JP2011093113A - Device and method for manufacturing laminated substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently manufacture a high-quality laminated substrate by favorably smoothing a resin layer from which a support layer is exfoliated by a simple structure and a step. <P>SOLUTION: A device 20 for manufacturing includes an attachment mechanism 46 obtaining an attachment substrate 24a by sticking a photosensitive web 22 to a glass substrate 24, an exfoliation mechanism 114 obtaining the laminated substrate 112 by exfoliating a base film 26 from the attachment substrate 24a, and a pressing roller mechanism 120 pressed to a resin layer surface 124 from which the base film 26 is exfoliated, and smoothing a recessed/protruded shape of the resin layer surface 124 by moving relatively to the laminated substrate 112. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  In the present invention, a laminate in which a support layer and at least one resin layer are laminated is bonded to the substrate such that the resin layer side faces the substrate, and then the support layer is peeled from the resin layer. The present invention relates to a multilayer substrate manufacturing apparatus method and a manufacturing method for manufacturing a multilayer substrate.

  For example, a liquid crystal panel substrate, a printed wiring substrate, and a PDP panel substrate are configured by attaching a photosensitive sheet (photosensitive web) having a photosensitive resin (photosensitive material) layer to the substrate surface. In the photosensitive sheet body, a photosensitive resin layer and a protective film are sequentially laminated on a flexible plastic support.

  Therefore, a pasting apparatus used for pasting this type of photosensitive sheet body usually transports a substrate such as a glass substrate or a resin substrate spaced apart by a predetermined distance, and also protects the protective film from the photosensitive sheet body. After peeling off, a method of sticking a photosensitive resin layer to the substrate is employed.

  For example, in the dry resist film laminating method disclosed in Patent Document 1, as shown in FIG. 9, a substrate preheating unit, a laminating unit, a substrate cooling unit, a substrate film cutting unit, and a film removing unit are provided on the substrate 1. They are sequentially arranged along the transport direction. The substrate 1 is heated to a predetermined temperature by the preheating heater 2 of the substrate preheating portion, and then sent to the laminating portion.

  A pair of laminating rollers 3a and 3b are disposed in the laminating section, and since the substrate 1 and the dry resist film 4 are sent between the laminating rollers 3a and 3b, the dry resist film 4 is the substrate 1. It is thermocompression bonded to. The dry resist film 4 has a cover film 5 previously peeled off, and a resist layer (not shown) is thermocompression bonded toward the substrate 1 side.

  Further, the substrate 1 to which the dry resist film 4 is thermocompression bonded is sent to the substrate cooling unit via the transport roller 6 and cooled via the substrate cooling means 7. When the dry resist film 4 is cooled by the substrate cooling unit, the resist layer of the dry resist film 4 is cured and the adhesion with the substrate 1 is improved. Therefore, when the dry resist film 4 is cut at the next stage on-substrate film cutting portion, the resist layer is prevented from being peeled off by the cutting stress.

  Next, the dry resist film 4 connecting the substrates 1 is cut by the on-substrate film cutting means 8 provided with a cutter at the on-substrate film cutting section, and the substrate 1 is sent to the film removing section. Yes. In this film removing unit, after the substrate 1 is reheated by the heating roll 9, the dry resist film 4 between the cut surfaces formed by connecting the substrates 1 via the film peeling means 10 and formed in the cutting step is obtained. It has been removed from the substrate 1.

JP-A-8-183146

  In the above prior art, when the dry resist film 4 is peeled from the substrate 1, protrusions (fluff) are likely to occur in the resist layer. In particular, the occurrence of protrusions is prominent at the front and rear ends in the web conveyance direction to which the substrate 1 from which the dry resist film 4 has been peeled off is attached.

  By the way, for example, in the proximity exposure method, a mask pattern is projected directly by irradiating parallel light with a predetermined distance (gap) between the mask and the substrate to be exposed, and an exposure process is performed on the resist layer. Is going. This predetermined distance is normally set to 160 μm.

  However, if protrusions of 160 μm or more are generated in the resist layer, the protrusions easily adhere to the mask, and there is a problem that the protrusions enter the exposure range and cause exposure failure. .

  The present invention solves this type of problem, and with a simple configuration and process, the resin layer from which the support layer has been peeled can be smoothly smoothed, and a high-quality multilayer substrate can be efficiently produced. It is an object of the present invention to provide a manufacturing apparatus and a manufacturing method for a laminated substrate.

