JP2010219306A - Electronic component mounting apparatus and nozzle drive control method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus for suppressing the waste of the index operation of a feeder and improving production efficiency. <P>SOLUTION: The electronic component mounting apparatus includes: a head part provided with a nozzle support part which supports a plurality of nozzles arrayed at equal intervals on a circumference so as to be freely reciprocated in a rotating shaft direction and rotates while supporting the respective nozzles, and first and second nozzle drive parts which move the respective nozzles positioned at prescribed first and second driving positions in the rotating shaft direction; a rotation control part which controls the rotating operation of the nozzle support part; and a drive control part which controls the first and second nozzle drive parts. The rotation control part makes the nozzle support part perform the rotating operation at a prescribed timing so as to position two adjacent nozzles across one nozzle corresponding to the first or second driving position. The drive control part controls the first or second nozzle drive part so as to alternately reciprocate the respective nozzles positioned at the first or second driving position in parallel with the rotation drive of the nozzle support part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and a nozzle drive control method, and more particularly, to an electronic component mounting apparatus including a rotary head and a nozzle drive control method.

  An electronic component mounting apparatus that mounts electronic components on a printed circuit board is an apparatus that picks up and picks up electronic components from a feeder that supplies the electronic components by using a nozzle, and transports and mounts the electronic components on the printed circuit board. An electronic component mounting apparatus generally has a plurality of nozzles in order to mount electronic components on a printed board efficiently and at high speed. The arrangement form of the nozzles is roughly classified into two types: a series arrangement type in which the nozzles are arranged on a straight line, and a circumferential arrangement type in which the nozzles are arranged on the circumference.

  For example, as shown in FIG. 8, the electronic component mounting apparatus in which nozzles are arranged in series includes a head unit 10 in which nozzles 14 are arranged in a straight line on a nozzle support unit 12. When the electronic components 4 are sucked from the corresponding feeders 16, the nozzles 14 transport and mount the sucked electronic components 4 on the printed circuit board by moving the head unit 10 that supports the nozzles 14. At this time, as shown in FIG. 8, when the arrangement pitch p1 of the nozzles 14 provided on the nozzle support portion 12 and the arrangement pitch p2 of the feeder 16 are the same, an actuator (not shown) that drives the nozzles 14. By providing each of the nozzles 14, the suction operation can be performed simultaneously. Thereby, production efficiency can be improved.

  On the other hand, in an electronic component mounting apparatus having a rotary head in which nozzles are arranged on the circumference, a plurality of nozzles 24 are arranged at equal intervals on the circumference of the nozzle support portion 22 as shown in FIG. The head unit 20 is provided. Generally, the rotary head unit 20 is provided with only one actuator (not shown) for driving the nozzle 24 in the vertical direction, and the electronic component 4 is sucked from the corresponding feeder 26 by the single nozzle 24. Then, the nozzle support portion 22 is rotated and the electronic component 4 is sucked from the feeder 26 corresponding to the nozzle 24 by the next nozzle 24. Accordingly, the head unit 20 can be moved after the plurality of electronic components 4 are held by the plurality of nozzles 24, and the number of times the head unit 20 reciprocates between the feeder 26 and the printed circuit board can be reduced. . However, when there is one actuator, the plurality of nozzles 24 cannot be driven simultaneously.

  When the electronic component 4 is simultaneously picked up using the rotary head unit 20, various configurations of the head unit 20 are conceivable. For example, as shown in FIG. 10, two rotary head portions 20a and 20b are provided, and an actuator (not shown) for driving the nozzles 24a and 24b is provided on each of the head portions 20a and 20b. (For example, Patent Document 1). By providing two actuators, the electronic component 4 can be sucked simultaneously at the driving positions za and zb. However, an actuator for driving the two head portions 20a and 20b, a camera for inspecting the arrangement of the electronic component 4, etc. A plurality of image processing elements 28a and 28b such as lenses must be provided, which raises a problem that costs increase.

  Further, for example, as shown in FIG. 11, the adjacent nozzles 24 (nozzles 24 positioned at the drive positions z <b> 1 and z <b> 2) among the plurality of nozzles 24 provided in one rotary head unit 20 are driven. The head unit 20 can be configured by providing two actuators (for example, Patent Document 2). However, two indexes are required on the pivot axis, and the field of view for image processing needs to be wide as shown in FIG. In the head unit 20 having such a configuration, as shown in FIG. 12A, the electronic component 4 can be simultaneously sucked by matching the arrangement pitch p1 of the adjacent nozzles 24 with the pitch p2 of the feeder 26a. However, as shown in FIG. 12B, when the electronic component 4 is sucked from the feeder 26b arranged at a different pitch p3 from the feeder 26a in FIG. 12A, the arrangement pitch p1 of the nozzles 24 and the pitch p3 of the feeder 26b are different. Therefore, simultaneous adsorption cannot be performed.

