JP2010135083A - Method of manufacturing plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a PDP with high reliability and with due consideration on its environment aspect, without drooping a mold-sealing member even if joining between a chip pipe and a rear plate is carried out with a side of the chip pipe connected to a discharge device to be at a lower side. <P>SOLUTION: A manufacturing method of the PDP is equipped with a process joining a tubular chip pipe communicating through a through-hole fitted at a rear plate onto the rear plate with the use of mold-sealing member structured of a sealing material to a discharge space with a front plate an a rear plate arranged in opposition and formed by sealing at its periphery. The mold-sealing member 23 is provided with a flat-plate part 23a having a hole part and a cylindrical part 23b, a density of the cylindrical part 23 is structured to be lower than that of the flat plate part 23a, the chip pipe is made in a state with a side connected with a discharge device to be a lower side and pinching the flat plate part of the mold-sealing member with the rear plate on the other side, by heating and melting the mold-sealing member in the state and cooling and solidifying, the chip tube and the rear plate are joined. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a plasma display panel (hereinafter referred to as PDP) which is a flat display device used for large televisions, public displays, and the like. The present invention relates to a method for manufacturing a PDP having a tip tube for enclosing a discharge gas in a space.

  Since PDPs can achieve higher definition and larger screens, commercialization is progressing toward 65-inch class television receivers and large public display devices, and products that exceed 100 inches are now released. Has been. In particular, PDPs for television receivers are being applied to full-spec high-definition televisions having more than twice the number of scanning lines as compared with the conventional NTSC system.

  Basically, the PDP is composed of a front plate and a back plate. The front plate covers a display electrode composed of a glass substrate of sodium borosilicate glass by a float method, a striped transparent electrode formed on one main surface of the glass substrate, and a bus electrode. The dielectric layer functions as a capacitor, and a protective layer made of magnesium oxide (MgO) formed on the dielectric layer. On the other hand, the back plate is a glass substrate provided with pores for exhaust and discharge gas encapsulation (also referred to as introduction), and stripe-shaped address electrodes (also referred to as data electrodes) formed on one main surface thereof, It is composed of a base dielectric layer that covers the address electrodes, a partition formed on the base dielectric layer, and a phosphor layer that emits red, green, and blue light formed between the partitions.

  Here, the front plate and the back plate are hermetically joined (sealed) with a sealing material around the front plate and for the purpose of exhausting the discharge space and / or introducing the discharge gas into the discharge space. A chip tube (also referred to as an exhaust tube) that is in airtight communication with the discharge space is joined to the back plate by a sealing material through a through hole provided in the back plate.

  Then, exhaust of the discharge space and sealing of discharge gas (in the case of Ne-Xe, pressure of 400 Torr to 600 Torr) are performed through the tip tube, and then the tip tube is locally heated and melted (chip off) at an appropriate portion. The PDP is completed by hermetically sealing.

  The completed PDP is discharged by selectively applying a video signal voltage to the display electrodes, and ultraviolet rays generated by the discharge excite each color phosphor layer to emit red, green, and blue light, thereby displaying a color image. Is realized.

  It should be noted that frit glass mainly composed of lead oxide is generally used as a sealing material for the above-mentioned PDP for sealing the dielectric layer, the front plate and the back plate, and joining the back plate and the chip tube. It has been. There are two types of frit glass: amorphous frit glass that does not crystallize even when heated and remains amorphous, and crystallized frit glass that crystallizes by heating. Each material has its long and short, and is selected in consideration of matching with the manufacturing process.

Here, in consideration of recent environmental problems, PDPs are required to use lead-free materials called “lead-free” and “lead-free” that do not contain lead components. Examples of the sealing material include phosphoric acid-based (phosphoric acid-tin oxide-based) sealing materials that do not contain a lead component, and examples of bismuth oxide-based sealing materials (for example, Patent Document 1 and Patent Document). 2).
JP 2004-182584 A JP 2003-095597 A

  FIG. 8 shows a process for sealing the front plate 2 and the back plate 3 around each other and a step of joining the back plate 3 and the tip tube 20 in the conventional PDP manufacturing method. The state of installation is schematically shown in a sectional view. The process of sealing the front plate 2 and the back plate 3 around the front plate 2 and the step of joining the back plate 3 and the tip tube 20 will be described below with reference to FIG.