  The apparatus for manufacturing a laminated substrate according to the present invention obtains a bonded substrate by adhering a laminated body in which a support layer and at least one resin layer are laminated to the substrate so that the resin layer side faces the substrate. An affixing mechanism, a peeling mechanism for peeling the support layer from the resin layer to obtain a laminated substrate, a pressure bonding to the resin layer from which the support layer has been peeled, and moving relative to the laminated substrate A pressure roller mechanism for flattening the uneven shape of the resin layer.

  The pressure roller mechanism includes a pair of roller members disposed on both surfaces of the laminated substrate and an elastic member that urges the pair of roller members in a direction close to each other and pressurizes the resin layer with the pair of roller members. It is preferable to comprise.

  Further, the pair of roller members is preferably a non-adhesive rubber roller.

  Furthermore, the pair of roller members is preferably a rubber roller having a rubber hardness of 50 to 80.

  Moreover, it is preferable that a pair of roller member has a crown shape with a peak in the axial center.

  Furthermore, it is preferable that the pair of roller members and the laminated substrate move relatively at a speed of 26 cm / sec or less.

  Furthermore, it is preferable that the pair of roller members sandwich the laminated substrate with a pressing force of 0.4 MPa or more.

  Also, in the method for manufacturing a laminated substrate according to the present invention, a laminated body in which a support layer and at least one resin layer are laminated is bonded to the substrate so that the resin layer side faces the substrate. A step of peeling the support layer from the resin layer to obtain a laminated substrate, a pressure roller mechanism is pressure-bonded to the resin layer from which the support layer has been peeled, and the pressure roller mechanism and the laminated substrate To relatively flatten the uneven shape of the resin layer.

  In the present invention, after the support layer is peeled from the resin layer, the pressure roller mechanism and the laminated substrate are relatively moved in a state where the pressure roller mechanism is pressure-bonded to the resin layer. For this reason, the uneven shape formed by peeling of the support layer of the resin layer is satisfactorily flattened, and a high-quality laminated substrate can be efficiently manufactured with a simple configuration and process. Therefore, the resin layer does not adhere to the mask during the exposure process, and a good exposure process is reliably performed.

It is a schematic block diagram of the manufacturing apparatus which concerns on embodiment of this invention. It is sectional drawing of the elongate photosensitive web used for the said manufacturing apparatus. It is explanatory drawing of the state by which the adhesive label was adhere | attached on the said elongate photosensitive web. It is a schematic perspective view of the pressure roller mechanism constituting the manufacturing apparatus. It is a schematic front explanatory view of the pressure roller mechanism. It is a relation explanatory drawing of spring strength and a nip band. It is a relation explanatory drawing of the above-mentioned spring strength and contact pressure. It is explanatory drawing of the height fluctuation | variation before and behind crimping | compression-bonding. It is explanatory drawing of the lamination method of the dry resist film of patent document 1. FIG.

  As shown in FIG. 1, the laminated substrate manufacturing apparatus 20 according to the first embodiment of the present invention is a long photosensitive in a manufacturing process of a printed wiring board, a liquid crystal, a PDP, an organic EL color filter, or the like. An operation of thermally transferring a photosensitive resin layer 29 (described later) of the web 22 to the glass substrate 24 is performed.

  As shown in FIG. 2, the photosensitive web 22 used in the manufacturing apparatus 20 includes a flexible base film (support layer) 26, a cushion layer (thermoplastic resin layer) 27, an intermediate layer (oxygen barrier film) 28, The photosensitive resin layer 29 and the protective film 30 are laminated. The photosensitive web 22 may be composed of a base film 26, a photosensitive resin layer 29, and a protective film 30.

  The base film 26 is formed of polyethylene terephthalate (PET), the cushion layer 27 is formed of ethylene and vinyl oxide copolymer, the intermediate layer 28 is formed of polyvinyl alcohol, and the photosensitive resin layer 29 is alkali-soluble. The protective film 30 is formed of polyethylene, polypropylene, or the like, and is formed of a colored photosensitive resin composition containing a binder, a monomer, a photopolymerization initiator, and a colorant.