  Further, for example, as shown in FIG. 13, among the plurality of nozzles provided in one rotary head unit 22, nozzles 24 at positions facing each other across the rotation center (nozzles 24 positioned at driving positions z <b> 1 and z <b> 2). It is also possible to provide the head unit 20 by providing two actuators so as to drive (see Patent Document 3). However, in the head unit 20 having such a configuration, it is necessary to provide the two image processing elements 28d and 28e, and there is a problem that the cost increases. Similarly to the head unit 20 having the configuration shown in FIG. 11, when the pitch of the nozzles 24 to be driven and the pitch of the feeders 26 are different, the electronic component may be provided even if two actuators for driving the nozzles 24 are provided. 4 cannot be adsorbed simultaneously.

JP 2003-101291 A JP 2003-347795 A JP 2008-053750 A

  As described above, in the configuration of the conventional rotary head unit, there are few cases where electronic components can be picked up simultaneously depending on the type and quantity of the components, and the cost of the image processing element is increased.

  Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is a new and improved technique capable of suppressing wasteful index operation of the feeder and improving production efficiency. An electronic component mounting apparatus and a nozzle drive control method are provided.

  In order to solve the above-described problem, according to one aspect of the present invention, a plurality of nozzles arranged at equal intervals on a circumference around a rotation axis are supported reciprocally in the direction of the rotation axis, and A nozzle support that can rotate around the rotation axis while supporting the nozzle, and each nozzle located at a predetermined first drive position and second drive position in the direction of the rotation axis according to the rotation of the nozzle support. A head unit including a first nozzle driving unit and a second nozzle driving unit, a rotation control unit that controls a rotation operation of the nozzle support unit, and a first nozzle driving unit and a second nozzle driving unit. An electronic component mounting apparatus including a drive control unit is provided. The rotation control unit rotates the nozzle support unit at a predetermined timing so that two adjacent nozzles separated from each other among the plurality of nozzles are positioned corresponding to the first drive position or the second drive position. The drive control unit performs the first reciprocating operation so that each nozzle aligned with the first drive position or the second drive position is alternately reciprocated in parallel with the rotation driving of the nozzle support unit by the rotation control unit. The nozzle driving unit or the second nozzle driving unit is controlled.

  According to the present invention, the two nozzle drive units that drive the nozzles of the rotary head unit in the pickup direction are provided. The two nozzle drive units are provided so as to drive two nozzles located on both sides of one nozzle among a plurality of nozzles arranged on the circumference. Then, the drive control unit rotates the nozzle support unit in the nozzle arrangement direction, and at the timing when the next driven nozzle is positioned at the drive position of the nozzle drive unit to be driven next, the first nozzle drive unit and The second nozzle drive unit is driven alternately. As a result, while completing the indexing operation in which the component supply unit can supply components at the drive position of one nozzle drive unit, the other nozzle drive unit drives the nozzle at the drive position to perform the pickup operation. be able to.

  Here, the drive control unit drives the first nozzle drive unit to cause the nozzle located at the first drive position to perform a pickup operation, and then is driven by the second nozzle drive unit. Is driven at the second drive position, the second nozzle drive unit is driven to cause the nozzle located at the second drive position to perform a pickup operation. While the pickup operation is performed at the first drive position, the index operation is performed at the second drive position. For this reason, after the pickup operation at the first driving position is completed, if the next nozzle to be driven is positioned at the second driving position, it is immediately possible without waiting for the completion of the index operation at the second driving position. The pickup operation can be started.

  Further, the drive control unit starts driving from the nozzle drive unit located on the upstream side in the rotation direction of the nozzle support unit among the first nozzle drive unit and the second nozzle drive unit. Thereby, the nozzles located at the two drive positions can be operated efficiently and alternately.

  In order to solve the above-mentioned problem, according to another aspect of the present invention, the nozzle support portions are arranged at equal intervals on the circumference centering on the rotation axis of the nozzle support portion, and are supported reciprocally in the direction of the rotation axis. The nozzle support unit supports each nozzle at a predetermined timing so that two adjacent nozzles separated from each other among the plurality of nozzles are positioned corresponding to the first drive position or the second drive position. Rotating around the rotation axis in a state, and reciprocating alternately each nozzle aligned with the first drive position or the second drive position in parallel with the rotation driving of the nozzle support portion A nozzle drive control method is provided.

