Nothing Special   »   [go: up one dir, main page]

JP2010199899A - Filter - Google Patents

Filter Download PDF

Info

Publication number
JP2010199899A
JP2010199899A JP2009041525A JP2009041525A JP2010199899A JP 2010199899 A JP2010199899 A JP 2010199899A JP 2009041525 A JP2009041525 A JP 2009041525A JP 2009041525 A JP2009041525 A JP 2009041525A JP 2010199899 A JP2010199899 A JP 2010199899A
Authority
JP
Japan
Prior art keywords
conductor
pieces
conductor pieces
adjacent
conductor piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009041525A
Other languages
Japanese (ja)
Other versions
JP5297227B2 (en
Inventor
Atsushi Suwa
敦 諏訪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Electric Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co Ltd filed Critical Panasonic Electric Works Co Ltd
Priority to JP2009041525A priority Critical patent/JP5297227B2/en
Publication of JP2010199899A publication Critical patent/JP2010199899A/en
Application granted granted Critical
Publication of JP5297227B2 publication Critical patent/JP5297227B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a filter that broadens a passband without being subject to restriction in respect of manufacture. <P>SOLUTION: The filter is equipped with: a dielectric substrate 1 having a grounding conductors 2a, 2b on both surfaces in a thickness direction; a plurality of conductor pieces 3 that are disposed in parallel with the grounding conductors 2a, 2b and coupled with each other in electromagnetic coupling manner; a power feeding section 4 formed on a conductor piece 31; an output section 5 formed on a conductor piece 36; and grounding through-holes 6 formed in ends of the conductor pieces, of ends of the conductor pieces 3, opposed to each other in pieces adjacent in the juxtapositional direction in an orthogonal direction relative to the juxtapositional direction of the conductor pieces 3, which connects the conductor pieces 3 to the grounding conductors 2a, 2b. The conductor pieces 3 are disposed on two planes having different positions in a thickness direction within the dielectric substrate 1 and being parallel with the grounding conductors 2a, 2b. The planes on which the conductor pieces 3 are disposed are planes adjacent in a thickness direction with respect to the planes on which the conductor pieces adjacent in the juxtapositional direction are formed. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は、インターディジタル型のフィルタに関するものである。   The present invention relates to an interdigital filter.

図11は、従来のフィルタの構成を示しており、このフィルタは、表面に接地導体2aを載置した誘電体基板1aの裏面に薄膜状の導体部310を形成し、誘電体基板1bが、その裏面を誘電体基板1aの裏面に対向させて導体部310上に載置され、誘電体基板1bの表面に接地導体2bを載置したストリップ線路構造を有する。ここで、誘電体基板1a,1bで誘電体基板1を構成しており、導体部310は、誘電体基板1内で接地導体2a,2bに対して平行に形成されている。   FIG. 11 shows a configuration of a conventional filter. This filter has a thin-film conductor 310 formed on the back surface of a dielectric substrate 1a on which a ground conductor 2a is placed, and the dielectric substrate 1b It has a stripline structure in which the back surface thereof is placed on the conductor portion 310 so as to face the back surface of the dielectric substrate 1a, and the ground conductor 2b is placed on the surface of the dielectric substrate 1b. Here, the dielectric substrate 1 is composed of the dielectric substrates 1a and 1b, and the conductor portion 310 is formed in parallel to the ground conductors 2a and 2b in the dielectric substrate 1.

薄膜状の導体部310は、誘電体基板1a,1bの間で接地導体2a,2bの面に対して平行な面上に形成された矩形状の導体片301〜304で構成され、導体片301〜304は、導体片の幅方向で所定の間隔毎に並設されている。並設方向で隣り合う導体片301〜304は互いに電磁結合によって結合し、並設方向の一端の導体片301からは給電部4が延設され、並設方向の他端の導体片304からは出力部5が延設されている。   The thin-film conductor 310 is composed of rectangular conductor pieces 301 to 304 formed on a plane parallel to the ground conductors 2a and 2b between the dielectric substrates 1a and 1b. ... To 304 are arranged in parallel at predetermined intervals in the width direction of the conductor pieces. The conductor pieces 301 to 304 that are adjacent in the juxtaposed direction are coupled to each other by electromagnetic coupling, and the power feeding portion 4 extends from the conductor piece 301 at one end in the juxtaposed direction, and from the conductor piece 304 at the other end in the juxtaposed direction. The output unit 5 is extended.

