to the target plane as it spreads to the end. The irradiation range is usually 100 mm to 300 mm, limited by the size and performance of the Fθ lens, and cannot be increased in accordance with the production line width and the size of the workpiece. In the moving method, the moving speed of the processing point is slower than that of the swing method, and it is necessary to move at each processing point, and a complicated mechanism and energy are required to control the focal length and direction of the laser.

In order to perform a wide range of processing with a swing method at an angle close to vertical, it is practically difficult because fine angle control is performed with a long focal point and light is condensed with a large objective lens. For example, when the processing range is 300 mm, when the beam is swung to ± 4 degrees, the angle at which the beam is swung from a distance of 4500 mm at a distance about 15 times the irradiation range and the focal point is moved by 1 mm is about 0.0127 degrees.

  As a means for solving the above problems, the apparatus of the present invention attaches a plane mirror on an arc for an arbitrary irradiation range, distributes a beam from the center of the arc, and has a focal length less than the irradiation width on the workpiece, with a focal length less It is characterized by horizontal split epi-illumination. The position of each plane mirror is an angle at which each focal length is equal, and the angle from which the beam from the center is reflected perpendicularly to the workpiece. In the control, the image capturing axis of the camera is placed coaxially with the beam, the target position and type information are obtained from the image, the beam is irradiated, and the position and output operation of the beam are performed as judged from the image of the situation. Further, there is a combination of a method of previously programming position information without using a camera and the above-described image control and program control.

A variety of processing methods can be obtained by placing an objective lens and mask in the incident range on the workpiece. The mask described here has an optical path blocking function, a bending function, a condensing function, a scattering function, and a bandpass filter function selected for the workpiece.

  According to the present invention, the limitation of the beam irradiation range of the conventional swing method is removed, the stage or robot that operates at each moving point of the movement method is eliminated, and the beam is moved over a wide range at the speed of the descending method. This system has the effect that precise processing such as precise beam control by image processing and quality control by image recording can be confirmed and confirmed by placing the camera coaxially with the beam operation axis.

The beam epi-illumination according to the present invention facilitates the mask operation on the workpiece. Depending on the type of mask, the scope of application, such as soldering, drilling, cutting, and overheating, is wide by controlling the focus shape, intensity, and focusing. In the image processing associated with the apparatus, the step change of the process is improved by the signal judgment from the line and the program judgment by the image recognition, and the mixed loading line can be set by the free positioning.

It is the figure which showed the path | route of the optical path which made a beam an example. It is the front view which showed the movement and distribution of the former optical path device and an optical path. It is the top view which showed the coaxial structure of the beam, illumination, and the camera in the former optical path device. It is the side view which showed the positional relationship and mirror position of the mirror of a mirror of a mirror head. The left half of the front (1) showing the position of the outer peripheral mirror surface and the individual optical path ranges placed in an arc, the figure (2) showing the size of the mirror surface in the Y direction, the size and angle of the outer peripheral mirror surface in the X direction, It is the figure (3) which showed the optical path. It is the front left half drawing (1), side view (2), and drawing distribution position figure (3) which put the laser marker on the apparatus upper surface as an original optical path device, and set the distribution fixed mirror in the center. They are a front half drawing (1), a side view (2), and a drawing distribution position diagram (3) in which a beam is shaken by a laser marker head or a rotating mirror and a distribution fixed mirror is placed in the center. This is an example of the position and irradiation of the outer peripheral mirror surface when there are curved surfaces or irregularities other than a flat workpiece. It is combination (1) (2) (3) of sectional drawing and top view which showed the arrangement | positioning kind of an objective lens. It is the figure (1) which showed arrangement | positioning and mask shape of a beam focus mask board, and a mask top view (2). It is a figure which controls the beam by determining the melting and melting of the solder ball by detecting the deformation and loss of the bright spot by the image and image processing of the solder ball obtained from the coaxial illumination. Deformation or loss of the bright surface is represented by melting by beam irradiation using images obtained from coaxial illumination and image processing. It is a graph figure explaining soldering using the difference of the heat absorption and heat dissipation by beam control and a member. It is a flowchart of the control process of this apparatus, an inspection process, and a processing process. It is a flowchart of the focus position correction process and beam control of this apparatus. It is a top view of the apparatus which moves an objective lens on a protective glass with this apparatus. It is the top view which showed the movement width | variety which moves multiple objective lenses by gathering with this apparatus. It is the left half drawing (1) and side view (2) of the front of the apparatus which does not place an outer periphery mirror in arc shape using the parallel beam which does not converge.

