JP2010021199A - Substrate processing apparatus, holding member and substrate processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a processing liquid supplied to a substrate to be processed from flowing into the lower surface of a turntable, thereby rotating the substrate to be processed at a low speed and processing it. <P>SOLUTION: Substrate processing apparatuses 10a, 10b process substrates to be processed. The substrate processing apparatuses 10a, 10b are each provided with: a turntable freely rotatably provided; a holding member 50 shakably provided on the turntable and holding a substrate to be processed when one end is shaking upward; a rotation driving mechanism 60 for rotating the turntable when the holding member 50 holds a substrate to be processed; and a sealing member disposed between the turntable and the holding member 50. The sealing member seals between the turntable and the holding member 50 when the one end of the holding member is shaking upward. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for performing a predetermined process on a substrate to be processed while rotating the substrate to be processed, and a holding member used in such a substrate processing apparatus.

Conventionally, as shown in FIG. 7, while rotating a semiconductor wafer W (hereinafter also referred to as a wafer W), which is a substrate to be processed, by rotating the turntable 30, a rotation process for performing a predetermined process on the wafer W is performed. An apparatus (substrate processing apparatus) is known. Such rotary apparatus (substrate processing apparatus), and retention turntable 30 which is rotated by the rotation driving source, the rotating together with the turntable 30, and the peripheral edge portion W _E of the wafer W above the turntable 30 The holding member 50 includes a free holding member 50 and a pressurizing member that is disposed below the turntable 30 and is driven in the vertical direction by a drive mechanism. The holding member 50 is located with respect to the turntable 30 about the swing shaft 50a. The holding member 50 is provided with a holding portion 51 at one end thereof, and a pressed portion 52 is provided at the other end thereof, and the holding portion 51 of the holding member 50 is placed at the center of the turntable 30. The rotation processing device is configured such that an elastic member 56 to be urged is provided on the turntable 30 and the pressurized portion 52 can be pressed in a direction opposite to the urging direction of the elastic member 56 by the pressure member. (Substrate processing apparatus) is known (Patent Document 1). reference).
JP-A-10-209254

However, in the conventional substrate processing apparatus, when using a slower rotational far of the turntable 30, the peripheral edge portion W _E of the wafer W, the centrifugal force of only shaken off the processing liquid on the wafer W is not generated, the turntable 30 Due to the capillary phenomenon that occurs in the gap S between the holding member 50 and the holding member 50, the processing liquid may flow from the gap S to the lower surface of the turntable 30 through the holding member 50.

  Then, when the processing liquid flows into the lower surface of the turntable 30 in this way, the holding member 50 and the lower part of the turntable 30 become dirty, and when processing using different processing liquids is performed quickly, The processing liquids are mixed and the processing liquid is crystallized, and the inside of the substrate processing apparatus becomes dirty.

For this reason, in the conventional substrate processing apparatus, the wafer W has to be rotated at a high speed (for example, about 1000 rpm). However, by rotating the wafer W at such a high speed, for example, there are the following disadvantages: Will occur. First, the airflow in the substrate processing apparatus is disturbed. Further, the processing liquid adhering to the wafer W is scattered in the substrate processing apparatus, and the inside of the substrate processing apparatus becomes dirty. Further, since the heat exchange at the periphery W _E of the wafer W is increased, the central portion of the wafer W and the peripheral portion W _E becomes the etching rate nonuniform, it is impossible to precisely process the wafer W .

  The present invention has been made in consideration of such points, and the processing liquid supplied to the substrate to be processed can be prevented from flowing into the lower surface of the turntable, and thus the substrate to be processed at a low speed. An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of processing by rotating the substrate, and a holding member used in such a substrate processing apparatus.

A substrate processing apparatus according to the present invention comprises:
In a substrate processing apparatus for processing a substrate to be processed,
A turntable provided rotatably,
A holding member that is swingably provided on the turntable and holds the substrate to be processed when one end is swung upward;
A rotation drive mechanism for rotating the turntable when the holding member holds the substrate to be processed;
A seal member disposed between the turntable and the holding member,
The seal member seals between the rotary base and the holding member when one end of the holding member swings upward.

