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JP2010112535A - Sealing structure - Google Patents

Sealing structure Download PDF

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JP2010112535A
JP2010112535A JP2008287826A JP2008287826A JP2010112535A JP 2010112535 A JP2010112535 A JP 2010112535A JP 2008287826 A JP2008287826 A JP 2008287826A JP 2008287826 A JP2008287826 A JP 2008287826A JP 2010112535 A JP2010112535 A JP 2010112535A
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metal
seal
flat surface
sealed
outer edge
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Satoshi Todo
聡 藤堂
Takahiro Kariya
隆広 假屋
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Mitsubishi Cable Industries Ltd
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Mitsubishi Cable Industries Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing structure superior in sealability between two members different in a linear expansion coefficient such as quartz (or ceramic) and metal used for a manufacturing device of a semiconductor and liquid crystal, particularly, maintaining high sealability even when a heat cycle is repeated. <P>SOLUTION: In the sealing structure for sealing by bringing a close contact seal part 7 of a metallic seal 5 into contact with a sealed plane surface 16 of a fragile member 1 having the low linear expansion coefficient, a metal plated layer 8 is laminated on at least a part of the sealed plane surface 16 brought into contact with the metallic seal 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、密封構造体に関する。   The present invention relates to a sealing structure.

半導体製造装置や液晶製造装置に於て、石英やセラミックと、ステンレス鋼等の金属材とが組み合わせて用いられる箇所があり、このような箇所の密封構造には、従来からゴムシールが多く使用されている。
その理由は、石英やセラミックは割れ易い(脆い)ため、弾性変形しやすいゴム材質が好適なものとして選定されていた。
In semiconductor manufacturing equipment and liquid crystal manufacturing equipment, there are places where quartz, ceramics, and metal materials such as stainless steel are used in combination, and rubber seals have often been used for the sealing structure of such places. Yes.
The reason is that quartz or ceramic is easily broken (brittle), and therefore, a rubber material that is easily elastically deformed has been selected as a suitable material.

しかしながら、近年の半導体や液晶の製造装置に於ては、高精度化・高機能化されつつあり、従来のゴムシールでは、ガス透過性、耐熱性、耐プラズマ性、耐ラジカル性及び寿命の面で、対応不可能になってきている。
そこで、これらの特性に優れた材質として金属を用いたメタル(金属)シールが提案されている(例えば、特許文献1参照)。
特開2002−317889号公報
However, in recent semiconductor and liquid crystal manufacturing apparatuses, high precision and high functionality are being achieved, and conventional rubber seals are in terms of gas permeability, heat resistance, plasma resistance, radical resistance and life. It is becoming impossible to respond.
Therefore, a metal seal using metal as a material excellent in these characteristics has been proposed (for example, see Patent Document 1).
JP 2002-317889 A

ところで、上述のメタル(金属)シールを用いた密封構造体では、メタルシールはゴムシールと比べて相手面とのなじみ性が小さく、低線膨張係数の石英フランジと、それよりも線膨張係数が大きい(高い)金属製フランジの間に、メタルシールを介装して密封する場合、ヒートサイクル等の熱変形や、ボルト等の締付外力と歪及びその変動によって、石英フランジが割れるという問題がある。さらに、上記特許文献1のものでは、比較的小径の管継手の部位に適用されているが、大型の石英(又はセラミック)の板状脆性部材では、熱変形(熱歪)、部品寸法誤差による歪、ボルト締付力等による外力歪等も過大となって、割れる危険性は一層高まる。   By the way, in the sealing structure using the above-mentioned metal (metal) seal, the metal seal is less compatible with the mating surface than the rubber seal, and has a low linear expansion coefficient quartz flange and a larger linear expansion coefficient than that. When sealing with a metal seal between (high) metal flanges, there is a problem that the quartz flange breaks due to thermal deformation such as heat cycle, tightening external force and strain such as bolts, and fluctuations. . Furthermore, in the thing of the said patent document 1, although it applies to the site | part of a comparatively small diameter pipe joint, in a large-sized quartz (or ceramic) plate-shaped brittle member, it is due to a thermal deformation (thermal distortion) and a component dimensional error. External strain caused by distortion, bolt tightening force, etc. becomes excessive, and the risk of cracking is further increased.

そこで、本発明は、半導体や液晶の製造装置に於て用いられる石英(又はセラミック)と金属という線膨張係数が相違する2部材間の密封性(シール性)に優れ、特に、ヒートサイクルを繰り返しても高いシール性能を発揮できる密封構造体を提供することを目的とする。これにより、半導体や液晶の製造方法の高性能化や高機能化を図ることを他の目的とする。   Therefore, the present invention is excellent in sealing (sealability) between two members having different linear expansion coefficients, such as quartz (or ceramic) and metal, which are used in semiconductor and liquid crystal manufacturing apparatuses, and in particular, repeats a heat cycle. However, it aims at providing the sealing structure which can exhibit high sealing performance. Accordingly, another object is to improve the performance and functionality of the semiconductor or liquid crystal manufacturing method.

