JP2011090867A - Terminal for electric connection, and connector using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a terminal for electric connection, capable of holding a solder material certainly, and a connector using the same. <P>SOLUTION: The solder material 35 is housed in a solder material storage 34 installed in a connection 33 of a terminal 30, and the melted solder material 35 is made to flow outside from the solder storage 34 and is made to solder the connection 33 of each terminal 30 to a substrate 1, thereby, it becomes unnecessary to solder using a solder separately and mounting of the connector on the substrate 1 can be made efficiently. In this case, since the solder material storage 34 houses the solder material 35 so as to cover from the surroundings, it can hold the solder material 35 certainly, and even if vibration and impact are received during transfer and mounting on the substrate 1 of the connector, the solder material 35 does not fall off from the solder material storage 34, and soldering to the substrate 1 can be made certainly. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electrical connection terminal used for, for example, a connector and connected to a substrate by soldering to the substrate, and a connector using the same.

  Conventionally, this type of connector has an insulating connector body and a plurality of terminals held by the connector body, and is connected to the board by soldering one end of each terminal to the board. It has been known.

  When soldering the terminals of this connector to the board, paste the cream solder on the board in advance, place the connector on it and heat it in a reflow oven to solder the terminal and the board What you do is known. In this case, since there is a possibility that a short circuit occurs due to the solder bridge in the connection portion arranged at a high density, it is necessary to reduce the solder amount by reducing the thickness of the solder. However, since the thickness of the solder on the board is all the same, if the thickness of the solder is reduced in accordance with the high-density connection portion, the solder of the connection portion that requires sufficient connection strength, such as a reinforcing bracket, etc. There is a disadvantage that the amount is insufficient.

  Therefore, it is known that the solder material is held at the terminal connection portion by caulking, the connector is placed on the substrate, and heated in a reflow furnace to solder the terminal and the substrate. (For example, refer to Patent Document 1). In this case, since the solder material is mounted on the terminal side, the amount of the solder material can be changed for each terminal.

JP 2003-229191 A

  However, when the solder material is attached to the terminal body by caulking as described above, the solder material may drop from the terminal body due to vibration or impact when the connector is mounted or mounted on the board before mounting. There is a problem that soldering defects are likely to occur.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electrical connection terminal capable of securely holding a solder material and a connector using the same.

  In order to achieve the above object, the present invention covers the solder material from the periphery in a terminal for electrical connection in which a solder material is held on one end side and soldered to a connection object by melting the solder material. And a solder material accommodating part capable of flowing the molten solder material to the outside.

  As a result, the solder material is accommodated in the solder material accommodating portion so as to be covered from the periphery, so that the solder material does not fall out of the solder material accommodating portion even when subjected to vibration or impact.

  According to the present invention, since the solder material does not fall out of the solder material housing portion even when subjected to vibration or impact, the soldering to the connection object can be performed reliably. Further, by forming the solder material in an arbitrary size, an appropriate amount of solder can be obtained for each type of terminal.

The perspective view which shows one Embodiment of the connector provided with the terminal for electrical connection of this invention Side sectional view of connector Connector exploded perspective view Terminal side view Bottom view of terminals Perspective view of terminals without solder material The perspective view which shows the formation process of a solder material accommodating part Side view showing the soldering process

  1 to 8 show an embodiment of the present invention. A connector 1 shown in the figure is mounted on a substrate 1 as an object to be connected, and is used by being electrically connected to an IC card (not shown).

  The connector includes a housing 10 fixed to the substrate 1, a cover 20 that covers the housing 10, and a plurality of terminals 30 that are arranged in the housing 10 at intervals in the width direction. A card (not shown) is inserted and removed.

