JP2010106149A - Thermosetting resin composition and prepreg and laminate using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is excellent in Tg, copper foil adhesion, heat resistance, moisture resistance, flame retardance, resistance to copper-brazing heat, low dielectric characteristic and low dielectric loss tangent, and application thereof, e.g. to a prepreg, a laminate, etc. <P>SOLUTION: The thermosetting resin composition contains: (A) a compound which has an acidic substituent and an N-substituted maleimide group within its molecular structure and is prepared by reacting (a) a maleimide compound having at least two N-substituted maleimide groups within a molecule and (b) an amine compound having an acidic substituent represented by formula (1) (wherein R<SB>1</SB>is a hydroxyl group, a carboxyl group or a sulfonic acid group which is an acidic substituent; R<SB>2</SB>is a hydrogen atom, a 1-5C aliphatic hydrocarbon group, a halogen atom, a hydroxyl group, a carboxy group or a sulfonic acid group; and x and y are each an integer of 1-4); (B) an aralkyl-modified epoxy resin; and (C) a metal hydrate having a pyrolysis temperature of ≥300°C as components. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a thermosetting resin composition suitable for electronic parts and the like, which has excellent low dielectric properties, flame retardancy, adhesion, heat resistance, safety and work environment.

  Thermosetting resins are widely used in the field of electronic components, etc., because the cross-linked structure unique to thermosetting resins expresses high heat resistance and dimensional stability, especially in copper-clad laminates and interlayer insulation materials, Due to the recent demand for higher density and higher reliability, high copper foil adhesion and heat resistance are required. Moreover, due to recent environmental problems, mounting of electronic parts using lead-free solder and flame resistance using halogen-free are required, and therefore higher heat resistance and flame resistance than conventional ones are required.

  The bismaleimide compound, which is a thermosetting resin, is a resin that is excellent in low dielectric properties, flame retardancy, and heat resistance, but a known bismaleimide compound that does not have curing reactivity with an epoxy resin is an epoxy-curable resin. When used as it is for a thermosetting resin, there is a problem that heat resistance and toughness are insufficient. Examples relating to thermosetting resins that produce and use adducts of bismaleimide compounds and aminophenols are disclosed in Patent Document 1, Patent Document 2, etc., but when these are used as copper-clad laminates or interlayer insulation materials However, curing reactivity and toughness are still insufficient, and heat resistance, reliability, workability, etc. are insufficient.

  Moreover, although the example regarding the thermosetting resin which contains cyanate resin and an aralkyl modified epoxy resin as an essential component is indicated by patent document 3, patent document 4, etc., cyanate resin which is an essential component is toughness and hardening reactivity. Because it is an inferior resin, the improvement in curing reactivity and toughness of this thermosetting resin is still insufficient, and even when these are used as copper-clad laminates or interlayer insulation materials, heat resistance, reliability, workability Etc. are insufficient.

  Further, Patent Document 5 discloses a case relating to a thermosetting resin using an adduct of a bismaleimide compound and an aminobenzoic acid produced without using an organic solvent, a benzoguanamine formaldehyde condensate, and the like. The temperature is low and the heat resistance to lead-free solder and the heat resistance with copper are insufficient in recent years.

Japanese Patent Publication No. 63-34899 JP-A-6-32969 JP 2002-309085 A JP 2002-348469 A Japanese Patent Publication No. 6-8342

  The object of the present invention is a thermosetting resin composition excellent in all of copper foil adhesion, heat resistance, moisture resistance, flame resistance, heat resistance with copper, low dielectric properties, low dielectric loss tangent, and use thereof, for example, A prepreg and a laminate are provided.

The present invention relates to the following.
1. (A) (a) produced by reacting a maleimide compound having at least two N-substituted maleimide groups in one molecule with an amine compound having an acidic substituent represented by (b) general formula (1) A compound having an acidic substituent and an N-substituted maleimide group in the molecular structure, (B) an aralkyl-modified epoxy resin, and (C) a metal hydrate having a thermal decomposition temperature of 300 ° C. or higher as components. A thermosetting resin composition.

（式中、Ｒ_１は酸性置換基である水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_２は水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子、水酸基、カルボキシ基、スルホン酸基を示し、ｘ及びｙは１〜４の整数である。）

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, Represents a sulfonic acid group, and x and y are integers of 1 to 4.)

2. (A) The said thermosetting resin composition whose compound is a hardening | curing agent shown to General formula (2) or General formula (3).