そこで、本発明に係る密封構造体は、低線膨張係数の脆性部材の被密封平坦面に対して、金属シールの密接シール部を接触させて密封する密封構造体に於て、
上記被密封平坦面のうち少なくとも上記金属シールと接触する部分に金属めっき層を積層させたものである。
Therefore, the sealing structure according to the present invention is a sealing structure that seals a tight seal portion of a metal seal in contact with a flat surface to be sealed of a brittle member having a low linear expansion coefficient.
A metal plating layer is laminated on at least a portion in contact with the metal seal in the sealed flat surface.

また、低線膨張係数の脆性部材の被密封用外縁部を、上記低線膨張係数よりも大きい線膨張係数の第1金属平坦面部・第2金属平坦面部にて、挟着保持すると共に、密封空間を区画形成する上記第1金属平坦面部と上記外縁部の一面の間に介設したメインシールと、上記第2金属平坦面部と上記外縁部の他面の間に介設した副シールとによって、上記脆性部材を上記第1金属平坦面部・第2金属平坦面部から弾発的遊離状態で挟着保持するように構成し、
上記外縁部の一面のうち少なくとも上記メインシールと接触する部分に金属めっき層を積層させたものである。
Further, the outer edge portion to be sealed of the brittle member having a low linear expansion coefficient is sandwiched and held by the first metal flat surface portion and the second metal flat surface portion having a linear expansion coefficient larger than the low linear expansion coefficient and sealed. A main seal interposed between the first metal flat surface portion defining the space and one surface of the outer edge portion, and a sub seal interposed between the second metal flat surface portion and the other surface of the outer edge portion. The brittle member is configured to be sandwiched and held in a resiliently released state from the first metal flat surface portion and the second metal flat surface portion,
A metal plating layer is laminated on at least a portion in contact with the main seal in one surface of the outer edge portion.

また、石英又はセラミックから成る脆性部材の被密封用外縁部を、第1金属平坦面部・第2金属平坦面部にて、挟着保持すると共に、密封空間を区画形成する上記第1金属平坦面部と上記外縁部の一面の間に介設したメインシールと、上記第2金属平坦面部と上記外縁部の他面の間に介設した副シールとによって、上記脆性部材を上記第1金属平坦面部・第2金属平坦面部から弾発的遊離状態で挟着保持するように構成し、
上記外縁部の一面のうち少なくとも上記メインシールと接触する部分に金属めっき層を積層させたものである。
Further, the outer edge for sealing of the brittle member made of quartz or ceramic is sandwiched and held by the first metal flat surface portion and the second metal flat surface portion, and the first metal flat surface portion defining the sealed space, The brittle member is connected to the first metal flat surface portion by the main seal interposed between the one surface of the outer edge portion and the sub seal interposed between the second metal flat surface portion and the other surface of the outer edge portion. The second metal flat surface portion is configured to be held in a resiliently released state,
A metal plating layer is laminated on at least a portion in contact with the main seal in one surface of the outer edge portion.

また、上記金属シールが弾性回復量が大きい形状・材質にて構成されているものである。あるいは、上記メインシールと副シールは、弾性回復量が大きい形状・材質にて構成されている。
また、上記金属めっき層の厚さ寸法を1μm 以上15μm 以下に設定したものである。
また、上記金属めっき層を、上記金属シールと上記被密封平坦面との接触部から内径方向・外径方向に各5mmの範囲内の帯状に形成したものである。
Further, the metal seal is made of a shape / material having a large elastic recovery amount. Alternatively, the main seal and the sub seal are made of a shape / material having a large elastic recovery amount.
The thickness of the metal plating layer is set to 1 μm or more and 15 μm or less.
Further, the metal plating layer is formed in a band shape within a range of 5 mm in each of an inner diameter direction and an outer diameter direction from a contact portion between the metal seal and the flat surface to be sealed.

本発明の密封構造体によれば、半導体や液晶の製造装置に於て用いられる石英(又はセラミック)と金属という線膨張係数が相違する2部材間の密封性(シール性)に優れ、特に、ヒートサイクルを繰り返しても高いシール性能を維持できる。これにより、半導体や液晶の製造装置の高性能化や高機能化の実現に貢献できる。   According to the sealing structure of the present invention, the sealing (sealability) between two members having different linear expansion coefficients of quartz (or ceramic) and metal used in a semiconductor or liquid crystal manufacturing apparatus is excellent. High sealing performance can be maintained even after repeated heat cycles. Thereby, it can contribute to realization of high performance and high functionality of a semiconductor or liquid crystal manufacturing apparatus.