  As described above, according to the present invention, it is possible to provide an electronic component mounting apparatus and a nozzle drive control method capable of suppressing wasteful index operation of a feeder and improving production efficiency.

It is a schematic plan view which shows the structure of the electronic component mounting apparatus concerning embodiment of this invention. It is a schematic perspective view which shows the structure of the head part concerning the embodiment. It is explanatory drawing which shows the arrangement position of the nozzle of the head part concerning the embodiment. It is explanatory drawing which shows the position of the nozzle drive part concerning the embodiment. It is explanatory drawing which shows the drive timing of the nozzle of the past and the same embodiment. It is explanatory drawing which shows the drive control method of the nozzle concerning the embodiment. It is explanatory drawing which shows the relationship between the arrangement pitch of the nozzle concerning the same embodiment, and the pitch of a feeder. It is explanatory drawing which shows the relationship between the arrangement pitch of the nozzle concerning the same embodiment, and the pitch of a feeder. It is explanatory drawing which shows the structure of the electronic component mounting apparatus provided with the head part by which the conventional nozzle was arrange | positioned in series. It is explanatory drawing which shows the structure of the electronic component mounting apparatus provided with the rotary head part by which the conventional nozzle was arrange | positioned by the circumference. It is explanatory drawing which shows the structure at the time of providing two conventional rotary head parts. It is explanatory drawing which shows a structure at the time of providing the two actuators which drive the nozzle adjacent to the conventional rotary head part. It is explanatory drawing which shows the relationship between the arrangement pitch of the nozzle of the head part shown in FIG. 11, and the pitch of a feeder. It is explanatory drawing which shows the relationship between the arrangement pitch of the nozzle of the head part shown in FIG. 11, and the pitch of a feeder. It is explanatory drawing which shows the structure at the time of providing the two actuators which drive the nozzle which opposes on both sides of a rotation center in the conventional rotary head part.

  Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In addition, in this specification and drawing, about the component which has the substantially same function structure, duplication description is abbreviate | omitted by attaching | subjecting the same code | symbol.

<Schematic configuration of electronic component mounting apparatus>
First, a schematic configuration of an electronic component mounting apparatus 100 according to an embodiment of the present invention will be described based on FIGS. 1 and 2. FIG. 1 is a schematic plan view showing the configuration of the electronic component mounting apparatus 100 according to the present embodiment. FIG. 2 is a schematic perspective view showing the configuration of the head unit 150 according to the present embodiment.

  The electronic component mounting apparatus 100 according to the present embodiment is an apparatus for mounting the electronic component 4 supplied from the component supply unit 160 on the substrate 2. For example, as shown in FIG. 1, the electronic component mounting apparatus 100 includes a substrate transfer unit 110, first transfer units 120 and 130, a second transfer unit 140, a head unit 150, and a component supply unit 160. Consists of.

  The substrate transport unit 110 transports the substrate 2 on which the electronic component 4 is mounted in the x-axis direction. For example, the substrate transport unit 110 can be configured by two belt conveyors 112 and 114 that extend substantially in parallel in the x-axis direction. By rotating these belt conveyors 112 and 114 at the same speed, the substrate 2 provided on the belt conveyors 112 and 114 can be moved in the x-axis direction.

  The 1st conveyance parts 120 and 130 convey the head part 150 supported by the 2nd conveyance part 140 mentioned later to a y-axis direction. The first transport units 120 and 130 support, for example, the second transport unit 140 and guide rails 122 and 132 that extend in the y-axis direction, and feed screws that are provided in parallel with the guide rails 122 and 132. 124 and 134, and drive units 126 and 136 that rotationally drive the feed screws 124 and 134. Nuts (not shown) provided in the second transport unit 140 are screwed into the feed screws 124 and 134. When the feed screws 124 and 134 are rotated by the drive units 126 and 136, the nuts screwed to the feed screws 124 and 134 move in the y-axis direction, and the second transport unit 140 is moved in the y-axis direction. .

