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JP2010239101A - Method of forming pattern and printing machine - Google Patents

Method of forming pattern and printing machine Download PDF

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Publication number
JP2010239101A
JP2010239101A JP2009103405A JP2009103405A JP2010239101A JP 2010239101 A JP2010239101 A JP 2010239101A JP 2009103405 A JP2009103405 A JP 2009103405A JP 2009103405 A JP2009103405 A JP 2009103405A JP 2010239101 A JP2010239101 A JP 2010239101A
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adhesive
functional material
substrate
intaglio
silicon rubber
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Japanese (ja)
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Hidejiro Ono
秀次郎 小野
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Abstract

<P>PROBLEM TO BE SOLVED: To form a pattern which exerts functions of materials, and to make a structural object having a cubic volume on a surface of a substrate through the selection of the materials. <P>SOLUTION: Functional material 5 is filled in an intaglio plate 4 made of silicon rubber and an adhesive material 6 is applied on. Residues of the materials etc. on flat sections 23 of the intaglio plate are removed, and after adhesion and cohesion of the materials in the depressions are sufficiently achieved, the materials are transferred onto the substrate 8. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

電機部品等製作の工程の中で望まれている、基板面上へ精度、精細を維持しながら機能性素材を高厚膜で基板上にパターン形成する方法及び印刷機に関するもの。  The present invention relates to a printing method and a method for forming a functional material pattern on a substrate with a high-thickness film while maintaining accuracy and fineness on the substrate surface, which is desired in the manufacturing process of electrical parts and the like.

電器部品等を作るプロセスの中で各種のパターン化技術が使用されている。廉価手法として、印刷法が使われている。その印刷によるパターンの膜厚は厚膜が望まれているものの一般的に数μ以下であり、又機能性素材がインキ化されている為その機能が十分に出せないでいる(図6)。又、寸法精度の悪さ、精細性の悪さなど課題があり、より良いパターンの形成法が望まれている。Various patterning techniques are used in the process of making electrical parts and the like. The printing method is used as an inexpensive method. The thickness of the pattern by printing is generally several μm or less although a thick film is desired, and its function cannot be sufficiently achieved because the functional material is inked (FIG. 6). Further, there are problems such as poor dimensional accuracy and poor definition, and a better pattern formation method is desired.

電極の印刷、PDP用のリブなど厚盛の印刷が望まれているが、厚膜形成が可能なシルク印刷では精度や精細性が不足する。Although thick printing such as electrode printing and PDP ribs is desired, silk printing capable of forming a thick film lacks accuracy and fineness.

現在高精度が求められる比較的厚盛の印刷が可能なグラビヤ法においても得られる膜厚は数μで、要求される膜厚は得られない。本案はグラビヤ印刷並みの高精度、高精細を得つつ、シルク印刷並みの数十μの膜厚を印刷によって得るという課題を解決するために考案したものである。Even in the gravure method capable of relatively thick printing that currently requires high accuracy, the film thickness obtained is several μm, and the required film thickness cannot be obtained. This proposal was devised in order to solve the problem of obtaining a film thickness of several tens of microns as high as silk printing by printing while obtaining high precision and high definition equivalent to gravure printing.

課題を解決する為の手段Means to solve the problem

本案は上記課題を解決する為に考案したもので、
まず、シリコンゴムシート面に求める画像に応じた深度、開口を設け、該シートに精度を待たせるため裏面に剛性板を貼り付シリコンゴム製凹版(4)とする。
This plan was devised to solve the above problems.
First, a depth and opening corresponding to the image required on the silicon rubber sheet surface are provided, and a rigid plate is pasted on the back surface to make the sheet wait for accuracy to form a silicon rubber intaglio (4).

シリコン製凹版面の凹部に機能性素材を充填する。接着剤を追加充填し該機能性素材を固化及び表面に粘着性を持たせた後に、充填された機能性素材のすべてを基板に転写する。この事により機能性素材を厚膜にしてパターン形成する。    The functional material is filled in the concave portion of the silicon intaglio surface. After the adhesive material is additionally filled to solidify the functional material and make the surface sticky, all of the filled functional material is transferred to the substrate. As a result, the functional material is formed into a thick film to form a pattern.

