JP2010080671A - Electronic element package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic element package which allows an electronic element to be efficiently structured and laid out together with a peripheral passive element component required for the electronic element. <P>SOLUTION: The electronic element package includes: a first wiring board having a first land; a second wiring board which has a first surface and a second surface opposite to the first surface and has the first surface mounted on the first wiring board via the first land and has a second land provided on the second surface and has a smaller area than the first wiring board; and an electronic element electrically connected to the second wiring board via the second land. The electronic element is an element (for example, a memory element) including a semiconductor integrated circuit chip, and the second wiring board has a passive element component buried just below the electronic element, wherein the passive element component is a bypass capacitor for the electronic element, a damping resistor, a terminal resistor, a pull-up resistor, or a pull-down resistor. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic element mounting body in which an electronic element is connected to a wiring board, and more particularly to an electronic component mounting body suitable for obtaining an efficient structure and arrangement including peripheral passive element parts necessary for the electronic element. About.

  The electronic circuit that constitutes an electronic device has an active element such as a semiconductor IC and functions such as voltage and current stabilization and noise reduction, circuit constant determination, signal timing adjustment, and passage and blocking of a specific signal. It consists of passive elements such as resistors, capacitors (capacitors), and inductors that are necessary for the circuits that are provided. For this reason, in many cases, a passive element is externally attached as a peripheral component of the semiconductor IC in a power supply circuit or a signal circuit accompanied by the semiconductor IC.

  In recent years, electronic devices are configured as a single electronic device by combining a large number of semiconductor ICs that control various functions in accordance with the trend of high functionality, high performance, and large-capacity high-speed signal processing. Along with this, passive elements for the above functions are often indispensable, and the amount of use tends to be very large. In general, electrical / electronic components constituting an electronic circuit are arranged in a plane on a wiring board and are connected to each other via a circuit pattern of the wiring board to express a desired function.

  Among electronic devices, in particular, portable electronic devices are required to be compatible with the above-described high functions and high performance as well as light and thin. In response to this, semiconductor ICs have been highly integrated, package miniaturized, and terminal areas have been arranged. In addition, technologies such as downsizing of peripheral passive element parts (1608 → 1005 → 0603 → 0402) and narrowing of parts arrangement (0.4 mm → 0.3 mm → 0.2 mm → 0.1 mm between parts) are also progressing. I have done it.

  For downsizing of passive element parts, in addition to increasing the cost of the element itself, a higher-accuracy mounting device is required to mount it, which increases costs due to capital investment such as new installation or renewal of mounting equipment. Occurs. In addition, enormous costs are required to further increase the integration of semiconductor ICs, and the speed of higher integration has been on the decline in recent years due to technical reasons. Subsidiarily, techniques such as multi-stage stack mounting (chip stack mounting, package on package mounting) of semiconductor packages are used.

  Even if the high-density arrangement and the miniaturization of passive component parts have progressed due to the high integration of semiconductor ICs and the auxiliary technology including the packaging technology, as the mounting state on the wiring board, basically, There is no difference in that the semiconductor IC and many external passive component parts are arranged in a plane. This is considered to be one obstacle to further miniaturization, high performance, and high functionality of electronic devices. That is, in the planar arrangement, the wiring length between the semiconductor IC and the peripheral passive element component tends to be inevitably increased due to the connection through the wiring pattern of the wiring board. Therefore, for example, problems such as signal delay, noise generation, crosstalk generation, and signal attenuation due to wiring length occur. As a result, the original performance may not be achieved.

In addition, there exists a thing disclosed by the following patent document 1 in the prior art used as the reference about the structure disclosed by this application. In this disclosure, there is no description about a form in which the wiring board itself is mounted on another wiring board.
JP 2003-197849 A

  The present invention has been made in consideration of the above circumstances, and in an electronic element mounting body in which an electronic element is connected to a wiring board, an efficient structure and arrangement including peripheral passive element parts necessary for the electronic element are provided. An object of the present invention is to provide an electronic element mounting body that can be obtained.

  In order to solve the above-described problem, an electronic device mounting body according to one embodiment of the present invention includes a first wiring board having a first land, a first surface, and a second surface facing the first surface. The first surface is mounted on the first wiring board via the first land, and the second land is provided on the second surface. A second wiring board having a smaller area than the wiring board; and an electronic element electrically connected to the second wiring board via the second land, wherein the electronic element is integrated in a semiconductor. An element including a circuit chip, wherein the second wiring board embeds a passive element component immediately below the electronic element, and the passive element component is a bypass capacitor for the electronic element; It is characterized by.

  In other words, this electronic element mounting body has three components from the bottom: a first wiring board, a second wiring board having a smaller area, and an electronic element including an integrated circuit chip. A passive element component is embedded in the second wiring board at a position directly below the electronic element, and this passive element component is a bypass capacitor for the electronic element.