  The second transport unit 140 supports the head unit 150 and transports the head unit 150 in the x-axis direction. The second transport unit 140 supports, for example, the head unit 150 and rotates the guide rail 142 extended in the x-axis direction, the feed screw 144 provided in parallel to the guide rail 142, and the feed screw 144. Driving unit 146. A nut (not shown) fixed to the head unit 150 is screwed to the feed screw 144. When the feed screw 144 is rotated by the drive unit 146, the nut screwed to the feed screw 144 moves in the x-axis direction, and the head unit 150 is moved in the x-axis direction. In addition, tables (not shown) that slide on the guide rails 122 and 132 of the first transport units 120 and 130 are provided at both ends of the second transport unit 140. In addition, although the feed screws 124, 134, and 144 are used for the first transport unit 120 and 130 and the second transport unit 140, the present invention is not limited to such an example, and for example, a linear motor may be used. .

  The head unit 150 takes out the electronic component 4 from the component supply unit 160 and transports and mounts the electronic component 4 on the substrate 2 on the substrate transport unit 110. As shown in FIG. 2, the head unit 150 according to the present embodiment is a rotary head in which a plurality of nozzles 154 that suck and hold the electronic component 4 are arranged at equal intervals on the circumference of the nozzle support unit 152. . The head unit 150 according to the present embodiment includes twelve nozzles 154, and the electronic component 4 is sucked and held on one end side of each nozzle 154 (the side facing the component supply surface of the substrate 2 or the feeder 162). A possible holding part 156 is provided. Further, the head unit 150 includes a rotation drive unit (not shown) that rotates the nozzle 154 in order to correct the angle of the component.

  The head unit 150 includes two nozzle driving units 170 and 180 that drive the nozzle 154 in the z-axis direction. The nozzle driving units 170 and 180 are, for example, abutting against the other end of the nozzle 154, moving units 172 and 182 that push and move the nozzle 154 in the negative z-axis direction, and an actuator that drives the moving units 172 and 182 in the z-axis direction. It can comprise from the drive parts 174 and 184 provided with. The electronic component mounting apparatus 100 according to the present embodiment includes a drive control unit (not shown) that controls the nozzle drive units 170 and 180. The drive control unit moves the nozzle 154 in the direction of approaching and separating from the component supply unit 160 according to a drive control method of the nozzle 154 described later. A detailed description of the arrangement of the nozzle driving units 170 and 180 and the driving control of the nozzle 154 by the nozzle driving units 170 and 180 will be described later.

  Returning to FIG. 1, the component supply unit 160 includes one or more feeders 162 that supply the electronic component 4. As the feeder 162, for example, a tape feeder, a stick feeder, a bulk feeder, or the like can be used. The electronic component 4 supplied from the feeder 162 is adsorbed by the nozzle 154 of the head unit 150 and is transported to and mounted at a predetermined position on the substrate 2 by the first transport units 120 and 130 and the second transport unit 140. .

  In addition to the nozzle drive unit 170, the drive control unit of the present embodiment also controls the drive unit that rotates the nozzle support unit 152 and the drive units of the first transport units 120 and 130 and the second transport unit 140. It shall be. However, the present invention is not limited to this example, and a control unit that controls driving of each driving unit may be provided.

  The schematic configuration of the electronic component mounting apparatus 100 according to the present embodiment has been described above. The electronic component mounting apparatus 100 according to the present embodiment drives two nozzles at a timing at which the nozzle 154 to be driven next is positioned at the drive position of the nozzle drive unit 170 (180) to be driven next among the plurality of nozzles 154. The two nozzles 154 are driven alternately by the units 170 and 180. Hereinafter, a method of driving the nozzle 154 of the head unit 150 according to the present embodiment will be described with reference to FIGS. FIG. 3 is an explanatory diagram showing the arrangement position of the nozzles 154 of the head unit 150 according to the present embodiment. FIG. 4 is an explanatory diagram showing the positions of the nozzle driving units 170 and 180 according to the present embodiment. FIG. 5 is an explanatory diagram showing the driving timing of the nozzle 154 of the conventional and this embodiment. FIG. 6 is an explanatory diagram illustrating a drive control method for the nozzle 154 according to the present embodiment.

<Nozzle drive position>
First, the arrangement of the nozzles 154 of the head unit 150 and the positions of the nozzles 154 driven by the nozzle driving units 170 and 180 will be described with reference to FIGS. 3 and 4. As described above, in the head unit 150 according to this embodiment, the twelve nozzles 154 (A to L) are arranged at equal intervals on the circumference. Of these nozzles 154, two nozzles 154 are located at driving positions z1 and z2 driven by the nozzle driving units 170 and 180. As shown in FIG. 4, the driving position z <b> 1 is a position driven by the nozzle driving unit 170, and the driving position z <b> 2 is a position driven by the nozzle driving unit 180.

