JP2010003816A - Wafer cleaning device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive wafer cleaning device capable of preventing production of mist by efficiently treating a cleaning liquid, and obviating the need of component replacement. <P>SOLUTION: This wafer cleaning device cleans a wafer while sucking mist without scattering the cleaning liquid by the use of a cleaning tank 21, a rotary table 22, a cleaning nozzle 14, a ring 23 arranged in the vicinity of an outer peripheral part of the rotary table 22, and a plurality of plate-like members 25 arranged on a peripheral edge of a bottom part of the rotary table 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wafer cleaning apparatus for cleaning a work after dicing mounted on a dicing apparatus that divides a work such as a wafer on which a semiconductor device or an electronic component is formed into individual chips.

  A wafer having a large number of semiconductor devices and electronic components formed on the surface is divided into individual chips by a dicing apparatus. FIG. 1 shows an example of a dicing apparatus. The dicing apparatus 1 includes a high-frequency motor built-in spindles 3 and 3 that are arranged to face each other and have a blade 2 and a wheel cover (not shown) attached to the tip, an imaging unit 4 that images the surface of the workpiece W, and a workpiece W. A processing unit 6 having a work table 5 for sucking and holding is provided.

  The dicing apparatus 1 includes, in addition to the processing unit 6, a wafer cleaning device 7 that spin-cleans a processed workpiece W, a load port 8 that mounts a cassette that stores a large number of workpieces W mounted on a frame F, a workpiece Conveying means 9 for conveying W, display means 10 for displaying an image picked up by the image pickup means 4 and inputting an operation to each part, a controller (not shown) for controlling the operation of each part, and the like.

  In the dicing apparatus 1 configured as described above, the blade 2 is rotated at a high speed to perform processing while supplying grinding water and cooling water to a processing portion where the blade 2 and the wafer W are in contact with each other, and cooling effects and processing residues such as grinding powder remain. It has the effect of washing away objects (hereinafter referred to as contamination).

  However, the contamination removal function is insufficient only by the washing action by the grinding water and the cooling water. In the dicing apparatus 1, the wafer W after the dicing is cleaned by the wafer cleaning apparatus 7 called a spinner to remove the contamination. (For example, refer to Patent Document 1).

  The configuration of the conventionally used wafer cleaning apparatus 7 will be described below. As shown in FIG. 2, the wafer cleaning device 7 is provided with a cleaning tank 11 that covers the entire wafer cleaning device 7. In the cleaning tank 11, there are provided a rotary table 13 that holds a workpiece W to be cleaned and is rotated by a motor 12, and a cleaning nozzle 14 that swings while spraying cleaning liquid such as pure water toward the rotary table 13. .

In the wafer cleaning apparatus 7 configured in this manner, the work W is held on the rotary table 13 by the rotary table 13 or by the motor 12 as shown in FIG. The rotary table 13 is rotated at a high speed in the direction of the arrow θ. The cleaning liquid is sprayed from the cleaning nozzle 14 in accordance with the rotation of the rotary table 13, and the workpiece is swung in the direction of the arrow A along the surface of the workpiece W held between the outer peripheral portion and the central portion of the rotary table 13. The entire W is cleaned.

At this time, the cleaning liquid struck on the rotary table 13 and scattered from the rotary table 13 due to centrifugal force hits the inner wall of the cleaning tank 11 and becomes mist and flows out from the wafer cleaning device 7 into the dicing device 1. In order to prevent this, a mist prevention cloth 15 is attached to the inner wall of the cleaning tank 11 in all directions, and a discharge port 16 is provided at the lower part of the cleaning tank 11. The mist prevention cloth 15 is formed of a soft thick cloth such as a non-woven fabric. As a result, the scattered cleaning liquid does not directly hit the inner wall of the cleaning tank 11 and is prevented from flowing into the dicing apparatus 1 as mist. The
JP 2003-273055 A

  However, when the mist prevention cloth 15 is attached to the inner wall of the cleaning tank 11 in order to prevent mist as in the prior art, the film or chip fragments formed on the surface of the workpiece W generated during dicing pierce the mist prevention cloth 15. Since the contamination washed away from the work W adheres and hardens on the mist prevention cloth 15, maintenance work such as periodic cleaning and replacement is required. Such maintenance work increases the manufacturing costs such as parts replacement costs and labor costs, and has been a major problem in the manufacture of semiconductor devices and electronic components that are desired to be mass-produced and reduced in price.

  The present invention has been made for such a problem, and is a low-cost wafer that efficiently processes the cleaning liquid scattered from the rotary table of the wafer cleaning apparatus, does not generate mist, and does not require parts replacement. The object is to provide a cleaning device.