（式中、Ｒ_１は酸性置換基である水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_２は水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子、水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_３は水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子を示し、ｘ、ｙ及びｚは１〜４の整数である。）

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, A sulfonic acid group, R ₃ represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, and x, y and z are integers of 1 to 4)

（式中、Ｒ_１は酸性置換基である水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_２は水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子、水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_４及びＲ_５は各々独立に水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子を示し、ｘ、ｙ及びｐ、ｑは各々独立に１〜４の整数であり、Ａはアルキレン基、アルキリデン基、エーテル基、スルフォニル基、又は式（４）に示す残基である）

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, R ₄ and R ₅ each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x, y, p, and q each independently represent 1 to 4 And A is an alkylene group, an alkylidene group, an ether group, a sulfonyl group, or a residue represented by formula (4))

3. A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition.
4). A laminate obtained by laminating the prepreg.

  According to the present invention, it becomes possible to provide a thermosetting resin composition excellent in all of copper foil adhesion, heat resistance, moisture resistance, flame resistance, heat resistance with copper, low dielectric properties, and low dielectric loss tangent. It was.

Hereinafter, the present invention will be described in detail.
The thermosetting resin composition of the present invention contains the following compounds (A) to (C) as components.
(A) (a) produced by reacting a maleimide compound having at least two N-substituted maleimide groups in one molecule with (b) an amine compound having an acidic substituent represented by the following general formula (1) A compound having an acidic substituent and an N-substituted maleimide group in the molecular structure.
(B) Aralkyl-modified epoxy resin.
(C) Metal hydrate having a thermal decomposition temperature of 300 ° C. or higher.

（式中、Ｒ_１は酸性置換基である水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_２は水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子、水酸基、カルボキシ基、スルホン酸基を示し、ｘ及びｙは１〜４の整数である。）

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, Represents a sulfonic acid group, and x and y are integers of 1 to 4.)

  The compound having an acidic substituent and an N-substituted maleimide group in the molecular structure of the component (A) of the present invention includes a maleimide compound having at least two N-substituted maleimide groups in one molecule of (a), ( The amine compound having an acidic substituent represented by the general formula (1) of b) is produced by stirring and reacting in an organic solvent for 0.1 to 10 hours as necessary with heating and heat retention. The maleimide compound having at least two N-substituted maleimide groups in one molecule of (a) is, for example, bis (4-maleimidophenyl) methane, polyphenylmethanemaleimide, bis (4-maleimidophenyl) ether, bis ( 4-maleimidophenyl) sulfone, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide, 4-methyl-1,3-phenylenebismaleimide, m-phenylenebismaleimide, 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane and the like. Among these, bis (4-maleimidophenyl) methane and bis (4-maleimidophenyl) sulfone which have a high reaction rate and can have higher heat resistance. 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimi 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane is preferred, and 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide from the viewpoint of solubility in a solvent, Bis (4-maleimidophenyl) methane is more preferred, and bis (4-maleimidophenyl) methane is particularly preferred because it is inexpensive.

  Examples of the amine compound having an acidic substituent represented by the general formula (1) in (b) include m-aminophenol, p-aminophenol, o-aminophenol, p-aminobenzoic acid, m-aminobenzoic acid, o -Aminobenzoic acid, o-aminobenzenesulfonic acid, m-aminobenzenesulfonic acid, p-aminobenzenesulfonic acid, 3,5-dihydroxyaniline, 3,5-dicarboxyaniline, etc., among these, M-aminophenol, p-aminophenol, p-aminobenzoic acid, and 3,5-dihydroxyaniline are preferable from the viewpoint of solubility and synthesis yield, and o-aminophenol, m-aminophenol, p-Aminophenol is more preferable, and p-aminophenol is particularly preferable in terms of dielectric properties, low thermal expansion, and low cost.

Here, the use amount of the maleimide compound (a) and the amine compound (b) having an acidic substituent is such that the equivalent ratio is in terms of —NH ₂ group with respect to the maleimide group equivalent of the maleimide compound (a). The equivalent of the amine compound having an acidic substituent is preferably in the range represented by the following formula: 2.0 ≦ (maleimide group equivalent) / (equivalent in terms of —NH ₂ group) ≦ 10.0. If it exceeds 10.0, the solubility in the solvent may be insufficient or the heat resistance of the thermosetting resin may decrease, and if it is less than 2.0, gelation may occur, or the heat resistance of the thermosetting resin may decrease. May decrease. Moreover, it is preferable to set it as 10-1000 mass parts per 100 mass parts of total of (a) component and (b) component, and, as for the usage-amount of an organic solvent, it is more preferable to set it as 100-500 mass parts, 200- It is especially preferable to set it as 500 mass parts. If the amount of the organic solvent is small, the solubility is insufficient, and if it exceeds 1000 parts by mass, a long time is required for synthesis.