図1・図2は、本発明の実施の一形態を示す。平板状の脆性部材1と、下方の(容器型の)金属部材2と、脆性部材1の外縁部3の下面4と金属部材2との間に介設される(後述の)金属シール5により密封空間6を形成している。   1 and 2 show an embodiment of the present invention. By a flat brittle member 1, a lower (container-type) metal member 2, and a metal seal 5 (described later) interposed between the lower surface 4 of the outer edge 3 of the brittle member 1 and the metal member 2. A sealed space 6 is formed.

すなわち、この密封構造体は、低線膨張係数の(例えば、石英又はセラミックから成る)脆性部材1の被密封平坦面16に対して、金属シール5の密接シール部7を接触させて密封する密封構造体に於て、被密封平坦面16のうち少なくとも金属シール5と接触する部分に金属めっき層8が積層されている。言い換えると、低線膨張係数の脆性部材1の表面1aの一部に、金属シール5(の密接シール部7)が接触して密封する金属めっき層8が積層されている。本発明に於て、低線膨張係数とは、 0.5×10-6〜 9.2×10-6と定義する。なお、石英の線膨張係数は 0.5×10-6である。 That is, this sealing structure is a hermetically sealed by bringing the tight seal portion 7 of the metal seal 5 into contact with the flat surface 16 to be sealed of the brittle member 1 having a low linear expansion coefficient (for example, made of quartz or ceramic). In the structure, a metal plating layer 8 is laminated on at least a portion of the flat surface 16 to be sealed that is in contact with the metal seal 5. In other words, a metal plating layer 8 is laminated on a part of the surface 1a of the brittle member 1 having a low coefficient of linear expansion so that the metal seal 5 (the close seal portion 7) contacts and seals. In the present invention, the low linear expansion coefficient is defined as 0.5 × 10 −6 to 9.2 × 10 −6 . Note that the coefficient of linear expansion of quartz is 0.5 × 10 −6 .

具体的には、低線膨張係数の脆性部材1の被密封用外縁部3を、低線膨張係数よりも大きい線膨張係数の第1金属平坦面部10・第2金属平坦面部11にて、挟着保持すると共に、密封空間6を区画形成する第1金属平坦面部10と外縁部3の一面12の間に介設したメインシール13と、第2金属平坦面部11と外縁部3の他面14の間に介設した副シール15とによって、脆性部材1を第1金属平坦面部10・第2金属平坦面部11から弾発的遊離状態で挟着保持するように構成されている。そして、外縁部3の一面12のうち少なくともメインシール13と接触する部分に金属めっき層8が積層されている。   Specifically, the outer edge 3 to be sealed of the brittle member 1 having a low linear expansion coefficient is sandwiched between the first metal flat surface portion 10 and the second metal flat surface portion 11 having a linear expansion coefficient larger than the low linear expansion coefficient. A main seal 13 interposed between the first metal flat surface portion 10 and the one surface 12 of the outer edge portion 3 that holds and holds the sealed space 6, and the second metal flat surface portion 11 and the other surface 14 of the outer edge portion 3. The brittle member 1 is sandwiched and held from the first metal flat surface portion 10 and the second metal flat surface portion 11 in a resiliently released state by the auxiliary seal 15 interposed therebetween. And the metal plating layer 8 is laminated | stacked on the part which contacts the main seal 13 among the one surfaces 12 of the outer edge part 3 at least.

金属シール5(メインシール13、副シール15)は弾性回復量が大きい形状・材質にて構成されている。金属シール5は、例えば、耐熱合金(ステンレス鋼等)に、銀、金、ニッケル、インジウム等のめっきを施したものから成る。   The metal seal 5 (main seal 13 and sub-seal 15) is configured with a shape and material having a large elastic recovery amount. The metal seal 5 is made of, for example, a heat resistant alloy (stainless steel or the like) plated with silver, gold, nickel, indium or the like.

金属めっき層8の厚さ寸法tが1μm 以上15μm 以下に設定されている。厚さ寸法tが1μm より小さい場合、金属シール5の接触部19の食い込みが余りにも僅小となり、それによって良好なシール性が得られない虞れがある。厚さ寸法tが15μm より大きい場合、めっきするのが困難であるとともに、無駄に多くの材料がかかる。なお、本発明に於て、金属めっき(層)とは、本来の金属めっきのみに限定されず、下地(層)(例えば蒸着)とその上に積層された本来の金属めっき(層)とを合わせたもの、さらには、下地(層)のみの場合をも、包含するものと、定義する。そして、金属めっき層8としては、その材質は、銅や銀や金等が選定できるが、金属シール5の接触部19の硬度(めっきが施されている場合はそのめっきの硬度)よりも柔らかく設定するのが望ましい。   The thickness t of the metal plating layer 8 is set to 1 μm or more and 15 μm or less. When the thickness dimension t is smaller than 1 μm, the contact portion 19 of the metal seal 5 bites too little, and there is a possibility that good sealing performance cannot be obtained. If the thickness dimension t is larger than 15 μm, it is difficult to plate, and much material is wasted. In the present invention, the metal plating (layer) is not limited to the original metal plating, but includes a base (layer) (for example, vapor deposition) and the original metal plating (layer) laminated thereon. It is defined to include the combined case, and also the case of only the base (layer). The metal plating layer 8 can be selected from copper, silver, gold, or the like, but is softer than the hardness of the contact portion 19 of the metal seal 5 (the hardness of the plating when plating is applied). It is desirable to set.