  The housing 10 is made of a synthetic resin molded product, and a tapered notch 11 is provided on the front side thereof. Further, side walls 12 are provided at both ends of the housing 10 in the width direction, and a back wall 13 is provided at the rear end of the housing 10. A plurality of terminal holes 14 for holding the terminals 30 are provided on the center side in the width direction of the housing 10, and each terminal hole 14 is provided in a row on each of the front end side and the rear end side of the housing 10.

  The cover 20 has an opening on the front surface and the lower surface, and is assembled to the housing 10 by covering the housing 10 from the upper surface side. In this case, the front opening of the cover 20 forms a card insertion slot 21.

  Each terminal 30 is made of a conductive metal plate and is disposed in each terminal hole 14 of the housing 10. Each terminal 30 is provided in a fixed piece portion 31 fixed to the housing 10, an elastic piece portion 32 elastically deformable in the vertical direction of the housing 10, a connection portion 33 connected to the substrate 1, and the connection portion 33. And a solder material containing portion 34. The solder material containing portion 34 contains a solder material 35 obtained by cutting bar-shaped solder such as thread solder into a predetermined length. The fixed piece 31 is formed in a flat plate shape, and both end sides in the width direction are formed so as to protrude outward in the width direction. The elastic piece portion 32 is formed to be elongated from one end of the fixed piece portion 31 so as to form an upward slope, and a chevron-shaped contact portion 32a that contacts the card is provided at the tip portion. The connecting portion 33 extends downward from the other end of the fixed piece portion 31 and is bent so as to be substantially U-shaped with respect to the fixed piece portion 31, and the tip end side comes into contact with the substrate 1. . The solder material accommodating portion 34 includes a first bent piece 34a extending from one end of the connecting portion 33 and a pair of second bent pieces 34b extending from both ends of the connecting portion 33 in the width direction. The solder material 35 is accommodated in a space surrounded by 34a and 34b. In this case, each second bent piece 34 b is provided with an opening 34 c for allowing the molten solder material 35 to flow out, and the opening 34 c is formed to be smaller than the solder material 35.

  When the solder material 35 is accommodated in the solder material accommodating portion 34, for example, as shown in FIG. 7 (a), after forming the terminals 30 before the bent pieces 34a and 34b are bent, the solder material 35 is shown in FIG. 7 (b). In this manner, each second bent piece 34b is bent to form a housing space for the solder material 35 between the fixed piece portion 31 and the connecting portion 33 (inside the substantially U-shaped bent portion). In this case, each second bent piece 34 b is bent into a curved shape so as to follow the outer peripheral surface of the solder material 35. Next, after inserting the solder material 35 between the second bent pieces 34b, the first bent piece 34a is bent vertically as shown in FIG. 7C to close the space for accommodating the solder material 35. As a result, the solder material 35 is accommodated in the solder material accommodating portion 34. In this case, the bent pieces 34 a and 34 b are bent so that the gap is smaller than the solder material 35.

  Further, the terminal 30 is held in the terminal hole 14 by press-fitting both end portions in the width direction of the fixed piece 31 into grooves provided on the inner surface of the terminal hole 14 of the housing 10. In this case, a notch portion 15 for receiving the solder material accommodating portion 34 of the terminal 30 is provided on the lower surface of the housing 10.

  When the connector configured as described above is mounted on the substrate 1, the connector is placed at the mounting position of the substrate 1, and the connection portion 33 of the terminal 30 is placed on the surface of the substrate 1 as shown in FIG. Heat in a reflow oven in contact. As a result, the solder material 35 of the solder material accommodating portion 34 of each terminal 30 is melted and flows out from the gaps and opening portions 34c of the bent pieces 34a and 34b, and as shown in FIG. The part 33 is soldered to the substrate 1. In this case, since the solder material accommodating portion 34 accommodates the solder material 35 so as to be covered with the bent pieces 34a and 34b from the surroundings, even when the connector is transported or placed on the substrate 1, it is subject to vibrations and shocks. The solder material 35 does not fall out of the solder material accommodating portion 34.

