JP2010021549A - Stage apparatus, aligner, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage apparatus suppressing performance deterioration. <P>SOLUTION: The stage apparatus includes a moving member movable in a predetermined direction, an intake formed on a first side of the moving member facing a front space of the moving member to take a gas into the member, an air passage formed in the moving member to guide the gas from the intake and a first exhaust port formed in the moving member to exhaust the gas guided along the air passage. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, an exposure apparatus that exposes a substrate with an exposure beam as disclosed in the following patent document is used. The exposure apparatus includes a movable member (for example, a substrate holding member that holds a substrate) that moves in a space in which the environment (including at least one of temperature, humidity, pressure, and cleanness) is controlled.

US Pat. No. 6,452,292 US Pat. No. 6,762,820

  For example, if the environment of the space in which the movable member moves changes due to the movement of the movable member, the movement performance of the movable member may be reduced. For example, when a substrate exposure process is performed in the space, there is a possibility that an exposure failure may occur or a defective device may occur.

  Moreover, when the temperature of a movable member rises, the movement performance of the movable member may fall. For example, when a substrate to be exposed is held on the movable member or a measuring instrument relating to exposure of the substrate is mounted, an exposure failure may occur or a defective device may occur.

  An object of an aspect of the present invention is to provide a stage apparatus that can suppress a decrease in movement performance of a movable member. Another object of the present invention is to provide an exposure apparatus that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, a moving member that is movable in a predetermined direction, and an intake port that is formed on the first side of the moving member and faces the space in front of the moving member in the predetermined direction and takes in gas. A stage device that is formed inside the moving member and guides the gas from the intake port, and a first exhaust port that is formed in the moving member and discharges the gas guided by the air passage. Provided.

  According to the second aspect of the present invention, a stage apparatus comprising: a moving member that moves on a predetermined surface of the base member; a heat sink disposed on at least a part of the moving member; and a cooling fan disposed on the heat sink. Is provided.

  According to a third aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with an exposure beam, the exposure apparatus including the stage device according to the first and second aspects.

  According to a fourth aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with an exposure beam from a projection system, wherein the exposure apparatus includes an optical path on the image plane side of the projection system, a substantially closed space, An exposure apparatus comprising: a movable member that can be moved at a time; and a suppression device that suppresses pressure fluctuations in a space on the front side of the movable member and a space on the rear side of the movable member when the movable member moves in a predetermined direction. Is provided.

  According to a fifth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the fourth aspect and developing the exposed substrate.

  According to the present invention, it is possible to suppress a decrease in movement performance of the movable member. Further, according to the present invention, it is possible to suppress the occurrence of exposure failure and suppress the occurrence of defective devices.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a perspective view which shows an example of the substrate stage which concerns on 1st Embodiment. It is a top view which shows an example of the substrate stage which concerns on 1st Embodiment. It is a figure for demonstrating an example of operation | movement of the substrate stage which concerns on 1st Embodiment. It is a figure which shows the substrate stage which concerns on a comparative example. It is a figure for demonstrating an example of operation | movement of the substrate stage which concerns on 1st Embodiment. It is the perspective view which fractured | ruptured a part which shows an example of the substrate stage which concerns on 2nd Embodiment. It is the perspective view which fractured | ruptured a part which shows an example of the substrate stage which concerns on 3rd Embodiment. It is a side view which shows an example of the measurement stage which concerns on 4th Embodiment. It is a perspective view which shows an example of the substrate stage which concerns on 5th Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with an exposure beam EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX includes a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and a measuring instrument C that measures an exposure beam EL. A movable measurement stage 3, a drive system 10 for moving the mask stage 1, a drive system 20 for moving the substrate stage 2 and the measurement stage 3, the mask stage 1, the substrate stage 2, and the measurement stage 3 An interferometer system 4 that optically measures the position of the mask, an illumination system IL that illuminates the mask M with the exposure beam EL, and a projection system PL that projects an image of the pattern of the mask M illuminated with the exposure beam EL onto the substrate P. A liquid immersion member 5 capable of forming an immersion space so that at least a part of the optical path of the exposure beam EL is filled with the liquid LQ, and a space in which the exposure beam EL travels. A chamber unit 6, and a control device 7 for controlling the operation of the entire exposure apparatus EX.

  In the present embodiment, the substrate stage 2 includes a plurality of openings 31 into which gas can be taken, and an air passage 33 that guides gas from at least one of the plurality of openings 31. The measurement stage 3 includes a plurality of openings 41 through which gas can be taken, and a ventilation path 43 that guides gas from at least one of the plurality of openings 41.

  Further, the exposure apparatus EX includes a body 8 including, for example, a first column 9 provided on a support surface FL in a clean room and a second column 10 provided on the first column 9. In the present embodiment, a mask stage 1, a substrate stage 2, a measurement stage 3, an illumination system IL, a projection system PL, a body 8, and the like are arranged in a space formed by the chamber device 6.

  The first column 9 includes a first support member 14 and a first surface plate 16 supported by the first support member 14 via a vibration isolator 15. The second column 10 includes a second support member 17 disposed on the first surface plate 16 and a second surface plate 19 supported on the second support member 17 via a vibration isolator 18.

  The first column 9 forms a first space 11. In the present embodiment, the first column 9 forms a first space 11 with the support surface FL. The first space 11 is substantially closed. The first space 11 may be defined by the first column 9 and the third surface plate 27 (described later).

  The second column 10 forms a second space 12. In the present embodiment, the second column 10 forms a second space 12 with the first surface plate 16. The second space 12 is substantially closed.

  The chamber device 6 forms a third space 13. In the present embodiment, the chamber device 6 forms a third space 13 with the second surface plate 19. The third space 13 is substantially closed.

  In the present embodiment, the exposure apparatus EX controls the environment (at least one of temperature, humidity, pressure, and cleanness) of the first, second, and third spaces 11, 12, and 13. , 22, 23. In the present embodiment, each of the environment control devices 21 to 23 includes a temperature adjustment device that can adjust the temperature of the gas, a filter unit that can remove foreign matters in the gas, and the like. Each of the environment control devices 21 to 23 supplies clean and temperature-adjusted gas to the first to third spaces 11 to 13 in order to control the environment of the first to third spaces 11 to 13.