金属めっき層8が、金属シール5と被密封平坦面16との接触部19から内径方向・外径方向に各5mmの範囲内の帯状に形成されている。正規の締付(圧縮)使用状態に於て、接触部19に幅がある場合には、幅の中央から計測する(後述の図3・図4等の他の形状の金属シールの場合も同様とする)。このようにすれば、各構成部品(部材)の寸法誤差が存在していても、また、金属シール5の弾性変形に伴って接触部19の径方向位置が内外変化する場合にあっても、確実に金属めっき層8に接触することになる。すなわち、シール性能を良くすることができる。   The metal plating layer 8 is formed in a band shape within a range of 5 mm in each of the inner diameter direction and the outer diameter direction from the contact portion 19 between the metal seal 5 and the flat surface 16 to be sealed. When the contact part 19 has a width in the normal tightening (compression) use state, the measurement is performed from the center of the width (the same applies to other shapes of metal seals such as FIGS. 3 and 4 described later). And). In this way, even if there is a dimensional error of each component (member), or even when the radial position of the contact portion 19 changes inside and outside due to elastic deformation of the metal seal 5, The metal plating layer 8 is surely contacted. That is, the sealing performance can be improved.

図2の(B)は、図2の(A)の要部拡大図である。従来のように脆性部材の被密封平坦面が剥き出しになっている(すなわち金属めっき層が積層されていない)場合、金属シールを脆性部材の被密封平坦面に接触させて締め込んでも、金属シールの接触部分が被密封平坦面に沿って潰れ、この状態で(熱を加えた際に線膨張係数の差によって)水平方向に力がはたらくと、脆性部材と金属シールとの間で相対的なすべりが生じるが、本発明のように脆性部材1の被密封平坦面16に金属めっき層8が積層されていると、図2(B)のように、金属シール5の密接シール部7が金属めっき層8に食い込んで、この状態で水平方向に力がはたらいても、脆性部材1と金属シール5との間で相対的なすべりが抑制されて止まっているので、シール性能を良好に維持できる。   FIG. 2B is an enlarged view of a main part of FIG. If the sealed flat surface of the brittle member is exposed (that is, the metal plating layer is not laminated) as in the conventional case, the metal seal can be secured even if the metal seal is brought into contact with the sealed flat surface of the brittle member and tightened. If the contact portion of the material collapses along the flat surface to be sealed and a force is applied in the horizontal direction (due to the difference in the coefficient of linear expansion when heat is applied), the relative contact between the brittle member and the metal seal will occur. Although slipping occurs, when the metal plating layer 8 is laminated on the sealed flat surface 16 of the brittle member 1 as in the present invention, the close seal portion 7 of the metal seal 5 is made of metal as shown in FIG. Even if the plating layer 8 is bitten and a force is applied in the horizontal direction in this state, the relative slip between the brittle member 1 and the metal seal 5 is suppressed and stopped, so that the sealing performance can be maintained well. .

図3は、金属シール5の横断面形状が弯曲S字(Z字)型の場合を示す。
図4は、金属シール5の横断面形状が矩形状の基本部9から半円山型突部17,17が突出した形状をしている場合を示す。
本発明の金属シール5としては、図2、図3、又は、図4に示すものの他、各種の断面形状とするも自由である。
FIG. 3 shows a case where the cross-sectional shape of the metal seal 5 is a curved S-shape (Z-shape).
4 shows a case where the metal seal 5 has a shape in which the semicircular protrusions 17 and 17 protrude from the rectangular basic portion 9.
As the metal seal 5 of the present invention, various cross-sectional shapes other than those shown in FIG. 2, FIG. 3, or FIG. 4 can be freely used.

図5は、第2の実施の形態を示す。脆性部材1は容器型(椀型)や浅皿型であり、被密封用外縁部3(フランジ部)は、外鍔状に突出形成される。図5では、上方の(平板状の)金属部材2と、脆性部材1の外縁部3の上面18との間に、(前述の)メインシール13としての金属シール5が介設され、これら金属部材2と脆性部材1の外縁部3とメインシール13により密封空間6を形成している。その他の構成は、第1の実施の形態と同様である。   FIG. 5 shows a second embodiment. The brittle member 1 is a container type (a bowl type) or a shallow dish type, and the outer edge 3 (flange part) to be sealed is formed so as to project into an outer bowl shape. In FIG. 5, a metal seal 5 as the main seal 13 (described above) is interposed between the upper (flat plate) metal member 2 and the upper surface 18 of the outer edge 3 of the brittle member 1. A sealed space 6 is formed by the member 2, the outer edge portion 3 of the brittle member 1, and the main seal 13. Other configurations are the same as those of the first embodiment.