  In order to achieve the above object, the present invention provides a cleaning tank, a rotary table provided inside the cleaning tank that rotates while holding a workpiece on the upper surface side, and the rotary table. A cleaning nozzle that injects cleaning liquid toward the surface, a ring provided in the vicinity of the outer peripheral portion of the rotary table, and an air flow from the upper surface side to the lower surface side of the rotary table between the outer peripheral portion of the rotary table and the ring. An air flow generating means provided on the outer periphery of the bottom of the rotary table to be generated.

  According to the first aspect of the present invention, the wafer cleaning apparatus includes a cleaning tank, a rotary table, and a cleaning nozzle. A ring is provided in the vicinity of the outer peripheral portion of the rotary table so as to cover the outer peripheral portion of the rotary table. In addition, air flow generating means for generating an air flow from the upper surface side to the lower surface side of the rotary table between the outer peripheral portion of the rotary table and the ring is provided on the outer periphery of the bottom of the rotary table.

  As a result, the cleaning liquid sprayed from the rotary table and scattered from the rotary table by centrifugal force is guided to the lower surface side of the rotary table by the ring. In addition, an airflow that flows from the upper surface side of the rotary table to the lower surface side is generated between the outer peripheral portion of the rotary table and the ring by the airflow generated by the rotation of the airflow generating means and the rotary table. As a result, the cleaning liquid scattered from the rotary table is guided to the lower surface side of the rotary table and collected at the bottom of the cleaning tank. The cleaning liquid collected at the bottom of the cleaning tank is discharged from the discharge port, and even when mist is generated, it leaks out of the cleaning tank because it flows toward the bottom of the cleaning tank due to the airflow generated by the rotation of the airflow generating means and the rotary table. There is no.

  According to a second aspect of the present invention, in the first aspect of the present invention, the ring has an opening on the lower surface side of the rotary table that is wider than an opening on the upper surface side of the rotary table.

  According to the invention of claim 2, the ring provided in the vicinity of the outer peripheral portion of the rotary table is formed in a shape in which the opening on the lower side of the rotary table is wider than the opening on the upper side of the rotary table. As a result, the cleaning liquid scattered from the rotary table by the centrifugal force and hitting the ring is guided to the lower surface side of the rotary table and collected at the bottom of the cleaning tank.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the ring is fixed to the rotary table and rotates together with the rotary table.

  According to invention of Claim 3, a ring is fixed to a rotary table and rotates with a rotary table. Accordingly, a ring for guiding the cleaning liquid scattered from the rotary table to the lower surface side of the rotary table is easily disposed in the vicinity of the outer peripheral portion of the rotary table, and the cleaning liquid scattered from the rotary table can be efficiently processed.

  According to a fourth aspect of the present invention, in the invention according to any one of the first, second, or third aspect, a rectifying plate fixed to the cleaning tank is provided in the vicinity of the outer peripheral edge of the ring. It is said.

  According to the invention of claim 4, the flow straightening plate fixed to the washing tank is provided in the vicinity of the outer peripheral edge of the ring, and a part of the washing liquid guided to the lower surface of the rotary table by the ring is placed in the washing tank by the flow straightening plate. It flows toward the bottom. Thereby, it is possible to efficiently process the cleaning liquid splashed from the rotary table.

  As described above, according to the wafer cleaning apparatus of the present invention, the cleaning liquid splashed from the rotary table of the wafer cleaning apparatus is efficiently processed by the ring and the airflow generating means provided in the vicinity of the rotary table to generate mist. Accordingly, it is possible to provide a low-cost wafer cleaning apparatus that does not require replacement of parts.

  Hereinafter, preferred embodiments of a wafer cleaning apparatus according to the present invention will be described in detail with reference to the accompanying drawings. First, the configuration of the wafer cleaning apparatus according to the present invention will be described. FIG. 4 is a perspective view of a wafer cleaning apparatus according to the present invention.

  As shown in FIG. 4, the wafer cleaning apparatus 20 is provided with a cleaning tank 21, and a cleaning table 21 holds a workpiece W to be cleaned and is rotated by a motor 12. Pure water is directed toward the rotating table 22. A cleaning nozzle 14 that swings while ejecting a cleaning liquid such as the like is provided.

  A ring 23 is fixed near the outer periphery of the turntable 22 and rotates together with the turntable 22. A rectifying plate 24 fixed to the cleaning tank 21 is provided on the outer peripheral edge of the ring 23.