  In the present embodiment, the control device 7 controls the environment control devices 21 to 23, and the first space 11 has the highest cleanliness among the first to third spaces 11 to 13. Next, the environment of the first to third spaces 11 to 13 is adjusted so that the cleanness of the third space 13 is high and the cleanness of the second space 12 is high next to the third space 13.

  Moreover, in this embodiment, the control apparatus 7 controls the environmental control apparatuses 21-23, and the pressure of the 1st space 11 is the highest among the 1st-3rd spaces 11-13, and 3rd space. The environment of the first to third spaces 11 to 13 is adjusted so that the pressure of 13 is higher than the pressure of the second space 12.

The illumination system IL illuminates a predetermined illumination area IR with an exposure beam EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with an exposure beam EL having a uniform illuminance distribution. As the exposure beam EL emitted from the illumination system IL, for example, bright ultraviolet rays (g rays, h rays, i rays) emitted from a mercury lamp and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light is used as the exposure beam EL.

  The mask stage 1 is movable in the third space 13 while holding the mask M. The mask stage 1 has a mask holding unit 1H that holds the mask M in a releasable manner. In the present embodiment, the mask holding unit 1H holds the mask M so that the surface (pattern formation surface) of the mask M and the XY plane are substantially parallel.

  The mask stage 1 is movable on the guide surface 19G of the second surface plate 19. The mask stage 1 is movable on the guide surface 19G to the illumination region IR (the irradiation position of the exposure beam EL from the illumination system IL). The guide surface 19G is substantially parallel to the XY plane. The mask stage 1 moves on the guide surface 19G by the operation of the drive system 10. In the present embodiment, the drive system 10 includes a planar motor for moving the mask stage 1 on the guide surface 19G. The planar motor for moving the mask stage 1 includes, for example, a movable element 1M arranged on the mask stage 1 and a fixed board arranged on the first surface plate 19, as disclosed in US Pat. No. 6,452,292. And a child 19C. In the present embodiment, the mover 1M includes a magnet array, and the stator 19C includes a coil array. The mover 1M may include a coil array, and the stator 19C may include a magnet array. In the present embodiment, the mask stage 1 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions by the operation of the drive system 10 including a planar motor.

  The projection system PL irradiates a predetermined projection region PR with the exposure beam EL. The projection system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection system PL are held by the lens barrel 24. The lens barrel 24 has a flange 24F. Projection system PL is supported by first surface plate 16 via flange 24F. A vibration isolator can be provided between the first surface plate 16 and the lens barrel 24.

  The projection system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. The projection system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection system PL is parallel to the Z axis. The projection system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection system PL may form either an inverted image or an erect image.

  Of the plurality of optical elements of the projection system PL, the terminal optical element 25 closest to the image plane of the projection system PL has an exit surface 26 that emits the exposure beam EL toward the image plane of the projection system PL. The projection region PR includes the irradiation position of the exposure beam EL emitted from the emission surface 26 of the projection system PL (terminal optical element 25).

  In the present embodiment, among the plurality of optical elements of the projection system PL, at least the terminal optical element 25 is disposed in the first space 11. In the present embodiment, the optical path of the exposure beam EL emitted from the exit surface 26 of the last optical element 25 is disposed in the first space 11. That is, in the present embodiment, the first space 11 includes an optical path on the image plane side of the projection system PL.

  The substrate stage 2 is movable in the first space 11 while holding the substrate P. The substrate stage 2 has a substrate holding part 2H that holds the substrate P in a releasable manner. In the present embodiment, the substrate P is held on the upper side (+ Z side) of the substrate holding part 2H. In the present embodiment, the substrate holding unit 2H holds the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel.

  The measurement stage 3 is movable in the first space 11 with the measuring instrument C mounted. The measuring instrument C can measure the exposure beam EL. As the measuring instrument C mounted on the measuring stage 3, for example, at least a part of an aerial image measuring system capable of measuring an aerial image by the projection system PL as disclosed in US Patent Application Publication No. 2002/0041377, For example, at least a part of an illuminance unevenness measuring system capable of measuring the illuminance unevenness of the exposure beam EL as disclosed in US Pat. No. 4,465,368, for example, a projection as disclosed in US Pat. No. 6,721,039. At least a part of a measurement system capable of measuring the fluctuation amount of the transmittance of the exposure beam EL of the system PL, for example, a dose measurement system (illuminance measurement) as disclosed in, for example, US Patent Application Publication No. 2002/0061469 System) and, for example, as disclosed in EP 1079223 At least a portion or the like of the wavefront aberration measuring system can be mentioned. An example of an exposure apparatus that includes a substrate stage that can move while holding the substrate P, and a measurement stage that can move by mounting the measuring device C that measures the exposure beam EL without holding the substrate P. For example, it is disclosed in, for example, US Pat. No. 6,897,963 and US Patent Application Publication No. 2007/0127006.

  Each of the substrate stage 2 and the measurement stage 3 is movable on the guide surface 27G of the third surface plate 27. Each of the substrate stage 2 and the measurement stage 3 can move to the projection region PR (the irradiation position of the exposure beam EL from the projection system PL) on the guide surface 27G. The guide surface 27G is substantially parallel to the XY plane. The third surface plate 27 is supported on the support surface FL via the vibration isolator 28. The third surface plate 28 is disposed in the first space 11.

  The substrate stage 2 and the measurement stage 3 move on the guide surface 27G by the operation of the drive system 20. In the present embodiment, the drive system 20 includes a planar motor for moving the substrate stage 2 and the measurement stage 3 on the guide surface 27G. Planar motors for moving the substrate stage 2 and the measurement stage 3 are, for example, movable elements 2M and 3M arranged on the substrate stage 2 and the measurement stage 3 as disclosed in US Pat. No. 6,452,292. And a stator 27C disposed on the third surface plate 27. In the present embodiment, the movers 2M and 3M include a coil array, and the stator 27C includes a magnet array. The movers 2M and 3M may include a magnet array, and the stator 27C may include a coil array. In the present embodiment, each of the substrate stage 2 and the measurement stage 3 is moved in six directions of the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 20 including the planar motor. Is possible.