石英フランジ(脆性部材1)の金属シール5との接触面(被密封平坦面16)に銅めっき層を厚さ寸法tを10μm として積層し、金属シール5として図2に示すメタルレジリエントシール(SUS630 、銀めっき30〜50μm )を用い、銅めっきを施した石英フランジの両側にセッティングしてHe加圧リーク試験を実施した。試験結果を図6に示す。図7は、石英フランジに銅めっきを施さない場合の比較例を示す(なお他の条件は、上記実施例と同一とした)。なお、図6及び図7において、点線はHeガスを注入する前のHeリーク量を示し、実線はHeガスを 0.3MPaの圧力で注入した場合のHeリーク量を示す。試験結果より、本発明は、リーク量が少なく、密封性能が優れていることがわかる。   A copper plating layer is laminated on the contact surface (sealed flat surface 16) of the quartz flange (brittle member 1) with the metal seal 5 with a thickness dimension t of 10 μm, and the metal seal 5 shown in FIG. SUS630, silver plating 30-50 .mu.m) was used, and a He pressure leak test was carried out by setting on both sides of a quartz flange subjected to copper plating. The test results are shown in FIG. FIG. 7 shows a comparative example in which copper plating is not applied to the quartz flange (note that other conditions are the same as those in the above example). 6 and 7, the dotted line indicates the amount of He leak before the He gas is injected, and the solid line indicates the amount of He leak when the He gas is injected at a pressure of 0.3 MPa. From the test results, it can be seen that the present invention has a small amount of leakage and excellent sealing performance.

なお、本発明は、設計変更可能であって、例えば、脆性部材1の被密封用外縁部3の一面12のうち少なくともメインシール13と接触する部分に金属めっき層8を積層させるとともに、脆性部材1の被密封用外縁部3の他面14のうち少なくとも副シール15と接触する部分に金属めっき層8を積層させたものとするも良い。
また、副シール15を具備しない(金属シール5としてメインシール13のみを具備する)密封構造体であるも良い。
In the present invention, the design can be changed. For example, the metal plating layer 8 is laminated on at least a portion of the one surface 12 of the outer edge portion 3 to be sealed that contacts the main seal 13 and the brittle member 1 The metal plating layer 8 may be laminated on at least a portion of the other surface 14 of the outer edge portion 3 to be sealed that is in contact with the sub seal 15.
Further, it may be a sealing structure that does not include the secondary seal 15 (only the main seal 13 is provided as the metal seal 5).

以上のように、本発明は、低線膨張係数の脆性部材1の被密封平坦面16に対して、金属シール5の密接シール部7を接触させて密封する密封構造体に於て、被密封平坦面16のうち少なくとも金属シール5と接触する部分に金属めっき層8を積層させたので、半導体や液晶の製造装置に於て用いられる石英(又はセラミック)と金属という線膨張係数が相違する2部材間の密封性(シール性)に優れ、特に、ヒートサイクルを繰り返しても高いシール性能を維持できる。図2(B)に示すように、金属シール5の接触部19が、脆性部材1の金属めっき層8へ僅かに食い込み状となって、矢印R方向への滑りが抑制されて、この滑りに伴う内部密封ガス(He等)の外部漏洩を防止して、ヒートサイクルを繰り返しても高いシール性を発揮する。   As described above, the present invention provides a sealed structure in which the tight seal portion 7 of the metal seal 5 is brought into contact with the flat surface 16 to be sealed of the brittle member 1 having a low linear expansion coefficient so as to be sealed. Since the metal plating layer 8 is laminated on at least a portion of the flat surface 16 that is in contact with the metal seal 5, the linear expansion coefficients of quartz (or ceramic) and metal used in a semiconductor or liquid crystal manufacturing apparatus are different. It is excellent in sealing performance (sealing performance) between members, and in particular, high sealing performance can be maintained even if the heat cycle is repeated. As shown in FIG. 2 (B), the contact portion 19 of the metal seal 5 slightly bites into the metal plating layer 8 of the brittle member 1, and the slip in the direction of the arrow R is suppressed. It prevents the external leakage of the accompanying internal sealing gas (He etc.) and exhibits high sealing performance even after repeated heat cycles.

