JP2010201842A - Cover for illuminating device and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cover for an illuminating device with a thickness of not smaller than 1 mm which can improve the transmission efficiency of light by inhibiting the reflection of the light on the surface without coating the surface with a coat such as a multilayered film, and a method of manufacturing the cover for the illuminating device. <P>SOLUTION: The cover 100 for the illuminating device is formed of a thermoplastic resin or a heat-curable resin, and whose thickness is not smaller than 1 mm for allowing light emitted by the illuminating device to transmit therethrough. In addition, the cover 100 has a projecting part 10 formed at a shorter interval P than the shortest wavelength of the wavelength of the light emitted from the illuminating device on at least, one surface. Furthermore, the projecting part 10 is integrally formed using the same thermoplastic resin or the same heat-curable resin as that of the remainder of the cover 100 for the illuminating device. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a lighting device cover used for protecting a lighting device (light emitting device), which is a light emitting unit, in a lighting device and a method for manufacturing the same.

  In a lighting device (or lighting fixture), a lighting device cover that covers a lighting device (or light-emitting device) such as an LED or a fluorescent tube is used. This cover for a lighting device is often used for the purpose of protecting the lighting device and obtaining an optical effect such as reducing the glare by diffusing the light from the lighting device. Since the cover for the lighting device needs to transmit light from the light emitting device, it is usually made of resin or glass. In particular, since the resin is excellent in durability and aesthetics and can be easily reduced in weight, more covers for lighting devices made of resin are used.

  However, such a cover made of resin and glass causes surface reflection. That is, a part of the light reaching the incident side surface of the cover (the surface closer to the lighting device out of both surfaces of the cover) is reflected by the incident side surface and cannot enter the cover. Further, after entering the inside of the cover, a part of the light reaching the exit side surface of the cover (the surface of the cover farther from the lighting device) is reflected by the exit side surface and cannot be emitted from the cover. Therefore, since the amount of light transmitted through the cover is reduced due to reflection on the incident side surface and the output side surface, there is a problem that the light transmission efficiency is lowered.

  In order to solve this problem, a cover for a lighting device in which a multilayer film is formed on the surface and reflection is suppressed has been used. However, such a multilayer film needs to be formed in a limited atmosphere such as a vacuum, takes a long time to form, and has a high cost. Therefore, it is applied only to limited applications.

  Therefore, as a method of suppressing reflection more easily and inexpensively in a shorter time, there is known a method of providing nano-order minute convex portions (or concave portions) on the surface of resin or glass (Patent Documents 1 and 2). . The surface reflection is prevented by shortening the pitch of the concavo-convex shape, that is, the interval between the concave portions or the convex portions, rather than the wavelength of light to be prevented from being reflected.

Patent Document 1 discloses a method for producing a resin member having a nano-order convex portion on the surface by molding using a mold having a nano-order concave portion formed by anodization. Further, Patent Document 2 discloses a method of forming a nano-order convex portion by performing etching using fine particles as a mask, and injection molding using a mold having a concave portion formed by this method, and the surface is nano-sized. A method of manufacturing a resin member having an order convex portion is shown.

International Publication No. WO 2008/001847 JP 2008-143162 A

  However, even if injection molding is performed by injecting resin into the mold with nano-order irregularities, the nano-order is formed on the surface of the resin member obtained due to the stress caused by the shrinkage of the resin during cooling. May not be formed. In the mold, the resin part body and the convex part on the surface are integrally molded by molten resin, and then the body part shrinks and moves in the process of cooling and reaching room temperature, but the convex part on the surface becomes the concave part of the mold. Try to stay. For this reason, a big force acts between the convex part of the surface and the main body. And when a convex part can stay in the recessed part of a metal mold | die, a surface convex part and a main-body part may be pulled apart by this force. On the other hand, if the convex part on the surface is pulled by the shrinking main body part and jumps out of the concave part of the mold, the convex part on the surface may be crushed by rubbing against the surface of the mold. In either case, no nano-order convex portions remain on the surface of the obtained resin member.

  As the thickness of the resin member to be obtained by injection molding increases, the force generated at the time of contraction increases, and it becomes difficult to form a target nano-order convex portion on the surface. The cover for a lighting device usually requires a thickness of 1 mm or more to protect the lighting device. However, with conventional injection molding, it is possible to obtain a resin member having a nano-order convex portion on the surface and a thickness of less than 1 mm. However, the nano-order convex portion formed integrally with the main body portion on the surface is available. A resin member having a portion (or a recess) and a thickness of 1 mm or more could not be obtained.

  In other words, a cover for a lighting device having a thickness of 1 mm or more made of a single resin in which convex portions or concave portions arranged at intervals shorter than the wavelength of light to be transmitted are integrally formed on the surface can be obtained. There wasn't.

  For example, by forming a nano-order convex part on the surface of a substrate whose thickness is less than 1 mm by the method described in Patent Document 1 or 2, the surface is obtained by joining this to a separately prepared main body such as a plate material. It was possible to obtain a lighting device cover having a thickness of 1 mm or more having a nano-order convex portion. However, when the type of resin between the base material such as the above-described film and the main body is different, there is a problem that light is reflected at the boundary portion of the different resin due to the difference in the type of resin and the transmission efficiency is lowered. In addition, even if the type of resin of the base (including the concavo-convex part) and the main body such as the above-mentioned film is the same, there is always a joint between the base and the main body because it is not integrally formed, There is a problem in that the transmission efficiency decreases because light is scattered in this portion. Furthermore, an increase in cost due to the step of joining the base material such as the film and the main body has been a problem.

  Accordingly, an object of the present invention is to provide a cover for a lighting device having a thickness of 1 mm or more that can improve light transmission efficiency by suppressing light reflection on the surface without coating the surface with a multilayer film or the like. To do. Another object of the present invention is to provide a method for manufacturing the lighting device cover.

  Aspect 1 of the present invention is a cover for a lighting device that is made of a thermoplastic resin or a thermosetting resin and has a thickness of 1 mm or more through which light emitted from the lighting device is transmitted. And having convex portions arranged at intervals shorter than the shortest wavelength among the wavelengths of emitted light, and the convex portions are integrated by the same thermoplastic resin or thermosetting resin as the rest of the cover for the lighting device. It is the cover for lighting devices characterized by being formed by these.

  Aspect 2 of the present invention is the illumination device cover according to aspect 1, wherein the convex portions are arranged at intervals of 380 nm or less.

  Aspect 3 of the present invention is the illumination device cover according to aspect 1 or 2, wherein the convex portions are provided on both sides.

  Aspect 4 of the present invention is the illumination device cover according to any one of aspects 1 to 3, wherein the convex portion is narrower on the distal side than on the proximal side.

  Aspect 5 of the present invention is the illumination device cover according to aspect 4, wherein the convex portion has a conical shape.

  Aspect 6 of the present invention is characterized in that the convex portion is formed by providing a conical concave portion whose inside is hollow and whose width becomes narrower from the outside toward the inside. It is a cover for lighting devices in any one of the aspects 1-3 to do.

  Aspect 7 of the present invention is the lighting device cover according to any one of the aspects 1 to 6, wherein the illumination device cover has a curved surface portion on a surface, and the convex portion is formed perpendicular to the curved surface portion. It is a cover for lighting devices.

