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JP2010198927A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
JP2010198927A
JP2010198927A JP2009042861A JP2009042861A JP2010198927A JP 2010198927 A JP2010198927 A JP 2010198927A JP 2009042861 A JP2009042861 A JP 2009042861A JP 2009042861 A JP2009042861 A JP 2009042861A JP 2010198927 A JP2010198927 A JP 2010198927A
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Japan
Prior art keywords
led lamp
peripheral surface
support
tube
holding
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Pending
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JP2009042861A
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Japanese (ja)
Inventor
Toyosaku Shiobara
豊作 塩原
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SSEC KK
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SSEC KK
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Priority to JP2009042861A priority Critical patent/JP2010198927A/en
Publication of JP2010198927A publication Critical patent/JP2010198927A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a LED lamp that facilitates assembling. <P>SOLUTION: A dissipation support 2 is held to the backside within a tube 1 by a holding means, a holding protrusion 11, which is a holding means, projects from a backside inner peripheral surface of the tube 1, the holding protrusion 11 engages with a holding groove 22, which is a holding means formed on the dissipation support 2, the dissipation support 2 is provided with a support groove 21 for supporting the insertion of a substrate 3 where a plurality of LEDs 4 are disposed in a longitudinal direction thereof, and an opening 21a of the support groove 21 is provided to face the irradiation direction of the LED 4. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、事務所、一般住宅、店舗、学校、冷凍庫、看板などに用いられるＬＥＤランプ（発光ダイオード照明灯）に関するものである。   The present invention relates to an LED lamp (light-emitting diode illuminating lamp) used in offices, ordinary houses, stores, schools, freezers, signboards, and the like.

最近は、白熱電球による照明灯に代えて弾丸型や表面実装型などのＬＥＤ（発光ダイオード）を組み込んでいるＬＥＤランプが使用されている例が多い。これは、このＬＥＤランプは白熱照明灯と比較して長寿命であってかつ消費電力が少ないからである。
ＬＥＤランプは、ＬＥＤ単独では発光量が小さいために、複数のＬＥＤを直線状に単一列又は複数列に配置した状態で用いられている（特開２００１−３５１４０２号公報及び特開２００４−３３５４２６号公報など）。
しかしながら、例えば特開２００４−３３５４２６号公報に記載の蛍光灯兌換型発光ダイオード灯において、棒状合成樹脂外管体内の温度は複数の白色発光ダイオードから発生する熱によって上昇し、温度上昇が白色発光ダイオードの劣化を招く課題がある。
このような温度上昇によるＬＥＤランプの短命化の課題を解決するために、放熱板を有するＬＥＤランプが提案されている（特開２００８−７７９４８号公報及び実用新案登録第３１４５１７４号公報）。
特開２００８−７７９４８号公報に記載の照明灯用灯具（以下「従来例１」という。）は、当該公報の図２に示すように発光体である発光ダイオード３から生じる熱を除く放熱板を兼用している反射板６を備えている。反射板６は略Ｗ字状に形成され、中央山型状の２個の傾斜面６１に、発光ダイオード３を配置した基板５がねじなどの固定手段Ｋによって取り付けられている。
実用新案登録第３１４５１７４号公報に記載の合成樹脂製蛍光灯用ランプシェード（以下「従来例２」という。）は、当該公報の図３に示すようにパイプ状ランプシェード１に設けた切れ込み溝には、ＬＥＤランプ４をセットした基盤３をその下部に取り付けたアルミニウム製放熱板２を嵌合させてあり、この放熱板によってＬＥＤランプ４からの熱を逃がすものである。 Recently, in many cases, LED lamps incorporating bullet-type or surface-mount type LEDs (light-emitting diodes) are used instead of incandescent lamps. This is because this LED lamp has a longer life and consumes less power than an incandescent lamp.
LED lamps are used in a state where a plurality of LEDs are linearly arranged in a single row or a plurality of rows because the amount of light emitted by the LED alone is small (Japanese Patent Laid-Open Nos. 2001-351402 and 2004-335426). Gazette).
However, in the fluorescent lamp-converting light-emitting diode lamp described in, for example, Japanese Patent Application Laid-Open No. 2004-335426, the temperature inside the rod-shaped synthetic resin outer tube rises due to heat generated from a plurality of white light-emitting diodes, and the temperature rise is white light-emitting diodes There is a problem that causes deterioration.
In order to solve the problem of shortening the life of the LED lamp due to such a temperature rise, an LED lamp having a heat sink has been proposed (Japanese Patent Laid-Open No. 2008-77948 and Utility Model Registration No. 3145174).
An illumination lamp device described in Japanese Patent Application Laid-Open No. 2008-77948 (hereinafter referred to as “conventional example 1”) has a heat radiating plate for removing heat generated from the light emitting diode 3 as a light emitter as shown in FIG. A reflector 6 is also provided. The reflecting plate 6 is formed in a substantially W shape, and a substrate 5 on which the light emitting diode 3 is arranged is attached to two central mountain-shaped inclined surfaces 61 by fixing means K such as screws.
A synthetic resin fluorescent lamp lamp shade (hereinafter referred to as “conventional example 2”) described in Japanese Utility Model Registration No. 3145174 is formed in a cut groove provided in a pipe-shaped lamp shade 1 as shown in FIG. Is fitted with an aluminum heat dissipating plate 2 to which a base 3 on which an LED lamp 4 is set is attached, and heat from the LED lamp 4 is released by the heat dissipating plate.

特開２００１−３５１４０２公報JP 2001-351402 A 特開２００４−３３５４２６号公報JP 2004-335426 A 特開２００８−７７９４８号公報JP 2008-77948 A 実用新案登録第３１４５１７４号公報Utility Model Registration No. 3145174

従来例１及び従来例２のいずれも、ＬＥＤから発生される熱を除く（逃す）機能を果たすことができる利点があるものの、従来例１では反射板６と発光ダイオード３を配置した基板５との組み立てが面倒であり、従来例２についても放熱板２とＬＥＤランプ４をセットした基盤３との関係において従来例１と同様の課題がある。
この発明の目的は、組み立てが容易となるＬＥＤランプを提供することにある。 Although both Conventional Example 1 and Conventional Example 2 have the advantage of being able to fulfill the function of removing (dissipating) the heat generated from the LEDs, in Conventional Example 1, the substrate 5 on which the reflector 6 and the light emitting diode 3 are arranged, The conventional example 2 has the same problems as the conventional example 1 in relation to the heat sink 2 and the substrate 3 on which the LED lamp 4 is set.
An object of the present invention is to provide an LED lamp that can be easily assembled.

この発明に係る第１のＬＥＤランプは、管体と、この管体内の背部側に配置されかつ保持手段によって係合保持されている放熱支持体と、この放熱支持体に支持されていると共に光源であるＬＥＤを複数配置してある基板とを備えている。上記基板は、上記放熱支持体に形成している支持溝内に挿入支持されている。上記ＬＥＤは、上記管体の上記背部側とは反対側である照射側に向けて照射可能である。上記保持手段として、例えば上記管体内周面から内方に向けて突出してある保持突部と、放熱支持体に設けてある保持溝とから構成されており、上記保持突部と保持溝とは互いに上記管体の長さ方向に移動可能に係合されているものである。
この発明に係る第２のＬＥＤランプは、管体と、この管体内の背部側に配置されかつ保持手段によって挿入保持されている放熱支持体及び光源であるＬＥＤを複数配置してある基板とを備えている。上記保持手段は、上記管体の内周面から内方に向けて互いに対向するように突出している板状の保持突部からなり、両保持突部が上記管体の長さ方向に沿って全長に亘って形成されており、上記両保持突部の先端部間に間隙が形成されており、上記両保持突部と上記管体の背部側の内周面との間に収納室が形成されている。上記収納室内には、上記背部側に放熱支持体が、上記間隙側に基板がそれぞれ移動可能にかつ重ねられた状態で挿入配置されていると共に、上記放熱支持体及び上記基板が上記管体の内周面と上記両保持突部とによって挟まれた状態で保持されている。上記放熱支持体は、管体の背部側の外周面が凸状の円弧面を形成していると共に、円筒形の管体の内周面に密着されている。上記ＬＥＤは、上記管体の上記背部側とは反対側である照射側に向けて照射可能である。 A first LED lamp according to the present invention includes a tube, a heat dissipating support disposed on the back side of the tube and engaged and held by holding means, and supported by the heat dissipating support and a light source. And a substrate on which a plurality of LEDs are arranged. The substrate is inserted and supported in a support groove formed in the heat dissipation support. The LED can irradiate toward an irradiation side opposite to the back side of the tube. The holding means includes, for example, a holding projection that protrudes inward from the inner peripheral surface of the tubular body, and a holding groove that is provided in the heat dissipation support, and the holding projection and the holding groove are They are engaged with each other so as to be movable in the longitudinal direction of the tubular body.
A second LED lamp according to the present invention includes a tube, and a substrate on which a plurality of LEDs that are light sources and light sources that are disposed on the back side of the tube and inserted and held by holding means are disposed. I have. The holding means is composed of plate-like holding protrusions that protrude inward from the inner peripheral surface of the tubular body, and both holding protrusions extend along the length direction of the tubular body. It is formed over the entire length, a gap is formed between the tip ends of the both holding projections, and a storage chamber is formed between the both holding projections and the inner peripheral surface on the back side of the tubular body Has been. In the storage chamber, a heat dissipation support is inserted on the back side, and a substrate is inserted and disposed in a state where the substrate is movable and stacked on the gap side. It is held in a state of being sandwiched between the inner peripheral surface and the both holding projections. In the heat dissipation support, the outer peripheral surface on the back side of the tubular body forms a convex arc surface, and is in close contact with the inner peripheral surface of the cylindrical tubular body. The LED can irradiate toward an irradiation side opposite to the back side of the tube.