  Sealing members 22 are arranged and formed at predetermined positions around the back plate 3, aligned at predetermined positions so that the display electrodes of the front plate 2 and the data electrodes of the back plate 3 intersect, and then a fixing jig ( Press and hold with a not shown). Here, the sealing member 22 is formed by using a pasty sealing material obtained by mixing frit glass and filler and kneading with an organic solvent, using a thick film printing, an inkjet, a coating device equipped with a dispenser, or the like. The coating is formed at a predetermined position around the substrate and then dried.

  On the other hand, for example, the center of the through hole 21 provided at a predetermined position of the corner portion of the back plate 3 and the center of the hole portion 124 of the molded sealing member 123 are aligned and placed, and further, Align so that the center of the opening of the end portion 20a of the tip tube 20 and the center of the through hole 21 are substantially coincident with each other, and hold down with a fixing jig (not shown) so that the respective alignment does not shift. Fix it.

  Here, the molded sealing member 123 is a material obtained by mixing a frit glass and a filler and kneading with a solvent, and using a mold, FIG. 9 shows a schematic shape thereof (a) a top view, (b) a front view, (C) As shown in a side view, it is press-molded into a shape having a flat plate portion 123a having a hole portion 124 and a cylindrical portion 123b, and then heated and fired at a temperature necessary to evaporate the solvent, and then solidified by sintering. It is formed by doing.

  As described above, the elements are arranged in the state as shown in FIG. 7, and the front plate is obtained by cooling and solidifying the sealing member 22 and the molded sealing member 123 after heating and melting them while maintaining this state. 2 and the back plate 3 and the back plate 3 and the tip tube 20 are joined.

  Here, FIG. 8 shows an example of an arrangement in which the end 20a on the side to be joined of the tip tube 20 is on the lower side and the end 20b on the side to be connected to the exhaust device (not shown) is on the upper side. However, in the case of such an arrangement, the exhaust device is generally installed on the floor surface, that is, on the lower side of the tip tube 20, and thus connected to the tip tube 20 joined in a state having an opening upward. In order to do so, it is necessary to bend the pipe from the exhaust device without fail, and the pipe becomes long.

  For this reason, as shown in FIG. 10A, the arrangement shown in FIG. 7 is the arrangement in which the tip tube 20 is turned upside down, so that the end portion 20b of the tip tube 20 on the side connected to the exhaust device is provided. There is a case where the arrangement with the lower side is taken down. In the arrangement shown in FIG. 10A, the piping can be shortened by direct connection when connecting the exhaust device (not shown) and the tip tube 20, so that the piping is easy and the exhaust resistance is minimized. There is an advantage that the exhaust time can be shortened.

  However, in the case of the arrangement shown in FIG. 10A, when the molded sealing member 123 is formed of a sealing material mainly composed of lead-containing frit glass, it can be joined without any problem. However, when the molded sealing member 123 formed of a sealing material mainly composed of non-leaded frit glass is used, each of the sealing member 22 and the molded sealing member 123 is heated and melted, and then cooled and solidified. Thus, when the sealing portion 27 and the joint portion 126 are formed, the molded sealing member 123 hangs down when heated and melted, and is cooled and solidified as it is, and as a result, as shown in FIG. As an example of the shape is schematically shown in a cross-sectional view, there is a case where the joint portion 126 hangs down and a “droop” occurs.

  When the joint portion 126 is in the “hanging down” state, the joining strength between the tip tube 20 and the back plate 3 becomes insufficient, and as a result, the discharge through the through hole 21 provided in the back plate 3. In some cases, the airtightness of the communication between the space 17 and the tip tube 20 may be defective. Here, it is considered that the dripping phenomenon does not occur in the frit glass containing lead because the high softening point frit glass containing lead during calcination starts crystallizing when the softening point is exceeded, and thus does not droop.

  The present invention has been made in view of such a situation, and a chip tube and a back plate are joined to each other by using a molded sealing member formed of a sealing material mainly composed of lead-free frit glass. Even if the side connected to the exhaust device is set to the lower side, the molded sealing member does not hang down, and thus a PDP having high reliability in terms of airtightness and considering the environment is realized. The purpose is to do.