  With such a configuration, the processing liquid supplied to the substrate to be processed can be prevented from flowing into the lower surface of the turntable, and thus the substrate to be processed can be rotated and processed at a low speed.

In the substrate processing apparatus according to the present invention,
The rotating table is provided with an opening through which the holding member passes when one end of the holding member is swung upward.
It is preferable that the seal member is disposed so as to surround the outer periphery of the opening.

  With such a configuration, the processing liquid can be easily and reliably prevented from flowing into the lower surface of the turntable.

In the substrate processing apparatus according to the present invention,
The seal member is preferably provided on the lower surface of the turntable.

In the substrate processing apparatus according to the present invention,
The seal member is preferably provided on one end side of the holding member.

In the substrate processing apparatus according to the present invention,
It is preferable that the apparatus further includes a back side processing liquid supply unit that supplies a processing liquid to the back surface of the substrate to be processed held by the holding member.

  With such a configuration, the processing liquid is supplied to the back surface of the substrate to be processed, but the processing liquid supplied to the back surface of the substrate to be processed does not flow into the bottom surface of the turntable.

In the substrate processing apparatus according to the present invention,
The seal member is preferably made of an O-ring.

The holding member according to the present invention is:
It is a holding member that is swingably provided on a turntable that is rotatably provided,
A seal member provided between the rotary table and
The substrate to be processed is held when one end is swung upward, and the space between the rotary table is sealed by the seal member.

  With such a configuration, the processing liquid can be prevented from flowing into the lower surface of the turntable.

The substrate processing method according to the present invention comprises:
In a substrate processing method for processing a substrate to be processed,
A substrate processing method using a substrate processing apparatus comprising: a turntable; a holding member swingably provided on the turntable; and a seal member disposed between the turntable and the holding member. And
A holding step in which one end of the holding member swings upward to hold the substrate to be processed;
A rotation step of rotating the turntable when the holding member holds the substrate to be processed, and
In the holding step, the seal member seals between the turntable and the holding member,
The rotation process rotates the turntable at a speed of 100 rpm or less.

  By such a method, it is possible to prevent the processing liquid supplied to the substrate to be processed from flowing into the lower surface of the turntable, and to perform processing by rotating the substrate to be processed at a low speed.

  According to the present invention, since the seal member seals between the turntable and the holding member when one end of the holding member swings upward, the processing liquid supplied to the substrate to be processed is It can prevent flowing into the lower surface of the turntable. Furthermore, since the processing liquid can be prevented from flowing into the lower surface of the turntable in this manner, the substrate to be processed can be rotated and processed at a low speed.

BEST MODE FOR CARRYING OUT THE INVENTION

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a cleaning processing system having a substrate processing apparatus for cleaning a semiconductor wafer W (hereinafter also referred to as a wafer W), which is a substrate to be processed, according to the present invention will be described with reference to the drawings. . Here, FIG. 1 to FIG. 5 are diagrams showing an embodiment of the present invention.

  As shown in FIG. 1, the cleaning processing system cleans a wafer W and thermally processes the cleaned wafer W, and carries the wafer W into the cleaning processing unit 2. , And a loading / unloading section 3 for unloading the wafer W from the cleaning processing section 2. FIG. 1 is a plan view of the cleaning system according to this embodiment as viewed from above.

  As shown in FIG. 1, the loading / unloading unit 3 transfers the wafer W to the cleaning processing unit 2 from the in / out port 4 on which the wafer W is placed, and the cleaning processing unit 2. And a wafer transfer unit 5 that delivers the wafer W to the in / out port 4.