  The liquid immersion member 5 is disposed in the vicinity of the last optical element 25. The liquid immersion member 5 forms an immersion space so that the optical path of the exposure beam EL between the terminal optical element 25 and the object disposed in the projection region PR is filled with the liquid LQ. The immersion space is a portion (space, region) filled with the liquid LQ. In the present embodiment, the object that can be arranged in the projection region PR includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measuring instrument C mounted on the measurement stage 3. . During the exposure of the substrate P, the immersion member 5 forms an immersion space so that the optical path of the exposure beam EL between the last optical element 25 and the substrate P is filled with the liquid LQ.

  The liquid immersion member 5 has a lower surface 29 that can face the object, and a space between the lower surface 29 and the object can hold the liquid LQ. An immersion space is formed by the liquid LQ held between the lower surface 29 and the object. In the present embodiment, during exposure of the substrate P, an immersion space is formed so that a partial region of the surface of the substrate P including the projection region PR is covered with the liquid LQ. During the exposure of the substrate P, the interface (meniscus, edge) of the liquid LQ is formed between the lower surface 29 of the liquid immersion member 5 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  In the present embodiment, the liquid immersion member 5 is a liquid immersion member as disclosed in, for example, US Patent Application Publication No. 2007/0132976, a supply port for supplying the liquid LQ, and collecting the liquid LQ. A recovery port. The control device 7 executes the liquid recovery operation using the recovery port in parallel with the liquid supply operation using the supply port, so that the terminal optical element 25 and the liquid immersion member 5 on one side, the terminal optical element 25 and the liquid are recovered. A liquid immersion space can be formed with the liquid LQ between the immersion member 5 and the object on the other side facing the immersion member 5.

  The interferometer system 4 includes a first interferometer unit 4A capable of optically measuring position information of the mask stage 1 (mask M) in the XY plane, a substrate stage 2 (substrate P), and a measurement stage 3 in the XY plane. A second interferometer unit 4B capable of optically measuring position information of (measuring instrument C). Each of the first and second interferometer units 4A and 4B has a plurality of laser interferometers. The first interferometer unit 4A irradiates the measurement mirror 1R provided on the mask stage 1 with measurement light, and measures position information of the mask stage 1 (mask M) in the X axis, Y axis, and θZ directions. The second interferometer unit 4B irradiates measurement light to each of the measurement mirror 2R provided on the substrate stage 2 and the measurement mirror 3R provided on the measurement stage 3, and relates to the X-axis, Y-axis, and θZ directions. Position information of the substrate stage 2 (substrate P) and the measurement stage 3 (measurement device C) is measured.

  Although not shown, position information on the surface of the substrate P held on the substrate stage 2 as disclosed in, for example, US Pat. No. 5,448,332 and US Pat. No. 6,327,025 is detected. A focus leveling detection system is arranged. The focus / leveling detection system can detect not only the position information of the surface of the substrate P but also the position information of the upper surface of the substrate stage 2 and the upper surface of the measurement stage 3.

  When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 7 determines the drive system 10, based on the measurement result of the interferometer system 4 and the detection result of the focus / leveling detection system. 20 is operated to control the position of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measuring instrument C).

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. When the substrate P is exposed, the control device 7 controls the mask stage 1 and the substrate stage 2 to move the mask M and the substrate P in a predetermined scanning direction in the XY plane. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction.

  In the present embodiment, a plurality of shot areas, which are exposure target areas, are arranged on the substrate P in a matrix. For example, in order to expose the first shot region on the substrate P, the control device 7 moves the substrate P (first shot region) in the Y-axis direction with respect to the projection region PR of the projection system PL, and the substrate P The mask M is moved in the Y-axis direction with respect to the illumination region IR of the illumination system IL in synchronization with the movement in the Y-axis direction through the projection system PL and the liquid LQ in the immersion space on the substrate P. Then, the exposure beam EL is irradiated to the first shot area. Thereby, an image of the pattern of the mask M is projected onto the first shot region of the substrate P, and the first shot region is exposed with the exposure beam EL from the projection system PL. After the exposure of the first shot area is completed, the control device 7 moves the substrate P in the X-axis direction (or in the XY plane) with the immersion space formed in order to start the exposure of the next second shot area. (Stepping operation) that moves in the direction tilted with respect to the X-axis direction at (), the second shot area is moved to the exposure start position. Then, the control device 7 starts exposure of the second shot area. The control device 7 performs a scan exposure operation for exposing the shot area while moving the shot area in the Y-axis direction with respect to the projection area PR, and after the exposure of the shot area is completed, sets the next shot area to the exposure start position. A plurality of shot areas on the substrate P are sequentially exposed while repeating the stepping operation for moving to.

  FIG. 2 is a perspective view showing an example of the substrate stage 2 according to the present embodiment, and FIG. 3 is a plan view. 2 and 3, the substrate stage 2 includes a plurality of openings 31 and a ventilation path 33 in order to suppress pressure fluctuations in the first space 11. In this embodiment, the substrate stage 2 includes a first side surface 2A on the + Y side, a second side surface 2B on the -Y side, a third side surface 2C on the + X side, and a third side surface 2C on the -X side with respect to the center of the substrate stage 2. And a fourth side surface 2D. In the present embodiment, the opening 31 is disposed on each of the first, second, third, and fourth side surfaces 2A, 2B, 2C, and 2D. In the following description, each of the openings 31 arranged on the first, second, third, and fourth side surfaces 2A, 2B, 2C, and 2D is appropriately replaced with the first, second, third, and fourth openings 31A and 31B. , 31C, 31D.

  In the present embodiment, the first opening 31A is formed substantially at the center of the first side surface 2A. Similarly, each of the second to fourth openings 31B to 31D is formed at substantially the center of each of the second to fourth side surfaces 2B to 2D. In the present embodiment, the shapes and sizes of the first to fourth openings 31A to 31D are substantially the same.

  The substrate stage 2 is movable in the XY directions on the guide surface 27G. For example, when the substrate stage 2 moves in the + Y direction, the gas in the first space 11 flows into the first opening 31A formed on the + Y side of the substrate stage 2. The first opening 31A faces the space in front of the substrate stage 2 (+ Y side) in the Y-axis direction, and the gas in the first space 11 can be taken in as the substrate stage 2 moves in the + Y direction. it can. That is, when the substrate stage 2 moves in the + Y direction, the first opening 31A functions as an inlet for taking in gas.