発明の効果The invention's effect

▲1▼従来の印刷では、機能性素材はべつの樹脂すなわち溶媒や溶剤で包み印刷適正を持たせたインキ化して使用する為、素材が溶媒や溶剤中で分散している為素材の機能が損なわれている(図6−▲6▼)。これに対し、本案では素材そのものをまず接しさせ接着剤で固化する為、素材の密度が高く(図1−▲7▼)、素材の機能が損なわれる事が少ないパターンの形成が出来る。(1) In conventional printing, the functional material is wrapped in another resin, ie, a solvent or solvent, and used as an ink with appropriate printing properties. The material functions because the material is dispersed in the solvent or solvent. It has been damaged (Fig. 6-6). On the other hand, in this plan, since the material itself is first contacted and solidified with an adhesive, the density of the material is high (FIG. 1- (7)), and a pattern can be formed with little loss of the function of the material.

▲2▼凹部に充填した素材のすべてを使用しパターン形成を行う為、凹部の深度、大きさの設定、充填する構造材の形状や大きさを選定する事によって必要な高さ形状の構造体を形成法できる。  (2) Since the pattern is formed using all of the material filled in the recess, the structure of the required height is selected by setting the depth and size of the recess and selecting the shape and size of the structural material to be filled. Can be formed.

発明を実施する為の最良の形態BEST MODE FOR CARRYING OUT THE INVENTION

シリコンゴムによって作成した凹版の凹部に機能性素材を充填、更に接着剤を充填、接着剤によって機能性素材が半固化し表面に粘着性の発生を待って凹部に充填した素材をすべて基板に転写し、機能性素材によるパターン形成を行う。Fill the concave part of the intaglio plate made of silicon rubber with a functional material, and then fill with an adhesive, and the functional material is semi-solidified by the adhesive and the adhesive material is transferred to the substrate. Then, pattern formation with a functional material is performed.

請求項1についての原理を図1により説明する。
請求項2についての原理を図2により説明する。
The principle of claim 1 will be described with reference to FIG.
The principle of claim 2 will be described with reference to FIG.

図4により請求項1の実施例の説明を行う。図3によって作成したシリコンゴム製凹版(4)を作成、準備する(▲1▼)凹版凹部(11)に、機能性素材(5)をブレードにて充填する(▲2▼−1)。接着剤(6)を全面に塗布する(▲3▼)。  The embodiment of claim 1 will be described with reference to FIG. A silicon rubber intaglio (4) prepared in accordance with FIG. 3 is prepared and prepared (1). A functional material (5) is filled into the intaglio recess (11) with a blade (2) -1. Adhesive (6) is applied to the entire surface (3).

接着剤の半硬化(▲4▼)を待って、シリコンゴムシート(21)面で出来たクリ−ニングローラー(20)を圧着し、凹版平部(23)に付いた素材と接着剤のすべてを転写除去する(▲5▼)。凹部内の接着剤の更なる乾燥を待って、基板(8)を圧着(▲6▼)、凹部内の半固化素材と接着剤をすべて基板に転写(▲7▼)。基板の焼成により粉末を完全固化する。これにより銀粉を硬化した輻20μ、高さ10μの導電配線を作成できた。  Wait until the adhesive is semi-cured (4), press the cleaning roller (20) on the surface of the silicone rubber sheet (21), and all the material and adhesive on the intaglio plate (23) Is transferred and removed (5). After further drying of the adhesive in the recess, the substrate (8) is pressure-bonded (6), and the semi-solidified material and the adhesive in the recess are all transferred to the substrate (7). The powder is completely solidified by firing the substrate. As a result, a conductive wiring of 20 μm in height and 10 μm high in which silver powder was cured could be created.

図5により請求項2の実施例の説明を行う。所定の深さを持ったシリコンゴム製凹版を準備する(▲1▼)。凹版凹部に、機能性素材(5)をブレード(18)にて充填する(▲2▼)。接着剤Aを全面に塗布する(▲3▼)。  The embodiment of claim 2 will be described with reference to FIG. A silicon rubber intaglio having a predetermined depth is prepared ((1)). A functional material (5) is filled into the intaglio depression with a blade (18) ((2)). Adhesive A is applied to the entire surface (3).

