JP2009238978A - Method of manufacturing ceramic substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic substrate capable of forming a conductor having high dimension accuracy and high electric characteristics with a ceramic slurry. <P>SOLUTION: The method of manufacturing a ceramic substrate applies a ceramic slurry 3a so as to cover a conductive paste 2a on a conductive layer 2 formed by applying the conductive paste 2a on a support 1 and drying the conductive paste 2a. In the manufacturing method, the conductive paste 2a contains at least two kinds of a first organic binder and a second organic binder which have different solubility parameters, and the ceramic slurry 3a contains a solvent having a solubility parameter approximate to the solubility parameter of the first organic binder. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a ceramic substrate, and more particularly to a method for manufacturing a ceramic substrate in which ceramic green sheets coated with a ceramic slurry are laminated.

  Conventionally, a ceramic multilayer substrate has a conductive pattern layer formed on the surface of a ceramic green sheet (hereinafter also referred to as a green sheet) by printing a conductive paste containing metal powder, and then a plurality of conductive pattern layers. It was produced by firing a laminate obtained by laminating and pressurizing green sheets formed with.

  However, when the number of stacked green sheets is increased, the difference in the thickness of the conductor pattern increases between the portion where the region where the conductor pattern layer is formed overlaps with the other portion. For this reason, when the laminated green sheets are pressed in the thickness direction, a sufficient pressing force is applied to the portion where the region where the conductor pattern layer is formed overlaps, but it is difficult to sufficiently apply the pressing force to the other portion. So, it tends to be insufficient crimping.

  And when the laminated body formed by such inadequate pressure bonding is baked, delamination (delamination) may occur in a portion where pressure bonding is insufficient.

  In response to these problems, a ceramic slurry is applied onto a support having a conductor layer formed on the surface, dried, and then peeled off to form a conductor layer embedded in a ceramic green sheet. Has been proposed (see, for example, Patent Document 1).

According to this manufacturing method, since the conductor layer is buried in the green sheet and the surface of the green sheet becomes flat, there is no difference in thickness between the area where the conductor layer is formed and the area where the conductor layer is not formed when the green sheets are laminated. In other words, delamination can be prevented from occurring due to non-uniform pressure when the green sheets are laminated.
JP-A-9-283360

  However, after the conductor layer is formed on the support, when the ceramic slurry is applied, the conductor layer is dissolved by the solvent in the ceramic slurry, mixed with the ceramic slurry, and made the same, and the conductor width is larger than the actually designed width. It had a problem of spreading (hereinafter also referred to as “brightening”).

  If the above-mentioned conductor blur is present inside the electronic component or circuit board, the electrical capacitance value or resistance value may deviate from the actual design value, so the standard value of electrical characteristics may not be satisfied. There was a problem.

  The present invention has been devised in view of the above-described problems, and an object of the present invention is to produce a ceramic substrate having high electrical characteristics, capable of forming a conductor with high dimensional accuracy in a method for producing a ceramic substrate using a ceramic slurry. It is to provide a method.

  The method for producing a ceramic substrate of the present invention includes a first application step of applying a conductive paste on a support, a second application step of applying a ceramic slurry so as to cover the conductive paste on the support, The ceramic slurry is dried to form a ceramic green sheet, and the conductive paste contains at least two kinds of a first organic binder and a second organic binder having different solubility parameters, and the ceramics The rally contains a solvent having a solubility parameter that approximates the solubility parameter of the first organic binder.

  In the method for producing a ceramic substrate of the present invention, the difference between the solubility parameter of the first organic binder and the solubility parameter of the solvent contained in the ceramic slurry is 1 or less, The difference between the solubility parameter and the solubility parameter of the solvent contained in the ceramic slurry is 2 or more.

  The method for producing a ceramic substrate of the present invention is characterized in that the glass transition temperature of the second organic binder is 30 ° C. or higher.

  The method for producing a ceramic substrate of the present invention includes a step of applying a conductive paste to the surface of the ceramic green sheet after the drying step, and a ceramic slurry on the surface of the ceramic green sheet so as to cover the conductive paste. The step of applying and the step of drying the ceramic slurry to form a ceramic green sheet laminate are repeated a predetermined number of times.

  In addition, the method for producing a ceramic substrate of the present invention includes a step of laminating a plurality of the ceramic green sheets obtained after the drying step.