  Aspect 8 of the present invention is the illumination device cover according to any one of claims 1 to 7, wherein the thermoplastic resin or thermosetting resin is a water-repellent resin.

  Aspect 9 of the present invention is the illumination device cover according to any one of claims 1 to 7, wherein the thermoplastic resin or the thermosetting resin is a hydrophilic resin.

  A tenth aspect of the present invention is the illumination device cover according to any one of the first to seventh aspects, wherein the thermoplastic resin or the thermosetting resin is a low-elasticity resin having an elastic modulus of 1 GPa or less. .

  Aspect 11 of the present invention is formed of a thermoplastic resin or a thermosetting resin, and at least one surface thereof is integrally formed with convex portions arranged at intervals shorter than the shortest wavelength of light emitted from the lighting device. A method for manufacturing a cover for a lighting device having a thickness of 1 mm or more, wherein 1) a step of preparing a mold having a recess for forming the protrusion, and 2) a frame body is disposed in the cavity And a step of insert molding such that at least a part of the outer periphery of the illumination device cover is bonded to the frame when the resin is injected.

  Aspect 12 of the present invention is the manufacturing method according to aspect 11, wherein only the mold is heated in the step 2) and then the mold is pressed against the plate.

  A thirteenth aspect of the present invention is the manufacturing method according to the eleventh aspect, wherein in the step 2), the plate is heated to a temperature equal to or higher than the glass transition temperature of the plate, and the mold having a temperature equal to or lower than the glass transition temperature is pressed. .

  Aspect 14 of the present invention is characterized in that two of the molds are prepared in the step 1), and the molds are pressed against both surfaces of the plate in the step 2). It is a manufacturing method.

  According to the fifteenth aspect of the present invention, a dummy die having no concave portion on the surface is further prepared in the step 1), and the die is pushed on one of both surfaces of the plate and the dummy die is pushed on the other in the step 2). It is a manufacturing method in any one of aspects 11-13 characterized by applying.

  A sixteenth aspect of the present invention is the manufacturing method according to the fourteenth or fifteenth aspect, wherein the two molds or the mold and the dummy mold are simultaneously pressed against both surfaces of the plate.

  Aspect 17 of the present invention is characterized in that when the plate is cooled in the step 2), the two molds or the mold and the dummy mold are simultaneously separated from the plate at a temperature lower than the glass transition temperature of the plate. It is a manufacturing method in any one of aspects 14-16.

  Aspect 18 of the present invention is the manufacturing method according to any one of Aspects 11 to 17, wherein the restraint is performed by sandwiching at least a part of the outer periphery of the plate with a chuck jig.

  Aspect 19 of the present invention is the manufacturing method according to any one of aspects 11 to 17, wherein the restraint is performed by adhering at least a part of the outer periphery of the plate to a frame.

  Aspect 20 of the present invention is the manufacturing method according to any one of aspects 11 to 19, wherein in the step 1), the recess is formed by anodization.

  Aspect 21 of the present invention is formed of a thermoplastic resin or a thermosetting resin, and at least one surface thereof is integrally formed with convex portions arranged at intervals shorter than the shortest wavelength of light emitted from the lighting device. A method for manufacturing a lighting device cover having a thickness of 1 mm or more by injection molding in which the thermoplastic resin or thermosetting resin is injected into a cavity formed between a first mold and a second mold. 1) a step of providing a concave portion for forming the convex portion in the first mold, and 2) a cooling process after injecting the thermoplastic resin or thermosetting resin, the thermoplastic resin or thermosetting Both the first mold and the second mold are simultaneously separated from the illumination device cover at a temperature between a glass transition temperature of the resin and a temperature lower by 20 ° C. than the glass transition temperature. Is a manufacturing method which comprises the steps of, a.

  According to the aspect 22 of the present invention, in the step 2), a knockout pin is protruded from the inner surface of the first mold or the second mold so that both the first mold and the second mold are simultaneously illuminated. The manufacturing method according to aspect 21, wherein the mold is released from the device cover.

  Aspect 23 of the present invention is made of a thermoplastic resin or a thermosetting resin, and at least one surface is integrally formed with convex portions arranged at intervals shorter than the shortest wavelength of light emitted from the lighting device. A method for manufacturing a lighting device cover having a thickness of 1 mm or more by injection molding in which the thermoplastic resin or thermosetting resin is injected into a cavity formed between a first mold and a second mold. 1) a step of providing a concave portion for forming the convex portion in the first mold; and 2) when a frame is disposed in the cavity and the thermoplastic resin or thermosetting resin is injected. And a step of insert molding such that at least a part of the outer periphery of the lighting device cover is bonded to the frame.

  Aspect 24 of the present invention is formed of a thermoplastic resin or a thermosetting resin, and convex portions arranged at intervals shorter than the shortest wavelength of light emitted from the lighting device are integrally formed on at least one surface. A method for manufacturing a lighting device cover having a thickness of 1 mm or more by injection molding in which the thermoplastic resin or thermosetting resin is injected into a cavity formed between a first mold and a second mold. 1) a step of providing a concave portion for forming the convex portion in the first mold, and 2) at least an outer periphery of the illumination device cover obtained when the thermoplastic resin or the thermosetting resin is injected. A process for constructing the first mold or the second mold such that a catch portion having a thickness thicker than a central portion of the illumination device cover is formed in a part. When a production method which comprises a.

  According to a twenty-fifth aspect of the present invention, the concave portion is also formed in the second mold in the step 1), and the convex portions are formed on both surfaces of the illumination device cover by the injection molding. It is a manufacturing method in any one of -24.

  Aspect 26 of the present invention is the manufacturing method according to any one of aspects 21 to 25, wherein in the step 1), the recess is formed by anodization.

  According to the present invention, there is provided a lighting device cover having a thickness of 1 mm or more and a lighting device cover capable of improving light transmission efficiency by suppressing reflection of light on the surface without coating the surface with a multilayer film or the like. A manufacturing method can be provided.

Fig.1 (a) is sectional drawing of the cover 100 for lighting devices concerning this invention, FIG.1 (b) shows the cover 100 for lighting devices seen from the A direction shown by the arrow in Fig.1 (a). It is a top view. FIG. 2 is a plan view showing a random arrangement of the convex portions 10. FIG. 3 is an enlarged view of the convex portion 10 and its peripheral portion in FIG. FIG. 4A is a perspective view showing a part of a lighting device cover 100a which is a modification of the lighting device cover 100, and FIG. 4B shows a IVb-IVb cross section of FIG. It is sectional drawing. FIG. 5A is a cross-sectional view showing a lighting device 500 using the lighting device cover 100, and FIG. 5B is a plan view of the lighting device 500. FIG. 6 is a cross-sectional view showing a lighting apparatus 600 including a lighting device cover 100b, which is another modification of the lighting device cover 100. As shown in FIG. 7 is an enlarged cross-sectional view of a part of the illumination device cover 100b shown in FIG. FIG. 8 is a schematic cross-sectional view showing a pressing method for obtaining the illumination device cover 100. FIG. 9 is a plan view showing an example of an arrangement of the chuck jig 62 for holding the resin plate 110 with the outer periphery of the resin plate 110 interposed therebetween. FIG. 10A is a plan view showing the frame 75 used in the second method and the lighting device cover 100 which is insert-molded so as to be bonded to the inner periphery of the frame 75, and FIG. FIG. 11 is a cross-sectional view showing the Xb-Xb cross section of FIG. FIG. 11 is a cross-sectional view showing the illumination device cover 100 in which the hook portion 120 is provided in the cavity formed by the first mold 70 and the second mold 72. FIG. 12 is a graph showing the relationship between the wavelength and the transmittance of the samples of Example 1 and Example 2 and the comparative example sample.

