JP2010239101A - Method of forming pattern and printing machine - Google Patents
Method of forming pattern and printing machine Download PDFInfo
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- JP2010239101A JP2010239101A JP2009103405A JP2009103405A JP2010239101A JP 2010239101 A JP2010239101 A JP 2010239101A JP 2009103405 A JP2009103405 A JP 2009103405A JP 2009103405 A JP2009103405 A JP 2009103405A JP 2010239101 A JP2010239101 A JP 2010239101A
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- adhesive
- functional material
- substrate
- intaglio
- silicon rubber
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- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
電機部品等製作の工程の中で望まれている、基板面上へ精度、精細を維持しながら機能性素材を高厚膜で基板上にパターン形成する方法及び印刷機に関するもの。 The present invention relates to a printing method and a method for forming a functional material pattern on a substrate with a high-thickness film while maintaining accuracy and fineness on the substrate surface, which is desired in the manufacturing process of electrical parts and the like.
電器部品等を作るプロセスの中で各種のパターン化技術が使用されている。廉価手法として、印刷法が使われている。その印刷によるパターンの膜厚は厚膜が望まれているものの一般的に数μ以下であり、又機能性素材がインキ化されている為その機能が十分に出せないでいる(図6)。又、寸法精度の悪さ、精細性の悪さなど課題があり、より良いパターンの形成法が望まれている。Various patterning techniques are used in the process of making electrical parts and the like. The printing method is used as an inexpensive method. The thickness of the pattern by printing is generally several μm or less although a thick film is desired, and its function cannot be sufficiently achieved because the functional material is inked (FIG. 6). Further, there are problems such as poor dimensional accuracy and poor definition, and a better pattern formation method is desired.
電極の印刷、PDP用のリブなど厚盛の印刷が望まれているが、厚膜形成が可能なシルク印刷では精度や精細性が不足する。Although thick printing such as electrode printing and PDP ribs is desired, silk printing capable of forming a thick film lacks accuracy and fineness.
現在高精度が求められる比較的厚盛の印刷が可能なグラビヤ法においても得られる膜厚は数μで、要求される膜厚は得られない。本案はグラビヤ印刷並みの高精度、高精細を得つつ、シルク印刷並みの数十μの膜厚を印刷によって得るという課題を解決するために考案したものである。Even in the gravure method capable of relatively thick printing that currently requires high accuracy, the film thickness obtained is several μm, and the required film thickness cannot be obtained. This proposal was devised in order to solve the problem of obtaining a film thickness of several tens of microns as high as silk printing by printing while obtaining high precision and high definition equivalent to gravure printing.
本案は上記課題を解決する為に考案したもので、
まず、シリコンゴムシート面に求める画像に応じた深度、開口を設け、該シートに精度を待たせるため裏面に剛性板を貼り付シリコンゴム製凹版(4)とする。This plan was devised to solve the above problems.
First, a depth and opening corresponding to the image required on the silicon rubber sheet surface are provided, and a rigid plate is pasted on the back surface to make the sheet wait for accuracy to form a silicon rubber intaglio (4).
シリコン製凹版面の凹部に機能性素材を充填する。接着剤を追加充填し該機能性素材を固化及び表面に粘着性を持たせた後に、充填された機能性素材のすべてを基板に転写する。この事により機能性素材を厚膜にしてパターン形成する。 The functional material is filled in the concave portion of the silicon intaglio surface. After the adhesive material is additionally filled to solidify the functional material and make the surface sticky, all of the filled functional material is transferred to the substrate. As a result, the functional material is formed into a thick film to form a pattern.
▲1▼従来の印刷では、機能性素材はべつの樹脂すなわち溶媒や溶剤で包み印刷適正を持たせたインキ化して使用する為、素材が溶媒や溶剤中で分散している為素材の機能が損なわれている(図6−▲6▼)。これに対し、本案では素材そのものをまず接しさせ接着剤で固化する為、素材の密度が高く(図1−▲7▼)、素材の機能が損なわれる事が少ないパターンの形成が出来る。(1) In conventional printing, the functional material is wrapped in another resin, ie, a solvent or solvent, and used as an ink with appropriate printing properties. The material functions because the material is dispersed in the solvent or solvent. It has been damaged (Fig. 6-6). On the other hand, in this plan, since the material itself is first contacted and solidified with an adhesive, the density of the material is high (FIG. 1- (7)), and a pattern can be formed with little loss of the function of the material.