そして、導体片301〜304は、その並設方向に直交する導体片の長さ方向のいずれかの端部に接地用スルーホール6を設けており、導体片301〜304は接地用スルーホール6を介して接地導体2a,2bに電気的に接続している。導体片301〜304は、隣り合う導体片とは逆の端部に接地用スルーホール6を形成しており、例えば、導体片301が一方の端部に接地用スルーホール6を形成すれば、導体片302は他方の端部に接地用スルーホール6を形成し、導体片303は一方の端部に接地用スルーホール6を形成し、導体片304は他方の端部に接地用スルーホール6を形成する。また、導体片301〜304の接地用スルーホール6を設けていない端部は開放されている。   The conductor pieces 301 to 304 are each provided with a grounding through hole 6 at one end in the length direction of the conductor pieces orthogonal to the juxtaposed direction. The conductor pieces 301 to 304 are provided with the grounding through hole 6. Are electrically connected to the ground conductors 2a and 2b. The conductor pieces 301 to 304 have the grounding through hole 6 at the end opposite to the adjacent conductor piece. For example, if the conductor piece 301 forms the grounding through hole 6 at one end, The conductor piece 302 has a grounding through hole 6 at the other end, the conductor piece 303 has a grounding through hole 6 at one end, and the conductor piece 304 has a grounding through hole 6 at the other end. Form. The ends of the conductor pieces 301 to 304 that are not provided with the grounding through hole 6 are open.

この導体片301〜304は共振器として動作し、隣り合う導体片とインターディジタル型に配置されて互いに電磁結合させることにより、給電部4の入力に対する出力部5の出力が所定の周波数帯域のみ通過するバンドパスフィルタを構成している(例えば、特許文献1参照)。   The conductor pieces 301 to 304 operate as a resonator, and are arranged in an interdigital manner with adjacent conductor pieces and electromagnetically coupled to each other, so that the output of the output unit 5 with respect to the input of the power feeding unit 4 passes only in a predetermined frequency band. The band pass filter is configured (see, for example, Patent Document 1).

上記従来技術によるバンドパスフィルタの通過特性を図12に示す。図12の横軸は周波数、縦軸は減衰量であり、中心周波数f0=4GHzの周辺を本来の通過帯域B11とするバンドパスフィルタの特性を示している。なお、減衰量が中心周波数におけるピーク値から3dB低下するまでの範囲を通過帯域とする。   FIG. 12 shows pass characteristics of the band-pass filter according to the conventional technique. In FIG. 12, the horizontal axis represents the frequency, the vertical axis represents the attenuation, and shows the characteristics of the bandpass filter with the center frequency f0 = 4 GHz and the original passband B11. In addition, let the range until attenuation falls by 3 dB from the peak value in a center frequency be a pass band.

そして、図13は導体片300(以後、導体片301〜304を区別しない場合は導体片300と称す)の詳細図を示しており、導体片300の各寸法とバンドパスフィルタの特性との関係は、矩形状の導体片300の長さ、幅、隣り合う導体片とのギャップをそれぞれL,W,Gとすると、導体片300の長さLを1/4波長とする周波数がバンドパスフィルタの中心周波数f0となり、導体片300の幅WとギャップG(以降、水平ギャップGと称す)が通過帯域B11を決定する。   FIG. 13 shows a detailed view of the conductor piece 300 (hereinafter referred to as the conductor piece 300 when the conductor pieces 301 to 304 are not distinguished from each other), and the relationship between the dimensions of the conductor piece 300 and the characteristics of the band-pass filter. Is a band-pass filter where the length and width of the rectangular conductor piece 300 and the gap between adjacent conductor pieces are L, W, and G, respectively, and the frequency at which the length L of the conductor piece 300 is ¼ wavelength is obtained. The width W of the conductor piece 300 and the gap G (hereinafter referred to as the horizontal gap G) determine the passband B11.

特公昭61−19122号公報Japanese Examined Patent Publication No. 61-19122

上記従来技術によるバンドパスフィルタでは、水平ギャップGを狭くして、導体片300間の結合度を強くするほど、その通過特性Y11は図14に示すように、通過帯域B11がB11a〜B11bまで広がる。しかしながら、一般的な電子回路基板や、LTCC(Low Temperature Co-firedCeramics)基板等を誘電体基板1に用いた場合、製造上の制約によって水平ギャップGの最小値は0.05mm程度が限界であり、通過帯域のさらなる広帯域化を図ることが困難であった。   In the band-pass filter according to the above-described prior art, as the horizontal gap G is narrowed and the degree of coupling between the conductor pieces 300 is increased, the pass characteristic Y11 spreads from B11a to B11b as shown in FIG. . However, when a general electronic circuit board, LTCC (Low Temperature Co-fired Ceramics) board or the like is used for the dielectric substrate 1, the minimum value of the horizontal gap G is limited to about 0.05 mm due to manufacturing restrictions. It was difficult to further widen the passband.

本発明は、上記事由に鑑みてなされたものであり、その目的は、製造上の制約を受けることなく通過帯域の広帯域化を図ることができるフィルタを提供することにある。   The present invention has been made in view of the above-described reasons, and an object of the present invention is to provide a filter capable of widening the passband without being restricted in manufacturing.