1. Illumination Device Cover FIG. 1A is a cross-sectional view of an illumination device cover 100 according to the present invention, and FIG. 1B is an illumination device view as seen from the direction A indicated by the arrow in FIG. 3 is a plan view showing a cover 100. FIG.

  A plurality of convex portions 10 are provided on the surface of at least one surface of the illumination device cover 100 to suppress reflection of light on the surface. A gap 20 is formed between the convex portions 10. The convex illumination device cover 100 has higher light transmission efficiency when light is prevented from being reflected on both the light incident surface (one surface) and the light exit surface (the other surface). Therefore, it is preferable that the convex part 10 is provided in both surfaces like embodiment shown to Fig.1 (a).

  Moreover, you may provide the convex part 10 in a part of one surface or both surfaces of the cover 100 for lighting devices. However, since the light transmission efficiency is improved in the portion where the convex portion 10 exists, the convex portion 10 is preferably provided on substantially the whole of one or both surfaces.

  The thickness of the cover 100 for lighting devices is at least 1 mm or more. This is to ensure the strength or rigidity necessary to protect the lighting device. In addition, as for the thickness of the cover 100 for lighting devices, it is preferable that H1 (The part (main part) thickness except the part protruded outside by the convex part 10) shown to Fig.1 (a) is 1 mm or more. .

Details of the convex portion 10 will be described below.
The convex portions 10 are arranged at an interval (pitch) P that is shorter than the wavelength of the light to be transmitted through the illumination device cover 100. This is because if the distance between the convex portions 10 is equal to or less than the wavelength of the transmitted light, light interference does not occur and reflection on the surface can be suppressed. The illumination light often includes almost all wavelength components in the visible region. Therefore, in order to reliably prevent the reflection of visible light, the interval P is preferably 380 nm or less, which is the shortest wavelength in the visible light region. Furthermore, the interval P is more preferably 250 nm or less so that no interference of light occurs when light enters or exits from the oblique direction with respect to the illumination device cover 100. This is because when light is incident obliquely, the pitch in the optical path becomes longer than the interval P.
In addition, the space | interval P of the convex part 10 means the distance between the centers of the convex part 10, as shown to Fig.1 (a) and (b).

In the embodiment shown in FIG. 1B, the convex portions 10 are regularly arranged in a lattice shape. The arrangement of the convex portions 10 is not limited to this lattice arrangement, and various arrangements such as a hexagonal close-packed arrangement can be selected. Furthermore, as shown in FIG. 2, you may arrange | position the convex part 10 at random. By arranging them at random, the periodicity of the projections 10 is lost, and even if the interval P is close to the wavelength of the light transmitted through the illumination device cover 100, interference is less likely to occur. In such a random arrangement, the interval P between the convex portions 10 means the interval to the nearest convex portion 10 among other convex portions 10 adjacent to each convex portion 10. For example, a plurality of convex portions 10 are arranged around the convex portion 10-1 which is one of the plurality of convex portions 10 in FIG. 2, and the closest one is the convex portion. 10-3. Therefore, the interval P between the protrusions 10-1 to mean interval _{P 1} between the convex portion 10-3. Like in FIG. 2, the spacing P of the projections 10-2, means the distance _{P 2} of the convex portion 10-3, the closest projections on the convex portion 10-2. And in the some convex part 10 arrange | positioned at random, that the space | interval is P means that 50% or more of the space | interval _Pn about each convex part 10 is below P as mentioned above.

Next, the shape of the convex part 10 is demonstrated.
The convex portion 10 may have various shapes such as a cylinder and a prism. A preferable shape is a cone having a triangular cross section as shown in FIG. 1 (a), and a pyramid such as a pyramid such as a triangular pyramid or a quadrangular pyramid. In addition, the cone shape in this specification includes the shape where the terminal part is flat as shown to Fig.1 (a). The reason why the shape of the convex portion 10 is preferably a pyramid will be described with reference to FIG. FIG. 3 is an enlarged view of the convex portion 10 and its peripheral portion in FIG. The refractive index of the structure having the convex portion 10 and the gap 20 formed between the convex portions 10 depends on the ratio of the length of the convex portion 10 and the length of the gap 20 in the horizontal direction of the portion. .

That is, as shown in FIG. 3, since there is no air gap 20 at the base end portion of the convex portion 10, that is, the portion below the height H 2 ₀ (the height is zero), the refractive index constitutes the illumination device cover 100. It is equal to the refractive index of the material (that is, the material constituting the convex portion 10). On the other hand, in the portion where the height is higher than H2 (that is, the height of the convex portion 10), since the convex portion 10 does not exist and only the space (that is, air) exists, the refractive index becomes equal to the refractive index of air.

Between the height H2 ₀ (that is, height zero) and the height H, the refractive index varies with the height depending on the ratio of the gap 20 and the convex portion 10. For example, the height H2 ₁ of the portion shown in FIG. 3, the width of voids 20 is X1, the height H2 ₂ parts, the width of the gap 20 is X2. And since the convex part 10 is a cone shape with a width | variety narrowing upwards, the direction of X2 becomes larger than X1. That is, the ratio occupied by voids 20 at the height H2 ₁ in a cross section shown in FIG. 3 (X1 / P) is larger than the ratio occupied by voids 20 in the height H2 ₂ (X2 / P). Accordingly, the refractive index at the height H2 _1, rather than the refractive index at the height H2 _2, will be close to the refractive index which constitutes the more convex portions 10.

Thus, if the convex part 10 is a cone shape, the width | variety becomes large toward the lower part from the upper part, and it respond | corresponds to this. From the value at which the refractive index is closer to air, from the terminal end of the convex portion (the portion of height H2) to the base end (height H2 ₀ (ie, height zero)), the value closer to the material constituting the convex portion 10 It changes continuously. When the refractive index continuously changes in this way, the reflection of light can be further suppressed.

  In addition, not only a cone shape but the shape where the width | variety of the convex part 10 reduces continuously from a base end to a terminal is a preferable shape. As an example of such a preferable shape other than the cone shape, for example, there is a hemisphere arranged like a bowl.

  In the embodiment shown in FIGS. 1A and 1B, the convex portion 10 has a conical shape and has a flat portion at the end portion (tip portion). Since the pointed portion of the cone-shaped end tends to be easily worn, there is an advantage that the wear resistance of the convex portion 10 is improved by flattening the end like the convex portion 10. On the other hand, by having the sharp end portion, the ratio of the gap 20 and the convex portion 10 between the convex portions 10 is continuously changed in the vicinity of the end portion of the convex portion 10, thereby changing the refractive index more. There is an advantage that it becomes smooth.

  Therefore, it is possible to appropriately select whether to provide a flat portion at the end of the convex portion 10 or a sharp end depending on the wear resistance, refractive index change, etc. required for the lighting device cover 100. .