  The ventilation path 33 is formed inside the substrate stage 2. The ventilation path 33 is formed so as to be connected to each of the first to fourth openings 31A to 31D. When the substrate stage 2 moves in the + Y direction, the air passage 33 guides the gas flowing in from the first opening 31A. The ventilation path 33 can guide the gas from the first opening 31A to at least one of the second to fourth openings 31B to 31D. Each of the second to fourth openings 31 </ b> B to 31 </ b> D can flow out of the first opening 31 </ b> A and discharge the gas guided by the ventilation path 33. That is, when the substrate stage 2 moves in the + Y direction, at least one of the second to fourth openings 31B to 31D is taken from the first opening 31A and the exhaust gas from which the gas guided to the air passage 33 is discharged. Acts as a mouth.

  In the present embodiment, the air flow path 33 is connected to the first opening 31A and is connected to the flow path 33A that guides the gas substantially in the Y-axis direction and the second opening 31B, and the flow that guides the gas substantially in the Y-axis direction. It includes a channel 33B, a flow path 33C that is connected to the third opening 31C and guides the gas substantially in the X-axis direction, and a flow path 33D that is connected to the fourth opening 31D and guides the gas substantially in the X-axis direction. In the present embodiment, the flow paths 33A and 33B and the flow paths 33C and 33D are substantially orthogonal. The widths of the flow paths 33A to 33D are substantially the same.

  At least a part of the air passage 33 is formed in the center of the substrate stage 2 inside the substrate stage 2. At least a part of the air passage 33 is disposed on the −Z side of the substrate holding part 2H. That is, at least a part of the air passage 33 is provided below the substrate holding part 2H. A portion where each of the flow paths 33 </ b> A to 33 </ b> D intersects is disposed at substantially the center of the substrate stage 2. In the following description, at least a part of the air passage 33 disposed substantially at the center of the substrate stage 2 is appropriately referred to as a center portion 33S.

  The flow paths 33A and 33B are formed by first and second guide portions 51 and 52 formed inside the substrate stage 2. The flow paths 33 </ b> C and 33 </ b> D are formed by third and fourth guide portions 53 and 54 formed inside the substrate stage 2. The first guide portion 51 guides the gas between the central portion 33S and the first opening 31A. The second guide part 52 guides the gas between the central part 33S and the second opening 31B. The third guide portion 53 guides the gas between the central portion 33S and the third opening 31C. The fourth guide portion 54 guides the gas between the central portion 33S and the fourth opening 31D. Further, in the present embodiment, the connecting portion 55 between the first guide portion 51 and the third and fourth guide portions 53 and 54 is a curved surface, and the second guide portion 52 and the third and fourth guide portions 53 and 54. The connecting portion 55 is a curved surface. Since the connection part 55 is a curved surface, gas can flow smoothly between each flow path 33A-33D.

  The second opening 31B formed on the −Y side of the substrate stage 2 faces the space behind (−Y side) the substrate stage 2 when the substrate stage 2 moves in the + Y direction. When the substrate stage 2 moves in the + Y direction, at least part of the gas that flows into the air passage 33 from the first opening 31A and flows through the flow path 33B is discharged from the second opening 31B.

  The third and fourth openings 31 </ b> C and 31 </ b> D are formed on the + X side and the −X side of the substrate stage 2. When the substrate stage 2 moves in the + Y direction, at least part of the gas that flows into the air passage 33 from the first opening 31A and flows through the flow paths 33C and 33D can be discharged from the third and fourth openings 31C and 31D. .

  Here, the case where the substrate stage 2 moves in the + Y direction has been described. For example, when the substrate stage 2 moves in the −Y direction, the second opening 31B functions as an inlet for taking in gas, and at least one of the first, third, and fourth openings 31A, 31C, and 31D is ventilated. It functions as an exhaust port through which the gas guided by the passage 33 is discharged. When the substrate stage 2 moves in the + X direction, the third opening 31C functions as an inlet for taking in gas, and at least one of the first, second, and fourth openings 31A, 31B, and 31D is vented. It functions as an exhaust port through which the gas guided by the passage 33 is discharged. When the substrate stage 2 moves in the −X direction, the fourth opening 31D functions as an inlet for taking in gas, and at least one of the first to third openings 31A to 31C is guided by the air passage 33. It functions as an exhaust port through which gas is exhausted.

  In the present embodiment, the substrate stage 2 includes first to fourth shutter devices 32A to 32D that can close the first to fourth openings 31A to 31D. As shown in FIG. 2, the first shutter device 32A includes at least one plate member 34 and a drive device 35 that can move the plate member 34 with respect to the first opening 31A. In the present embodiment, the first shutter device 32 </ b> A has two plate members 34. By arranging the plate member 34 in the first opening 31A by the driving device 35, the first opening 31A is closed. Further, when the plate member 34A is retracted from the first opening 31A by the driving device 35, the first opening 31A is opened. The second to fourth shutter devices 32B to 32D have the same configuration as the first shutter device 32A. A description of the second to fourth shutter devices 32B to 32D is omitted.

  In the present embodiment, the substrate stage 2 has an upper surface 2T that is disposed around the substrate holding part 2H and can face the terminal optical element 25 and the liquid immersion member 5. The upper surface 2T of the substrate stage 2 is flat and substantially parallel to the XY plane.

  The measurement stage 3 has a first side surface on the + Y side, a second side surface on the -Y side, a third side surface on the + X side, and a fourth side surface on the -X side. The opening 41 is disposed on each of the first to fourth side surfaces of the measurement stage 3. The opening 41 is formed at substantially the center of each of the first to fourth side surfaces of the measurement stage 3. An air passage 43 is formed inside the measurement stage 3 so as to be connected to each of the openings 41.

  In the present embodiment, like the plurality of openings 31 and the air passages 33 of the substrate stage 2, the plurality of openings 41 and the air passages 43 are provided in the measurement stage 3. A detailed description of the opening 41 and the air passage 43 formed in the measurement stage 3 is omitted. In the present embodiment, the measurement stage 3 is also provided with a shutter device that can close the opening 41. The shutter device provided on the measurement stage 3 and the shutter device provided on the substrate stage 2 have the same configuration. A detailed description of the shutter device provided on the measurement stage 3 will be omitted.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described.