請求項1の発明は、厚み方向の両面に接地導体を備えた誘電体板と、誘電体板内で接地導体に対して平行な方向に並設されて、互いに電磁結合によって結合した複数の導体片と、複数の導体片のうち並設方向の一端の導体片に形成された給電部と、複数の導体片のうち並設方向の他端の導体片に形成された出力部と、各導体片の前記並設方向に対する直交方向の両端部のうち、並設方向に隣り合う導体片とは逆の端部に形成されて、各導体片を誘電体板の両面の接地導体に接続する接地結合部とを備え、誘電体板内で厚み方向の位置が互いに異なり且つ接地導体に対して平行な複数の面上に各導体片が配置され、各導体片が配置される面は、並設方向に隣り合う導体片が形成された面に対して厚み方向に隣接する面であることを特徴とする。   According to the first aspect of the present invention, there are provided a dielectric plate having ground conductors on both sides in the thickness direction, and a plurality of conductors arranged in parallel in the dielectric plate in a direction parallel to the ground conductor and coupled to each other by electromagnetic coupling. Each of the plurality of conductor pieces, a power feeding portion formed on one conductor piece in the juxtaposed direction, an output portion formed on the other conductor piece in the juxtaposed direction, and each conductor. Grounding that is formed at the end opposite to the conductor piece adjacent in the juxtaposed direction among both ends of the piece in the direction perpendicular to the juxtaposed direction, and connects each conductor piece to the ground conductors on both sides of the dielectric plate Each conductor piece is disposed on a plurality of surfaces that are different from each other in the thickness direction in the dielectric plate and parallel to the ground conductor, and the surfaces on which the conductor pieces are disposed are arranged in parallel. It is a surface which adjoins the thickness direction with respect to the surface in which the conductor piece adjacent to the direction was formed.

この発明によれば、導体片間の水平ギャップを「正」の値だけでなく、「0」や「負」の値にまで狭めることも可能であり、製造上の制約を受けることなく導体片間の結合度をより強くして通過帯域の広帯域化を図ることができる。   According to the present invention, the horizontal gap between the conductor pieces can be narrowed not only to a “positive” value but also to a “0” or “negative” value. It is possible to increase the degree of coupling between the two to increase the passband.

請求項2の発明は、請求項1において、前記並設方向に隣り合う各導体片は、前記厚み方向からみて互いの一部が重なることを特徴とする。   A second aspect of the invention is characterized in that, in the first aspect, the conductor pieces adjacent to each other in the juxtaposed direction are partially overlapped when viewed from the thickness direction.

この発明によれば、導体片間の結合度をより強くして通過帯域の広帯域化を図ることができる。   According to this invention, the degree of coupling between the conductor pieces can be made stronger, and the passband can be widened.

請求項3の発明は、請求項1または2において、各導体片は、当該導体片の接地結合部を形成した端部が、前記並設方向に隣り合う導体片の前記接地結合部を形成していない端部から離れるように、各面上において前記並設方向に対する直交方向へずらして配置されることを特徴とする請求項。   According to a third aspect of the present invention, in the first or second aspect, each conductor piece has an end portion where the ground coupling portion of the conductor piece is formed to form the ground coupling portion of the conductor piece adjacent in the parallel arrangement direction. It is shifted and arrange | positioned on each surface in the orthogonal direction with respect to the said parallel arrangement direction so that it may leave | separate from the edge part which is not.

この発明によれば、隣り合う導体片が互いに重なり合う領域を大きくしていっても、導体片の端部の接地結合部が、隣接する導体片の端部と干渉することはなく、隣り合う導体片間の電磁結合をさらに強力にして、通過帯域の大幅な広帯域化を図ることができる。   According to this invention, even if the area where adjacent conductor pieces overlap each other is enlarged, the ground coupling portion at the end of the conductor piece does not interfere with the end of the adjacent conductor piece, and the adjacent conductor The electromagnetic coupling between the pieces can be further strengthened to greatly increase the passband.

以上説明したように、本発明では、製造上の制約を受けることなく通過帯域の広帯域化を図ることができるという効果がある。   As described above, according to the present invention, there is an effect that it is possible to widen the pass band without being restricted in manufacturing.

実施形態1のフィルタの構成を示す一部分解斜視図である。FIG. 3 is a partially exploded perspective view showing the configuration of the filter according to the first embodiment. 同上の構成を示す側面断面図である。It is side surface sectional drawing which shows a structure same as the above. 同上の導体片の構成を示す平面図である。It is a top view which shows the structure of the conductor piece same as the above. 同上の導体片の構成を示す側面図である。It is a side view which shows the structure of the conductor piece same as the above. (a)(b)同上の導体片間の水平ギャップが「0」「負」の場合を示す平面図である。(A) (b) It is a top view which shows the case where the horizontal gap between the conductor pieces same as the above is "0" "negative". 同上の減衰特性の変化を示す図である。It is a figure which shows the change of an attenuation characteristic same as the above. (a)(b)隣り合う導体片間の水平ギャップが大きい状態を示す斜視図である。(A) (b) It is a perspective view which shows the state where the horizontal gap between adjacent conductor pieces is large. (a)(b)隣り合う導体片間の水平ギャップを狭めた状態を示す斜視図である。(A) (b) It is a perspective view which shows the state which narrowed the horizontal gap between adjacent conductor pieces. 実施形態2のフィルタの一部構成を示す斜視図である。It is a perspective view which shows a partial structure of the filter of Embodiment 2. 同上の導体片の構成を示す平面図である。It is a top view which shows the structure of the conductor piece same as the above. 従来のフィルタの構成を示す一部分解斜視図である。It is a partially exploded perspective view which shows the structure of the conventional filter. 同上の減衰特性を示す図である。It is a figure which shows an attenuation characteristic same as the above. 同上の導体片の構成を示す平面図である。It is a top view which shows the structure of the conductor piece same as the above. 同上の減衰特性の変化を示す図である。It is a figure which shows the change of an attenuation characteristic same as the above.