また、低線膨張係数の脆性部材1の被密封用外縁部3を、低線膨張係数よりも大きい線膨張係数の第1金属平坦面部10・第2金属平坦面部11にて、挟着保持すると共に、密封空間6を区画形成する第1金属平坦面部10と外縁部3の一面12の間に介設したメインシール13と、第2金属平坦面部11と外縁部3の他面14の間に介設した副シール15とによって、脆性部材1を第1金属平坦面部10・第2金属平坦面部11から弾発的遊離状態で挟着保持するように構成し、外縁部3の一面12のうち少なくともメインシール13と接触する部分に金属めっき層8を積層させたので、半導体や液晶の製造装置に於て用いられる石英(又はセラミック)と金属という線膨張係数が相違する2部材間の密封性(シール性)に優れ、特に、図2(B)に示すように、金属シール5の接触部19が、脆性部材1の金属めっき層8へ僅かに食い込み状となって、矢印R方向への滑りが抑制されて、この滑りに伴う内部密封ガス(He等)の外部漏洩を防止して、ヒートサイクルを繰り返しても高いシール性能を維持できる。また、脆性部材1の仕上げ精度(平行度、平面度)、ヒートサイクルによるボルトの伸び縮みや脆性部材1と金属シール5の熱膨張係数の差による伸び縮みを吸収することができる。つまり、比較的容易な方法で、これまで困難とされていた石英やセラミックなどのフランジに対する金属シール5の使用を可能にし、かつ、高いシール性能を発揮することができる。   Further, the sealed outer edge portion 3 of the brittle member 1 having a low linear expansion coefficient is sandwiched and held by the first metal flat surface portion 10 and the second metal flat surface portion 11 having a linear expansion coefficient larger than the low linear expansion coefficient. In addition, a main seal 13 interposed between the first metal flat surface portion 10 and the one surface 12 of the outer edge portion 3 that define the sealed space 6, and between the second metal flat surface portion 11 and the other surface 14 of the outer edge portion 3. The brittle member 1 is sandwiched and held from the first metal flat surface portion 10 and the second metal flat surface portion 11 in a resiliently released state by the intervening sub-seal 15. Since the metal plating layer 8 is laminated at least in a portion in contact with the main seal 13, the sealing performance between two members having different linear expansion coefficients of quartz (or ceramic) and metal used in a semiconductor or liquid crystal manufacturing apparatus. Excellent (sealability), especially as shown in FIG. The contact portion 19 of the brittle member 1 slightly bites into the metal plating layer 8 of the brittle member 1 to prevent slipping in the direction of arrow R and prevent external leakage of the internal sealing gas (He etc.) accompanying this slipping. Thus, high sealing performance can be maintained even after repeated heat cycles. Moreover, the finishing precision (parallelism, flatness) of the brittle member 1, the expansion and contraction of the bolt due to the heat cycle, and the expansion and contraction due to the difference in the thermal expansion coefficient between the brittle member 1 and the metal seal 5 can be absorbed. That is, it is possible to use the metal seal 5 for a flange made of quartz or ceramic, which has been difficult until now, and to exhibit high sealing performance by a relatively easy method.

また、石英又はセラミックから成る脆性部材1の被密封用外縁部3を、第1金属平坦面部10・第2金属平坦面部11にて、挟着保持すると共に、密封空間6を区画形成する第1金属平坦面部10と外縁部3の一面12の間に介設したメインシール13と、第2金属平坦面部11と外縁部3の他面14の間に介設した副シール15とによって、脆性部材1を第1金属平坦面部10・第2金属平坦面部11から弾発的遊離状態で挟着保持するように構成し、外縁部3の一面12のうち少なくともメインシール13と接触する部分に金属めっき層8を積層させたので、半導体や液晶の製造装置に於て用いられる石英又はセラミックと、金属という線膨張係数が相違する2部材間の密封性(シール性)に優れ、特に、図2(B)に示すように、金属シール5の接触部19が、脆性部材1の金属めっき層8へ僅かに食い込み状となって、矢印R方向への滑りが抑制されて、この滑りに伴う内部密封ガス(He等)の外部漏洩を防止して、ヒートサイクルを繰り返しても高いシール性能を維持できる。また、脆性部材1の仕上げ精度(平行度、平面度)、ヒートサイクルによるボルトの伸び縮みや脆性部材1と金属シール5の熱膨張係数の差による伸び縮みを吸収することができる。つまり、比較的容易な方法で、これまで困難とされていた石英やセラミックなどのフランジに対する金属シール5の使用を可能にし、高いシール性能を発揮することができる。   In addition, the outer edge portion 3 to be sealed of the brittle member 1 made of quartz or ceramic is sandwiched and held by the first metal flat surface portion 10 and the second metal flat surface portion 11 and the sealed space 6 is partitioned. A brittle member is formed by a main seal 13 interposed between the flat metal surface portion 10 and one surface 12 of the outer edge portion 3 and a secondary seal 15 interposed between the second metal flat surface portion 11 and the other surface 14 of the outer edge portion 3. 1 is configured to be clamped and held from the first metal flat surface portion 10 and the second metal flat surface portion 11 in a resiliently released state, and at least a portion of the one surface 12 of the outer edge portion 3 that contacts the main seal 13 is plated with metal. Since the layer 8 is laminated, quartz or ceramic used in a semiconductor or liquid crystal manufacturing apparatus is excellent in sealing performance (sealing performance) between two members having different linear expansion coefficients such as metal. As shown in B), the contact portion 19 of the metal seal 5 is a brittle member 1. Slightly bites into the metal plating layer 8 to prevent slipping in the direction of arrow R, prevent external leakage of the internal sealing gas (He etc.) accompanying this slipping, and is high even if the heat cycle is repeated Seal performance can be maintained. Moreover, the finishing precision (parallelism, flatness) of the brittle member 1, the expansion and contraction of the bolt due to the heat cycle, and the expansion and contraction due to the difference in the thermal expansion coefficient between the brittle member 1 and the metal seal 5 can be absorbed. That is, it is possible to use the metal seal 5 against a flange made of quartz or ceramic, which has been difficult until now, by a relatively easy method, and can exhibit high sealing performance.