  The organic solvent used in this reaction is not particularly limited, but alcohol solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether, and ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone. And ether solvents such as tetrahydrofuran, aromatic solvents such as toluene, xylene and mesitylene, N atom containing solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone, S atom containing solvents such as dimethyl sulfoxide, and the like. One kind or a mixture of two or more kinds can be used. Among these, cyclohexanone, propylene glycol monomethyl ether, and methyl cellosolve are preferable from the viewpoint of solubility, and cyclohexanone and propylene glycol monomethyl ether are more preferable from the viewpoint of low toxicity, and they remain as residual solvents when producing prepreg because of high volatility. The difficult propylene glycol monomethyl ether is particularly preferred.

  In this reaction, a reaction catalyst can be optionally used as necessary, and is not particularly limited. Examples of the reaction catalyst include amines such as triethylamine, pyridine, and tributylamine, imidazoles such as methylimidazole and phenylimidazole, phosphorus-based catalysts such as triphenylphosphine, and the like. Can be used.

  By this reaction, for example, a compound having an acidic substituent and an N-substituted maleimide group in the molecular structure represented by the following general formula (2) or (3) is synthesized, and copper foil adhesion, heat resistance, moisture resistance, difficulty A thermosetting resin composition having excellent flammability and low dielectric properties can be obtained.

（式中、Ｒ_１は酸性置換基である水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_２は水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子、水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_３は水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子を示し、ｘ、ｙ及びｚは１〜４の整数である。）

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, A sulfonic acid group, R ₃ represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, and x, y and z are integers of 1 to 4)

（式中、Ｒ_１は酸性置換基である水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_２は水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子、水酸基、カルボキシ基、スルホン酸基を示し、Ｒ_４及びＲ_５は各々独立に水素原子、又は炭素数１〜５の脂肪族炭化水素基、ハロゲン原子を示し、ｘ、ｙ及びｐ、ｑは各々独立に１〜４の整数であり、Ａはアルキレン基、アルキリデン基、エーテル基、スルフォニル基、又は式（４）に示す残基である）

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, R ₄ and R ₅ each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x, y, p, and q each independently represent 1 to 4 And A is an alkylene group, an alkylidene group, an ether group, a sulfonyl group, or a residue represented by formula (4))

  The aralkyl-modified epoxy resin as component (B) is a biphenyl aralkyl epoxy resin represented by the following general formula (5), a phenol aralkyl epoxy resin represented by the following general formula (6), a naphthalene aralkyl epoxy resin, or an anthracene aralkyl. An epoxy resin etc. are mentioned, 1 type (s) or 2 or more types can be mixed and used.

  Among these, biphenyl aralkyl epoxy resins and phenol aralkyl epoxy resins are more preferable from the viewpoint of dielectric properties, heat resistance and copper foil adhesion, and biphenyl aralkyl epoxy resins are particularly preferable from the viewpoint of moisture and heat resistance.

The metal hydrate having a thermal decomposition temperature of 300 ° C. or higher as the component (C) is obtained by heat-treating boehmite type aluminum hydroxide (AlOOH) or gibbsite type aluminum hydroxide (Al (OH) ₃ ) by heat treatment. And a compound prepared by adjusting the temperature to 300 ° C. or higher, magnesium hydroxide, and the like. Among these, boehmite type aluminum hydroxide (AlOOH) and magnesium hydroxide having excellent heat resistance are more preferable, and when used in combination with the thermosetting resin of this research which is excellent in flame retardancy, the flame retardant effect is Boehmite type aluminum hydroxide (AlOOH), which is a little inferior but inexpensive and has a particularly high thermal decomposition temperature of 350 ° C. or higher, is particularly preferable because it has both particularly high heat resistance and flame retardancy.