以下、本発明の実施の形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(実施形態1)
図1、図2は、本実施形態のフィルタの構成を示しており、このフィルタは、一面に接地導体2aを載置し、他面に接地導体2bを載置した誘電体基板1内に薄膜状の導体部30を形成したストリップ線路構造を有し、導体部30は、誘電体基板1内で接地導体2a,2bに対して平行に形成されている。ここで図1は、誘電体基板1をその面方向に切断した状態を示しており、誘電体基板1は、その一面側および他面側を一体に形成した1枚構造、または複数枚を重ね合わせた積層構造のいずれでもよい。
(Embodiment 1)
FIG. 1 and FIG. 2 show the configuration of the filter of the present embodiment. This filter has a thin film in a dielectric substrate 1 in which a ground conductor 2a is placed on one surface and a ground conductor 2b is placed on the other surface. The conductor portion 30 is formed in parallel with the ground conductors 2 a and 2 b in the dielectric substrate 1. Here, FIG. 1 shows a state in which the dielectric substrate 1 is cut in the surface direction. The dielectric substrate 1 has a single-layer structure in which one surface side and the other surface side are integrally formed, or a plurality of layers are stacked. Any of the laminated structure combined may be sufficient.

薄膜状の導体部30は、誘電体基板1内に形成された矩形状の導体片31〜36で構成され、導体片31〜36は、誘電体基板1の厚み方向(誘電体基板1の面に対する法線方向)からみて、導体片の幅方向で所定の間隔毎に並設されている。並設方向で隣り合う導体片31〜36は互いに電磁結合によって結合し、並設方向の一端の導体片31からは給電部4が延設され、並設方向の他端の導体片36からは出力部5が延設されている。   The thin film-like conductor portion 30 is composed of rectangular conductor pieces 31 to 36 formed in the dielectric substrate 1, and the conductor pieces 31 to 36 are arranged in the thickness direction of the dielectric substrate 1 (surface of the dielectric substrate 1. As viewed from the normal direction), the conductor pieces are arranged at predetermined intervals in the width direction of the conductor pieces. The conductor pieces 31 to 36 adjacent in the juxtaposed direction are coupled to each other by electromagnetic coupling, and the power feeding portion 4 extends from the conductor piece 31 at one end in the juxtaposed direction, and from the conductor piece 36 at the other end in the juxtaposed direction. The output unit 5 is extended.

さらに、誘電体基板1内には、接地導体2a,2bの面に対して平行で、且つ誘電体基板1内での厚み方向の位置(レベル)が互いに異なる2つの面S1,S2(図2参照)が仮想的に設けられている。2つの面S1,S2は、誘電体基板1内で厚み方向にギャップD(以降、垂直ギャップDと称す)だけ離れており、導体片32,34,36は、接地導体2aを載置した誘電体基板1の一面側に位置する面S1上に配置され、導体片31,33,35は、接地導体2bを載置した誘電体基板1の他面側に位置する面S2上に配置されている。すなわち、導体片31〜36は、誘電体基板1内において、基板の厚み方向に垂直ギャップD間隔で交互にずれながら面方向に並設されているのである。   Further, in the dielectric substrate 1, two surfaces S1 and S2 that are parallel to the surfaces of the ground conductors 2a and 2b and have different positions (levels) in the thickness direction in the dielectric substrate 1 (FIG. 2). Is virtually provided. The two surfaces S1 and S2 are separated by a gap D (hereinafter referred to as a vertical gap D) in the thickness direction in the dielectric substrate 1, and the conductor pieces 32, 34, and 36 are dielectrics on which the ground conductor 2a is placed. The conductor pieces 31, 33, and 35 are disposed on the surface S2 located on the other surface side of the dielectric substrate 1 on which the ground conductor 2b is placed. Yes. That is, the conductor pieces 31 to 36 are juxtaposed in the surface direction in the dielectric substrate 1 while being alternately shifted in the thickness direction of the substrate at a vertical gap D interval.