  In order to achieve the above object, a method for manufacturing a PDP according to the present invention includes a through-hole provided in a back plate for a discharge space formed by disposing a front plate and a back plate facing each other and sealing the periphery of the front plate and the back plate. A method for manufacturing a plasma display panel comprising a step of joining a tubular chip tube communicating with a back plate using a molded sealing member made of a sealing material, wherein the molded sealing member comprises: A flat plate portion having a hole portion and a cylindrical portion are provided, and the density of the cylindrical portion is configured to be lower than the density of the flat plate portion, and the tip tube has a lower end on the side connected to the exhaust device, and the other side At the end, the flat part of the molded sealing member is sandwiched between the back plate and the chip tube and the back plate are joined by heating and melting the molded sealing member in this state and then solidifying it by cooling. It is to do.

  According to the present invention, using a molded sealing member formed of a sealing material mainly composed of lead-free frit glass, the side of the tip tube connected to the exhaust device of the tip tube is connected to the back surface plate. Even if it is performed on the lower side, the molded sealing member does not hang down, so that it is possible to realize a PDP having high reliability in terms of airtightness and taking environmental considerations into consideration.

  Hereinafter, a method of manufacturing a PDP according to an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a cross-sectional perspective view showing a schematic structure of a PDP manufactured by a method of manufacturing a PDP according to an embodiment of the present invention. As shown in FIG. 1, the PDP 1 has a front plate 2 made of a front glass substrate 5 and the like and a back plate 3 made of a back glass substrate 11 and the like facing each other, and its outer peripheral portion is a sealing material such as glass frit. Is hermetically sealed.

  A discharge gas such as neon (Ne) and xenon (Xe) is sealed at a pressure of 400 Torr to 600 Torr in the discharge space 17 inside the sealed PDP 1.

  On the front glass substrate 5 of the front plate 2, a plurality of pairs of strip-like display electrodes 8 composed of the scanning electrodes 6 and the sustain electrodes 7 are arranged in parallel to each other. A dielectric layer 9 serving as a capacitor is formed on the front glass substrate 5 so as to cover the display electrodes 8, and a protective layer 10 made of magnesium oxide (MgO) or the like is further formed on the surface.

  A plurality of strip-like address electrodes (also referred to as data electrodes) 12 are arranged in parallel to each other on the rear glass substrate 11 of the rear plate 3 in a direction intersecting with the scanning electrodes 6 and the sustain electrodes 7 of the front plate 2. The underlying dielectric layer 13 covers this. Further, a partition wall 4 having a predetermined height is formed on the base dielectric layer 13 between the address electrodes 12 to divide the discharge space 17. In addition, phosphor layers 14R, 14G, and 14B that emit red, green, and blue light respectively by ultraviolet rays are sequentially applied to the grooves between the barrier ribs 4.

  A discharge cell is formed at a position where the scan electrode 6 and the sustain electrode 7 intersect with the address electrode 12, and has red, green, and blue phosphor layers 14R, 14G, and 14B arranged in the direction of the display electrode 8. Becomes a pixel for color display.

  Next, a method for manufacturing a PDP according to an embodiment of the present invention will be described.

  First, scan electrode 6 and sustain electrode 7 are formed on front glass substrate 5. The transparent electrodes 6a and 7a and the metal bus electrodes 6b and 7b constituting the scan electrode 6 and the sustain electrode 7 are formed by patterning using a photolithography method or the like. The transparent electrodes 6a and 7a are formed using a thin film process or the like, and the metal bus electrodes 6b and 7b are solidified by baking a paste containing a silver material at a desired temperature.

  Thereafter, a dielectric paste is applied on the front glass substrate 5 by a die coating method or the like so as to cover the scan electrodes 6 and the sustain electrodes 7 to form a dielectric paste layer (dielectric material layer). After the dielectric paste is applied, the surface of the applied dielectric paste is leveled by leaving it to stand for a predetermined time, so that a flat surface is obtained. Thereafter, the dielectric paste layer is formed by baking and solidifying the dielectric paste layer to cover the scan electrode 6 and the sustain electrode 7. The dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent.

  Next, a protective layer 10 made of magnesium oxide (MgO) is formed on the dielectric layer 9 by vacuum deposition. Through the above steps, predetermined components (display electrode 8, dielectric layer 9, and protective layer 10 including scan electrode 6 and sustain electrode 7) are formed on front glass substrate 5, and front plate 2 is completed. In addition, the material containing lead is not used for each component of the front plate 2 mentioned above.

  On the other hand, the back plate 3 is formed as follows. First, the composition for the address electrode 12 is formed by a method of screen printing a paste containing a silver material on the rear glass substrate 11 or a method of patterning using a photolithography method after forming a metal film on the entire surface. An address electrode 12 is formed by forming a material layer to be formed and firing it at a desired temperature.