  The rotary table 22 is rotated by the motor 12 while holding the workpiece W for each frame F or only the workpiece W by a suction means or a clamping device (not shown). As shown in FIG. 5, plate-like members 25, 25... As airflow generating means are provided on the outer periphery of the bottom of the rotary table 22. Each plate-like member 25 is provided from the inner peripheral side of the turntable 22 toward the outer peripheral edge as shown in FIG. 6, and the turntable 22 is rotated in the direction of the arrow θ by the motor 12 shown in FIG. An air flow is generated that flows toward the bottom of the cleaning tank 21 that is in the direction of the rotation axis 22 </ b> A that is the rotation center indicated by B and that is below. The plate-like member 25 has the same blade shape as a general turbo fan or sirocco fan, and a detailed description thereof will be omitted.

  As shown in FIG. 5, the ring 23 is attached to the vicinity of the outer peripheral portion of the turntable 22 by a fixing tool (not shown) (fixing tool 23C shown in FIG. 7 described later). The ring 23 is formed in a shape in which the opening 23B on the lower surface side of the turntable 22 is wider than the opening 23A on the upper surface side of the turntable 22 when attached to the turntable 22. Thereby, the ring 23 is easily arranged near the outer periphery of the rotary table 22, and the cleaning liquid splashed from the rotary table 22 hits the inner surface of the ring 23 inclined toward the lower surface side of the rotary table 22, and the cleaning tank along the slope. 21 will flow to the bottom.

  The rectifying plate 24 is formed with an opening 24A having an inclination angle equivalent to that of the ring 23 at the center, and is attached to the cleaning tank 21 and the opening 24A is disposed in the vicinity of the outer peripheral edge of the ring 23 as shown in FIG. The As a result, the bottom of the cleaning tank 21 is isolated on the upper side and the lower side of the rotary table 22, and the cleaning liquid that hits the inner surface of the ring 23 and flows to the bottom of the cleaning tank 21 is stored in the bottom of the cleaning tank 21 without splashing and discharged. More discharged outside.

  Next, the operation of the wafer cleaning apparatus according to the present invention will be described. The wafer cleaning apparatus 20 shown in FIG. 7 is provided with a cleaning tank 21, and swings in the cleaning tank 21 while jetting cleaning liquid such as pure water toward the rotary table 22 rotated by the motor 12. A cleaning nozzle 14 is provided.

  In the wafer cleaning apparatus 20, the work W is held by the turntable 22 for each frame F or only the work W, and the turntable 22 is rotated at high speed in the direction of the arrow θ shown in FIG. Further, the cleaning liquid is sprayed from the cleaning nozzle 14 in accordance with the rotation of the rotary table 22, and the cleaning nozzle 14 is swung along the surface of the work W held between the outer peripheral portion and the central portion of the rotary table 22. To clean the entire workpiece W.

  At this time, as shown in FIG. 8, the cleaning liquid struck on the turntable 22 is scattered in the direction of the arrow S <b> 1 which is the outer peripheral direction from the turntable 22 by centrifugal force, and is fixed near the outer periphery of the turntable 22. Then, it hits the inclined surface of the inner surface of the ring 23 that rotates together with the rotary table 22.

  A part of the cleaning liquid hitting the inclined surface of the inner surface of the ring 23 flows in the direction of the arrow S2 along the inclined surface, flows along the rectifying plate 24 to the bottom of the cleaning tank 21, and a part of the cleaning liquid becomes a mist shape inside the ring 23. Scatter.

  The cleaning liquid which has hit the inner surface of the ring 23 and becomes mist is sucked in the direction of arrow S3 shown in FIG. 8 by the air flow in the direction of arrow B shown in FIG. It is sent to the side and stays at the bottom of the cleaning tank 21 and is discharged to the outside from the discharge port 16 by suction means (not shown).

  Accordingly, the cleaning liquid collected at the bottom of the cleaning tank 21 does not splash outside the apparatus due to rebounding or the like. Further, the air flow generated by the plate member 25 between the inner surface of the ring 23 and the outer peripheral edge of the rotary table 22 causes the air flow from the upper surface side to the lower surface side of the rotary table 22 to suck the mist toward the bottom of the cleaning tank 21, Is prevented from floating to the outside and efficiently discharged from the discharge port 16 to the outside.

  As described above, according to the wafer cleaning apparatus according to the present invention, the ring is fixed in the vicinity of the outer peripheral portion of the rotary table and rotates together with the rotary table, and the plate-like member provided on the outer peripheral edge of the rotary table bottom portion. The cleaning liquid splashed from the rotary table of the cleaning apparatus can be efficiently processed so that mist is not generated, and a low-cost wafer cleaning apparatus that does not require parts replacement can be obtained.

