JP2011097326A - Speaker, electronic apparatus and mobile phone employing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a speaker that has superior mountability to small audio equipment and a mobile phone or the like, and achieves thickness reduction. <P>SOLUTION: The speaker is configured such that the connections between a terminal and a lead wire of a voice coil are provided outside from the periphery of a diaphragm by constituting the outer shape of the speaker of either of a rectangle or a square, coupling the terminal to a resin frame by insertion molding, and constituting the terminal by lacking part of the outer shape of the resin frame, projecting the part so as to be settled in the outer shape of the speaker from a sidewall part of a lacked missing part, and connecting the lead wire of the voice coil to a projected projection part, and the thickness reduction is achieved for dimensions of components arranged outside from the outer periphery of the diaphragm by excluding material thickness dimensions of the terminal, outline diameter dimensions of the lead wire of the voice coil, material thickness dimensions of a coupling medium such as soldering when the terminal is coupled to the lead wire of the voice coil, and furthermore, material thickness dimensions of a strengthening agent to be applied to a connection of the lead wire from overall height dimensions of the speaker. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a loudspeaker used for various audio equipments and mobile phones.

  In recent years, in addition to the enhancement of functions of small audio equipment and mobile phones, further miniaturization, thinning, and downsizing have been demanded from the market in order to pursue further ease of use and portability. .

  In response to such market backgrounds, the market demands further miniaturization, thinning, and compactness of compact speakers and receivers used in compact audio equipment and mobile phones. Has been.

  Due to the need to ensure the sound pressure level of speakers and receivers in the market demands for miniaturization, thinning, and compactness, reducing the diaphragm area is not a good development direction. Therefore, making the shape other than a circle, such as a rectangle, a square, or a track shape, is very effective for mounting on a small acoustic device or a mobile phone.

  In addition, there is a difficulty in designing input-resistant design for thinning, but it is not necessary to reduce the area of the diaphragm, and the marketability is very high because it can be easily mounted on small acoustic devices and mobile phones. strong.

  Hereinafter, a conventional small speaker for a mobile phone will be described as an example.

  FIG. 4 is a plan view of a conventional small speaker for a mobile phone, and FIG. 5 is a sectional view thereof.

  Since the diaphragm is transparent, it does not appear in the plan view, and the lower part of the diaphragm is seen through.

  As shown in FIGS. 4 and 5, a magnet 1 and an upper plate 2 are coupled to a yoke 3 of a resin frame 6 in which a yoke 3 and a terminal 10 are insert-molded to form an internal magnet type magnetic circuit 4, and this magnetic circuit The voice coil 8 is inserted into the magnetic gap 5, the lead wire 11 of the voice coil 8 is drawn to the terminal 10 on the back surface of the diaphragm 7, and connected to the periphery of the voice coil 8 and the resin frame 6. The diaphragm 7 was bonded.

  As prior art document information relating to the invention of this application, for example, Patent Document 1 and Patent Document 2 are known.

JP 2002-209295 A JP 2002-354582 A

  However, in the conventional speaker as shown in FIGS. 4 and 5, the overall height is determined by the thickness of each component and the amplitude stroke of the vibration component.

  That is, since each component is stacked, the thickness of the magnetic circuit 4 and the resin frame 6, the thickness of the terminal 10 provided on the resin frame 6, and the lead of the voice coil 8 disposed on the terminal 10. The outer diameter of the wire 11, the thickness of the solder when the terminal 10 and the lead wire 11 of the voice coil 8 are joined, the thickness of the reinforcing agent for covering and reinforcing the solder portion, and the reinforcing agent and vibration It is determined by the amplitude stroke size between the plate 7 and the material thickness size of the diaphragm 7.

  Further, for a type of speaker that requires a protector for protecting the diaphragm 7, the amplitude stroke dimension between the protector and the diaphragm 7 and the thickness of the protector are also required.