A system and apparatus configuration for carrying out the present invention will be described below. This system distributes and irradiates the work surface with the same optical path length in the form shown in FIG. 2 and subsequent figures in order to finely control the movement of the focal point and the optical path (hereinafter referred to as the irradiation point) FP that has reached the work shown in FIG. I do. However, the optical path lengths in FIG. 18 are not equal. As shown in FIGS. 2 and 5, plane mirrors are arranged in an arc shape on the workpiece (hereinafter referred to as an outer peripheral mirror). The outer peripheral mirror has an optical path distance (hereinafter referred to as an optical path length) from the focal point determining mechanism to the workpiece irradiation point. Are arranged at the same position, and the angle of each of the peripheral mirrors is an angle at which the beam is incident on the workpiece. The position of the irradiation point is changed by placing and controlling a device (hereinafter referred to as a mirror head) that changes the optical path angle under the outer mirror and the optical path changed by the mirror head as shown in FIGS. There is a form in which it is reflected on the outer peripheral mirror by hitting the distribution mirror surface under the mirror. The present invention includes a form in which an objective lens and a mask are placed between a workpiece and a peripheral mirror in order to obtain a necessary effect at an irradiation point.

In this device, each function and various diagrams are simplified for the sake of explanation, but the functions and equipment described in the mask plate, counter lens, point mirror, distribution mirror surface, image processing, and control method are selected. To do. Distributive reflection described here refers to distributing a work band to each plane mirror above it and reflecting it from the mirror onto the divided area.
Although the present invention will be described with an apparatus in a vertical direction as an embodiment, the present invention includes directions other than vertical such as an upward direction and a lateral direction as a radiation direction with respect to an object. Under the peripheral mirror refers to the work direction from the peripheral mirror.

Here, “the same optical path length” refers to an optical path length that falls within the focal diameter as required at the irradiation point. When the ratio of the allowable range of the focal diameter is constant, the optical path length error when the focal diameter is small is small in proportion to the diameter. However, the optical path length when the objective lens is placed is within the required focal diameter range for the objective lens. The optical path length of the camera is the focal angle that is the angle of view of the image. Here, the error of the optical path length with respect to the objective lens is within the required focal diameter range. When a parallel beam that does not converge is used, the outer peripheral mirror does not need to be arranged in an arc shape and can be placed at a free position.

In the present invention, the device placed at the optical path position before the optical path change of the mirror head is the original optical path device. A plurality of original optical path devices can be installed by selecting a laser beam, radiated light, illumination, electron beam, radio wave, and a camera, detector, photosensor, and receiver as a receiver. However, as shown in FIGS. 6 and 7, the optical path range placed by the original optical path device when applied to the distribution mirror surface is limited to the distribution mirror surface. In addition, a liquid crystal mask or a digital mirror device (hereinafter referred to as DLP) can be added to the original optical path device.

When the original optical path device has a light receiver, the position and status of the irradiation point are grasped to facilitate control and operation. The data from the photoreceiver is converted into an image and processed, and the position of the irradiation point can be corrected through highly accurate positioning and position confirmation with respect to the workpiece. The target is recognized and the beam output is controlled. I can do it. In addition to correcting the position of the irradiation point, irradiation can be performed by changing the liquid crystal mask or DLP mask image in accordance with the surrounding image.