  As shown in FIG. 4, the driving positions z <b> 1 and z <b> 2 of the nozzle 154 by the nozzle driving units 170 and 180 are provided at the positions of the nozzles 154 adjacent to each other in the arrangement direction of the nozzles 154 with the one nozzle 154 interposed therebetween. That is, the driving positions z1 and z2 of the nozzles 154 are arranged with a distance (2p) twice the pitch p between the adjacent nozzles 154. In FIG. 3, the nozzle 154 (B) is positioned at the driving position z <b> 1 driven by the nozzle driving unit 170, and the nozzle 154 (L) is positioned at the driving position z <b> 2 driven by the nozzle driving unit 180.

  In the electronic component mounting apparatus 100 according to the present embodiment, an image processing element such as a camera or a lens for inspecting the arrangement or the like of the electronic component 4 can be provided at, for example, a position 190 in FIG. The configuration in which one image processing element is provided at such a position can be the same as the conventional arrangement of image processing elements. Therefore, even if two nozzle drive units 170 and 180 are provided, the number of image processing elements to be installed does not increase, so that an increase in cost can be suppressed.

<Nozzle drive control method>
The electronic component mounting apparatus 100 including the head unit 150 in which the nozzles 154 are driven at such driving positions z1 and z2 is the nozzle driving unit in which the nozzle 154 to be driven next is driven next among the plurality of nozzles 154. The nozzle driving unit 170 (180) is driven at a timing at which the driving position z1 (z2) is 170 (180). Thereby, it is possible to reduce the waiting time that occurs when the feeder 162 performs an indexing operation that enables the electronic component 4 to be supplied. Hereinafter, the drive control method for the nozzle 154 according to the present embodiment will be described in detail with reference to FIGS. 5 and 6. In the following description, it is assumed that the nozzle driving unit 152 rotates clockwise.

[When equipped with one nozzle drive unit]
Before describing the drive control method of the nozzle 154 according to the present embodiment, a conventional nozzle drive control method in the case where one nozzle drive unit is provided will be described as a comparative example. The nozzle drive timing is shown in the upper diagram of FIG. Here, the vertical axis z indicates the amount of movement of the nozzle in the z-axis direction, the vertical axis Rotary indicates the rotational operation state of the nozzle support, and the vertical axis Feeder indicates the index operation state of the feeder. The horizontal axis indicates time.

  First, when the feeder is in a state where electronic components can be supplied, the nozzle is moved in the negative z-axis direction by the nozzle driving unit, and holds the electronic components supplied by the feeder by suction. When the electronic component is held, the nozzle is moved in the positive z-axis direction by the nozzle driving unit (pickup operation). At this time, when the nozzle rises to a predetermined height, an index operation is started in which the feeder that has supplied the electronic component can supply the next electronic component. Further, when the nozzle rises to a predetermined height, the nozzle support portion starts to rotate so that the next nozzle is positioned at the drive position z by the nozzle drive portion. Here, in FIG. 5, the start time of the index operation and the timing of the rotation operation of the nozzle support portion are different, but the present invention is not limited to this example, and these operations may be performed at the same timing.

  Here, the feeder indexing operation generally requires more time than the operation of rotating the nozzle support portion to prepare the next nozzle. Therefore, as shown in the upper diagram of FIG. 5, the electronic component pick-up operation by the next nozzle positioned at the driving position is performed until the index operation of the feeder is completed after the next nozzle is positioned at the driving position by the nozzle driving unit. Can not do. For this reason, in the conventional nozzle drive control method, time T1 is required from the start of the nozzle pickup operation to the start of the next nozzle pickup operation.

[2. Nozzle drive control method of this embodiment]
Next, the drive control method of the nozzle 154 according to this embodiment is shown in the lower part of FIG. Here, the vertical axis z1 represents the amount of movement in the z-axis direction of the nozzle 154 located at the drive position z1, and the vertical axis z2 represents the amount of movement in the z-axis direction of the nozzle 154 located at the drive position z2. The vertical axis Rotary indicates the rotational operation state of the nozzle support portion 152. The vertical axis Feeder1 indicates the index operation state of the feeder 162 that supplies the electronic component 4 to the nozzle 154 located at the drive position z1, and the vertical axis Feeder2 indicates the feeder 162 that supplies the electronic component 4 to the nozzle 154 located at the drive position z2. Indicates the index operating state. The horizontal axis indicates time. At this time, the driving positions z1 and z2 for driving the nozzles 154 by the nozzle driving units 170 and 180 are arranged with the pitch 2p as described with reference to FIGS.