  According to the method for producing a ceramic substrate of the present invention, a conductive layer is formed on a support with a conductive paste, and a ceramic slurry is applied on the support to form a ceramic green sheet. From the conductive layer and the ceramic green sheet, In the step of forming the ceramic green sheet with a conductor layer, the conductor layer contains at least two kinds of organic binders, and the solubility parameter of the first organic binder of the conductor layer and the solubility parameter of the solvent contained in the ceramic slurry are: Since it has an approximate solubility parameter, the ceramic slurry and the first organic binder of the conductor layer are dissolved, and the second organic binder having a different solubility is difficult to dissolve in the solvent of the ceramic slurry. Can be bonded firmly It is possible to prevent bleeding of the conductive layer.

  Further, the difference between the solubility parameter of the first organic binder and the solubility parameter of the solvent contained in the ceramic slurry is 1 or less, the solubility parameter of the second organic binder of the conductor layer and the solubility parameter of the solvent contained in the ceramic slurry are When the difference is set to be 2 or more, the solvent contained in the ceramic slurry dissolves only the first organic binder of the conductor layer. As a result, the ceramic slurry and the conductor layer are firmly bonded, and at the same time, it is possible to prevent the conductor from blurring.

  Further, in the method for producing a ceramic substrate of the present invention, when the glass transition temperature of the second organic binder is set to 30 ° C. or higher, the conductor layer maintains sufficient strength even when the first organic binder is dissolved. This makes it possible to prevent the conductor layer from blurring.

  In the method for producing a ceramic substrate of the present invention, after the drying step, a step of applying a conductive paste to the surface of the ceramic green sheet, and a step of applying a ceramic slurry to the surface of the ceramic green sheet so as to cover the conductive paste And when the process of drying the ceramic slurry and forming the ceramic green sheet laminate is repeated a predetermined number of times, the thickness difference is reduced between the part where the conductor layer is formed and the part where it is not, The ceramic green sheets are brought into close contact with each other without generating voids around the conductor layer or between the conductor layers, and the ceramic substrate obtained by firing the ceramic laminate is hardly delaminated.

  Further, in the method for producing a ceramic substrate of the present invention, even when a plurality of ceramic green sheets obtained after the drying step are laminated, the difference in thickness is small between the portion where the conductor layer is formed and the portion where the conductor layer is not overlapped. Thus, the ceramic green sheets are brought into close contact with each other without generating voids around the conductor layer or between the conductor layers, and the ceramic substrate obtained by firing the ceramic laminate has almost no delamination.

  Further, according to the method for producing a ceramic substrate of the present invention, ceramic green sheets can be laminated at a low pressure, and the ceramic green sheet and the conductor pattern formed thereon are hardly deformed, and the resulting ceramic The laminate and the ceramic substrate obtained by firing the laminate have high dimensional accuracy.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a diagram showing an example of a method for manufacturing a ceramic substrate according to an embodiment of the present invention. In FIG. 1, 1 is a support, 2a is a conductive paste applied on the support 1, 2 is a conductor layer obtained by drying the conductive paste 2a, 3a covers the conductor layer 2 on the support 1 The ceramic slurry thus coated 3 is a ceramic green sheet formed by drying the ceramic slurry 3 a, and 4 is a ceramic green sheet laminate formed by laminating the ceramic green sheets 3.

  First, as shown to Fig.1 (a), after apply | coating the electrically conductive paste 2a on the support body 1, the conductor layer 2 is formed by drying this. Next, as shown in FIG. 1B, the ceramic slurry 3a is applied on the support 1 on which the conductor layer 2 is formed, and then dried to form the ceramic green sheet 3 with the conductor layer. . The support 1 is a film or plate made of an organic resin such as polyolefin, polyester, polyamide, polyimide, or vinyl chloride.

  In order to suppress the occurrence of deformation such as elongation in the ceramic green sheet 3 with a conductor layer at the time of peeling from the support 1, it is preferable that a surface treatment layer of a release agent is formed. Types of release agents can be broadly classified into silicone, fluorine, long chain alkyl group-containing, alkyd resin, and polyolefin resin. From the viewpoint of heat resistance, releasability and cost, a silicone system is desirable. Moreover, according to the product form, any of a solventless type, an emulsion type, and a solvent type can be used.

  The surface of the support 1 is the surface treatment layer when a surface treatment layer such as a release agent or an antistatic agent is formed on the surface of the support 1 in consideration of the peelability of the ceramic green sheet. Means surface.