Using the optical path of horizontal split epi-illumination, the mask illustrated in FIG. 10 is placed on the workpiece at the position shown in FIG. 1 and FIG. 4, and the beam shape is changed at each irradiation point position and the beam intensity is partially increased or decreased. Can be set with a mask pattern. The focus is shown in FIGS. 1 and 4 by placing the objective lens illustrated in FIG. 9 on the irradiation point, thereby condensing insufficient convergence due to the long focus by condensing, and simultaneous processing of multiple focal points by dividing the optical path. Can be changed to

The apparatus of the present invention is based on vertical epi-illumination, but can irradiate the beam at an arbitrary angle by changing the angle and position of the arc mirror surface as shown in FIG. Depending on the workpiece, it is possible to irradiate the beam obliquely to the object according to the curved surface of the bottle or steel pipe or according to the mounting.

The apparatus of the present invention obtains alignment information and type information from an image as an intelligent operation by a camera image in addition to irradiation at a predetermined focal coordinate position, and irradiates the beam and judges from the image of the situation to determine the beam In order to perform the position and output operation, the camera's imaging axis is placed coaxially with the beam as shown in FIG. Furthermore, in order to obtain the effect of the image shown in FIG. 11 or FIG. The above control is exemplified in FIGS. 14 and 15.

This apparatus has the path of the beam optical path shown in FIG. 1, and a plane mirror is arranged on the workpiece in an arc shape in accordance with the assumed processing region as shown in FIG. 2, and can include FIG. 3 as the original optical path device. . However, the order of HF, FL, and SQ is arbitrary. The objective lens is inserted if necessary depending on the size of the beam focus. The long focus lens attached immediately after the beam diameter expander is not called an objective lens because it is placed in front of the reflection path. YM and XM are in the mirror head, and the Y direction of the optical path is controlled by YM, and the X direction is controlled by XM. In this apparatus, the X direction indicates the longitudinal irradiation direction, and the Y direction indicates the short irradiation direction.
In the embodiment, the description of twelve outer peripheral mirror surfaces is an optimum value in which the optical path length error is within 1 mm when the optical path length is 300 mm to 400 mm and the beam diameter is 10 mm or more on the outer peripheral mirror. Therefore, under different conditions, the outer peripheral mirror surface can be considered variously, such as 4 or 1000 instead of 12, or 2 of (1) in FIG.

As shown in FIG. 5, the plane mirrors arranged on the arc are arranged so that the focal lengths to the workpiece are equal, and the angle is set so that the beam is irradiated perpendicularly from the center of the plane mirror to the workpiece. The length of each mirror surface is the length obtained by adding the beam diameter φLB to the mirror surface after the beam is swung from the rotating mirror surface center CXP at the angle La of each outer peripheral mirror surface. The width of each outer peripheral mirror surface is Mw, and the length Lw is expressed by Equation 1. Each position of the outer periphery mirror is a position satisfying Expression 2 indicating the relationship between the optical path lengths and the width of each incident light. The mounting angle is shown in Equation 3. The calculation of the optical path length and the semi-illuminated coordinate is performed so that the position of the CXP does not obstruct the irradiation point from FIGS. 4 and 5, so that the reflection from the mirror XM and the irradiation point of the workpiece from each outer mirror surface LM The coordinates indicating the optical path length by distance and three-dimensional calculation may be calculated by computer simulation, or geometrical calculation may be performed from the viewpoint of graphics.
Except for FIG. 18, there is no particular indication of the optical path length from FIG. 1 to FIG. 8, but it is assumed that the following formulas (1), (2), and (3) hold.

As shown in FIG. 2 and FIG. 3, the method of swinging the optical path on the work surface with this apparatus controls the motor YS that rotates the vertical mirror YM and the motor XS that rotates the horizontal mirror XM below the center of the arc to control the reflection angle of the optical path. Change and do. There are two types of this device, using an electromagnetic motor, such as a galvano motor with good mobility, and an ultrasonic motor with high stopping accuracy. When adjusting the focal position more precisely by controlling the rotary mirror, there is a method in which the objective lens is placed at the incident position and the accuracy is increased according to the magnification.