  As described above, in the conventional speaker, it is necessary to set the overall height of the speaker in consideration of many components and amplitude strokes, so that it is very difficult to realize a thin market demand. I had it.

  An object of the present invention is to solve such a problem and to propose a speaker that can be mounted on a small acoustic device, a mobile phone or the like and can be thinned.

  In order to achieve this object, a speaker according to the present invention comprises a resin frame coupled to a magnetic circuit, a diaphragm coupled to the resin frame, a diaphragm coupled to the diaphragm, and a part of the magnetic gap of the magnetic circuit. The speaker is composed of a voice coil and terminals connected to the resin frame. The external shape of the speaker is either rectangular or square, and the terminals are connected to the resin frame by insert molding. The terminals are resin frames. A part of the outer shape of the speaker is chipped off, and protruded from the side wall portion of the chipped portion of the chipped portion so as to be within the outer shape of the speaker, and the lead wire of the voice coil is connected to the projecting portion thus projected. Is.

  By adopting this configuration, the connection between the terminal provided on the inner peripheral portion of the diaphragm and the lead wire of the voice coil is provided outside the outer peripheral portion of the diaphragm, so that the material thickness of the terminal and the voice coil The outer diameter dimensions of the lead wires and the thickness of the bonding medium such as soldering when they are joined, as well as the thickness of the reinforcing agent applied to the lead wire connection, can be removed from the overall height of the speaker. Therefore, it is possible to reduce the thickness by the size of the parts arranged outside the outer peripheral portion of these diaphragms.

  In addition, the terminal is configured to protrude from the side wall portion of the defective portion in which a part of the outer shape of the resin frame is lost to fit within the outer shape of the speaker, and the lead wire of the voice coil is connected to the protruded protruding portion. Therefore, the external dimensions of the speaker as viewed from above do not protrude from the original rectangular or square shape of the speaker, and the mounting property to an acoustic device, a mobile phone, or the like is improved.

  By adopting the configuration of the speaker of the present invention, there is an effect that the mountability to a small acoustic device, a mobile phone, or the like is improved and the thickness can be reduced.

  Further, by connecting the terminal to the resin frame by insert molding, it is possible to improve productivity and improve the connection reliability between the resin frame and the terminal.

  Furthermore, by providing the connection between the terminal and the voice coil lead wire outside the outer periphery of the diaphragm instead of the inner periphery of the diaphragm, foreign matter such as solder scraps and welding scraps on the magnetic gap, and further lead The reinforcing agent applied to the connecting portion of the wire can be prevented from entering, and the gap defect rate can be reduced.

The top view of the speaker in one embodiment of this invention Sectional drawing of the speaker in one embodiment of this invention Sectional drawing of the electronic device in one embodiment of this invention Plan view of a conventional speaker Cross-sectional view of a conventional speaker

(Embodiment 1)
Hereinafter, the structure of the speaker in the present embodiment will be described with reference to the drawings.

  FIG. 1 is a plan view of a small speaker for a cellular phone according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view thereof.

  Since the diaphragm is transparent, it does not appear in the plan view, and the lower part of the diaphragm is seen through.

  1 and 2, a magnet 21 and an upper plate 22 are coupled to a yoke 23 of a resin frame 26 in which a yoke 23 and a terminal 30 are insert-molded to form an inner magnet type magnetic circuit 24. The voice coil 28 is inserted into the gap 25, the lead wire 31 of the voice coil 28 is routed to the terminal 30 provided on the outer periphery of the diaphragm 27, and the diaphragm 27 is attached to the periphery of the voice coil 28 and the resin frame 26. The lead wire 31 of the voice coil 28 and the terminal 30 are connected and bonded.

  If necessary, the connecting portion of the lead wire 31 and the terminal 30 is protected by applying a reinforcing agent to the connecting portion of the lead wire.