そして、導体片31〜36は、その並設方向に直交する導体片の長さ方向のいずれかの端部に接地用スルーホール6(接地結合部)を設けており、接地用スルーホール6は、誘電体基板1内をその厚み方向に挿通して接地導体2a,2bに接続し、導体片31〜36は接地用スルーホール6を介して接地導体2a,2bに電気的に接続している。導体片31〜36は、隣り合う導体片とは逆の端部に接地用スルーホール6を形成しており、例えば、導体片31が一方の端部に接地用スルーホール6を形成すれば、導体片32は他方の端部に接地用スルーホール6を形成し、導体片33は一方の端部に接地用スルーホール6を形成し、導体片34は他方の端部に接地用スルーホール6を形成し、導体片35は一方の端部に接地用スルーホール6を形成し、導体片36は他方の端部に接地用スルーホール6を形成する。また、導体片31〜36の接地用スルーホール6を設けていない端部は開放されている。   The conductor pieces 31 to 36 are each provided with a grounding through hole 6 (ground coupling portion) at one end in the length direction of the conductor pieces orthogonal to the parallel arrangement direction. The dielectric substrate 1 is inserted in the thickness direction and connected to the ground conductors 2a and 2b, and the conductor pieces 31 to 36 are electrically connected to the ground conductors 2a and 2b through the grounding through holes 6. . The conductor pieces 31 to 36 have a grounding through hole 6 at the end opposite to the adjacent conductor piece. For example, if the conductor piece 31 has the grounding through hole 6 at one end, The conductor piece 32 forms the grounding through hole 6 at the other end, the conductor piece 33 forms the grounding through hole 6 at one end, and the conductor piece 34 forms the grounding through hole 6 at the other end. The conductor piece 35 forms the grounding through hole 6 at one end, and the conductor piece 36 forms the grounding through hole 6 at the other end. The ends of the conductor pieces 31 to 36 where the grounding through hole 6 is not provided are open.

この導体片31〜36は共振器として動作し、隣り合う導体片とインターディジタル型に配置されて互いに電磁結合させることにより、給電部4の入力に対する出力部5の出力が所定の周波数帯域のみ通過するバンドパスフィルタを構成している。   The conductor pieces 31 to 36 operate as a resonator and are arranged in an interdigital manner with adjacent conductor pieces so as to be electromagnetically coupled to each other so that the output of the output unit 5 with respect to the input of the power feeding unit 4 passes only in a predetermined frequency band. A band pass filter is configured.

図3は導体片3(以後、導体片31〜36を区別しない場合は導体片3と称す)の詳細図を示しており、導体片3の各寸法とバンドパスフィルタの特性との関係は、矩形状の導体片3の長さ、幅、隣り合う導体片とのギャップをそれぞれL,W,Gとすると、導体片3の長さLを1/4波長とする周波数がバンドパスフィルタの中心周波数f0となり、導体片3の幅WとギャップG(以降、水平ギャップGと称す)が通過帯域B1を決定する。   FIG. 3 shows a detailed view of the conductor piece 3 (hereinafter referred to as the conductor piece 3 when the conductor pieces 31 to 36 are not distinguished from each other). The relationship between the dimensions of the conductor piece 3 and the characteristics of the bandpass filter is as follows. When the length and width of the rectangular conductor piece 3 and the gap between adjacent conductor pieces are L, W, and G, the frequency at which the length L of the conductor piece 3 is ¼ wavelength is the center of the bandpass filter. The frequency f0 and the width W of the conductor piece 3 and the gap G (hereinafter referred to as the horizontal gap G) determine the passband B1.

そして、水平ギャップGを狭くして、導体片3間の結合度を強くするほど、通過帯域B1が広がる。しかしながら、一般的な電子回路基板や、LTCC(Low Temperature Co-firedCeramics)基板等を誘電体基板1に用いた場合、製造上の制約によって水平ギャップGの最小値は0.05mm程度が限界であり、この水平ギャップGの限界が従来における通過帯域の広帯域化の限界となっていた。   Then, the narrower the horizontal gap G and the stronger the coupling degree between the conductor pieces 3, the wider the pass band B1. However, when a general electronic circuit board, LTCC (Low Temperature Co-fired Ceramics) board or the like is used for the dielectric substrate 1, the minimum value of the horizontal gap G is limited to about 0.05 mm due to manufacturing restrictions. The limit of the horizontal gap G has been the limit of the conventional passband.

しかし、本実施形態では図4に示すように、誘電体基板1の面方向からみた場合の導体片3の配置が、誘電体基板1の厚み方向に垂直ギャップD間隔で交互にずれながら面方向に並設されており、この構成によって、隣り合う導体片3間の電磁結合をより強力にしている。   However, in the present embodiment, as shown in FIG. 4, the arrangement of the conductor pieces 3 when viewed from the surface direction of the dielectric substrate 1 is alternately shifted in the thickness direction of the dielectric substrate 1 by the vertical gap D interval. In this configuration, the electromagnetic coupling between the adjacent conductor pieces 3 is made stronger.