  Next, a dielectric paste is applied on the rear glass substrate 11 on which the address electrodes 12 are formed by a die coating method or the like so as to cover the address electrodes 12 to form a dielectric paste layer. Thereafter, the base dielectric layer 13 is formed by firing the dielectric paste layer. The dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent.

  Thereafter, a partition wall forming paste including a partition wall material is applied onto the base dielectric layer 13 and patterned into a predetermined shape to form a partition wall material layer, and then fired to form the partition walls 4. Here, as a method of patterning the partition wall paste applied on the base dielectric layer 13, a photolithography method or a sand blast method can be used.

  Then, a phosphor paste containing a phosphor material is applied to the rear glass substrate 11 on which the barrier ribs 4 are formed, on the base dielectric layer 13 between the adjacent barrier ribs 4 and on the side surfaces of the barrier ribs 4, and then fired. Layers 14R, 14G, and 14B are formed. Through the above steps, the back plate 3 having predetermined constituent members on the back glass substrate 11 is completed. In addition, the material containing lead is not used for each component of the back plate 3 mentioned above similarly to the front plate 2.

  Subsequently, the front plate 2 and the back plate 3 are hermetically joined (sealed) with a sealing material around the front plate 2 and exhaust gas inside the discharge space 17 and / or introduction of discharge gas into the discharge space. For this purpose, a step of joining a tip tube (also referred to as an exhaust tube) in airtight communication with the discharge space 17 through a through-hole provided in the back plate 3 to the back plate with the same sealing material is performed.

  FIG. 2 shows a step of sealing the front plate 2 and the back plate 3 around the periphery and a step of bonding the back plate 3 and the tip tube 20 in the manufacturing method of the PDP according to the embodiment of the present invention. The state of installation of each element at the time is schematically shown in a sectional view. 2A and 2B, in the method for manufacturing a PDP according to the embodiment of the present invention, the step of sealing the front plate 2 and the back plate 3 around them, and the bonding of the back plate 3 and the tip tube 20 are performed. The process will be described below.

  In the step of sealing the front plate and the back plate with the sealing material around the front plate, that is, the step of airtight bonding, the sealing members 22 are respectively arranged and formed at predetermined positions around the back plate 3, The display electrodes on the face plate 2 and the data electrodes on the back plate 3 are aligned at predetermined positions so as to be pressed and fixed by a fixing jig (not shown). Here, the sealing member 22 is a paste-type sealing material obtained by mixing a frit glass not containing a lead component and a filler and kneading with an organic solvent, a thick film printing, an ink jet, or a coating device equipped with a dispenser. Is applied and formed at a predetermined position around the back plate 3 and then dried.

  Here, the filler has heat resistance and is used for the purpose of adjusting the thermal expansion coefficient of the molding sealing member 23 and controlling the flow state of the frit glass constituting the molding sealing member 23. Wright, forsterite, β-eucryptite, zircon, mullite, barium titanate, aluminum titanate, titanium oxide, molybdenum oxide, tin oxide, aluminum oxide, quartz glass, etc. are used alone or in combination as particularly preferred materials. The

  On the other hand, in the step of joining the back plate 3 and the tip tube 20, the center of the exhaust through-hole 21 provided at a predetermined position of the corner portion of the back plate 3 and the hole portion 24 of the molded sealing member 23, for example. The alignment is performed so that the center substantially matches the center of the opening portion of the end portion 20a of the tip tube 20 and the center of the exhaust through-hole 21 so as to approximately match each other. While being held down, it is fixed by pressing it with a fixing jig (not shown) so that no deviation occurs.

  As described above, the tip tube 20 has the end 20b on the side connected to the tip tube head 25 as the lower side, and the other side, that is, the end 20a on the side joined to the back plate 3, is a flat plate of the molded sealing member 23. The portion 23a is fixed in a state of being sandwiched between the back plate 3.

  Here, the schematic shape of the molded sealing member 23 is shown in a perspective view in FIG. 3, and in FIG. 4 (a) a top view, (b) a front view, and (c) a side view. As shown in FIGS. 3 and 4, a molded sealing member 23 is made of a material obtained by mixing lead-free frit glass and filler and mixed with a solvent, using a mold, as shown in FIG. 3 and FIG. It is formed by press-molding into a shape including the portion 23b, and then heated and fired at a temperature necessary for evaporating the solvent and solidified by sintering. In addition, as a filler in this case, the same material as the filler added to the sealing material used for sealing the front plate and the back plate can be used.