  Therefore, a substantial portion of the area burden of the passive element component arrangement that should be assumed by the first wiring board is moved to the second wiring board, and this passive element component is directly under the electronic element. In the position. Therefore, when evaluation including peripheral passive element components necessary for the electronic element is made, an electronic element mounting body having an efficient structure and arrangement can be obtained. The bypass capacitor in the electronic element is an essential peripheral component in almost all cases, and it is very significant that it can be moved from the first wiring board to another place.

  An electronic device mounting body according to another aspect of the present invention includes a first wiring board having a first land, a first surface, and a second surface facing the first surface. The first surface side is mounted on the first wiring board via the first land, and the second land is provided on the second surface. The area is smaller than that of the first wiring board. A second wiring board, and an electronic element electrically connected to the second wiring board through the second land, the electronic element comprising a semiconductor integrated circuit chip A memory element, wherein the second wiring board embeds a passive element component immediately below the electronic element, and the passive element component is a damping resistor, termination resistor, or pull-up for the electronic element It is a resistor or a pull-down resistor.

  In other words, this electronic element mounting body has three components from the bottom: a first wiring board, a second wiring board having a smaller area, and a memory element including an integrated circuit chip. A passive element component is embedded in the second wiring board immediately below the electronic element, and this passive element component becomes a damping resistance, a termination resistance, or a pull-up resistance or pull-down resistance for the memory element. Yes.

  Therefore, a substantial part of the area burden of the passive element component arrangement that should be assumed by the first wiring board is moved to the second wiring board, and this passive element component is directly under the memory element. In the position. Therefore, when evaluation including peripheral passive element components necessary for the memory element is made, an electronic element mounting body having an efficient structure and arrangement can be obtained. Note that a damping resistor, a termination resistor, or a pull-up resistor or a pull-down resistor is an essential peripheral component in almost all cases, and it is very significant that it can be moved from the first wiring board to another location. Big.

  According to the present invention, in an electronic element mounting body in which an electronic element is connected to a wiring board, an electronic element mounting body capable of obtaining an efficient structure and arrangement including peripheral passive element parts necessary for the electronic element is provided. Can be provided.

  As an embodiment of the present invention, the electronic device may be a chip scale package product. If the electronic element including the integrated circuit chip is a package product, it can be connected (surface mounted) to the second wiring board by, for example, soldering, and does not require special mounting equipment and is excellent in mass productivity. In particular, if a chip scale package product is used, the required area can be further reduced, contributing to miniaturization.

  As an embodiment, the electronic element may be flip-connected to the second wiring board. If the flip connection is used, the wiring length can be further shortened, which is suitable for an application that particularly needs to increase the signal speed.

  As an embodiment, the electronic element may be electrically connected to the second wiring board through the second land by a bonding wire. In this aspect, the electronic element and the second wiring board form one component, and this component can be handled as being mounted on the first wiring board.

  As an embodiment, the electronic device may be a BGA (ball grid array) package product. If the electronic element provided with the integrated circuit chip is a package product, it can be connected (surface mounted) to the second wiring board by soldering, and it does not require special mounting equipment and is excellent in mass productivity. In particular, if a BGA package product is used, there are few restrictions on the area, and it is possible to deal with more types of electronic devices.

  Also, as an embodiment, solder is used for electrical connection for embedding the passive element component in the second wiring board, and the second wiring board is mounted on the first wiring board in order to mount the second wiring board. Another solder different from the solder may be used, and the melting point of the solder may be higher than the melting point of the other solder. By making the melting point of the solder used for the passive element component embedded in the second wiring board higher than the melting point of the solder for mounting the second wiring board on the first wiring board, this It is possible to prevent remelting of the solder in the second wiring board during mounting. Since remelting causes connection failure and the like, it is preferable that this can be prevented.

  As an embodiment, solder is used for electrical connection for embedding the passive element component in the second wiring board, and the electronic element is connected to the second wiring board via the second land. Another solder different from the solder may be used for electrical connection, and the melting point of the solder may be higher than the melting point of the other solder. In this mounting, the melting point of the solder used for the passive element component embedded in the second wiring board is made higher than the melting point of the solder for mounting the electronic element on the second wiring board. It is possible to prevent remelting of the solder in the second wiring board. Since remelting causes connection failure and the like, it is preferable that this can be prevented.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of an electronic element mounting body according to an embodiment of the present invention. As shown in the figure, this electronic element mounting body has a structure in which an electronic element 200 is mounted on a normally used wiring board 300 via a passive element component built-in wiring board 100. On the wiring board 300, in addition to the passive element component built-in wiring board 100, a passive element mounting component 401 such as a chip capacitor, or a semiconductor active element mounting component such as a package product, in the same manner as a normal substrate. Components such as 402 may be mounted.

