JP2010087532A - Exposure system, exposure method, and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure system having a photodetector excellently receiving light through a projection optical system. <P>SOLUTION: The exposure system is for exposing a substrate P by irradiating the substrate P disposed on an image surface side in the projection optical system PL with an exposing light through the projection optical system PL and liquid LQ, is provided with the photodetector 90 that receives the light that has passed through the projection optical system PL through a slit plate 75 having a slit section 71 disposed on the image surface side in the projection optical system PL, and the space between an optical device 76 and the slit plate 75 composing the photodetector 90 is filled with the liquid LQ. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus and exposure method for exposing a substrate via a projection optical system and a liquid, and a device manufacturing method.

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. In addition, these exposure apparatuses have optical sensors (light receiving units) that receive exposure light via a projection optical system, and various mechanical adjustments and optical adjustments are performed based on the outputs of these optical sensors. The exposure operation when actually performing exposure of the substrate by performing or determining various operation conditions is optimized. In recent years, in order to cope with higher integration of device patterns, higher resolution of the projection optical system is desired. The resolution of the projection optical system becomes higher as the exposure wavelength used is shorter and the numerical aperture of the projection optical system is larger. Therefore, the exposure wavelength used in the exposure apparatus is shortened year by year, and the numerical aperture of the projection optical system is also increasing. The mainstream exposure wavelength is 248 nm of the KrF excimer laser, but the 193 nm of the shorter wavelength ArF excimer laser is also being put into practical use. Also, when performing exposure, the depth of focus (DOF) is important as well as the resolution. The resolution R and the depth of focus δ are each expressed by the following equations.
R = k ₁ · λ / NA (1)
δ = ± k ₂ · λ / NA ² (2)
Here, λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, and k ₁ and k ₂ are process coefficients. From the equations (1) and (2), it can be seen that the depth of focus δ becomes narrower when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to increase the resolution R.

  If the depth of focus δ becomes too narrow, it becomes difficult to match the substrate surface with the image plane of the projection optical system, and the focus margin during the exposure operation may be insufficient. Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, a liquid immersion method disclosed in Patent Document 1 below has been proposed. In this immersion method, a space between the lower surface of the projection optical system and the substrate surface is filled with a liquid such as water or an organic solvent to form an immersion region, and the wavelength of exposure light in the liquid is 1 / n of that in air. (Where n is the refractive index of the liquid, which is usually about 1.2 to 1.6), the resolution is improved, and the depth of focus is expanded about n times.

International Publication No. 99/49504 Pamphlet

  Since the above-described optical sensor (light receiving unit) has a light transmission part arranged on the image plane side of the projection optical system and receives light through the light transmission part, the liquid immersion method is adopted. As the numerical aperture of the projection optical system increases and the incident angle of the exposure light (the angle formed by the outermost light beam and the optical axis) increases, the spread of the light emitted from the light transmission part also increases, which is favorable. There is a possibility that light cannot be received.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an exposure apparatus, an exposure method, and a device manufacturing method having a light receiver that can receive light through the projection optical system satisfactorily. To do.

  In order to solve the above-described problems, the present invention employs the following configuration corresponding to FIGS. 1 to 26 described in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  The exposure apparatus (EX) according to the present invention exposes exposure light (EL) via a projection optical system (PL) and a liquid (LQ) to a substrate (P) disposed on the image plane side of the projection optical system (PL). ) In the exposure apparatus that exposes the substrate (P) by irradiating the projection optical system via an optical member (75) having a light transmission part (71) disposed on the image plane side of the projection optical system (PL). A light receiver (76, 90) that receives light that has passed through (PL), and a liquid (LQ) is filled between the light receiver (76, 90) and the optical member (75). To do.

  In immersion exposure, when light having passed through a projection optical system is received by a light receiver via an optical member arranged on the image plane side of the projection optical system, the space between the projection optical system and the optical member is filled with liquid. It is conceivable to perform the light receiving operation by irradiating the light receiver with light in the above state. According to the present invention, by filling the liquid between the optical member and the light receiver, the light having passed through the projection optical system can be favorably received by the light receiver. In other words, by filling the space between the projection optical system and the optical member with the liquid, the numerical aperture NA of the projection optical system is improved. Depending on the numerical aperture NA of the projection optical system, the optical system of the light receiver is improved. It is also necessary to change the numerical aperture NA. In other words, if the numerical aperture NA of the light receiver is not improved in accordance with the numerical aperture NA of the projection optical system, the light receiver will not be able to capture the light that has passed through the projection optical system, resulting in good light reception. become unable. Accordingly, when the numerical aperture NA of the projection optical system is improved by filling the liquid between the projection optical system and the optical member, the liquid between the optical member and the light receiver is also filled with the liquid. By improving the numerical aperture NA of the system, the light receiver can receive light through the projection optical system satisfactorily.

  Here, the optical member includes all those having a light transmission part.

  The exposure apparatus (EX) of the present invention irradiates exposure light (EL) through the projection optical system (PL) to the substrate (P) disposed on the image plane side of the projection optical system (PL). In the exposure apparatus that exposes the substrate (P), the projection optical system (PL) is passed through the optical member (75) having the light transmission part (71) disposed on the image plane side of the projection optical system (PL). A light receiver (76, 90) for receiving light is provided, and a liquid (LQ) is filled between the light receiver (76, 90) and the optical member (75).

  According to the present invention, by filling the liquid between the optical member and the light receiver, the numerical aperture NA of the optical system of the light receiver can be improved, and the light receiving operation can be performed satisfactorily. The configuration in which the liquid is filled between the optical member and the light receiver of the present invention can be applied not only to the immersion exposure apparatus but also to a dry exposure apparatus that performs exposure without using a liquid.

  The exposure apparatus (EX) according to the present invention exposes exposure light (EL) to the substrate (P) disposed on the image plane side of the projection optical system (PL) through the projection optical system (PL) and the liquid (LQ). In the exposure apparatus that exposes the substrate (P) by irradiating the projection optical system (PL), a projection optical system (75) is provided via an optical member (75) having a light transmission part (71) disposed on the image plane side of the projection optical system (PL). The light receiving element (82) which receives the light which passed through (PL) is provided, and the light receiving element (82) is in contact with the optical member (71).

  According to the present invention, by arranging the light receiving element of the light receiver so as to be in contact with the optical member, a liquid is filled between the projection optical system and the optical member to substantially improve the numerical aperture NA of the projection optical system. Even in such a case, the light receiver can receive light through the projection optical system satisfactorily.

  The exposure apparatus (EX) according to the present invention exposes exposure light (EL) via a projection optical system (PL) and a liquid (LQ) to a substrate (P) disposed on the image plane side of the projection optical system (PL). ) In the exposure apparatus that exposes the substrate (P) by irradiating the projection optical system via an optical member (75) having a light transmission part (71) disposed on the image plane side of the projection optical system (PL). A light receiver (76, 90) that receives light that has passed through (PL) is provided, and a through hole (120, 130) is provided at a predetermined position of the optical member (75).

  According to the present invention, since the through hole is provided in the optical member, the liquid between the projection optical system and the optical member can move (escape) through the through hole. The difference between the pressure of the liquid between the optical member and the pressure of the liquid between the optical member and the light receiver does not occur, and there is no inconvenience such as bending of the optical member. In addition, since the liquid can be moved through the through hole, a large pressure fluctuation of the liquid between the projection optical system and the optical member does not occur, and thus the projection optical system fluctuates (vibrates) due to the liquid pressure fluctuation. Can be prevented.

  The device manufacturing method of the present invention uses the above-described exposure apparatus (EX). According to the present invention, since the light receiver can receive light through the projection optical system satisfactorily, it is possible to perform an accurate exposure process in a state where optimum exposure conditions are set based on the light reception result. Devices with performance can be manufactured.

  The exposure method of the present invention is an exposure method for exposing the substrate by irradiating exposure light onto the substrate through the projection optical system: a light transmission portion disposed on the image plane side of the projection optical system Receiving light having passed through the projection optical system through an optical member having a light receiving device; and exposing the substrate by irradiating exposure light onto the substrate through the projection optical system; An exposure method is provided in which a liquid is filled between the light receiver and the optical member.

  In this method, since the liquid is filled between the light receiver and the optical member, the exposure light from the light transmitting portion can be received well even if the numerical aperture of the projection optical system is increased.

  According to the present invention, since the light passing through the projection optical system can be received well by the light receiver, it is possible to perform an accurate exposure process in a state in which optimum exposure conditions are set based on the light reception result.

It is a schematic block diagram which shows one Embodiment of the exposure apparatus of this invention. It is a schematic block diagram which shows the vicinity of the front-end | tip part of a projection optical system, a liquid supply mechanism, and a liquid collection | recovery mechanism. It is a top view which shows the positional relationship of the projection area | region of a projection optical system, a liquid supply mechanism, and a liquid collection | recovery mechanism. It is a schematic block diagram which shows one Embodiment of the light receiver which concerns on this invention. It is a schematic diagram which shows the state which the light receiver is performing measurement operation. It is a principal part enlarged view which shows one Embodiment of the optical member and light receiver which concern on this invention. It is a top view of the optical member of FIG. It is a figure which shows an example of the light transmissive part of an optical member. It is a figure which shows an example of the light reception signal light-received with the light receiver. It is a figure which shows an example of the mask used when measuring the image formation characteristic of a projection optical system. It is a figure which shows an example of the mask used when measuring the image formation characteristic of a projection optical system. It is a figure which shows an example of the mask used when measuring the image formation characteristic of a projection optical system. It is a principal part enlarged view which shows another embodiment of the optical member and light receiver which concern on this invention. It is a principal part enlarged view which shows another embodiment of the optical member and light receiver which concern on this invention. It is a principal part enlarged view which shows another embodiment of the optical member and light receiver which concern on this invention. It is a top view of the optical member of FIG. It is a figure which shows an example of the procedure which forms a liquid immersion area | region. It is a principal part enlarged view which shows another embodiment of the optical member and light receiver which concern on this invention. It is a top view of the optical member of FIG. It is a principal part enlarged view which shows another embodiment of the optical member and light receiver which concern on this invention. It is a top view of the optical member of FIG. It is a principal part enlarged view which shows another embodiment of the optical member and light receiver which concern on this invention. It is a top view which shows the state by which the several light receiver is arrange | positioned on the substrate stage. It is a principal part enlarged view which shows another embodiment of the optical member and light receiver which concern on this invention. It is a principal part enlarged view which shows another embodiment of the optical member and light receiver which concern on this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

  The exposure apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is a schematic block diagram showing an embodiment of an exposure apparatus according to the present invention.

  In FIG. 1, an exposure apparatus EX includes a mask stage MST that supports a mask M, a substrate stage PST that supports a substrate P, and an illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light EL. A projection optical system PL that projects and exposes the pattern image of the mask M illuminated with the exposure light EL onto the substrate P supported by the substrate stage PST, and a control device CONT that controls the overall operation of the exposure apparatus EX. A storage device MRY that is connected to the control device CONT and stores various types of information related to exposure processing is provided. Further, the exposure apparatus EX includes an aerial image measuring device 70 that is used for measuring the imaging characteristics (optical characteristics) of the projection optical system PL. The aerial image measuring device 70 includes a light receiver 90 that receives light (exposure light EL) that has passed through the projection optical system PL via a slit plate 75 having a slit portion 71 disposed on the image plane side of the projection optical system PL. I have.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and substantially increase the depth of focus. A liquid supply mechanism 10 for supplying the liquid LQ to the substrate P, and a liquid recovery mechanism 20 for recovering the liquid LQ on the substrate P. While transferring at least the pattern image of the mask M onto the substrate P, the exposure apparatus EX uses a liquid LQ supplied from the liquid supply mechanism 10 to a part on the substrate P including the projection area AR1 of the projection optical system PL ( Locally) the immersion area AR2 is formed. Specifically, the exposure apparatus EX fills the liquid LQ between the optical element 60 on the front end side (image plane side) of the projection optical system PL and the surface of the substrate P, and the projection optical system PL and the substrate P The substrate P is exposed by projecting the pattern image of the mask M onto the substrate P by irradiating the exposure light EL through the liquid LQ and the projection optical system PL.

  In the present embodiment, the exposure apparatus EX is a scanning exposure apparatus (so-called so-called exposure apparatus EX) that exposes the pattern formed on the mask M onto the substrate P while synchronously moving the mask M and the substrate P in different directions (reverse directions) in the scanning direction. A case where a scanning stepper) is used will be described as an example. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, the synchronous movement direction (scanning direction) between the mask M and the substrate P in the plane perpendicular to the Z-axis direction is the X-axis direction, A direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is defined as a Y-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. Here, the “substrate” includes a semiconductor wafer coated with a photoresist, which is a photosensitive material, and the “mask” includes a reticle on which a device pattern to be reduced and projected on the substrate is formed.