  As described above, the elements are arranged in the state as shown in FIG. 2, and while maintaining this state, the sealing member 22 and the molded sealing member 23 are heated and melted and then cooled and solidified, so that FIG. As shown in the schematic sectional view in FIG. 1, the sealing portion 27 and the joining portion 26 are used to seal the front plate 2 and the back plate 3 and to join the back plate 3 and the tip tube 20 together.

  Here, what is characteristic in the manufacturing method of the PDP according to the embodiment of the present invention described above is that the density of the cylindrical portion 23b of the molded sealing member 23 is lower than the density of the flat plate portion 23a. is there.

  That is, as described above, conventionally, when trying to join the tip tube to the back plate using the molded sealing member with the end on the side connected to the exhaust device as the lower side, the lead tube is mainly made of non-leaded frit glass. When a molded sealing member made of a sealing material is used, drooping occurs, resulting in insufficient bonding strength between the tip tube and the back plate, and as a result, the penetration provided in the back plate In some cases, the airtightness of the communication between the discharge space and the exhaust pipe through the hole may cause a problem, and the drooping may occur at the end of the tip tube 20 as schematically shown in a sectional view in FIG. That the center of the opening of the part and the center of the hole 24 of the molded sealing member 23 are extremely misaligned and are heated and melted, and this is noticeable in part A in FIG. Was obtained by the study of the present inventors.

  From the above, the cause of drooping is considered as follows. That is, the molded sealing member 23 is supported in a state where the flat plate portion 23a is sandwiched between the chip plate 20 and the back plate 3, but the portion of the molded sealing member 23 that is not supported by the chip tube 20, that is, The outside of the region supported by the tip tube 20 of the flat plate portion 23a and the portion of the cylindrical portion 23b are not supported at all, and the weight of this portion is when the molded sealing member 23 is heated and softened. The idea is that it will sag when it is larger than the surface tension of the sealing material.

  Therefore, in the method for manufacturing a PDP according to an embodiment of the present invention, the molded sealing member includes a flat plate portion having a hole and a cylindrical portion, and the density of the cylindrical portion is configured to be lower than the density of the flat plate portion. In addition, the tip tube has an end on the side connected to the exhaust device of the tip tube as a lower side, and a flat plate portion of the molded sealing member is disposed between the end portion on the other side of the tip tube and the back plate. In this state, the molded sealing member is heated and melted and then cooled and solidified to join the tip tube and the back plate.

  That is, by configuring the density of the cylindrical portion to be lower than the density of the flat plate portion, the portion of the cylindrical portion that occupies most of the portion of the molded sealing member that is not supported by the tip tube is lightened. By realizing that the weight of the part of the molded sealing member that is not supported by the tip tube is smaller than the surface tension of the molded sealing member, drooping occurs when heated to the softening temperature and melted. It is what suppresses it.

  Here, suppression of “dripping” is also possible by lowering the density of the entire molded sealing member, but in that case, the fracture strength particularly at the flat plate portion receiving the support of the tip tube is lowered. Is a problem. That is, since the flat plate portion of the molded sealing member is sandwiched between the chip tube and the back plate, if the density of the flat plate portion is lowered, cracks and cracks will occur in that portion. This may cause a problem that reliable joining cannot be performed, which is not preferable. Furthermore, it is not preferable to reduce the density of the entire molded sealing member from the viewpoint of securing strength during handling of the molded sealing member in the manufacturing process.

  The density of the molded sealing member can be adjusted by, for example, selection of molding conditions (material filling amount, press pressure, sintering temperature, etc.), and the individual density as in the molded sealing member as described above. In order to have different densities in the body, it can be realized by changing the pressing pressure and pressing a plurality of times.

  That is, with reference to FIG. 4, when the sealing material is filled into the mold and press-molded, first, the sealing material of the flat plate portion 23a is filled into the mold and pressed for the first time, and then the cylindrical portion. Filling the mold with the sealing material of the portion 23b, and pressing the second time with a pressure weaker than the pressing pressure at the time of forming the flat plate portion, the flat plate portion 23a having the hole 24 and the cylindrical portion 23b, The molded sealing member 23 having a density of the cylindrical portion 23b lower than that of the flat plate portion 23a can be obtained.