具体的には、図5(a)(b)に示すように、導体片3間の水平ギャップGは「正」の値だけでなく、「0」や「負」の値にまで狭めることも可能である。導体片3間の水平ギャップGが負方向に設定されて、誘電体基板1の厚み方向からみて隣り合う導体片3が互いに重なり合えば、この重なり領域が大きいほど電磁結合がより強力になって、通過帯域B1をより広帯域とすることができる。図6は、水平ギャップGを「0」から「負」の値にまで変化させたときの本実施形態のバンドパスフィルタの通過特性Y1を示しており、水平ギャップGが負方向へ変化して誘電体基板1の厚み方向からみて隣り合う導体片3が互いに重なり合う領域が大きいほど結合度が大きくなり、通過帯域B1がB1a〜B1bまで広がって、より広帯域となる。なお、従来のバンドパスフィルタが導体片3間の水平ギャップGを狭めることで得られる通過特性Y11も図6中に示しているが、本実施形態の通過特性Y1に比べて狭帯域となっている。   Specifically, as shown in FIGS. 5A and 5B, the horizontal gap G between the conductor pieces 3 may be narrowed not only to a “positive” value but also to a “0” or “negative” value. Is possible. If the horizontal gap G between the conductor pieces 3 is set in the negative direction and the adjacent conductor pieces 3 overlap each other when viewed from the thickness direction of the dielectric substrate 1, the larger this overlapping region, the stronger the electromagnetic coupling. The pass band B1 can be made wider. FIG. 6 shows the pass characteristic Y1 of the band-pass filter of the present embodiment when the horizontal gap G is changed from “0” to a “negative” value. The horizontal gap G changes in the negative direction. As the region where the adjacent conductor pieces 3 overlap each other as viewed from the thickness direction of the dielectric substrate 1 increases, the degree of coupling increases, and the passband B1 extends to B1a to B1b, resulting in a wider band. In addition, although the pass characteristic Y11 obtained by narrowing the horizontal gap G between the conductor pieces 3 by the conventional band pass filter is also shown in FIG. 6, it has a narrower band than the pass characteristic Y1 of this embodiment. Yes.

このように、本実施形態のフィルタでは、隣り合う導体片3間の水平ギャップGを、製造上の制約を受けることなく従来に比べて狭くでき、導体片3間の結合度をより強くして通過帯域の広帯域化を図っている。   Thus, in the filter of this embodiment, the horizontal gap G between the adjacent conductor pieces 3 can be made narrower than the conventional one without being restricted in manufacturing, and the degree of coupling between the conductor pieces 3 can be made stronger. The passband is widened.

(実施形態2)
実施形態1のフィルタでは、隣り合う導体片3間の水平ギャップGが負方向に設定されて、誘電体基板1の厚み方向からみて隣り合う導体片3が互いに重なり合う領域が大きいほど通過帯域B1が広くなる。しかし、隣り合う導体片3が互いに重なり合う領域を大きくしていくと、ある時点で導体片3の端部の接地用スルーホール6が、隣接する導体片3の端部と干渉するという課題が発生する。
(Embodiment 2)
In the filter of the first embodiment, the horizontal gap G between the adjacent conductor pieces 3 is set in the negative direction, and the pass band B1 becomes larger as the region where the adjacent conductor pieces 3 overlap each other when viewed from the thickness direction of the dielectric substrate 1 is larger. Become wider. However, when the area where the adjacent conductor pieces 3 overlap each other is enlarged, there is a problem that the grounding through hole 6 at the end of the conductor piece 3 interferes with the end of the adjacent conductor piece 3 at a certain time. To do.

例えば、図7(a)(b)に示すように、隣り合う導体片3間の水平ギャップGが大きく、導体片3の重なり領域が小さい場合には、導体片3の端部の接地用スルーホール6が、隣接する導体片3の端部に干渉する虞はない。しかし、図8(a)(b)に示すように、隣り合う導体片3間の水平ギャップGを狭めていって導体片3の重なり領域が大きくなると、導体片3の端部の接地用スルーホール6が、隣接する導体片3の端部に干渉してしまう。   For example, as shown in FIGS. 7A and 7B, when the horizontal gap G between the adjacent conductor pieces 3 is large and the overlapping area of the conductor pieces 3 is small, the grounding through at the end of the conductor piece 3 is used. There is no possibility that the hole 6 interferes with the end portion of the adjacent conductor piece 3. However, as shown in FIGS. 8A and 8B, when the horizontal gap G between the adjacent conductor pieces 3 is narrowed and the overlapping area of the conductor pieces 3 is increased, the grounding through at the end of the conductor piece 3 is increased. The hole 6 interferes with the end portion of the adjacent conductor piece 3.