また、金属シール5(又は、メインシール13と副シール15)が弾性回復量が大きい形状・材質にて構成されているので、シール性能がより優れる。
また、金属めっき層8の厚さ寸法tを1μm 以上15μm 以下に設定したので、効率良く良好なシール性を得ることができる。
また、金属めっき層8を、金属シール5と被密封平坦面16との接触部19から内径方向・外径方向に各5mmの範囲内の帯状に形成したので、金属シール5の密接シール部7が金属めっき層8から外れてしまうことがない。
Further, since the metal seal 5 (or the main seal 13 and the sub-seal 15) is made of a shape and material having a large elastic recovery amount, the sealing performance is more excellent.
Further, since the thickness dimension t of the metal plating layer 8 is set to 1 μm or more and 15 μm or less, a good sealing property can be obtained efficiently.
Further, since the metal plating layer 8 is formed in a band shape within a range of 5 mm in each of the inner diameter direction and the outer diameter direction from the contact portion 19 between the metal seal 5 and the flat surface 16 to be sealed, the close seal portion 7 of the metal seal 5 is formed. Does not come off the metal plating layer 8.

本発明の第1の実施の形態を示す断面正面図である。It is a section front view showing a 1st embodiment of the present invention. 要部拡大断面図である。図2(B)は図2(A)のさらに要部拡大断面図である。It is a principal part expanded sectional view. FIG. 2B is an enlarged cross-sectional view of an essential part of FIG. 金属シールの他例を示す断面図である。It is sectional drawing which shows the other example of a metal seal. 金属シールのさらに他例を示す断面図である。It is sectional drawing which shows the other example of a metal seal. 第2の実施の形態を示す断面正面図である。It is a section front view showing a 2nd embodiment. 本発明の実施例の測定結果を示すグラフ図である。It is a graph which shows the measurement result of the Example of this invention. 比較例の測定結果を示すグラフ図である。It is a graph which shows the measurement result of a comparative example.

符号の説明Explanation of symbols

1 脆性部材
3 (被密封用)外縁部
5 金属シール
6 密封空間
7 密接シール部
8 金属めっき層
10 第1金属平坦面部
11 第2金属平坦面部
12 一面
13 メインシール
14 他面
15 副シール
16 被密封平坦面
19 接触部
DESCRIPTION OF SYMBOLS 1 Brittle member 3 (For sealing) Outer edge part 5 Metal seal 6 Sealed space 7 Close seal part 8 Metal plating layer
10 1st metal flat surface
11 Second metal flat surface
12 One side
13 Main seal
14 Other side
15 Secondary seal
16 Sealed flat surface
19 Contact area

Claims (7)