In addition, even in the lead-free frit glass, compared with a molded sealing member formed of a sealing material using a lead-free amorphous frit glass of a phosphate-tin oxide system and a vanadium oxide-zinc oxide-barium oxide system, The molded sealing member formed of a sealing material using a non-lead amorphous frit glass containing bismuth oxide and containing silicic acid (Bi ₂ O ₃ —B ₂ O ₃ ) causes drooping. Hateful. This is because phosphorous acid-tin oxide system and vanadium oxide-zinc barium monoxide system are used in the non-lead amorphous frit glass of bisilicic acid system (Bi ₂ O ₃ -B ₂ O ₃ system) containing bismuth oxide. This is probably because the surface tension is higher than that of non-lead amorphous frit glass.

Therefore, from the viewpoint of environmental considerations and the difficulty of drooping, an amorphous frit glass of bisilicate (Bi ₂ O ₃ -B ₂ O ₃ system) containing bismuth oxide is used as a lead-free frit glass. It is desirable to use it.

In the above description, rigid silicic acid based (Bi ₂ O ₃ —B ₂ O ₃ based) non-lead amorphous frit glass containing bismuth oxide does not contain lead at all. However, when analyzed, a trace amount of lead is detected although it is 500 PPM or less. However, in the EC-RoHS directive regarding the environment in Europe, if it is 1000 PPM or less, it can be regarded as not containing lead. In the embodiment of the present invention, expressions such as “does not contain lead” or “non-lead” are used. Used.

  In the above description, the molded sealing member 23 has a flat plate portion 23a and a cylindrical portion 23b as shown in FIG. 7 in addition to the configuration including the flat plate portion 23a and the cylindrical portion 23b as shown in FIG. It is obvious that the effects of the present invention can be obtained even with a configuration including the above.

  As described above, the present invention is useful for providing a large-screen, high-definition plasma display device.

Sectional perspective view which shows schematic structure of PDP manufactured by the manufacturing method of PDP by one embodiment of this invention The state of installation of each element at the time of a sealing process of a front board and a back board in a manufacturing method of PDP by one embodiment of the present invention, and a back board and a chip tube is shown typically. Cross section A perspective view showing a schematic shape of a molded sealing member (A) Top view, (b) Front view, (c) Side view Sectional drawing which shows schematically the junction part of a backplate and a chip tube of the sealing part of a front plate and a backplate of PDP manufactured by the manufacturing method of PDP by one embodiment of this invention. Sectional drawing which shows roughly the structure where generation | occurrence | production of drooping is remarkable (A) Top view, (b) Front view, (c) Side view Sectional drawing which shows typically the installation state of each element in the process of joining the back plate and the tip tube in the sealing step of the front plate and the back plate and the back plate and the chip tube in the conventional PDP manufacturing method (A) Top view, (b) Front view, (c) Side view (A) (b) which shows typically the state of installation of each element at the time of a sealing process of a front board and a back board in a conventional PDP manufacturing method, and a back board and a chip tube joining process. Cross section

Explanation of symbols

1 Plasma display panel (PDP)
2 Front plate 3 Back plate 4 Bulkhead 5 Front glass substrate 6 Scan electrode 6a, 7a Transparent electrode 6b, 7b Metal bus electrode 7 Sustain electrode 8 Display electrode 9 Dielectric layer 10 Protective layer 11 Rear glass substrate 12 Address electrode 13 Base dielectric Layer 14R, 14G, 14B Phosphor layer 17 Discharge space 20 Chip tube 21 Through hole 22 Sealing member 23, 123 Molded sealing member 23a, 123a Flat plate portion 23b, 123b Cylindrical portion 24, 124 Hole portion 25 Chip tube head 26, 126 Joining part 27 Sealing part

Claims (1)

A tubular tip tube communicating with a discharge space formed by opposingly arranging the front plate and the back plate and sealing around the front plate through a through hole provided in the back plate,
A method for manufacturing a plasma display panel comprising a step of bonding to a back plate using a molded sealing member composed of a sealing material,
The molded sealing member includes a flat plate portion having a hole and a cylindrical portion, and the density of the cylindrical portion is configured to be lower than the density of the flat plate portion,
The tip tube has an end portion on the side connected to the exhaust device as a lower side, and a state in which the flat plate portion of the molded sealing member is sandwiched between the rear plate at the other end portion,
A method of manufacturing a plasma display panel in which a chip tube and a back plate are joined by heating and melting a molded sealing member in this state and then solidifying by cooling.

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