接着剤の半硬化(▲4▼)を待って、シリコンゴムシート(21)面で出来たクリ−ニングローラー(20)を圧着し、凹版平部(23)に付いた素材残と接着剤のすべてを転写除去する(▲5▼)。凹部内の接着剤の乾燥によって素材の更なる固化(▲6▼)を待って、接着剤B(13)をブレードにより塗布(▲7▼)。  Waiting for the semi-curing of the adhesive (4), press the cleaning roller (20) made of the silicon rubber sheet (21) surface, and remove the adhesive from the material remaining on the intaglio plate (23). All of them are transferred and removed ((5)). After the material in the recess is dried, the material is further solidified (6), and the adhesive B (13) is applied with a blade (7).

基板(8)を圧着、凹部内の固化素材と接着剤(A)接着剤(B)をすべて基板に転写(▲9▼)。基板の焼成により素材を完全固化しパターン形成する。これによりNI粉を硬化した幅180μ、高さ150μの構造物(仕切り板)を作成できた。  The substrate (8) is pressure-bonded, and the solidified material and the adhesive (A) and the adhesive (B) in the recess are all transferred to the substrate (9). The material is completely solidified by baking the substrate to form a pattern. As a result, a structure (partition plate) having a width of 180 μm and a height of 150 μm obtained by curing the NI powder could be created.

請求項3の実施例を図4により説明する。実施例2と同様の工程において、凹版凹部に、揮発性溶剤と混合した機能性素材をブレードにて充填する(▲2▼−2)。以後の工程は実施例2と同じ。An embodiment of claim 3 will be described with reference to FIG. In the same process as in Example 2, a functional material mixed with a volatile solvent is filled into the intaglio recess with a blade ((2) -2). The subsequent steps are the same as in Example 2.

請求項4の実施例を図7に示す。
版胴(29)を設け、シリコンゴム製凹版(4)を貼る。該凹版に接するように接着剤供給機構(27)、機能性素材供給機構(28)、シリコンゴムシート(21)を張ったクリーニングローラー(20)を装備し、基板(8)を乗せて接して動く版定盤(30)を設けてある(▲1▼)。
An embodiment of claim 4 is shown in FIG.
A plate cylinder (29) is provided, and a silicon rubber intaglio (4) is applied. Equipped with an adhesive supply mechanism (27), a functional material supply mechanism (28), and a cleaning roller (20) with a silicone rubber sheet (21) in contact with the intaglio, and a substrate (8) is placed on and in contact with it. A moving platen (30) is provided (1).

凹版面に機能性素材供給機構により機能性素材を供給し、接着剤供給機構により接着剤を供給する(▲2▼)。凹版表面をクリーニングローラーによってクリーニングする(▲3▼)。凹版画像を基板に転写する(▲4▼)。The functional material is supplied to the intaglio surface by the functional material supply mechanism, and the adhesive is supplied by the adhesive supply mechanism ((2)). The surface of the intaglio is cleaned with a cleaning roller ((3)). The intaglio image is transferred to the substrate (4).

基板面に機能性のある素材を機能を損なうことなくパターン形成を試みる為に用いる。
高さや幅を求める構造体を基板上にパターン形成する為に用いる。
A functional material is used on the substrate surface to attempt pattern formation without impairing the function.
A structure for obtaining the height and width is used to form a pattern on the substrate.