The illumination optical system IL converts the light beam (laser beam) LB emitted from the light source 1 into exposure light EL, and illuminates the mask M supported by the mask stage MST with the exposure light EL. As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm), or the like is used. In this embodiment, ArF excimer laser light is used.

  In the present embodiment, pure water is used as the liquid LQ. Pure water is not only ArF excimer laser light, but also far ultraviolet light (DUV light) such as ultraviolet emission lines (g-line, h-line, i-line) emitted from mercury lamps and KrF excimer laser light (wavelength 248 nm). Can also be transmitted.

  The light source 1 in the present embodiment is an excimer laser light source that emits ArF excimer laser light (wavelength 193 nm). The controller CONT turns on / off the laser emission, the center wavelength, the spectral half width, the repetition frequency, and the like. Controlled.

  The illumination optical system IL includes a beam shaping optical system 2, an optical integrator 3, an illumination system aperture stop plate 4, relay optical systems 6, 8, a fixed mask blind 7A, a movable mask blind 7B, a mirror 9, a condenser lens 30, and the like. ing. In this embodiment, a fly-eye lens is used as the optical integrator 3, but a rod-type (internal reflection type) integrator, a diffractive optical element, or the like may be used. In the beam shaping optical system 2, the cross-sectional shape of the laser beam LB pulsed by the light source 1 is shaped so as to be efficiently incident on the optical integrator 3 provided behind the optical path of the laser beam LB. For example, a cylindrical lens and a beam expander are included. The optical integrator (fly eye lens) 3 is disposed on the optical path of the laser beam LB emitted from the beam shaping optical system 2, and is used to illuminate the mask M with a uniform illuminance distribution from a number of point light sources (light source images). A surface light source, that is, a secondary light source is formed.

  An illumination system aperture stop plate 4 made of a disk-like member is disposed in the vicinity of the exit-side focal plane of the optical integrator 3. The illumination system aperture stop plate 4 has an aperture stop (small aperture) composed of a normal circular aperture, for example, an aperture stop (small aperture) for reducing the σ value, which is a small circular aperture and is a coherence factor, at substantially equal angular intervals. σ stop), an annular aperture stop for annular illumination (annular stop), and a modified aperture stop (quadrupole illumination stop called SHRINC) in which a plurality of openings are arranged eccentrically for the modified light source method, etc. Has been placed. The illumination system aperture stop plate 4 is rotated by a driving device 31 such as a motor controlled by a control device CONT, whereby any aperture stop is selectively placed on the optical path of the exposure light EL. Be placed.

  In this example, the light intensity distribution on the pupil plane of the illumination optical system IL is adjusted using the illumination system aperture stop member 4, but as disclosed in US Pat. No. 6,563,567. Other optical systems may be used.

  A beam splitter 5 having a low reflectance and a high transmittance is disposed on the optical path of the exposure light EL that has passed through the illumination system aperture stop plate 4, and further, relays are provided on the rear optical path with mask blinds 7A and 7B interposed therebetween. Optical systems (6, 8) are arranged. The fixed mask blind 7A is disposed on a surface slightly defocused from the conjugate plane with respect to the pattern surface of the mask M, and a rectangular opening that defines the illumination area IA on the mask M is formed. Further, a movable mask blind 7B having an opening having a variable position and width in the direction corresponding to the scanning direction (X-axis direction) and the non-scanning direction (Y-axis direction) orthogonal thereto in the vicinity of the fixed mask blind 7A. Is arranged, and the exposure area IA is further restricted via the movable mask blind 7B at the start and end of the scanning exposure, thereby preventing unnecessary exposure. Further, in the present embodiment, the movable mask blind 7B is also used for setting an illumination area in a later-described aerial image measurement. On the other hand, on the optical path of the exposure light EL reflected by the beam splitter 5 in the illumination optical system IL, the condenser lens 32 and the sensitivity are good in the far ultraviolet region, and are high in order to detect the pulse emission of the light source 1. An integrator sensor 33 including a light receiving element such as a PIN photodiode having a response frequency is disposed.

  The operation of the illumination optical system IL configured in this way will be briefly described. The laser beam LB pulsed from the light source 1 is incident on the beam shaping optical system 2 where it is efficiently applied to the optical integrator 3 at the rear. After the cross-sectional shape is shaped so as to be incident well, it enters the optical integrator 3. As a result, a secondary light source is formed on the exit-side focal plane of the optical integrator 3 (the pupil plane of the illumination optical system IL). The exposure light EL emitted from the secondary light source passes through one of the aperture stops on the illumination system aperture stop plate 4 and then enters the beam splitter 5 having high transmittance and low reflectivity. The exposure light EL transmitted through the beam splitter 5 passes through the first relay lens 6, passes through the rectangular opening of the fixed mask blind 7 </ b> A and the movable mask blind 7 </ b> B, passes through the second relay lens 8, and is reflected by the mirror 9. The optical path can be bent vertically downward. The exposure light EL whose optical path is bent by the mirror 9 passes through the condenser lens 30 and illuminates the illumination area IA on the mask M held by the mask stage MST with a uniform illuminance distribution.

  On the other hand, the exposure light EL reflected by the beam splitter 5 is received by the integrator sensor 33 via the condenser lens 32, and the photoelectric conversion signal of the integrator sensor 33 passes through a peak hold circuit and an A / D converter (not shown). The signal is supplied to the control device CONT through the signal processing device. In the present embodiment, the measurement value of the integrator sensor 33 is used for the exposure amount control and also for the calculation of the irradiation amount with respect to the projection optical system PL. This irradiation amount is the substrate reflectivity (this is the output of the integrator sensor). It can also be obtained based on the output of a reflectance monitor (not shown), and is used for calculating the amount of change in imaging characteristics due to illumination light absorption of the projection optical system PL. In the present embodiment, the dose is calculated based on the output of the integrator sensor 33 by the control device CONT at a predetermined interval, and the calculation result is stored in the storage device MRY as an irradiation history.

  The mask stage MST is movable while holding the mask M. For example, the mask M is fixed by vacuum suction (or electrostatic suction). The mask stage MST is supported in a non-contact manner on the mask base 55 via a gas bearing (air bearing) which is a non-contact bearing. The mask stage driving device MSTD including a linear motor or the like is used to drive the optical axis of the projection optical system PL. It can move two-dimensionally in a plane perpendicular to AX, that is, in the XY plane, and can be rotated slightly in the θZ direction. The mask stage MST can move on the mask base 55 at a scanning speed designated in the X-axis direction, and the X can only cross the entire surface of the mask M at least the optical axis AX of the projection optical system PL. It has a moving stroke in the axial direction.

  A movable mirror 41 is provided on the mask stage MST. A laser interferometer 42 is provided at a position facing the movable mirror 41. The position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured in real time by the laser interferometer 42, and the measurement result is a control device. Output to CONT. The control device CONT controls the position of the mask M supported by the mask stage MST by driving the mask stage drive device MSTD based on the measurement result of the laser interferometer 42.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and includes a plurality of optical elements including an optical element (lens) 60 provided at the front end portion on the substrate P side. These optical elements are supported by a lens barrel PK. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4 or 1/5. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The projection optical system PL may be any of a refractive system, a reflective system, and a catadioptric system.

  The optical element 60 at the tip of the projection optical system PL of this embodiment is held by a lens cell 62, and the lens cell 62 holding the optical element 60 and the tip of the barrel PK are connected by a connecting mechanism 61. ing. The optical element 60 is in contact with the liquid LQ in the liquid immersion area AR2. The optical element 60 is made of meteorite. Since meteorite has high affinity with water, the liquid LQ can be brought into close contact with almost the entire liquid contact surface 60a of the optical element 60. That is, in the present embodiment, the liquid (water) LQ having a high affinity with the liquid contact surface 60a of the optical element 60 is supplied, and therefore the adhesion between the liquid contact surface 60a of the optical element 60 and the liquid LQ. And the optical path between the optical element 60 and the substrate P can be reliably filled with the liquid LQ. The optical element 60 may be quartz having a high affinity for water. Further, the liquid contact surface 60a of the optical element 60 may be subjected to a hydrophilization (lyophilic treatment) to further increase the affinity with the liquid LQ.

The substrate stage PST can move while holding the substrate P, and includes an XY stage 53 and a Z tilt stage 52 mounted on the XY stage 53. The XY stage 53 is supported in a non-contact manner above the upper surface of the stage base 54 via a gas bearing (air bearing) which is a non-contact bearing (not shown). The XY stage 53 (substrate stage PST) is supported in a non-contact manner with respect to the upper surface of the stage base 54, and is in a plane perpendicular to the optical axis AX of the projection optical system PL by the substrate stage driving device PSTD including a linear motor and the like. That is, it can move two-dimensionally in the XY plane and can rotate in the θZ direction. A Z tilt stage 52 is mounted on the XY stage 53, and a substrate holder 51 is mounted on the Z tilt stage 52. The substrate P is held by the substrate holder 51 by vacuum suction or the like. The Z tilt stage 52 is provided so as to be movable in the Z-axis direction, the θX direction, and the θY direction by an actuator described later. The substrate stage driving device PSTD including the actuator is controlled by the control device CONT. The substrate stage PST controls the focus position (Z position) and tilt angle of the substrate P to adjust the surface of the substrate P to the image plane of the projection optical system PL by the autofocus method and the auto leveling method. Positioning is performed in the X-axis direction and the Y-axis direction.

  An auxiliary plate 57 is provided on the substrate stage PST (substrate holder 51) so as to surround the substrate P. The auxiliary plate 57 has a flat surface substantially the same height as the surface of the substrate P held by the substrate holder 51. Even when the edge region of the substrate P is exposed, the liquid LQ can be held under the projection optical system PL by the auxiliary plate 57.

  Although the auxiliary plate 57 is formed only around the substrate holder 51, the periphery of the aerial image measuring device 70 or the aerial image measuring device with the substrate holder 51 so that the upper surface of the substrate stage PST is substantially flush. An auxiliary plate 57 may be disposed between the auxiliary plate 57 and the auxiliary plate 57. Thus, even if the upper surface of the aerial image measurement device 70 is smaller than the liquid immersion area AR2, the liquid LQ can be held under the projection optical system PL by the auxiliary plate 57.

  A movable mirror 43 is provided on the substrate stage PST (Z tilt stage 52). A laser interferometer 44 is provided at a position facing the movable mirror 43. The position and rotation angle of the substrate P on the substrate stage PST in the two-dimensional direction are measured in real time by the laser interferometer 44, and the measurement result is output to the control device CONT. The controller CONT positions the substrate P supported by the substrate stage PST by driving the substrate stage driving device PSTD including a linear motor or the like based on the measurement result of the laser interferometer 44.

  Further, the exposure apparatus EX includes a focus detection system 45 that detects the position of the surface of the substrate P supported by the substrate stage PST (substrate holder 51). The focus detection system 45 includes a light projecting unit 45A that projects a detection light beam on the substrate P via the liquid LQ from an oblique direction, and a light receiving unit 45B that receives the reflected light of the detection light beam reflected by the substrate P. I have. The light reception result of the focus detection system 45 (light receiving unit 45B) is output to the control device CONT. The control device CONT can detect the position information in the Z-axis direction of the surface of the substrate P based on the detection result of the focus detection system 45. Further, by projecting a plurality of detection light beams from the light projecting unit 45A, it is possible to detect inclination information of the substrate P in the θX and θY directions. As the configuration of the focus detection system 45, for example, the one disclosed in JP-A-6-283403 can be used. As the focus detection system 45, it is also possible to use a system that projects a detection light beam onto the surface of the substrate P without passing through the liquid LQ outside the liquid immersion area AR2 and receives the reflected light.

  The control device CONT uses Z position driving units 56A to 56C, which will be described later, so that the focus shift becomes zero based on a defocus signal (defocus signal) from the light receiving unit 45B, for example, an S curve signal, during scanning exposure or the like. The movement of the Z tilt stage 52 in the Z-axis direction and the two-dimensional tilt (rotation in the θX and θY directions) are controlled via the substrate stage driving device PSTD including That is, the control device CONT controls the movement of the Z tilt stage 52 using the multipoint focus detection system 45, so that the image focusing plane of the projection optical system PL substantially matches the surface of the substrate P. And auto leveling.

Further, in the vicinity of the tip of the projection optical system PL, an off-axis type substrate alignment system 46 that detects an alignment mark on the substrate P or a reference mark formed on a reference member (not shown) provided on the substrate stage PST. Is provided. A mask alignment system 47 for detecting a reference mark provided on the reference member via the mask M and the projection optical system PL is provided in the vicinity of the mask stage MST. In this embodiment, an image processing type alignment sensor, a so-called FIA (Field Image Alignment) system is used as the alignment system. As the configuration of the substrate alignment system 46, for example, the one disclosed in JP-A-4-65603 can be used, and the configuration of the mask alignment system 47 is disclosed in JP-A-7-176468. Can be used.