  The electronic element 200 is an element that can be directly mounted on the wiring board 300 without using the passive element component built-in wiring board 100. In this mounted body, peripheral passive element parts necessary for the electronic element 200 are provided. In particular, in order to obtain an efficient structure and arrangement, a passive element component built-in wiring board 100 is used in particular. Details will be described later.

  Solder 301 is used to mount the passive element component built-in wiring board 100 on the wiring board 300. For this reason, lands for connection to the solder 301 are provided on both surfaces of the passive element component built-in wiring board 100 and the wiring board 300. On the wiring board 300 side, a land for this purpose is formed by the wiring layer 300a on the surface. A solder resist 300b is formed on the surface of the wiring board 300 so as to surround the land. For the connection by the solder 301, a solder reflow technique can be used.

  Solder 201 is used to mount the electronic element 200 on the passive element component built-in wiring board 100. Therefore, an area-arranged terminal 200 a for connection to the solder 201 is provided on the surface of the electronic element 200, and a land for connection to the solder 201 is provided on the surface of the passive element component built-in wiring board 100. Is provided. The area arrangement refers to a grid-like arrangement, and is an arrangement in which the pitch can be expanded more than the arrangement of one row along the four sides or two opposite sides of the electronic element 200. For the connection using the solder 201, a solder reflow technique can be used.

  More specifically, the electronic device 200 is a device component of a wafer level / chip scale package. That is, the electronic device 200 includes at least a semiconductor integrated circuit (IC) chip and a grid-like array (area arrangement) terminal 200a formed on the chip. The terminal 200a is a terminal provided by rearranging the position of the IC chip from the terminal pad that the IC chip originally has through the rewiring layer. By such rearrangement, the arrangement density as a terminal becomes coarser than that of the terminal pad on the IC chip. Thereby, the electronic element 200 can be connected to the land by the wiring layer 26 via the solder 201 by the surface mounting technique.

  The passive element component built-in wiring board 100 is an intermediary board for electrically connecting the electronic element 200 to the wiring board 300, and is characterized in that the passive element component 41 is embedded directly inside the electronic element 200. There is. The passive element component 41 can be, for example, a chip capacitor such as a bypass capacitor required for the electronic element 200 or a chip inductor such as a decoupling inductor. In particular, if the electronic element 200 is an element having many input / output terminals of a bus such as a memory element, it can be embedded as a chip resistance component such as a damping resistor, a termination resistor, a pull-up resistor, or a pull-down resistor.

  The damping resistor is normally connected in series to the bus output terminal of the electronic element, and has a function of preventing signal reflection by setting the driving impedance to a predetermined value. The termination resistor is normally connected between the bus input terminal of the electronic element and the ground, and has a function of preventing signal reflection by matching with the damping resistor. The pull-up resistor is connected between the bus and, for example, a power supply line, and has a function of avoiding a floating state by fixing the bus to an electrically high state when the bus is electrically disconnected from the electronic element. The pull-down resistor is connected between the bus and the ground, and in the state where the bus is electrically disconnected from the electronic element, conversely, it has a function of electrically fixing it to a low state and avoiding a floating state. .

  By using such a passive element component built-in wiring board 100, the area burden for arranging the passive element parts having the above functions, which is normally required for the wiring board 300, is greatly reduced. Passive element parts such as a bypass capacitor and a decoupling inductor are external parts necessary for almost all types of electronic elements, and in a memory element having a bus, many resistors are externally attached according to the bus width. By embedding these in the passive element component built-in wiring board 100, the area around the passive element component built-in wiring board 100 in the wiring board 300 is largely opened as a mounting area for another component.

  Therefore, in this embodiment, when the electronic element 200 is viewed as an electronic element mounting body connected to the wiring board 300, an efficient arrangement and structure can be obtained regardless of a large number of peripheral passive element components essential to the electronic element 200. . Further, it is also advantageous that the wiring length between the electronic element 200 and its peripheral passive element parts is shorter. If the wiring length is shortened, problems such as signal delay, noise, crosstalk, and signal attenuation can be reduced.

  Further, in this embodiment, since an element component based on a wafer level / chip scale package is used as the electronic element 200, it can be connected (surface mounted) to the wiring board 100 by the solder 201. Therefore, it does not require special mounting equipment and is superior in mass productivity. In particular, since it is a chip scale package product, the area required for mounting can be reduced to the minimum, which can contribute to the miniaturization of applied products.

  In the passive element component built-in wiring board 100, the passive element component 41 is embedded as described above. For this reason, in this embodiment, as shown in FIG. 1, a multilayer wiring board having six wiring layers 21 to 26 is used. Although the number of wiring layers is not limited to this, the passive element component built-in wiring board 100 will be additionally described below.

  The passive element component built-in wiring board 100 includes insulating layers 11, 12, 13, 14, 15, and wiring layers (wiring patterns) 21, 22, 23, 24, 25, and 26 (= total). 6 layers), interlayer connector 31, 32, 34, 35, through-hole conductor 33, passive element component 41, solder 51, and solder resists 61, 62.