  Among these, the in / out port 4 includes a carrier (container) C that accommodates a plurality of wafers W substantially horizontally at a predetermined interval, and a mounting table 6 for mounting the carrier, as shown in FIG. And have. On the mounting table 6, a plurality (three in FIG. 1) of carriers C can be placed on a horizontal plane and placed at predetermined positions.

  As shown in FIG. 1, the wafer transfer unit 5 includes a wafer transfer device 7 that transfers the wafer W between the carrier C mounted on the mounting table 6 and the cleaning processing unit 2. The wafer transfer device 7 accesses all the carriers C placed on the placing table 6, and also accesses a wafer transfer unit 8 (described later) disposed in the cleaning processing unit 2, so that an in / out port is provided. The wafer W is transferred from the 4 side to the cleaning processing unit 2 side, and conversely from the cleaning processing unit 2 side to the in / out port 4 side.

  As shown in FIG. 1, the cleaning processing unit 2 includes a main wafer transfer device 15 that transfers the wafer W, a wafer transfer unit 8 that temporarily places the wafer W, and a substrate processing apparatus that cleans the wafer W. 10a and 10b, and a heating / cooling unit 12 that heats and cools the wafer W after being cleaned by the substrate processing apparatuses 10a and 10b. The heating / cooling unit 12 includes a heating unit (not shown) that heats the wafer W and a cooling unit (not shown) that cools the wafer W heated by the heating unit. The main wafer transfer device 15 is accessible to all of the wafer transfer unit 8, the substrate processing apparatuses 10a and 10b, and the heating / cooling unit 12.

  Further, as shown in FIG. 2, the substrate processing apparatuses 10 a and 10 b are rotatable inside the casing 21, a substantially cylindrical cup 22 disposed in the casing 21 and having an upper surface opened, and the cup 22. A rotary table (rotary table) 30 provided in the cylinder, and a cylindrical rotary shaft 31 (having a hollow portion 31a) that extends vertically downward from the center of the rotary table 30 and has a hollow structure (having a hollow portion 31a). 3).

Further, as shown in FIG. 5B, a holding member 50 is provided on the protrusion 33 protruding downward from the rotary table 30 so as to be swingable about the swing shaft 50a. Then, the holding member 50 protrudes provided at one end of the outer side on the upper side, a peripheral edge portion W _E of the wafer W (see the solid line in FIG. 5 (b)) when it is swung upward A holding part 51 to hold, a pressurized part 52 provided at the other end on the inner side and projecting downward, and a holding body 50b extending between the holding part 51 and the pressurized part 52; have. In the present embodiment, the three holding members 50 are arranged along the rotation direction of the turntable 30 (see FIG. 4).

  Further, as shown in FIG. 5B, the holding member 50 has a concave locking portion 53 between the swing shaft 50 a and the pressed portion 52. And between this latching | locking part 53 and the predetermined position of the lower surface of the turntable 30, the spring etc. which give the elastic force which pushes down the other end side of the holding member 50, ie, the to-be-pressurized part 52 side, etc. The elastic member 56 is disposed. For this reason, in the normal state, one end portion side of the holding member 50, that is, the holding portion 51 side is urged upward.

  As shown in FIG. 5B, the swing shaft 50a is provided on the holding main body 50b and between the holding portion 51 and the locking portion 53 (in this embodiment, the swinging shaft 50a is The ratio of the distance between the moving shaft 50a and the locking portion 53 and the distance between the swing shaft 50a and the holding portion 51 is about 2: 1).

  Further, in the cup 22, on the lower side of the pressed part 52 of each holding member 50, the pressurized part 52 is moved upward by pressing the pressurized part 52 from the lower side. A pressurizing mechanism (not shown) for swinging the holding member 50 about the swing shaft 50a is disposed. The pressurizing mechanism includes a contact member that can come into contact with the pressurized portion 52, and a vertical drive mechanism that moves the contact member in the vertical direction.