  Further, instead of providing a flat portion, a round (R) may be attached to the end of the convex portion 10. In this case, the radius of the radius is preferably 10 nm or more, and more preferably 20 nm or more.

  There is no particular limitation on the width W of the convex portion 10 (the value at the portion where the width is maximum when the width changes within a conical cross section) and the height H2. However, it is preferable that the aspect ratio (height H2 / width W) obtained by dividing the height H2 of the convex portion 10 by the width W of the convex portion 10 is 0.5 or more. This is because when the aspect ratio is 0.5 or more, the refractive index changes more continuously, so that more light can be transmitted through the illumination device cover 100 without being reflected.

  In the embodiment shown in FIG. 1A, the base end portion of the convex portion 10 is not in contact with the base end portion of another adjacent convex portion 10 (that is, has a flat portion on the bottom surface of the gap 20). However, for the purpose of obtaining a desired aspect ratio or smoothing the refractive index change around the base end portion of the convex portion 10, the base end portions of the adjacent convex portions are appropriately brought into contact with each other. (In other words, the convex portion 10 may be arranged so that the bottom surface of the gap 20 does not have a flat portion).

  The illumination device cover 100 according to the present invention is made of a single resin, has a convex portion 10 formed integrally with other portions on the surface (that is, has no interface due to bonding), and has a thickness. 1 mm or more.

  Various resins can be used for such a lighting device cover 100. Either a thermoplastic resin or a thermosetting resin can be selected. Examples of suitable thermoplastic resins include polymethyl methacrylate (PMMA), polycarbonate (PC) and polypropylene. Examples of suitable thermosetting resins include silicone and epoxy resins.

  Further, when a water repellent resin is used, the water repellency of the nanostructure such as the convex portion 10 is improved. Accordingly, it is possible to prevent the convex portion 10 (that is, the lighting device cover 100) from being soiled. Examples of the water-repellent resin that can be used for the lighting device cover 100 include a transparent fluororesin resin such as polytetrafluoroethylene (PTFE) and a silicone resin.

  Further, when a hydrophilic resin is used, the hydrophilicity of the nanostructure such as the convex portion 10 is improved. Therefore, when the dirt adhering to the convex portion 10 (that is, the lighting device cover 100) is washed with an aqueous solution containing a surfactant such as water or detergent, the wettability between water or the aqueous solution and the convex portion 10 is improved. Therefore, the cleaning property can be improved. Examples of hydrophilic resins that can be used for the lighting device cover 100 include polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET).

  The elastic modulus of the resin used for the lighting device cover 100 is not particularly limited. However, when a material having a low elastic modulus is used, when the convex portion 10 having a nanostructure is deformed by an external force, the stress generated in the convex portion 10 can be reduced, and the convex portion 10 is hardly broken. In the manufacturing method described in detail later, when the illumination device cover 100 having a curved surface or a three-dimensional shape is released from the mold, the mold release direction and the convex portion 10 extend from the base end to the end. When the directions are different, the convex portion 10 is deformed by the mold when the mold is released. In this case, if the convex portion 10 is formed of a low elastic modulus resin, the convex portion 10 is only elastically deformed, and is easily damaged without being damaged when completely released from the mold. You can return to As the low elastic modulus resin that can be used for the lighting device cover 100, a resin having an elastic modulus of 1 Ga or less is preferable. Examples of such elastic modulus resins include silicone resins, silsesquioxane resins, and thermoplastics. There is an elastomer.

・ Modification example 1
FIG. 4A is a perspective view showing a part of a lighting device cover 100a which is a modification of the lighting device cover 100, and FIG. 4B shows a IVb-IVb cross section of FIG. It is sectional drawing.

  In the illumination device cover 100 shown in FIGS. 1A and 1B, the convex portions 10 are obtained by projecting conical convex portions on the surface. On the other hand, in the illumination device cover 100a shown in FIGS. 4A and 4B, the gap 20a has an inverted conical shape having a wide outer width and a narrower width toward the inner side. Is forming.

  In the illumination device cover 100a as well as the illumination device cover 100, the ratio of the convex portion 10a and the gap portion 20a in the horizontal direction in FIG. 4B varies with the height, and the illumination device cover 100a. The ratio of the gap portion 20a increases toward the outer side (upward direction in FIG. 4B). Therefore, the refractive index continuously changes so as to approach the refractive index of the air as it goes to the outside, and to approach the refractive index of the resin constituting the convex portion 10 as it goes inward.

  The lighting device cover 100a has a structure in which adjacent convex portions (the convex portions 10a in FIG. 4B) are connected to each other, and is not easily broken by an external force such as a touch with a hand.

  Also in the illumination device cover 100a, as in the illumination device cover 100, the interval (pitch) of the convex portions 10a is arranged at an interval P shorter than the wavelength of light to be transmitted through the illumination device cover 100a. . Preferably, the interval P is 380 nm or less, and more preferably, the interval P is 250 nm or less.

  Since the interval P between the gap portions 20a shown in FIG. 4A is equal to the interval between the convex portions 10a shown in FIG. 4B, a desired interval P is obtained by adjusting the interval at which the gap portions 20a are arranged. Can do.

  Moreover, the arrangement | positioning of the space | gap part 20a can be arbitrary arrangement | positioning, such as a lattice arrangement | positioning similarly to the above-mentioned convex part 10, and random arrangement | positioning is also possible.

  Moreover, the height H2 of the convex part 10a can be changed by changing the height H2 of the space | gap part 20a. Furthermore, the width W of the convex part 10a can be made into a desired value by selecting suitably the width W2 of the bottom face (flat part inside the illumination device cover 100a) of the space | gap part 20a. There are no particular restrictions on the width W and height H2 of the convex portion 10a. However, it is preferable that the aspect ratio (height H2 / width W) obtained by dividing the height H2 of the convex portion 10a by the width W of the convex portion 10 is 0.5 or more.

  In addition, the width W of the convex part 10a when the space | gap part 20a is a reverse cone shape like the cover 100a for lighting devices passes through the center parts of the space | gap part 20b which was the nearest as shown in FIG.4 (b). It is the maximum value of the width of the convex portion 10a on the cross section.

  Here, although details are not shown repeatedly, the resin that can be used for the lighting device cover 100 a is the resin described above as the resin that can be used for the lighting device cover 100.

  FIG. 5A is a cross-sectional view showing a lighting device 500 using the lighting device cover 100, and FIG. 5B is a plan view of the lighting device 500. Although the light emitting diode (LED) 510 is used as the lighting device (light emitting device) in the lighting device 500, various lighting devices including a fluorescent lamp and an incandescent lamp can be used.

  The lighting device 500 includes a substrate 520 including wiring for supplying current to the light emitting diode 510, and the light emitting diode 510 is disposed on the substrate 520. Furthermore, the illumination device 500 includes a housing 530 that guides light from the illumination device (light emitting diode) 510 and holds the illumination device cover 100. The housing 530 is disposed on the substrate 520 so that its inner surface surrounds the light emitting diode 510. The housing 530 may include a reflective material for reflecting light from the lighting device upward on the inner side as necessary.