  The passive element component 41 is a chip component for surface mounting, and as described above, for example, a chip capacitor, a chip inductor, or a chip resistor. The planar size is, for example, 0.6 mm × 0.3 mm. Terminals are provided at both ends, and the lower side thereof is opposed to the mounting land formed by the wiring layer 22. The terminals of the passive element component 41 and the mounting land are electrically and mechanically connected by solder 51.

  The wiring layers 21 and 26 are wiring layers on both main surfaces as wiring boards and include lands. The land by the wiring layer 21 is a land for mounting on the wiring board 300, and the land by the wiring layer 26 is a land for mounting the electronic element 200. Solder resists 61 and 62 are formed on both main surfaces except for the land portion where the solder is located in the mounting, so that the solder melted at the time of solder connection is fixed to the land portion and then functions as a protective layer (thickness). Each is about 20 μm, for example). A Ni / Au plating layer (not shown) having high corrosion resistance may be formed on the surface layer of the land portion.

  The wiring layers 22, 23, 24, and 25 are inner wiring layers, and the insulating layer 11 is disposed between the wiring layer 21 and the wiring layer 22, and the insulating layer 12 is disposed between the wiring layer 22 and the wiring layer 23, respectively. However, the insulating layer 13 is between the wiring layer 23 and the wiring layer 24, the insulating layer 14 is between the wiring layer 24 and the wiring layer 25, and the insulating layer 15 is between the wiring layer 25 and the wiring layer 26. The wiring layers 21 to 26 are spaced apart from each other. Each of the wiring layers 21 to 26 is made of, for example, a metal (copper) foil having a thickness of 18 μm.

  Each of the insulating layers 11 to 15 is a rigid material made of, for example, a glass epoxy resin, for example, having a thickness of 100 μm, and the insulating layer 13 only having a thickness of, for example, 300 μm. In particular, the insulating layer 13 has an opening at a position corresponding to the built-in passive element component 41, and provides a space for embedding the passive element component 41. The insulating layers 12 and 14 are deformed so as to fill the space inside the through-hole conductor 33 of the insulating layer 13 and the opening of the insulating layer 13 for the built-in passive element component 41, There is no space.

  The wiring layer 21 and the wiring layer 22 can be conducted by an interlayer connector 31 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 11. Similarly, the wiring layer 22 and the wiring layer 23 can be conducted by an interlayer connector 32 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 12. The wiring layer 23 and the wiring layer 24 can be conducted by a through-hole conductor 33 provided through the insulating layer 13. The wiring layer 24 and the wiring layer 25 can be conducted by an interlayer connector 34 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 14. The wiring layer 25 and the wiring layer 26 can be conducted by an interlayer connector 35 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 15.

  The interlayer connectors 31, 32, 34, and 35 are derived from conductive bumps formed by screen printing of a conductive composition, respectively, and depend on the manufacturing process in the axial direction (shown in FIG. 1). The diameter changes in the upper and lower stacking directions). The diameter is, for example, 200 μm on the thick side.

  Next, a manufacturing process of the passive element component built-in wiring board 100 will be described with reference to FIGS. 2 to 4 are process diagrams schematically showing a part of the manufacturing process of the passive element component built-in wiring board 100 shown in FIG. In these figures, the same or equivalent components as those shown in FIG.

  It demonstrates from FIG. FIG. 2 shows a manufacturing process of a portion of the passive element component built-in wiring board 100 centering on the insulating layer 11. First, as shown in FIG. 2 (a), a paste-like conductive composition to be an interlayer connection 31 is formed on a metal foil (electrolytic copper foil) 22A having a thickness of 18 μm, for example, by screen printing. It is formed in a bump shape (bottom diameter, eg 200 μm, height, eg 160 μm). This conductive composition is obtained by dispersing fine metal particles such as silver, gold and copper or fine carbon particles in a paste-like resin. For convenience of explanation, printing is performed on the lower surface of the metal foil 22A, but it may be printed on the upper surface (the following drawings are also the same). After the interlayer connector 31 is printed, it is dried and cured.

  In FIG. 2A, the left and right sides of the drawing are omitted, but this is to show that a large number of wiring boards 100 are manufactured simultaneously (manufactured as a so-called multi-sided wiring board and finally individual Tidy up). The same applies to the following drawings.

  After the curing of the interlayer connector 31, next, as shown in FIG. 2B, a prepreg 11A of FR-4 having a thickness of, for example, 100 μm is laminated on the metal foil 22A to penetrate the interlayer connector 31, Make sure that the head is exposed. At the time of exposure or thereafter, the tip thereof may be crushed by plastic deformation (in any case, the shape of the interlayer connection body 31 has an axis that coincides with the stacking direction, and the diameter changes in the axial direction). Subsequently, as shown in FIG. 2 (c), a metal foil (electrolytic copper foil) 21A is laminated on the prepreg 11A, and the whole is integrated by pressing and heating. At this time, the metal foil 21A is in electrical continuity with the interlayer connector 31, and the prepreg 11A is completely cured to become the insulating layer 11.

  Next, as shown in FIG. 2D, patterning by, for example, well-known photolithography is performed on the metal foil 22A on one side, and this is processed into a wiring pattern 22 including mounting lands. Then, as shown in FIG. 2E, cream solder 51A is applied on the mounting land obtained by the processing. For application of the cream solder 51A onto the land, for example, screen printing can be used. According to this, it is possible to easily and efficiently print a predetermined pattern. It can also be applied by a dispenser instead of screen printing. The cream solder 51A may have a configuration in which, for example, solder particles (melting point 217 ° C.) having a composition of Sn-3Ag-0.5Cu are dispersed in a flux.

  Instead of this, the cream solder 51A may use a conductive composition (eg, silver paste) before curing. The conductive composition has high heat resistance after curing, and can effectively prevent re-melting and poor connection as the wiring board 100 after completion.

  In this sense, when the cream solder 51A is used, the melting point thereof is that of the solder 301 for connecting the wiring board 100 to the wiring board 300 and that of the solder 201 for connecting the electronic element 200 on the wiring board 100. It is preferable to select a higher one. According to this, the connection failure by remelting of the solder in the wiring board 100 can be suppressed. More specifically, for example, when the solder particles in the cream solder 51A are Sn-3Ag-0.5Cu (melting point 217 ° C.), the solder 301 and the solder 201 are, for example, Sn-58Bi (melting point 139 ° C.). Compositions can be used.

  When the cream solder 51A is applied to the mounting land obtained by processing, the passive element component 41 is subsequently placed on the mounting land via the cream solder 51A, for example, by a mounter. And it heats and reflows the cream solder 51A, and the passive element component 41 is connected and fixed on the land. As a result, as shown in FIG. 2 (f), the wiring board material 1 in a state where the passive element component 41 is connected to the mounting land of the wiring layer 22 through the solder 51 is obtained. The subsequent process using the wiring board material 1 will be described with reference to FIG.

  Next, a description will be given with reference to FIG. FIG. 3 shows a manufacturing process of a part of the passive element component built-in wiring board 100 centering on the insulating layer 13 and the insulating layer 13. First, as shown in FIG. 3A, for example, an FR-4 insulating layer 13 having a thickness of, for example, 300 μm in which metal foils (electrolytic copper foils) 23A and 24A having a thickness of 18 μm are laminated on both surfaces is prepared. A through-hole 83 for forming a through-hole conductor is formed at a predetermined position, and component openings 81 and 82 are formed in a portion corresponding to the built-in passive element component 41.

  Next, electroless plating and electrolytic plating are performed to form a through-hole conductor 33 on the inner wall of the through-hole 83 as shown in FIG. At this time, a conductor is also formed on the inner walls of the openings 81 and 82. Further, as shown in FIG. 3C, the metal foils 23A and 24A are patterned in a predetermined manner using well-known photolithography to form wiring layers 23 and 24. By patterning the wiring layers 23 and 24, the conductor formed on the inner walls of the openings 81 and 82 is also removed.

  Next, as shown in FIG. 3D, conductive bumps (bottom diameter, for example, 200 μm, height, for example, 160 μm) to be the interlayer connector 32 are formed at predetermined positions on the wiring layer 23 with the paste-like conductive composition. It is formed by screen printing. Subsequently, as shown in FIG. 3E, an FR-4 prepreg 12A (nominal thickness, for example, 100 μm) to be the insulating layer 12 is laminated on the wiring layer 23 side using a press. In the prepreg 12 </ b> A, openings similar to the insulating layer 13 are provided in advance corresponding to the built-in chip component 41 and the semiconductor element 42.

  In the stacking step of FIG. 3 (e), the head of the interlayer connector 32 is penetrated through the prepreg 12A. In addition, the broken line of the head part of the interlayer connection body 32 in FIG. 3 (e) indicates that there are both cases where the head part is plastically deformed and crushed at this stage and when it is not plastically deformed. The wiring board material obtained as described above is referred to as a wiring board material 2.

  The steps shown in FIG. 3 can be performed as follows. In the stage of FIG. 3A, only the through hole 83 is formed and the subsequent steps from FIG. 3B to FIG. 3D are performed without forming the openings 81 and 82 for the built-in components. Next, as a process corresponding to FIG. 3E, prepreg 12A (without opening) is stacked. And it is the process of forming simultaneously the opening part for components incorporation in the insulating layer 13 and the prepreg 12A.

  Next, a description will be given with reference to FIG. FIG. 4 is a diagram showing an arrangement relationship in which the wiring board materials 1 and 2 obtained as described above are stacked. Here, the upper wiring board material 3 shown in the figure applies the same process as that of the lower wiring board material 1, and thereafter, the interlayer connector 34 and the prepreg 14A are connected to the interlayer connector in the intermediate wiring board material 2 shown in the figure. 32 and the prepreg 12A.

  However, the wiring board material 3 is configured without a component (passive element component 41) and a portion (mounting land) for connecting the component, and the prepreg 14A is not provided with an opening for the passive element component 41. . Other than that, the metal foil (electrolytic copper foil) 26A, the insulating layer 15, the interlayer connection body 35, the wiring layer 25, the prepreg 14A, and the interlayer connection body 34 are the metal foil 21A of the wiring board material 1, the insulating layer 11, and the interlayer connection, respectively. The same as the body 31, the wiring layer 22, the prepreg 12 </ b> A of the wiring board material 2, and the interlayer connection body 32.

  The wiring board materials 1, 2, and 3 are stacked and arranged in the arrangement as shown in FIG. Thereby, the prepregs 12A and 14A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 12 </ b> A and 14 </ b> A obtained by heating, the prepregs 12 </ b> A and 14 </ b> A are deformed into the space around the passive element component 41 and the space inside the through-hole conductor 33, and no gap is generated. The wiring layers 22 and 24 are electrically connected to the interlayer connectors 32 and 34, respectively.

  After the laminating process shown in FIG. 4, the upper and lower metal foils 26A and 21A are patterned in a predetermined manner by using well-known photolithography, followed by forming layers of solder resists 61 and 62, and subsequently, multifaceted By separating the plates into individual pieces, the passive element component built-in wiring board 100 as shown in FIG. 1 can be obtained.

  As a modification, the through-hole conductor 33 provided in the intermediate insulating layer 13 can naturally have a configuration similar to the interlayer connector 31 or 32. Further, for the interlayer connectors 31, 32, 34, and 35, in addition to those derived from the conductive bumps printed by the conductive composition described above, for example, metal bumps formed by metal plate etching, conductive composition filling It is also possible to appropriately select and employ a connection body obtained from the above, a conductor bump formed by plating, or the like. Further, the outer wiring layers 21 and 26 are formed at the stage of each wiring board material 1 and 3 (for example, at the stage of FIG. 2D) other than patterning after the last lamination step. May be.

  In the laminating process shown in FIG. 4, for the wiring board materials 1 and 2, the prepreg 12A and the interlayer connector 32 are provided on the wiring board material 1 side instead of the wiring board material 2 side. May be. That is, the formation of the interlayer connector 32 and the lamination of the prepreg 12A are performed in advance on the wiring layer 22 (on the insulating layer 11) of the wiring board material 1. In this case, the mounted passive element component 41 seems to be an interference factor when the interlayer connection body 32 is formed by screen printing at first glance. However, in the case where the passive element component 41 is a sufficiently thin component, it is actually an interference factor. It will not be. In the step of laminating the prepreg 12A, the prepreg 12A can be uniformly laminated in the in-plane direction by pressing and heating with a cushioning material capable of absorbing the thickness of the passive element component 41 interposed therebetween.

  The passive element component built-in wiring board 100 shown in FIG. 1 has been described above including the manufacturing process. The point is that both the upper and lower sides in which the passive element components are embedded and embedded and are electrically connected thereto. Any wiring board having lands for solder connection on the main surface can be used.

  Next, another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view schematically showing a configuration of an electronic element mounting body according to another embodiment of the present invention. In the figure, the same or equivalent parts as those shown in the already described figures are designated by the same reference numerals, and the description thereof is omitted.

  In this embodiment, an IC chip 210a directly connected to the passive element component built-in wiring board 100 by wire bonding is provided as the electronic element 210. That is, the passive element component built-in wiring board 100 is also used as a substrate for an interposer function, and the wiring layer 26 on the upper surface functions as a land for connecting a bonding wire 210b from a terminal pad (not shown) of the IC chip 210a. I am letting. Further, a mold resin 210c is provided for sealing and protecting the bonding wire 210b and the IC chip 210a. In the example shown in the figure, the IC chip 210a has a stack configuration for higher functionality.

  In this electronic component mounting body, the electronic element 210 is already a single component with the passive element component built-in wiring board 100, and can be handled as being mounted on the wiring board 300. This integrated component is accompanied by the passive element component built-in wiring board 100, so that the added value is very high.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view schematically showing a configuration of an electronic element mounting body according to still another embodiment of the present invention. In the figure, the same or equivalent parts as those shown in the already described figures are designated by the same reference numerals, and the description thereof is omitted.

  In this embodiment, a package product (for example, a BGA package product or an LGA (land grid array) package product) having area-arranged terminals 220e is used as the electronic element 220. However, unlike the package shown in FIG. 1, the package has an interposer 220d, and a terminal 220e is disposed on the lower surface of the interposer 220d, and the terminal pad (not shown) of the IC chip 220a is also disposed on the upper surface. A land (not shown) for connecting the bonding wire 220b is provided. This land is electrically connected to the terminal 220e in a direction passing through the interposer 220d.

  The electronic element 220 includes a mold resin 220c for sealing and protecting the bonding wire 220b and the IC chip 220a. In the figure, the IC chip 210a has a stack configuration for high functionality.

  In this electronic component mounting body, it is possible to connect (surface mount) the electronic element 220 to the wiring board 100 with solder, which is superior in mass productivity without requiring special mounting equipment. In particular, if a BGA package product having an interposer 220d is used, the electronic element 220 has less restrictions on the area of the interposer 220d regardless of the area of the IC chip 220a, and can accommodate more types of IC chips 220a. Can do.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view schematically showing a configuration of an electronic device mounting body according to still another embodiment of the present invention. In the figure, the same or equivalent parts as those shown in the already described figures are designated by the same reference numerals, and the description thereof is omitted.

  This embodiment is the same as that shown in FIG. 6 in that a package product having area-arranged terminals 230 e is used as the electronic element 230. However, a land (not shown) for flip-connecting the IC chip 230a via, for example, a gold stud-like bump 230b is provided on the upper surface of the interposer 230d. A gap between the interposer 230d and the IC chip 230a is filled with an underfill resin 230c to protect the flip connection portion.

  In this embodiment as well, the electronic element 230 can be connected (surface mounted) to the wiring board 100 by solder, and no special equipment is required for mounting the electronic element 230, which is superior in mass productivity. In particular, since the BGA package product including the interposer 230d is used, the electronic element 230 has less restrictions on the area of the interposer 230d regardless of the area of the IC chip 230a, and can support a larger variety of IC chips 230a. can do. In addition, the electronic element 230 having better frequency characteristics can be used as compared with the case shown in FIG. 6 because there is no bonding wire 220b.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 8 is a cross-sectional view schematically showing a configuration of an electronic element mounting body according to still another embodiment of the present invention. In the figure, the same or equivalent parts as those shown in the already described figures are designated by the same reference numerals, and the description thereof is omitted.

  In this embodiment, a packaged product having a lead frame 240d and a terminal 240e arranged in a row along with the lead frame 240d is used as the electronic element 240. The row-arranged terminals 240e are connected to the lands on the passive element component built-in wiring board 100 by solder 202. The row-arranged terminals 240e are electrically connected to terminal pads (not shown) on the IC chip 240a by bonding wires 240b. The bonding wire 240b and the IC chip 240a are sealed with a mold resin 240c.

  As described above, the electronic element 240 can be used even if it is a packaged product in which the terminals are arranged in an array rather than an area. A package product in which terminals are arranged in a row tends to have a large area. Therefore, the significance of accommodating peripheral passive element components associated therewith in the passive element component built-in wiring board 100 is relatively smaller than in the above embodiments. Become. However, there is a certain significance.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view schematically showing a configuration of an electronic element mounting body according to still another embodiment of the present invention. In the figure, the same or equivalent parts as those shown in the already described figures are designated by the same reference numerals, and the description thereof is omitted.

  In this embodiment, an IC chip 250 a flip-connected on the passive element component built-in wiring board 100 is provided as the electronic element 250. On the upper surface of the passive element component built-in wiring board 100, a land for flip-connecting the IC chip 250a via, for example, a gold stud-like bump 250b is prepared by the wiring layer 26. The gap between the passive element component built-in wiring board 100 and the IC chip 250a is filled with an underfill resin 250c to protect the flip connection part.

  In this electronic component mounting body, the electronic element 250 is already a single component with the passive element component built-in wiring board 100, and can be handled as being mounted on the wiring board 300. This integrated component is accompanied by the passive element component built-in wiring board 100, so that the added value is very high. This point is the same as the embodiment shown in FIG. In addition, since the electronic component mounting body does not include a bonding wire as the electronic element 250, the frequency characteristics can be further improved accordingly.

  As mentioned above, although each embodiment of this invention was described, these electronic component mounting bodies also have the following advantages. In other words, assuming that the wiring pattern on the surface of the wiring board 300 is standardized, it is useful in that the electronic elements are mounted via the passive element component built-in wiring board 100. That is, by manufacturing the passive element component-embedded wiring board 100 so as to correspond to the difference in the form of the electronic element (whether it is a package product or the type of package), it is possible to use the various electronic elements. In other words, the passive element component built-in wiring board 100 functions as a standardized substrate for each electronic element.