  First, when the feeder is in a state where electronic components can be supplied, a pick-up operation is performed by the nozzle 154 located at the drive position z1 on the upstream side in the rotation direction of the nozzle support portion 152 among the two drive positions z1 and z2. The nozzle 154 located at the drive position z1 is moved in the negative z-axis direction by the nozzle drive unit 170 and sucks and holds the electronic component 4 supplied by the feeder 162. When the electronic component 4 is held, the nozzle 154 is moved in the positive z-axis direction by the nozzle driving unit 170. At this time, when the nozzle 154 is raised to a predetermined height, the feeder 162 (Feeder 1) that has supplied the electronic component 4 starts an indexing operation that enables the next electronic component to be supplied. Further, when the nozzle 154 rises to a predetermined height, the nozzle support portion 152 starts to rotate so that the next nozzle 154 is positioned at the driving position z2 by the nozzle driving portion 180.

  At this time, the feeder 162 (Feeder 2) that supplies the electronic component 4 to the nozzle 154 located at the drive position z2 has already been indexed. Therefore, if the next nozzle 154 is positioned at the drive position z2, the pickup operation can be started. When the next nozzle 154 is positioned at the driving position z2, the nozzle driving unit 180 moves the nozzle 154 positioned at the driving position z2 in the negative z-axis direction. The nozzle 154 positioned at the driving position z2 is moved in the positive z-axis direction by the nozzle driving unit 180 when holding the electronic component 4 provided by the feeder 162 (Feeder2). When the nozzle 154 rises to a predetermined height, the feeder 162 (Feeder 2) that has supplied the electronic component 4 starts an indexing operation that enables the next electronic component to be supplied. When the nozzle 154 rises to a predetermined height, the nozzle support portion 152 starts to rotate so that the next nozzle 154 is positioned at the drive position z1 by the nozzle drive portion 170.

  Here, the feeder 162 (Feeder 1) that supplies the electronic component 4 to the nozzle 154 located at the driving position z1 performs the index operation while the electronic component 4 of the other feeder 162 (Feeder 2) is being picked up. Completed. Accordingly, the pickup operation can be started when the next nozzle 154 is positioned at the drive position z1. Thus, by alternately driving the nozzle 154 located at the drive position z1 and the nozzle 154 located at the drive position z2, the pickup operation of the nozzle 154 can be performed without waiting for the completion of the index operation of the feeder 162. it can.

  In the drive control method of the nozzle 154 according to the present embodiment, the time required for the nozzle 154 to pick up the electronic component 4 provided by the feeder 162 is after the pickup operation of the nozzle 154 located at the drive position z1 is started. It is time T2 until the pickup operation by the next nozzle 154 located at the drive position z2 is started. The drive control method of the nozzle 154 of this embodiment can eliminate the waiting time for the pickup operation until the index operation of the feeder 162 is completed, and the conventional drive control method in which the nozzle is driven by one nozzle drive unit. As compared with, it is possible to shorten the time for one pickup by time t (= T1-T2). Thereby, the production efficiency of the electronic component mounting apparatus 100 can be improved.

  FIG. 6 shows a specific example of the drive control method of the nozzle 154. In FIG. 6, it is assumed that twelve nozzles 154 (A to L) are provided in the same manner as the head unit 150 shown in FIGS. First, as illustrated in FIG. 6A, the nozzle 154 (B) is driven by the nozzle driving unit 170 and the electronic component 4 is picked up. When the electronic component 4 is picked up by the nozzle 154 (B), the nozzle driving unit 152 is rotated as shown in the lower diagram of FIG. 5, and the next nozzle 154 (A) is moved as shown in FIG. 6B. It is located at the drive position z2 by the nozzle drive unit 180. When the nozzle 154 (A) is positioned at the driving position z2, the pickup of the electronic component 4 by the nozzle 154 (A) is started. During this time, the indexing operation of the feeder 162 that supplies the electronic component 4 to the nozzle 154 at the driving position z1 is continuously performed, and is completed before the nozzle 154 (D) is moved to the driving position z1.

  Further, when the electronic component 4 is picked up by the nozzle 154 (A), the nozzle driving unit 152 is rotated as shown in the lower diagram of FIG. 5, and as shown in FIG. 6C, the next nozzle 154 (D ) Is located at the drive position z1 by the nozzle drive unit 170. When the nozzle 154 (D) is positioned at the driving position z1, the pickup of the electronic component 4 by the nozzle 154 (D) is started. During this time, the indexing operation of the feeder 162 that supplies the electronic component 4 to the nozzle 154 at the drive position z2 is continued, and is completed before the nozzle 154 (C) is moved to the drive position z2. Thereafter, when the electronic component 4 is picked up by the nozzle 154 (D), the nozzle driving unit 152 is rotated, and the next nozzle 154 (C) is driven by the nozzle driving unit 180 as shown in FIG. Located at z2. When the nozzle 154 (C) is positioned at the driving position z2, pickup of the electronic component 4 by the nozzle 154 (C) is started.