  In order to start the exposure operation of the substrate P, the control device 7 moves the substrate stage 2 to the substrate replacement position, and uses the transfer system (not shown) to place the substrate stage 2 on the substrate replacement position. The substrate P before exposure is loaded. The measurement stage 3 is disposed at a position facing the last optical element 25 and the liquid immersion member 5, and an immersion space is formed with the liquid LQ between the last optical element 25 and the liquid immersion member 5 and the measurement stage 3. Is formed. The control device 7 performs a measurement operation using the measurement stage 3 as necessary.

  After the substrate P is loaded on the substrate stage 2, the control device 7 operates the drive system 20 so that the terminal optical element 25 and the liquid immersion member 5 and the measurement stage 3 face each other from the state in which the terminal optical element 25 and the measurement stage 3 face each other. The substrate stage 2 and the measurement stage 3 are moved so that the liquid immersion member 5 and the substrate stage 2 are changed to a facing state.

  In order to execute the exposure operation of the substrate P, the control device 7 forms an immersion space with the liquid LQ between the terminal optical element 25 and the immersion member 5 and the surface of the substrate P. The control device 7 sequentially exposes a plurality of shot areas on the substrate P via the projection system PL and the liquid LQ in the immersion space LS.

  After the exposure of the substrate P is completed, the control device 7 operates the drive system 20 to unload the exposed substrate P from the substrate stage 2, and the terminal optical element 25, the liquid immersion member 5, and the substrate stage. The substrate stage 2 and the measurement stage 3 are moved so that the terminal optical element 25 and the liquid immersion member 5 and the measurement stage 3 are opposed to each other. The control device 7 moves the substrate stage 2 to the substrate exchange position, and uses the transfer system (not shown) to unload the substrate P after exposure from the substrate stage 2 arranged at the substrate exchange position. . Thereafter, the control device 7 loads the substrate P before exposure onto the substrate stage 2 using the transport system. Thereafter, the same processing as described above is repeated.

  In the present embodiment, the control device 7 opens the first and second openings 31A and 31B as shown in FIG. 4 at least during the exposure of the substrate P. In the present embodiment, the control device 7 uses the third and fourth shutter devices 32C and 32D to close the third and fourth openings 31C and 31D. In the scan exposure operation of the substrate P, the substrate stage 2 moves in each of the + Y direction and the −Y direction. In other words, the substrate stage 2 moves so as to reciprocate in the Y-axis direction for exposure of a plurality of shot regions of the substrate P. For example, as shown in FIG. 4, when the substrate stage 2 moves in the + Y direction, gas flows into the ventilation path 33 from the first opening 31 </ b> A, and at least a part of the gas is guided to the ventilation path 33. And is discharged from the second opening 31B. On the other hand, when the substrate stage 2 moves in the −Y direction, a gas flows into the ventilation path 33 from the second opening 31B, and at least a part of the gas is guided by the ventilation path 33 and the first opening 31A. More discharged.

  In the present embodiment, when the substrate stage 2 moves in the + Y direction, the ventilation path 33 allows the gas in the space on the front side (+ Y side) of the substrate stage 2 to flow to the space on the rear side (−Y side). When the substrate stage 2 moves in the −Y direction, the gas in the space on the front side (−Y side) of the substrate stage 2 flows into the space on the rear side (+ Y side). That is, when the substrate stage 2 moves in the + Y direction, gas flows out from the space on the front side (+ Y side) of the substrate stage 2 through the first opening 31A, and the rear side ( -Y side) gas flows into the space. Further, when the substrate stage 2 moves in the −Y direction, gas flows out from the space on the front side (−Y side) of the substrate stage 2 through the second opening 31B, and the rear side through the first opening 31A. Gas flows into the (−Y side) space.

  In the present embodiment, an inlet 31A (31B) for taking in the gas, an air passage 33 for guiding the gas from the inlet 31A (31B), and the gas guided by the air passage 33 are discharged to the substrate stage 2. Since the exhaust port 31B (31A) is provided, the pressure fluctuation in the first space 11 can be suppressed. The pressure fluctuation in the first space 11 includes at least one of a change in pressure distribution in the first space 11 and a pressure fluctuation in each part in the first space 11.

  FIG. 5 is a diagram illustrating an example of the substrate stage 2J according to the comparative example. The substrate stage 2J shown in FIG. 5 is not provided with an intake port, an air passage, and an exhaust port. When such a substrate stage 2J moves in the substantially closed first space 11, for example, in the + Y direction, the pressure in the space on the front side (+ Y side) of the substrate stage 2J is excessive in the Y-axis direction. There is a possibility that a phenomenon occurs in which the pressure in the space on the rear side (−Y side) becomes excessively low due to the increase. As described above, when the substrate stage 2J moves in the first space 11, a pressure fluctuation in the first space 11 may occur.

  When the pressure variation in the first space 11 occurs, for example, the refractive index of the optical path of the measurement light of the second interferometer unit 4B for optically measuring the position of the substrate stage 2J varies, and the position of the substrate stage 2J is changed. Measurement accuracy may be reduced. As a result, there is a possibility that the movement performance of the substrate stage 2J is deteriorated and an exposure failure occurs or a defective device occurs.

  Further, although the first space 11 is substantially closed, there is a possibility that gas flows into the first space 11 from the external space (for example, the second space 12) due to the pressure fluctuation of the first space 11. is there. As described above, the control device 7 performs control so that the cleanness of the first space 11 is higher than the cleanness of the second space 12, and the gas in the second space 12 flows into the first space 11. In order to suppress this, the pressure in the first space 11 is controlled to be higher than the pressure in the second space 12, but the second fluctuation is caused by the pressure fluctuation in the first space 11 caused by the movement of the substrate stage 2J. There is a possibility that the gas in the space 12 flows into the first space 11. As a result, the cleanliness of the first space 11 is lowered, and there is a possibility that an exposure failure may occur or a defective device may occur.