  In this embodiment, the rectifying plate is attached only to the inner wall surface of the cleaning tank 21, but the present invention is not limited to this, and is rotated to the bottom of the rotary table 22 as in the wafer cleaning apparatus 20A shown in FIG. A curved ring-shaped rectifying plate 26 that rotates together with the table 22 may be provided, and a curved ring-shaped rectifying plate 27 whose upper portion is covered with the rectifying plate 26 may be provided at the bottom of the cleaning tank 21. Thereby, the airflow flowing toward the rotation axis 22 </ b> A generated by the rotation of the rotary table 22 and the plate-like member 25 flows efficiently toward the bottom of the cleaning tank 21, and the sucked mist is efficiently discharged from the discharge port 16. .

  Further, in the present embodiment, the plate-like member 25 is provided as shown in FIG. 6, and an airflow that flows downward in the center direction of the turntable 22 is generated by the turntable 22 rotating in the arrow θ direction. However, the present invention is not limited to this, and a plate-like member 25A shown in FIG. 10 may suitably generate an airflow that flows toward the bottom of the cleaning tank 21 that is in the outer circumferential direction of the rotary table 22 indicated by the arrow C. It can be implemented. The plate-like member 25A has a blade shape of a general axial fan, and detailed description thereof is omitted.

  As a result, as shown in FIG. 11, a part of the cleaning liquid splashed in the direction of the arrow S1 which is the outer peripheral edge direction from the rotary table 22 by the centrifugal force and hits the inclined surface of the inner surface of the ring 23 along the inclined surface. The mist-like cleaning liquid flows in the direction, flows through the rectifying plate 24 to the bottom of the cleaning tank 21, and is generated by the airflow in the direction of arrow C shown in FIG. 10 generated by the rotary table 22 and the plate-like member 25A. It is sucked in the direction and sent to the lower side of the rotary table 22 and discharged to the outside from the discharge port 16 by suction means (not shown).

  Further, in the present embodiment, the ring 23 is fixed to the rotary table 22 and the rectifying plate 24 is disposed in the vicinity of the outer peripheral edge of the ring 23. However, the present invention is not limited thereto, and the ring 23 is fixed to the rotary table. Instead, it can be suitably carried out even if the ring 23 is arranged in the vicinity of the outer peripheral portion of the rotary table 22 by being fixed to the cleaning tank 21 or the like.

The perspective view which shows the external appearance of a dicing apparatus. The perspective view which showed the external appearance of the conventional wafer cleaning apparatus. The top view of the conventional wafer cleaning apparatus. The perspective view which showed the external appearance of the wafer cleaning apparatus concerning this invention. The perspective view which showed the ring and rotary table of the wafer cleaning apparatus concerning this invention. The bottom view of the bottom of the rotary table. Side surface sectional drawing of the wafer cleaning apparatus concerning this invention. The figure which expanded a part of side surface cross section of the wafer cleaning apparatus concerning this invention. Side surface sectional drawing which showed another embodiment of the wafer cleaning apparatus concerning this invention. The bottom front view of the turntable by another embodiment. The figure which expanded a part of side surface cross section of the wafer cleaning apparatus by another embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Dicing apparatus, 2 ... Blade, 3 ... Spindle, 4 ... Imaging means, 5 ... Work table, 6 ... Processing part, 7, 20, 20A ... Wafer cleaning apparatus, 8 ... Load port, 9 ... Conveyance means, 10 ... Display means 11, 21 ... Cleaning tank, 12 ... Motor, 13, 22 ... Rotary table, 14 ... Cleaning nozzle, 15 ... Mist prevention cloth, 16 ... Discharge port, 23 ... Ring, 24, 26, 27 ... Rectification plate, 25, 25A ... Plate-like member (airflow generating means), W ... Workpiece

Claims (4)

A washing tank;
A rotary table provided inside the washing tank that rotates while holding a workpiece on the upper surface side;
A cleaning nozzle for injecting a cleaning liquid toward the rotary table;
A ring provided near the outer periphery of the rotary table;
An air flow generating means provided on the outer periphery of the bottom of the rotary table for generating an air flow from the upper surface side to the lower surface side of the rotary table between the outer peripheral portion of the rotary table and the ring. Wafer cleaning equipment.   2. The wafer cleaning apparatus according to claim 1, wherein the ring has an opening on the lower surface side of the rotating table wider than an opening on the upper surface side of the rotating table.   The wafer cleaning apparatus according to claim 1, wherein the ring is fixed to the rotary table and rotates together with the rotary table.   4. The wafer cleaning apparatus according to claim 1, wherein a rectifying plate fixed to the cleaning tank is provided in the vicinity of an outer peripheral edge of the ring. 5.

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