  Here, the terminal 30 causes the two corners of the rectangular outer shape of the resin frame 26 to be lost, and the terminal 30 protrudes from the side wall portion of the lost defect so as to fit within the outer shape of the speaker. The lead wire 31 of the voice coil 28 is connected to the protruding portion.

  The terminal 30 opposite to the end where the lead wire 31 of the voice coil 28 is connected is configured as a spring terminal for supplying power to an electronic device such as a mobile phone.

  Of course, the opposite side portion may be eliminated, and the end of the terminal 30 connected to the lead wire 31 of the voice coil 28 may be shared as a terminal for supplying power to an electronic device such as a mobile phone.

  Although the outer shape of the resin frame 26 has been described as a rectangle here, it may be a square.

  As shown in the figure, the positions where the terminals 30 are provided at two corners of a rectangular shape or a square shape have a great effect on promoting miniaturization and compactness.

  Furthermore, when the positions where the terminals 30 are provided are two corners of a rectangular or square outer shape, and the speaker outer shape is rectangular, the outer shape of the diaphragm should be a track shape, or the speaker outer shape When the shape is square, the outer shape of the diaphragm is circular, so that the terminal 30 can be provided at a position where the diaphragm is not originally present, and the effect of miniaturization and compactness can be further enhanced.

  Further, even when the outer shape of the diaphragm 27 is a rectangular shape or a square shape, the corners of the four normal vibration plates are somewhat rounded or rounded to improve the amplitude characteristics of the diaphragm 27. From this point of view, it is very effective that the positions where the terminals 30 are provided are the two corners of the rectangular shape or the square shape, and the two corners where the terminals 30 are provided are If the speaker does not protrude from the rectangular or square outer shape, it will not hinder mounting on a mobile phone or the like.

  And any two corners may be selected as the two corners among the four corners.

  Here, by connecting the lead wire 31 of the voice coil 28 and the terminal 30 within the entire height range of the resin frame 26, the speaker can be made thinner without adding extra thickness. Is effective.

  Further, by connecting the lead wire 31 of the voice coil 28 and the terminal 30 by soldering, a simple facility can be produced without providing a large facility.

  Even if the solder that is the coupling medium between the lead wire 31 of the voice coil 28 and the terminal 30 rises to some extent, the coupling portion of the lead wire 31 of the voice coil 28 and the terminal 30 is arranged outside the outer peripheral portion of the diaphragm 27. In addition, since it protrudes from the side wall portion of the resin frame 26, there are no other components, and the rising dimension of the solder can be easily accommodated within the range of the total height of the resin frame 26.

  In addition, when the lead wire 31 of the voice coil 28 and the terminal 30 are connected by welding, materials such as solder can be reduced, productivity can be improved, and conduction defects such as tunnel solder can be improved. Can also be prevented.

  Furthermore, even when the lead wire 31 of the voice coil 28 and the terminal 30 are connected by thermocompression bonding, the material such as solder can be reduced, the productivity can be improved, and the conduction such as tunnel solder can be improved. Defects can also be prevented.

  The above-described soldering, welding, and thermocompression are all accompanied by heat generation. However, since the terminal 30 protrudes from the side wall portion of the resin frame 26, the lead wire connection portion includes other parts. This part is not present, the heat generation does not adversely affect other parts, and the influence on the resin frame 26 can be minimized.

  As described above, by adopting the configuration of the present application, the connection between the terminal provided on the inner peripheral portion of the diaphragm and the lead wire of the voice coil outside the outer peripheral portion of the diaphragm is provided. The total thickness of the loudspeaker is determined by the thickness and the outer diameter of the lead wire of the voice coil, the material thickness of the bonding medium such as soldering when they are joined, and the material thickness of the reinforcing agent applied to the connection portion of the lead wire. Therefore, the thickness can be reduced by the size of the parts arranged outside the outer peripheral portion of these diaphragms.