そこで、本実施形態では、図9、図10に示すように、各導体片3は、当該導体片の接地用スルーホール6を形成した端部が、隣り合う導体片3の接地用スルーホール6を形成していない端部から離れるように、並設方向に対する直交方向(導体片3の長さ方向)へずらして配置されている。   Therefore, in this embodiment, as shown in FIGS. 9 and 10, each conductor piece 3 has an end portion where the grounding through hole 6 of the conductor piece is formed, and the grounding through hole 6 of the adjacent conductor piece 3. Are arranged to be shifted in the direction orthogonal to the juxtaposition direction (the length direction of the conductor pieces 3) so as to be away from the end where the conductors are not formed.

具体的には、導体片31,33,35は、面S2上で接地用スルーホール6を形成した一方の端部側にずれて配置され、導体片32,34,36は、面S1上で接地用スルーホール6を形成した他方の端部側にずれて配置されており、導体片31,33,35の接地用スルーホール6と導体片32,34,36の接地用スルーホール6とが互いに離れる方向へ、導体片31〜36がずれて配置されるのである。   Specifically, the conductor pieces 31, 33, and 35 are arranged so as to be shifted to one end side where the grounding through-hole 6 is formed on the surface S 2, and the conductor pieces 32, 34, and 36 are arranged on the surface S 1. The grounding through-hole 6 is arranged so as to be shifted to the other end side where the grounding through-hole 6 is formed, and the grounding through-hole 6 of the conductor pieces 31, 33, and 35 and the grounding through-hole 6 of the conductor pieces 32, 34, and 36 are arranged. The conductor pieces 31 to 36 are arranged so as to deviate from each other.

したがって、隣り合う導体片3が互いに重なり合う領域を大きくしていっても、導体片3の端部の接地用スルーホール6が、隣接する導体片3の端部と干渉することはなく、隣り合う導体片3間の電磁結合をさらに強力にして、通過帯域の大幅な広帯域化を図ることができる。   Therefore, even if the area where the adjacent conductor pieces 3 overlap each other is enlarged, the grounding through hole 6 at the end of the conductor piece 3 does not interfere with the end of the adjacent conductor piece 3 and is adjacent. The electromagnetic coupling between the conductor pieces 3 can be further strengthened, and the pass band can be greatly widened.

また本実施形態では、隣り合う導体片3が互いに重なり合う長さL’が、バンドパスフィルタの中心周波数f0を決定しており、この長さL’を1/4波長とする周波数がバンドパスフィルタの中心周波数f0となる。なお、導体片3の幅Wと水平ギャップGとが通過帯域B1を決定することは、実施形態1と同様である。   In the present embodiment, the length L ′ at which the adjacent conductor pieces 3 overlap each other determines the center frequency f0 of the bandpass filter, and the frequency at which the length L ′ is a quarter wavelength is the bandpass filter. Becomes the center frequency f0. Note that the width W of the conductor piece 3 and the horizontal gap G determine the passband B1 as in the first embodiment.

1 誘電体基板
2a,2b 接地導体
3(31〜36) 導体片
4 給電部
5 出力部
6 接地用スルーホール
DESCRIPTION OF SYMBOLS 1 Dielectric board 2a, 2b Grounding conductor 3 (31-36) Conductor piece 4 Feeding part 5 Output part 6 Grounding through hole

Claims (3)

厚み方向の両面に接地導体を備えた誘電体板と、
誘電体板内で接地導体に対して平行な方向に並設されて、互いに電磁結合によって結合した複数の導体片と、
複数の導体片のうち並設方向の一端の導体片に形成された給電部と、
複数の導体片のうち並設方向の他端の導体片に形成された出力部と、
各導体片の前記並設方向に対する直交方向の両端部のうち、並設方向に隣り合う導体片とは逆の端部に形成されて、各導体片を誘電体板の両面の接地導体に接続する接地結合部と
を備え、
誘電体板内で厚み方向の位置が互いに異なり且つ接地導体に対して平行な複数の面上に各導体片が配置され、各導体片が配置される面は、並設方向に隣り合う導体片が形成された面に対して厚み方向に隣接する面である
ことを特徴とするフィルタ。
A dielectric plate with ground conductors on both sides in the thickness direction;
A plurality of conductor pieces arranged in parallel in a dielectric plate in a direction parallel to the ground conductor and coupled to each other by electromagnetic coupling;
A power feeding portion formed on one end of the plurality of conductor pieces in the juxtaposed direction,
An output portion formed on the conductor piece at the other end in the juxtaposition direction among the plurality of conductor pieces;
Of the two ends of each conductor piece in the direction perpendicular to the parallel arrangement direction, it is formed at the end opposite to the conductor piece adjacent to the parallel arrangement direction, and each conductor piece is connected to the ground conductors on both sides of the dielectric plate And a ground joint
Each conductor piece is disposed on a plurality of surfaces that are different from each other in the thickness direction in the dielectric plate and parallel to the ground conductor, and the surface on which each conductor piece is disposed is an adjacent conductor piece in the juxtaposition direction. A filter that is adjacent to the surface on which the is formed in the thickness direction.
前記並設方向に隣り合う各導体片は、前記厚み方向からみて互いの一部が重なることを特徴とする請求項1記載のフィルタ。   2. The filter according to claim 1, wherein the conductor pieces adjacent to each other in the juxtaposed direction overlap each other as viewed from the thickness direction. 各導体片は、当該導体片の接地結合部を形成した端部が、前記並設方向に隣り合う導体片の前記接地結合部を形成していない端部から離れるように、各面上において前記並設方向に対する直交方向へずらして配置されることを特徴とする請求項1または2記載のフィルタ。   Each conductor piece has the end on which the ground coupling portion of the conductor piece is formed on each surface so that the end of the conductor piece adjacent to the parallel arrangement direction is away from the end on which the ground coupling portion is not formed. The filter according to claim 1 or 2, wherein the filter is arranged so as to be shifted in a direction orthogonal to the juxtaposed direction.
JP2009041525A 2009-02-24 2009-02-24 filter Expired - Fee Related JP5297227B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009041525A JP5297227B2 (en) 2009-02-24 2009-02-24 filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009041525A JP5297227B2 (en) 2009-02-24 2009-02-24 filter