▲2▼凹部に充填した素材のすべてを使用しパターン形成を行う為、凹部の深度、大きさの設定、充填する構造材の形状や大きさを選定する事によって必要な高さ形状の構造体を形成法できる。 (2) Since the pattern is formed using all of the material filled in the recess, the structure of the required height is selected by setting the depth and size of the recess and selecting the shape and size of the structural material to be filled. Can be formed.
シリコンゴムによって作成した凹版の凹部に機能性素材を充填、更に接着剤を充填、接着剤によって機能性素材が半固化し表面に粘着性の発生を待って凹部に充填した素材をすべて基板に転写し、機能性素材によるパターン形成を行う。Fill the concave part of the intaglio plate made of silicon rubber with a functional material, and then fill with an adhesive, and the functional material is semi-solidified by the adhesive and the adhesive material is transferred to the substrate. Then, pattern formation with a functional material is performed.
請求項1についての原理を図1により説明する。
請求項2についての原理を図2により説明する。The principle of
The principle of
図4により請求項1の実施例の説明を行う。図3によって作成したシリコンゴム製凹版(4)を作成、準備する(▲1▼)凹版凹部(11)に、機能性素材(5)をブレードにて充填する(▲2▼−1)。接着剤(6)を全面に塗布する(▲3▼)。 The embodiment of
接着剤の半硬化(▲4▼)を待って、シリコンゴムシート(21)面で出来たクリ−ニングローラー(20)を圧着し、凹版平部(23)に付いた素材と接着剤のすべてを転写除去する(▲5▼)。凹部内の接着剤の更なる乾燥を待って、基板(8)を圧着(▲6▼)、凹部内の半固化素材と接着剤をすべて基板に転写(▲7▼)。基板の焼成により粉末を完全固化する。これにより銀粉を硬化した輻20μ、高さ10μの導電配線を作成できた。 Wait until the adhesive is semi-cured (4), press the cleaning roller (20) on the surface of the silicone rubber sheet (21), and all the material and adhesive on the intaglio plate (23) Is transferred and removed (5). After further drying of the adhesive in the recess, the substrate (8) is pressure-bonded (6), and the semi-solidified material and the adhesive in the recess are all transferred to the substrate (7). The powder is completely solidified by firing the substrate. As a result, a conductive wiring of 20 μm in height and 10 μm high in which silver powder was cured could be created.
図5により請求項2の実施例の説明を行う。所定の深さを持ったシリコンゴム製凹版を準備する(▲1▼)。凹版凹部に、機能性素材(5)をブレード(18)にて充填する(▲2▼)。接着剤Aを全面に塗布する(▲3▼)。 The embodiment of
接着剤の半硬化(▲4▼)を待って、シリコンゴムシート(21)面で出来たクリ−ニングローラー(20)を圧着し、凹版平部(23)に付いた素材残と接着剤のすべてを転写除去する(▲5▼)。凹部内の接着剤の乾燥によって素材の更なる固化(▲6▼)を待って、接着剤B(13)をブレードにより塗布(▲7▼)。 Waiting for the semi-curing of the adhesive (4), press the cleaning roller (20) made of the silicon rubber sheet (21) surface, and remove the adhesive from the material remaining on the intaglio plate (23). All of them are transferred and removed ((5)). After the material in the recess is dried, the material is further solidified (6), and the adhesive B (13) is applied with a blade (7).
基板(8)を圧着、凹部内の固化素材と接着剤(A)接着剤(B)をすべて基板に転写(▲9▼)。基板の焼成により素材を完全固化しパターン形成する。これによりNI粉を硬化した幅180μ、高さ150μの構造物(仕切り板)を作成できた。 The substrate (8) is pressure-bonded, and the solidified material and the adhesive (A) and the adhesive (B) in the recess are all transferred to the substrate (9). The material is completely solidified by baking the substrate to form a pattern. As a result, a structure (partition plate) having a width of 180 μm and a height of 150 μm obtained by curing the NI powder could be created.