低線膨張係数の脆性部材(1)の被密封平坦面(16)に対して、金属シール(5)の密接シール部(7)を接触させて密封する密封構造体に於て、
上記被密封平坦面(16)のうち少なくとも上記金属シール(5)と接触する部分に金属めっき層(8)を積層させたことを特徴とする密封構造体。
In a sealing structure in which a tight seal portion (7) of a metal seal (5) is brought into contact with a flat surface (16) to be sealed of a brittle member (1) having a low linear expansion coefficient, and sealed.
A sealing structure characterized in that a metal plating layer (8) is laminated on at least a portion of the flat surface to be sealed (16) that is in contact with the metal seal (5).
低線膨張係数の脆性部材(1)の被密封用外縁部(3)を、上記低線膨張係数よりも大きい線膨張係数の第1金属平坦面部(10)・第2金属平坦面部(11)にて、挟着保持すると共に、密封空間(6)を区画形成する上記第1金属平坦面部(10)と上記外縁部(3)の一面(12)の間に介設したメインシール(13)と、上記第2金属平坦面部(11)と上記外縁部(3)の他面(14)の間に介設した副シール(15)とによって、上記脆性部材(1)を上記第1金属平坦面部(10)・第2金属平坦面部(11)から弾発的遊離状態で挟着保持するように構成し、
上記外縁部(3)の一面(12)のうち少なくとも上記メインシール(13)と接触する部分に金属めっき層(8)を積層させたことを特徴とする密封構造体。
The outer edge portion (3) to be sealed of the brittle member (1) having a low linear expansion coefficient is composed of a first metal flat surface portion (10) and a second metal flat surface portion (11) having a linear expansion coefficient larger than the low linear expansion coefficient. The main seal (13) interposed between the first metal flat surface portion (10) and the one surface (12) of the outer edge portion (3) which sandwich and hold the sealed space (6). And the second metal flat surface portion (11) and the secondary seal (15) interposed between the other surface (14) of the outer edge portion (3), the brittle member (1) is flattened with the first metal flat surface. It is constructed so as to be clamped and held from the face part (10) and the second metal flat face part (11),
A sealing structure characterized in that a metal plating layer (8) is laminated on at least a portion in contact with the main seal (13) of one surface (12) of the outer edge portion (3).
石英又はセラミックから成る脆性部材(1)の被密封用外縁部(3)を、第1金属平坦面部(10)・第2金属平坦面部(11)にて、挟着保持すると共に、密封空間(6)を区画形成する上記第1金属平坦面部(10)と上記外縁部(3)の一面(12)の間に介設したメインシール(13)と、上記第2金属平坦面部(11)と上記外縁部(3)の他面(14)の間に介設した副シール(15)とによって、上記脆性部材(1)を上記第1金属平坦面部(10)・第2金属平坦面部(11)から弾発的遊離状態で挟着保持するように構成し、
上記外縁部(3)の一面(12)のうち少なくとも上記メインシール(13)と接触する部分に金属めっき層(8)を積層させたことを特徴とする密封構造体。
The sealed outer edge (3) of the brittle member (1) made of quartz or ceramic is sandwiched and held by the first metal flat surface portion (10) and the second metal flat surface portion (11), and the sealed space ( 6) a main seal (13) interposed between the first metal flat surface portion (10) and the one surface (12) of the outer edge portion (3), and the second metal flat surface portion (11). The brittle member (1) is attached to the first metal flat surface portion (10) and the second metal flat surface portion (11) by the sub seal (15) interposed between the other surfaces (14) of the outer edge portion (3). ) Is configured to hold in a loosely released state,
A sealing structure characterized in that a metal plating layer (8) is laminated on at least a portion in contact with the main seal (13) of one surface (12) of the outer edge portion (3).
上記金属シール(5)が弾性回復量が大きい形状・材質にて構成されている請求項1記載の密封構造体。   The sealing structure according to claim 1, wherein the metal seal (5) is formed of a shape and material having a large elastic recovery amount. 上記メインシール(13)と副シール(15)は、弾性回復量が大きい形状・材質にて構成されている請求項2又は3記載の密封構造体。   The sealing structure according to claim 2 or 3, wherein the main seal (13) and the sub-seal (15) are formed of a shape and material having a large elastic recovery amount. 上記金属めっき層(8)の厚さ寸法(t)を1μm 以上15μm 以下に設定した請求項1,2,3,4又は5記載の密封構造体。   The sealed structure according to claim 1, 2, 3, 4 or 5, wherein the thickness (t) of the metal plating layer (8) is set to 1 µm or more and 15 µm or less. 上記金属めっき層(8)を、上記金属シール(5)と上記被密封平坦面(16)との接触部(19)から内径方向・外径方向に各5mmの範囲内の帯状に形成した請求項1又は6記載の密封構造体。   The metal plating layer (8) is formed in a strip shape within a range of 5 mm from the contact portion (19) between the metal seal (5) and the sealed flat surface (16) in the inner diameter direction and the outer diameter direction. Item 7. The sealed structure according to Item 1 or 6.
JP2008287826A 2008-11-10 2008-11-10 Sealing structure Pending JP2010112535A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003185022A (en) * 2001-12-18 2003-07-03 Sumitomo Metal Ind Ltd Sealing structure
JP2004340315A (en) * 2003-05-19 2004-12-02 Mitsubishi Cable Ind Ltd Metal seal
JP2007139192A (en) * 2005-11-17 2007-06-07 Air Products & Chemicals Inc Seal assembly and seal assembly manufacturing and operating method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003185022A (en) * 2001-12-18 2003-07-03 Sumitomo Metal Ind Ltd Sealing structure
JP2004340315A (en) * 2003-05-19 2004-12-02 Mitsubishi Cable Ind Ltd Metal seal
JP2007139192A (en) * 2005-11-17 2007-06-07 Air Products & Chemicals Inc Seal assembly and seal assembly manufacturing and operating method

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