  The upper surface of the housing 530 has an opening, and the illumination device cover 100 is disposed so as to cover the opening. A part of the light emitted from the light emitting diode 510 directly reaches the lower surface of the lighting device cover 100, and another part is reflected by the inner surface of the housing 530 and then reaches the lower surface of the lighting device cover 100. To do. The light that has entered the illumination device cover 100 from the lower surface of the illumination device cover 100 passes through the illumination device cover 100 with high transmission efficiency and exits from the upper surface of the illumination device cover 100.

  Note that the illumination device cover 100 has a higher angle than light entering the surface at a low angle (an angle close to the surface) depending on conditions such as the value of the interval P and the wavelength of incident light. In some cases, reflection can be prevented with higher efficiency with respect to light entering at an angle close to perpendicular to the surface. In this case, it is preferable to make the light from the light emitting diode 510 incident on the illumination device cover 100 at a higher angle by controlling the angle of the reflective material arranged on the inner surface of the housing 530 or the housing 530 as necessary. .

  It goes without saying that the illumination device cover 100a may be used instead of the illumination device cover 100 in the illumination device 500.

・ Modification 2
FIG. 6 is a cross-sectional view showing a lighting apparatus 600 including a lighting device cover 100b, which is another modification of the lighting device cover 100. As shown in FIG. FIG. 7 is an enlarged cross-sectional view of a part of the illumination device cover 100b shown in FIG. Unlike the lighting device 500, the lighting device 600 does not have a housing that guides the light emitted from the light emitting diode 510 to the lighting device cover 100b. Instead, a concave surface (curved surface) 30 is provided on the lower surface of the illumination device cover 100b. The concave surface 30 is provided along the outer periphery (especially, the outer periphery of the upper half) of the light emitting diode so that more light (indicated by arrows in FIG. 6) spreading radially upward from the light emitting diode 510 can reach.

  The concave surface 30 is formed such that light from the light emitting diode 510 is incident on the concave surface 30 substantially perpendicularly. By the lens function of the illumination device cover 100b having curved surfaces (the concave surface 30 and the convex surface 40), most of the light incident from the concave surface 30 is directed upward and is emitted from the convex surface 40 in a direction substantially perpendicular to the convex surface 40. .

  As shown in FIG. 7, convex portions 10 b are arranged on the concave surface 30 at intervals P for the purpose of suppressing reflection of incident light. Similarly, on the convex surface 40, convex portions 10b are arranged at intervals P for the purpose of suppressing reflection of emitted light.

  Since light enters the curved surface (concave surface) 30 substantially perpendicularly as described above, the convex portion 10b is preferably arranged perpendicular to the curved surface 30. This is because if the convex portion 10b is inclined with respect to incident light, the reflection suppressing effect may be lowered. Similarly, the convex portion 10b on the curved surface (convex surface) 40 is also preferably arranged perpendicular to the curved surface.

  In addition, the width | variety of a base end part is wider than the width | variety of a terminal part like the embodiment of FIG. In the case of having such a shape, the arrangement of the convex part 10 perpendicular to the curved surface means that the center line C of the convex part 10b is arranged perpendicular to the curved surface (concave surface 30 or convex surface 40).

  Other characteristics such as the shape of the convex portion 10b, the constituent material, and the interval P may be the same as those of the convex portion 10 of the lighting device cover 100 described above. Moreover, you may arrange | position the convex part 10a of the cover 100a for lighting devices mentioned above. In this case, it is preferable to arrange the gap 20 a (that is, the center line of the gap 20 a) so as to be perpendicular to the concave surface 30 or the convex surface 40.

  In the lighting device cover 100b, the thickness H3 is 1 mm or more at the portion where the thickness shown in FIG. 6 is maximum, and more preferably, the thickness H1 of the flat portion of the lighting device cover 100b is 1 mm or more. This is to ensure the necessary strength.

2. Manufacturing Method of Lighting Device Cover Next, a manufacturing method of the lighting device cover 100 will be described below.
Manufacturing methods can be broadly divided into two methods: press method and injection molding method.
First, the pressing method will be described.

(1) Press Method FIG. 8 is a schematic cross-sectional view showing a press method for obtaining the illumination device cover 100. FIG. 9 is a plan view showing an example of the arrangement of a resin plate 110, the details of which will be described later, and a chuck jig 62 for holding the outer periphery of the resin plate 110 across the periphery.

  In the pressing method according to the present invention, first, a mold (mold) 60 having a concave portion corresponding to the convex portion 10 is prepared so that the desired convex portion 10 can be formed. Such a recess can be obtained, for example, by anodizing aluminum as disclosed in Patent Document 1.

  Further, in the method using anodization of aluminum, a curved surface is formed using an aluminum plate, and a concave portion (that is, a concave portion capable of forming the convex portion 10b) perpendicular to the curved surface can be obtained by anodizing the curved surface. Is. Further, the anodization of aluminum has an advantage that a concave portion corresponding to the convex portion 10 (for example, a cone shape) whose base end portion is wider than the distal end portion can be easily obtained.

  In addition, if necessary, an anodized aluminum is obtained to obtain a master, nickel electroforming is performed on the master to obtain an intermediate mold, and nickel electroforming is further performed on the intermediate mold to reproduce the master. A mold 60 may be obtained. There is an advantage that a plurality of molds 60 can be obtained from an original plate once created.

  Furthermore, even if a concave portion having the same shape as the above-described gap 20a is formed on the aluminum plate by anodization, nickel electroforming is performed on the aluminum plate, and the mold 60 for forming the convex portion 10a is obtained. Good.

  It is also possible to obtain a mold 60 by forming a convex portion having the same shape as the convex portion 10 on the aluminum plate by anodization, and performing nickel electroforming on the aluminum plate.

  As another method, for example, as described in Patent Document 2, a metal mainly composed of quartz glass, resin, silicon, gallium nitride, gallium arsenide, indium phosphide, nickel, iron, titanium, carbon, sapphire, or carbon nitride. Alternatively, the mold 60 can be obtained by etching with the surface of the nonmetal masked with island-shaped fine particles. This method also has an advantage that a concave portion corresponding to the convex portion 10 (for example, a cone shape) whose base end portion is wider than the distal end portion can be easily obtained.

  In addition, the mold 60 can be obtained by providing desired concave portions on a substrate made of various materials by lithography such as electron beam lithography.

  Then, the resin plate 110 serving as the illumination device cover 100 is heated, and the mold 60 is pressed to transfer the convex portion 10 (or the convex portion 10a or the convex portion 10b) onto the surface of the resin plate 110. And the cover 100 for lighting devices can be obtained by cooling the resin plate 110 which has the convex part 10 on the surface. During cooling, the mold 60 may be separated from the surface of the resin plate 110 when the resin plate 110 (particularly, the portion where the protrusions 10 a are formed) becomes lower than the glass transition temperature of the resin constituting the resin plate 110.

When the resin plate 110 is cooled, at least a part of the outer periphery thereof is chucked so that the convex portion 10 does not fall down or deform due to contraction of the resin constituting the illumination device cover 100 during the cooling. The resin plate 110 is held between 62 and the resin plate 110 is prevented from contracting.
In addition, when forming the convex part 10 in both surfaces of the resin plate 110, the two type | molds 60 are prepared, for example, as shown in FIG. 8, it presses against the resin plate 110 from the up-down both directions.