  FIG. 2 is an enlarged view showing the liquid supply mechanism 10, the liquid recovery mechanism 20, and the projection optical system PL. The projection optical system PL is held by a plurality of (here, 10) optical elements 64a to 64j held by the lens barrel PK and a lens cell 62 on the image plane side (substrate P side) of the projection optical system PL. And an optical element 60. Among the optical elements 64a to 64j constituting the projection optical system PL, some of the optical elements 64a and 64b, for example, optical elements 64a and 64b are inclined with respect to the optical axis AX direction and the XY plane by a plurality of driving elements (for example, piezoelectric elements) 63, respectively. It is configured to be capable of minute driving. Further, sealed first and second sealed chambers 65A and 65B are formed between the optical elements 64d and 64e and between the optical elements 64f and 64g, respectively. A clean gas such as dry air is supplied to the first and second sealed chambers 65A and 65B from a gas supply mechanism (not shown) via a pressure adjustment mechanism 66.

  In the present embodiment, the pressure adjusting mechanism 66 that adjusts the driving voltage (driving amount of the driving element) applied to each driving element 63 and the gas pressure (internal pressure) inside the first and second sealed chambers 65A and 65B, Controlled by the imaging characteristic control device 67 in accordance with a command from the control device CONT, thereby correcting the imaging characteristics of the projection optical system PL, such as field curvature, distortion, magnification, and the like. . Note that the image formation characteristic adjusting mechanism for adjusting the image formation characteristic may be constituted by only a movable optical element such as the optical element 64a, and the number of the movable optical elements may be arbitrary. However, in this case, since the number of movable optical elements corresponds to the types that can correct the imaging characteristics of the projection optical system PL excluding the focus, the number of movable optical elements depends on the type of imaging characteristics that need to be corrected. You only need to set the number.

The Z tilt stage 52 is supported at three points on the XY stage 53 by three Z position driving units 56A, 56B, and 56C (however, the Z position driving unit 56C on the back side of the drawing is not shown). These Z position driving units 56A to 56C have three actuators (for example, a voice coil motor) that independently drive the respective support points on the lower surface of the Z tilt stage 52 in the optical axis direction (Z direction) of the projection optical system PL. 59A, 59B, 59C (however, the actuator 59C on the back side of the paper in FIG. 2 is not shown) and the Z-axis direction driving amount (displacement from the reference position) by the Z position driving units 56A, 56B, 56C of the Z tilt stage 52 ) To detect the encoder 58 </ b> A, 58 </ b> B, 58 </ b> C (note that the encoder 58 </ b> C on the back side in FIG. 2 is not shown). Here, as the encoders 58A to 58C, linear encoders such as an optical type or a capacitance type are used, for example. In this embodiment, the actuators 56A, 56B, and 56C drive the Z tilt stage 52 in the optical axis AX direction (Z-axis direction) and the tilt direction with respect to the plane orthogonal to the optical axis (XY plane), that is, the θX and θY directions. A drive device is configured. Further, the driving amount (displacement amount from the reference point) of each supporting point by the Z position driving units 56A, 56B, and 56C of the Z tilt stage 52 measured by the encoders 58A to 58C is output to the control device CONT. The control device CONT obtains the position and leveling amount (θX rotation amount, θY rotation amount) of the Z tilt stage 52 based on the measurement results of the encoders 58A to 58C.

  The liquid supply mechanism 10 supplies the liquid LQ between the projection optical system PL and the substrate P in a predetermined period including the time of exposure processing, and includes a liquid supply unit 11 capable of delivering the liquid LQ, and a liquid supply A supply nozzle 13 connected to the part 11 via a supply pipe 12 and supplying the liquid LQ delivered from the liquid supply part 11 onto the substrate P is provided. The supply nozzle 13 is disposed close to the surface of the substrate P. The liquid supply unit 11 includes a tank that stores the liquid LQ, a pressure pump, and the like, and supplies the liquid LQ onto the substrate P via the supply pipe 12 and the supply nozzle 13. The liquid supply operation of the liquid supply unit 11 is controlled by the control device CONT, and the control device CONT can control the liquid supply amount per unit time on the substrate P by the liquid supply unit 11. Note that the tank, the pressure pump, and the like of the liquid supply mechanism 10 do not necessarily have to be provided in the exposure apparatus EX, and at least a part of them can be replaced by equipment such as a factory in which the exposure apparatus EX is installed. .

  The liquid recovery mechanism 20 recovers the liquid LQ between the projection optical system PL and the substrate P during a predetermined period including the time of the exposure process, and the recovery nozzle 23 is disposed close to the surface of the substrate P. And a liquid recovery unit 21 connected to the recovery nozzle 23 via a recovery pipe 22. The liquid recovery unit 21 includes a vacuum system (a suction device) including a vacuum pump, a tank for storing the recovered liquid LQ, and the like, and its operation is controlled by the control device CONT. When the vacuum system of the liquid recovery unit 21 is driven, the liquid LQ on the substrate P is recovered via the recovery nozzle 23. As a vacuum system, a vacuum system in a factory where the exposure apparatus EX is disposed may be used without providing a vacuum pump in the exposure apparatus. Further, the tank of the liquid recovery mechanism 220 is not necessarily provided in the exposure apparatus EX, and at least a part of them can be substituted by equipment such as a factory in which the exposure apparatus EX is installed.

  In addition, it is preferable to provide a gas-liquid separator that separates the liquid LQ sucked from the recovery nozzle 23 and the gas in the middle of the recovery pipe 22, specifically, between the recovery nozzle 23 and the vacuum system. When the liquid LQ on the substrate P is sucked and collected, there is a possibility that the liquid recovery unit (vacuum system) 21 collects the liquid LQ together with the surrounding gas (air). By separating the liquid and gas recovered from the nozzle 23, it is possible to prevent the occurrence of inconveniences such as the liquid LQ flowing into the vacuum system and the vacuum system failing. The liquid LQ recovered by the liquid recovery unit 21 is discarded or cleaned, for example, and returned to the liquid supply unit 11 or the like for reuse.

  The liquid supply mechanism 10 and the liquid recovery mechanism 20 are supported separately from the projection optical system PL. Thereby, the vibration generated in the liquid supply mechanism 10 and the liquid recovery mechanism 20 is not transmitted to the projection optical system PL.

  FIG. 3 is a plan view showing the positional relationship between the liquid supply mechanism 10 and the liquid recovery mechanism 20 and the projection area AR1 of the projection optical system PL. The projection area AR1 of the projection optical system PL has a rectangular shape (slit shape) elongated in the Y-axis direction, and three supply nozzles 13A to 13C are arranged on the + X side so as to sandwich the projection area AR1 in the X-axis direction. The two collection nozzles 23A and 23B are arranged on the −X side. The supply nozzles 13 </ b> A to 13 </ b> C are connected to the liquid supply unit 11 via the supply pipe 12, and the recovery nozzles 23 </ b> A and 23 </ b> B are connected to the liquid recovery part 21 via the recovery pipe 22. In addition, the supply nozzles 16A to 16C and the recovery nozzles 26A and 26B are arranged in a positional relationship in which the supply nozzles 13A to 13C and the recovery nozzles 23A and 23B are rotated by approximately 180 °. The supply nozzles 13A to 13C and the recovery nozzles 26A and 26B are alternately arranged in the Y axis direction, the supply nozzles 16A to 16C and the recovery nozzles 23A and 23B are alternately arranged in the Y axis direction, and the supply nozzles 16A to 16C are The recovery nozzles 26 </ b> A and 26 </ b> B are connected to the liquid recovery part 21 via the recovery pipe 25.

  FIG. 4 is a schematic configuration diagram showing an aerial image measuring device 70 used for measuring the imaging characteristics (optical characteristics) of the projection optical system PL. The aerial image measuring device 70 includes a light receiver 90 that receives light that has passed through the projection optical system PL via a slit plate 75 having a slit portion 71 disposed on the image plane side of the projection optical system PL. The slit plate 75 is provided on the Z tilt stage 52 on the image plane side of the projection optical system PL. The light receiver 90 receives an optical element 76 disposed near the slit plate 75 inside the Z tilt stage 52, a mirror 77 that bends an optical path of light that has passed through the optical element 76, and light that passes through the mirror 77. An optical element 78, a light transmission lens 79 that sends the light that has passed through the optical element 78 to the outside of the Z tilt stage 52, a mirror 80 that is provided outside the Z tilt stage 52 and bends the optical path of the light from the light transmission lens 79; A light receiving lens 81 that receives light that has passed through the mirror 80 and a light sensor (light receiving element) 82 that includes a photoelectric conversion element that receives light via the light receiving lens 81 are provided.

  The slit plate 75 includes a glass plate member 74 having a rectangular shape in plan view, a light shielding film 72 made of chromium or the like provided at the center of the upper surface of the glass plate member 74, and the periphery of the light shielding film 72, that is, the glass plate member 74. A reflection film 73 made of aluminum or the like provided on a portion of the upper surface other than the light shielding film 72 and a slit portion 71 that is an opening pattern formed in a part of the light shielding film 72 are provided. In the slit portion 71, a glass plate member 74 that is a transparent member is exposed, and light can pass through the slit portion 71.

  A convex portion 83 is provided at a position adjacent to the substrate holder 51 on the upper surface of the Z tilt stage 52, and an opening 84 is provided above the convex portion 83. The slit plate 75 can be attached to and detached from the opening 84 of the convex portion 83, and is fitted from above in a state of closing the opening 84.

  As a material for forming the glass plate member 74, synthetic quartz or meteorite having good transparency to ArF excimer laser light or KrF excimer laser light is used. The refractive index of synthetic quartz for ArF excimer laser light is about 1.56, and the refractive index for KrF excimer laser light is about 1.51.

  The optical element 76 is disposed below the slit portion 71 inside the Z tilt stage 52 and is held by a holding member 85. The holding member 85 holding the optical element 76 is attached to the inner wall surface 83 </ b> A of the convex portion 83. The light that has passed through the optical element 76 disposed inside the Z tilt stage 52 passes through the optical element 78 after its optical path is bent by the mirror 77. The light that has passed through the optical element 78 is sent out of the Z tilt stage 52 by a light transmission lens 79 that is fixed to the + X side wall of the Z tilt stage 52. The light transmitted to the outside of the Z tilt stage 52 by the light transmitting lens 79 is guided to the light receiving lens 81 by the mirror 80. The light receiving lens 81 and the optical sensor 82 disposed above the light receiving lens 81 are housed in a case 86 while maintaining a predetermined positional relationship. The case 86 is fixed in the vicinity of the upper end portion of the support column 88 provided on the upper surface of the stage base 54 via an attachment member 87.

  The mirror 77, the optical element 78, the light transmission lens 79, and the like are detachable from the Z tilt stage 52. A support column 88 that supports the case 86 that houses the light receiving lens 81 and the optical sensor 82 is detachable from the stage base 54.

  As the optical sensor 82, a photoelectric conversion element (light receiving element) capable of detecting weak light with high accuracy, for example, a photomultiplier tube (PMT, photomultiplier tube) or the like is used. The photoelectric conversion signal from the optical sensor 82 is sent to the control device CONT via the signal processing device.

  FIG. 5 is a diagram illustrating a state in which the imaging characteristics of the projection optical system PL are measured using the aerial image measurement device 70. As shown in FIG. 5, during the measurement of the imaging characteristics of the projection optical system PL, the liquid supply mechanism 10 and the liquid recovery mechanism 20 are used with the projection optical system PL and the slit plate 75 facing each other. The liquid LQ is caused to flow between the optical element 60 on the front end side (image plane side) of the projection optical system PL and the slit plate 75. Then, in a state where the liquid LQ is filled between the optical element 60 of the projection optical system PL and the slit plate 75, the light (exposure light EL) via the projection optical system PL and the liquid LQ constitutes the aerial image measurement device 70. The slit plate 75 is irradiated. The surface position information of the upper surface 75A of the slit plate 75 at this time can be detected using the focus detection system 45.

6 is an enlarged cross-sectional view of the main part showing the vicinity of the slit plate 75 and the optical element 76 disposed in the convex portion 83 of the aerial image measuring device 70, and FIG. 7 is a plan view of the slit plate 75 viewed from above. It is. In FIG. 6, the light receiver 90 is illustrated in a simplified manner. Among the plurality of optical elements and members constituting the light receiver 90, the optical element disposed at the position closest to the slit plate 75 on the optical path of light. Only the element 76 and the optical sensor 82 that receives the light that has passed through the optical element 76 are shown. In the aerial image measurement device 70 shown in FIG. 6, the liquid LQ is filled between the slit plate 75 and the light receiver 90. In the present embodiment, the liquid LQ is a slit among a plurality of optical elements (optical members) disposed on the lower surface of the slit plate 75 fitted in the opening 84 of the convex portion 83 and the optical path of the light receiver 90. The space between the optical element 76 and the optical element 76 disposed closest to the plate 75 is filled. The optical element 76 is held by a holding member 85 attached to the inner wall surface 83 </ b> A of the convex portion 83 at a position below the slit plate 75, and the liquid LQ is applied to the slit plate 75, the holding member 85, and the optical element 76. The enclosed space SP is filled. In the present embodiment, the optical element 76 is constituted by a plano-convex lens, and is disposed with its flat surface facing upward. Then, the inner bottom surface 85 </ b> A of the holding member 85 and the optical element 76.
Is substantially flush with the upper surface (flat surface) 76A. In addition, the holding member 85 is formed in a substantially upward U-shape in cross section, and the outer surface 85B of the holding member 85 and the inner wall surface 83A of the convex portion 83 are in close contact with each other, and the upper end surface (slit plate 75) of the holding member 85 A sealing member 91 such as an O-ring is provided between 85C and the slit plate 75. Thereby, the inconvenience that the liquid LQ filled in the space SP leaks to the outside is prevented.