  As shown in FIG. 3, a circular hole 30 a communicating with the hollow portion 31 a of the rotating shaft 31 is formed at the center of the rotary table 30. Further, in the hollow portion 31a of the rotating shaft 31, a lifting member 35 that is movable in the vertical direction within the hollow portion 31a is disposed. Further, on the upper surface of the elevating member 35, support pins 35a for instructing the wafer W at the delivery position (upper position) are provided.

  Further, as shown in FIG. 3, the back surface of the wafer W held by the holding member 50 is supplied to the elevating member 35 from the processing liquid supply unit (not shown) through the back surface side supply path 36 a. A back surface side liquid supply port 36 for supplying to is provided. In addition, an inert gas (for example, nitrogen gas) supplied from an inert gas supply unit (not shown) is discharged from the hollow portion 31a. In addition, the back surface side process liquid supply part is comprised by the back surface side liquid supply port 36, the back surface side supply path 36a, and the process liquid supply part.

Further, as shown in FIG. 2, above the turntable 30, the surface side that supplies the processing liquid supplied from the processing liquid supply unit (not shown) to the surface of the wafer W held by the holding member 50. A liquid surface side liquid supply nozzle 40 is provided. The surface side liquid surface liquid supply nozzle 40, from the center W _C of the wafer W over the periphery W _E, can be moved.

  As shown in FIGS. 4 and 5A and 5B, the rotary table 30 has a holding member 50 when the one end (holding portion 51) of the holding member 50 is swung upward. An opening 30p is provided. When one end of the holding member 50 swings upward, the holding unit 51 protrudes above the rotary table 30, and the wafer W held by the holding unit 51 floats from the rotary table 30. (See FIG. 5B).

  4 and 5A and 5B, an O-ring (seal member) 55 is provided on the lower surface of the turntable 30 so as to surround the outer periphery of the opening 30p. When one end of the holding member 50 swings upward, the O-ring 55 seals between the rotary table 30 and the holding member 50.

  In the present embodiment, a description will be given using a mode in which the O-ring 55 is provided on the lower surface of the turntable 30, but the present invention is not limited to this, and the O-ring 55 is provided on one end side of the holding member 50. Etc. may be provided (see FIG. 6).

  As shown in FIG. 2, the rotary shaft 31 is connected to a rotary drive mechanism 60 having a motor M that rotates the rotary table 30 by rotating the rotary shaft 31.

  Next, the function and effect of the present embodiment having such a configuration will be described.

  First, the wafer W taken out from the carrier C is temporarily placed on the wafer delivery unit 8 by the wafer transfer device 7 (see FIG. 1).

  Next, the wafer W placed on the wafer delivery unit 8 is carried into the housing 21 from the entrance (not shown) by the main wafer transfer device 15 (see FIG. 2). At this time, the elevating member 35 is positioned at the delivery position (upper position), and the wafer W is delivered onto the support pins 35 a of the elevating member 35. Thereafter, the main wafer transfer device 15 is retracted from the housing 21.

Next, at the same time when the elevating member 35 is lowered, the pressure member (not shown) of the pressure mechanism (not shown) is lowered. When the pressure member is lowered in this way, the pressure applied to the pressurized portion 52 by the pressure member is released, and the holding portion 51 of the holding member 50 is oscillated by the urging force applied from the elastic member 56. Is pivoted upward (from the dotted line to the solid line in FIG. 5B). Then, as indicated by the solid line in FIG. 5 (b), the holding portion 51, the peripheral edge portion W _E of the wafer W is held (holding step).

  At this time, the O-ring 55 provided on the lower surface of the rotary table 30 is pressed by the pressing force applied from one end of the holding member 50 (the urging force of the elastic member 56). The space is sealed.