  In the present embodiment, the substrate stage 2 is provided with the intake port 31A (31B), the air passage 33, and the exhaust port 31B (31A), so that even if the substrate stage 2 moves in the first space 11, The pressure fluctuation in the first space 11 can be suppressed. That is, in the present embodiment, since the opening 31 and the air passage 33 are provided in the substrate stage 2, it is possible to suppress pressure fluctuations in the space on the front side and the space on the rear side of the substrate stage 2. Therefore, the pressure difference between the space on the front side and the space on the rear side of the substrate stage 2 can be reduced. In the present embodiment, the air passage 33 guides the gas from the intake port 31A (31B) toward the exhaust port 31B (31A) so that the pressure fluctuation in the first space 11 is suppressed. The pressure fluctuation in the first space 11 can be suppressed. In the present embodiment, the air passage 33 has a predetermined shape, and no member that prevents the gas flow is disposed in the air passage 33. Therefore, the air passage 33 can guide the gas taken in from the intake port 31A (31B) to the exhaust port 31B (31A) so that the pressure fluctuation in the first space 11 is suppressed.

  Further, in the present embodiment, the intake 31A (31B) is formed substantially at the center of the side surface 2A (2B) facing the space in front of the substrate stage 2 in the Y-axis direction. Even when moving in the Y-axis direction, the gas can be satisfactorily introduced so that the pressure fluctuation in the first space 11 is suppressed.

  In the present embodiment, the movable element 2M of the planar motor is arranged on the substrate stage 2. The ventilation path 33 is disposed in the vicinity (upper part) of the mover 2M. That is, in the present embodiment, at least a part of the air passage 33 is provided between the substrate holding part 2H and the mover 2M. Therefore, the mover 2M can be cooled by the gas flowing through the ventilation path 33. Therefore, the substrate holder 2H is prevented from changing in temperature, deformed, or expanded or contracted by heat from the mover 2M.

  For example, when the substrate stage 2 moves in the + Y direction, the opening that is opened to discharge the gas flowing in from the first opening 31A is not limited to the second opening 31B. That is, at least one of the second opening 31B, the third opening 31C, and the fourth opening 31D can be opened in order to discharge the gas flowing in from the first opening 31A. That is, in the present embodiment, when the substrate stage 2 is moved, at least one of the opening facing the space on the front side of the substrate stage 2 and the other three openings can be opened. For example, as shown in FIG. 6, when the substrate stage 2 moves in the + Y direction, the control device 7 causes the first opening 31A on the front side (+ Y side) of the substrate stage 2 and the third opening 31C on the + X side. And the second and fourth shutter devices 32B and 32D can be used to close the second and fourth openings 31B and 31D. Also by doing so, pressure fluctuations in the first space 11 accompanying the movement of the substrate stage 2 can be suppressed.

  As shown in FIG. 6, the measurement light of the second interferometer unit 4 </ b> B is directed toward the substrate stage 2 on the measurement mirror 2 </ b> R on the −X side and the −Y side with respect to the center of the substrate stage 2. In this case, the control device 7 exhausts the second and fourth openings 31B and 31D close to the optical path of the measurement light using the shutter devices 32B and 32D to the optical path of the measurement light from the ventilation path 33. Supply of gas can be suppressed.

  Although the substrate stage 2 has been described here, the same applies to the measurement stage 3. That is, since the opening 41 and the air passage 43 are formed in the measurement stage 3, even if the measurement stage 3 moves in the first space 11, the pressure fluctuation in the first space 11 can be suppressed. it can. Further, the mover 3M and / or the measuring instrument C arranged on the measurement stage 3 can be cooled by the gas flowing through the ventilation path 43.

  As described above, according to the present embodiment, it is possible to suppress the occurrence of pressure fluctuations in the first space 11 due to the movement of the substrate stage 2 and the measurement stage 3. Therefore, it is possible to suppress the occurrence of defective exposure and the occurrence of defective devices due to the pressure fluctuation.

  In the present embodiment, the member (for example, the movable element 2) of the substrate stage 2 and the member of the measurement stage 3 (such as the movable element 3M and the measuring instrument C) are cooled by the gas flowing through the ventilation paths 33 and 43. be able to. For example, when the temperatures of the movable elements 2M and 3M of the substrate stage 2 and the measurement stage 3 rise, the movement performance of the substrate stage 2 and the measurement stage 3, for example, may deteriorate. Further, when the temperature of the mover 2M of the substrate stage 2 rises, there is a possibility that the substrate P held by the substrate holding part 2H is thermally deformed. Further, when the temperature of the measuring instrument C rises, the performance of the measuring instrument C may be reduced. When these inconveniences occur, exposure failure occurs, and as a result, a defective device may occur. In this embodiment, the air passage 33 is provided so that the predetermined member of the substrate stage 2 is cooled, and the air passage 43 is provided so that the predetermined member of the measurement stage 3 is cooled. Generation and generation of defective devices can be suppressed.

<Second Embodiment>
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 7 is a partially broken perspective view showing an example of the substrate stage 2E according to the second embodiment. As shown in FIG. 7, the substrate stage 2 includes a heat sink 70 disposed in the ventilation path 33. In the present embodiment, the heat sink 70 is disposed on the lower surface 33 </ b> U of the air passage 33 in order to cool the mover 2 </ b> M of the substrate stage 2. In the present embodiment, the heat sink 70 includes a plate member 71 disposed so as to contact the lower surface 33 </ b> U of the air passage 33, and a plurality of pins 72 disposed on the upper surface of the plate member 71. The heat sink 70 is made of, for example, aluminum or aluminum alloy. In the present embodiment, the mover 2M is effectively cooled by disposing the heat sink 70 in the ventilation path 33.

  In the present embodiment, one heat sink 70 is arranged in the approximate center of the substrate stage 2E on the XY plane, but the number and arrangement of the heat sinks are arbitrarily determined according to the position and / or number of objects to be cooled. be able to.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  The third embodiment is a modification of the second embodiment. FIG. 8 is a partial perspective view showing an example of the substrate stage 2F according to the third embodiment. As shown in FIG. 8, the substrate stage 2 </ b> F includes a heat sink 70 and a cooling fan 80 disposed on the heat sink 70. Each of the heat sink 70 and the cooling fan 80 is disposed in the air passage 33. The mover 2M is effectively cooled by using the heat sink 70 and the cooling fan 80 disposed in the air passage 33.

  The cooling fan 80 may be an electric fan or may be a fan that is rotated by gas passing through the air passage 33.