  Furthermore, the terminal is configured to protrude from the side wall portion of the defective portion in which a part of the outer shape of the resin frame is lost to fit within the outer shape of the speaker, and the lead wire of the voice coil is connected to the protruded protruding portion. Therefore, the external dimensions of the speaker as viewed from above do not protrude from the original rectangular or square shape of the speaker, and it is possible to achieve good mountability to an acoustic device, a mobile phone, or the like.

  Further, by connecting the terminal to the resin frame by insert molding, it is possible to improve productivity and improve the connection reliability between the resin frame and the terminal.

  Furthermore, by providing the connection between the terminal and the voice coil lead wire outside the outer periphery of the diaphragm instead of the inner periphery of the diaphragm, foreign matter such as solder scraps and welding scraps on the magnetic gap, and further lead The reinforcing agent applied to the connecting portion of the wire can be prevented from entering, and the gap defect rate can be reduced.

(Embodiment 2)
Hereinafter, the present invention will be described using the second embodiment.

  FIG. 3 is a cross-sectional view of a main part of a mobile phone which is an electronic apparatus according to an embodiment of the present invention.

  As shown in FIG. 3, a mobile phone 80 is configured by mounting any one speaker 35 of the present invention.

  Here, as a configuration of the cellular phone 80, components such as the speaker 35, the electronic circuit 40, the liquid crystal display 60, and the like are mounted inside the exterior case 70 to constitute a main part of the cellular phone 80.

  With this configuration, it is possible to reduce the thickness, size, and size of an electronic device such as a mobile phone equipped with the speaker while realizing a reduction in the thickness of the speaker.

  In addition, the performance and quality such as improvement of productivity and reduction of the defective rate can be greatly improved.

  Although the present embodiment has described an example in which the electronic device is mounted on a mobile phone that is a mobile communication device, the present invention is not limited to this, and video devices such as portable game machines, portable navigation devices, and televisions. It may be.

  That is, the present invention can be applied to all electronic devices equipped with speakers.

  The present invention can be applied to a small electronic device such as a speaker that needs to be thin and a mobile phone equipped with the speaker.

DESCRIPTION OF SYMBOLS 1 Magnet 2 Upper plate 3 Yoke 4 Magnetic circuit 5 Magnetic gap 6 Resin frame 7 Diaphragm 8 Voice coil 10 Terminal 11 Lead wire 21 Magnet 22 Upper plate 23 Yoke 24 Magnetic circuit 25 Magnetic gap 26 Resin frame 27 Diaphragm 28 Voice coil 30 Terminal 31 Lead wire 35 Speaker 40 Electronic circuit 60 Liquid crystal display 70 Exterior case 80 Mobile phone

Claims (9)

 A resin frame coupled to the magnetic circuit, a diaphragm coupled to the resin frame, a voice coil coupled to the diaphragm, a part of which is disposed in the magnetic gap of the magnetic circuit, and the resin frame A speaker composed of coupled terminals, wherein the speaker has an outer shape of either a rectangle or a square, and a terminal is coupled to the resin frame by insert molding, and the terminal is one of the outer shapes of the resin frame. A speaker in which a part is lost, protruded from the side wall of the lost part so as to be within the outer shape of the speaker, and a lead wire of the voice coil is connected to the protruding part. The speaker according to claim 1, wherein the outer shape of the diaphragm is a track shape when the outer shape of the speaker is a rectangle. The speaker according to claim 1, wherein the outer shape of the diaphragm is a circular shape when the outer shape of the speaker is a square. The speaker according to claim 1, wherein the connection between the lead wire and the terminal of the voice coil is accommodated within the entire height range of the resin frame. The speaker according to claim 1, wherein the connection of the lead wire and the terminal of the voice coil is performed by soldering. The speaker according to claim 1, wherein the voice coil lead wire and the terminal are joined by welding. The speaker according to claim 1, wherein the voice coil lead wire and the terminal are joined by thermocompression bonding. The electronic device carrying the speaker as described in any one of Claims 1-7. A mobile phone equipped with the speaker according to any one of claims 1 to 7.

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