  Here, in the present embodiment, the portion of the holding member 50 that contacts the O-ring 55 and the swing shaft 50a are separated to some extent (the swing shaft 50a and the locking portion 53). The ratio between the distance between the swinging shaft 50a and the distance between the holding portion 51 is about 2: 1), so that the distance between the action point and the fulcrum in the lever principle can be separated. it can. For this reason, a strong force resulting from the biasing force of the elastic member 56 can be applied to the portion of the holding member 50 that contacts the O-ring 55. In the prior art, as shown in FIG. 7, the swing shaft 50a is positioned below the holding portion 51, and the distance between the holding portion 51 and the swing shaft 50a is close, so this embodiment A strong biasing force cannot be applied to the holding portion 51 as in the form.

As described above, when the peripheral edge portion W _E of the wafer W is held by the holding unit 51, by the motor M of the rotation drive mechanism 60, the rotation shaft 31 is rotated (see Figure 2). Along with this, the rotary table 30 is driven to rotate, and the wafer W held by the holding member 50 is also rotated (rotating step). The following steps are performed while the wafer W is rotated in this way.

Next, a processing liquid composed of a chemical liquid, a rinsing liquid, a drying liquid, and the like is supplied from the surface side liquid supply nozzle 40 to the surface of the wafer W, and the surface of the wafer W is subjected to a predetermined cleaning process. The thus treated liquid supplied toward the surface of the wafer W, the surface of the wafer W, flow toward the periphery W _E of the wafer W. The drying liquid supplied in the drying process for drying the wafer W is made of a hydrophobic liquid such as IPA (isopropyl alcohol).

Further, as described above, when the processing liquid is supplied from the front surface side liquid supply nozzle 40, the back surface side liquid supply port 36 formed in the elevating member 35 in the rotating shaft 31 is directed toward the back surface of the wafer W. Treatment liquid is supplied. The thus treated liquid supplied toward the rear surface of the wafer W is between the rear surface of the wafer W and the rotary table 30, it flows towards the periphery W _E of the wafer W. In the drying process of drying the wafer W, the processing liquid is not supplied from the back surface side liquid supply port 36, and an inert gas (for example, nitrogen) supplied from an inert gas supply part (not shown) from the hollow part 31a. Gas) is discharged.

  In this way, while the front and back surfaces of the wafer W are being processed by the processing liquid, the rotation speed of the wafer W can be freely changed from a low speed to a high speed according to the processing content.

Processing liquid supplied to the wafer W by centrifugal force wafer W is generated by a rotating flows toward the peripheral edge portion W _E of the wafer W, but if the wafer W is rotated by the following low speed 100rpm the can not generate a centrifugal force of only shaken off the processing liquid from the periphery W _E into the cup 22. For this reason, the processing liquid supplied to the wafer W tends to enter the lower surface of the turntable 30 through the gap S between the turntable 30 and the holding member 50 by capillary action (see FIG. 5B).

However, according to the present embodiment, the space between the rotary table 30 and the holding member 50 is sealed by the O-ring 55 (see FIG. 5B). Therefore, even when the process by rotating the wafer W with the following low speed 100 rpm, the processing liquid supplied to the wafer W, without flowing into the underside of the rotary table 30, from the periphery W _E of the wafer W The liquid is drained to the cup 22.

  As a result, each processing solution can be surely drained from the rotary table 30 to the cup 22 even in a place where different types of processing solutions are used continuously, so that each processing solution is mixed. There is no. Therefore, it is possible to prevent the crystal of the processing liquid from being generated, and consequently, it is possible to prevent the cup 22 and the like from becoming dirty.

  Further, in the present embodiment, the turntable 30 is configured to be larger than the size of the wafer W, and an opening 30p for allowing the holding member 50 to pass therethrough is provided on the lower surface of the turntable 30 (FIGS. 4 and 5). (See (a) and (b)). For this reason, it is possible to reliably prevent the processing liquid supplied to the wafer W from flowing into the lower surface of the turntable 30 only by providing the O-ring 55 so as to surround only the outer periphery of the opening 30p. .

  As described above, since the space between the rotary table 30 and the holding member 50 is sealed by the O-ring 55, the processing liquid supplied from the back surface side liquid supply port 36 toward the back surface of the wafer W is used. However, it does not flow into the lower surface of the rotary table 30.