  In the thermosetting resin composition of the present invention, it is desirable to use a curing accelerator for improving heat resistance, flame retardancy, copper foil adhesiveness, etc. Examples of the curing accelerator include imidazoles and their Derivatives, tertiary amines, quaternary ammonium salts and the like. Among them, imidazoles and derivatives thereof are preferable from the viewpoints of heat resistance, flame retardancy, copper foil adhesiveness, and the like, and compounds in which the imidazole group represented by the following general formula (7) is substituted with an epoxy resin, and the following general The compound substituted by the isocyanate resin represented by the formula (8) is more preferable because it is excellent in curing moldability at a relatively low temperature at 200 ° C. or less and the aging stability of the varnish or prepreg. Alternatively, the compound represented by (10) may be used in a small amount, and is particularly preferable because it is commercially inexpensive.

（式中、Ｒ_６、Ｒ_７、Ｒ_８、Ｒ_９は、各々独立に水素原子、又は炭素数１〜５の脂肪族炭化水素基、フェニル基を示し、Ｂは存在しないか、又はアルキレン基、アルキリデン基、エーテル基、スルフォニル基のいずれかである。）

(In the formula, R ₆ , R ₇ , R ₈ , and R ₉ each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a phenyl group, and B does not exist or is an alkylene group. , An alkylidene group, an ether group, or a sulfonyl group.)

（式中、Ｒ_６、Ｒ_７、Ｒ_８、Ｒ_９は各々独立に水素原子、又は炭素数１〜５の脂肪族炭化水素基、フェニル基を示し、Ｄはアルキレン基、芳香族炭化水素基等のイソシアネート樹脂の残基である。）

(Wherein R ₆ , R ₇ , R ₈ and R ₉ each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a phenyl group, and D represents an alkylene group or an aromatic hydrocarbon group. It is a residue of an isocyanate resin such as

  In the thermosetting resin composition of the present invention, the amount of the component (A) used is preferably 1 to 99 parts by mass per 100 parts by mass in total with the component (B) in terms of solid content. It is more preferable to set it as -90 mass parts, and it is especially preferable to set it as 50-80 mass parts. If the blending amount of component (A) is small, flame retardancy is insufficient, and if it exceeds 99 parts by mass, heat resistance and adhesiveness are reduced. The amount of the component (C) used is preferably 10 to 200 parts by mass, preferably 10 to 150 parts by mass, per 100 parts by mass of the sum of the components (A) and (B) in terms of solid content. More preferred is 50 to 150 parts by mass. If it is less than 10 parts by mass, the flame retardancy may be insufficient, and if it exceeds 200 parts by mass, chemical resistance such as plating solution resistance may be deteriorated. The amount of the curing accelerator used is preferably 0.1 to 20 parts by mass, and preferably 0.1 to 10 parts by mass per 100 parts by mass of the total of the components (A) and (B) in terms of solid content. It is more preferable. If the amount of the curing accelerator used is small, the heat resistance, flame retardancy, copper foil adhesiveness, etc. are insufficient, and if it exceeds 20 parts by mass, the heat resistance and aging stability will be reduced.

  The thermosetting resin composition of the present invention can optionally be used in combination with other flame retardants, such as halogen-containing flame retardants containing bromine or chlorine, metal hydroxides having a thermal decomposition temperature of less than 300 ° C., etc. Does not meet the purpose of the present invention. Examples of other flame retardant combinations include triphenyl phosphate, tricresyl phosphate, trisdichloropropyl phosphate, phosphoric ester compounds, phosphazenes, phosphorous flame retardants such as red phosphorus, antimony trioxide, zinc molybdate, etc. Inorganic flame retardant aids and the like.

  In the thermosetting resin composition of the present invention, an inorganic filler can be optionally used in combination. Examples of inorganic fillers include silica, mica, talc, short glass fiber or fine powder and hollow glass, calcium carbonate, quartz powder and the like, among these, from the viewpoint of dielectric properties, heat resistance, flame retardancy Silica is particularly preferred. The amount of these inorganic fillers to be used is preferably 0 to 200 parts by mass, preferably 20 to 200 parts by mass with respect to 100 parts by mass of the sum of the components (A) and (B) in terms of solid content. More preferred is 20 to 150 parts by mass. When the compounding amount of the inorganic filler exceeds 300 parts by mass, chemical resistance such as plating solution resistance and moldability are deteriorated.