  The holding member 85 holding the slit plate 75 and the optical element 76 can be attached to and detached from the inner wall surface 83 </ b> A of the convex portion 83. When the holding member 85 is attached, the holding member 85 holding the optical element 76 is inserted into the convex portion 83 from the opening 84 of the convex portion 83 (at this time, the slit plate 75 is not attached). The holding member 85 and the inner wall surface 83A of the convex portion 83 are fixed by a fixing member. Next, the slit plate 75 is fitted into the opening 84. On the other hand, when removing the holding member 85, the slit plate 75 may be removed from the opening 84, and then the holding member 85 may be pulled out through the opening 84.

  The exposure apparatus EX includes a liquid supply apparatus 100 that supplies the liquid LQ to the space SP between the slit plate 75 and the optical element 76 of the light receiver 90, and a liquid recovery apparatus 104 that recovers the liquid LQ in the space SP. It has. A supply channel 102 connected to the space SP is formed on the + X side wall of the convex portion 83 and the holding member 85, and a recovery channel 106 connected to the space SP is formed on the −X side wall. . Further, one end of a supply pipe 101 is connected to the liquid supply apparatus 100, and the other end of the supply pipe 101 is connected to a supply flow path 102 via a joint 103. One end of a recovery pipe 105 is connected to the liquid recovery apparatus 104, and the other end of the recovery pipe 105 is connected to a recovery flow path 106 via a joint 107. Valves 101A and 105A for opening and closing the flow paths are provided in the middle of the supply pipe 101 and the collection pipe 105, respectively. The operations of the liquid supply device 100, the liquid recovery device 104, and the valves 101A and 105A are controlled by the control device CONT, and the control device CONT controls these to supply and recover the liquid LQ to and from the space SP. Fill SP with liquid LQ.

  As shown in FIG. 7, the slit plate 75 includes a light shielding film 72 made of chromium or the like provided in the center of the upper surface of a rectangular glass plate member 74 in plan view, and the periphery of the light shielding film 72, that is, the glass plate member 74. A reflective film 73 made of aluminum or the like provided on a portion other than the light shielding film 72 and a slit portion 71 which is an opening pattern formed in a part of the light shielding film 72. In the slit portion 71, a glass plate member 74 that is a transparent member is exposed, and light can pass through the slit portion 71. The slit portion 71 is a rectangular (rectangular) slit whose longitudinal direction is the Y-axis direction, and has a predetermined width 2D.

  Next, a procedure for measuring the imaging characteristics of the projection optical system PL using the above-described aerial image measurement device 70 will be described.

  When measuring the aerial image (projected image), the control device CONT moves the substrate stage PST so that the projection optical system PL and the slit plate 75 face each other (that is, the state shown in FIG. 5). Then, the liquid supply mechanism 10 and the liquid recovery mechanism 20 are used to fill the liquid LQ between the optical element 60 at the tip of the projection optical system PL and the slit plate 75. In parallel (or before or after), the control device CONT fills the liquid LQ between the optical element 76 of the light receiver 90 and the slit plate 75 using the liquid supply device 100 and the liquid recovery device 104. . Here, in the following description, the immersion area formed by the LQ filled between the projection optical system PL and the slit plate 75 is referred to as “first immersion area LA1”, the slit plate 75 and the light receiver 90 ( The liquid immersion area formed by the liquid LQ filled with the optical element 76) is appropriately referred to as “second liquid immersion area LA2”.

  At the time of measuring the aerial image, a mask M provided with a measurement mark to be described later is supported on the mask stage MST. The control device CONT illuminates the mask M with the exposure light EL by the illumination optical system IL. Light (exposure light EL) that passes through the measurement mark, the projection optical system PL, and the liquid LQ in the first immersion area LA1 is applied to the slit plate 75. The light that has passed through the slit portion 71 of the slit plate 75 enters the optical element 76 via the liquid LQ in the second immersion area LA2.

  Since the numerical aperture NA of the projection optical system is improved by the liquid LQ in the first immersion area LA1 between the projection optical system PL and the slit plate 75, the optical element of the light receiver 90 is changed according to the numerical aperture NA of the projection optical system PL. Unless the numerical aperture NA of 76 is also improved, the optical element 76 may not be able to capture (all) the light that has passed through the projection optical system PL, and will not be able to receive the light satisfactorily. Therefore, when the numerical aperture NA of the projection optical system PL is improved by filling the liquid LQ between the projection optical system PL and the slit plate 75 as in the present embodiment, the slit plate 75 and the light receiver 90 are used. By filling the liquid LQ between the optical element 76 and the optical element 76 of the optical receiver 76 to improve the numerical aperture NA of the optical element 76, the optical element 76 of the optical receiver 90 improves the light through the projection optical system PL. Can be captured.

  The optical element 76 condenses the light that has passed through the second immersion area LA2. The light condensed by the optical element 76 is guided to the outside of the substrate stage PST through the mirror 77, the optical element 78, and the light transmission lens 79. The light guided to the outside of the substrate stage PST is bent in the optical path by the mirror 80, received by the optical sensor 82 through the light receiving lens 81, and a photoelectric conversion signal corresponding to the amount of light received from the optical sensor 82. (Light quantity signal) is output to the control device CONT via the signal processing device.

  As will be described later, in the present embodiment, measurement of the projected image (aerial image) of the measurement mark is performed by the slit scan method, and in this case, the light transmitting lens 79 is connected to the light receiving lens 81 and the optical sensor 82. Will move. Therefore, in the aerial image measuring device 70, the size of each lens and the mirror 80 is set so that all the light passing through the light transmitting lens 79 moving within a predetermined range is incident on the light receiving lens 81.

  In the aerial image measurement device 70, since the optical sensor 82 is provided at a predetermined position outside the substrate stage PST, the measurement accuracy of the laser interferometer 44 due to the heat generated by the optical sensor 82 can be affected. It is suppressed. Further, since the outside and the inside of the substrate stage PST are not connected by a light guide or the like, the driving accuracy of the substrate stage PST is affected as in the case where the outside and the inside of the substrate stage PST are connected by a light guide. There is nothing. Of course, when the influence of heat or the like can be ignored or eliminated, the optical sensor 82 may be provided inside the substrate stage PST. That is, some of the plurality of optical elements and light receiving elements constituting the light receiver 90 may be provided on the substrate stage PST, or all may be provided on the substrate stage PST.

  In the present embodiment, the liquid LQ used in the “first liquid immersion area LA1” and the “second liquid immersion area LA2” may be the same type of liquid, or may be a different type, particularly a refractive index for exposure light. Different liquids may be used. In particular, the liquid used for the “first immersion area LA1” is preferably selected in consideration of the NA or refractive index of the optical element provided at the tip of the projection optical system, while the “second immersion area LA1”. The liquid used for “region LA2” can be selected in consideration of the refractive index of the glass plate member 74 and / or the size and refractive index of the optical element 76.

  In this embodiment, an example in which the aerial image measurement device 70 in which the liquid LQ is filled between the slit plate 75 and the light receiver 90 (optical element 76) is applied to the immersion exposure apparatus has been described. The aerial image measuring device 70 (light receiver 90) according to the present invention can also be applied to a dry exposure apparatus (normal exposure apparatus) that performs exposure without filling the liquid LQ between the system PL and the substrate P. When measuring the aerial image in the dry exposure apparatus, the slit optical plate PL and the slit plate 75 are opposed to each other and the liquid LQ is not filled between the projection optical system PL and the slit plate 75, and the slit plate is used. 75 and the optical element 76 of the light receiver 90 are filled with the liquid LQ (in the state where only the second liquid immersion area LA2 is formed without forming the first liquid immersion area LA1), the projection optical system PL The slit plate 75 is irradiated with the exposure light EL via. The optical element 76 of the light receiver 90 is improved in numerical aperture NA by the liquid LQ filled between the slit plate 75 and the optical element 76, so that the projection optics having a large numerical aperture NA (for example, NA> 0.9). Even a dry exposure apparatus equipped with a system can receive light well. Further, for example, even if the optical element 76 of the light receiver 90 is brought into close contact with the slit plate 75, the light that has passed through the projection optical system PL can be received well, and the effect that the entire light receiver 90 can be made compact is obtained.

  In the present embodiment, the liquid LQ is filled and filled in the space SP between the slit plate 75 and the optical element 76 by using the liquid supply device 100 and the liquid recovery device 104 to supply and recover the liquid LQ. However, without using the liquid supply apparatus 100 and the liquid recovery apparatus 104, for example, a configuration in which the liquid LQ is filled in the space SP at the time of manufacturing the exposure apparatus EX is possible. In this case, for example, the slit plate 75 may be removed from the convex portion 83 (Z tilt stage 52), and the liquid LQ in the space SP may be periodically replaced, or the liquid LQ that has excellent storage stability and does not require replacement. May be used. On the other hand, by supplying and recovering the liquid LQ using the liquid supply apparatus 100 and the liquid recovery apparatus 104, the space SP can be always filled with a fresh (clean) liquid LQ. During the measurement by the aerial image measurement device 70, the liquid supply operation and the liquid recovery operation of the liquid supply device 100 and the liquid recovery device 104 may be stopped. For example, when the holding member 85 holding the slit plate 75 and the optical element 76 is removed from the convex portion 83 (Z tilt stage 52), the liquid recovery device 104 collects the liquid LQ in the space SP, and then the slit plate 75 or By removing the holding member 85 holding the optical element 76, the attaching / detaching operation can be performed without leaking the liquid LQ.

  Note that the liquid LQ is not filled between the slit plate 75 and the light receiver 90 (optical element 76), and the refractive index substantially the same as that of the liquid LQ is provided between the slit plate 75 and the light receiver 90 (optical element 76). You may arrange | position the transparent member (optical member, glass member) which has. Examples of such a light transmissive member include quartz and meteorite. The liquid LQ in this embodiment is pure water, and the refractive index of pure water with respect to ArF excimer laser light is said to be approximately 1.44. On the other hand, the refractive index of quartz with respect to ArF excimer laser light is said to be approximately 1.56. Therefore, instead of forming the second immersion area LA2 with the liquid (pure water) LQ, a light transmitting member made of quartz may be disposed between the slit plate 75 and the optical element 76.

  Hereinafter, an example of an aerial image measurement operation using the aerial image measurement device 70 will be described with reference to FIG. As described above, FIG. 5 is a diagram showing a state where an aerial image is being measured. At the time of aerial image measurement, as the mask M, a dedicated one for aerial image measurement or a device in which a dedicated measurement mark is formed on a device manufacturing mask used for device manufacture is used. Instead of these masks, a mask stage MST may be provided with a fixed mark plate (fiducial mark plate) made of the same glass material as the mask, and a measurement mark formed on the mark plate. .

  The mask M includes a line-and-space (L / S) mark whose ratio (duty ratio) between the width of the line portion and the width of the space portion having a periodicity in the X-axis direction is 1: 1 at a predetermined position. The mark PMx and the measurement mark PMy made of an L / S mark having a periodicity ratio of 1: 1 in the Y-axis direction are formed close to each other. These measurement marks PMx and PMy are composed of line patterns having the same line width. Further, as shown in FIG. 8A, the slit plate 75 constituting the aerial image measuring device 70 includes a slit portion 71x having a predetermined width 2D extending in the Y-axis direction and a slit having a predetermined width 2D extending in the X-axis direction. The portion 71y is formed in a predetermined positional relationship as shown in FIG. In this manner, the slit plate 75 is actually formed with a plurality of slit portions 71x, 71y, etc., but these slit portions are shown as the slit portions 71 in FIGS. Yes.

  For example, in the measurement of the aerial image of the measurement mark PMx, the control device CONT drives the movable mask blind 7B shown in FIG. Is limited to a predetermined area including In this state, light emission of the light source 1 is started by the control device CONT, and when the exposure light EL is irradiated onto the measurement mark PMx, the light (exposure light EL) diffracted and scattered by the measurement mark PMx is caused by the projection optical system PL. Refracted and a spatial image (projected image) of the measurement mark PMx is formed on the image plane of the projection optical system PL. At this time, as shown in FIG. 8A, the substrate stage PST is at a position where the spatial image PMx ′ of the measurement mark PMx is formed on the + X side (or −X side) of the slit portion 71x on the slit plate 75. It shall be provided.