  As described above, according to the present embodiment, even when the wafer W is rotated and processed at a low speed of 100 rpm or less, the processing liquid supplied to the wafer W flows into the lower surface of the turntable 30. Can be prevented. For this reason, the wafer W can be processed at a low-speed rotation that could not be performed conventionally.

  That is, conventionally, when the wafer W is rotated at a low speed, the processing liquid supplied to the wafer W flows into the lower surface of the rotary table 30 from the gap S between the rotary table 30 and the holding member 50, so that high speed (for example, , About 1000 rpm), it was necessary to rotate the wafer W. On the other hand, in this embodiment, since the space between the rotary table 30 and the holding member 50 is sealed by the O-ring 55 (see FIG. 5B), the wafer W is rotated at a low speed of 100 rpm or less. However, the processing liquid supplied to the wafer W does not flow into the lower surface of the turntable 30 from the gap S between the turntable 30 and the holding member 50. For this reason, the wafer W can be processed at a low-speed rotation that could not be performed conventionally.

  As a result, according to the present embodiment, the following effects can be achieved due to the fact that the wafer W can be rotated at a low speed of 100 rpm or less.

  That is, first, it is possible to prevent the airflow in the cup 22 from being disturbed.

  In addition, it is possible to prevent the processing liquid adhering to the wafer W from being scattered to the cup 22 and to prevent the cup 22 and the like from becoming dirty.

  Further, since the processing liquid supplied to the wafer W can be prevented from being scattered in this way, the processing liquid can be kept on the wafer W for a certain period of time to process the wafer W. For this reason, compared with the conventional substrate processing apparatus, the wafer W can be processed with a small amount of processing liquid, and the amount of processing liquid used can be reduced.

  Further, when a volatile chemical solution (for example, an ammonia fluoride solution) is used as the processing solution, when the wafer W is rotated at a high speed as in the conventional technique, the amount of the processing solution attached to the wafer W evaporates. It will increase. For this reason, the concentration change of the processing liquid due to evaporation becomes large when the chemical liquid is collected and reused. In this regard, according to the present embodiment, since the wafer W can be rotated at a low speed of 100 rpm or less, even when such a volatile chemical solution is used as the processing solution, the evaporation of the processing solution is reduced. can do. For this reason, the change in the concentration of the processing liquid due to evaporation can be reduced, and the wafer W can be processed with high accuracy.

Furthermore, the center by treating the wafer W at low speed, also it is possible to prevent the heat exchanger becomes larger in the periphery W _E of the faster becomes the wafer W speed, temperature of the processing liquid adhering to the wafer W is it is possible to prevent the large difference between the parts W _C and the peripheral portion W _E. Accordingly, between the central portion W _C and the peripheral portion W _E of the wafer W can be made uniform etching rate, a wafer W can be precisely processed.

  Further, according to the present embodiment, since the wafer W can be processed at such a low speed, the processing of the wafer W at a high speed and the processing of the wafer W at a low speed can be appropriately combined. For example, while supplying the rinse liquid to the wafer W, the wafer W can be repeatedly rotated at a low speed and a high speed. As a result, various processing recipes can be assembled as compared with the conventional substrate processing apparatus.

  When the processing of the wafer W with the processing liquid as described above is completed, the motor M of the rotation drive mechanism 60 is stopped, and the rotation of the wafer W held by the holding member 50 is also stopped (see FIG. 2).

Next, at the same time that the elevating member 35 is raised, the pressure member of the pressure mechanism is raised. As the pressure member rises in this way, the pressurized portion 52 is brought into contact with the pressure member and then pressurized, and the holding portion 51 of the holding member 50 moves downward about the swing shaft 50a. (to the dotted line from the solid line in FIG. 5 (b)) is swung, the peripheral edge portion W _E of the wafer W is released from the holding portion 51. Thereafter, the back surface of the wafer W is supported by the support pins 35a of the elevating member 35, and the elevating member 35 continues to rise, so that the elevating member 35 is positioned at the delivery position (upper position).