Details of this pressing method are shown below.
There are two general methods for heating the resin plate 110. First, the resin plate 110 is not directly heated, but the mold 60 is heated to, for example, the glass transition temperature of the resin to be used or more, the heated mold 60 is pressed against the resin plate 110, and the mold 60 contacts the resin plate 110. In this case, the surface portion of the resin plate 110 (particularly, the portion where the convex portion 10 is to be formed) is heated to a temperature higher than the glass transition temperature by the heat transmitted from the mold 60.

  This method has an advantage that shrinkage of the resin plate 110 during cooling can be more easily reduced because the entire resin plate 110 need not be heated to the glass transition temperature or higher.

  Another method is a method of heating the resin plate 110 to a glass transition temperature or higher without heating the mold 60. In this method, it is not necessary to wait until the resin plate 110 reaches the glass transition temperature or higher after pressing the mold 60, and the convex portion 10 can be formed quickly. That is, there is an advantage that the tact time can be shortened. In this method, the mold 60 may be heated to a temperature lower than the glass transition temperature or higher than the glass transition temperature in order to prevent the surface temperature of the resin plate 110 from being lowered when the mold 60 is pressed. The mold 60 may have a heating device and / or a cooling device inside because it may be necessary to adjust the temperature such as the heating described above.

  For the purpose of preventing the stress 10 from being damaged due to thermal stress due to the difference in thermal expansion coefficient between the mold 60 made of, for example, aluminum or nickel and the resin constituting the resin plate 110 when the resin plate 110 is cooled. It is preferable that the mold 60 pressed against the resin plate 110 is separated from the surface of the resin plate 110 after the temperature of the resin plate 110 becomes lower than the glass transition temperature during cooling.

  During cooling, the resin plate 110 is prevented from contracting by restraining at least a part of the outer periphery of the resin plate 110 as described above. One method of such restraining is to sandwich the outer peripheral portion of the resin plate 110 by the chuck jig 62. The timing at which the resin plate 110 is sandwiched (chucked) by the chuck jig 62 may be just before the start of cooling. However, in consideration of workability and the like, the resin plate 110 and / or the mold are sandwiched in advance after the resin plate 110 is sandwiched by the chuck jig. It is preferable to heat 60 and press the mold 60.

As shown in FIG. 7, when the resin plate 110 is held in the air with the chuck jig 62 interposed therebetween, if the mold 60 is pressed against only one surface of the resin plate 110, the other surface is only the outer periphery. Since it is not supported, the resin plate 110 may bend. For this reason, even when the convex portion 10 is provided only on one side of the resin plate 110, it is desirable to support a central portion of the resin plate 110 by pressing a die (dummy die) having no concave portion on the other surface.

  In this way, when the mold 60 and the dummy mold are pressed against both surfaces of the resin plate 110 and when the mold 60 is pressed against both surfaces of the resin plate 110 (that is, the convex portions 10a are formed on both surfaces), the mold 60 and the dummy are pressed. The mold or the two molds 60 are preferably pressed simultaneously. This is because the transferability on both sides can be made equal by making the temperature changes on both sides substantially the same. The mold 60 and the dummy mold or the two molds 60 are preferably separated from the resin plate 110 at the same time at a temperature lower than the glass transition temperature during cooling. This is because, compared with the case where the mold 60 or the dummy mold is in contact with only one surface, the thermal stress generated in the convex portion 10 can be reduced, and the collapse of the convex portion 10 can be prevented more reliably.

  In addition, about the part pinched by the chuck | zipper jig | tool 62 among the outer peripheral parts of the resin plate 110, for example, as shown in FIG. In addition to this, for example, it is also preferable to sandwich four locations on the outer periphery that are approximately 90 ° apart, and if the resin plate 110 is elongated, it is also preferable to sandwich both ends in the longitudinal direction. .

  An extra portion to be sandwiched by the chuck jig 62 is provided in advance on the outer peripheral portion of the resin plate 110, the convex portion 10 is formed, and after cooling to room temperature, the extra portion is removed to remove the illumination device cover 100. May be obtained.

  The method of restraining the outer peripheral portion of the resin plate 110 is not limited to the method of sandwiching the resin plate 110 with the chuck jig 62. For example, a resin plate 110 (for example, obtained by integral molding of a resin and a frame) in which at least a part of the outer peripheral portion is bonded to a frame having a small thermal expansion coefficient such as metal or ceramic is used. Also by the method, the outer peripheral part of the resin plate 110 can be restrained and thermal contraction can be suppressed. When the outer periphery of the resin plate 110 is constrained by such another method, a preferable portion to be constrained is the portion described above as a preferred embodiment of the portion sandwiched by the chuck jig 62.

  In the pressing method, as described above, the resin plate 110 is heated and the mold 60 is pressed to form the convex portion 10, so that the resin used is preferably a thermoplastic resin.

(2) Injection molding method As described above, the conventional injection molding method has a problem that the convex portion 10 is crushed due to shrinkage of the resin during cooling, and it is not possible to obtain a cover for a lighting device having a thickness of 1 mm or more. It was.
However, the inventor conducted intensive research and found three methods capable of manufacturing a cover for a lighting device having a thickness of 1 mm or more in injection molding. Details of the three methods will be described below. By using any of these methods, the illumination device cover 100, the illumination device cover 100a, and the illumination device cover 100b can be manufactured by injection molding.

  In any method, the first mold and the second mold are combined, and injection molding is performed in which a resin is injected into a cavity formed therebetween. The first mold forms one surface of the lighting device cover 100, and the second mold forms the other surface of the lighting device cover 100. When the convex portion 10 (or the convex portion 10a or the convex portion 10b) is formed only on one surface of the lighting device cover 100, a concave portion corresponding to the first mold is formed. When the convex portions 10 are formed on both surfaces of the lighting device cover 100, concave portions corresponding to both the first mold and the second mold are formed. This concave portion can be formed by the same method as the concave portion formed in the above-described pressing method mold 60.

  The recess may be formed directly in the first or second mold, or by forming the recess in another substrate or the like and then attaching the substrate having this recess to the first or second mold. May be.

First Method The first method is the first mold and the second mold performed after injecting resin into the cavity between the first mold and the second mold and forming the illumination device cover 100 by injection molding. The illumination device cover 100 is obtained by controlling the mold release conditions. That is, at a temperature between the glass transition temperature of the resin (thermoplastic resin or thermosetting resin) forming the lighting device cover 100 and a temperature lower by 20 ° C. than the glass transition temperature, the first lighting device cover 100 is removed from the first. The mold and the second mold are released.

  This is because if the mold is released at a temperature higher than the glass transition temperature (Tg), the resin is still soft, and the convex portion 10 may be deformed by the impact of the release. This is because the shrinkage of the resin proceeds and damage to the convex portion 10 begins to occur.

  Further, the first mold and the second mold are released simultaneously. This is because, when one mold is released, the formed illumination device cover 100 is not restrained, and thus contracts greatly, and the convex portion 10 is broken on the surface that is not released.

  Simultaneous release of the first mold and the second mold can be easily performed by using, for example, a movable knockout pin arranged in the first mold or the second mold. That is, when the first mold and the second mold are separated (opened), the device cover 100 is pushed out by causing the knockout pin to protrude from the inner surface of the mold, so that the lighting device cover 100 is Simultaneously release from the second mold.