この発明のＬＥＤランプによれば、管体内の放熱支持体を保持手段によって係合保持し、上記放熱支持体の支持溝を通じてＬＥＤを取り付けている基板を挿入支持するものであるから組み立てが容易となり、簡単な構成によって上記基板からの熱を放熱支持体を通じて除くことができ、上記収納室が上記管体の背部側に設けられているので、管体の表面にＬＥＤの影がドット状に表れにくくなる。
この発明のＬＥＤランプによれば、管体内の放熱支持体及び基板を保持手段によって挿入保持するものであるから組み立てが容易となり、簡単な構成によって上記基板からの熱を放熱支持体を通じて除くことができ、上記収納室が上記管体の背部側に設けられているので、管体の表面にＬＥＤの影がドット状に表れにくくなる。 According to the LED lamp of the present invention, the heat radiation support body in the tube is engaged and held by the holding means, and the board on which the LED is mounted is inserted and supported through the support groove of the heat radiation support body, so that the assembly becomes easy. The heat from the substrate can be removed through the heat dissipation support with a simple configuration, and the housing chamber is provided on the back side of the tube, so that LED shadows appear on the surface of the tube in the form of dots. It becomes difficult.
According to the LED lamp of the present invention, since the heat dissipation support and the substrate in the tube are inserted and held by the holding means, the assembly becomes easy, and heat from the substrate can be removed through the heat dissipation support with a simple configuration. In addition, since the storage chamber is provided on the back side of the tubular body, LED shadows do not easily appear in the form of dots on the surface of the tubular body.

この発明に係るＬＥＤランプの第１の実施形態の側面側の主要部を拡大して示す断面図である。It is sectional drawing which expands and shows the principal part by the side of the 1st Embodiment of the LED lamp which concerns on this invention. この発明に係るＬＥＤランプを示す側面図である。It is a side view which shows the LED lamp which concerns on this invention. 図２のＩＩＩ−ＩＩＩ線断面図である。It is the III-III sectional view taken on the line of FIG. この発明に係るＬＥＤランプに用いる管体の保持突部から放熱支持体を分離している状態を示す拡大側面図である。It is an enlarged side view which shows the state which has isolate | separated the thermal radiation support body from the holding | maintenance protrusion part of the tubular body used for the LED lamp which concerns on this invention. この発明に係るＬＥＤランプの主要部を構成している管体、放熱支持体及び基板並びにこれらに設けてある放熱性膜をそれぞれ示す拡大平面図である。FIG. 2 is an enlarged plan view showing a tube body, a heat radiation support body, a substrate, and a heat radiation film provided on them, constituting the main part of the LED lamp according to the present invention. この発明に係るＬＥＤランプに用いる管体を示す一部切欠正面図である。It is a partially cutaway front view which shows the tubular body used for the LED lamp which concerns on this invention. この発明に係るＬＥＤランプに用いる管体を示す側面図である。It is a side view which shows the tubular body used for the LED lamp which concerns on this invention. 図７のＶＩＩＩ−ＶＩＩＩ線断面図である。It is the VIII-VIII sectional view taken on the line of FIG. この発明に係るＬＥＤランプに用いる放熱支持体を拡大して示す斜視図である。It is a perspective view which expands and shows the thermal radiation support body used for the LED lamp which concerns on this invention. 図９のＸ−Ｘ線断面図である。FIG. 10 is a sectional view taken along line XX in FIG. 9. この発明に係るＬＥＤランプに用いるＬＥＤ付きの基板を保持している放熱支持体を示す底面図である。It is a bottom view which shows the thermal radiation support body holding the board | substrate with LED used for the LED lamp which concerns on this invention. この発明に係るＬＥＤランプに用いる口金を示す拡大正面図である。It is an enlarged front view which shows the nozzle | cap | die used for the LED lamp which concerns on this invention. この発明に係るＬＥＤランプの端部側を拡大して示す一部切欠拡大正面図である。It is a partially notched enlarged front view which expands and shows the edge part side of the LED lamp which concerns on this invention. この発明に係るＬＥＤランプの第２の実施形態を示す一部切欠正面図である。It is a partially notched front view which shows 2nd Embodiment of the LED lamp which concerns on this invention. 図１４のＸＶ−ＸＶ線拡大断面図である。It is the XV-XV line expanded sectional view of FIG. この発明に係るＬＥＤランプの主要部を示す一部切欠平面図である。It is a partially notched top view which shows the principal part of the LED lamp which concerns on this invention. この発明に係るＬＥＤランプの主要部を示す拡大側面図である。It is an enlarged side view which shows the principal part of the LED lamp which concerns on this invention. 図１７のＸＶＩＩＩ−ＸＶＩＩＩ線断面図である。It is the XVIII-XVIII sectional view taken on the line of FIG. この発明に係るＬＥＤランプに用いる管体を示す側面図である。It is a side view which shows the tubular body used for the LED lamp which concerns on this invention. 図１９のＸＸ−ＸＸ線断面図である。It is the XX-XX sectional view taken on the line of FIG. 図１９のＸＸＩ−ＸＸＩ線断面図である。It is the XXI-XXI sectional view taken on the line of FIG. この発明に係るＬＥＤランプに用いる放熱支持体を拡大して示す斜視図である。It is a perspective view which expands and shows the thermal radiation support body used for the LED lamp which concerns on this invention. 図２２のＸＸＩＩＩ−ＸＸＩＩＩ線断面図である。It is XXIII-XXIII sectional view taken on the line of FIG. この発明に係るＬＥＤランプの第３の実施形態を示す主要部の拡大側面図である。It is an enlarged side view of the principal part which shows 3rd Embodiment of the LED lamp which concerns on this invention. この発明に係るＬＥＤランプの第４の実施形態を示す主要部の拡大側面図である。It is an enlarged side view of the principal part which shows 4th Embodiment of the LED lamp which concerns on this invention. 図２５に示すＬＥＤランプから放熱支持体を外した状態を示す拡大側面図である。It is an enlarged side view which shows the state which removed the heat dissipation support body from the LED lamp shown in FIG. この発明に係るＬＥＤランプに用いる放熱支持体を拡大して示す斜視図である。It is a perspective view which expands and shows the thermal radiation support body used for the LED lamp which concerns on this invention. この発明に係るＬＥＤランプの第５の実施形態を示す一部切欠正面図である。It is a partially notched front view which shows 5th Embodiment of the LED lamp which concerns on this invention. 図２８のＸＸＩＸ−ＸＸＩＸ線拡大断面図である。FIG. 29 is an enlarged sectional view taken along line XXIX-XXIX in FIG. 28. この発明に係るＬＥＤランプに用いるＬＥＤ付きの基板を示す底面図である。It is a bottom view which shows the board | substrate with LED used for the LED lamp which concerns on this invention.

この発明に係るＬＥＤランプの第１の実施形態について図１〜図１３を参照して説明する。
図１〜図５において、ＬＥＤランプＬは、細長い円筒形パイプからなる管体１と、この管体の背部側である底部側（図１上側）の内部に配置し、管体に保持手段によって係合保持されている放熱支持体２と、この放熱支持体の支持溝２１内に挿入かつ離脱可能に支持されている基板３と、この基板に実装してある光源であるＬＥＤ（発光ダイオード）４と、上記管体の両端部に取り付けてある口金５とを備えている。ＬＥＤランプＬのＬＥＤ４は、管体１の背部側とは反対側（図１下側）に向けて光を照射可能である。 1st Embodiment of the LED lamp which concerns on this invention is described with reference to FIGS.
1 to 5, the LED lamp L is arranged inside a tube body 1 made of an elongated cylindrical pipe and a bottom side (upper side in FIG. 1) which is the back side of the tube body, and the tube body is held by holding means. The heat dissipation support 2 engaged and held, the substrate 3 supported so as to be inserted into and removed from the support groove 21 of the heat dissipation support, and an LED (light emitting diode) as a light source mounted on the substrate 4 and a base 5 attached to both ends of the tubular body. The LED 4 of the LED lamp L can irradiate light toward the side opposite to the back side of the tube 1 (the lower side in FIG. 1).

図６〜図８に示す管体１はプラスチック製パイプ又はガラス製パイプからなり、本例では蛍光塗料、拡散材及び変色防止材が配合されている乳白色のプラスチック製パイプが使用されている。
管体１は、背部側（図７上側）の内周面１ａから管体の中心部に向けて突出されている保持手段（図７に示す例では保持突部１１）を設けてある。保持突部１１は管体１の長さ方向に沿って延伸され、かつ管体の全長に亘って設けられている。
保持突部１１は、図７に示すように断面逆Ｔ字形に形成され、先端部が両側に張り出されている係止部１１ａとなっている。
図１及び図５において、管体１は、背部側（図１上側）の外周面に所定の設置幅Ｗを有する帯状の放熱性膜１２を形成してある。放熱性膜１２は、管体１の長さ方向に沿って管体の一端から他端まで全長に亘って設けられている。放熱性膜１２は例えばセラミックコート膜であり、管体１内の熱を吸収して管体外へ逃すことによって管体内の熱を下げる役割を果たしている。図５では、放熱性膜１２が点描で図示されている。
管体１は、例えばパイプ押出し機を用いて押出成形法により加工され、その管本体と保持突部１１とが一体成形されている。 The pipe body 1 shown in FIGS. 6 to 8 is made of a plastic pipe or a glass pipe. In this example, a milky white plastic pipe containing a fluorescent paint, a diffusing material and a discoloration preventing material is used.
The tube 1 is provided with holding means (holding protrusion 11 in the example shown in FIG. 7) that protrudes from the inner peripheral surface 1a on the back side (upper side in FIG. 7) toward the center of the tube. The holding protrusion 11 extends along the length direction of the tube 1 and is provided over the entire length of the tube.
As shown in FIG. 7, the holding projection 11 is formed in an inverted T-shaped cross section, and is a locking portion 11 a with a tip portion projecting on both sides.
1 and 5, the tubular body 1 is formed with a strip-like heat-dissipating film 12 having a predetermined installation width W on the outer peripheral surface on the back side (upper side in FIG. 1). The heat dissipation film 12 is provided over the entire length from one end of the tube body to the other end along the length direction of the tube body 1. The heat dissipating film 12 is, for example, a ceramic coat film, and plays the role of lowering the heat in the pipe body by absorbing the heat in the pipe body 1 and letting it out of the pipe body. In FIG. 5, the heat dissipation film 12 is illustrated by pointillism.
The tube 1 is processed by an extrusion method using, for example, a pipe extruder, and the tube main body and the holding projection 11 are integrally formed.