According to the present invention, known thermoplastic resins, elastomers, flame retardants, organic fillers and the like can be used in combination.
Examples of the thermoplastic resin include tetrafluoroethylene, polyethylene, polypropylene, polystyrene, polyphenylene ether resin, phenoxy resin, polycarbonate resin, polyester resin, polyamide resin, polyimide resin, xylene resin, petroleum resin, and silicone resin.

  Examples of the elastomer include polybutadiene, acrylonitrile, epoxy-modified polybutadiene, maleic anhydride-modified polybutadiene, phenol-modified polybutadiene, and carboxy-modified acrylonitrile. Examples of organic fillers include organic powders such as silicone powder, tetrafluoroethylene, polyethylene, polypropylene, polystyrene, and polyphenylene ether.

  In the present invention, an ultraviolet absorber, an antioxidant, a photopolymerization initiator, a fluorescent whitening agent, an adhesion improver, and the like can be arbitrarily added to the resin composition, and the resin composition is not particularly limited. Examples of these include UV absorbers such as benzotriazoles, antioxidants such as hindered phenols and styrenated phenols, photopolymerization initiators such as benzophenones, benzyl ketals, and thioxanthones, and fluorescence such as stilbene derivatives. Examples include brighteners, urea compounds such as urea silane, and adhesion improvers such as silane coupling agents.

The prepreg of the present invention is obtained by impregnating or coating the base material with the above-described thermosetting resin composition of the present invention. Hereinafter, the prepreg of the present invention will be described in detail.
The prepreg of the present invention can be produced by impregnating or coating the thermosetting resin composition of the present invention on a substrate and semi-curing (B-stage) by heating or the like. As the base material of the present invention, known materials used for various types of laminates for electrical insulating materials can be used. Examples of the material include inorganic fibers such as E glass, D glass, S glass, and Q glass, organic fibers such as polyimide, polyester, and tetrafluoroethylene, and mixtures thereof. These base materials have, for example, shapes such as woven fabric, non-woven fabric, robink, chopped strand mat, and surfacing mat, but the material and shape are selected depending on the intended use and performance of the molded product, and if necessary, A single material or two or more materials and shapes can be combined. The thickness of the base material is not particularly limited, and for example, about 0.03 to 0.5 mm can be used, and the surface is treated with a silane coupling agent or the like or mechanically subjected to a fiber opening treatment. However, it is suitable from the aspects of heat resistance, moisture resistance, and workability. After impregnating or coating the base material so that the amount of the resin composition attached to the base material is 20 to 90% by mass in terms of the resin content of the prepreg after drying, the temperature is usually 100 to 200 ° C. Can be heated and dried for 1 to 30 minutes and semi-cured (B-stage) to obtain the prepreg of the present invention.

The laminate of the present invention can be formed by laminate molding using the prepreg of the present invention described above. The prepreg of the present invention can be produced, for example, by laminating 1 to 20 sheets and laminating and forming a metal foil such as copper and aluminum on one or both sides thereof. The metal foil is not particularly limited as long as it is used for electrical insulating material applications. In addition, as the molding conditions, for example, a method of a laminated plate for an electrical insulating material and a multilayer plate can be applied. For example, a multistage press, a multistage vacuum press, continuous molding, an autoclave molding machine, etc. are used, and a temperature of 100 to 250 ° C. It can be molded in a range of ˜100 kg / cm ² and a heating time of 0.1 to 5 hours. Further, the prepreg of the present invention and the inner layer wiring board can be combined and laminated to produce a multilayer board.

Next, the present invention will be described in more detail with reference to the following examples, but these examples do not limit the present invention in any way.
Production Example 1 Production of Curing Agent (1-1) Having Acidic Substituent and Unsaturated Maleimide Group Heating and cooling reaction vessel with a volume of 2 liters equipped with a thermometer, a stirrer, and a moisture meter with a reflux condenser Bis (4-maleimidophenyl) methane: 358.0 g, p-aminophenol: 54.5 g, and propylene glycol monomethyl ether: 412.50 g (maleimide group equivalent) / (equivalent in terms of —NH ₂ group) = It mix | blended in the ratio used as 4.0, it was made to react for 5 hours, making it reflux, and the solution of the hardening | curing agent (1-1) which has an acidic substituent and unsaturated maleimide group was obtained. Moreover, as a result of analyzing this solution by GPC (polystyrene conversion, eluent: tetrahydrofuran), as shown in FIG. 1, the peak of p-aminophenol that appeared at about 19 minutes disappeared, and the addition reaction Peaks (B) and (C) derived from the product were confirmed. Here, peak (A) is bis (4-maleimidophenyl) methane as a raw material for synthesis, peak (B) is a reaction product represented by chemical formula (11), and peak (C) is a secondary product represented by chemical formula (12). It is a reaction product.