  In the present embodiment, one heat sink 70 and one cooling fan 80 are arranged at approximately the center of the substrate stage 2F on the XY plane. However, the number and arrangement of the heat sinks and cooling fans depend on the position of the cooling target and the cooling target. It can be arbitrarily determined according to the number. Even when the substrate stage 2F includes a plurality of heat sinks, it is not necessary to mount a cooling fan on all of them.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 9 is a side view showing an example of the measurement stage 3G according to the fourth embodiment. As shown in FIG. 9, the measurement stage 3 </ b> G includes a heat sink 70 </ b> G disposed in the ventilation path 43. In the present embodiment, the heat sink 70 </ b> G is disposed on the upper surface 43 </ b> T of the air passage 43 in order to cool the measuring instrument C of the measuring stage 3. The heat sink 70G includes a plate member 71G disposed so as to contact the upper surface 43T of the air passage 43, and a plurality of pins 72G disposed on the lower surface of the plate member 71G. The heat sink 70G is made of, for example, aluminum or an aluminum alloy. Using the heat sink 70G disposed in the air passage 43, the measuring instrument C is effectively cooled.

  Also in this embodiment, the number and arrangement of heat sinks can be arbitrarily determined according to the position and / or number of objects to be cooled.

  Further, the cooling fan 80 described with reference to FIG. 8 can be arranged on the heat sink 70G shown in FIG.

  In addition to the heat sink 70G or without the heat sink 70G, a heat sink may be disposed on the lower surface 43U of the air passage 43. Thereby, the mover 3M of the measurement stage 3 is effectively cooled using the heat sink. Also in this case, the cooling fan 80 described with reference to FIG. 8 can be disposed on the heat sink. In the first to fourth embodiments described above, the air passage is provided in both the substrate stage 2 and the measurement stage 3, but the air passage may be provided in only one of them. For example, when the pressure fluctuation generated in the first space 11 due to the movement of the measurement stage 3 is small, a ventilation path may be provided only in the substrate stage 2.

  In the first to fourth embodiments described above, the shutter device is disposed in each of the plurality of openings of the stage (the substrate stage 2 and / or the measurement stage 3), but the shutter device may be omitted. Or you may provide a shutter apparatus only in some of the some opening provided in the stage (the substrate stage 2 and / or the measurement stage 3).

  In the first to fourth embodiments described above, one opening is provided on each of the four side surfaces of the stage (substrate stage 2 and / or measurement stage 3), and the position and / or number of openings on each side surface. Can be determined arbitrarily. In this case, the number of openings of the substrate stage 2 and the number of openings of the measurement stage 3 may be different.

  In the first to fourth embodiments described above, openings are provided on the four side surfaces of the stage (substrate stage 2 and / or measurement stage 3), but the stage (substrate stage 2 and / or measurement) is provided. It suffices to provide at least one opening on at least two side surfaces of the stage 3). For example, when the pressure fluctuation in the first space 11 due to the movement of the stage (substrate stage 2 and / or measurement stage 3) in the Y direction is large, the stage (substrate stage 2 and / or measurement stage 3) The openings may be provided only on one side and the other side in the Y direction. Also in this case, the number of openings of the substrate stage 2 and the number of openings of the measurement stage 3 may be different.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 9 is a perspective view showing an example of the substrate stage 2K according to the fifth embodiment. In FIG. 9, the substrate stage 2 </ b> K includes a ventilation path 33 </ b> K for flowing the gas in the space on the front side of the substrate stage 2 to the space on the rear side of the substrate stage 2 </ b> K when moving in a predetermined direction in the XY plane. ing. In the present embodiment, the air passage 33K includes a recess formed in each of the first to fourth side surfaces 2A to 2D. Also in the present embodiment, the pressure passage in the first space 11 accompanying the movement of the substrate stage 2 can be suppressed by the ventilation path 33K.

  In the present embodiment, the air passage 33K is formed in each of the first to fourth side surfaces 2A to 2D of the substrate stage 2K, but one of the first to fourth side surfaces 2A to 2D, or Only two or three ventilation paths 33K may be provided.

  In the present embodiment, at least one heat sink 70K is disposed on the lower surface of the air passage 33K. In the present embodiment, one heat sink 70K is disposed in the vicinity of each of the four side surfaces 2A to 2D of the substrate stage 2K. The mover 2M of the substrate stage 2K is cooled using the heat sink 70K. A cooling fan can be arranged on the heat sink 70K as shown in FIG.

  In the present embodiment, a recess can be formed on at least one of the four side surfaces of the measurement stage, and an air passage can be provided in the measurement stage in the same manner as the substrate stage 2K.

  An air passage is formed in one of the substrate stage and the measurement stage as in the first to fourth embodiments, and an air passage is provided in at least one of the four side surfaces of the other stage as in the fifth embodiment. You may provide the recessed part which functions as.

  In each of the above embodiments, the case where the substrate stage 2 and the measurement stage 3 are arranged one by one has been described as an example. However, at least one of the substrate stage 2 and the measurement stage 3 is arranged two or more. May be. Further, the exposure apparatus EX may not include the measurement stage 3. In this case, the measuring instrument C may be mounted on the substrate stage 2.

  In each of the above-described embodiments, the first space 11, the second space 12, and the third space 13 are defined as three partial spaces in the space formed by the chamber device 6. The number and arrangement of the subspaces in the space formed by 6 can be arbitrarily determined. There may be no partial space in the space formed by the chamber device 6.

  In the first to fifth embodiments described above, the optical path on the exit side (image plane side) of the terminal optical element 25 of the projection system PL is filled with the liquid LQ. For example, International Publication No. 2004/019128 As disclosed in the pamphlet, a projection system in which the optical path on the incident side (object plane side) of the last optical element 25 is also filled with the liquid LQ can be employed.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection system with the first pattern and the substrate P substantially stationary, the second pattern and In a state where the substrate P is substantially stationary, the reduced image of the second pattern may be overlapped with the first pattern using the projection system and may be collectively exposed on the substrate P (stitch-type batch exposure apparatus). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, for example, as disclosed in the corresponding US Pat. No. 6,611,316, two mask patterns are synthesized on the substrate via a projection system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a multistage exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to. Three or more substrate stages can be arranged.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure beam EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the embodiments described above, the exposure apparatus provided with the projection system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection system PL. Even when the projection system PL is not used in this way, the exposure beam is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. Is done.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 11, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with an exposure beam using a pattern of a mask and developing the exposed substrate according to the above-described embodiment, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 2A-2D ... Side surface, 2M ... Movable element, 3 ... Measurement stage, 3M ... Movable element, 4 ... Interferometer system, 5 ... Liquid immersion member, 7 ... Control apparatus, 11 ... 1st space, 20 DESCRIPTION OF SYMBOLS ... Drive system, 25 ... Terminal optical element, 27 ... 3rd surface plate, 27G ... Guide surface, 31A-31D ... Opening, 32A-32D ... Shutter apparatus, 33 ... Air passage, 70 ... Heat sink, 80 ... Cooling fan, C ... Measuring instrument, EL ... Exposure beam, EX ... Exposure apparatus, LQ ... Liquid, LS ... Immersion space, P ... Substrate, PL ... Projection system