  The conductive paste 2a is obtained by uniformly dispersing a conductive powder obtained by adding an organic binder, a solvent and, if necessary, a dispersing agent, by a kneading means such as a ball mill, a three-roll mill, a planetary mixer, a trimix, and the like. To adjust the viscosity.

  Examples of the conductive material of the conductive powder include W (tungsten), Mo (molybdenum), Mn (manganese), Au (gold), Ag (silver), Cu (copper), Pd (palladium), and Pt (platinum). 1 type or 2 types or more are mentioned, The conductor powder is manufactured by the atomizing method, the reduction method, etc., and processes, such as oxidation prevention and aggregation prevention, are performed if necessary.

  When two or more kinds of conductor materials are used, two or more kinds of powders may be mixed, or a powder in which two or more kinds of materials are integrated by an alloy, coating, or the like may be used.

  Moreover, fine powder or coarse powder may be removed by classification or the like to adjust the particle size distribution.

  As the organic binder, those conventionally used for conductive pastes can be used. For example, acrylic binders (acrylic acid, methacrylic acid or their homopolymers or copolymers, specifically acrylic ester copolymers) can be used. Polymers, methacrylate copolymers, acrylate-methacrylate copolymers, etc.), polyvinyl butyral, polyvinyl alcohol, acryl-styrene, polypropylene carbonate, cellulose, and other homopolymers or copolymers Coalescence is mentioned.

  Among these organic binders, at least two of the first organic binder and the second binder having different solubility parameters are combined, and the solubility parameter of the first organic binder is different from the solubility parameter of the solvent used for the ceramic slurry 3a. It is important to select one with less.

  In this case, specifically, a first organic binder having a difference of 1 or less from the solubility parameter of the solvent contained in the ceramic slurry 3a and a second organic binder having a difference of 2 or more from the solubility parameter of the solvent are used. It is good to do. At this time, the glass transition temperature of the second organic binder is preferably 30 ° C. or higher.

  Use both the first organic binder having a difference of 1 or less from the solubility parameter of the solvent contained in the ceramic slurry 3a and the second organic binder having a difference of 2 or more from the solubility parameter of the solvent contained in the ceramic slurry 3a. Thus, when the conductive paste 2a is printed on the support 1 and dried to form the conductor layer 2, and then the ceramic slurry 3a is applied from above, the conductor layer 2 contains the second organic binder. Therefore, even if the solvent of the ceramic slurry 3a contacts the conductor layer 2, the shape of the conductor layer 2 is prevented from collapsing, and the conductor layer 2 contains the first organic binder. When the green sheet 3 on which the conductor layer 2 is formed is peeled off from the support 1 due to the repelling of the ceramic slurry 3a, According to peeling from the sheet 3, it is possible to prevent the defect of the conductive layer 2.

  Here, the solubility parameter is a numerical value based on the property that organic components having similar properties are easily compatible with each other, and is also called an SP value. Since those having close solubility parameter values are easily dissolved, they are used as an index indicating the dissolving power of the organic component.

  As the solubility parameter of the organic component of the present invention, the solubility parameter data published by Kodansha “Solvent Handbook” (Shozo Asahara et al., 1976, first edition) was used.

  As the solvent for the conductive paste, any conductive powder and organic binder that can be well dispersed and mixed may be used, and plasticizers such as terpineol, butyl carbitol acetate, and phthalic acid can be used. Considering the drying property of the solvent after the conductor layer 2 is formed, a low boiling point solvent such as terpineol is preferable. In addition, since the first organic binder and the second organic binder having different solubility parameters are included, the solubility parameter of the solvent preferably has an intermediate value, for example, an isobutyl methacrylate polymer having an SP value of 8.3. Is used as the first binder and a methacrylate polymer having an SP value of 10.7 is used as the second binder, ethyl acetate having an SP value of 9 may be selected.

  Next, as shown in FIG. 1B, the ceramic slurry 3 a is applied on the support 1 and the conductor layer 2.

Examples of the ceramic powder used in the ceramic slurry include Al ₂ O ₃ powder, AlN powder, glass ceramic powder (a mixture of glass powder and filler powder), and the like for a multilayer wiring capacitor. Composite perovskite ceramic powders such as BaTiO ₃ system and PbTiO ₃ system are listed, and they are appropriately selected according to the characteristics required for electronic parts.