In the present apparatus, the beam LB shown in FIG. 3 is arranged such that the camera, the beam, and the illumination are coaxially provided by a transmission mirror HF that reflects only the beam, a mirror EM that sends a reflected image to the camera CAM, and an illumination LED.
This axis is reflected by the mirror YM moved by the motor YS and moved in the vertical direction, and then reflected by the mirror XM moved by the motor XS and moved laterally. The image grasps the beam position and irradiation point status to facilitate control and operation. With this image processing in addition to the conventional teaching control, highly accurate positioning, position confirmation, and position correction can be performed.

Further, it is possible to control the beam output while observing the change in the irradiation state. The EM on the right in FIG. 3 peels off the mirror coating in an elliptical shape so that it can be transmitted coaxially in order to use the coaxial mirror for the camera as a point light source. The peeled shape is an ellipse in which the transmitted light is circular when tilted by 45 degrees, and the area is within 1/25 of the camera optical path area so that the received light image cannot be prevented. Moreover, you may make a hole in EM and let an optical fiber penetrate.

This device can change the size of the focal point by placing the objective lens on the workpiece. An objective lens for the workpiece can be set for each position, and it can be compensated for insufficient convergence by entering the workpiece on the workpiece. Further, by moving the objective lens, it is possible to irradiate the apparatus irradiation range without any gap. FIG. 9 shows a case where the beam position is moved within the objective lens range in accordance with the incident position of the beam and a case where the beam focal position is defined by the objective lens. When adjusting the incident position within the objective lens, the focal position with respect to the workpiece can be finely adjusted in proportion to the magnification of the objective lens. For example, when there is a 10-fold magnification, if the incident position on the top surface of the objective lens is set in units of 100 μ, it becomes 10 μ units on the workpiece. When the enlargement operation is performed with the objective lens, the control of the mirror and the image processing camera image are similarly enlarged, so that the apparatus can be directly controlled without changing the specifications of the motor and the camera.

The objective lens is placed on a protective glass at the bottom of the apparatus as shown in FIG. The objective lens is hemispherical and placed on a protective glass with a flat surface in contact. Tilt the protective glass so that the beam does not return to the mirror head. In the apparatus of the embodiment, the original optical path device is protected from reflection of the plane of the objective lens and the protective glass by tilting it by 2 degrees or more in the direction of the mirror head or the opposite side. In some cases, the protective glass and objective lens are semi-reflective and cannot be tilted. When the objective lens is moved in accordance with the optical path focus, it can be moved by a mirror head motor. Since the movement amount of the focal position is proportional to the angle change regardless of the position as shown in FIG. 5, the focal position is moved by the focal movement according to the focal movement direction. If the focal point of the objective lens and the position of the irradiation point are shifted, the irradiation point is shifted in the focal direction as shown in (1) of FIG.

Referring to FIG. 15 as an example, a support arm is attached to the objective lens, and the objective lens is moved in the X direction by a gear and a belt from the mirror head motor. In the Y direction, the objective lens is moved through a wire that does not expand and contract. The focal position of the objective lens does not need to be exactly coincident with the position of the irradiation point by the focal position correction process, and an object that easily causes an error, such as a belt or a wire, may be used. For example, even when the irradiation point is controlled in units of 10 μm, the positional accuracy of the objective lens may be in units of 1 mm. In the description of FIG. 15, the objective lens is moved by the motor of the mirror head, but another motor and a two-dimensional stage may be used.

  In FIG. 15, it is difficult to move the objective lens at high speed according to the case where the irradiation point moves from the left and right ends of the irradiation range. If there is such control, a large number of objective lenses are used. FIG. 16 shows an example in which hexagonal objective lenses are laid down and the movement width is reduced to the size of each individual lens, and the movement amount is reduced to the lens interval width by arranging them at equal intervals. In this case, move it separately from the mirror head motor. If the irradiation point position is determined in advance, the objective lens is placed in that range and the necessary range is moved or fixed. You may combine FIG. 15 and FIG.