  As shown in FIG. 1, the manufacturing apparatus 20 accommodates a photosensitive web roll 22a in which a photosensitive web 22 is wound in a roll shape, and a web feed mechanism 32 that feeds the photosensitive web 22 from the photosensitive web roll 22a. Then, a half-cut mechanism 36 for forming a half-cut portion 34 that can be cut in the width direction and an adhesive label 38 (see FIG. 3) are bonded to the protective film 30 on the fed-out protective film 30 of the photosensitive web 22. A label adhering mechanism 40.

  Downstream of the label adhering mechanism 40, a reservoir mechanism 42 for changing the photosensitive web 22 from tact feeding to substantially continuous feeding, and a protective film for peeling the protective film 30 from the photosensitive web 22 at a predetermined length interval. A peeling mechanism 44, a heating mechanism 45 that transports the glass substrate 24 to a pasting position in a state where the glass substrate 24 is heated to a predetermined temperature, and a photosensitive resin layer 29 exposed by the peeling of the protective film 30 are pasted to the glass substrate 24. An affixing mechanism 46 is provided. The laminated body in which the photosensitive web 22 is bonded to the glass substrate 24 by the bonding mechanism 46 is hereinafter referred to as a bonded substrate 24a.

  An inter-substrate web cutting mechanism 48 for cutting the photosensitive web 22 between the glass substrates 24 is disposed downstream of the attaching mechanism 46. Upstream of the inter-substrate web cutting mechanism 48, a web cutting mechanism 48a used at the start of operation and at the end of operation is provided.

  In the vicinity of the downstream side of the web feed mechanism 32, a joining base 49 for joining the rear end of the photosensitive web 22 that has been substantially used and the tip of the photosensitive web 22 that is newly used is disposed. A film end position detector 51 is disposed downstream of the joining base 49 in order to control the deviation in the width direction due to the winding deviation of the photosensitive web roll 22a.

  The half-cut mechanism 36 is disposed downstream of the roller pair 50 for calculating the roll diameter of the photosensitive web roll 22a accommodated and wound in the web feed mechanism 32. The half-cut mechanism 36 includes a rotating round blade (cutter) 54 that is movable back and forth in a direction orthogonal to the conveyance direction (arrow A direction) of the photosensitive web 22.

  As shown in FIG. 2, the half-cut portion 34 needs to cut at least the protective film 30, and in practice, the photosensitive resin layer 29 to the intermediate layer 28 are cut to securely cut the protective film 30. In addition, the cutting depth of the rotating round blade 54 is set.

  The label bonding mechanism 40 supplies an adhesive label 38 that connects the peeling portion 30aa on the front side of the peeling side and the peeling portion 30ab on the back side of the peeling side in order to leave the remaining portion 30b of the protective film 30 correspondingly between the glass substrates 24. . As shown in FIG. 2, the protective film 30 has a remaining portion 30 b sandwiched between the first peeled portion 30 aa and the later peeled portion 30 ab.

  As shown in FIG. 1, the label adhering mechanism 40 includes adsorbing pads 58a to 58g to which a maximum of seven adhering labels 38 can be attached at predetermined intervals, and the adhering labels by the adsorbing pads 58a to 58g. At the attachment position 38, a pedestal 59 for holding the photosensitive web 22 from below is disposed so as to be movable up and down.

  The reservoir mechanism 42 absorbs the difference in speed between the tact conveyance of the upstream photosensitive web 22 and the continuous conveyance of the downstream photosensitive web 22, but in order to further prevent fluctuations in tension, the reservoir mechanism 42 is a oscillating duplex unit. It is preferable to provide a dancer 61 composed of the roller 60.

  The protective film peeling mechanism 44 is disposed downstream of the reservoir mechanism 42, and includes a suction drum 62 and a peeling roller 64 that contacts the suction drum 62 with the photosensitive web 22 interposed therebetween. The protective film 30 that is peeled off from the photosensitive web 22 at an acute peeling angle via the peeling roller 64 is wound around the protective film winding shaft 66 except for the remaining portion 30b. The protective film take-up shaft 66 is connected to, for example, a torque motor 68 in order to apply a predetermined tension to the protective film 30.

  A tension control mechanism 76 that can apply tension to the photosensitive web 22 is disposed on the downstream side of the protective film peeling mechanism 44. The tension control mechanism 76 includes a cylinder 78, and the tension of the photosensitive web 22 with which the tension pickup roller 80 is slidably contacted can be adjusted by oscillating and displacing the tension pickup roller 80 under the driving action of the cylinder 78. is there. The tension control mechanism 76 may be used as necessary, and can be deleted.