  Next, the wafer W supported by the support pins 35 a of the elevating member 35 is unloaded from the entrance / exit (not shown) by the main wafer transfer device 15 and is loaded into the heating / cooling unit 12. (See FIGS. 1 and 2).

  Next, the wafer W cleaned by the substrate processing apparatuses 10a and 10b is heated by the heating / cooling unit 12 and then cooled (see FIG. 1).

  Next, the main wafer transfer device 15 unloads the wafer W from the heating / cooling unit 12 and temporarily places it on the wafer delivery unit 8 (see FIG. 1). Thereafter, the processed wafer W is carried into and stored in the carrier C by the wafer transfer device 7 (see FIG. 1), and the processing of one wafer W is completed.

  By the way, in the present embodiment, the description has been given using the substantially circular wafer W as the substrate to be processed. However, the present invention is not limited to this. For example, a rectangular substrate such as an LCD substrate may be used as the substrate to be processed. it can.

The top view which looked at the washing processing system by an embodiment of the invention from the upper part. 1 is a side sectional view of a substrate processing apparatus according to an embodiment of the present invention. The side sectional view which expanded the rotation table center vicinity of the substrate processing apparatus by an embodiment of the invention. It is the top view which looked at the turntable of the substrate processing apparatus by embodiment of this invention from upper direction. The top view and side sectional view which showed in detail the holding member of the substrate processing apparatus by embodiment of this invention. The sectional side view which showed in detail the holding member of the substrate processing apparatus by the modification of embodiment of this invention. Side sectional drawing which showed the holding member of the conventional substrate processing apparatus in detail.

Explanation of symbols

21 Housing 22 Cup 30 Turntable (turntable)
30p Opening 50 Holding member 50a Oscillating shaft 50b Holding body 51 Holding part 52 Pressurized part 55 O-ring (seal member)
56 Elastic member 60 Rotation drive mechanism W Wafer (substrate to be processed)

Claims (8)

In a substrate processing apparatus for processing a substrate to be processed,
A turntable provided rotatably,
A holding member that is swingably provided on the turntable and holds the substrate to be processed when one end is swung upward;
A rotation drive mechanism for rotating the turntable when the holding member holds the substrate to be processed;
A seal member disposed between the turntable and the holding member,
The substrate processing apparatus, wherein the seal member seals between the rotary base and the holding member when one end of the holding member is swung upward. The rotating table is provided with an opening through which the holding member passes when one end of the holding member is swung upward.
The substrate processing apparatus according to claim 1, wherein the seal member is disposed so as to surround an outer periphery of the opening.   The substrate processing apparatus according to claim 1, wherein the seal member is provided on a lower surface of the turntable.   The substrate processing apparatus according to claim 1, wherein the seal member is provided on one end side of the holding member.   5. The substrate processing apparatus according to claim 1, further comprising a back surface side processing liquid supply unit configured to supply a processing liquid to the back surface of the substrate to be processed held by the holding member. .   The substrate processing apparatus according to claim 1, wherein the seal member is an O-ring. It is a holding member that is swingably provided on a turntable that is rotatably provided,
A seal member provided between the rotary table and
A holding member that holds a substrate to be processed when one end swings upward, and that seals between the rotating table and the rotating table by the sealing member. In a substrate processing method for processing a substrate to be processed,
A substrate processing method using a substrate processing apparatus comprising: a turntable; a holding member swingably provided on the turntable; and a seal member disposed between the turntable and the holding member. And
A holding step in which one end of the holding member swings upward to hold the substrate to be processed;
A rotation step of rotating the turntable when the holding member holds the substrate to be processed, and
In the holding step, the seal member seals between the turntable and the holding member,
In the rotating step, the rotating table is rotated at a speed of 100 rpm or less.

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