  Under the instruction of the control device CONT, when the substrate stage PST is driven in the + X direction as indicated by the arrow Fx in FIG. 8A by the substrate stage driving device PSTD, the slit portion 71x is aerial image. Scanning is performed in the X-axis direction with respect to PMx ′. During this scanning, light (exposure light EL) that passes through the slit portion 71x passes through the light receiving optical system in the substrate stage PST (Z tilt stage 52), the mirror 80 outside the substrate stage PST, and the light receiving lens 81, and the optical sensor 82. And the photoelectric conversion signal is supplied to the signal processing device. The signal processing device performs predetermined processing on the photoelectric conversion signal and supplies a light intensity signal corresponding to the aerial image PMx ′ to the control device CONT. At this time, the signal processing apparatus is a signal obtained by standardizing the signal from the optical sensor 82 with the signal from the integrator sensor 33 shown in FIG. 1 in order to suppress the influence of the variation in the emission intensity of the exposure light EL from the light source 1. Is supplied to the control device CONT. FIG. 8B shows an example of a photoelectric conversion signal (light intensity signal) obtained at the time of the aerial image measurement.

  Note that the measurement mark is not limited to the above-described mark, and can be appropriately determined according to the imaging characteristics of the measurement target, measurement accuracy, and the like.

  When measuring the aerial image of the measurement mark PMy, the substrate stage PST is provided at a position where the aerial image of the measurement mark PMy is formed on the + Y side (or -Y side) of the slit portion 71y on the slit plate 75. The photoelectric conversion signal (light intensity signal) corresponding to the aerial image of the measurement mark PMy can be obtained by performing measurement by the slit scanning method similar to the above.

  In the measurement for obtaining the imaging characteristic adjustment information and the like, first, in the initial adjustment, the optical elements 64a and 64b of the projection optical system PL are driven one by one, and the first and second sealed chambers 65A and 65B are also driven. The pressure of the projection optical system PL is changed one by one, and the focus of the projection optical system PL and other predetermined imaging characteristics (for example, at least one of various aberrations such as field curvature, magnification, distortion, coma aberration, spherical aberration, etc.) ) Is measured using the aerial image measuring device 70 as will be described later, and the driving amount of the optical elements 64a and 64b and the imaging characteristic change amount with respect to the pressure change in the first and second sealed chambers 65A and 65B are obtained. .

Hereinafter, a method for detecting the best focus position of the projection optical system PL will be described as an example of an imaging characteristic measurement operation. In this case, it is assumed that the normal stop of the illumination system aperture stop plate 4 is selected as a precondition, and the normal illumination condition is set as the illumination condition. For detection of the best focus position, for example, a mask M on which a measurement mark PMx (or PMy) made of an L / S pattern having a line width of 1 μm and a duty ratio of 50% is used. First, the mask M is loaded onto the mask stage MST by a loader device (not shown). Next, the control device CONT moves the mask stage MST via the mask stage driving device MSTD so that the measurement mark PMx on the mask M substantially coincides with the optical axis of the projection optical system PL. Next, the control device CONT drives and controls the movable mask blind 7B so that the exposure light EL is irradiated only on the measurement mark PMx portion, thereby defining the illumination area. In this state, the control device CONT irradiates the mask M with the exposure light EL, scans the substrate stage PST in the X-axis direction, and uses the aerial image measurement device 70 to scan the measurement mark PMx. Aerial image measurement is performed by the slit scan method. At this time, the control device CONT changes the position of the slit plate 75 in the Z-axis direction (that is, the position of the Z tilt stage 52) at a predetermined step pitch via the substrate stage driving device PSTD, and the space of the measurement mark PMx. Image measurement is repeated a plurality of times, and the light intensity signal (photoelectric conversion signal) for each time is stored in the storage device MRY. Note that the change in the position of the slit plate 75 in the Z-axis direction is performed by controlling the actuators 59A, 59B, and 59C based on the measurement values of the encoders 58A, 58B, and 58C of the Z tilt stage 52. And the control apparatus CONT each carries out the Fourier transformation of the some light intensity signal (photoelectric conversion signal) obtained by the said repetition, and calculates | requires the contrast which is an amplitude ratio of each primary frequency component and zeroth-order frequency component. Then, the control device CONT detects the Z position of the Z tilt stage 52 (that is, the position of the slit plate 75 in the Z-axis direction) corresponding to the light intensity signal that maximizes the contrast, and this position is projected into the projection optical system PL. Is determined as the best focus position. Since the contrast changes sensitively according to the focus position (defocus amount), the best focus position of the projection optical system PL can be measured (determined) accurately and easily. The control device CONT performs focus calibration which is reset (calibration) of the detection origin (detection reference point) of the focus detection system 45 based on the obtained best focus position. Accordingly, the substrate stage PS is thereafter handled by the focus detection system 45.
A predetermined surface on T (for example, the surface of the substrate P or the surface of the slit plate 75) can be positioned at a position optically conjugate with the reference surface of the mask M.

  It should be noted that the amplitude of the second and higher order real frequency components is generally small, and there are cases where the amplitude for electrical noise and optical noise may not be sufficient, but the S / N ratio (signal / noise ratio). If there is no problem in this point, the best focus position can be obtained even by observing the change in the amplitude ratio of the higher-order frequency components. The best focus position can be detected not only by the method using the contrast described above but also by a method of detecting the Z position (focus position) at which the differential value of the light intensity signal is maximum.

Further, here, a method (slit scanning method) in which the slit portion 71 (slit plate 75) is scanned in a predetermined direction in the XY plane when measuring the best focus position of the projection optical system PL has been described. A spatial image of a measurement mark such as a mark is formed on the image plane of the projection optical system PL, and the slit portion 71 (slit plate 75) is relatively scanned with respect to this spatial image in the optical axis AX direction (Z-axis direction). As described above, the slit plate 75 (Z tilt stage 52) may be scanned along the Z-axis direction within a predetermined stroke range centered on the best focus position. Then, the best focus position is obtained based on the light intensity signal (peak value) at that time. In this case, it is preferable to use a measurement mark having a size and shape such that the spatial image of the measurement mark substantially matches the shape of the slit portion 71 (71x or 71y) on the image plane. If such an aerial image measurement is performed, a light intensity signal as shown in FIG. 9 can be obtained. In this case, by directly finding the position of the peak of the signal waveform of the light intensity signal, the Z position at that point may be set as the best focus position Z ₀ , or the light intensity signal is sliced at a predetermined slice level line SL, the Z position of the two intersections of the midpoint between the light intensity signal and the slice level line SL may best focus position Z _0. In any case, this method can improve the throughput because the best focus position can be detected only by scanning the slit plate 75 once in the Z-axis direction.

Next, a method for detecting the image plane shape (field curvature) of the projection optical system PL will be described as an example of the imaging characteristic measurement operation. When detecting this field curvature, a mask M1 in which measurement marks PM _{1 to} PM _n having the same dimensions and the same period as the measurement marks PMx are formed in the pattern area PA as shown in FIG. 10 as an example. After the mask M1 is loaded on the mask stage MST, the controller CONT, as measurement marks PM _k in the center of the mask M1 is substantially coincident on the optical axis of the projection optical system PL, via the mask stage driving unit MSTD To move the mask stage MST. That is, positioning of the mask M1 to the reference point is performed. When positioning to this reference point is performed, it is assumed that all of the measurement marks PM _{1 to} PM _n are located in the field of view of the projection optical system PL. Next, the control device CONT drives and controls the movable mask blind 7B so that the exposure light EL is irradiated only on the measurement mark PM ₁ portion, thereby defining the illumination area. In this state, the control unit CONT radiates the exposure light EL on the mask M1, aerial image measurement and the projection optical system PL of the measurement mark PM ₁ by using the spatial image-measuring device 70 by the slit scan method in the same manner as described above The best focus position is detected, and the result is stored in the storage device MRY. Defining the detection of the best focus position with measurement marks PM ₁ ends, the control unit CONT, the illumination area of the movable mask blind 7B controls and drives so that the exposure light EL is irradiated only to the mark PM ₂ parts Measurement To do. In this state, detection is performed best focus position of the same spatial image measurement and the projection optical system of the measurement mark PM ₂ slit scan method PL, and stores the result in the storage device MRY. Thereafter, similarly to the above, the control device CONT repeatedly performs aerial image measurement and detection of the best focus position of the projection optical system PL for the measurement marks PM _{3 to} PM _n while changing the illumination area. Then, the control unit CONT, the best focus position obtained by these Z _1, Z 2, _..., by performing a predetermined statistical process based on Z _n, to calculate the curvature of the projection optical system PL .

Further, when detecting the spherical aberration of the projection optical system PL, a mask M2 shown in FIG. 11 is used. Two measurement marks PM1 and PM2 are formed in the pattern area PA of the mask M2 shown in FIG. 11 at a substantially central position in the Y-axis direction and separated by a predetermined distance in the X-axis direction. The measurement mark PM1 is an L / S pattern having the same dimensions and the same period as the measurement mark PMx described above. In addition, the measurement mark PM2 is an L / S lined up in the X-axis direction at a period (for example, about 1.5 to 2 times the period (mark pitch) of the measurement mark PM1) of the line pattern having the same dimensions as the measurement mark PMx. It is a pattern. After loading the mask M2 onto the mask stage MST, the control device CONT uses the mask stage MST via the mask stage driving device MSTD so that the measurement mark PM1 on the mask M2 substantially coincides with the optical axis of the projection optical system PL. To move. Next, the control device CONT drives and controls the movable mask blind 7B so as to define the illumination area so that the exposure light EL is irradiated only on the measurement mark PM1 portion. In this state, the control device CONT irradiates the mask M2 with the exposure light EL, and performs the aerial image measurement and projection optical system PL of the measurement mark PM1 using the aerial image measurement device 70 by the slit scan method in the same manner as described above. The best focus position is detected, and the result is stored in the storage device MRY. When the detection of the best focus position using the measurement mark PM1 is completed, the control device CONT moves the mask stage MST in the −X direction via the mask stage driving device MSTD so that the exposure light EL is irradiated to the measurement mark PM2. Move a predetermined distance. In this state, similarly to the above, the aerial image measurement of the measurement mark PM2 and the best focus position of the projection optical system PL are detected by the slit scan method, and the result is stored in the storage device MRY. Based on the difference between the best focus positions Z ₁ and Z ₂ obtained from these, the control device CONT calculates the spherical aberration of the projection optical system PL by calculation.

Further, when detecting the magnification and distortion of the projection optical system PL, a mask M3 shown in FIG. 12 is used. Measurement marks BM made up of a total of five square marks of, for example, 120 μm square (30 μm square on the slit plate 75 at a projection magnification of ¼ times) at the center and four corners of the pattern area PA of the mask M3 shown in FIG. _{1 to} BM ₅ are formed. After loading the mask M3 on the mask stage MST, the controller CONT, so that the center of the measurement mark BM ₁ existing in the center of the mask M3 is, substantially it coincides with the optical axis of the projection optical system PL, the mask stage drive The mask stage MST is moved via the apparatus MSTD. That is, the mask M3 is positioned to the reference point. It is assumed that all the measurement marks BM _{1 to} BM ₅ are located in the field of view of the projection optical system PL in the state where the positioning to the reference point has been performed. Next, the control unit CONT, the exposure light EL to define an illumination region of the movable mask blind 7B controls and drives so as to irradiate only a large rectangular area portion slightly from the measurement mark BM ₁ comprising measuring marks BM ₁ . In this state, the control device CONT irradiates the mask M3 with the exposure light EL. As a result, a spatial image of the measurement mark BM ₁ , that is, a square mark image of approximately 30 μm square is formed. In this state, the control device CONT performs the aerial image measurement of the measurement mark BM ₁ using the aerial image measurement device 70 while scanning the substrate stage PST in the X-axis direction via the substrate stage driving device PSTD, and by the measurement The obtained light intensity signal is stored in the storage device MRY. Next, based on the obtained light intensity signal, the control device CONT obtains the imaging position of the measurement mark BM ₁ by, for example, a known phase detection method or edge detection method. Here, as a method of phase detection, for example, the product of a primary frequency component (which can be regarded as a sine wave) obtained by Fourier transforming a light intensity signal and a sine wave serving as a reference of the same frequency. For example, the sum of one period is obtained, and the sum of, for example, one period of the product of the primary frequency component and the cosine wave serving as the reference of the same period is obtained. Then, the phase difference of the primary frequency component with respect to the reference signal is obtained by obtaining the arc sine of the quotient obtained by dividing the obtained sum, and the measurement mark BM ₁ is obtained based on this phase difference. A general method of obtaining the X position x ₁ of the _first can be used. In addition, as an edge detection method, an edge detection method using a slice method that calculates the position of each aerial image edge corresponding to each photoelectric conversion signal based on the intersection of the light intensity signal and a predetermined slice level. Can be used. Next, the control device CONT measures the aerial image of the measurement mark BM ₁ using the aerial image measurement device 70 while scanning the substrate stage PST in the Y-axis direction, and stores the light intensity signal obtained by the measurement in the storage device. Store in MRY. Then, the Y position y ₁ of the measurement mark BM _{1 is obtained} by a method such as phase detection similar to the above. Then, the control unit CONT based on the coordinate position of the obtained measurement mark _{BM 1 (x 1, y 1} ), to correct the positional deviation of the optical axis center of the mask M3. When the correction of the positional deviation of the mask M3 is completed, the control unit CONT, the movable mask blind 7B so that the exposure light EL is irradiated only to the larger rectangular area portion slightly from the measurement mark BM ₂ comprising measuring marks BM ₂ Is controlled to define the illumination area. In this state, as described above, the aerial image measurement and XY position measurement of the measurement mark BM ₂ are performed by the slit scanning method, and the result is stored in the storage device MRY. Thereafter, the control device CONT repeatedly performs the measurement of the aerial image and the measurement of the XY position for the measurement marks BM _{3 to} BM ₅ while changing the illumination area. Based on the coordinate values (x ₂ , y ₂ ), (x ₃ , y ₃ ), (x ₄ , y ₄ ), (x ₅ , y ₅ ) of the measurement marks BM _{2 to} BM ₅ obtained thereby. By performing a predetermined calculation, the control device CONT calculates at least one of the magnification and distortion of the projection optical system PL.

  The procedure for measuring the best focus position, curvature of field, spherical aberration, magnification, and distortion of the projection optical system PL using the aerial image measurement device 70 has been described above as an example. It should be noted that the aerial image measuring device 70 can also measure other imaging characteristics such as coma aberration using predetermined measurement marks.

  As described above, when the imaging characteristics of the projection optical system PL are measured by the slit scanning method, the slit plate 75 (slit portion 71) is relatively set with respect to the light (exposure light EL) via the projection optical system PL. The light receiver 90 (optical element 76) is irradiated with light through the liquid LQ.

  Based on the measured image formation characteristic information of the projection optical system PL, the control device CONT corrects the amount of correction for obtaining desired image formation characteristics, specifically, the drive amounts of the optical elements 64a and 64b of the projection optical system PL. And the adjustment amount of the internal pressure of 1st, 2nd sealed chamber 65A, 65B is calculated | required. Here, in the storage device MRY, for example, adjustment of the driving amounts of the optical elements 64a and 64b of the projection optical system PL and the internal pressures of the first and second sealed chambers 65A and 65B, which are obtained in advance by experiments or simulations, for example. The relationship between the amount and the change amount (variation amount) of various image formation characteristics of the projection optical system PL (that is, image formation characteristic adjustment information) is stored. The control device CONT refers to the relationship stored in the storage device MRY and drives the optical elements 64a and 64b of the projection optical system PL to correct the imaging characteristics of the projection optical system PL to a desired state. A correction amount including an adjustment amount of the internal pressure of the first and second sealed chambers 65A and 65B is obtained. Details of aerial image measurement are disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-14005.

  The procedure for exposing the device manufacturing pattern onto the substrate P using the exposure apparatus EX will be described below.

  After measuring the imaging characteristics via the projection optical system PL and the liquid LQ by the aerial image measurement device 70 and deriving a correction amount for correcting the imaging characteristics, the control device CONT includes the projection optical system PL. The substrate stage PST is driven via the substrate stage driving device PSTD so that the substrate P loaded on the substrate stage PST faces the substrate P. At this time, a mask M on which a device manufacturing pattern is formed is loaded on the mask stage MST. Then, the control device CONT drives the liquid supply unit 11 of the liquid supply mechanism 10 and supplies a predetermined amount of liquid LQ per unit time onto the substrate P via the supply pipe 12 and the supply nozzle 13. Further, the control device CONT drives the liquid recovery unit (vacuum system) 21 of the liquid recovery mechanism 20 in accordance with the supply of the liquid LQ by the liquid supply mechanism 10, and performs a unit per unit time via the recovery nozzle 23 and the recovery pipe 22. A fixed amount of liquid LQ is recovered. Thereby, an immersion area AR2 of the liquid LQ is formed between the optical element 60 at the tip of the projection optical system PL and the substrate P.

  Then, the control device CONT illuminates the mask M with the exposure light EL by the illumination optical system IL, and projects an image of the pattern of the mask M onto the substrate P through the projection optical system PL and the liquid LQ. Here, when performing the exposure process on the substrate P, the control unit CONT drives the optical elements 64a and 64b of the projection optical system PL based on the obtained correction amount, and the first and second sealed chambers. The exposure processing is performed while adjusting the internal pressures of 65A and 65B and adjusting the imaging characteristics via the projection optical system PL and the liquid LQ.

At the time of scanning exposure, a part of the pattern image of the mask M is projected onto the projection area AR1, and the mask M moves in the −X direction (or + X direction) at the velocity V with respect to the projection optical system PL. Then, the substrate P moves in the + X direction (or -X direction) at a speed β · V (β is the projection magnification) via the substrate stage PST. Then, after the exposure of one shot area is completed, the next shot area is moved to the scanning start position by stepping the substrate P, and thereafter, the exposure process for each shot area is sequentially performed by the step-and-scan method. In the present embodiment, the liquid LQ is set to flow in the same direction as the movement direction of the substrate P in parallel with the movement direction of the substrate P. That is, when scanning exposure is performed by moving the substrate P in the scanning direction (−X direction) indicated by the arrow Xa (see FIG. 3), the supply pipe 12, the supply nozzles 13A to 13C, the recovery pipe 22, and the recovery nozzle The liquid LQ is supplied and recovered by the liquid supply mechanism 10 and the liquid recovery mechanism 20 using 23A and 23B. That is, when the substrate P moves in the −X direction, the liquid LQ is supplied from the supply nozzle 13 (13A to 13C) between the projection optical system PL and the substrate P, and the recovery nozzle 23 (23A, 23B). ), The liquid LQ on the substrate P is collected, and the liquid LQ flows in the −X direction so as to fill the space between the optical element 60 at the tip of the projection optical system PL and the substrate P. On the other hand, when scanning exposure is performed by moving the substrate P in the scanning direction (+ X direction) indicated by the arrow Xb (see FIG. 3), the supply pipe 15, the supply nozzles 16A to 16C, the recovery pipe 25, and the recovery nozzle 26A. , 26B, the liquid LQ is supplied and recovered by the liquid supply mechanism 10 and the liquid recovery mechanism 20. That is, when the substrate P moves in the + X direction, the liquid LQ is supplied from the supply nozzle 16 (16A to 16C) between the projection optical system PL and the substrate P, and the recovery nozzle 26 (26A, 26B). As a result, the liquid LQ on the substrate P is collected, and the liquid LQ flows in the + X direction so as to fill the space between the optical element 60 at the tip of the projection optical system PL and the substrate P. In this case, for example, the liquid LQ supplied via the supply nozzle 13 flows so as to be drawn between the optical element 60 and the substrate P as the substrate P moves in the −X direction. Even if the supply energy of the (liquid supply unit 11) is small, the liquid LQ can be easily supplied between the optical element 60 and the substrate P. Then, by switching the direction in which the liquid LQ flows according to the scanning direction, the liquid LQ is moved between the optical element 60 and the substrate P when the substrate P is scanned in either the + X direction or the −X direction. And a high resolution and a wide depth of focus can be obtained.

  In the above embodiment, during the measurement operation by the aerial image measurement device 70, the liquid supply of the liquid supply mechanism 10 and the liquid recovery by the liquid recovery mechanism 20 are performed, and the optical element 60 and the slit plate 75 of the projection optical system PL are performed. The liquid LQ flows between the liquid LQ and the liquid LQ when the temperature of the liquid LQ changes due to light irradiation and the deterioration of the liquid LQ is small. In some cases, both the liquid supply by the liquid supply mechanism 10 and the liquid recovery by the liquid recovery mechanism 20 may be stopped, and the liquid LQ may be recovered by the liquid recovery mechanism 20 after the measurement operation ends.

  Hereinafter, another embodiment of the present invention will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 13 is a diagram showing another embodiment of the aerial image measurement device 70. In FIG. 13, among the light receivers 90 of the aerial image measuring device 70, the optical sensor 82 is disposed at a position closest to the slit plate 75, and the space L between the optical sensor 82 and the slit plate 75 is filled with the liquid LQ. ing. The optical sensor 82 is held by a holding member 85. The light receiving surface 82A of the optical sensor 82 and the inner bottom surface 85A of the holding member 85 are flush with each other. Even with such a configuration, the optical sensor 82 can well receive light that has passed through the projection optical system PL, the first liquid immersion area LA1, the slit plate 75, and the second liquid immersion area LA2.

  FIG. 14 shows another embodiment of the aerial image measurement device 70. As shown in FIG. 14, the light receiving surface 82 </ b> A of the optical sensor 82 is in close contact with the lower surface of the slit plate 75. That is, in the example shown in FIG. 14, the second liquid immersion area LA2 is not formed. Thus, by arranging the optical sensor 82 of the light receiver 90 so as to contact the slit plate 75, the liquid LQ is filled between the projection optical system PL and the slit plate 75, and the numerical aperture NA of the projection optical system PL is set. Even in the case of substantial improvement, the light receiver 90 (light receiving element 82) can receive light through the projection optical system PL satisfactorily.

  In the case where the optical sensor 82 is in contact with the slit plate 75, it is preferable that the slit plate 75 (glass plate member 74) is as thin as possible so as not to be bent by the weight of the liquid LQ in the first liquid immersion area LA1. Furthermore, a configuration in which the light receiving surface 82A of the light receiving sensor 82 is exposed above the glass plate member 74 is also possible. On the other hand, by providing the slit plate 75 (glass plate member 74) on the light receiving surface 82A of the optical sensor 82 without exposing the light receiving surface 82A, the flat region becomes larger, so that the first liquid immersion region LA1 is improved. Can be formed.

  An adhesive can be used to join the optical sensor 82 to the lower surface of the slit plate 75. In this case, the adhesive has a high transmittance with respect to the exposure light, and has a refractive index such that the exposure light that has passed through the slit portion (light transmission portion) 71 can enter the light receiving surface 82A of the optical sensor 82. Is desirable.

  In the embodiment of FIG. 14, the optical sensor 82 is in close contact with the lower surface of the slit plate 75, but the light receiving element may be patterned on the lower surface of the slit plate 75 (glass plate member 74). .

  By the way, as described above, when measuring the imaging characteristics of the projection optical system PL by the slit scanning method, the slit plate 75 (slit portion 71) with respect to the light (exposure light EL) via the projection optical system PL. The light is applied to the light receiver 90 (optical element 76) through the liquid LQ while moving relatively. In this case, the movement of the slit plate 75 causes the projection optical system PL (tip portion) to pass through the liquid LQ in the first immersion area LA1 between the projection optical system PL and the slit plate 75 during the light receiving operation by the light receiver 90. The optical element 60) may be vibrated, or the slit plate 75 may be bent or fluctuated by the force of the liquid LQ, resulting in a disadvantage that the aerial image measurement accuracy is lowered.

  Therefore, as shown in FIG. 15, by providing the through hole 120 at a predetermined position of the slit plate 75, even if the slit plate 75 moves relative to the projection optical system PL, the projection optical system PL and the slit plate 75 Since the liquid LQ in the first immersion area LA1 can escape to the space SP through the through hole 120, the second liquid LQ between the projection optical system PL and the slit plate 75 is moved even if the slit plate 75 moves. There is no difference between the pressure of the liquid LQ in the one liquid immersion area LA1 and the pressure of the liquid LQ in the second liquid immersion area LA2 between the slit plate 75 and the light receiver 90 (optical element 76). There is no inconvenience such as bending. When the slit plate 75 moves, the liquid LQ in the first immersion area LA1 also moves in the lateral direction (the surface direction of the slit plate 75), but by providing a through hole 120 so that it can also move in the vertical direction. The occurrence of inconvenience such as bending of the slit plate 75 can be further prevented. Further, since the liquid LQ can move between the first immersion area LA1 and the second immersion area LA2 through the through hole 120, the first immersion between the projection optical system PL and the slit plate 75 is possible. Since the large pressure fluctuation of the liquid LQ in the area LA1 does not occur, it is possible to prevent the occurrence of inconvenience that the projection optical system PL fluctuates (vibrates) due to the pressure fluctuation of the liquid LQ accompanying the movement of the slit plate 75.

  FIG. 16 is a plan view of the slit plate 75 of FIG. As shown in FIG. 16, a plurality of through holes 120, four in the present embodiment, are provided. The plurality of (four) through holes 120 are provided at positions facing each other across the slit portion 71 of the slit plate 75. The through hole 120 is provided inside the first liquid immersion area LA1 of the liquid LQ filled between the projection optical system PL and the slit plate 75. Accordingly, even when the slit plate 75 moves, the liquid LQ in the first immersion area LA1 can escape to the space SP through the through hole 120. The through holes 120 are formed so as to be opposed to each other with the slit portion 71 provided at a substantially central portion of the slit plate 75 interposed therebetween, and are formed at positions that are point-symmetric with respect to the center of the slit plate 75. Therefore, the surface accuracy of the slit plate 75 can be maintained.

  Note that the number of through holes 120 is not limited to four, and an arbitrary plurality of through holes 120 may be provided or one. Further, as shown in FIG. 16, in the present embodiment, the through holes 120 are provided at equal intervals so as to surround the slit portion 71, but may be at irregular intervals. Further, the distance between the slit portion 71 (the center thereof) and each of the plurality of through holes 120 may be the same or different.

  By the way, in the case where the through hole 120 is provided in the slit plate 75, when the liquid LQ is filled in the space SP in order to form the second immersion area LA2, the liquid supply device 100 and the liquid described with reference to FIG. In addition to the configuration using the recovery device 104, the liquid supply mechanism 10 is used to supply the liquid LQ to the space SP between the slit plate 75 and the light receiver 90 (optical element 76) via the through hole 120. It may be. Further, the liquid LQ in the space SP between the slit plate 75 and the light receiver 90 (optical element 76) may be recovered using the liquid recovery mechanism 20 through the through hole 120. That is, the liquid supply mechanism 10 capable of supplying the liquid LQ between the projection optical system PL and the substrate P and the liquid recovery mechanism 20 capable of recovering the liquid LQ between the projection optical system PL and the substrate P during the exposure process are used. Thus, the second immersion area LA2 between the slit plate 75 and the light receiver 90 (optical element 76) may be formed.

  When forming the second immersion area LA2 using the liquid supply mechanism 10, as shown in FIG. 17A, the liquid supply mechanism 10 supplies the liquid LQ from the supply nozzle 13 to the space SP through the through hole 120. To do. Further, the liquid LQ on the slit plate 75 (including the liquid LQ overflowing from the space SP through the through hole 120) is recovered from the recovery nozzle 23 of the liquid recovery mechanism 20. Thus, as shown in FIG. 17B, the first liquid immersion area LA1 and the second liquid immersion area LA2 are formed by using the liquid supply mechanism 10 and the liquid recovery mechanism 20, respectively.

After the light receiver 90 receives light (exposure light EL) via the projection optical system PL via the liquid LQ and the slit plate 75, the liquid recovery mechanism 20 causes the liquid LQ in the first immersion region LA1 on the slit plate 75 to be received. Recover. Thereafter, the substrate stage PST is moved for exposure processing, and the projection optical system PL and the substrate P are opposed to each other. At this time, as shown in FIG. 17C, the slit plate 75 is below the projection optical system PL. Evacuated from. Then, a cover member 122 is placed over the through hole 120 of the slit plate 75 retracted from under the projection optical system PL. In the present embodiment, the lid member 122 covers the entire slit plate 75 to close the through hole 120. The lid member 122 is placed on the slit plate 75 by an arm 122A constituting a lid mechanism. Then, the exposure process for the substrate P is performed in a state where the through hole 120 is closed by the lid member 122. Although the substrate stage PST moves during the exposure process for the substrate P, the liquid LQ in the space SP may leak (scatter) to the outside through the through hole 120 as the substrate stage PST moves. Therefore, at least during the exposure process for the substrate P, the lid member 122 closes the through hole 120, thereby preventing the liquid LQ in the space SP from leaking outside through the through hole 120. Further, it is possible to prevent the inconvenience that the liquid LQ in the space SP is vaporized and changes the environment in which the exposure apparatus EX is placed. When detecting light via the liquid LQ using the light receiver 90, the arm 122A removes the lid member 122 from the slit plate 122, and then, as shown in FIGS. In addition, the first and second liquid immersion regions LA1 and LA2 are formed using the liquid supply mechanism 10 and the liquid recovery mechanism 20. Note that the lid mechanism is not limited to the above-described form. For example, a lid member is attached to a predetermined position of the slit plate 75 or the convex portion 83 via a hinge portion, and the measurement is performed by the light receiver 90 using an actuator. A configuration in which the lid member is opened and the lid member is closed during the exposure process on the substrate P is also possible.

As a hole portion that communicates the inside and the outside of the space SP between the slit plate 75 and the light receiver 90, in addition to the through hole 120 provided in the slit plate 75, as shown in FIG. A second through hole provided outside the region LA1 is also included. 18 is a cross-sectional view showing an example in which the second through hole 130 is provided, and FIG. 19 is a plan view. 18 and 19, a peripheral wall portion 132 is provided on the upper surface of the Z tilt stage 52 and around the convex portion 83 so as to surround the convex portion 83. Further, a lid member 134 is provided on the upper portion of the peripheral wall portion 132, and a buffer space portion 136 is formed by the convex portion 83, the peripheral wall portion 132, and the lid member 134. A second through hole 130 that connects the space SP and the buffer space 136 is formed at a predetermined position on the wall of the protrusion 83 and the holding member 85. In the present embodiment, as shown in FIG. 19, a plurality of (here, eight) second through holes 130 are provided around the space SP at predetermined intervals. The number and arrangement of the second through holes 130 can be arbitrarily set. By providing the second through hole 130, even if the slit plate 75 moves and the volume of the first liquid immersion area AR1 changes, the second liquid connected to the first liquid immersion area LA1 via the through hole 120. The liquid LQ in the immersion area LA2 can escape to the buffer space 130 via the second through hole 130. Therefore, inconveniences such as pressure fluctuations in the first immersion area LA1 can be further prevented.

  As a modification of the embodiment shown in FIGS. 18 and 19, the second through hole 130 may be provided in the slit plate 75 as shown in FIG. 20. The second through hole 130 is provided outside the first immersion area LA1. FIG. 21 is a plan view of the slit plate 75 of FIG. As shown in FIG. 21, a plurality of the second through holes 130, eight in the present embodiment, are provided. The plural (eight) second through holes 130 are provided at positions facing each other across the slit portion 71 of the slit plate 75. Thereby, when the liquid LQ in the first immersion area LA1 escapes to the space SP through the through hole 120 when the slit plate 75 moves, the liquid LQ in the space SP is externally transmitted through the second through hole 130. Can escape.

  When the liquid LQ overflows from the second through hole 130 formed in the slit portion 75, the liquid LQ flows out to the outside of the slit plate 75 (convex portion 83), but the slit plate 75 is on the Z tilt stage 52. A recovery mechanism 140 that recovers the liquid LQ that has flowed out of the second through hole 130 is provided around the provided protrusion 83. The recovery mechanism 140 includes a groove portion 141 provided around the convex portion 83 on the Z tilt stage 52, a porous member 142 made of porous ceramics or a sponge-like member that is disposed in the groove portion 141 and can hold the liquid LQ, A tank 144 serving as a liquid storage unit connected to the groove part 141 via a flow path 143 and a vacuum system 145 including a vacuum pump or the like connected to the tank 144 via a flow path 146 are provided. Further, the flow path 146 is provided with a valve 146A for opening and closing the flow path 146, and the discharge path 144A is connected to the tank 144. The liquid LQ that flows out from the second through hole 130 to the periphery of the convex portion 83 is held by the porous member 142 disposed in the groove portion 141. The recovery mechanism 140 recovers the liquid LQ in the groove 141 (porous member 142) together with the surrounding gas by driving the vacuum system 145 while operating the valve 146A and opening the flow path 146. To do. The recovered liquid LQ is collected in the tank 144. When the liquid LQ accumulates in the tank 144, it is discharged from the discharge flow path 144A. At this time, since the liquid LQ is collected below the tank 144, the liquid LQ does not flow into the vacuum system 145. That is, in the tank 144, the liquid LQ recovered from the groove portion 141 and the surrounding gas are separated into gas and liquid. By providing the recovery mechanism 140, it is possible to prevent inconvenience that the liquid LQ flowing out of the second through hole 130 or the first liquid immersion area LA1 remains on the Z tilt stage 52.

  Note that a variable mechanism that changes the size of the through hole 120 may be provided in the through hole 120 (or the second through hole 130). For example, during the aerial image measurement, by increasing the size of the through hole 120 (or the second through hole 130), the viscosity resistance of the liquid LQ when passing through the through hole 120 can be reduced, and the liquid LQ is smooth. Can move to. Further, by enlarging the through hole 120, as described with reference to FIG. 17, the liquid LQ can be easily injected into the space SP through the through hole 120. At times other than the aerial image measurement (specifically during the exposure operation), the through hole 120 (or the second through hole 130) is reduced or closed by the variable mechanism, so that the liquid LQ in the space SP is removed. It is possible to prevent the occurrence of inconvenience that the environment in which the exposure apparatus EX is placed is changed or the liquid LQ flows out of the space SP with the movement of the substrate stage PST.

  By the way, in each said embodiment, although it is the structure which forms 1st immersion area LA1 locally in the one part area | region on the slit board 75, as shown in FIG. 22, the slit board 75 whole is made into the liquid LQ. You may make it soak. In FIG. 22, a flange member 150 is provided on the Z tilt stage 52, and the slit plate 75 is supported by a support member 151 attached on the bottom 150 </ b> B of the flange member 150. An optical element 76 held by the holding member 85 is disposed below the slit plate 75 (on the downstream side of the optical path). The holding member 85 is also attached to the bottom 150B of the flange member 150. The support member 151 is provided with a second through hole 130 that communicates the inside and the outside of the space SP between the slit plate 75 and the optical element 76. The upper end of the opening 150 </ b> A of the flange member 150 is positioned higher than the slit plate 75, the supply port 13 </ b> A of the liquid supply nozzle 13, and the recovery port 23 </ b> A of the liquid recovery nozzle 23.

  When forming the first liquid immersion area LA1 and the second liquid immersion area LA2, the liquid supply mechanism 10 is driven after the projection optical system PL and the slit plate 75 inside the collar member 150 are opposed to each other, and the supply nozzle The liquid LQ is supplied from 13 to the inside of the eaves member 150. The liquid LQ supplied to the inside of the collar member 150 is filled between the optical element 60 and the slit plate 75 at the tip of the projection optical system PL to form the first immersion area LA1, and the through hole 120 and the first The second immersion area LA2 is formed by filling the space SP between the slit plate 75 and the optical element 76 via the two through holes 130. In parallel with this, by driving the liquid recovery mechanism 20 and recovering the liquid LQ in the collar member 150 from the recovery nozzle 23, the collar member 150 is filled with a predetermined amount of liquid LQ.

  In each of the above embodiments, an example in which the optical member (slit plate) 75 and the light receiver 90 are applied to the aerial image measurement device 70 that measures the imaging characteristics of the projection optical system PL has been described. As illustrated in FIG. On the substrate stage PST, in addition to the aerial image measuring device 70, a light dose sensor (for example, disclosed in Japanese Patent Application Laid-Open No. 11-16816, which measures light dose information via the projection optical system PL). (Illuminance sensor) 160, an illuminance unevenness sensor 170 as disclosed in, for example, JP-A-57-117238, and the like are also provided. The present invention can also be applied to the irradiation amount sensor 160 and the illuminance unevenness sensor 170.

  FIG. 24 is a schematic diagram of the dose sensor 160. The irradiation amount sensor 160 measures the irradiation amount (illuminance) of exposure light irradiated on the image plane side of the projection optical system PL, and includes an upper plate 163 provided on the Z tilt stage 52, and an upper plate 163 thereon. And an optical sensor 164 that receives light that has passed through the plate 163. The upper plate 163 includes a glass plate member 162 and a light transmission amount adjustment film 161 provided on the upper surface of the glass plate member 162. The light transmission amount adjusting film 161 is made of, for example, a chromium film, has a predetermined light transmittance, and is provided over the entire upper surface of the glass plate member 162. By providing the light transmission amount adjusting film 161 to reduce the amount of light incident on the optical sensor 164, inconveniences such as damage and saturation to the optical sensor 164 caused by irradiation with an excessive amount of light are prevented. . The dose sensor 160 performs a measurement operation at a predetermined timing, for example, when the mask M is replaced.

  Then, when measuring the irradiation amount of the exposure light EL that has passed through the projection optical system PL by the irradiation amount sensor 160, the projection optical system with the projection optical system PL and the upper plate 163 facing each other as in the above-described embodiment. The liquid LQ is supplied between the PL and the upper plate 163 to form the first liquid immersion area LA1, and the liquid LQ is supplied between the upper plate 163 and the optical sensor 164 to set the second liquid immersion area LA2. The upper plate 163 is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the first immersion area LA1. An optical system (optical element) may be disposed between the upper plate 163 and the optical sensor 164. In this case, the second immersion area LA2 is disposed at a position closest to the upper plate 163 and the upper plate 163. Formed between the optical elements. Further, the optical sensor 164 may be in close contact with the upper plate 163.