Claims (36)

A movable member movable in a predetermined direction;
In the predetermined direction, facing the space in front of the moving member, formed on the first side of the moving member, and an intake for taking in gas,
An air passage formed inside the moving member for guiding gas from the intake;
A stage device comprising: a first exhaust port that is formed in the moving member and from which the gas guided by the air passage is exhausted.   The stage device according to claim 1, wherein the first exhaust port is formed on a second side of the moving member facing a space behind the moving member in the predetermined direction. A second exhaust port formed on a third side of the moving member, different from the first side and the second side;
The stage device according to claim 2, wherein the air passage is capable of guiding at least a part of the gas from the intake port to the second exhaust port. The moving member has a second side facing a space behind the moving member in the predetermined direction, and a third side different from the first side and the second side,
The stage apparatus according to claim 1, wherein the first exhaust port is formed on the third side.   The stage device according to any one of claims 1 to 4, wherein the moving member moves in a substantially closed space.   The stage device according to claim 5, wherein the air passage guides the pressure fluctuation in the space to be suppressed.   The stage apparatus as described in any one of Claims 1-6 provided with the heat sink arrange | positioned at the said ventilation path.   The stage apparatus according to claim 7, further comprising a cooling fan disposed on the heat sink. A flat motor for moving the moving member;
A movable element of the planar motor is disposed on the moving member;
The stage apparatus according to claim 7 or 8, wherein the movable element is cooled using the heat sink.   The stage apparatus as described in any one of Claims 1-9 provided with the shutter apparatus which can close a said 1st exhaust port. The moving member has a holding part for holding an object,
The stage apparatus according to claim 1, wherein at least a part of the ventilation path is provided below the holding portion.   The stage device according to any one of claims 1 to 11, wherein at least a part of the air passage is formed substantially at the center of the moving member. The moving member has a first surface on the first side,
The stage apparatus according to any one of claims 1 to 12, wherein the intake port is formed substantially at the center of the first surface. The moving member has a second surface on the second side,
The stage apparatus according to claim 2 or 3, wherein the first exhaust port is formed at a substantially center of the second surface. A moving member that moves on a predetermined surface of the base member;
A heat sink disposed on at least a portion of the moving member;
And a cooling fan disposed on the heat sink. An inlet formed in the moving member for taking in gas;
An air passage formed inside the moving member and through which gas from the intake port flows,
The stage apparatus according to claim 15, wherein the heat sink and the cooling fan are disposed in the air passage.   The stage apparatus according to claim 16, further comprising an exhaust port that is formed in the moving member and exhausts the gas that has flowed through the ventilation path.   The stage device according to any one of claims 15 to 17, wherein a member disposed on the moving member is cooled using the heat sink and the cooling fan. A planar motor for moving the moving member;
The stage device according to claim 18, wherein the member disposed on the moving member includes a mover of the planar motor. The moving member has a holding part for holding an object,
The stage apparatus according to claim 19, wherein the heat sink and the cooling fan are disposed between the holding unit and the movable element. The moving member has a holding part for holding an object,
The stage device according to any one of claims 15 to 19, wherein the heat sink and the cooling fan are disposed below the holding portion. An exposure apparatus that exposes a substrate with an exposure beam,
An exposure apparatus comprising the stage apparatus according to any one of claims 1 to 21. An exposure apparatus that exposes a substrate with an exposure beam from a projection system,
A substantially closed space containing the optical path on the image plane side of the projection system;
A movable member movable in the space;
An exposure apparatus comprising: a suppressing device that suppresses pressure fluctuations in a space on the front side of the moving member and in a space on the rear side of the moving member when the moving member moves in a predetermined direction.   24. The exposure apparatus according to claim 23, wherein the suppression device causes gas to flow out of the space on the front side.   The exposure apparatus according to claim 23 or 24, wherein the suppression device causes a gas to flow into the space on the rear side.   26. The exposure apparatus according to any one of claims 23 to 25, wherein the suppressing device includes an air passage formed inside the moving member and allowing a gas in the front space to flow to the space on the rear side. The moving member has a holding unit for holding an object, and is movable below the projection system;
27. The exposure apparatus according to claim 26, wherein at least a part of the ventilation path is provided below the holding portion. The moving member faces the space on the front side, and an intake port for taking in gas from the space on the front side,
An exhaust port that faces the space behind the moving member in the predetermined direction and exhausts the gas taken in from the intake port; and
28. The exposure apparatus according to claim 27, wherein the air passage guides the gas taken in from the intake port to the first exhaust port.   The exposure apparatus according to claim 28, further comprising a shutter device capable of closing the exhaust port.   The exposure apparatus according to any one of claims 26 to 29, further comprising a heat sink disposed in the air passage.   31. The exposure apparatus according to claim 30, further comprising a cooling fan disposed on the heat sink. A flat motor for moving the moving member;
A movable element of the planar motor is disposed on the moving member;
32. The exposure apparatus according to claim 30, wherein the movable element is cooled using the heat sink.   The exposure apparatus according to any one of claims 22 to 32, wherein the moving member is movable to an irradiation position of the exposure beam.   34. The exposure apparatus according to any one of claims 22 to 33, wherein the moving member holds the substrate.   The exposure apparatus according to any one of claims 22 to 34, wherein the moving member is equipped with a measuring instrument that measures the exposure beam. Exposing the substrate using the exposure apparatus according to any one of claims 22 to 35;
Developing the exposed substrate; and a device manufacturing method.

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