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JP2010532429A5 - - Google Patents

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Publication number
JP2010532429A5
JP2010532429A5 JP2010514971A JP2010514971A JP2010532429A5 JP 2010532429 A5 JP2010532429 A5 JP 2010532429A5 JP 2010514971 A JP2010514971 A JP 2010514971A JP 2010514971 A JP2010514971 A JP 2010514971A JP 2010532429 A5 JP2010532429 A5 JP 2010532429A5
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JP
Japan
Prior art keywords
substrate
organic composition
patterned
ionizable substituent
patterning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010514971A
Other languages
Japanese (ja)
Other versions
JP2010532429A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/067179 external-priority patent/WO2009006010A2/en
Publication of JP2010532429A publication Critical patent/JP2010532429A/en
Publication of JP2010532429A5 publication Critical patent/JP2010532429A5/ja
Pending legal-status Critical Current

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Claims (4)

イオン化可能置換基を有する有機組成物を所定のパターンで基材上に適用する工程、および前記イオン化可能置換基とイオン性種との間のイオン交換を行う工程を含んで成る、基材のパターニング方法。   Patterning a substrate comprising applying an organic composition having an ionizable substituent on the substrate in a predetermined pattern and performing ion exchange between the ionizable substituent and the ionic species Method. 基材に放射線硬化性組成物を適用する工程、
前記有機組成物少なくとも一部分を硬化させる工程、
前記未硬化部分を除いて、硬化した有機組成物のパターンを形成する工程、および、
前記イオン化可能置換基をイオン性種で置き換えるために、イオン交換を行う工程、
を含んで成る、基材のパターニング方法。 Applying a radiation curable composition to the substrate;
Curing at least a portion of the organic composition;
Forming a pattern of a cured organic composition excluding the uncured portion; and
Performing ion exchange to replace the ionizable substituent with an ionic species;
A method for patterning a substrate, comprising: 基材、
パターン化された有機組成物、および、
パターン化された金属性被膜、
を含んで成る、物品、
前記パターン化された有機組成物は、前記パターン化された金属性被膜で覆われて、全体形状を形成し、そして前記全体形状は、幅で少なくとも約１μｍおよび高さで少なくとも２０ｎｍである幅を有する。 Base material,
A patterned organic composition, and
Patterned metallic coating,
An article comprising,
The patterned organic composition is covered with the patterned metallic coating to form an overall shape, and the overall shape has a width that is at least about 1 μm in width and at least 20 nm in height. Have. 前記基材が、ポリマーまたはガラスを含む、請求項３に記載の物品。 The article of claim 3 , wherein the substrate comprises a polymer or glass .
JP2010514971A 2007-07-02 2008-06-17 Substrate patterning method Pending JP2010532429A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94752707P 2007-07-02 2007-07-02
PCT/US2008/067179 WO2009006010A2 (en) 2007-07-02 2008-06-17 Method of patterning a substrate

Publications (2)

Publication Number Publication Date
JP2010532429A JP2010532429A (en) 2010-10-07
JP2010532429A5 true JP2010532429A5 (en) 2011-07-21

Family

ID=40226752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010514971A Pending JP2010532429A (en) 2007-07-02 2008-06-17 Substrate patterning method

Country Status (6)

Country Link
EP (1) EP2162237A4 (en)
JP (1) JP2010532429A (en)
KR (1) KR20100036260A (en)
CN (1) CN101687218A (en)
BR (1) BRPI0813652A2 (en)
WO (1) WO2009006010A2 (en)

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US8936890B1 (en) 2013-11-05 2015-01-20 Eastman Kodak Company Electroless plating method
US9128378B2 (en) 2013-11-05 2015-09-08 Eastman Kodak Company Forming conductive metal patterns with reactive polymers
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
US9380700B2 (en) 2014-05-19 2016-06-28 Sierra Circuits, Inc. Method for forming traces of a printed circuit board
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
US9631279B2 (en) * 2014-05-19 2017-04-25 Sierra Circuits, Inc. Methods for forming embedded traces
US10573610B2 (en) 2014-05-19 2020-02-25 Catlam, Llc Method for wafer level packaging
EP3165947B1 (en) 2014-07-03 2021-11-24 JX Nippon Mining & Metals Corporation Radiation detector ubm electrode structure body, radiation detector, and method of manufacturing same
US9706650B1 (en) 2016-08-18 2017-07-11 Sierra Circuits, Inc. Catalytic laminate apparatus and method
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US9922951B1 (en) 2016-11-12 2018-03-20 Sierra Circuits, Inc. Integrated circuit wafer integration with catalytic laminate or adhesive
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination
IT201900011958A1 (en) 2019-07-17 2021-01-17 Milano Politecnico Metallization of plastic substrates
JP2022165788A (en) * 2021-04-20 2022-11-01 東京応化工業株式会社 Composition for nanoimprint and pattern formation method

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JP3535418B2 (en) * 1999-07-14 2004-06-07 富士通株式会社 Conductor pattern forming method
JP2001135168A (en) * 1999-08-26 2001-05-18 Sharp Corp Production of metal wiring
JP2002129345A (en) * 2000-10-19 2002-05-09 Sumitomo Osaka Cement Co Ltd Liquid for light-sensitive coating for forming undercoat of selective plating
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