請求項1の原理説明図 ▲1▼ 図3によって出来たシリコンゴム製凹版(4)の準備の図 ▲2▼ 凹版の凹部に機能性素材(5)を充填する図 ▲3▼ 接着剤(6)を追加充填する図 ▲4▼ 接着剤が半硬化し機能性素材を接着する図 ▲5▼ 基板(8)を圧着する図 ▲6▼ 基板に凹部に充填された機能性素材がすべて転写する図 ▲7▼ 転写されたインキの拡大図;機能性素材が密に接着され、機能性を上げる原因となっている様子の説明図。  Illustration of the principle of claim 1 (1) Preparation of the silicon rubber intaglio (4) made according to FIG. (2) Diagram of filling the concave material of the intaglio with the functional material (5) (3) Adhesive (6 (4) Figure of the adhesive is semi-cured and the functional material is adhered. (5) Figure of crimping the substrate (8). (6) All the functional material filled in the recess is transferred to the substrate. Fig. 7: Magnified view of transferred ink; explanatory diagram showing how the functional material is closely adhered to increase the functionality. 請求項2の原理説明図 ▲1▼ 図3によって出来たシリコンゴム製凹版の準備の図 ▲2▼ 凹版の凹部(24)に機能性素材(5)を充填する図 ▲3▼ 凹部に接着液A(11)を充填する図 ▲4▼ 接着液Aが硬化し素材が固化する図 ▲5▼ 接着剤B(13)を素材の固化面に塗布する図 ▲6▼ 基板(8)を圧着する図 ▲7▼ 基板に凹部に充填された機能性素材がすべて転写する図  Illustration of the principle of claim 2 (1) Diagram of preparation of silicon rubber intaglio made by FIG. (3) Diagram of filling functional material (5) into recess (24) of intaglio (3) Adhesive liquid in recess Diagram of filling A (11) ▲ 4 ▼ Diagram of adhesive liquid A curing and material solidifying ▲ 5 ▼ Diagram of applying adhesive B (13) to solidified surface of material ▲ 6 ▼ Crimping substrate (8) Fig. ▲ 7 ▼ Diagram showing all functional material filled in the recesses transferred to the substrate シリコンゴム製凹版を作る説明図 ▲1▼ 求める凹版と凹凸を逆にする母型を準備する図 ▲2▼ 母型の表面にシリコンゴム液(2)を塗布する図 ▲3▼ ベース板(3)をゴム液背面に圧着する図 ▲4▼ シリコンゴム硬化後母型から剥離し出来たシリコンゴム製凹版の図  Illustration to make intaglio plate made of silicon rubber ▲ 1 ▼ Figure to prepare a master mold that reverses the desired intaglio and unevenness ▲ 2 ▼ Figure to apply silicon rubber liquid (2) to the surface of the mother mold ▲ 3 ▼ Base plate (3 ) Is pressed onto the back of the rubber liquid. 請求項1及び請求項3の実施例の説明図 ▲1▼ 図3によって出来たシリコンゴム製凹版(4)の準備の図 ▲2▼−1 凹版の凹部にブレード(18)により機能性素材(5)を充填する図 ▲2▼−2 凹版の凹部にブレード(18)により揮発性溶剤と混合した機能性素材(25)を充填する図 ▲3▼ 接着剤(6)を追加充填する図 ▲4▼ 接着剤が半硬化し機能性素材を接着する図 ▲5▼ シリコンゴムシート(21)面で出来たクリ−ニングローラー(20)を圧着し、凹版平部(23)に付いた素材と接着剤のすべてを転写除去する図 ▲6▼ 基板(8)を圧着する図 ▲7▼ 基板に凹部に充填された機能性素材がすべて転写する図  Explanatory drawing of the embodiment of claims 1 and 3. (1) Preparation drawing of the silicon rubber intaglio (4) made according to FIG. (2) -1 Functional material (with blade (18) in the intaglio depression 5) Filling figure ▲ 2 ▼ -2 Filling the concave part of the intaglio with the functional material (25) mixed with the volatile solvent by the blade (18) ▲ 3 ▼ Filling the adhesive (6) additionally ▲ 4 ▼ The figure where the adhesive is semi-cured and bonds the functional material. ▲ 5 ▼ The material attached to the intaglio flat part (23) is bonded by pressing the cleaning roller (20) made of the silicon rubber sheet (21). Diagram of transferring and removing all of adhesive ▲ 6 ▼ Diagram of pressing substrate (8) ▲ 7 ▼ Diagram of transfer of all functional material filled in recesses to substrate 請求項2の実施例の説明図 ▲1▼ 図3によって出来たシリコンゴム製凹版の準備の図 ▲2▼ 凹版の凹部(24)にブレード(18)により機能性素材(5)を充填する図 ▲3▼ 凹部に接着液A(11)を塗布する図 ▲4▼ 接着液Aが半硬化し素材が半固化する図 ▲5▼ シリコンゴムシート(21)面で出来たクリ−ニングローラー(20)を圧着し、凹版平部(23)に付いた素材と接着剤Aのすべてを転写除去する図 ▲6▼ 接着液Aが硬化し素材が固化する図 ▲7▼ 接着剤B(13)を素材の固化面に塗布する図 ▲8▼ 基板(8)を圧着する図 ▲9▼ 基板に凹部に充填された機能性素材がすべて転写する図  Explanatory drawing of Example of Claim 2 (1) Drawing of preparation of silicon rubber intaglio made according to FIG. 3 (2) Diagram in which functional material (5) is filled into recess (24) of intaglio by blade (18) (3) Diagram of applying adhesive liquid A (11) to the recesses (4) Diagram of adhesive liquid A semi-cured and material semi-solidified (5) Cleaning roller (20) made of silicon rubber sheet (21) surface ) And the material attached to the intaglio plate (23) and the adhesive A are all transferred and removed. (6) The adhesive A is cured and the material is solidified. (7) Adhesive B (13) is removed. Figure 8 Applying to the solidified surface of the material ▲ 8 ▼ Figure crimping the substrate (8) ▲ 9 ▼ Diagram showing all functional materials filled in the recesses transferred to the substrate 機能性素材をインキ化して使う従来技術の説明図。 ▲1▼ 図3によって出来たシリコンゴム製凹版の準備の図 ▲2▼ 凹版の凹部にインキ化された機能性素材を充填する図 ▲3▼ インキが半乾燥する図 ▲4▼ 基板を圧着する図 ▲5▼ 基板に凹部に充填されたインキがすべて転写する図 ▲6▼ 転写されたインキの拡大図;機能性素材が溶媒で独立して包まれ、素材の密度低下及び機能性を落とす原因となっている様子の説明図。  Explanatory drawing of conventional technology that uses functional materials in ink form. ▲ 1 ▼ Diagram of preparation of silicon rubber intaglio made by Fig.3 ▲ 2 ▼ Diagram of filling indentation with functional material ▲ 3 ▼ Diagram of semi-drying of ink ▲ 4 ▼ Crimping substrate Fig. ▲ 5 Fig. ▲ All of the ink filled in the recesses is transferred to the substrate. ▲ 6 ▼ Enlarged view of the transferred ink; the reason why the functional material is independently wrapped with the solvent and the density is reduced Explanatory drawing of a state. 本案実施の為の複数の供給機構を持った印刷機の例の図 ▲1▼ 本機全体説明図 ▲2▼ 版面に機能性素材の供給と接着剤の充填を行っている図 ▲3▼ 充填された版の表面をクリーニングしている図 ▲4▼ 版面から画像を基板に転写している図  Diagram of an example of a printing press having a plurality of supply mechanisms for the implementation of this plan. (1) General explanation diagram of the printer. (2) Diagram of supplying functional material to the printing plate and filling with adhesive. (3) Filling Fig. 4 Cleaning the surface of the printed plate. Fig. 4 Transferring the image from the printing plate to the substrate.