Sectional drawing which shows typically the structure of the electronic element mounting body which concerns on one Embodiment of this invention. Process drawing which shows a part of manufacturing process of the passive element component built-in wiring board 100 shown in FIG. The process drawing which shows another part of manufacturing process of the passive element component built-in wiring board 100 shown in FIG. FIG. 10 is a process diagram schematically showing still another part of the manufacturing process of the passive element component built-in wiring board 100 shown in FIG. 1. Sectional drawing which shows typically the structure of the electronic element mounting body which concerns on another embodiment of this invention. Sectional drawing which shows typically the structure of the electronic element mounting body which concerns on another embodiment of this invention. Sectional drawing which shows typically the structure of the electronic device mounting body which concerns on another (4th) embodiment of this invention. Sectional drawing which shows typically the structure of the electronic device mounting body which concerns on another (5th) embodiment of this invention. Sectional drawing which shows typically the structure of the electronic element mounting body which concerns on another (6th) embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring board material, 2 ... Wiring board material, 3 ... Wiring board material, 11 ... Insulating layer, 11A ... Prepreg, 12 ... Insulating layer, 12A ... Prepreg, 13 ... Insulating layer, 14 ... Insulating layer, 14A ... Prepreg, DESCRIPTION OF SYMBOLS 15 ... Insulating layer, 21 ... Wiring layer (wiring pattern), 21A ... Metal foil (copper foil), 22 ... Wiring layer (wiring pattern), 22A ... Metal foil (copper foil), 23 ... Wiring layer (wiring pattern), 23A ... Metal foil (copper foil), 24 ... Wiring layer (wiring pattern), 24A ... Metal foil (copper foil), 25 ... Wiring layer (wiring pattern), 26 ... Wiring layer (wiring pattern), 26A ... Metal foil ( (Copper foil), 31, 32, 34, 35 ... interlayer connection (conductive bump by conductive composition printing), 33 ... through-hole conductor, 41 ... passive element component, 51 ... solder, 51A ... cream solder, 61 62 ... solder resist, 8 , 82 ... Component openings, 83 ... Through holes, 100 ... Passive element component built-in wiring board (second wiring board), 200 ... Electronic elements (chip scale package products), 200a ... Area placement terminals, 201 ... Solder, 202 ... Solder, 210 ... Electronic element (including an IC chip connected by wire bonding on a passive element component built-in wiring board), 210a ... IC chip, 210b ... Bonding wire, 210c ... Mold resin, 220 ... Electronic element (internal 220a ... IC chip, 220b ... bonding wire, 220c ... mold resin, 220d ... interposer, 220e ... area placement terminal, 230 ... electronic element (BGA including flip-connected IC chip) Package product), 230a ... IC chip, 230 ... Stud-like bumps, 230c ... Underfill resin, 230d ... Interposer, 230e ... Area placement terminal, 240 ... Electronic element (package product having a lead frame), 240a ... IC chip, 240b ... Bonding wire, 240c ... Mold resin, 240d: lead frame, 240e: terminals arranged in a row, 250: electronic elements (including IC chips flip-connected on a passive element component built-in wiring board), 250a: IC chips, 250b: stud-like bumps, 250c: underfill Resin, 300 ... wiring board (first wiring board), 300a ... wiring layer (including first land), 300b ... solder resist, 301 ... solder, 401 ... mounting component, 402 ... mounting component.

Claims (8)

A first wiring board having a first land;
A first surface and a second surface opposite to the first surface, the first surface side being mounted on the first wiring board via the first land, and the second surface A second land having a second land on the surface thereof and having a smaller area than the first wiring board;
An electronic element electrically connected to the second wiring board through the second land,
The electronic element is an element including a semiconductor integrated circuit chip;
An electronic element mounting body, wherein the second wiring board embeds a passive element component at a position directly below the electronic element, and the passive element component is a bypass capacitor for the electronic element. A first wiring board having a first land;
A first surface and a second surface opposite to the first surface, the first surface side being mounted on the first wiring board via the first land, and the second surface A second land having a second land on the surface thereof and having a smaller area than the first wiring board;
An electronic element electrically connected to the second wiring board through the second land,
The electronic element is a memory element including a semiconductor integrated circuit chip;
The second wiring board embeds a passive element component immediately below the electronic element, and the passive element component is a damping resistor, a termination resistor, or a pull-up resistor or a pull-down resistor for the electronic device. An electronic element mounting body characterized by the above.   The electronic device package according to claim 1, wherein the electronic device is a chip scale package product.   The electronic device package according to claim 1, wherein the electronic device is flip-connected to the second wiring board.   The electronic device package according to claim 1, wherein the electronic device is electrically connected to the second wiring board through the second land by a bonding wire.   The electronic device package according to claim 1, wherein the electronic device is a BGA package product. Solder is used for electrical connection for embedding the passive element component in the second wiring board,
In order to mount the second wiring board on the first wiring board, another solder different from the solder is used,
The electronic element mounting body according to claim 1, wherein a melting point of the solder is higher than a melting point of the other solder. Solder is used for electrical connection for embedding the passive element component in the second wiring board,
Another solder different from the solder is used to electrically connect the electronic element to the second wiring board through the second land,
The electronic element mounting body according to claim 1, wherein a melting point of the solder is higher than a melting point of the other solder.

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