Although this apparatus is basically based on vertical incident light, the beam can be irradiated at an arbitrary angle by changing the angle and position of the arc mirror surface as shown in FIG. (1) in FIG. 8 is a diagram in which an outer peripheral mirror is attached at an angle that is incident on the work surface at a position where the optical path length is the same with respect to a curved surface such as a glass bottle, a bottle, or a steel pipe depending on the work. (2) of FIG. 8 is a diagram in which PM is installed as a part of the outer peripheral mirror at a position where an optical beam length is the same at the irradiation position of the target beam obliquely according to mounting.

As shown in FIG. 10, this apparatus can irradiate a mask with a beam for each irradiation point position by placing a mask plate on a workpiece. The mask irradiation is to control the partial brightness and darkness of the beam illuminance by changing the shape of the beam surface at the irradiation point by projecting the mask pattern of the mask plate and by the intensity of transmission. When the cream solder mask plate is copied, the mask plate irradiates the shape at the place where the base solder is placed. The partial brightness and darkness of the beam illuminance by the mask means that the dot expression of the mask pattern in FIG. 10 represents the transmittance of the beam. When the beam is transmitted in proportion to the density of the dots, the beam energy is directly below in proportion to the density when the illuminance of the beam is constant. There are various mask patterns such as a donut shape, a rectangle shape, and a cross shape depending on the application. For example, when irradiating with a pinhole avoiding a lead, a donut shape is preferable, and irradiation of a rectangular pad can be performed without protruding using the rectangular pad.

  The mask may be refracted by a lens or glassware. In FIG. 9 (3) as an example, a prism type glass is placed and the irradiation point is divided into two. The mask plate should be made of the following materials in addition to the stainless plate. The upper surface of the glass plate through which the wavelength of the beam and the wavelength of the illumination pass is frosted and scattered and refracted so that the work is not focused. A mask pattern is formed by coating a film that passes illumination light but reflects only the beam.

As shown in FIG. 3, the apparatus of the present invention can perform intelligent operation by image by placing the image capturing axis of the camera coaxially with the beam in the original optical path device. In this operation, alignment information and type information are obtained from the image, the beam is irradiated, and the position and output operation of the beam are performed by judging from the image of the situation. The images shown in FIG. 11 and FIG. 12 utilize the property that when the illumination is placed coaxially with the photographing, the surface perpendicular to the optical axis is reflected and looks bright. Since the pads, leads, and solder balls of the electric circuit are mirror surfaces, this property is particularly prominent and the vertical surface appears to shine.

  Deformation due to melting of the solder ball and the lead is easy to be recognized and judged by image processing because the bright spot appears to change greatly with a slight inclination due to deformation using the above-mentioned properties. The beam control flow in FIG. 11 and the transition from the upper picture to the lower picture of the bright spot show this. The above control is exemplified in FIG. 14 and FIG.

A mode in which an optical path changed by a mirror head such as a laser marker as shown in FIG. 6 is applied to the distribution mirror surface below the outer mirror and reflected by the outer mirror will be described. This idea is a method in which the drawing area of the laser marker is distributed by five mirrors and reflected by a pair of outer peripheral mirrors and reflected on the same optical path length as shown in (3) of FIG. The difference between FIG. 4 and FIG. 5 is that the distribution mirror surface enters the position of CPX and that the actual optical path length is calculated from the Fθ lens. Even if the optical path length is extended according to the beam swing angle by using the Fθ lens, the same focal diameter is obtained, so the extension is added.
In (1) and (2) in FIG. 6, the inclination of the mirror surface is the same between the corresponding distribution mirror surface and the outer peripheral mirror surface. That is, LMa and ma have the same inclination, and similarly, LMb and mb, and LMc and mc have the same inclination. Although FIG. 6 is described on the left side, the apparatus is composed of five distribution mirror surfaces and five outer peripheral mirrors. With the positional configuration as shown in (1), (2), and (3) in FIG. 6 of the embodiment, the minimum optical path length can be achieved. Furthermore, this position configuration can be divided, but if the beam diameter is large, the ineffective area of the beam increases along the area divided by the distribution mirror surface, which is inefficient.