  The heating mechanism 45 includes a transport mechanism 84 for transporting the glass substrate 24 in the direction of arrow C and a plurality of heating furnaces 86, and the transport mechanism 84 has a plurality of resin disk shapes arranged in the direction of arrow C. A conveyance roller 88 is included.

  The affixing mechanism 46 is provided with rubber rollers 90a and 90b for laminating that are arranged vertically and heated to a predetermined temperature. The backup rollers 92a and 92b are in sliding contact with the rubber rollers 90a and 90b, and the backup roller 92b is pressed toward the rubber roller 90b via the roller clamp portion 94.

  In the vicinity of the rubber roller 90a, a contact prevention roller 96 for preventing the photosensitive web 22 from contacting the rubber roller 90a is disposed. The contact prevention roller 96 is movable via an actuator (not shown).

  A film transport roller 98a and a substrate transport roller 98b are disposed between the attaching mechanism 46 and the inter-substrate web cutting mechanism 48. A transport system 110 in which a plurality of rollers 110 a are arranged is provided on the downstream side of the inter-substrate web cutting mechanism 48. At the end of the conveyance system 110 in the direction of arrow C (downstream), a peeling mechanism 114 that peels the base film 26 from the attachment substrate 24a to obtain the laminated substrate 112 is disposed.

  The peeling mechanism 114 includes a pair of chucks 116a and 116b that can move via an actuator (not shown). The chucks 116a and 116b can be adjusted to positions where both sides of the base film 26 projecting outward from both ends in the transport direction of the glass substrate 24 constituting the bonded substrate 24a can be gripped. Below the chucks 116a and 116b, a plurality of suction pads 118 are disposed to suck and hold the glass substrate 24 of the bonded substrate 24a.

  A pressure roller mechanism 120 is disposed downstream of the peeling mechanism 114. As shown in FIGS. 4 and 5, the pressure roller mechanism 120 includes a pair of roller members 122 a and 122 b disposed on at least one end side of the laminated substrate 112 and a direction in which the roller members 122 a and 122 b are close to each other. And an elastic member, for example, a spring 126, that presses the resin layer surface (cushion layer 27, etc.) 124 from which the base film 26 has been peeled off by the roller members 122a and 122b.

  The roller members 122a and 122b have shaft portions 130a and 130b supported by the wall portion 128, respectively. Brackets 132a and 132b are provided on the shaft portions 130a and 130b, and a spring 126 is interposed between the brackets 132a and 132b to pull the brackets 132a and 132b toward each other.

  Non-adhesive rubber rollers 134a and 134b are rotatably provided at the tip portions of the shaft portions 130a and 130b. The non-adhesive rubber rollers 134a and 134b are made of, for example, a silicone rubber roller, and have a crown shape with a peak in the axial center.

  The non-adhesive rubber rollers 134 a and 134 b are set to a rubber hardness of 30 to 80, more preferably a rubber hardness of 50 to 80, and sandwich the laminated substrate 112 through a spring 126 with a pressure of 0.4 MPa or more. The non-adhesive rubber rollers 134a and 134b and the laminated substrate 112 move relatively at a speed of 26 cm / sec or less.

  As shown in FIG. 1, the interior of the manufacturing apparatus 20 is partitioned into a first clean room 142 a and a second clean room 142 b through a partition wall 140. The first clean room 142a accommodates the web feed mechanism 32 to the tension control mechanism 76, and the second clean room 142b accommodates the pasting mechanism 46 and the subsequent parts. The first clean room 142a and the second clean room 142b communicate with each other through the penetrating portion 144.

  The operation of the manufacturing apparatus 20 configured as described above will be described below in relation to the manufacturing method according to the present invention.

  First, as shown in FIG. 1, the photosensitive web 22 is fed out from a photosensitive web roll 22 a attached to the web feed mechanism 32, and the photosensitive web 22 is sent to a half-cut mechanism 36.

  In the half-cut mechanism 36, a half-cut portion 34 is formed in the photosensitive web 22 via the rotating round blade 54 (see FIG. 2). Then, as shown in FIG. 1, the half-cut photosensitive web 22 is transported in the direction of arrow A corresponding to the dimension of the remaining portion 30b of the protective film 30, and then temporarily stopped and the rotating round blade 54 is removed. The next half-cut portion 34 is formed under the traveling action. For this reason, the photosensitive web 22 is provided with a front peeling portion 30aa and a rear peeling portion 30ab across the remaining portion 30b (see FIG. 2).