Production Example 2: Production of Curing Agent (1-2) Having Acidic Substituent and Unsaturated Maleimide Group A reaction vessel with a volume of 2 liters that can be heated and cooled, equipped with a thermometer, a stirrer, and a moisture meter with a reflux condenser. Bis (4-maleimidophenyl) methane: 358.0 g, m-aminophenol: 54.50 g, and propylene glycol monomethyl ether: 412.5 g (maleimide group equivalent) / (equivalent in terms of —NH ₂ group) = It mix | blended in the ratio used as 4.0, it was made to react for 5 hours, making it reflux, and the solution of the hardening | curing agent (1-2) which has an acidic substituent and unsaturated maleimide group was obtained.

Production Example 3 Production of Curing Agent (1-3) Having Acidic Substituent and Unsaturated Maleimide Group Heating and cooling reaction vessel with a volume of 2 liters equipped with a thermometer, stirrer, and moisture meter with reflux condenser Bis (4-maleimidophenyl) methane: 358.0 g, p-aminobenzoic acid: 27.40 g, and N, N-dimethylacetamide: 385.4 g in terms of (maleimide group equivalent) / (— NH ₂ group equivalent) Equivalents) = 10.0 and mixed at 160 ° C. for 5 hours to obtain a solution of a curing agent (1-3) having an acidic substituent and an unsaturated maleimide group.

Production Example 4: Production of Curing Agent (1-4) Having Acidic Substituent and Unsaturated Maleimide Group A reaction vessel with a volume of 1 liter that can be heated and cooled with a thermometer, a stirrer, and a moisture meter with a reflux condenser. M-phenylenebismaleimide: 268.0 g, m-aminophenol: 109.0 g, and N, N-dimethylacetamide: 377.0 g (maleimide group equivalent) / (-NH ₂ group equivalent) = 2 Was mixed at a ratio of 0.0 and reacted at 140 ° C. for 5 hours to obtain a solution of a curing agent (1-4) having an acidic substituent and an unsaturated maleimide group.

Production Example 5 Production of Curing Agent (1-5) Having Acidic Substituent and Unsaturated Maleimide Group Heating and cooling reaction vessel with a volume of 2 liters equipped with a thermometer, stirrer, and moisture meter with a reflux condenser 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide: 442.0 g, p-aminophenol: 54.5 g, and propylene glycol monomethyl ether: 496.5 g (maleimide group equivalent) / (- equivalent of NH ₂ groups equivalent) = blended with 4.0 and consisting ratio, the solution to obtain a curing agent (1-5) having reacted for 5 hours acidic substituent and an unsaturated maleimide group at reflux It was.

Production Example 6 Production of Curing Agent (1-6) Having Acidic Substituent and Unsaturated Maleimide Group Heating and cooling reaction vessel with a volume of 2 liters equipped with a thermometer, a stirrer, and a moisture meter with a reflux condenser 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide: 442.0 g, o-aminophenol: 54.5 g, and propylene glycol monomethyl ether: 496.5 g (maleimide group equivalent) / (-NH ₂ group equivalent) = 4.0 is mixed and reacted for 5 hours while refluxing to obtain a solution of the curing agent (1-6) having an acidic substituent and an unsaturated maleimide group. It was.

Production Example 7 Production of Curing Agent (1-7) Having Acidic Substituent and Unsaturated Maleimide Group Heating and cooling reaction vessel with a volume of 2 liters equipped with a thermometer, stirrer, and moisture meter with reflux condenser Bis (4-maleimidophenyl) sulfone: 408.0 g, p-aminophenol: 54.5 g, and N, N-dimethylacetamide: 462.5 g (maleimide group equivalent) / (-NH ₂ group equivalent) ) = 4.0 and blended at 100 ° C. for 2 hours to obtain a solution of a curing agent (1-7) having an acidic substituent and an unsaturated maleimide group.