  When the mold is opened, if the illumination device cover 100 remains in either mold due to the shape of the mold or the like, it is preferable to provide a knockout pin only in the remaining mold. When the illumination device cover 100 remains in both molds, the knock alto pin is provided in both molds.

  When the mold is opened, the end face of the knockout pin that pushes out the illumination device cover 100 and releases it from the mold is preferably flush with the inner surface of the mold. Moreover, it is preferable that the protruding speed of the knock alto pin when the mold is opened is slower than the speed at which the first mold and the second mold are separated. This is because if the protruding speed is too high, the lighting device cover 100 is pressed against the separated mold by the knockout pin.

  As another method for simultaneously releasing the illumination device cover 100 from the first mold and the second mold, there is a method using a holder. When the resin falls below the glass transition temperature, for example, a mold block (mold) for forming the side surface portion of the lighting device cover 100 is slid to create a gap that connects the lighting device cover 100 and the outside. Simultaneously releasing the mold can be easily performed by inserting a jig (holding tool) into the gap and holding the illumination device cover 100 with the jig and then separating the first mold and the second mold. be able to.

  The convex part 10 of the cover 100 for lighting devices obtained by using either method is not damaged. Moreover, the simultaneous mold release method is not limited to these two methods.

Second Method FIG. 10A is a plan view showing the frame 75 used in the second method and the illumination device cover 100 that is insert-molded so as to be bonded to the inner periphery of the frame 75. FIG. (B) is sectional drawing which shows the Xb-Xb cross section of Fig.10 (a).
In the second method, after the frame body 75 is inserted into the cavity formed between the first mold and the second mold during injection molding, resin is injected to illuminate the inside of the frame body 75. Insert molding is performed so that at least a part of the outer periphery of the device cover 100 adheres. Then, the outer periphery of the lighting device cover 100 is restrained by the frame 75, so that the resin constituting the lighting device cover 100 is prevented from shrinking during cooling. As a result, it is possible to prevent the convex portion 10 from being damaged due to the shrinkage of the resin.

In one preferred embodiment, the inner periphery of the frame 75 and the outer periphery of the illumination device cover 100 are bonded over the entire outer periphery of the illumination device cover 100. It is also a preferred embodiment that four or more locations on the outer periphery of the illumination device cover 100 are bonded at approximately equal intervals. Furthermore, if the illumination device cover 100 is an elongated shape, it is also a preferred embodiment that both ends in the longitudinal direction are bonded to the frame body 75.
The frame 75 can be formed from various materials including metals and ceramics.

Third Method FIG. 11 is a cross-sectional view showing the illumination device cover 100 in which the hook portion 120 is provided in the cavity formed by the first mold 70 and the second mold 72.

  As shown in FIG. 11, the first mold 70 or the second mold 72 is formed so that the catch portion 120 thicker than the thickness of the central portion of the lighting device cover 100 is formed on at least a part of the outer peripheral portion of the lighting device cover 100. At least one of the above is configured. That is, at least one of the first mold 70 or the second mold 72 has a concave portion corresponding to the hook portion 120.

  By forming the catching portion 120 in this way during injection molding resin injection, the outer peripheral portion of the illumination device cover 100 is constrained within the cavity, so that the illumination device cover 100 contracts when cooled. Can be suppressed. Accordingly, it is possible to prevent the convex portion 10 from being damaged.

  The hook part 120 is one of the preferred embodiments that is provided over the entire outer periphery of the lighting device cover 100. It is also a preferred embodiment that the hooks 120 are provided at approximately equal intervals at four or more locations on the outer periphery of the lighting device cover 100. Furthermore, if the illumination device cover 100 is elongated, it is also a preferred embodiment to provide the catch portions 120 at both ends in the longitudinal direction.

  The hook portion 120 may be removed after the first mold 70 and the second mold 72 are released from the illumination device cover 100.

In addition, when forming the cone-shaped convex part 10 in which the terminal part is flat or rounded as shown in FIG. 1A by the above-described pressing method and injection molding method, the mold 60 used for the pressing method and the injection molding are used. It is a usual method to form a concave portion having the same shape as the convex portion 10 in one mold and / or the second mold (that is, an inverted conical shape having a flat portion or a rounded portion on the end side).
However, the ends of the inverted conical recesses provided in the mold 60, the first mold and the second mold are pointed, and the conditions such as the temperature of the resin are changed during the press and injection molding, so that the resin You may form the part which has a flat part or a round at the terminal part of the convex part 10 so that it may not be filled to the pointed part.

  As Example 1, the end portion having a width W of 200 nm, a height H2 of 250 nm, and a distance P of 250 nm has a conical convex portion 10 with a radius having a radius of 10 nm or more, and a thickness H1 of 2 mm in length and width Each obtained a sample of 90 mm polycarbonate. The sample of Example 1 was created in the following order. (1) An inverted conical recess having a diameter of 200 nm, a depth of 250 nm, and a pitch of 250 nm was formed by anodizing aluminum. (2) In order to protect the original plate, nickel electroforming was performed twice to produce a mold 60 having the same structure as the original plate. (3) Using the mold 60, the mold 60 and the convex part 10 (nano pattern) having an inverted structure were formed on one side of a polycarbonate plate having a thickness of 2 mm and a 90 mm square produced by injection molding. At that time, the entire outer periphery of the polycarbonate plate is chucked, and the upper die (die 60) and the lower die (dummy die) heated in advance to 180 ° C. are simultaneously pressed against the polycarbonate plate for 5 minutes at a pressure of 1 MPa. Pressed. (4) Then, after cooling the polycarbonate plate (resin) until the glass transition temperature reaches 150 ° C., the upper die, the lower die and the chuck are moved so that the upper die, the lower die and the polycarbonate plate are released simultaneously. I let you.

  In the obtained sample according to Example 1, there was no inconvenience such as the falling of the convex portion 10. In other words, the nanostructure of the mold 60 was successfully transferred onto the entire surface of one side of the polycarbonate plate. In Example 1, the concave portion of the mold 60 has a conical shape with a sharp end (inverted conical shape), but a radius having a radius of 10 nm or more is formed at the end portion of the convex portion 10 obtained. I was able to.

  As Example 2, a sample having a conical convex portion 10 having a width W of 250 nm, a height H2 of 300 nm, and a distance P of 300 nm, and a thickness H1 of 2 mm and a length and width of 90 mm of polycarbonate was obtained. . The sample of Example 1 was produced in the following order.

  (1) An inverted conical recess having a diameter of 250 nm, a depth of 300 nm, and a pitch of 300 nm was formed by anodizing aluminum. (2) The first mold was assembled with the obtained aluminum plate having concave portions. (3) Injection molding was performed in which polycarbonate was injected into the cavity between the first mold and the second mold provided with knockout pins. (4) Then, after cooling until the polycarbonate which was injection-molded reaches 150 ° C. which is a glass transition temperature, the first mold and the second mold were opened. At this time, the first and second molds were simultaneously released from the obtained injection molded article by operating the knockout pin at a speed slower than the mold opening speed simultaneously with the mold opening.

  The obtained sample according to Example 2 had no problems such as the collapse of the convex portion 10 over the entire surface of one side, that is, the nanostructure formed in the mold could be transferred satisfactorily.