1、母型 2、シリコンゴム液 3、ベース板
4、シリコンゴム製凹版 5、機能性素材 6、接着剤
7、接着している機能性素材 8、基板
9、基板に転写した機能性素材
10、所定の凹部を持った凹版 11、接着剤A
12、硬化した接着剤A 13、接着剤B 14、溶媒+溶剤
15、インキ化された機能性素材 16、溶剤が減り半硬化したインキ
17 基板に転写したインキ
18、ブレード 19、半硬化した接着剤
20、クリーニングローラー
21、シリコンゴムシート 22、転写した凹版平部のインキ
23、凹版平部 24、凹部
25、揮発性溶剤と混合した機能性素材 26、溶媒
27、接着剤供給機構 28、機能性素材供給機構 29、版胴
30、版定盤
DESCRIPTION OF SYMBOLS 1, Mother mold 2, Silicone rubber liquid 3, Base board 4, Silicon rubber intaglio 5, Functional material 6, Adhesive 7, Adhering functional material 8, Substrate 9, Functional material 10 transferred to substrate , Intaglio plate with predetermined recess 11, Adhesive A
12. Cured adhesive A 13, Adhesive B 14, solvent + solvent 15, functionalized ink material 16, semi-cured ink 17 with reduced solvent, ink 18 transferred to substrate, blade 19, semi-cured adhesive Agent 20, cleaning roller 21, silicon rubber sheet 22, transferred intaglio plate ink 23, intaglio plate portion 24, recess 25, functional material mixed with volatile solvent 26, solvent 27, adhesive supply mechanism 28, function Material supply mechanism 29, plate cylinder 30, plate surface plate