図９〜図１１に示す放熱支持体２は、その本体２ａが放熱部材であるアルミニウム材を用いた棒状体で構成され、ヒートシンクの機能を果たしているものである。
放熱支持体２（本体２ａ）には、その背部側（図９上側）とは反対側（下側）にその長さ方向に全長に亘って支持溝２１を、そして背部側の中央部に保持溝２２を、また当該保持溝を挟んで放熱溝２３，２４を全長に亘ってそれぞれ形成してある。
支持溝２１の開口２１ａは下側である照射側（ＬＥＤ４の光の照射方向側）に向けられており、開口の両側縁部に受け部２５を設けてある。
保持溝２２は、図１及び図４に示すように、保持突部１１と共に保持手段を構成している。保持溝２２は断面逆Ｔ字形に形成されている。保持溝２２の内底部側には幅方向に張り出した係合部２２ａが形成されている。
放熱支持体２の上側の外周面の外形は凸状の円弧面を形成している。放熱支持体２の外周面は、管体１の内周面１ａに密着可能である（図１）。
また、放熱支持体２の外周面には、図１及び図５に示すように例えばセラミックコート膜などからなる放熱性膜２６を塗布してある。放熱性膜２６は、放熱支持体２の外周面全面を被覆している。図５では、放熱性膜２６が点描で図示されている。
図１〜図４に示す放熱支持体２は、支持溝２１内においてＬＥＤ４を実装したＬＥＤ付きの基板３を挿入支持可能である。
放熱支持体２は押出し機を用いて押出成形法により加工される。 The heat radiating support 2 shown in FIGS. 9 to 11 has a main body 2a made of a rod-like body using an aluminum material as a heat radiating member, and serves as a heat sink.
The heat dissipating support 2 (main body 2a) has a support groove 21 extending in the length direction on the opposite side (lower side) to the back side (upper side in FIG. 9), and held in the center on the back side. The heat release grooves 23 and 24 are formed over the entire length of the groove 22 and the holding groove.
The opening 21a of the support groove 21 is directed to the lower irradiation side (the light irradiation direction side of the LED 4), and receiving portions 25 are provided at both side edges of the opening.
As shown in FIGS. 1 and 4, the holding groove 22 constitutes holding means together with the holding protrusion 11. The holding groove 22 has an inverted T-shaped cross section. On the inner bottom side of the holding groove 22, an engaging portion 22 a that protrudes in the width direction is formed.
The outer shape of the upper outer peripheral surface of the heat dissipation support 2 forms a convex arc surface. The outer peripheral surface of the heat dissipation support 2 can be in close contact with the inner peripheral surface 1a of the tube 1 (FIG. 1).
Further, a heat dissipating film 26 made of, for example, a ceramic coat film is applied to the outer peripheral surface of the heat dissipating support 2 as shown in FIGS. The heat dissipation film 26 covers the entire outer peripheral surface of the heat dissipation support 2. In FIG. 5, the heat dissipating film 26 is illustrated by dot drawing.
The heat dissipation support 2 shown in FIGS. 1 to 4 can insert and support the substrate 3 with LED in which the LED 4 is mounted in the support groove 21.
The heat radiation support 2 is processed by an extrusion method using an extruder.

図１〜図５及び図１１に示すように、ＬＥＤ付きの基板３はその本体が細長い板体からなり、組み立て時に放熱支持体２の支持溝２１内に嵌め込まれる。基板３には、ＬＥＤ４に電気的に接続している制御部（図示せず。）を設けてある。基板３の一側面（図１下面）には単一又は複数列のＬＥＤ４を直線状に間隔を置いて配置し、一端部に保護回路ダイオード６を取り付けてある。図３及び図１１に示す例では、基板３には、複数の白色発光のＬＥＤ４がその長さ方向に沿って等間隔を置いて一直線状に配列され、そして基板の一側片面である表面（図１下面）全面に白色の印刷又は白色シート（図示せず。）の貼付をすることによって、内部反射光の取り出し効率を上げるようにしている。また基板３の裏面（図１上面）の全面には、例えばセラミックコート膜などからなる放熱性膜３１（図１及び図５）を塗布してある。図５では、放熱性膜３１が点描で図示されている。   As shown in FIG. 1 to FIG. 5 and FIG. 11, the substrate 3 with LED has a main body made of an elongated plate, and is fitted into the support groove 21 of the heat dissipation support 2 during assembly. The substrate 3 is provided with a control unit (not shown) that is electrically connected to the LEDs 4. Single or multiple rows of LEDs 4 are linearly arranged on one side surface (lower surface in FIG. 1) of the substrate 3, and a protection circuit diode 6 is attached to one end. In the example shown in FIGS. 3 and 11, a plurality of white light emitting LEDs 4 are arranged in a straight line at equal intervals along the length direction of the substrate 3, and a surface (one side surface of the substrate) ( The efficiency of taking out internally reflected light is increased by applying white printing or white sheet (not shown) on the entire lower surface of FIG. Further, a heat dissipating film 31 (FIGS. 1 and 5) made of, for example, a ceramic coat film is applied to the entire back surface (upper surface in FIG. 1) of the substrate 3. In FIG. 5, the heat dissipation film 31 is illustrated by pointillism.

管体１、放熱支持体２及び基板３の相互の関係について、図１〜図５を参照して説明する。
まず、管体１と放熱支持体２との関係について説明する。
放熱支持体２は管体１内の背部側で係合保持されている。すなわち、管体１内において、管体の保持突部１１が放熱支持体２の保持溝２２内に嵌め込まれ、係止部１１ａ及び係合部２２ａが互いに係合された状態で、管体の長さ方向に移動可能に保持されている。この保持状態において、放熱支持体２の上側の外周面は管体１の内周面１ａに密着されて、放熱支持体の安定的な位置保持が保たれている。
図１及び図３に示す放熱支持体２を管体１に保持するためには、保持突部１１をこの放熱支持体の保持溝２２内に、その一側方（図３左方又は右方）の開口から差し入れてから、他側方に向けてスライドさせる。放熱支持体２は管体１に対してスライド操作を通じて取付け又は取外しが自在である。
ついで、放熱支持体２と基板３との関係について説明する。
ＬＥＤ付きの基板３が放熱支持体２の支持溝２１内に収納されている。すなわち、図１に示すように基板３の本体両側が受け部２５上に載せられた状態で支持され、基板の上面が支持溝２１の内底面に接している。また各ＬＥＤ４はその下部が開口２１ａより下方に露出されているため、光を下方に照射可能である。
図１及び図３に示すＬＥＤ付きの基板３を放熱支持体２に支持するためには、この基板を支持溝２１の一側方（図３左方又は右方）の開口から支持溝内に差し入れてから、他側方に向けてスライドさせる。基板３は、放熱支持体２に対してスライド操作を通じて取付け又は取外しが自在である。
基板３は管体１に対して放熱支持体２を介して取り付けられている。 The mutual relationship among the tube 1, the heat dissipation support 2 and the substrate 3 will be described with reference to FIGS. 1 to 5.
First, the relationship between the tube 1 and the heat dissipation support 2 will be described.
The heat dissipation support 2 is engaged and held on the back side in the tube 1. That is, in the tubular body 1, the tubular body holding projection 11 is fitted into the retaining groove 22 of the heat dissipation support 2, and the engaging portion 11 a and the engaging portion 22 a are engaged with each other, It is held movable in the length direction. In this holding state, the outer peripheral surface on the upper side of the heat radiating support 2 is brought into close contact with the inner peripheral surface 1a of the tube body 1, and the stable position holding of the heat radiating support is maintained.
In order to hold the heat radiating support 2 shown in FIGS. 1 and 3 to the tube 1, the holding protrusion 11 is placed in the holding groove 22 of the heat radiating support at one side (left or right in FIG. 3). ) And then slide it to the other side. The heat radiation support 2 can be attached to or detached from the tube 1 through a sliding operation.
Next, the relationship between the heat dissipation support 2 and the substrate 3 will be described.
A substrate 3 with LEDs is accommodated in a support groove 21 of the heat dissipation support 2. That is, as shown in FIG. 1, both sides of the main body of the substrate 3 are supported while being placed on the receiving portion 25, and the upper surface of the substrate is in contact with the inner bottom surface of the support groove 21. Moreover, since each LED4 has the lower part exposed below the opening 21a, it can irradiate light downward.
In order to support the substrate 3 with LED shown in FIGS. 1 and 3 on the heat dissipation support 2, this substrate is inserted into the support groove from the opening on one side (left or right in FIG. 3) of the support groove 21. After inserting, slide toward the other side. The substrate 3 can be attached to or detached from the heat dissipation support 2 through a sliding operation.
The substrate 3 is attached to the tube 1 via a heat radiating support 2.