A mode in which an optical path changed by a mirror head such as a laser marker as shown in FIG. 7 is applied to a distribution mirror surface under the outer mirror and reflected by the outer mirror will be described. The configuration of FIG. 7 explains that the efficiency is better when there is little division by the distribution mirror surface in the explanation of FIG. 6 above, so this idea was developed to take a Fθ lens and take a wider drawing area for the distribution mirror surface, and adjust the optical path length to the outer peripheral mirror surface. It is an example which adjusts by multiple division of. With the position configuration as shown in FIGS. 7A, 7B and 7C of the embodiment, the minimum optical path length can be achieved.

The peripheral mirror shown in FIG. 18 when the non-converging beam is used does not need to be arranged in an arc shape and can be placed at a free position. Since processing cannot be performed with a beam that does not converge, an objective lens or mask is placed to converge. Since the peripheral mirror is not placed in an arc shape, the condition of Equation 2 described above is lost, and the proportional relationship between the angle and the irradiation point position does not hold, and the optical path distance changes at each position of the peripheral mirror. Since the operation of the objective lens in FIG. 15 does not hold, it is moved separately from the mirror head motor. In order to appropriately control the apparatus, a correlation table (hereinafter referred to as a coordinate angle / distance correlation table) of the irradiation point position corresponding to each peripheral mirror, the control mirror angle of the mirror head, and the optical path distance is created. Based on this, coordinates are calculated from the control command, and the position of the objective lens, the reduction and enlargement of the image, and the focus position correction process are performed by a microcomputer or the like.

The creation of the coordinate angle / distance correlation table involves mounting errors between the peripheral mirror, camera, and mirror head, so add a length measuring device to the original optical path device and set the mirror head angle based on the camera image for each required irradiation point position. The optical path distance is recorded and a correlation table is created. The creation of this correlation table is also created and used in the case of obtaining the above control accuracy even in apparatuses other than FIG.

In the apparatus and system of the present invention, a liquid crystal mask or a digital mirror device (commonly called DLP) is placed between HF and before HF in FIG. 1 to expose or burn images, characters, or patterns at the irradiation point. I can do it. As a result, compared with drawing with a laser marker, marking of a character string, a pattern, a mark, and a cipher pattern can be performed at a high speed over a wide range. In addition, a fine circuit can be exposed on the panel with high definition according to the focal diameter. This can also be changed according to the focal position while confirming the drawing pattern since the irradiation point and the surrounding area can be taken as an image. As a result, different circuits and image patterns can be exposed for each irradiation point position combined at successive irradiation point positions. For example, a circuit or image drawn with 1000 × 1000 pixels is connected 100 times to expose a large screen of 10,000 × 10000 pixels. it can.

Since the feature of this apparatus is high-speed processing at a large number of positions, the availability will be described below. This device can replace the laser soldering on the mounting line of an electric manufacturer with a cream solder system with high efficiency. Mass production of many LED electrodes with many jumping pins can be performed by manual soldering or soldering robots.

Since this apparatus can perform processing in a wide width without processing in a narrow range as in the prior art, it is suitable for drilling, welding, sealing, and inspection of solar power boards, sheets having a width of 300 mm or more, and panels.

By reducing or eliminating the movement of the stage, it is suitable for inspection and processing of containers, films, culture plates, and immersion liquids with large liquids. Suitable for high-speed processing at many positions in the human body, animals, and plants that are difficult to fix and move to any position.

With this flexible sheet circuit processing, a large number of drilling, welding, cutting, and soldering can be performed at high speed without cutting the roll sheet as it is after the etching.