Production Example 8 Production of Curing Agent (1-8) Having Acidic Substituent and Unsaturated Maleimide Group Heating and cooling reaction vessel with a volume of 2 liters equipped with a thermometer, stirrer, and moisture meter with reflux condenser Bis (4-maleimidophenyl) ether: 360.0 g, p-aminophenol: 54.5 g, and N, N-dimethylacetamide: 414.5 g (maleimide group equivalent) / (-NH ₂ group equivalent) ) = 4.0 and blended at 100 ° C. for 2 hours to obtain a solution of a curing agent (1-8) having an acidic substituent and an unsaturated maleimide group.

Production Example 9 Production of Curing Agent (1-9) Having Acidic Substituent and Unsaturated Maleimide Group Heating and cooling reaction vessel with a volume of 2 liters equipped with a thermometer, stirrer, and moisture meter with a reflux condenser 2,2′-bis [4- (4-maleimidophenoxy) phenyl] propane: 570.0 g, p-aminophenol: 54.5 g, and propylene glycol monomethyl ether: 624.5 g (maleimide group equivalent) / (Equivalent in terms of —NH ₂ group) = 4.0 was blended and reacted at 120 ° C. for 2 hours to obtain a solution of a curing agent (1-9) having an acidic substituent and an unsaturated maleimide group. .

Production Example 10 Production of Curing Agent (1-10) Having Acidic Substituent and Unsaturated Maleimide Group Heating and cooling reaction vessel with a volume of 2 liters equipped with a thermometer, a stirrer, and a moisture meter with a reflux condenser 4-methyl-1,3-phenylenebismaleimide: 282.0 g, p-aminophenol: 54.5 g, and N, N-dimethylacetamide: 336.5 g (maleimide group equivalent) / (— NH ₂ group (Equivalent equivalent) = 4.0 and blended at 120 ° C. for 2 hours to obtain a solution of a curing agent (1-10) having an acidic substituent and an unsaturated maleimide group.

(Examples 1-18, Comparative Examples 1-6)
Ingredients (A) obtained in Production Examples 1 to 10, Aralkyl-modified epoxy resin (B), and a curing accelerator, a flame retardant, an inorganic filler, and a diluent solvent using methyl ethyl ketone A uniform varnish having a resin content of 65% by mass was obtained by mixing at a blending ratio (parts by mass) shown in Tables 1 to 4. Next, the varnish was impregnated and applied to an E glass cloth having a thickness of 0.2 mm and dried by heating at 160 ° C. for 10 minutes to obtain a prepreg having a resin content of 55% by mass. Next, four prepregs were stacked, 18 μm electrolytic copper foils were placed one above the other, and pressed at a pressure of 25 kg / cm ² and a temperature of 185 ° C. for 90 minutes to obtain a copper clad laminate. Using the copper-clad laminate thus obtained, copper foil adhesion (copper foil peel strength), glass transition temperature, solder heat resistance, moisture absorption (water absorption), flame retardancy, relative dielectric constant (1 GHz ) And dielectric loss tangent (1 GHz) were measured and evaluated by the following method, and the evaluation results are shown in Tables 5 to 8.

(1) Evaluation of copper foil adhesion (copper foil peel strength) A copper-clad laminate is dipped in a copper etching solution to form a 1 cm wide copper foil to produce an evaluation substrate, and copper is tested using a tensile tester. The adhesion (peel strength) of the foil was measured.
(2) Measurement of glass transition temperature (Tg) A 5-mm square evaluation board from which copper foil was removed by immersing a copper clad laminate in a copper etching solution was prepared, and a TMA test apparatus (manufactured by DuPont, TMA2940) was used. Evaluation was made by observing the thermal expansion characteristics of the evaluation substrate.
(3) Evaluation of solder heat resistance A 5-cm square evaluation board from which copper foil was removed by immersing a copper-clad laminate in a copper etching solution was prepared, and using a pressure cooker test apparatus manufactured by Hirayama Mfg. Co., Ltd. After performing the pressure-cooker treatment for 4 hours under the conditions of 121 ° C. and 2 atm, the evaluation substrate was immersed in a solder bath at a temperature of 288 ° C. for 20 seconds, and then the solder heat resistance was evaluated by observing the appearance.
(4) Evaluation of heat resistance with copper (T-300) An evaluation board of 5 mm square was produced from a copper clad laminate, and the evaluation board swelled at 300 ° C. using a TMA test apparatus (manufactured by DuPont, TMA2940). It was evaluated by measuring the time to do.
(5) Evaluation of hygroscopicity (water absorption rate) A copper-clad laminate was immersed in a copper etching solution to prepare an evaluation board from which the copper foil was removed, and a pressure cooker test apparatus manufactured by Hirayama Seisakusho was used. After performing the pressure-cooker treatment for 5 hours under the conditions of 121 ° C. and 2 atm, the water absorption rate of the evaluation substrate was measured.
(6) Flame Retardancy Evaluation A test piece cut out to 127 mm in length and 12.7 mm in width was prepared from an evaluation board from which a copper foil was removed by immersing a copper-clad laminate in a copper etching solution, and tested for UL94. Evaluation was made according to the method (Method V).
(7) Measurement of relative dielectric constant and dielectric loss tangent The obtained copper-clad laminate was immersed in a copper etching solution to produce an evaluation substrate from which the copper foil was removed, and a relative dielectric constant measuring device manufactured by Hewlett-Packard Company (product) Name: HP4291B), relative permittivity and dielectric loss tangent at a frequency of 1 GHz were measured.