  Further, the photosensitive web 22 is conveyed to the label adhering mechanism 40, and a predetermined application portion of the protective film 30 is disposed on the receiving table 59. In the label adhering mechanism 40, a predetermined number of adhesive labels 38 are adsorbed and held by the adsorbing pads 58a to 58g, and each adhering label 38 straddles the remaining portion 30b of the protective film 30, and the front peeling portion 30aa and the rear peeling portion 30ab. Are integrally bonded to each other (see FIG. 3).

  In the protective film peeling mechanism 44, the photosensitive web 22 is sandwiched between the suction drum 62 and the peeling roller 64, and the base film 26 of the photosensitive web 22 is adsorbed and held on the suction drum 62. In this state, the suction drum 62 is rotated, and a predetermined torque is applied to the protective film 30 via the torque motor 68.

  Therefore, the protective film 30 is peeled off from the photosensitive web 22 leaving the remaining portion 30 b, and taken up on the protective film take-up shaft 66 via the peeling roller 64. In addition, it is preferable to spray static elimination air on a peeling site | part.

  Under the action of the protective film peeling mechanism 44, the protective film 30 is peeled off from the base film 26 leaving the remaining portion 30b, and then the tension of the photosensitive web 22 is adjusted by the tension control mechanism 76. The photosensitive web 22 is quantitatively transported to the pasting mechanism 46 under the rotating action of the film transporting roller 98a at the start of operation and thereafter under the rotating action of the substrate transporting roller 98b that sandwiches the pasting substrate 24a. At that time, the contact prevention roller 96 waits upward, and the rubber roller 90b is disposed below.

  On the other hand, in the heating mechanism 45, the heating temperature in each heating furnace 86 is set corresponding to the lamination temperature in the attaching mechanism 46. The glass substrate 24 is tact-conveyed sequentially to each heating furnace 86 under the rotating action of the conveyance roller 88 constituting the conveyance mechanism 84. The glass substrate 24 is temporarily disposed between the rubber rollers 90 a and 90 b corresponding to the portion where the photosensitive resin layer 29 of the photosensitive web 22 is attached.

  In this state, by raising the backup roller 92b and the rubber roller 90b via the roller clamp portion 94, the glass substrate 24 is sandwiched between the rubber rollers 90a and 90b with a predetermined pressing pressure. Further, the photosensitive resin layer 29 is transferred (laminated) to the glass substrate 24 by heating and melting under the rotating action of the rubber roller 90a.

  Here, as lamination conditions, the speed is 1.0 m / min to 10.0 m / min, the temperature of the rubber rollers 90a and 90b is 80 ° C. to 150 ° C., the rubber hardness of the rubber rollers 90a and 90b is 40 ° to 90 °, The pressing pressure (linear pressure) of the rubber rollers 90a and 90b is 50 N / cm to 400 N / cm.

  When the lamination of one photosensitive web 22 on the glass substrate 24 is completed via the rubber rollers 90a and 90b, the rotation of the rubber roller 90a is stopped. On the other hand, the affixed substrate 24a in which the photosensitive web 22 is laminated on the glass substrate 24 is clamped by the substrate transport roller 98b. Then, the rubber roller 90b is retracted in a direction away from the rubber roller 90a, and the clamp is released.

  As a result, the glass substrate 24 heated to a predetermined temperature via the heating mechanism 45 in the time from the end of the laminating process for one sheet to the start of the next laminating process, the rubber rollers 90a and 90b. The photosensitive web 22 that is conveyed and disposed between and in sliding contact with the rubber roller 90a is finely fed.

  Affixed substrate 24a having photosensitive web 22 affixed to glass substrate 24 is quantitatively conveyed in the direction of arrow C. Then, the bonded substrate 24 a obtained by cutting the photosensitive web 22 between the glass substrates 24 via the inter-substrate web cutting mechanism 48 is conveyed to the peeling mechanism 114 via the conveyance system 110.