Claims (4)

シリコンゴム製凹版(4)の凹部(24)にインキを充填し、半乾燥後該インキを100%基板に転写する画像の形成法において、シリコンゴム製凹版の凹部に、第1に機能性素材(5)を充填し、第2に接着剤(6)を充填し該機能性素材を半固化した後、すべて基板に転写する事を特徴とするパターン形成法。  In the method of forming an image in which the recess (24) of the silicon rubber intaglio (4) is filled with ink and the ink is transferred to 100% substrate after semi-drying, the functional material is firstly formed in the recess of the silicon rubber intaglio A pattern forming method characterized by filling (5), secondly filling the adhesive (6) and semi-solidifying the functional material, and then transferring the whole to the substrate. シリコンゴム製凹版(4)の凹部(24)に、第1に機能性素材を充填し、第2に接着剤A(11)を充填し該素材を凹部内部で接着固体化し、第3に接着剤B(13)を充填し、機能性素材をすべて基板に転写する事を特徴とするパターン形成法。  The concave part (24) of the silicon rubber intaglio (4) is filled first with a functional material, secondly with an adhesive A (11), and the material is bonded and solidified inside the concave part, and then adhered to the third. Filling agent B (13) and transferring all the functional material onto the substrate. 凹部に充填する機能性素材が揮発性溶剤と混合してある事を特徴とする請求項1及び2.3. The functional material filled in the recess is mixed with a volatile solvent. 凹版の凹部に複数の異なった素材をそれぞれ供給する複数の供給機構(27)(28)を備えた印刷機(図7)。The printing machine (FIG. 7) provided with the several supply mechanism (27) (28) which each supplies a several different raw material to the recessed part of an intaglio.
JP2009103405A 2009-03-30 2009-03-30 Method of forming pattern and printing machine Pending JP2010239101A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013202838A (en) * 2012-03-27 2013-10-07 Mimaki Engineering Co Ltd Printing method and printing device
KR20160085041A (en) * 2015-01-07 2016-07-15 성낙훈 Fine circuit board and its manufacturing method
JP2019523559A (en) * 2016-07-28 2019-08-22 ランダ ラブズ (2012) リミテッド Method of applying an electrical conductor to an electrically insulating substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013202838A (en) * 2012-03-27 2013-10-07 Mimaki Engineering Co Ltd Printing method and printing device
KR20160085041A (en) * 2015-01-07 2016-07-15 성낙훈 Fine circuit board and its manufacturing method
KR102412346B1 (en) * 2015-01-07 2022-06-22 성낙훈 Fine circuit board and its manufacturing method
JP2019523559A (en) * 2016-07-28 2019-08-22 ランダ ラブズ (2012) リミテッド Method of applying an electrical conductor to an electrically insulating substrate
US11546999B2 (en) 2016-07-28 2023-01-03 Lumet Technologies Ltd. Apparatus for applying of a conductive pattern to a substrate
US11570902B2 (en) 2016-07-28 2023-01-31 Lumet Technologies, LTD. Flexible membrane for applying a pattern to a substrate
US11832395B2 (en) 2016-07-28 2023-11-28 Landa Labs (2012) Ltd. Application of electrical conductors to an electrically insulating substrate

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