管体１の放熱性膜１２、放熱支持体２の放熱性膜２６及び基板３の放熱性膜３１の関係について説明する。
図１及び図５に示すように、放熱支持体２の外周面は管体１の内周面１ａに密着されており、外周面に設けてある放熱性膜２６は管体の放熱性膜１２と対向位置関係にある。放熱性膜２６の幅は、全長に亘って図１に示すように管体１を挟んで放熱性膜１２の設置幅Ｗに対応している。さらに、基板３の上面は放熱支持体２の支持溝２１の内底面に密着されており、上面に設けてある放熱性膜３１は管体の放熱性膜１２と対向位置関係にある。
このため、ＬＥＤ４から発生される熱の多くは、基板３に吸収されて放熱性膜２６を経て放熱支持体２に吸収される。そして、放熱性膜３１は管体１を挟んで放熱性膜１２に対向している状態にあるために、放熱支持体２からの放熱が放熱性膜３１から管体１を経て放熱性膜１２へ円滑に逃すことができる。 The relationship between the heat dissipation film 12 of the tube 1, the heat dissipation film 26 of the heat dissipation support 2, and the heat dissipation film 31 of the substrate 3 will be described.
As shown in FIGS. 1 and 5, the outer peripheral surface of the heat dissipation support 2 is in close contact with the inner peripheral surface 1 a of the tube 1, and the heat dissipating film 26 provided on the outer peripheral surface is the heat dissipating film 12 of the tube. And the opposite position relationship. The width of the heat dissipating film 26 corresponds to the installation width W of the heat dissipating film 12 across the entire length of the tube 1 as shown in FIG. Further, the upper surface of the substrate 3 is in close contact with the inner bottom surface of the support groove 21 of the heat radiating support 2, and the heat radiating film 31 provided on the upper surface is opposite to the heat radiating film 12 of the tubular body.
For this reason, most of the heat generated from the LED 4 is absorbed by the substrate 3 and absorbed by the heat dissipation support 2 via the heat dissipation film 26. Since the heat dissipating film 31 is in a state of facing the heat dissipating film 12 across the tube 1, the heat dissipating from the heat dissipating support 2 is transferred from the heat dissipating film 31 through the tube 1 to the heat dissipating film 12. You can escape smoothly.

管体１の両端側（図３左右両側）に配置してある口金５は、放熱部を設けてあり、図１２及び図１３に示す例では、その外周全周に複数の放熱溝５１を設けてある。管体１に吸収された熱は、この管体の端部に嵌め込まれている口金５に伝え、口金の放熱溝５１によって効果的に口金外に放熱される。口金の放熱溝５１の数は単一又は複数も設けられるが、放熱効果を高めるために複数設けるのが良い。
各口金５には端子ピン７をそれぞれ設けてある。各端子ピンは基板３に電気的に接続されている。 The caps 5 arranged on both ends (the left and right sides in FIG. 3) of the tube body 1 are provided with heat radiating portions. In the example shown in FIGS. 12 and 13, a plurality of heat radiating grooves 51 are provided on the entire outer periphery. It is. The heat absorbed by the tube body 1 is transmitted to the base 5 fitted in the end portion of the tube body, and is effectively radiated outside the base by the heat dissipation groove 51 of the base body. Although the number of the heat radiation grooves 51 of the base is single or plural, it is preferable to provide a plurality of heat radiation grooves 51 in order to enhance the heat radiation effect.
Each base 5 is provided with a terminal pin 7. Each terminal pin is electrically connected to the substrate 3.

上記構成のＬＥＤランプＬにおいて、ＬＥＤ４からの放射光は、その光軸を中心として円錐状（放射状）に広がり、管体１の背部側と反対側の照射面を照射する。この際、ＬＥＤ４を取り付けている基板３は、管体内の背部側に位置している放熱支持体２に支持されているために、ＬＥＤ４の放射角度が広がる。この結果、面発光としての効果が発揮され、管体１の一側の表面へのＬＥＤ４の影がドット状に表れにくくなり、この効果は管体１の色彩が乳白色であることによってより一層発揮されている。
ＬＥＤ４から発生される熱は、基板３から放熱支持体２に吸収され、吸収された熱は放熱支持体から管体１を経て外部に放出されてＬＥＤランプＬ内の高熱化が抑制される。管体１、放熱支持体２及び基板３のそれぞれの放熱性膜１２，２６，３１の存在によって高熱化の抑制がより一層効果的に行われる。このような高熱化抑制効果は、放熱溝５１を有する口金５の存在によってさらに高まる。 In the LED lamp L having the above configuration, the emitted light from the LED 4 spreads conically (radially) around the optical axis, and irradiates the irradiation surface opposite to the back side of the tube body 1. At this time, since the substrate 3 to which the LED 4 is attached is supported by the heat dissipation support 2 located on the back side in the tube, the radiation angle of the LED 4 is widened. As a result, the effect of surface light emission is exhibited, and the shadow of the LED 4 on the surface on one side of the tube 1 is less likely to appear in the form of dots, and this effect is further exhibited by the fact that the color of the tube 1 is milky white. Has been.
Heat generated from the LED 4 is absorbed from the substrate 3 to the heat radiating support 2, and the absorbed heat is released from the heat radiating support through the tube 1 to the outside, so that high heat in the LED lamp L is suppressed. Due to the presence of the heat dissipating films 12, 26, 31 of the tube 1, the heat dissipating support 2, and the substrate 3, it is possible to more effectively suppress the increase in heat. Such a high heat suppression effect is further enhanced by the presence of the base 5 having the heat radiation groove 51.

管体１は、その材質の一つであるプラスチックとして、例えばポリカーボネートなどが使用される。管体１は、押出し成形法により加工する場合には、図示の例では予め乳白色のポリカーボネートペレット、蛍光塗料ペレット、拡散材ペレット及び変色防止材のそれぞれの配分比率を所定の値に設定しておく。これらの材質の配合比率を適宜変更することによって、ＬＥＤランプＬから照射される光の拡散、透視度及び光源からの照射率量の調整が図られる。
管体１の長さ、内径及び肉厚、そして保持突部１１の突出長及び断面形状、またＬＥＤ付きの基板３の長さ及び横幅、さらに口金５の幅及び放熱溝５１の数はいずれも適宜である。 The tube 1 is made of, for example, polycarbonate as a plastic material. When the tube body 1 is processed by an extrusion molding method, in the illustrated example, the distribution ratios of milky white polycarbonate pellets, fluorescent paint pellets, diffusing material pellets, and discoloration preventing materials are set to predetermined values in advance. . By appropriately changing the blending ratio of these materials, the diffusion of light irradiated from the LED lamp L, the degree of transparency, and the amount of irradiation rate from the light source can be adjusted.
The length, inner diameter and thickness of the tube body 1, the protrusion length and cross-sectional shape of the holding protrusion 11, the length and width of the substrate 3 with LED, the width of the base 5 and the number of heat radiation grooves 51 are all. It is appropriate.

図示するＬＥＤランプＬによれば、ＬＥＤ４を取り付けている基板３を支持している放熱支持体２は管体１内の背部側（底部側）に配置されているので、光軸を中心として放射状に広がるＬＥＤの光の照射面までの距離が長くなり、この結果、放射エリアが広がり、管体の表面に各ＬＥＤ４の影がドット状に表れにくく、ＬＥＤランプの設置場所やその用途の範囲が広がり、換言すれば、ＬＥＤランプの利用範囲を広げることができる。
また、管体１はポリカーボネート、蛍光塗料、拡散材及び変色防止材を混合配分して乳白色のプラスチックパイプによって構成されているので、光の拡散、透視度及び光源であるＬＥＤ４からの照射率量を調整することができ、管体１の背部側に基板３をその内周面に接近して配置してあることと相俟って管体の表面に各ＬＥＤ４の影がドット状に表れにくくする効果がより良く発揮され、ＬＥＤランプＬを多方面の照明手段として利用することができる。
ＬＥＤランプＬの組み立て時に、管体１に対して放熱支持体２を保持突部１１及び保持溝２２を通じて挿脱可能に係合保持し、管体内に位置保持することができるから、ＬＥＤランプの組み立てや解体が容易である。放熱支持体２の外周面に保持溝２２の他に放熱溝２３，２４を設けているので、放熱支持体の放熱機能を高めることができる。放熱支持体２の外周面を円弧面として管体１の内周面１ａに密着可能とすることにより、放熱支持体の位置保持の安定化と熱を円滑かつ確実に管体側へ逃すことができる。
また、ＬＥＤ付きの基板３を放熱支持体２の支持溝２１内にスライド挿入するだけで、基板の取付け及びその位置保持をすることができるので、放熱支持体と基板３との組立作業が容易であると共に、放熱支持体に対して基板３の離脱が可能であるので解体も容易となる。
管体１の放熱性膜１２、放熱支持体２の放熱性膜２６及び基板３の放熱性膜３１は、図１に示すように、三層状態に配置されているので、上記各放熱性膜を介してＬＥＤ４からの熱を基板３から放熱支持体２へ、さらに放熱支持体から管体１及び口金５へと円滑にかつ確実に放熱されるので、効率的かつ効果的な放熱が可能となる。この効果は、上述したように口金５の放熱溝５１により高められる。
放熱支持体２の外周面に設けてある放熱溝２３，２４を放熱用の他に必要に応じて配線用のスペースとして利用することができる。 According to the LED lamp L shown in the figure, since the heat dissipation support 2 supporting the substrate 3 to which the LED 4 is attached is disposed on the back side (bottom side) in the tube 1, it is radial about the optical axis. As a result, the distance to the light irradiation surface of the LED that spreads out becomes longer, and as a result, the radiation area widens, and the shadow of each LED 4 hardly appears in the form of dots on the surface of the tube. Expanding, in other words, the range of use of the LED lamp can be expanded.
Moreover, since the tube 1 is composed of a milky white plastic pipe by mixing and distributing polycarbonate, a fluorescent paint, a diffusing material, and a discoloration preventing material, the diffusion of light, the degree of transparency, and the amount of irradiation from the LED 4 that is a light source are set. It is possible to adjust, and coupled with the fact that the substrate 3 is arranged close to the inner peripheral surface on the back side of the tube 1, the shadow of each LED 4 is less likely to appear in the form of dots on the surface of the tube. The effect is better exhibited, and the LED lamp L can be used as a multi-directional illumination means.
When the LED lamp L is assembled, the heat radiation support 2 can be detachably engaged with the tube body 1 through the holding projection 11 and the holding groove 22 and can be held in the tube body. Easy to assemble and dismantle. Since the heat radiating grooves 23 and 24 are provided on the outer peripheral surface of the heat radiating support 2 in addition to the holding groove 22, the heat radiating function of the heat radiating support can be enhanced. By making the outer peripheral surface of the heat radiating support 2 an arc surface and being able to be in close contact with the inner peripheral surface 1a of the tube 1, the position holding of the heat radiating support can be stabilized and heat can be released smoothly and reliably to the tube side. .
Further, since the substrate can be attached and its position can be held by simply sliding the LED-equipped substrate 3 into the support groove 21 of the heat dissipation support 2, the assembly work between the heat dissipation support and the substrate 3 is easy. In addition, since the substrate 3 can be detached from the heat dissipation support, disassembly is facilitated.
Since the heat dissipating film 12 of the tube 1, the heat dissipating film 26 of the heat dissipating support 2, and the heat dissipating film 31 of the substrate 3 are arranged in three layers as shown in FIG. The heat from the LED 4 is smoothly and reliably radiated from the substrate 3 to the heat radiation support body 2 and from the heat radiation support body to the tube body 1 and the base 5 through the heat sink, thereby enabling efficient and effective heat radiation. Become. This effect is enhanced by the heat radiation groove 51 of the base 5 as described above.
The heat radiating grooves 23 and 24 provided on the outer peripheral surface of the heat radiating support 2 can be used as a space for wiring as needed in addition to the heat radiating.