  FIG. 25 is a schematic diagram of the illuminance unevenness sensor 170. The illuminance unevenness sensor 170 measures the illuminance (intensity) of the exposure light irradiated to the image plane side through the projection optical system PL at a plurality of positions, and the exposure light irradiated to the image plane side of the projection optical system PL. An illuminance unevenness (illuminance distribution) is measured, and includes an upper plate 174 provided on the Z tilt stage 52, and an optical sensor 175 that receives light that has passed through a bin hole portion 171 provided on the upper plate 174. It has. The upper plate 174 is obtained by providing a thin film 172 containing a light-shielding material such as chromium on the surface of a glass plate member 173, patterning the thin film 172, and providing a pinhole portion 171 at the center thereof.

  When the illuminance unevenness sensor 170 measures the illuminance distribution, the projection optical system PL and the upper plate 174 of the illuminance unevenness sensor 170 face each other and the space between the projection optical system PL and the upper plate 174 is filled with the liquid LQ. The space between the upper plate 174 and the optical sensor 175 is also filled with the liquid LQ. Then, the pinhole portion 171 is sequentially moved at a plurality of positions in the irradiation region (projection region) irradiated with the exposure light EL. An optical system (optical element) may be disposed between the upper plate 174 and the optical sensor 175. In this case, the second immersion area LA2 is disposed at a position closest to the upper plate 174 and the upper plate 174. Formed between the optical elements. Further, the upper plate 174 and the optical sensor 175 may be brought into close contact with each other.

  Furthermore, the present invention can also be applied to a sensor that can be attached to and detached from the substrate stage PST (Z stage 51), for example, as disclosed in JP-A-11-238680 and JP-A-2000-97616.

  As described above, the liquid LQ in the present embodiment is composed of pure water. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. .

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be approximately 1.44. When ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL, On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution can be obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

  In the present embodiment, the optical element 60 is attached to the tip of the projection optical system PL. However, as an optical element attached to the tip of the projection optical system PL, optical characteristics of the projection optical system PL, such as aberration (spherical aberration, coma) It may be an optical plate used for adjustment of aberration and the like. Alternatively, it may be a plane parallel plate that can transmit the exposure light EL.

The liquid LQ of the present embodiment is water, but may be a liquid other than water. For example, when the light source of the exposure light EL is an F ₂ laser, the F ₂ laser light does not pass through water. In this case, as the liquid LQ, a fluorine-based liquid such as fluorine-based oil or perfluorinated polyether (PFPE) that can transmit the F ₂ laser light may be used. In addition, as the liquid LQ, the liquid LQ is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used.

  In the above embodiments, the shape of the nozzle described above is not particularly limited. For example, the liquid LQ may be supplied or recovered with two pairs of nozzles on the long side of the projection area AR1. In this case, the supply nozzle and the recovery nozzle may be arranged side by side so that the liquid LQ can be supplied and recovered from either the + X direction or the −X direction. .

  That is, various forms that can keep the space between the optical element 60 of the projection optical system PL and the substrate P filled with sufficient liquid LQ can be employed. Further, it is not always necessary to change the supply position and the recovery position of the liquid LQ according to the moving direction of the substrate P, and the supply and recovery of the liquid LQ may be continued from a predetermined position.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  In the above-described embodiment, an exposure apparatus that locally fills the space between the projection optical system PL and the substrate P with a liquid is used. However, the exposure as disclosed in Japanese Patent Laid-Open No. 6-124873. A liquid tank having a predetermined depth is formed on an immersion exposure apparatus for moving a stage holding a target substrate in a liquid tank, or a stage as disclosed in JP-A-10-303114, The present invention can also be applied to an immersion exposure apparatus that holds a substrate.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise. The present invention can also be applied to a step-and-stitch type exposure apparatus that partially transfers at least two patterns on the substrate P.

  An exposure apparatus to which the above-described liquid immersion method is applied is configured to expose the substrate P by filling the optical path space on the emission side of the optical element 60 of the projection optical system PL with the liquid LQ. / 019128, the optical path space on the incident side of the optical element 60 of the projection optical system may be filled with the liquid LQ. In this case, even if the projection optical system PL has a large numerical aperture of 1.0 or more, a non-refractive parallel plate or a lens having a very small refractive power can be used as the optical element 60.

  Further, according to the present invention, as disclosed in JP-A-10-163099, JP-A-10-214783, JP-T 2000-505958, etc., substrates to be processed such as wafers are separately placed. The present invention can also be applied to a twin stage type exposure apparatus having two stages that can move independently in the XY directions.

  In addition, as disclosed in JP-A-11-135400, the present invention includes an exposure stage that can move while holding a substrate to be processed such as a wafer, and a measurement stage that includes various measurement members and sensors. The present invention can also be applied to a provided exposure apparatus. In this case, at least a part of the plurality of sensors (measurement devices) described in the above embodiments can be mounted on the measurement stage.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing a reticle, a mask or the like.

  When linear motors (see USP5,623,853 or USP5,528,118) are used for the substrate stage PST and the mask stage MST, air levitation type using an air bearing and Lorentz force or It is preferable to use either a magnetic levitation type using a reactance force. Each stage PST, MST may be a type that moves along a guide, or may be a guideless type that does not have a guide.

  As a driving mechanism for each stage PST, MST, a planar motor that drives each stage PST, MST by electromagnetic force with a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil facing each other is provided. It may be used. In this case, either one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages PST and MST.

  As described in JP-A-8-166475 (USP 5,528,118), the reaction force generated by the movement of the substrate stage PST is not transmitted to the projection optical system PL, but mechanically using a frame member. You may escape to the floor (ground). The reaction force generated by the movement of the mask stage MST is not transmitted to the projection optical system PL by using a frame member as described in JP-A-8-330224 (USS / N 08 / 416,558). You may mechanically escape to the floor (ground).

  The exposure apparatus EX of the present embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 26, a microdevice such as a semiconductor device includes a step 201 for performing a function / performance design of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, substrate processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

DESCRIPTION OF SYMBOLS 1 ... Liquid, 10 ... Liquid supply mechanism, 13 ... Supply nozzle, 20 ... Liquid recovery mechanism,
23 ... Recovery nozzle, 70 ... Aerial image measuring device, 74 ... Glass plate member (optical member),
75 ... Slit plate (optical member), 76 ... Optical element, 82 ... Optical sensor (light receiving element),
90 ... receiver, 100 ... liquid supply device, 104 ... liquid recovery device, 120 ... through hole,
122 ... Lid member (lid mechanism), 122A ... Arm (lid mechanism), 130 ... Second through hole,
134 ... Lid member (lid mechanism), 140 ... Recovery mechanism, 162 ... Glass plate member (optical member),
163 ... Upper plate (optical member), 173 ... Glass plate member (optical member),
174 ... Upper plate (optical member), CONT ... control device, EL ... exposure light, EX ... exposure device,
LA1 ... first immersion area, LA2 ... second immersion area, LQ ... liquid, P ... substrate,
PL: Projection optical system, PST: Substrate stage (substrate holding member)

Claims (33)

In an exposure apparatus that exposes the substrate by irradiating exposure light to the substrate disposed on the image plane side of the projection optical system via the projection optical system and the liquid,
A light receiver that receives light that has passed through the projection optical system via an optical member that has a light transmission portion disposed on the image plane side of the projection optical system;
An exposure apparatus, wherein a liquid is filled between the light receiver and the optical member.   2. The exposure apparatus according to claim 1, wherein the light receiver is irradiated with light in a state where a liquid is filled between the projection optical system and the optical member. In an exposure apparatus that exposes the substrate by irradiating exposure light through the projection optical system to the substrate disposed on the image plane side of the projection optical system,
A light receiver that receives light that has passed through the projection optical system via an optical member that has a light transmission portion disposed on the image plane side of the projection optical system;
An exposure apparatus, wherein a liquid is filled between the light receiver and the optical member. The optical receiver, an optical element disposed at a position closest to the optical member;
A light receiving element that receives light that has passed through the optical element;
The exposure apparatus according to claim 1, wherein a liquid is filled between the optical element and the optical member. The light receiver has a light receiving element,
The exposure apparatus according to claim 1, wherein a liquid is filled between the light receiving element and the optical member.   The exposure apparatus according to claim 1, further comprising a liquid supply device that supplies a liquid between the optical member and the light receiver.   The exposure apparatus according to claim 1, further comprising a liquid recovery apparatus that recovers a liquid between the optical member and the light receiver.   The exposure apparatus according to claim 1, further comprising a hole that communicates the inside and the outside of the space between the optical member and the light receiver.   The exposure apparatus according to claim 8, wherein the hole includes a through hole provided at a predetermined position of the optical member.   The exposure apparatus according to claim 9, wherein a plurality of the through holes are provided at positions facing each other across the light transmission portion of the optical member.   11. The exposure apparatus according to claim 9, wherein the through hole is provided inside a liquid immersion area filled between the projection optical system and the optical member.   The said hole part contains the 2nd through-hole provided in the outer side of the liquid immersion area | region filled between the said projection optical system and the said optical member, The any one of Claims 8-11 characterized by the above-mentioned. The exposure apparatus according to one item. A liquid supply mechanism capable of supplying a liquid between the projection optical system and the substrate during the exposure process;
The exposure apparatus according to claim 8, wherein the liquid supply mechanism supplies a liquid to a space between the optical member and the light receiver through the hole. A liquid recovery mechanism capable of recovering the liquid between the projection optical system and the substrate during the exposure process;
The exposure apparatus according to claim 8, wherein the liquid recovery mechanism recovers a liquid in a space between the optical member and the light receiver through the hole. In an exposure apparatus that exposes the substrate by irradiating exposure light through the projection optical system and liquid onto the substrate disposed on the image plane side of the projection optical system,
A light receiver having a light receiving element that receives light that has passed through the projection optical system via an optical member having a light transmission portion disposed on the image plane side of the projection optical system;
An exposure apparatus, wherein the light receiving element is in contact with the optical member.   16. The exposure apparatus according to claim 15, wherein the light receiver is irradiated with light in a state where a liquid is filled between the projection optical system and the optical member.   17. The exposure apparatus according to claim 1, wherein the light receiver is irradiated with light while relatively moving the light transmitting portion with respect to the light that has passed through the projection optical system. . In an exposure apparatus that exposes the substrate by irradiating exposure light to the substrate disposed on the image plane side of the projection optical system via the projection optical system and the liquid,
A light receiver that receives light that has passed through the projection optical system via an optical member that has a light transmission portion disposed on the image plane side of the projection optical system;
An exposure apparatus, wherein a through hole is provided at a predetermined position of the optical member.   19. The exposure apparatus according to claim 18, wherein a plurality of the through holes are provided at positions facing each other across the light transmission portion of the optical member.   20. The exposure apparatus according to claim 18, wherein a liquid is filled between the optical member and the light receiver.   21. The exposure apparatus according to claim 18, wherein the light receiver is irradiated with light in a state where a liquid is filled between the projection optical system and the optical member.   The exposure according to any one of claims 18 to 21, wherein the through hole is provided inside a liquid immersion area filled between the projection optical system and the optical member. apparatus.   A second through hole is provided outside the liquid immersion area filled between the projection optical system and the optical member, and communicates the inside and outside of the space between the optical member and the light receiver. The exposure apparatus according to any one of claims 18 to 22, wherein   The light is applied to the light receiver through the liquid while moving the optical member relative to the projection optical system. The exposure apparatus according to item.   The exposure apparatus according to claim 12 or 23, further comprising a recovery mechanism for recovering the liquid flowing out of the second through hole.   The exposure apparatus according to any one of claims 9 and 18 to 25, further comprising a lid mechanism for opening and closing the through hole.   27. The exposure apparatus according to claim 26, wherein the lid mechanism closes the through hole at least during an exposure process on the substrate. A substrate holding member that is movable while holding the substrate;
28. The exposure apparatus according to claim 1, wherein the light receiver is provided on the substrate holding member.   The said light receiver receives the light which passed through the said light transmissive part, and measures the image formation characteristic of the said projection optical system based on this light reception result, It is characterized by the above-mentioned. Exposure device.   29. The light receiver receives light through the light transmission unit and measures light irradiation amount information through the projection optical system based on the light reception result. The exposure apparatus according to item.   The exposure apparatus according to any one of claims 1 to 30, wherein the light receiver is detachable from the exposure apparatus.   32. A device manufacturing method, wherein a device is manufactured using the exposure apparatus according to any one of claims 1 to 31. An exposure method for exposing a substrate by irradiating the substrate with exposure light via a projection optical system, comprising:
Receiving light having passed through the projection optical system with a light receiver via an optical member having a light transmission portion disposed on the image plane side of the projection optical system;
Exposing the substrate by irradiating the substrate with exposure light via a projection optical system;
An exposure method in which a liquid is filled between the light receiver and the optical member.

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