請求項3の実施例を図4により説明する。実施例2と同様の工程において、凹版凹部に、揮発性溶剤と混合した機能性素材をブレードにて充填する(▲2▼−2)。以後の工程は実施例2と同じ。An embodiment of
請求項4の実施例を図7に示す。
版胴(29)を設け、シリコンゴム製凹版(4)を貼る。該凹版に接するように接着剤供給機構(27)、機能性素材供給機構(28)、シリコンゴムシート(21)を張ったクリーニングローラー(20)を装備し、基板(8)を乗せて接して動く版定盤(30)を設けてある(▲1▼)。An embodiment of
A plate cylinder (29) is provided, and a silicon rubber intaglio (4) is applied. Equipped with an adhesive supply mechanism (27), a functional material supply mechanism (28), and a cleaning roller (20) with a silicone rubber sheet (21) in contact with the intaglio, and a substrate (8) is placed on and in contact with it. A moving platen (30) is provided (1).
凹版面に機能性素材供給機構により機能性素材を供給し、接着剤供給機構により接着剤を供給する(▲2▼)。凹版表面をクリーニングローラーによってクリーニングする(▲3▼)。凹版画像を基板に転写する(▲4▼)。The functional material is supplied to the intaglio surface by the functional material supply mechanism, and the adhesive is supplied by the adhesive supply mechanism ((2)). The surface of the intaglio is cleaned with a cleaning roller ((3)). The intaglio image is transferred to the substrate (4).
基板面に機能性のある素材を機能を損なうことなくパターン形成を試みる為に用いる。
高さや幅を求める構造体を基板上にパターン形成する為に用いる。A functional material is used on the substrate surface to attempt pattern formation without impairing the function.
A structure for obtaining the height and width is used to form a pattern on the substrate.
1、母型 2、シリコンゴム液 3、ベース板
4、シリコンゴム製凹版 5、機能性素材 6、接着剤
7、接着している機能性素材 8、基板
9、基板に転写した機能性素材
10、所定の凹部を持った凹版 11、接着剤A
12、硬化した接着剤A 13、接着剤B 14、溶媒+溶剤
15、インキ化された機能性素材 16、溶剤が減り半硬化したインキ
17 基板に転写したインキ
18、ブレード 19、半硬化した接着剤
20、クリーニングローラー
21、シリコンゴムシート 22、転写した凹版平部のインキ
23、凹版平部 24、凹部
25、揮発性溶剤と混合した機能性素材 26、溶媒
27、接着剤供給機構 28、機能性素材供給機構 29、版胴
30、版定盤DESCRIPTION OF
12. Cured adhesive A 13, Adhesive B 14, solvent + solvent 15, functionalized ink material 16, semi-cured ink 17 with reduced solvent,
Claims (4)
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JP2009103405A JP2010239101A (en) | 2009-03-30 | 2009-03-30 | Method of forming pattern and printing machine |
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JP2009103405A JP2010239101A (en) | 2009-03-30 | 2009-03-30 | Method of forming pattern and printing machine |
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JP2010239101A true JP2010239101A (en) | 2010-10-21 |
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JP2009103405A Pending JP2010239101A (en) | 2009-03-30 | 2009-03-30 | Method of forming pattern and printing machine |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013202838A (en) * | 2012-03-27 | 2013-10-07 | Mimaki Engineering Co Ltd | Printing method and printing device |
KR20160085041A (en) * | 2015-01-07 | 2016-07-15 | 성낙훈 | Fine circuit board and its manufacturing method |
JP2019523559A (en) * | 2016-07-28 | 2019-08-22 | ランダ ラブズ (2012) リミテッド | Method of applying an electrical conductor to an electrically insulating substrate |
-
2009
- 2009-03-30 JP JP2009103405A patent/JP2010239101A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013202838A (en) * | 2012-03-27 | 2013-10-07 | Mimaki Engineering Co Ltd | Printing method and printing device |
KR20160085041A (en) * | 2015-01-07 | 2016-07-15 | 성낙훈 | Fine circuit board and its manufacturing method |
KR102412346B1 (en) * | 2015-01-07 | 2022-06-22 | 성낙훈 | Fine circuit board and its manufacturing method |
JP2019523559A (en) * | 2016-07-28 | 2019-08-22 | ランダ ラブズ (2012) リミテッド | Method of applying an electrical conductor to an electrically insulating substrate |
US11546999B2 (en) | 2016-07-28 | 2023-01-03 | Lumet Technologies Ltd. | Apparatus for applying of a conductive pattern to a substrate |
US11570902B2 (en) | 2016-07-28 | 2023-01-31 | Lumet Technologies, LTD. | Flexible membrane for applying a pattern to a substrate |
US11832395B2 (en) | 2016-07-28 | 2023-11-28 | Landa Labs (2012) Ltd. | Application of electrical conductors to an electrically insulating substrate |
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