この発明に係るＬＥＤランプの第２の実施形態について図１４〜図２３を参照して説明する。
図示するＬＥＤランプＬａは、図１に示すＬＥＤランプＬと比較すると、主要部分における基本構成及び作用効果が共通している。
以下、ＬＥＤランプＬに対してＬＥＤランプＬａが相違する点について主に説明し、共通する点については必要に応じて説明する。 A second embodiment of the LED lamp according to the present invention will be described with reference to FIGS.
Compared with the LED lamp L shown in FIG. 1, the LED lamp La shown in the drawing has the same basic configuration and operational effects in the main part.
Hereinafter, the difference between the LED lamp L and the LED lamp La will be mainly described, and the common points will be described as necessary.

第１の相違点は放熱支持体１０２の保持手段の構成である。すなわち、図１４及び図１５に示すＬＥＤランプＬａにおいて、放熱支持体１０２は、管体１０１内の平板状の保持突部１１１と管体の背部側（図１５上側）の内周面１０１ａとによって挟まれる状態で保持されている。保持突部１１１と管体１０１の内周面１０１ａとが放熱支持体１０２の保持手段を形成している。
図１７〜図２１において、保持突部１１１は、管体１０１内にその背部側の内周面に接近している図１９左右両側に位置し、内方に向けてかつ互いに対向するように管体の内周面から突出されている。対の保持突部１１１は、管体１０１の長さ方向に沿って全長に亘って水平に設けられている。対の保持突部１１１のそれぞれの先端部は、上側に屈曲している押え部１１１ａである。押え部１１１ａの両先端部は互いに間隙１１４を置いて対向位置関係にある。間隙１１４は、図１８に示す例では管体１０１に全長に亘って形成されているスリット状のものである。管体１０１内の背部側の内周面１０１ａと保持突部１１１によって囲まれた空間が収納室１１３となっている。
管体１０１は、例えばパイプ押出し機を用いて押出成形法により加工され、その管本体と保持突部１１１とが一体成形されている。 The first difference is the structure of the holding means for the heat dissipation support 102. That is, in the LED lamp La shown in FIGS. 14 and 15, the heat dissipation support 102 is constituted by the flat holding protrusion 111 in the tube body 101 and the inner peripheral surface 101 a on the back side of the tube body (upper side in FIG. 15). It is held in a sandwiched state. The holding projection 111 and the inner peripheral surface 101 a of the tube body 101 form a holding means for the heat radiation support body 102.
17 to 21, the holding projections 111 are located on the left and right sides of FIG. 19, which are close to the inner peripheral surface on the back side, in the tube body 101, so that the tubes face inward and face each other. It protrudes from the inner peripheral surface of the body. The pair of holding projections 111 are provided horizontally along the entire length of the tube body 101. Each distal end portion of the pair of holding projections 111 is a presser portion 111a bent upward. Both the end portions of the presser portion 111a are in an opposing positional relationship with a gap 114 therebetween. In the example shown in FIG. 18, the gap 114 has a slit shape formed over the entire length of the tube body 101. A space surrounded by the inner peripheral surface 101 a on the back side in the tube body 101 and the holding projection 111 is a storage chamber 113.
The tube body 101 is processed by an extrusion method using, for example, a pipe extruder, and the tube body and the holding projection 111 are integrally formed.

第２の相違点は、図１４及び図１５に示すように、放熱支持体１０２には、これを管体１０１に保持するための手段（図１に示すＬＥＤランプＬの保持溝２２）に相当する手段を設けていないことである。その理由は、上述したように、放熱支持体１０２は対の保持突部１１１と管体１０１の内周面１０１ａとによって保持されるからである。
このため、放熱支持体１０２の外周面の中央部に形成されている溝１２２は、図１に示すＬＥＤランプＬの保持溝２２の機能はなく、放熱溝１２３，１２４と同様に放熱溝として機能する。放熱支持体１０２の溝１２２は、図２２に示すように、例えば断面Ｖ字形であって、放熱溝１２３，１２４と同様に放熱支持体の全長に亘って形成されている。
なお、放熱支持体１０２の溝１２２及び放熱溝１２３，１２４は、使用されるＬＥＤ１０４の種類及び基板１０３の構成によって、配線溝として利用される場合がある。 As shown in FIGS. 14 and 15, the second difference is that the heat dissipating support 102 is equivalent to a means for holding it on the tube 101 (the holding groove 22 of the LED lamp L shown in FIG. 1). The means to do is not provided. The reason is that, as described above, the heat dissipation support 102 is held by the pair of holding protrusions 111 and the inner peripheral surface 101 a of the tube body 101.
Therefore, the groove 122 formed in the central portion of the outer peripheral surface of the heat dissipation support 102 does not function as the holding groove 22 of the LED lamp L shown in FIG. 1 and functions as a heat dissipation groove in the same manner as the heat dissipation grooves 123 and 124. To do. As shown in FIG. 22, the groove 122 of the heat dissipation support 102 has, for example, a V-shaped cross section, and is formed over the entire length of the heat dissipation support similar to the heat dissipation grooves 123 and 124.
Note that the groove 122 and the heat dissipation grooves 123 and 124 of the heat dissipation support 102 may be used as wiring grooves depending on the type of the LED 104 used and the configuration of the substrate 103.

図１４〜図１７において、ＬＥＤランプＬａにおける管体１０１の放熱性膜１１２、この放熱性膜の設置幅Ｗａ、放熱支持体１０２の本体１０２ａ、支持溝１２１、開口１２１ａ、受け部１２５、放熱性膜１２６、基板１０３の放熱性膜１３１、口金１０５、放熱溝１５１、保護回路ダイオード１０６及び端子ピン１０７は、図１及び図２に示すＬＥＤランプＬにおける管体１の放熱性膜１２、この放熱性膜の設置幅Ｗ、放熱支持体２の本体２ａ、支持溝２１、開口２１ａ、受け部２５、放熱性膜２６、放熱性膜３１、口金５、放熱溝５１、保護回路ダイオード６、端子ピン７にそれぞれ相当している。   14 to 17, the heat dissipating film 112 of the tube 101 in the LED lamp La, the installation width Wa of the heat dissipating film, the main body 102a of the heat dissipating support 102, the support groove 121, the opening 121a, the receiving part 125, the heat dissipating property. The film 126, the heat dissipating film 131 of the substrate 103, the base 105, the heat dissipating groove 151, the protection circuit diode 106, and the terminal pin 107 are the heat dissipating film 12 of the tube 1 in the LED lamp L shown in FIGS. Installation width W, heat sink 2 body 2a, support groove 21, opening 21a, receiving portion 25, heat dissipation film 26, heat dissipation film 31, base 5, heat dissipation groove 51, protection circuit diode 6, terminal pin 7 respectively.

図１７に示すＬＥＤランプＬａの管体１０１の収納室１１３内において、ＬＥＤ付きの基板１０３を支持溝１２１内に支持している放熱支持体１０２は、対の保持突部１１１の押え部１１１ａと、収納室の管体の内周面１０１ａとによって挟まれた状態で保持されている。このとき、放熱支持体１０２は、上側の外周面が管体１０１の内周面１０１ａに放熱性膜１２６を介して密着されており、下側の面には押え部１１１ａの弾性力が付与されているので、安定的な位置保持が保たれている。   In the housing chamber 113 of the tube body 101 of the LED lamp La shown in FIG. 17, the heat radiation support body 102 that supports the substrate 103 with the LED in the support groove 121 is connected to the holding portions 111 a of the pair of holding projections 111. And held between the inner peripheral surface 101a of the tubular body of the storage chamber. At this time, the upper outer peripheral surface of the heat dissipating support body 102 is in close contact with the inner peripheral surface 101a of the tube body 101 via the heat dissipating film 126, and the elastic force of the pressing portion 111a is applied to the lower surface. As a result, stable position retention is maintained.

図１４及び図１５に示すＬＥＤランプＬａによれば、組み立て時に放熱支持体１０２を管体１０１の一端から他端に向けて収納室１１３内にスライドさせることによって、保持突部１１１と管体１０１の内周面１０１ａとによって保持される。放熱支持体は、管体１０１内に挿脱可能に保持可能である。また、ＬＥＤランプＬにおける放熱支持体２と基板３との関係と同様に、放熱支持体１０２では、支持溝１２１内にＬＥＤ１０４を取り付けている基板１０３を挿脱可能に支持することができる。
このため、ＬＥＤランプＬａにおける組み立て解体がＬＥＤランプＬと同様に容易となる。 According to the LED lamp La shown in FIGS. 14 and 15, the holding projection 111 and the tube body 101 are slid by sliding the heat dissipation support 102 into the storage chamber 113 from one end of the tube body 101 toward the other end during assembly. Of the inner peripheral surface 101a. The heat radiating support can be removably held in the tube body 101. Similarly to the relationship between the heat dissipation support 2 and the substrate 3 in the LED lamp L, the heat dissipation support 102 can support the substrate 103 on which the LED 104 is mounted in the support groove 121 in a detachable manner.
For this reason, assembling and disassembling in the LED lamp La is facilitated similarly to the LED lamp L.