  This device is suitable for measurement and processing of objects that are installed on and in the flow of gas or liquid and that pass widely. For example, the measurement of drifting objects in the river and the measurement of fish are performed, and selective deletion is performed.

This device uses a mask for the original optical path device and can perform beam exposure over a large area as required, so that patterns and characters can be exposed on liquid crystal panels, solar cell panels, sheets, panels, clothes fabrics, foods, and packaging containers.

CAM camera
CXP Horizontal axis mirror rotation center
CYP vertical axis mirror rotation center
DG protective glass plate
EL beam expander
Coaxial mirror for EM camera
FP beam focal position or optical path focal position on the workpiece
FL beam focus lens
H height
HF beam only reflector
LA Arc-shaped mirror support arm
LB beam and output machine
LM Peripheral mirror
LED work lighting
MB mask board
MP mask pattern
OL objective lens
PM point mirror
R Distance from rotating mirror to LM
SQ beam aperture
SW irradiation area
W Work
XM Horizontal movable mirror
XS horizontal motor
XW X direction movement width (longitudinal direction)
YM vertical axis movable mirror
YW Y direction travel width (short direction)
YS vertical axis motor
Ma Tilt angle of mirror arranged in arc
La beam tilt angle
Lw beam swing
Ra Beam swing angle bp Divided width ΦLB of arc mirror surface with respect to workpiece Beam diameter mc hitting it Distributing mirror central mirror mb Distributing mirror left and right middle mirror ma Distributing mirror left and right end mirror LMc Distributing mirror mc Central outer peripheral mirror LMb Distributing Left and right middle outer peripheral mirror LMa corresponding to the mirror mb Left and right end outer peripheral mirror corresponding to the distribution mirror ma

Claims (10)

In order to irradiate the convergent beam to a wide range of arbitrary positions, use a plurality of plane mirror surfaces that are arranged at positions where the optical path length is changed by changing the direction of the optical path on the movable mirror surface, and the original optical path device is placed on the same axis of the optical path. An apparatus having a method for processing and measuring an object. 2. An apparatus according to claim 1, wherein each of the optical path lengths is equal with an error within twice the optical path focal diameter, and each of the allocated episcopic spreads is used within 10 degrees. By measuring the position of the object over a wide range and changing the object by using the direct reflection of the curved surface of the object and the direct reflection of the object by the illumination coaxial with the camera and the fact that the other parts are scattered and dark and the contrast becomes clear. A device that has a method to capture and control the position and output of the beam. An apparatus having a method of masking a mask having a function of blocking an optical path, bending, condensing, scattering, and bandpass filter at a plurality of locations.   Added a method to control the irradiation point with an objective lens, which has a method of processing and measuring the target by placing the original optical path device on the same axis as the pre-distribution optical path in a device that uses a plurality of flat mirror surfaces arranged on each of them to reflect the beam. apparatus.   A device that has the function to select various devices to the original optical path device in this device. In order to control the convergent beam by reflecting it to any position within the wide band area, the optical path range of the laser marker is divided by 5 distribution mirror surfaces and each of the allocated optical path lengths is arranged at the same position. An apparatus having a method of processing an object using a plane mirror surface. In order to control the convergent beam on a wide range of arbitrary positions, the optical path is distributed by the distribution mirror surface, and a plurality of plane mirror surfaces arranged at positions where the optical path lengths are equal to each other are used, and the original optical path is coaxial with the optical path before the distribution. An apparatus having a method for processing and measuring a target by placing a vessel.   Using a plurality of plane mirror surfaces arranged so as to reflect the distributed non-convergent parallel beams, and having a method of processing and measuring by placing an original optical path device coaxially with the optical path before distribution and controlling the irradiation point with an objective lens apparatus. The apparatus which has the method of moving and measuring the arbitrary range on a workpiece | work by moving an objective lens in Claim 5 and Claim 9.

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