  Similarly, as shown in FIG. 6 (e), after picking up by the nozzle 154 (H) at the driving position z1, as shown in FIG. 6 (f), by the nozzle 154 (G) at the driving position z2. Pickup is performed. That is, in the drive control method of the nozzle 154 according to the present embodiment, B (z1) → A (z2) → D (z1) → C (z2) → F (z1) → E (z2) → H (z1) → The pickup operation of the nozzle 154 is performed in the order of G (z2) → J (z1) → I (z2) → L (z1) → K (z2).

  Thus, the pickup operation of the nozzle 154 at the drive position z1 by the nozzle drive unit 170 and the pickup operation of the nozzle 154 at the drive position z2 by the nozzle drive unit 180 are alternately performed, and the nozzles 154 located at the respective drive positions z1 and z2. The indexing operation of the feeder 162 for supplying the electronic component 4 to the electronic component 4 is performed during the pickup operation performed at each of the driving positions z1 and z2. Thereby, the pick-up operation by the nozzle 154 can be performed without waste, and the production efficiency of the electronic component mounting apparatus 100 can be improved.

<Advantages of continuous adsorption>
The drive control method of the nozzle 154 according to the present embodiment is a method of driving the two nozzle drive units 170 and 180 alternately. That is, the electronic component 4 is not simultaneously picked up by a plurality of nozzles as in the prior art, but the two nozzle driving units 170 and 180 are driven with a time difference to suck the electronic component 4 continuously. Therefore, it is not necessary to exactly match the arrangement pitch of the nozzles at the driving position and the pitch of the feeder as in the prior art.

  For example, as shown in FIG. 7A, when the arrangement pitch p1 of the nozzles 154 at the driving positions z1 and z2 is twice the pitch p2 of the feeder 162a, the driving position z1 is caused by two feeders 162a sandwiching one feeder 162a. The electronic component 4 can be supplied to the nozzle 154 located at the nozzle 154 and the nozzle 154 located at the drive position z2. For example, as shown in FIG. 7B, when the arrangement pitch p1 of the nozzles 154 at the driving positions z1 and z2 is the same as the pitch p3 of the feeder 162b, the two adjacent feeders 162b are positioned at the driving position z1. The electronic component 4 can be supplied to the nozzle 154 and the nozzle 154 located at the driving position z2.

  Furthermore, the drive control method of the nozzles 154 according to the present embodiment is performed when the arrangement pitch p1 of the nozzles 154 at the drive positions z1 and z2 is not an integral multiple of the pitch of the feeder 162 other than the case shown in FIGS. 7A and 7B. This is also possible because the nozzles 154 at the driving positions z1 and z2 are continuously driven with a time difference.

  In this case, after the pickup operation of the nozzle 154 located at the drive position z1 is performed and before the pickup operation of the nozzle 154 located at the drive position z2 is performed, the rotation operation of the nozzle support portion 152 and the index operation by the feeder 162 are performed. At the same time, the position of the head unit 150 is moved by driving the second conveying unit 140 so that the nozzle driving unit 180 is aligned with the component providing position of the corresponding feeder 162. Further, when the pickup operation of the nozzle 154 located at the drive position z2 is completed, the pickup operation of the nozzle 154 located at the drive position z1 is performed together with the rotation operation of the nozzle support portion 152 and the index operation by the feeder 162. The position of the head unit 150 is moved by driving the second transport unit 140 so that the nozzle driving unit 170 is aligned with the component providing position of the corresponding feeder 162.

  In this way, by alternately driving the two nozzle drive units 170 and 180 with a time difference, the arrangement pitch p1 of the nozzles 154 at the drive positions z1 and z2 and the pitch of the feeder 162 do not exactly match, The electronic component 4 can be picked up efficiently. Therefore, even if the size of the feeder 162 changes depending on the type and quantity of the electronic component 4, it is possible to flexibly cope with without changing the configuration of the head unit 150.