  In the peeling mechanism 114, the glass substrate 24 side of the bonded substrate 24 a is held under the suction action of the suction pad 118, while the chucks 116 a and 116 b each protrude inward from both ends of the glass substrate 24 in the transport direction. Grasping both ends in the transport direction. Further, the chucks 116a and 116b are driven and controlled in a predetermined direction, whereby the base film 26 held by the chucks 116a and 116b is separated from the cushion layer 27 and peeled off from the attachment substrate 24a. Thus, the laminated substrate 112 is obtained.

  In the laminated substrate 112, when the base film 26 is peeled off, protrusions (fluff) are likely to occur at the front and rear ends in the web conveyance direction to which the resin layer surface 124 is attached. This is because when the remaining portion 30b of the protective film 30 contracts and an unnecessary portion is laminated on the glass substrate 24 at the time of lamination, the unnecessary portion is integrated with the remaining portion 30b as the base film 26 is peeled off. This is because it grows and becomes fuzzy.

  Therefore, in this embodiment, the laminated substrate 112 from which the base film 26 has been peeled is conveyed to the pressure roller mechanism 120 under the action of the conveying system 110 in order to flatten the uneven shape of the resin layer surface 124.

  In the pressure roller mechanism 120, as shown in FIGS. 4 and 5, the pair of roller members 122a and 122b sandwich both surfaces of one end portion side of the multilayer substrate 112 with a predetermined pressure force (4 MPa or more). 112 moves in the direction of arrow C at a speed of 26 cm / sec or less.

  Therefore, the unevenness formed by peeling the base film 26 is satisfactorily flattened on the resin layer surface 124, and it is possible to efficiently manufacture the high-quality multilayer substrate 112 with a simple configuration and process. Become. Therefore, during the exposure process of the multilayer substrate 112, the projections on the resin layer surface 124 do not adhere to the mask (not shown), and an effect that a good exposure process is performed reliably can be obtained.

  In this case, the non-adhesive rubber rollers 134a and 134b constituting the roller members 122a and 122b are, for example, silicone rubber rollers, and have a crown shape with a peak in the axial center. Therefore, the resin layer surface 124 does not particularly adhere to the roller member 122a, and the resin layer surface 124 can be satisfactorily planarized.

  Further, the non-adhesive rubber rollers 134 a and 134 b are set to have a rubber hardness of 30 to 80, more preferably 50 to 80, and the laminated substrate 112 is sandwiched with a pressure of 0.4 MPa or more via the spring 126. is doing.

  FIG. 6 shows the relationship between the spring strength (force to press the rubber roller against the laminated substrate 112) and the crushing width (nip band) of each rubber roller in three types of rubber rollers having rubber hardness 50, 70 and 80. . Thereby, the higher the rubber hardness and the weaker the spring strength, the smaller the crushing width of the rubber roller.

  FIG. 7 shows the relationship between the spring strength and the pressing force (contact pressure) of each rubber roller in three types of rubber rollers having rubber hardness 50, 70 and 80. Accordingly, the lower the rubber hardness (the larger the nip band), the larger the contact area of the rubber roller, so that the pressing force of the rubber roller is reduced. On the other hand, the lower the spring strength, the lower the pressing force of the rubber roller.

  For this reason, in this embodiment, the non-adhesive rubber rollers 134a and 134b are set to have a rubber hardness of 30 to 80, more preferably a rubber hardness of 50 to 80. This is because if the rubber hardness is less than 30, the roller is too soft and the protrusions (uneven shape) on the resin layer surface 124 cannot be flattened. On the other hand, if the rubber hardness exceeds 80, the roller is too hard, the nip band becomes narrow, the pressure-bonding force increases locally, and it is not possible to cope with the positional variation of the protrusions. In addition, the glass substrate 24 may be damaged.

  Further, in the present embodiment, the non-adhesive rubber rollers 134a and 134b sandwich the laminated substrate 112 with a pressing force of 0.4 MPa or more. This is because if the pressure-bonding force is less than 0.4 MPa, the protrusions (uneven shape) on the resin layer surface 124 cannot be reliably flattened to a desired state.

  For example, FIG. 8 uses a rubber roller having a rubber hardness of 50 and medium spring strength (compression force is less than 0.4 MPa) and a rubber roller having a rubber hardness of 50 and high spring strength (compression force is 0.4 MPa). The result of detecting the height of the resin layer surface 124 before and after the crimping is shown. The good height of the resin layer surface 124 has a threshold value of 160.00 μm, which is the distance between a mask used in a proximity exposure machine (not shown) and the laminated substrate 112.