  As a sample of the comparative example, a polycarbonate plate obtained by injection molding and having no protrusion 10 on the surface and having a thickness of 2 mm and a length and a width of 90 mm was used.

  FIG. 12 is a graph showing the relationship between the wavelength and the transmittance of the samples of Example 1 and Example 2 and the comparative example sample.

  The sample of Example 1 showed higher transmission efficiency than the comparative sample over the entire wavelength range of 380 nm to 750 nm, which is the wavelength range of visible light. The sample of Example 2 showed higher transmission efficiency than the comparative sample in the visible light wavelength region having a wavelength longer than about 450 nm. It was confirmed that both the samples of Example 1 and Example 2 exhibited excellent characteristics as a cover for a lighting device.

10, 10a, 10b Convex part 20, 20a Clearance 30 Concave surface 40 Convex surface 60 Mold 62 Chuck jig 70 First mold 72 Second mold 75 Frame body 100, 100a, 100b Illumination device cover 110 Resin plate 120 Hook part 500 , 600 Lighting device 510 Light emitting diode 520 Substrate 530 Case

Claims (26)

A cover for a lighting device having a thickness of 1 mm or more, which is made of a thermoplastic resin or a thermosetting resin and transmits light emitted from the lighting device.
Protrusions arranged at intervals shorter than the shortest of the wavelengths of light emitted from the lighting device on at least one surface, the protrusions being the same heat as the rest of the illumination device cover A cover for a lighting device, which is integrally formed of a plastic resin or a thermosetting resin.   The illumination device cover according to claim 1, wherein the convex portions are arranged at intervals of 380 nm or less.   The illumination device cover according to claim 1, wherein the convex portions are provided on both surfaces.   The illumination device cover according to any one of claims 1 to 3, wherein the convex portion is narrower on the distal side than on the proximal side.   The lighting device cover according to claim 4, wherein the convex portion has a conical shape.   The said convex part is formed by providing the cone-shaped recessed part which the inside becomes a cavity and the width | variety becomes narrow toward the inner side from the outer side of the said illumination device cover. The cover for lighting devices in any one.   The lighting device cover according to any one of claims 1 to 6, wherein the lighting device cover has a curved surface portion on a surface thereof, and the convex portion is formed perpendicular to the curved surface portion.   The lighting device cover according to claim 1, wherein the thermoplastic resin or thermosetting resin is a water-repellent resin.   The said thermoplastic resin or thermosetting resin is a hydrophilic resin, The cover for lighting devices in any one of Claims 1-7 characterized by the above-mentioned.   The said thermoplastic resin or thermosetting resin is a low elastic resin whose elastic modulus is 1 GPa or less, The cover for lighting devices in any one of Claims 1-7 characterized by the above-mentioned. An illumination having a thickness of 1 mm or more, which is made of a thermoplastic resin or a thermosetting resin, and has convex portions integrally formed on at least one surface at intervals shorter than the shortest wavelength of light emitted from the illumination device. A device cover manufacturing method comprising:
1) a step of preparing a mold having a concave portion for forming the convex portion;
2) When at least one of the mold and the plate is heated and the mold is pressed against at least one surface of the plate made of the plastic resin or thermosetting resin to form the convex portion, and then the plate is cooled. Constraining at least a part of the outer periphery of the plate;
The manufacturing method characterized by including.   The manufacturing method according to claim 11, wherein, in the step 2), after heating only the mold, the mold is pressed against the plate.   The manufacturing method according to claim 11, wherein in the step 2), the plate is heated to a temperature equal to or higher than the glass transition temperature of the plate, and the mold having a temperature equal to or lower than the glass transition temperature is pressed.   The manufacturing method according to claim 11, wherein two molds are prepared in the step 1), and the molds are pressed against both surfaces of the plate in the step 2).   A dummy mold not having the concave portion on the surface is further prepared in the step 1), and the mold is pressed against one of both surfaces of the plate and the dummy mold is pressed against the other in the step 2). Item 14. The method according to any one of Items 11 to 13.   The manufacturing method according to claim 14, wherein the two molds or the mold and the dummy mold are simultaneously pressed against both surfaces of the plate.   17. When cooling the plate in the step 2), the two molds or the mold and the dummy mold are simultaneously separated from the plate at a temperature lower than the glass transition temperature of the plate. The manufacturing method in any one of.   The manufacturing method according to claim 11, wherein the restraint is performed by sandwiching at least a part of an outer periphery of the plate with a chuck jig.   The manufacturing method according to claim 11, wherein the restraint is performed by adhering at least a part of an outer periphery of the plate to a frame.   The manufacturing method according to claim 11, wherein in the step 1), the recess is formed by anodic oxidation. A lighting device having a thickness of 1 mm or more, which is made of a thermoplastic resin or a thermosetting resin and has convex portions integrally formed on at least one surface at intervals shorter than the shortest wavelength of light emitted from the lighting device. A cover for manufacturing by injection molding in which the thermoplastic resin or thermosetting resin is injected into a cavity formed between a first mold and a second mold,
1) providing a recess for forming the protrusion in the first mold;
2) In the cooling process after injecting the thermoplastic resin or thermosetting resin, at a temperature between the glass transition temperature of the thermoplastic resin or thermosetting resin and a temperature 20 ° C. lower than the glass transition temperature, Releasing both the first mold and the second mold simultaneously from the illumination device cover;
The manufacturing method characterized by including.   In the step 2), a knockout pin is protruded from the inner surface of the first mold or the second mold, and both the first mold and the second mold are released from the illumination device cover at the same time. The manufacturing method according to claim 21, wherein: A lighting device having a thickness of 1 mm or more, which is made of a thermoplastic resin or a thermosetting resin and has convex portions integrally formed on at least one surface at intervals shorter than the shortest wavelength of light emitted from the lighting device. A cover for manufacturing by injection molding in which the thermoplastic resin or thermosetting resin is injected into a cavity formed between a first mold and a second mold,
1) providing a recess for forming the protrusion in the first mold;
2) A frame is disposed in the cavity, and insert molding is performed so that at least a part of the outer periphery of the illumination device cover is bonded to the frame when the thermoplastic resin or thermosetting resin is injected. Process,
The manufacturing method characterized by including. A lighting device having a thickness of 1 mm or more, which is made of a thermoplastic resin or a thermosetting resin and has convex portions integrally formed on at least one surface at intervals shorter than the shortest wavelength of light emitted from the lighting device. A cover for manufacturing by injection molding in which the thermoplastic resin or thermosetting resin is injected into a cavity formed between a first mold and a second mold,
1) providing a recess for forming the protrusion in the first mold;
2) A catching portion having a thickness larger than that of the central portion of the illumination device cover is formed on at least a part of the outer periphery of the illumination device cover obtained when the thermoplastic resin or thermosetting resin is injected. , Configuring the first mold or the second mold;
The manufacturing method characterized by including.   The said recessed part is formed also in a said 2nd mold by the said process 1), The said convex part is formed in both surfaces of the said cover for lighting devices by the said injection molding, The any one of Claims 21-24 characterized by the above-mentioned. The manufacturing method as described.   The manufacturing method according to any one of claims 21 to 25, wherein in the step 1), the concave portion is formed by anodic oxidation.

Images