この発明に係るＬＥＤランプの第３の実施形態について図２４を参照して説明する。
図示するＬＥＤランプＬｂは、図１７に示すＬＥＤランプＬａと比較すると、主要部分における基本構成及び作用効果が共通している。
ＬＥＤランプＬａに対してＬＥＤランプＬｂが相違する点は、放熱支持体２０２の形状のみである。すなわち、ＬＥＤランプＬｂにおける放熱支持体２０２の中央に位置している溝２２２及び放熱溝２２３，２２４の各断面形状がＬＥＤランプＬａの溝１２２及び放熱溝１２３，１２４のそれらと相違している。
ＬＥＤランプＬｂにおける放熱支持体２０２は、図２に示すＬＥＤランプＬの放熱支持体２と同一構成のものを利用している。溝２２２は放熱溝として機能する。
したがって、放熱支持体２０２は、前記ＬＥＤランプＬ及びＬＥＤランプＬａの双方に適用できる。 A third embodiment of the LED lamp according to the present invention will be described with reference to FIG.
The LED lamp Lb shown in the drawing has the same basic configuration and operational effects in the main part as compared with the LED lamp La shown in FIG.
The LED lamp Lb is different from the LED lamp La only in the shape of the heat dissipation support 202. That is, the cross-sectional shapes of the groove 222 and the heat radiation grooves 223 and 224 located at the center of the heat radiation support 202 in the LED lamp Lb are different from those of the groove 122 and the heat radiation grooves 123 and 124 of the LED lamp La.
The heat dissipation support 202 in the LED lamp Lb uses the same structure as the heat dissipation support 2 of the LED lamp L shown in FIG. The groove 222 functions as a heat radiating groove.
Therefore, the heat dissipation support 202 can be applied to both the LED lamp L and the LED lamp La.

図２４において、ＬＥＤランプＬｂにおける管体２０１、保持突部２１１、押え部２１１ａ、管体の放熱性膜２１２、収納室２１３、間隙２１４、支持溝２２１、受け部２２５、放熱性膜２２６、基板２０３、基板の放熱性膜２３１、ＬＥＤ２０４及び保護回路ダイオード２０６は、図１７に示すＬＥＤランプＬａにおける管体１０１、保持突部１１１、押え部１１１ａ、管体の放熱性膜１１２、収納室１１３、間隙１１４、支持溝１２１、受け部１２５、放熱性膜１２６、基板１０３、基板の放熱性膜１３１、ＬＥＤ１０４及び保護回路ダイオード１０６にそれぞれ相当している。   24, in the LED lamp Lb, the tube 201, the holding projection 211, the holding portion 211a, the heat dissipation film 212 of the tube, the storage chamber 213, the gap 214, the support groove 221, the receiving portion 225, the heat dissipation film 226, the substrate. 203, the heat dissipation film 231 of the substrate, the LED 204, and the protection circuit diode 206 are the tube body 101, the holding projection 111, the holding portion 111a, the heat dissipation film 112 of the tube body, the storage chamber 113, the LED lamp La shown in FIG. It corresponds to the gap 114, the support groove 121, the receiving portion 125, the heat dissipating film 126, the substrate 103, the heat dissipating film 131 of the substrate, the LED 104, and the protection circuit diode 106, respectively.

この発明に係るＬＥＤランプの第４の実施形態について図２５〜図２７を参照して説明する。
図示するＬＥＤランプＬｃの特徴は、放熱支持体３０２及び基板３０３を保持する方法にある。
図２５及び図２６に示すＬＥＤランプＬｃにおいて、管体３０１は図１７に示すＬＥＤランプＬａの管体１０１と実質的に同一構成である。対の保持突部３１１及び押え部３１１ａは、ＬＥＤランプＬａの対の保持突部１１１及び押え部１１１ａに対応している。管体３０１の収納室３１３内には放熱支持体３０２及び基板３０３が配置されている。放熱支持体３０２はＬＥＤランプＬａの放熱支持体１０２に対応するものであるが、下面の構成が図２７に示すように平坦面となっている点で放熱支持体１０２とは相違している。また放熱支持体３０２の上側外面は円弧面となっており、管体３０１の内周面３０１ａに密着している点、中央の溝３２２と、この溝の両側に放熱溝３２３，３２４とを形成し、溝３２２も放熱溝である点で、放熱支持体１０２と共通している。
さて、管体３０１内において、収納室３１３内に配置されている放熱支持体３０２及び基板３０３は、この管体内の背部側に配置されかつ保持手段によって挿脱可能に保持されている。この保持手段は、対の保持突部３１１と管体３０１の内周面３０１ａとによって構成されている。すなわち、ＬＥＤ３０４を実装している基板３０３は、図２５に示すように下面側が対の保持突部３１１によって水平状態に支えられており、上面側は放熱支持体３０２によって押えられている。基板３０３と、基板上に重ねられた放熱支持体３０２とは、管体３０１の収納室３１３内で、対の保持突部３１１と管体の内周面３０１ａによって挟まれた状態で保持されている。
図２５において、ＬＥＤランプＬｃにおける管体３０１の押え部３１１ａ、管体の放熱性膜３１２、間隙３１４、放熱支持体３０２の放熱性膜３２６、基板３０３の放熱性膜３３１及び保護回路ダイオード３０６は、図１７に示すＬＥＤランプＬａにおける管体１０１の押え部１１１ａ、管体の放熱性膜１１２、間隙１１４、放熱支持体１０２の放熱性膜１２６、基板１０３の放熱性膜１３１及び保護回路ダイオード１０６にそれぞれ相当している。 A fourth embodiment of the LED lamp according to the present invention will be described with reference to FIGS.
The feature of the LED lamp Lc shown in the figure is in the method of holding the heat dissipation support 302 and the substrate 303.
In the LED lamp Lc shown in FIGS. 25 and 26, the tube body 301 has substantially the same configuration as the tube body 101 of the LED lamp La shown in FIG. The pair of holding protrusions 311 and the presser part 311a correspond to the pair of holding protrusions 111 and the presser part 111a of the LED lamp La. A heat dissipation support 302 and a substrate 303 are disposed in the storage chamber 313 of the tube body 301. The heat dissipation support 302 corresponds to the heat dissipation support 102 of the LED lamp La, but is different from the heat dissipation support 102 in that the configuration of the lower surface is a flat surface as shown in FIG. Further, the upper outer surface of the heat dissipating support 302 is an arcuate surface, and is in close contact with the inner peripheral surface 301a of the tube body 301. A central groove 322 and heat dissipating grooves 323 and 324 are formed on both sides of the groove. The groove 322 is also a heat radiation groove, and is common to the heat radiation support body 102.
In the tube 301, the heat radiation support 302 and the substrate 303 disposed in the storage chamber 313 are disposed on the back side of the tube and are detachably held by the holding means. This holding means is constituted by a pair of holding projections 311 and an inner peripheral surface 301 a of the tube body 301. That is, as shown in FIG. 25, the substrate 303 on which the LED 304 is mounted is supported on the lower surface side in a horizontal state by the pair of holding projections 311, and the upper surface side is pressed by the heat dissipation support 302. The substrate 303 and the heat dissipation support 302 stacked on the substrate are held in the storage chamber 313 of the tube body 301 while being sandwiched between the pair of holding protrusions 311 and the inner peripheral surface 301a of the tube body. Yes.
In FIG. 25, the holding portion 311a of the tube body 301, the heat dissipating film 312 of the tube body, the gap 314, the heat dissipating film 326 of the heat dissipating support 302, the heat dissipating film 331 of the substrate 303, and the protection circuit diode 306 in the LED lamp Lc. 17, the holding portion 111 a of the tube body 101, the heat dissipating film 112 of the tube body, the gap 114, the heat dissipating film 126 of the heat dissipating support 102, the heat dissipating film 131 of the substrate 103, and the protection circuit diode 106. Respectively.

ＬＥＤランプＬｃの組み立ては、まず、図２６に示すようにＬＥＤ３０４を実装している基板３０３を管体３０１の一端部開口から収納室３１３内に挿入して他端に向けてスライドする。この操作によって、基板３０３は管体３０１の収納室３１３に一次的に保持される。ついで、収納室３１３内であって、基板３０３の上側の空間内に放熱支持体３０２を差し入れることによって放熱支持体の上側外周面は管体３０１の内周面３０１ａに密着され、この結果、基板３０３は放熱支持体と共に管体３０１内に対の保持突部３１１と管体の内周面３０１ａによって確実に保持される（図２５）。
ＬＥＤランプＬｃにおいても、放熱支持体３０２及び基板３０３のスライド操作によって簡易な組み立てや解体が可能となる。
基板３０３の図２５の左右の幅の大きさは、基板が保持突部３１１上に支えられるものである限り、問わない。基板３０３の幅をその両端部が管体３０１の内周面３０１ａに押圧的に接触することができるような大きさに設定することによって、基板の上記一次保持が確実なものとなる。
また、放熱支持体３０２は基板３０３を下側で支持するので、基板の保持が安定する利点がある。 As for the assembly of the LED lamp Lc, first, as shown in FIG. 26, the substrate 303 on which the LED 304 is mounted is inserted into the storage chamber 313 from one end opening of the tube 301 and slid toward the other end. By this operation, the substrate 303 is temporarily held in the storage chamber 313 of the tube body 301. Next, in the storage chamber 313, by inserting the heat dissipation support 302 into the space above the substrate 303, the upper outer peripheral surface of the heat dissipation support is brought into close contact with the inner peripheral surface 301a of the tube body 301. The substrate 303 is reliably held in the tube body 301 by the pair of holding projections 311 and the inner peripheral surface 301a of the tube body together with the heat dissipation support (FIG. 25).
The LED lamp Lc can be easily assembled and disassembled by sliding the heat dissipation support 302 and the substrate 303.
The width of the left and right widths of the substrate 303 in FIG. 25 is not limited as long as the substrate is supported on the holding protrusion 311. By setting the width of the substrate 303 to such a size that both ends of the substrate 303 can press-contact the inner peripheral surface 301a of the tube body 301, the primary holding of the substrate is ensured.
Further, since the heat dissipation support 302 supports the substrate 303 on the lower side, there is an advantage that the holding of the substrate is stabilized.

図２６に示すように、ＬＥＤランプＬｃの基板３０３の幅方向（左右方向）の両端部を管体３０１の内周面に押圧可能となるようにその幅を設計しておくことによって、放熱支持体３０２を介在させることなく、基板を管体の収納室３１３に保持することができる。この例では、放熱支持体３０２を用いない分だけ、放熱効果が図２５に示す例と比較して低下することになる。   As shown in FIG. 26, the width of the substrate 303 of the LED lamp Lc in the width direction (left-right direction) is designed so that the width can be pressed against the inner peripheral surface of the tube 301, thereby supporting the heat dissipation. The substrate can be held in the tube storage chamber 313 without the body 302 interposed. In this example, the heat radiation effect is reduced as compared with the example shown in FIG.

図２５に示すＬＥＤランプＬａにおける管体３０１の内周面３０１ａ、保持突部３１１の押え部３１１ａ、収納室３１３、間隙３１４、基板３０３、ＬＥＤ３０４及び保護回路ダイオード３０６は、図１５に示すＬＥＤランプＬａにおける管体１０１の内周面１０１ａ、保持突部１１１の押え部１１１ａ、収納室１１３、間隙１１４、基板１０３、ＬＥＤ１０４及び保護回路ダイオード１０６にそれぞれ相当している。   The inner peripheral surface 301a of the tube 301, the holding portion 311a of the holding projection 311, the storage chamber 313, the gap 314, the substrate 303, the LED 304, and the protection circuit diode 306 in the LED lamp La shown in FIG. It corresponds to the inner peripheral surface 101a of the tube body 101 in La, the holding portion 111a of the holding projection 111, the storage chamber 113, the gap 114, the substrate 103, the LED 104, and the protection circuit diode 106, respectively.

この発明に係るＬＥＤランプの第５の実施形態について図２８〜図３０を参照して説明する。
図示するＬＥＤランプＬｄは図２５に示すＬＥＤランプＬｃと比較すると、基本構成及び作用効果が共通している。
ＬＥＤランプＬｃに対してＬＥＤランプＬｄが相違する点は、放熱支持体を備えていないことである。すなわち、
基板４０３は、ＬＥＤランプＬｃの基板３０３と同様に、その幅方向（左右方向）の両端部を管体４０１の内周面４０１ａに押圧可能となるようにその幅が設計されている。基板４０３は、下面両側で管体４０１の保持突部４１１に支えられ、両端部が管体の内周面４０１ａに押圧されることによって、収納室４１３内に水平状態に保持される。
ＬＥＤランプＬｄの基板４０３に実装されているＬＥＤ４０４は砲弾型のものが使用されている。
図２８〜図３０において、符号４０５は口金を、符号４５１は放熱溝を、符号４０６は保護回路ダイオードを、符合４０７は端子ピンを、符合４１４は間隙をそれぞれ示す。
ＬＥＤランプＬｄの組み立ては、図２９に示すようにＬＥＤ４０４を実装している基板４０３を管体４０１の一端部開口から収納室４１３内に挿入して他端に向けてスライドする。この操作によって、基板４０３は保持突部４１１に支えられると同時に、基板の両端部は管体の内周面４０１ａに強く接触されるから、この内周面によっても保持されることになる。 A fifth embodiment of the LED lamp according to the present invention will be described with reference to FIGS.
The LED lamp Ld shown in the figure has the same basic configuration and operational effects as compared with the LED lamp Lc shown in FIG.
The LED lamp Ld is different from the LED lamp Lc in that it does not include a heat dissipation support. That is,
Similarly to the substrate 303 of the LED lamp Lc, the width of the substrate 403 is designed so that both end portions in the width direction (left-right direction) can be pressed against the inner peripheral surface 401a of the tube body 401. The substrate 403 is supported by the holding protrusions 411 of the tube body 401 on both sides of the lower surface, and both ends are pressed against the inner peripheral surface 401a of the tube body, thereby being held horizontally in the storage chamber 413.
The LED 404 mounted on the substrate 403 of the LED lamp Ld is a cannonball type.
28 to 30, reference numeral 405 indicates a base, reference numeral 451 indicates a heat radiation groove, reference numeral 406 indicates a protection circuit diode, reference numeral 407 indicates a terminal pin, and reference numeral 414 indicates a gap.
As shown in FIG. 29, the LED lamp Ld is assembled by inserting the substrate 403 on which the LED 404 is mounted into the housing chamber 413 from one end opening of the tube 401 and sliding it toward the other end. By this operation, the substrate 403 is supported by the holding projection 411 and at the same time, both end portions of the substrate are strongly in contact with the inner peripheral surface 401a of the tubular body, so that the substrate 403 is also held by this inner peripheral surface.

放熱支持体２，１０２，２０２の支持溝２１，１２１，２２１内にＬＥＤ付きの基板３，１０３，２０３を挿入した状態において、図１、図１５及び図２４に示すように基板の裏面が支持溝内面に密着するのが良い。もちろん、基板３，１０３，２０３の裏面の構成によっては、この裏面を必ずしも支持溝２１，１２１，２２１内面に密着することを要しない。また、溝１２２，２２２，３２２及び放熱溝２３，２４，１２３，１２４，２２３，２２４，３２３，３２４は、放熱支持体２，１０２，２０２，３０２に必要に応じて設けられるものであり、また上記溝及び上記放熱溝を設ける場合には、その数や断面形状は図示の例に限定されない。
上述した例では、管体１，１０１，２０１，３０１，４０１である乳白色のプラスチックパイプ内に白色光のＬＥＤ４，１０４，２０４，３０４，４０４が配置されている。管体１，１０１，２０１，３０１，４０１の表面にＬＥＤ４，１０４，２０４，３０４，４０４の影が表れることを極力制限する観点から、これらの管体における色彩は、ＬＥＤの発光色と同系色（同一色を含む。）にすることが望ましい。同様の観点から、管体１，１０１，２０１，３０１，４０１は、透光性を有すると共に、非透明（不透明、半透明）部材であるのが良いが、透明であっても良い。もちろん、管体１，１０１，２０１，３０１，４０１の材質やＬＥＤ４，１０４，２０４，３０４，４０４の発光色は上例に限定されない。
管体１，１０１，２０１，３０１，４０１の各保持突部１１，１１１，２１１，３１１，４１１は、いずれも管体に全長に亘って設けられているが、適宜間隔を置いて設けても良い。各保持突部１１１，２１１，３１１の先端部に、上方に屈曲した押え部１１１ａ，２１１ａ，３１１ａを設けることによって放熱支持体１０２，２０２，３０２に弾性力を付与するので安定的な保持に役立つ。もちろん、放熱支持体１０２，２０２，３０２の形状に関しては、先端部を屈曲させることなく、図２９に示す保持突部４１１のように水平にする構成であっても良い。
ＬＥＤ４，１０４，２０４，３０４，４０４は、各図示の例によれば、形状及び大きさがいずれも同一のものを用いているが、これらの例に限定されない。
口金に関して、図１２、図１４及び図２８に示す口金５，１０５，４０５のように外周面に放熱溝５１，１５１，４５１を設けているが、必ずしも、これらの口金の外周に放熱部を設けることを要しない。また、放熱部は、図示の例では口金５，１０５，４０５の外周全周に形成している放熱溝で構成されているが、この例に限られない。放熱部は、例えば連続することなく、適宜間隔を置いて形成している溝であっても良く、また凹部であっても良い。 In the state where the substrates 3, 103, 203 with LEDs are inserted into the support grooves 21, 121, 221 of the heat radiation supports 2, 102, 202, the back surface of the substrate is supported as shown in FIGS. It is good to adhere to the groove inner surface. Of course, depending on the configuration of the back surfaces of the substrates 3, 103, and 203, it is not always necessary that the back surface is in close contact with the inner surfaces of the support grooves 21, 121, and 221. Further, the grooves 122, 222, 322 and the heat radiation grooves 23, 24, 123, 124, 223, 224, 323, 324 are provided on the heat radiation support bodies 2, 102, 202, 302 as necessary, In the case where the grooves and the heat dissipation grooves are provided, the number and cross-sectional shape thereof are not limited to the illustrated example.
In the above-described example, white light LEDs 4, 104, 204, 304, and 404 are arranged in milky white plastic pipes that are the tubular bodies 1, 101, 201, 301, and 401. From the viewpoint of limiting as much as possible that the shadows of the LEDs 4, 104, 204, 304, 404 appear on the surfaces of the tubes 1, 101, 201, 301, 401, the colors in these tubes are similar to the emission colors of the LEDs. (Including the same color) is desirable. From the same point of view, the tubular bodies 1, 101, 201, 301, 401 have translucency and are preferably non-transparent (opaque, translucent) members, but may be transparent. Of course, the material of the tubes 1, 101, 201, 301, 401 and the emission colors of the LEDs 4, 104, 204, 304, 404 are not limited to the above examples.
The holding projections 11, 111, 211, 311, and 411 of the pipes 1, 101, 201, 301, and 401 are all provided over the entire length of the pipe, but may be provided at appropriate intervals. good. By providing the holding portions 111a, 211a, and 311a bent upward at the front end portions of the holding protrusions 111, 211, and 311, an elastic force is applied to the heat radiation support bodies 102, 202, and 302, which is useful for stable holding. . Of course, regarding the shape of the heat radiating supports 102, 202, 302, it may be configured to be horizontal like the holding projection 411 shown in FIG. 29 without bending the tip.
According to the illustrated examples, the LEDs 4, 104, 204, 304, and 404 have the same shape and size, but are not limited to these examples.
Regarding the bases, the heat radiation grooves 51, 151, and 451 are provided on the outer peripheral surface like the bases 5, 105, and 405 shown in FIGS. 12, 14, and 28. However, the heat radiation part is not necessarily provided on the outer periphery of these bases. I don't need it. Moreover, although the thermal radiation part is comprised by the thermal radiation groove formed in the outer periphery whole periphery of the nozzle | cap | die 5,105,405 in the example of illustration, it is not restricted to this example. The heat dissipating part may be, for example, a groove formed at an appropriate interval without being continuous, or may be a concave part.

Ｌ，Ｌａ，Ｌｂ，Ｌｃ ＬＥＤランプ
Ｗ，Ｗａ 放熱性膜の設置幅
１，１０１，２０１，３０１ 管体
１ａ，１０１ａ，３０１ａ 内周面
１１，１１１，２１１，３１１ 保持突部（保持手段）
１１ａ 係止部
１１３，２１３，３１３ 収納室
１２，１１２，２１２，３１２ 放熱性膜
１２２，２２２，３２２ 溝
２，１０２，２０２，３０２ 放熱支持体
２１，１２１，２２１ 支持溝
２１ａ，１２１ａ 開口
２２ 保持溝（保持手段）
２２ａ 係合部
２３，１２３，２２３，３２３ 放熱溝
２４，１２４，２２４，３２４ 放熱溝
２５，１２５，２２５ 受け部
２６，１２６，２２６，３２６ 放熱性膜
３，１０３，２０３，３０３ ＬＥＤ付きの基板
３１，１３１，２３１，３３１ 放熱性膜
４，１０４，２０４，３０４ ＬＥＤ（発光ダイオード）
５，１０５ 口金
５１，１５１ 放熱溝 L, La, Lb, Lc LED lamp W, Wa Installation width of heat dissipation film 1, 101, 201, 301 Tubular body 1a, 101a, 301a Inner peripheral surface 11, 111, 211, 311 Holding protrusion (holding means)
11a Locking portion 113, 213, 313 Storage chamber 12, 112, 212, 312 Heat radiation film 122, 222, 322 Groove 2, 102, 202, 302 Heat radiation support 21, 121, 221 Support groove 21a, 121a Opening 22 Holding Groove (holding means)
22a engagement part 23,123,223,323 heat dissipation groove 24,124,224,324 heat dissipation groove 25,125,225 receiving part 26,126,226,326 heat dissipation film 3,103,203,303 substrate with LED 31,131,231,331 Heat-dissipating film 4,104,204,304 LED (light emitting diode)
5,105 Base 51,151 Radiation groove

Claims (14)

管体と、この管体内の背部側に配置されかつ保持手段によって係合保持されている放熱支持体と、この放熱支持体に支持されていると共に光源であるＬＥＤを複数配置してある基板とを備えており、
上記基板は、上記放熱支持体に形成している支持溝内に挿入支持されており、
上記ＬＥＤは、上記管体の上記背部側とは反対側である照射側に向けて照射可能である
ことを特徴とするＬＥＤランプ。 A tube, a heat dissipating support disposed on the back side of the tube and engaged and held by holding means, and a substrate on which a plurality of LEDs serving as light sources are disposed while being supported by the heat dissipating support With
The substrate is inserted and supported in a support groove formed in the heat dissipation support,
The LED lamp can be irradiated toward an irradiation side opposite to the back side of the tube. 保持手段は、管体内周面から内方に向けて突出してある保持突部と、放熱支持体に設けてある保持溝とから構成されており、上記保持突部と保持溝とは互いに上記管体の長さ方向に移動可能に係合されていることを特徴とする請求項１記載のＬＥＤランプ。   The holding means includes a holding projection that protrudes inward from the peripheral surface of the pipe body, and a holding groove that is provided in the heat dissipation support, and the holding projection and the holding groove are mutually connected to the pipe. The LED lamp according to claim 1, wherein the LED lamp is engaged so as to be movable in a body length direction. 保持手段は、管体内周面から内方に向けて突出しかつ長さ方向に延伸している保持突部と、放熱支持体にその長さ方向に沿って設けてある保持溝とから構成されており、上記保持突部と保持溝とは互いに上記管体の長さ方向に移動可能に係合されていることを特徴とする請求項１記載のＬＥＤランプ。   The holding means is composed of a holding protrusion protruding inward from the peripheral surface of the tubular body and extending in the length direction, and a holding groove provided in the heat dissipation support body along the length direction. 2. The LED lamp according to claim 1, wherein the holding projection and the holding groove are engaged with each other so as to be movable in the length direction of the tubular body. 放熱支持体は、管体の背部側の外周面に放熱溝を形成してあることを特徴とする請求項１乃至請求項３のいずれかに記載のＬＥＤランプ。   4. The LED lamp according to claim 1, wherein the heat dissipating support body has a heat dissipating groove formed on an outer peripheral surface on a back side of the tube body. 放熱支持体は、管体の背部側の外周面が凸状の円弧面を形成していると共に、上記管体の内周面に密着可能であることを特徴とする請求項１乃至請求項４のいずれかに記載のＬＥＤランプ。   The heat dissipation support is characterized in that the outer peripheral surface on the back side of the tubular body forms a convex arc surface and can be in close contact with the inner peripheral surface of the tubular body. The LED lamp in any one of. 放熱支持体は、管体の背部側の外周面が放熱性膜によって被覆されていることを特徴とする請求項１乃至請求項５のいずれかに記載のＬＥＤランプ。   6. The LED lamp according to claim 1, wherein an outer peripheral surface of the heat dissipating support body on the back side of the tube body is covered with a heat dissipating film. 管体の背部の外周面には、放熱支持体の背部側の外周面に対向位置関係に帯状の放熱性膜をその長さ方向に沿って形成してあり、上記放熱支持体の外周面が放熱性膜によって被覆されていることを特徴とする請求項１乃至請求項５のいずれかに記載のＬＥＤランプ。   On the outer peripheral surface of the back portion of the tube body, a strip-like heat radiating film is formed along the length direction of the outer peripheral surface on the back side of the heat radiating support member so as to be opposed to each other, and the outer peripheral surface of the heat radiating support member is The LED lamp according to any one of claims 1 to 5, wherein the LED lamp is covered with a heat dissipating film. 基板のＬＥＤの取付け面とは反対側の面は、放熱支持体の支持溝の内底面に密着されていると共に放熱性膜によって被覆されていることを特徴とする請求項１乃至請求項７のいずれかに記載のＬＥＤランプ。   The surface of the substrate opposite to the LED mounting surface is in close contact with the inner bottom surface of the support groove of the heat dissipation support and is covered with a heat dissipation film. The LED lamp in any one. 管体の両端に口金を配置してあり、上記口金の外周面に放熱部を形成してあることを特徴とする請求項１乃至請求項８のいずれかに記載のＬＥＤランプ。   The LED lamp according to any one of claims 1 to 8, wherein a base is disposed at both ends of the tube body, and a heat radiating portion is formed on an outer peripheral surface of the base. 管体の両端に口金を配置してあり、上記口金の外周面に放熱部を形成してあり、この放熱部は放熱溝で構成されていることを特徴とする請求項１乃至請求項８のいずれかに記載のＬＥＤランプ。   The bases are arranged at both ends of the tube body, and a heat radiating part is formed on the outer peripheral surface of the base, and the heat radiating part is constituted by a heat radiating groove. The LED lamp in any one. 管体と、この管体内の背部側に配置されかつ保持手段によって挿入保持されている放熱支持体及び光源であるＬＥＤを複数配置してある基板とを備えており、
上記保持手段は、上記管体の内周面から内方に向けて互いに対向するように突出している板状の保持突部からなり、両保持突部が上記管体の長さ方向に沿って全長に亘って形成されており、上記両保持突部の先端部間に間隙が形成されており、上記両保持突部と上記管体の背部側の内周面との間に収納室が形成されており、
上記収納室内には、上記背部側に放熱支持体が、上記間隙側に基板がそれぞれ移動可能にかつ重ねられた状態で挿入配置されていると共に、上記放熱支持体及び上記基板が上記管体の内周面と上記両保持突部とによって挟まれた状態で保持されており、
上記放熱支持体は、管体の背部側の外周面が凸状の円弧面を形成していると共に、円筒形の管体の内周面に密着されており、
上記ＬＥＤは、上記管体の上記背部側とは反対側である照射側に向けて照射可能である
ことを特徴とするＬＥＤランプ。 A tube, and a heat dissipating support disposed on the back side of the tube and inserted and held by holding means, and a substrate on which a plurality of LEDs as light sources are arranged,
The holding means is composed of plate-like holding protrusions that protrude inward from the inner peripheral surface of the tubular body, and both holding protrusions extend along the length direction of the tubular body. It is formed over the entire length, a gap is formed between the tip ends of the both holding projections, and a storage chamber is formed between the both holding projections and the inner peripheral surface on the back side of the tubular body Has been
In the storage chamber, a heat dissipation support is inserted on the back side, and a substrate is inserted and disposed in a state where the substrate is movable and stacked on the gap side, and the heat dissipation support and the substrate are connected to the tube body. It is held in a state sandwiched between the inner peripheral surface and the both holding projections,
The heat dissipation support has an outer peripheral surface on the back side of the tube forming a convex arc surface, and is in close contact with the inner peripheral surface of the cylindrical tube,
The LED lamp can be irradiated toward an irradiation side opposite to the back side of the tube. 基板の幅方向の両端部は、管体の内周面に押圧状態に接触していることを特徴とする請求項１１記載のＬＥＤランプ。   The LED lamp according to claim 11, wherein both end portions in the width direction of the substrate are in contact with the inner peripheral surface of the tube body in a pressed state. 管体の両端に口金を配置してあり、上記口金の外周面に放熱部を形成してあることを特徴とする請求項１１又は請求項１２に記載のＬＥＤランプ。   13. The LED lamp according to claim 11, wherein a base is disposed at both ends of the tube body, and a heat radiating portion is formed on the outer peripheral surface of the base. 管体の両端に口金を配置してあり、上記口金の外周面に放熱部を形成してあり、この放熱部は放熱溝で構成されていることを特徴とする請求項１１又は請求項１２に記載のＬＥＤランプ。
A base is arranged at both ends of the tube body, a heat radiating portion is formed on the outer peripheral surface of the base, and the heat radiating portion is constituted by a heat radiating groove. LED lamp of description.
JP2009042861A 2009-02-25 2009-02-25 Led lamp Pending JP2010198927A (en)

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