  The configuration of the electronic component mounting apparatus 100 according to the embodiment of the present invention and the electronic component mounting method using the same have been described above. According to the present embodiment, the rotary head unit 150 in which a plurality of nozzles 154 are arranged at equal intervals on the circumference includes two nozzle driving units 170 and 180 that drive the nozzle 154 in the z-axis direction. At this time, the driving positions z1 and z2 of the nozzle 154 by the nozzle driving units 170 and 180 are provided at the positions of the adjacent nozzles 154 with one nozzle 154 interposed therebetween. And according to the index operation of the feeder 162 corresponding to each drive position z1, z2, the nozzle 154 located in the drive position z1 and the nozzle 154 located in the drive position z2 are continuously driven alternately.

  Thereby, while completing the index operation of the feeder 162 corresponding to one drive position (for example, drive position z1), the pickup operation of the nozzle 154 located in the other drive position (for example, drive position z2) is performed. Production efficiency by the electronic component mounting apparatus 100 can be improved. Further, the pickup operation of the electronic component 4 can be performed efficiently without strictly matching the arrangement pitch p1 of the nozzles 154 at the driving positions z1 and z2 and the pitch of the feeder 162. Therefore, the size of the feeder 162 is reduced. Can respond flexibly to changes.

  The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious that a person having ordinary knowledge in the technical field to which the present invention pertains can come up with various changes or modifications within the scope of the technical idea described in the claims. Of course, it is understood that these also belong to the technical scope of the present invention.

  For example, in the above embodiment, the number of nozzles 154 is twelve, but the present invention is not limited to this example, and it is sufficient that at least four or more nozzles 154 are provided. In the electronic component mounting apparatus according to the present invention, since the nozzles are alternately operated by the two nozzle driving units, the driving efficiency can be improved by using an even number of nozzles.

  Moreover, although the said embodiment demonstrated the case where the nozzle support part 152 was rotated clockwise, this invention is not limited to this example, You may rotate the nozzle support part 152 counterclockwise. In this case, it drives from the nozzle 154 located in the drive position (drive position z2 in FIG. 4) of the nozzle support part 152 in the rotation direction upstream.

2 Substrate 4 Electronic component 100 Electronic component mounting apparatus 110 Substrate transport unit 120, 130 First transport unit 140 Second transport unit 150 Head unit 152 Nozzle support unit 154 Nozzle 160 Component supply unit 162 Feeder 170, 180 Nozzle drive unit 190 Image processing element position

Claims (4)

A plurality of nozzles arranged at equal intervals on a circumference centered on the rotation axis are reciprocally supported in the direction of the rotation axis, and the nozzles are rotatable around the rotation axis while supporting the nozzles. A first nozzle driving unit that moves the nozzles located at predetermined first driving positions and second driving positions in the direction of the rotation axis in accordance with rotation of the nozzle supporting unit, and a second nozzle driving unit; A head unit including a nozzle driving unit;
A rotation control unit for controlling the rotation operation of the nozzle support unit;
A drive control unit for controlling the first nozzle drive unit and the second nozzle drive unit;
With
The rotation control unit supports the nozzle so that two adjacent nozzles that are separated from each other among the plurality of nozzles are positioned corresponding to the first driving position or the second driving position. Rotating the part at a predetermined timing,
The drive controller alternately reciprocates each nozzle aligned with the first drive position or the second drive position in parallel with the rotation driving of the nozzle support by the rotation controller. A component mounting apparatus that controls the first nozzle driving unit or the second nozzle driving unit. The drive control unit
After driving the first nozzle driving unit to cause the nozzle located at the first driving position to perform a pickup operation,
Next, at a timing when the nozzle driven by the second nozzle driving unit is positioned at the second driving position, the second nozzle driving unit is driven and the nozzle is positioned at the second driving position. The electronic component mounting apparatus according to claim 1, wherein the nozzle performs a pickup operation.   3. The drive control unit according to claim 1, wherein the drive control unit starts driving from a nozzle drive unit located upstream in the rotation direction of the nozzle support unit among the first nozzle drive unit and the second nozzle drive unit. The electronic component mounting apparatus described. Two adjacent nozzles separated by one nozzle among a plurality of nozzles arranged at equal intervals on a circumference centering on the rotation axis of the nozzle support portion and supported so as to reciprocate in the rotation axis direction Rotating around the rotation axis in a state where the nozzle support portion supports each nozzle at a predetermined timing so that the nozzle is positioned corresponding to the first drive position or the second drive position;
In parallel with the rotational drive of the nozzle support part, alternately reciprocating each of the nozzles aligned with the first drive position or the second drive position;
A nozzle drive control method.

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