The numbers in the table are indicated by mass parts of solid content. * 1: Biphenyl aralkyl epoxy resin (manufactured by Nippon Kayaku Co., Ltd .; trade name NC-3000H, epoxy equivalent 290)
* 2: Phenol aralkyl epoxy resin (Mitsui Chemicals, trade name E-XL-3L, epoxy equivalent 235)
* 3: Addition reaction product of bisphenol A type epoxy resin and 2-phenylimidazole having the structure shown below

* 4: Addition reaction product of hexamethylene diisocyanate resin having the structure shown below and 2-ethyl-4-methylimidazole

* 5: Boehmite type aluminum hydroxide * 6: Bis (4-maleimidophenyl) methane * 7: 2,2'-bis [4- (4-maleimidophenoxy) phenyl] propane * 8: Bisphenol A type epoxy resin (Japan) Epoxy Resin Co., Ltd., trade name: Epicoat 828, epoxy equivalent 186)
* 9: Bisphenol F type epoxy resin (manufactured by Japan Epoxy Resin Co., Ltd., trade name: Epicoat 807, epoxy equivalent 168)
* 10: 2-Phenylimidazole * 11: Gibbsite type aluminum hydroxide.

  As is apparent from Tables 5 to 8, the examples of the present invention are Tg, copper foil peel strength, heat resistance, moisture resistance, flame resistance, heat resistance with copper (T-288), low dielectric properties, low Excellent dielectric loss tangent. On the other hand, there is no comparative example satisfying all of Tg, copper foil peel strength, heat resistance, moisture resistance, flame resistance, heat resistance with copper (T-300), low dielectric properties, and low dielectric loss tangent. The characteristics are inferior.

  A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition of the present invention and a laminate produced by laminating the prepreg are Tg, copper foil adhesion, heat resistance, moisture resistance. Excellent in heat resistance, flame retardancy, heat resistance with copper (T-300), low dielectric properties, low dielectric loss tangent, and useful as a printed wiring board for electronic equipment.

It is a graph which shows the measurement result of GPC.

Explanation of symbols

(A): peak related to bis (4-maleimidophenyl) methane (B): peak related to the reaction product shown in chemical formula (11) (C): peak related to the reaction product shown in chemical formula (12)

Claims (4)

(A) (a) produced by reacting a maleimide compound having at least two N-substituted maleimide groups in one molecule with an amine compound having an acidic substituent represented by (b) general formula (1) A compound having an acidic substituent and an N-substituted maleimide group in the molecular structure, (B) an aralkyl-modified epoxy resin, and (C) a metal hydrate having a thermal decomposition temperature of 300 ° C. or higher as components. A thermosetting resin composition.

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, Represents a sulfonic acid group, and x and y are integers of 1 to 4.) The thermosetting resin composition according to claim 1, wherein the compound (A) is a curing agent represented by the general formula (2) or the general formula (3).

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, A sulfonic acid group, R ₃ represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, and x, y and z are integers of 1 to 4)

(In the formula, R ₁ represents a hydroxyl group, carboxy group or sulfonic acid group which is an acidic substituent, and R ₂ represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a halogen atom, a hydroxyl group, a carboxy group, R ₄ and R ₅ each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x, y, p, and q each independently represent 1 to 4 And A is an alkylene group, an alkylidene group, an ether group, a sulfonyl group, or a residue represented by formula (4))

  A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition according to claim 1.   A laminate obtained by laminating the prepreg according to claim 3.

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