  As described above, according to the present embodiment, the solder material 35 is accommodated in the solder material accommodation portion 34 provided in the connection portion 33 of the terminal 30, and the molten solder material 35 is caused to flow out of the solder material accommodation portion 34. Since the connection portion 33 of each terminal 30 is soldered to the substrate 1, it is not necessary to solder using a separate solder, and the connector can be efficiently mounted on the substrate 1. In this case, since the solder material accommodating portion 34 accommodates the solder material 35 so as to cover from the periphery, the solder material 35 can be securely held, and vibration or vibration can be caused when the connector is transported or placed on the board 1. Even when an impact is applied, the solder material 35 does not fall out of the solder material accommodating portion 34, and soldering to the substrate 1 can be performed reliably.

  Further, since the solder material accommodating portion 34 is formed by bending the bent pieces 34 a and 34 b extending from the connection portion 33, the solder material accommodating portion 34 can be easily formed in the manufacturing process of the terminal 30. This is extremely advantageous for improving productivity.

  Further, since the elastic piece portion 32 having the contact portion 32a with the card is provided on one end side and the connection portion 33 is provided on the other end side, the contact portion 32a is reliably brought into contact with the card by elastic deformation of the elastic piece portion 32. be able to.

  Further, since the other end side is formed so as to be bent in a substantially U shape with respect to the one end side, and the solder material accommodating portion 34 is disposed inside the bent portion, the solder material accommodating portion 34 may protrude outward. In addition, there is an advantage that the terminal 30 is not increased in size by the solder material accommodating portion 34. In this case, since the solder material accommodating portion 34 is received in the cutout portion 15 provided on the lower surface of the housing 10, the solder material accommodating portion 34 does not come into contact with an object outside the housing 10, and the connector is conveyed. The solder material accommodating portion 34 can be protected inside.

  Furthermore, since the opening 34c through which the molten solder material 34 can flow out is provided in the second bent piece 34b of the solder material storage portion 34, the molten solder material 34 can easily flow out of the solder material storage portion 34. This is extremely effective for preventing poor soldering.

  In the above-described embodiment, a connector having one type of terminal 30 is shown. However, when used for a connector having a plurality of types of terminals such as a signal line terminal and a fixing terminal, a solder material is used. By forming the connector in an arbitrary size, an appropriate amount of solder can be obtained for each type of terminal in accordance with the required connection strength, the density of the connection portion, and the like.

  Moreover, the bending process of each bending piece 34a, 34b shown by the said embodiment is an example, and the order and method of bending are not restricted to the said embodiment.

  Furthermore, in the said embodiment, although the electrical connection terminal 30 used for the connector for cards was shown, this invention is applicable also to the electrical connection terminal used for other types of connectors and connectors.

  30 ... Terminal, 33 ... Connection part, 34 ... Solder material accommodation part, 34a ... 1st bending piece, 34b ... 2nd bending piece, 34c ... Opening part.

Claims (6)

In the terminal for electrical connection, which has a connection part connected to the connection object, and is soldered to the connection object by melting the solder material held in the connection part,
A terminal for electrical connection, comprising: a solder material accommodating portion that accommodates the solder material so as to cover from the surroundings and can flow the molten solder material to the outside. The electrical connection terminal according to claim 1, wherein the solder material accommodating portion is formed by bending a plurality of bent portions extending from the connection portion. The electrical connection terminal according to claim 1, wherein an elastic piece portion having a contact portion with another connection object is provided on one end side, and the connection portion is provided on the other end side. 4. The electrical connection device according to claim 1, wherein the other end side is formed so as to be bent in a substantially U shape with respect to the one end side, and a solder material accommodating portion is disposed inside the bent portion. Terminal. The electrical connection terminal according to claim 1, 2, 3, or 4, wherein the solder material container is provided with an opening through which molten solder material can flow out. A connector comprising the electrical connection terminal according to claim 1, 2, 3, 4 or 5.

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