  As a result, with a rubber roller having a pressure bonding force of less than 0.4 MPa, the height after pressure bonding is about 200 μm, and the protrusions on the surface 124 of the resin layer could not be satisfactorily flattened. On the other hand, with a rubber roller having a pressure bonding force of 0.4 MPa, the height after pressure bonding was about 140 μm, and the protrusions on the resin layer surface 124 could be satisfactorily flattened.

  Furthermore, in this embodiment, the laminated substrate 112 is moving at a speed of 26 cm / sec or less in the arrow C direction with respect to the non-adhesive rubber rollers 134a and 134b. This is because if the moving speed of the laminated substrate 112 exceeds 26 cm / sec, the protrusions on the resin layer surface 124 cannot be satisfactorily flattened. For this reason, in this embodiment, the planarization of the resin layer surface 124 can be easily and reliably performed.

  Further, the non-adhesive rubber rollers 134a and 134b have a crown shape with a peak in the center in the axial direction. Therefore, since the range in which the protrusions on the resin layer surface 124 are crushed varies depending on the size of the nip band, the range to be crushed can be easily adjusted according to the position of the protrusions.

  In the present embodiment, the peeling mechanism 114 uses a connection peeling method in which the base film 26 that has been cut in advance is used from each of the pasted substrates 24a. However, the present invention is not limited to this. For example, you may employ | adopt the continuous peeling system which winds up and peels the base film 26 affixed integrally on each bonding board | substrate 24a continuously with a winding roller.

DESCRIPTION OF SYMBOLS 20 ... Manufacturing apparatus 22 ... Photosensitive web 24a ... Pasting board 26 ... Base film 29 ... Photosensitive resin layer 30 ... Protective film 32 ... Web delivery mechanism 36 ... Half cut mechanism 40 ... Label adhesion mechanism 42 ... Reservoir mechanism 44 ... Protection Film peeling mechanism 45 ... heating mechanism 46 ... pasting mechanism 48 ... inter-substrate web cutting mechanism 76 ... tension control mechanism 90a, 90b ... rubber roller 110 ... transport system 110a ... roller 112 ... laminated substrate 114 ... peeling mechanism 116a, 116b ... chuck 120 ... Pressure roller mechanism 122a, 122b ... Roller member 124 ... Resin layer surface 126 ... Spring 134a, 134b ... Non-adhesive rubber roller

Claims (8)

An adhering mechanism to obtain an adhering substrate by adhering a laminated body in which a support layer and at least one resin layer are laminated to the substrate so that the resin layer side faces the substrate;
A peeling mechanism for peeling the support layer from the resin layer to obtain a laminated substrate;
A pressure-bonding roller mechanism that is pressure-bonded to the resin layer from which the support layer has been peeled off and flattened the uneven shape of the resin layer by moving relative to the laminated substrate;
An apparatus for manufacturing a laminated substrate, comprising: The manufacturing apparatus according to claim 1, wherein the pressure roller mechanism includes a pair of roller members disposed on both surfaces of the multilayer substrate;
An elastic member that urges the pair of roller members in a direction approaching each other and pressurizes the resin layer with the pair of roller members;
An apparatus for manufacturing a laminated substrate, comprising:   The manufacturing apparatus according to claim 2, wherein the pair of roller members are non-adhesive rubber rollers.   4. The manufacturing apparatus according to claim 2, wherein the pair of roller members are rubber rollers having a rubber hardness of 50 to 80.   The manufacturing apparatus according to any one of claims 2 to 4, wherein the pair of roller members has a crown shape with a peak in the center in the axial direction.   6. The manufacturing apparatus according to claim 2, wherein the pair of roller members and the laminated substrate move relatively at a speed of 26 cm / sec or less. apparatus.   The manufacturing apparatus according to any one of claims 2 to 6, wherein the pair of roller members sandwich the laminated substrate with a pressure of 0.4 MPa or more. Adhering a laminate in which a support layer and at least one resin layer are laminated to the substrate such that the resin layer side faces the substrate;
Peeling the support layer from the resin layer to obtain a laminated substrate;
Pressure bonding a pressure roller mechanism to the resin layer from which the support layer has been peeled, and relatively moving the pressure roller mechanism and the laminated substrate, thereby flattening the uneven shape of the resin layer;
A method for producing a laminated substrate, comprising:

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