Publications (2)

Publication Number Publication Date
JP2010199899A true JP2010199899A (en) 2010-09-09
JP5297227B2 JP5297227B2 (en) 2013-09-25

Family

ID=42824169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009041525A Expired - Fee Related JP5297227B2 (en) 2009-02-24 2009-02-24 filter

Country Status (1)

Country Link
JP (1) JP5297227B2 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254501A (en) * 1986-04-28 1987-11-06 Murata Mfg Co Ltd Strip line filter
JPH01307301A (en) * 1988-06-06 1989-12-12 Ngk Spark Plug Co Ltd Dielectric filter
JPH05110305A (en) * 1991-10-18 1993-04-30 Ngk Insulators Ltd Interdigital dielectric filter and its manufacture
JPH0870201A (en) * 1994-08-26 1996-03-12 Japan Radio Co Ltd Laminated dielectric filter
JP2000114807A (en) * 1998-09-30 2000-04-21 Murata Mfg Co Ltd Filter device, duplexer and communication equipment device
JP2002335108A (en) * 2002-03-22 2002-11-22 Mitsubishi Electric Corp Method of designing impedance transformer
JP2006166136A (en) * 2004-12-08 2006-06-22 Koa Corp Laminated band-pass filter

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254501A (en) * 1986-04-28 1987-11-06 Murata Mfg Co Ltd Strip line filter
JPH01307301A (en) * 1988-06-06 1989-12-12 Ngk Spark Plug Co Ltd Dielectric filter
JPH05110305A (en) * 1991-10-18 1993-04-30 Ngk Insulators Ltd Interdigital dielectric filter and its manufacture
JPH0870201A (en) * 1994-08-26 1996-03-12 Japan Radio Co Ltd Laminated dielectric filter
JP2000114807A (en) * 1998-09-30 2000-04-21 Murata Mfg Co Ltd Filter device, duplexer and communication equipment device
JP2002335108A (en) * 2002-03-22 2002-11-22 Mitsubishi Electric Corp Method of designing impedance transformer
JP2006166136A (en) * 2004-12-08 2006-06-22 Koa Corp Laminated band-pass filter

Also Published As

Publication number Publication date
JP5297227B2 (en) 2013-09-25

Similar Documents

Publication Publication Date Title
US10622693B2 (en) Filter unit and filter
JP2019017084A (en) Dielectric waveguide filter with direct coupling and alternative cross-coupling
JP6787955B2 (en) filter
US9660315B2 (en) Ground structures between resonators for distributed electromagnetic wave filters
KR100892024B1 (en) Bandpass filter
JP4598024B2 (en) Band stop filter
JP5094524B2 (en) High frequency coupled line and high frequency filter
JP5297227B2 (en) filter
CN109378561B (en) Double-passband filter
JP4411315B2 (en) Band stop filter
US9859598B2 (en) Electronic circuit
JP6287904B2 (en) Dielectric waveguide resonator, dielectric waveguide input / output structure, and dielectric waveguide filter
TWI648950B (en) Differential filter microstrip line structure capable of suppressing common mode signals
JP6946156B2 (en) Trap filter
US20110267156A1 (en) Stripline Filter
JP7464547B2 (en) Thin film circuit board
JP4629617B2 (en) High frequency coupled line and high frequency filter
US8130062B2 (en) Microstripline filter
KR20220062994A (en) Bandpass filter
JP2007180781A (en) Resonance circuit, filter circuit and multilayer substrate
JP5665523B2 (en) High frequency absorption circuit, multistage high frequency absorption circuit
JP2004104588A (en) Bandpass filter
US20100090782A1 (en) Strip line filter
JP2024018253A (en) Laminated band-pass filter
US9484609B2 (en) Microwave coupling structure for suppressing common mode signals while passing differential mode signals between a pair of coplanar waveguide (CPW) transmission lines

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100715

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110915

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20120113

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120828

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120911

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121112

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130108

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130408

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20130416

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130521

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130614

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees