JP2010166003A - Film laminating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film laminating device achieving downsizing of the device and high-speed processing. <P>SOLUTION: The film laminating device 10 includes head units 31a and 31b movable along Y rails 33a and 33b of a head unit moving mechanism 30. In the film laminating device 10, a small piece film A1 is cut out from a roll film A fed by the film moving mechanism 20, and the small piece film A1 is conveyed by a head unit moving mechanism 30 to be stuck to a sheet electronic substrate B conveyed by a substrate moving mechanism 15. In each of the head units 31a and 31b, four dies 36 movable upward and downward individually are arranged, and each of the dies 36 includes a die cutting blade 37, a suction port 38, and a fixing heater 39. In each of the head units 31a and 31b, a state detection unit 29 for a substrate is arranged, while a state detection part 42 is arranged below the movement area of the head units 31a and 31b. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a film laminating apparatus for cutting a small piece film from a roll film and laminating it on a sheet-like electronic substrate.

  Conventionally, for example, when creating a flexible printed circuit board, a small piece film made of an insulator is attached to a conductive pattern forming surface of a resin sheet-like electronic substrate on which a conductive pattern is formed to protect the conductive pattern. is doing. In such a case, a film laminating apparatus is used for cutting a piece-shaped film of a predetermined shape from a roll-shaped film and laminating it on a sheet-like electronic substrate (see, for example, Patent Document 1).

  The film laminating apparatus (coverlay film laminating apparatus) includes various devices such as a base film supply apparatus, a temporary pressure bonding apparatus, a laminated film collection apparatus, and a coverlay film cutting / supplying apparatus. When the coverlay film is bonded to the base film, the coverlay film that is intermittently fed out by the base film supply device and cut into a predetermined shape by the coverlay film cutting / feeding device is conveyed. The film is temporarily pressed by a temporary pressing apparatus to form a laminated film.

  This cover lay film cutting / supplying device is composed of a cover lay film cutting device for cutting the cover lay film and a cover lay film supplying device comprising a movable clamper and a suction pad. The cover lay film cut into a strip shape is sucked by a suction pad and conveyed to a predetermined position of the base film. The temporary pressure bonding apparatus includes a temporary pressure bonding table and a buffer mechanism that receives the temporary pressure bonding table, and the temporary pressure bonding table with the base film and the coverlay film disposed between the temporary pressure bonding table and the buffer mechanism. The coverlay film is temporarily pressure-bonded to the base film by moving to the buffer mechanism side. And the formed laminated film is collect | recovered by a laminated film collection | recovery apparatus.

  However, in the above-described conventional coverlay film laminating apparatus, the coverlay film is cut, the cut coverlay film is transported, and the coverlay film is temporarily bonded to the base film by different apparatuses. Became larger and the processing speed was slower.

  The present invention has been made to cope with such problems, and an object of the present invention is to provide a film laminating apparatus capable of downsizing and high-speed processing.

  In order to achieve the above-described object, the structural feature of the film laminating apparatus according to the present invention is that a small piece film is cut from a roll-shaped film fed out by a film moving mechanism, and the small piece film is formed by a head unit moving mechanism. Is a film laminating apparatus for laminating a sheet-like electronic substrate conveyed by a substrate moving mechanism, and includes a plurality of dies that can be individually moved up and down and moved along a rail included in a head unit moving mechanism A possible head unit, a cutting part that is formed on the lower surface of a plurality of molds and pressed against the roll film, and cuts a piece-like film from the roll film, and a cutting part that is provided in each of the plurality of molds. A holding part for holding the cut piece-like film, and a holding part provided for each of a plurality of molds A small piece of film which thus conveyed is held in that a fixing portion for fixing a sheet-like electronic substrate.

  In the film laminating apparatus according to the present invention, the head unit moving mechanism includes a rail and a head unit movable along the rail, and the head unit has a plurality of gold plates individually movable up and down. A mold is included, and each die is provided with a cutting portion, a holding portion, and a fixing portion. That is, the cutting unit, the holding unit, and the fixing unit are not provided in separate devices constituting the film laminating apparatus, respectively, but these are all provided in the mold, and the cutting unit, the holding unit, and the fixing unit are provided. The head unit is composed of a mold or the like. Accordingly, when the head unit moves, a plurality of sets of the cutting part, the holding part, and the fixing part are moved together.

  Therefore, the entire film laminating apparatus can be reduced in size, and within the range of movement of the head unit, the small film is cut from the roll film, the cut small film is held, and the small film is conveyed. In addition, all the processes of bonding the small piece film to the sheet-like electronic substrate can be performed. Further, the head unit is provided with a plurality of molds each provided with a cutting part, a holding part and a fixing part, and each mold can be individually moved up and down. For this reason, while being able to cut | disconnect and hold | maintain several piece-like films from a roll-like film simultaneously or in order, a several piece-like film can be bonded together to a sheet-like electronic substrate simultaneously or in order.

  When a plurality of small pieces of film are cut or fixed at the same time, high-speed processing is possible, so that efficient attachment of the small pieces of film to a sheet-like electronic substrate is possible. In addition, when cutting a plurality of small pieces of film in order, each time a portion of the roll-shaped film that cuts each small piece of film is approached or a plurality of small pieces of film are cut from the roll-shaped film The waste of the roll film can be reduced by changing the direction of the head unit. In addition, when laminating a plurality of small pieces of film in order, each time the small pieces of film are laminated to a sheet-like electronic substrate, the direction of each piece of thin film (head unit) is changed to form a sheet. Even if the arrangement of the portions on the electronic substrate where the small film is bonded is irregular, each small film can be accurately bonded to the sheet-shaped electronic substrate.

  Another structural feature of the film laminating device according to the present invention is that the head unit is provided with a substrate state detection unit capable of detecting a sheet-like electronic substrate, and a holding unit is provided below the moving range of the head unit. A small piece film state detection unit capable of detecting the small piece film to be held is provided. According to this, the substrate state detection unit detects the installation position of the sheet-like electronic substrate and the position of the portion where the piece-like film is pasted on the sheet-like electronic substrate, and is held by the piece-like film state detection unit. By detecting the direction of the small piece film held by the portion and comparing both detection results, the small piece film can be bonded to an accurate position on the sheet-like electronic substrate.

  Still another structural feature of the film laminating apparatus according to the present invention is that additional material is added or unnecessary material is removed from the small piece film conveyed by the head unit moving mechanism, or A state changing unit for changing the state of the small piece film is provided. In this case, the state changing unit includes a predetermined member, an addition device that adds liquid or gas to the small piece film, a removal device that removes unnecessary portions, liquid, gas, or electrostatic material from the small piece film, small piece shape It is preferable to use any posture correcting device that corrects the posture of the film.

  According to this, before the piece-like film cut from the roll-like film is bonded to the sheet-like electronic substrate, if any treatment is required for the piece-like film, the state change unit performs the treatment. It can be carried out. When the state changing unit is an additional device that adds a predetermined member, for example, when a process of peeling a small piece film or a part thereof bonded to the sheet-like electronic substrate from the sheet-like electronic substrate is required Moreover, the process which sticks the small film for peeling on the edge part etc. of a small piece-like film can be performed. In this case, a device for attaching a small film for peeling is used as the state changing unit.

  When the state changing unit is an additional device that adds liquid or gas, it improves the wettability when the piece-like film is attached to the sheet-like electronic substrate, and makes the piece-like film suitable for the sheet-like electronic substrate. Bonding can be made possible. Further, when the state changing unit is a removing device that removes unnecessary portions, burrs generated on the outer peripheral portion of the small piece film, foreign matters attached to the small piece film, and the like can be removed. Furthermore, when the state changing unit is a removing device that removes liquid, gas, or electrostatic material, by removing excess liquid or gas contained in the small piece film or static electricity contained in the small piece film, Appropriate bonding of the small piece film to the sheet-like electronic substrate can be made possible. When the state changing unit is a posture correcting device that corrects the posture of the small piece film, the posture of the small piece film held by the holding unit can be corrected to an appropriate state.

  Still another structural feature of the film laminating apparatus according to the present invention resides in that a film fixing unit for fixing a part where the roll-shaped film is fed is provided in the film moving mechanism. According to this, since a roll-shaped film is fixed by a film fixing part, the process at the time of cut | disconnecting a small piece-like film from a roll-shaped film in a cutting | disconnection part can be performed correctly and smoothly.

  Further, still another structural feature of the film bonding apparatus according to the present invention is that a pair of head unit moving mechanisms are provided in parallel. According to this, since a pair of head unit moving mechanisms having a head unit having a plurality of molds are provided, processing at a higher speed becomes possible.

  Still another structural feature of the film laminating apparatus according to the present invention is that the cutting portion is constituted by a Thomson-type cutting blade. According to this, even if the shape of the small piece film is complicated, the shape of the cut portion can be formed with high accuracy according to the shape of the small piece film, and the cut portion can be made inexpensive.

  Still another structural feature of the film laminating device according to the present invention is that the holding portion includes a suction portion connected to the suction device, and a pressure-sensitive adhesive portion and a small piece each having a lower surface with adhesiveness. It is comprised in either of the engaging parts engaged with the outer peripheral part of a film-like film. When the holding unit is configured by a suction unit connected to the suction device, the piece-like film can be securely held by the suction force of the suction device, and when the holding unit is configured by an adhesive unit, It is possible to obtain a holding portion that is inexpensive and has a simple structure. Further, when the holding portion is constituted by an engaging portion that engages with the outer peripheral portion of the small piece film, a holding portion that can be obtained at a low cost with a simpler structure can be obtained.

  Still another structural feature of the film laminating apparatus according to the present invention is that the fixing portion is configured by a fixing heater or an ultrasonic oscillator. When the fixing part is composed of a fixing heater, a part of the small piece film is melted by heating while pressing the upper surface of the small piece film placed on the sheet-like electronic substrate with the fixing heater. It can be made to stick together on a sheet-like electronic substrate. In addition, when the fixed portion is constituted by an ultrasonic oscillator, the small piece film is obtained by oscillating ultrasonic waves while pressing the upper surface of the small piece film placed on the sheet-like electronic substrate with the ultrasonic oscillator. Can be fixed to a sheet-like electronic substrate with high density. In this case, as the roll film and the sheet-like electronic substrate, a resin material or a metal material that can be bonded by heating or ultrasonic waves is used.

  In addition, another structural feature of the film laminating apparatus according to the present invention is that the holding part holds the small piece film at the same time that the cutting part cuts the small piece film from the roll film. It is in. According to this, since the process in which the cutting part cuts the piece-like film from the roll film and the process in which the holding part holds the cut piece-like film is performed at the same time, the processing time can be further reduced. become.

It is the perspective view which showed the film bonding apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which showed the head unit with which the film bonding apparatus which concerns on 1st Embodiment of this invention is provided. It is the perspective view which showed the principal part of the film bonding apparatus. It is explanatory drawing which showed the state which has located the head unit above the roll-shaped film. (A) shows the state which lowers a head unit, (b) is explanatory drawing which showed the roll-shaped film. (A) shows the state which cut | disconnects a roll-shaped film with one metal mold | die cutting blade of a head unit, (b) is explanatory drawing which showed the roll-shaped film at that time. (A) shows the state which raises one mold cutting blade and cuts a roll-shaped film with the other mold cutting blade, (b) is explanatory drawing which showed the roll-shaped film at that time. (A) shows the state which raises the other die cutting blade and raises a head unit, (b) is explanatory drawing which showed the roll-shaped film at that time. (A) shows the state which aligns a head unit above a sheet-like electronic substrate, (b) is explanatory drawing which showed the upper surface of the sheet-like electronic substrate. (A) shows the state which fixes a small piece film to a sheet-like electronic substrate with one metal mold | die of a head unit, (b) is explanatory drawing which showed the upper surface of the sheet-like electronic substrate at that time. It is explanatory drawing which showed the state which raised one metal mold | die. (A) shows the state which fixes a piece-like film to a sheet-like electronic substrate with the other metal mold | die, (b) is explanatory drawing which showed the upper surface of the sheet-like electronic substrate at that time. It is explanatory drawing which showed the state which raises the other die cutting blade and raises a head unit. It is explanatory drawing which showed the state which lowers a head unit with respect to a sheet-like electronic substrate, and fixes a small piece film to a sheet-like electronic substrate with one metal mold | die. It is explanatory drawing which showed the state which lowers a head unit with respect to a sheet-like electronic substrate, and fixes a small piece film to a sheet-like electronic substrate with the other metal mold | die. It is sectional drawing which showed the head unit with which the film bonding apparatus which concerns on 2nd Embodiment of this invention is provided. It is sectional drawing which showed the head unit with which the film bonding apparatus which concerns on 3rd Embodiment of this invention is provided. It is sectional drawing which showed the head unit with which the film bonding apparatus which concerns on 4th Embodiment of this invention is provided. (A) is sectional drawing which showed the head unit with which the film bonding apparatus which concerns on 5th Embodiment of this invention is provided, (b) is the elements on larger scale which showed the principal part. It is sectional drawing which showed the head unit with which the film bonding apparatus which concerns on 6th Embodiment of this invention is provided.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a film bonding apparatus 10 according to the embodiment. The film laminating apparatus 10 cuts the small piece film A1 from the resin roll film A and conveys the cut piece film A1 to form on the upper surface of the resin sheet electronic substrate B. It is an apparatus for bonding to the predetermined part of the electrode pattern made. The film laminating apparatus 10 includes a base (not shown), a substrate moving mechanism 15, a film moving mechanism 20, a head unit moving mechanism 30, and a state changing unit 40.

  The substrate moving mechanism 15 is a device for moving the sheet-like electronic substrate B in the X direction (the direction indicated by the arrow X in FIG. 1 in the left-right direction) above the base and installing it on a preset installation unit. Yes, the film moving mechanism 20 is arranged in parallel with the substrate moving mechanism 15 on the upper surface of the base, and intermittently moves the roll film A in the X direction to install each part in a preset installation part. It is a device. Further, the head unit moving mechanism 30 moves the pair of head units 31a and 31b arranged above the base in the Y direction (indicated by an arrow Y in FIG. 1) above the roll film A and the sheet electronic substrate B, respectively. It is an apparatus for moving in the front-rear direction and the Z-direction (vertical direction in the direction indicated by the arrow Z in FIG. 1).

  And the state change unit 40 is an apparatus for performing the predetermined | prescribed process mentioned later with respect to the small piece film A1 installed in the predetermined part of the film moving mechanism 20, and conveyed with a pair of head unit 31a, 31b. . The substrate moving mechanism 15 includes a pair of X rails 16 a and 16 b disposed on the upper surface of the base, a planar plate-shaped moving table 17 on which the sheet-like electronic substrate B is installed on the upper surface, and four lower corners of the moving table 17. Engagement sliding portions 18a and 18b (only two are shown) are provided, which slide while engaged with the X rails 16a and 16b, respectively, so that the movable table 17 can move along the X rails 16a and 16b. )).

  Although not shown, the substrate moving mechanism 15 is provided with a substrate driving device provided with a transport motor, and the moving table 17 is moved along the X rails 16a and 16b by the driving of the substrate driving device. That is, the X rails 16a and 16b extend in the left-right direction at a constant interval in the front-rear direction according to the length in the front-rear direction of the moving table 17 on the base, and the substrate driving device is operated by the operation of the transport motor. The moving table 17 is moved, and the sheet-like electronic substrates B installed on the upper surface of the moving table 17 are sequentially conveyed to the installation unit. And when fixation of the small piece film A1 to the sheet-like electronic board | substrate B is complete | finished in an installation part, the sheet-like electronic board | substrate B will be conveyed downstream.

  The film moving mechanism 20 is disposed behind the substrate moving mechanism 15 in parallel with the substrate moving mechanism 15, and a pair of X rails 21 a and 21 b disposed at a predetermined interval on the upper surface of the base, and the X rail 21a and 21b, a movable table unit 22 that can be moved along the X rails 21a and 21b, and a roll-shaped film unwinding unit and a roll-shaped film disposal unit winding unit (both not shown). )). The movable table unit 22 has a main body portion formed by forming a table-like film support portion 24 projecting upward at the center portion in the width direction (front-rear direction) on the upper surface of the bottom surface portion 23 that is rectangular in plan view. Wall-shaped roll-shaped film fixing units 25 and 26 as film fixing portions according to the present invention are formed on the left and right ends of the main body portion, respectively.

  The roll-shaped film fixing units 25 and 26 have a bilaterally symmetric structure, and include plate-like wall-like fixing parts 25a and 26a extending upward from both end faces of the bottom part 23, and wall-like fixing parts 25a and 26a, respectively. It is comprised by the square-bar-shaped rod-shaped moving part 25b, 26b which moves up and down so that it may advance and retreat with respect to an upper surface. Then, film insertion slits 25c and 26c that form a gap between the wall surface fixing portions 25a and 26a and the rod-like moving portions 25b and 26b at the center in the width direction (front-rear direction) on the upper surfaces of the wall surface fixing portions 25a and 26a. Is provided. The film insertion slits 25 c and 26 c are set to have the same width as the width of the film support portion 24, and the height of the lower end portion is set to be the same as the height of the upper surface of the film support portion 24.

  The heights of the front and rear side portions at the upper ends of the wall-shaped fixing portions 25a and 26a are slightly higher than the height of the upper surface of the film support portion 24, and the difference between the heights (the heights of the film insertion slits 25c and 26c). The length is the same as or slightly shorter than the thickness of the roll film A. The widths of the film support 24 and the film insertion slits 25c and 26c are set to be slightly larger than the width of the roll film A. For this reason, the roll-shaped film A is installed on the film support portion 24 in a state of being inserted through the film insertion slit 25c and the film insertion slit 26c, and the rod-shaped moving portions 25b and 26b are moved downward, respectively. Portions located at both ends of the moving table unit 22 in the roll film A can be fixed on the film support 24.

  Further, the moving table unit 22 is provided with an elevating device (not shown) for elevating and lowering the rod-like moving parts 25b and 26b, and the rod-like moving part 25b is moved to the wall-like fixing part 25a by the operation of this elevating device. On the other hand, the rod-like moving part 26b advances and retreats with respect to the wall-like fixing part 26a. At the four corners of the lower surface of the bottom surface 23, an engagement sliding portion 27a that allows the movable table unit 22 to move along the X rails 21a and 21b by sliding in a state engaged with the X rails 21a and 21b. 27b and 27c (only three are shown). Although not shown, the moving table unit 22 is provided with a driving device including a transport motor, and the moving table unit 22 is moved along the X rails 21a and 21b by the driving of the driving device.

  The roll-shaped film unwinding unit is disposed on the upstream side (left side) of the X rails 21a and 21b, and supports the center of the winding portion of the roll-shaped film A before processing so as to be rotatable around the axis. And a feed driving device that rotationally drives the support shaft portion. And the roll-shaped film A is intermittently sent to the upper surface of the film support part 24 by the drive of a sending drive device. The roll-shaped film disposal unit winding unit is disposed on the downstream side (right side) of the X rails 21a and 21b, and the roll-shaped film disposal unit A2 after the processing in which the small piece film A1 is cut and discarded A take-up shaft portion that winds up on the surface and a take-up drive device that rotationally drives the take-up shaft portion are provided. And a winding shaft part winds up roll-shaped film disposal part A2 one by one by the drive of a winding drive device.

  The head unit moving mechanism 30 is composed of a pair of moving mechanisms 30a and 30b provided on the left and right sides of the X rails 16a and 16b and the X rails 21a and 21b in a state where the head unit moving mechanism 30 is stretched on both the front and rear sides of the base. It is arranged at a constant interval above. The movement mechanisms 30a and 30b are both hung on the leg portions 32a and 32b extending upward from the outer portions of the X rails 16a and 16b and the X rails 21a and 21b on the upper surface of the base, and the upper end side portions of the leg portions 32a and 32b. A pair of bar-shaped Y rails 33a and 33b extending in the front-rear direction are provided in a state of being maintained at a fixed interval above the X rails 16a and 16b and the X rails 21a and 21b.

  The head unit 31a is attached to the Y rails 33a and 33b of the moving mechanism 30a via the moving shaft 34a so as to be movable in the front-rear direction, and is connected to the Y rails 33a and 33b of the moving mechanism 30b via the moving shaft 34b. The head unit 31b is attached so as to be movable in the front-rear direction. The moving shaft portions 34a and 34b are each provided with a Y-axis drive device including a Y-axis motor (not shown). The head unit 31a is moved together with the moving shaft portion 34a, and the head unit 31b is moved together with the moving shaft portion 34b. These are individually moved in the front-rear direction by driving the Y-axis drive device.

  The head units 31a and 31b include a Z-axis drive device including head unit lifting shafts 35a and 35b that allow the head units 31a and 31b to move in the Z-axis direction (vertical direction) and the head units 31a and 31b, respectively. An R-direction drive device (not shown) that rotates in a direction (a direction indicated by an arrow R in FIG. 1 and a direction around the Z axis) is also provided. For this reason, the head units 31a and 31b move in the front-rear direction by driving the Y-axis driving device, and move in the vertical direction along the head unit lifting shafts 35a and 35b by driving the Z-axis driving device. It rotates around the Z axis by driving the direction drive device.

  Each of the head units 31a and 31b includes four separate molds 36 (see FIG. 2 (only two are shown)), and each of the molds 36 is provided via a lifting guide portion 36a. Thus, it is possible to advance and retract individually with respect to the lower surface of the thick plate-like base portion 36b. That is, each of the lifting guide portions 36a is provided with a mold lifting / lowering drive section (not shown), and each mold 36 is lifted / lowered with respect to the base section 36b by driving of each mold lifting / lowering driving section. . Further, as shown in FIGS. 2 and 3, a die cutting blade 37 as a cutting portion according to the present invention is attached to the lower surface of each die 36, and inside each die 36. A suction port 38 as a holding portion according to the present invention and a fixing heater 39 as a fixing portion according to the present invention are provided.

  The die cutting blade 37 is composed of a Thomson-type cutting blade, and each die cutting blade 37 is formed in an L-shaped frame shape that is the same shape as the outer peripheral portion of the small piece film A1. Then, as shown in FIG. 3, the four die cutting blades 37 are arranged in a rectangular shape such that each of the two die cutting blades 37 is combined to form a square. The suction port 38 is formed of a tubular body that vertically penetrates the mold 36, the upper end is connected to a suction device (not shown), and the lower end is opened at the lower surface of the mold 36. Yes. As shown in FIG. 2, the suction port 38 allows the small piece film A <b> 1 cut from the roll-shaped film A by the die cutting blade 37 to move inside the die cutting blade 37 (upper part) as shown in FIG. 2. Then, the small piece film A1 is released by stopping the operation of the suction device.

  The fixing heater 39 is composed of a rod-shaped heater that generates heat when energized, and moves up and down in the mold 36 by the operation of a heater lifting device (not shown). Projects downward from the lower surface of the mold 36. For this reason, the head units 31a and 31b are placed on the sheet-like electronic substrate B and the roll-shaped film A above the sheet-like electronic substrate B conveyed by the substrate moving mechanism 15 and the roll-shaped film A conveyed by the film moving mechanism 20. On the other hand, it can move in any direction, and each mold 36 can be moved up and down individually relative to the other parts of the head units 31a and 31b.

  Further, the suction port 38 sucks and picks up the small piece film A1 with the suction force generated by the operation of the suction device, and moves to the upper side of the sheet-like electronic substrate B by the movement of the head units 31a and 31b. The small piece film A1 is released by releasing the suction by the apparatus. Furthermore, the fixing heater 39 can move up and down with respect to the mold 36 and can heat the small piece film A1 by energization. By this heating, the small piece film A1 can be fixed to the sheet-like electronic substrate B.

  The head units 31a and 31b are provided with a substrate state detection unit 29 as a substrate state detection unit according to the present invention for detecting the state of the upper surface of the sheet-like electronic substrate B. The substrate state detection unit 29 can be composed of, for example, a CCD camera, is fixed to the side surfaces of the head units 31a and 31b, and moves together with the head units 31a and 31b. This substrate state detection unit 29 confirms the installation position of the sheet-like electronic substrate B, confirms the position of the portion where the small film A1 is fixed on the upper surface of the sheet-like electronic substrate B, and the upper surface of the sheet-like electronic substrate B. It is used for confirming the arrangement of the small piece film A1 bonded to the film.

  The state changing unit 40 is installed on a substantially central upper surface in the longitudinal direction of the bottom surface portion 23 of the moving table unit 22 on the side of the substrate moving mechanism 15 and can move together with the moving table unit 22. And a state detecting unit 42 as a state detecting unit for a small piece film according to the invention. For example, the state changing unit 41 is attached to a peeling film used when a small film for peeling is attached to a part of the small piece film A1 that is attracted to the suction port 38 and conveyed by the head units 31a and 31b. It can be configured with an attaching device.

  This peeling film sticking apparatus is equipped with a mechanism that sequentially feeds small films from the bottom to the top of a cylindrical supply section extending vertically. The state detection unit 42 can be constituted by a CCD camera, for example, and is used for checking the state of the small piece film A1 adsorbed by the suction port 38. The state of the small piece film A1 in this case includes the direction of the small piece film A1 and the state of adsorption to the suction port 38. The small film is composed of, for example, a plurality of layers of the small piece film A1, and after the small piece film A1 is attached to the sheet-like electronic substrate B, a part of the small piece film A1 is peeled off. In some cases, it is used as a peeling start part.

  The film laminating apparatus 10 operates the film laminating apparatus 10 such as a storage device including a CPU, a ROM, and a RAM, various detection devices including an image processing apparatus, an input device, and a sensor in addition to the above-described apparatuses. There are various devices necessary for this. In the storage device, various programs such as various programs for operating the respective devices included in the film laminating device 10 and data relating to the installation positions and shapes of the sheet-like electronic substrate B, the roll-like film A, and the small piece-like film A1. Is stored.

  The image processing apparatus is connected to the substrate state detection unit 29 and the state detection unit 42. The captured images of the substrate state detection unit 29 and the state detection unit 42 are image-processed and stored in the storage device as image data. . The input device is used for input for selecting a program stored in the storage device and for inputting various data. Further, the detection device detects the rotational speeds of various motors such as a conveyance motor, and determines the positions of the moving table 17 and the moving table unit 22 and the positions of the head units 31a and 31b in the X, Y, Z, and R directions. recognize. And CPU operates each apparatus with which the film bonding apparatus 10 is provided based on the program and various data which a memory | storage device memorize | stores, the input data of an input device, the detected value of a detection apparatus, etc.

  The processing in the case of fixing the small film A1 on the surface of the sheet-like electronic substrate B using the film laminating apparatus 10 configured as described above is performed by the CPU executing the various programs described above. Is called. In this case, first, the moving table 17 on which the sheet-like electronic substrate B is installed is conveyed below the moving range of the head units 31a and 31b, and the moving table unit 22 is conveyed below the moving range of the head units 31a and 31b. To do. Next, a predetermined portion of the roll-shaped film A (portion for cutting the small piece film A <b> 1) is fed out to the upper surface of the film support portion 24 of the moving table unit 22.

  And after fixing the part located in the upper surface both ends of the film support part 24 in the roll-shaped film A with the roll-shaped film fixing units 25 and 26, as shown in FIG. The head unit 31a is positioned above the portion of the roll film A where the small piece film A1 is cut. Next, the suction device is operated to lower the head unit 31a as shown in FIG. 5A while sucking air on the upper surface of the roll film A through the suction port 38. FIG.5 (b) has shown the state which looked at the roll-shaped film A at this time from upper direction.

  Next, as shown in FIG. 6A, one of the molds 36 is lowered with respect to the base part 36 b and the other molds 36, and the roll film A is cut with the mold cutting blade 37. Simultaneously with this cutting, the small piece film A1 cut from the roll film A is sucked into the suction port 38. Here, for convenience of explanation, the number of molds 36 is two. Hereinafter, one mold 36 will be described as a mold 36A, and the other mold 36 will be described as a mold 36B. FIG.6 (b) has shown the small piece film A1 which is a cutting object part cut | disconnected from the roll-shaped film A by operation shown to Fig.6 (a).

  Next, as shown in FIG. 7A, the mold 36A is raised and the mold 36B is lowered. As a result, the cut piece film A1 is lifted together with the mold 36A while being held on the inner upper side of the mold cutting edge 37 of the mold 36A by suction of the suction port 38, and the mold 36B The die cutting blade 37 cuts the small piece film A1 from the other part of the roll film A. Moreover, as shown in FIG.7 (b), the hole A3 after the small piece film A1 is cut | disconnected and taken out in the roll-shaped film A, and the cutting line of the small piece film A1 are formed.

  Then, as shown in FIG. 8A, by raising the mold 36B, the other cut piece of film A1 is sucked into the suction port 38 of the mold 36B, and the mold 36B While being held on the inside upper side of the die cutting edge 37, it rises together with the die 36B. As a result, as shown in FIG. 8B, the roll film A is formed with two holes A3 after the small piece film A1 is cut and taken out.

  Next, the head unit 31a moves down above the state change unit 40 while holding the two small pieces of film A1, and then descends and is supplied to the upper surface of the state change unit 41. A small film for peeling is attached to the small piece film A1 by bringing the small piece film A1 into contact with a film (not shown). Then, the state detection unit 42 checks the state of the small piece film A1 adsorbed by the suction port 38. Next, the head unit 31a moves above the sheet-like electronic substrate B as shown in FIG. FIG. 9B shows the state of the upper surface of the sheet-like electronic substrate B at this time.

  Next, the head unit 31a is rotated by driving the R direction driving device, and the direction of the small piece film A1 held by the mold 36A is set to the portion where the small piece film A1 on the sheet-like electronic substrate B is bonded. Match the direction. The portion of the sheet-like electronic substrate B on which the small piece film A1 is bonded is the upper surface of the electrode pattern, and the electrode pattern is protected by fixing the small piece film A1 on the surface. Further, the portion of the sheet-like electronic substrate B to which the small piece film A1 is bonded is previously imaged by the substrate state detection unit 29 and stored in the storage device as image data. This image data and the mold 36A The R direction driving device is driven while comparing the position in the rotation direction and the direction of the small piece film A1.

  Next, as shown in FIG. 10A, the mold 36 </ b> A is lowered, and the small piece film A <b> 1 is overlaid on the electrode pattern of the sheet-like electronic substrate B. At this time, the fixing heater 39 is lowered and heated while pressing a predetermined portion of the small piece film A1, thereby fixing the small piece film A1 to the sheet-like electronic substrate B. In this case, it is preferable to fix the small piece film A1 at a plurality of locations of the small piece film A1, for example, two thermocompression bonding points B1 as shown in FIG. Next, as shown in FIG. 11, the fixing heater 39 is raised while the small piece film A1 is left on the sheet-like electronic substrate B, and the die 36A is raised.

  Next, the head unit 31a is rotated by driving the R direction driving device, and the direction of the small piece film A1 held by the mold 36B is bonded to the next small piece film A1 on the sheet-like electronic substrate B. Match the direction of the part. Then, as shown in FIG. 12A, the mold 36 </ b> B descends and the small piece film A <b> 1 is overlaid on the electrode pattern of the sheet-like electronic substrate B. At this time, the fixing heater 39 is lowered and heated while pressing a predetermined portion of the small piece film A1, thereby fixing the small piece film A1 to the sheet-like electronic substrate B.

  As a result, as shown in FIG. 12B, the two small pieces of film A1 are fixed to the sheet-like electronic substrate B at two thermocompression bonding points B1, respectively. And as shown in FIG. 13, while raising the metal mold | die 36B, the head unit 31a is raised. At this time, the operation of the suction device is stopped. In this way, by repeating the above-described operation, all the small pieces of film A1 are attached to the sheet-like electronic substrate B. Then, when the attachment of the small film A1 to the sheet-like electronic substrate B is completed, a new sheet-like electronic substrate B is set on the moving table 17, and the next portion of the roll-shaped film A is moved to the moving table unit 22. The film is fed to the upper surface of the film support 24 and the above-described processing is repeated.

  In addition, when performing the process shown to Fig.10 (a), it can replace with this process and the process shown in FIG. 14 can also be performed. That is, in the process shown in FIG. 10A, only the mold 36A is lowered and the fixing heater 39 of the mold 36A is lowered to fix the small piece film A1 to the sheet-like electronic substrate B. However, as shown in FIG. 14, the entire head unit 31a may be lowered to the upper surface of the sheet-like electronic substrate B, and the fixing heater 39 of the mold 36A may be lowered. Similarly, when the process shown in FIG. 12A is performed, the process shown in FIG. 15 can be performed instead of this process.

  That is, in the process shown in FIG. 12A, only the mold 36B is lowered and the fixing heater 39 of the mold 36B is lowered to fix the small piece film A1 to the sheet-like electronic substrate B. However, as shown in FIG. 15, the entire head unit 31a may be lowered to the upper surface of the sheet-like electronic substrate B, and the fixing heater 39 of the mold 36B may be lowered. In addition, the two small pieces of film A1 are simultaneously cut from the roll-shaped film A with both molds 36A and 36B, or the two small pieces of film A1 are simultaneously cut into sheet-like electrons with both molds 36A and 36B. It can also be fixed to the substrate B.

  As described above, in the film laminating apparatus 10 according to the present embodiment, the head units 31a and 31b that are movable along the Y rails 33a and 33b included in the moving mechanisms 30a and 30b constituting the head unit moving mechanism 30, respectively, Four dies 36 each capable of moving up and down individually are provided. Each die 36 is provided with a die cutting edge 37, a suction port 38, and a fixing heater 39. When the head units 31a and 31b move, four sets of the die cutting edges 37 are provided. The suction port 38 and the fixing heater 39 are moved together.

  Accordingly, the entire film laminating apparatus 10 can be reduced in size, and the small piece film A1 can be cut from the roll film A within the movement range of the head units 31a and 31b. Holding, transporting the small piece film A1, pasting the small film on the small piece film A1, confirming the holding state of the small piece film A1, and bonding the small piece film A1 to the sheet-like electronic substrate B All processing can be performed. In addition, since the four dies 36 respectively provided on the head units 31a and 31b can be individually moved up and down, the four pieces of film A1 from the roll film A can be transferred simultaneously or sequentially. While being able to cut | disconnect and hold | maintain, four piece-like film A1 can be bonded together to the sheet-like electronic substrate B simultaneously or sequentially.

  For this reason, when performing a high-speed process, when cutting and fixing the four small piece films A1 simultaneously, and reducing the waste of the roll-shaped film A, each small piece-like shape in the roll-shaped film A The waste of the roll-shaped film A can be reduced by making the part which cut | disconnects film A1 approach, or changing the direction of head unit 31a, 31b each time it cut | disconnects. Further, when the arrangement of the portions where the piece-like film A1 is bonded to the sheet-like electronic substrate B is irregular, the piece-like film A1 is attached to the sheet-like electronic substrate B every time the piece-like film A1 is attached. By changing the direction of the film A1, each piece of film A1 can be bonded to the sheet-like electronic substrate B with high accuracy.

  In other words, the four molds 36 that can be individually moved up and down are provided with a die cutting edge 37, a suction port 38, and a fixing heater 39, respectively. When cutting the piece film A1, each piece film A1 can be cut in order while adjusting the rotation direction angle of each mold 36, and each piece film A1 is fixed when each piece film A1 is fixed. Each piece-like film A1 can be fixed to the sheet-like electronic substrate B in order while adjusting the angle of the rotational direction of the mold 36. As a result, the waste of the roll film A (roll film discard part A2) can be reduced, and even if the arrangement of the portion for fixing the small film A1 in the sheet-like electronic substrate B is complicated. Can be easily handled.

  Further, since the substrate state detection unit 29 and the state detection unit 42 are provided, the installation state of the sheet-like electronic substrate B and the portion where the small piece film A1 on the sheet-like electronic substrate B is pasted by the substrate state detection unit 29 are provided. In addition to detecting the position, the state detection unit 42 detects the orientation of the small piece film A1 held in the suction port 38, and compares both detection results, thereby making the small piece film A1 a sheet-like electronic substrate. It can be pasted to an accurate position in B. In addition, since the state changing unit 41 is provided, a small piece is required when a process for peeling a part of the small piece film A1 bonded to the sheet-like electronic substrate B from the sheet-like electronic substrate B is necessary in a later step. The process which sticks the small film for peeling to the film-like film A1 can be performed.

  Further, in order to fix both sides of the roll-shaped film A installed on the film support 24 with the roll-shaped film fixing units 25 and 26, when cutting the small piece film A1 from the roll-shaped film A with the die cutting blade 37. Can be performed accurately and smoothly. Furthermore, since the die cutting blade 37 is composed of a Thomson-type cutting blade, even if the shape of the small piece film A1 is complicated, the die cutting blade 37 can be handled with high accuracy, and the die cutting blade 37 can be made inexpensive. In the present embodiment, the process in which the die cutting blade 37 cuts the small piece film A1 from the roll film A and the process in which the suction port 38 holds the cut piece film A1 are performed simultaneously. Therefore, the processing time can be further shortened.

(Second Embodiment)
FIG. 16 shows the head unit 51 provided in the film bonding apparatus according to the second embodiment of the present invention. In the head unit 51, an ultrasonic oscillator 59 is provided as a fixing portion in place of the fixing heater 39 described above. The ultrasonic oscillator 59 fixes the small film A1 to the sheet-like electronic substrate B by oscillating ultrasonic waves while pressing the small piece film A1 against the sheet-like electronic substrate B. About the structure of the other part of the film bonding apparatus provided with this head unit 51, it is the same as the film bonding apparatus 10 mentioned above. Accordingly, the same parts are denoted by the same reference numerals and the description thereof is omitted. The operational effects of the film laminating apparatus according to this embodiment are the same as the operational effects of the film laminating apparatus 10 described above.

(Third embodiment)
FIG. 17 shows a head unit 61 provided in a film bonding apparatus according to the third embodiment of the present invention. In this head unit 61, an adhesive holding member 68 as an adhesive part according to the present invention attached to the lower surface of the mold 66 is used as the holding part instead of the suction port 38 in the first embodiment. The adhesive holding member 68 is provided in a portion of the lower surface of the mold 66 excluding an opening through which the fixing heater 69 advances and retreats, and the lower surface of the adhesive holding member 68 is configured by an adhesive surface. For this reason, by lowering the mold 66 and pressing the small piece film A <b> 1 with the adhesive holding member 68, the small piece film A <b> 1 is adhered and held on the adhesive holding member 68.

  About the structure of the other part of the film bonding apparatus provided with this head unit 61, it is the same as the film bonding apparatus 10 which concerns on 1st Embodiment mentioned above. Accordingly, the same parts are denoted by the same reference numerals and the description thereof is omitted. When this head unit 61 is used, there is no need to provide a hole or the like for providing a holding part inside the mold 66, so that the structure of the mold 66 and the holding part is simplified and the cost can be reduced. About the other effect of the film bonding apparatus which concerns on this embodiment, it is the same as that of the film bonding apparatus 10 mentioned above.

(Fourth embodiment)
FIG. 18 shows a head unit 71 provided in the film bonding apparatus according to the fourth embodiment of the present invention. In the head unit 71, an ultrasonic oscillator 79 is provided as a fixing portion instead of the fixing heater 69 in the third embodiment. About the structure of the other part of the film bonding apparatus provided with this head unit 71, it is the same as the film bonding apparatus which concerns on 3rd Embodiment mentioned above. Accordingly, the same parts are denoted by the same reference numerals and the description thereof is omitted. The operational effects of the film laminating apparatus according to the present embodiment are also the same as the operational effects of the film laminating apparatus according to the third embodiment described above.

(Fifth embodiment)
FIG. 19A shows a head unit 81 included in a film bonding apparatus according to the fifth embodiment of the present invention. In the head unit 81, a saw blade holding portion 88 (see FIG. 19B) formed on the inner peripheral surface of the die cutting blade 87 is used as a holding portion instead of the adhesive holding member 68 in the third embodiment. It is used. The saw blade holding portion 88 is constituted by an uneven surface composed of a plurality of concave portions and convex portions provided on the inner peripheral surface of the die cutting blade 87. For this reason, when the metal mold 86 is lowered and the small film A1 is cut from the roll film A with the metal cutting edge 87, the outer peripheral part of the small film A1 is a concave portion (convex part) of the saw blade holding part 88. The small piece film A1 is held by the die cutting edge 87.

  About the structure of the other part of the film bonding apparatus provided with this head unit 81, it is the same as the film bonding apparatus which concerns on 3rd Embodiment mentioned above. Accordingly, the same parts are denoted by the same reference numerals and the description thereof is omitted. According to the film laminating apparatus provided with the head unit 81, the structure of the holding unit is further simplified, and the cost of the head unit 81 can be reduced. The other operational effects of the film laminating apparatus provided with the head unit 81 are the same as the operational effects of the film laminating apparatus according to the third embodiment described above.

(Sixth embodiment)
FIG. 20 shows a head unit 91 provided in the film bonding apparatus according to the sixth embodiment of the present invention. In the head unit 91, an ultrasonic oscillator 99 is provided as a fixing portion instead of the fixing heater 69 in the fifth embodiment. About the structure of the other part of the film bonding apparatus provided with this head unit 91, it is the same as the film bonding apparatus which concerns on 5th Embodiment mentioned above. Accordingly, the same parts are denoted by the same reference numerals and the description thereof is omitted. The operational effects of the film bonding apparatus including the head unit 91 are the same as the operational effects of the film bonding apparatus according to the fifth embodiment described above.

  Moreover, the film bonding apparatus which concerns on this invention is not limited to each embodiment mentioned above, It can implement by changing suitably. For example, in each of the above-described embodiments, the substrate state detection unit 29 and the state detection unit 42 are configured by a CCD camera, but a detection device such as a laser sensor may be used instead. In the embodiment described above, the operation of the suction device is started before cutting the piece-like film A1 from the roll-like film A, and after the piece-like film A1 is cut by all the die cutting blades 37 and the like. Although it is stopped, the suction device can be operated while the film laminating device 10 is operating. Further, different suction devices may be connected to the suction ports 38 of the respective molds 36 and the like, and individually operated when necessary.

  Furthermore, in embodiment mentioned above, although the state change part 41 is comprised with the peeling film sticking apparatus used in order to stick the small film for peeling to the small piece film A1, this state change part 41 is comprised. Is a small device transported by an addition device for adding liquid or gas to the small piece film A1, a removal device for removing unnecessary parts, liquid, gas or electrostatic material from the small piece film A1, a head unit 31a, etc. You may comprise with the attitude | position correction apparatus etc. which correct the attitude | position of piece-like film A1 in a favorable state. According to this, before the piece-like film A1 cut from the roll-like film A is bonded to the sheet-like electronic substrate B, this state changing unit is necessary when any processing is required for the piece-like film A1. 41 can perform the necessary processing.

  In the fifth embodiment and the sixth embodiment, the holding portion is constituted by a saw blade holding portion 88 formed on the inner peripheral surface of the die cutting blade 87, and a small portion is formed in the recess of the saw blade holding portion 88. The small piece film A1 is held by engaging the outer peripheral portion of the piece film A1, but instead of this engagement, the small piece is caused by the holding force of friction generated on the inner peripheral surface of the die cutting edge 87. The film A1 can also be held. In this case, the saw blade holding portion 88 is not necessary, or can be formed of a gentle uneven surface instead of the saw blade shape. Moreover, it can change suitably also about the structure of each other part which comprises the film bonding apparatus which concerns on this invention.

  DESCRIPTION OF SYMBOLS 10 ... Film bonding apparatus, 15 ... Substrate movement mechanism, 20 ... Film movement mechanism, 25, 26 ... Roll-shaped film fixing unit, 29 ... Substrate state detection unit, 30 ... Head unit movement mechanism, 30a, 30b ... Movement mechanism 31a, 31b, 51, 61, 71, 81, 91 ... head unit, 33a, 33b ... Y rail, 36, 36A, 36B, 66, 86 ... mold, 37, 87 ... mold cutting blade, 38 ... suction Port, 39, 69 ... fixing heater, 41 ... state changing unit, 42 ... state detecting unit, 59, 79, 99 ... ultrasonic oscillator, 68 ... adhesive holding member, 88 ... saw blade holding unit, A ... roll -Like film, A1 ... small piece-like film, B ... sheet-like electronic substrate.

Japanese Patent No. 4097679

Claims (10)

A film laminating apparatus that cuts a small piece film from a roll-shaped film fed out by a film moving mechanism, and bonds the small piece film to a sheet-like electronic substrate conveyed by a substrate moving mechanism by a head unit moving mechanism. And
A head unit that includes a plurality of molds that can be individually moved up and down, and that is movable along a rail provided in the head unit moving mechanism;
A cutting part for cutting the piece-like film from the roll-shaped film by being formed on the lower surface of the plurality of molds and being pressed against the roll-shaped film;
A holding part for holding the piece-like film provided in each of the plurality of molds and cut by the cutting part;
A film laminating apparatus comprising: a fixing unit that fixes the piece-like film that is provided on each of the plurality of molds and that is held and conveyed by the holding unit to the sheet-like electronic substrate.   For the small piece film capable of detecting the small piece film held by the holding portion below the moving range of the head unit, while providing the head unit with a substrate state detecting portion capable of detecting the sheet-like electronic substrate. The film bonding apparatus according to claim 1, further comprising a state detection unit.   2. A state changing unit is provided for adding or removing an additional material to the small piece film conveyed by the head unit moving mechanism or changing the state of the small piece film. Or the film bonding apparatus of 2.   The state change unit includes a predetermined member, an addition device that adds liquid or gas to the small piece film, a removal device that removes unnecessary portions, liquid, gas, or electrostatic material from the small piece film, small piece shape The film laminating apparatus according to claim 3, wherein the film laminating apparatus is configured by any one of attitude correcting apparatuses that correct the attitude of the film.   The film bonding apparatus as described in any one of Claims 1 thru | or 4 which provided the film fixing | fixed part for fixing the part which the said roll-shaped film was drawn | fed out to the said film moving mechanism.   The film bonding apparatus according to claim 1, wherein a pair of the head unit moving mechanisms are provided in parallel.   The film laminating device according to any one of claims 1 to 6, wherein the cutting portion is constituted by a Thomson-type cutting blade.   The holding part is configured by any one of a suction part connected to a suction device, an adhesive part whose lower surface is provided with adhesiveness, and an engaging part that engages with the outer peripheral part of the piece-like film. The film bonding apparatus as described in any one of Claims 1 thru | or 7.   The film bonding apparatus according to any one of claims 1 to 8, wherein the fixing portion is configured by a fixing heater or an ultrasonic oscillator.   The film according to any one of claims 1 to 9, wherein the cutting unit cuts the piece-like film from the roll-like film and at the same time the holding unit holds the piece-like film. Bonding device.

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