Examples of the glass component of the glass ceramic powder include SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —MO system (however, , M represents Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same or different and Ca, Sr, Mg , Ba or Zn), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same as above), SiO ₂ —B ₂ O ₃ —M ³ ₂ O system (where M ³ represents Li, Na or K), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ³ ₂ O system (where M3 is the same as above) And Pb-based glass, Bi-based glass, and the like.

Moreover, as filler powder of glass ceramic powder, for example, Al ₂ O ₃ , SiO ₂ , composite oxide of ZrO ₂ and alkaline earth metal oxide, composite oxide of TiO ₂ and alkaline earth metal oxide, A ceramic powder such as a composite oxide (for example, spinel, mullite, cordierite) containing at least one selected from Al ₂ O ₃ and SiO ₂ can be used.

  As the organic binder, those conventionally used in green sheets can be used. For example, acrylic (a homopolymer or copolymer of acrylic acid, methacrylic acid or an ester thereof, specifically an acrylic ester copolymer). Polymers, methacrylic acid ester copolymers, acrylic acid ester-methacrylic acid ester copolymers, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate, cellulose, and other homopolymers Or a copolymer is mentioned.

  In view of decomposition and volatility in the firing step, an acrylic binder is more preferable.

  The solvent is not particularly limited as long as the ceramic powder and the organic binder can be well dispersed and mixed, and examples thereof include organic solvents such as toluene, ketones, alcohols, and water. In addition, as described above, the SP values of the first organic binder and the second organic binder contained in the conductor layer 2 are selected with care.

  Examples of the method for forming the green sheet 3 by applying the ceramic slurry 3a include a doctor blade method, a lip coater method, and a die coater method.

  In particular, when an extrusion method such as a die coater method, a slot coater method, or a curtain coater method is used, since these are non-contact coating methods, the penetration of the ceramic slurry 3a is not generated by a physical force. Therefore, the green sheet 3 having no anisotropy can be formed.

  Note that through conductors such as via-hole conductors and through-hole conductors for connecting the conductor layers 2 between the upper and lower layers may be formed as necessary.

  These through conductors are formed by a means such as embedding a conductive paste 2a obtained by pasting a conductive material powder into a through hole formed in the green sheet 3 by punching, laser processing, or the like by printing or press filling.

  When the green sheet 3 is thick, it is preferable to use punching because the through-hole processing is less likely to cause a difference in the through-hole diameters on the front and back sides of the green sheet 3.

  Further, when the through hole is processed, the green sheet 3 may be peeled off from the support 1, but it is more preferable that the green sheet 3 is held on the support 1 because deformation of the green sheet 3 can be prevented.

  Next, as shown in FIG. 1 (c), the ceramic slurry 3a applied in FIG. 1 (b) is dried to form the ceramic green sheet 3, and then the ceramic green sheet 3 as shown in FIG. The green sheet laminate 4 can be obtained by repeating the process of coating the surface with the conductive paste 2a and drying it and then applying the ceramic slurry 3a thereon as shown in FIG. 1 (b) a predetermined number of times. . FIG.1 (c) shows the 3 layer green sheet laminated body 4 obtained by repeating such a process 3 times.

  In the present invention, the solubility parameter of the solvent contained in the conductive paste 2a is selected to be intermediate between the SP values of the first and second organic binders. Therefore, the conductor 2 and the ceramic green sheet obtained after drying are selected. Adhesion with 3 is good.

  Also, the green sheet laminated body 4 is peeled off from the support 1, the green sheets with conductor 3 are aligned and stacked, and the green sheet laminated body 4 is produced by the method of producing the green sheet laminated body 4 by heating and pressurizing and pressing. The body 4 may be used.

  When the support 1 is peeled off, a treatment such as heating can be performed as necessary.

  Moreover, although the conditions of the heat-pressing in the case of crimping | bonding differ with kinds and quantity of organic binders etc. to be used, they are 30-100 degreeC and 2-20 MPa in general.

  At this time, in order to improve the adhesion between the conductor-attached green sheets 3, it is preferable to use an adhesive in which a solvent is mixed with an organic binder, a plasticizer, or the like.

  Finally, the ceramic substrate of the present invention is manufactured by firing the green sheet laminate 4.

  The step of firing consists of removing organic components and sintering the ceramic powder.

  Removal of the organic component is performed by heating the green sheet laminate 4 in a temperature range of 100 to 800 ° C. to decompose and volatilize the organic component.

  The sintering temperature varies depending on the ceramic composition, and is performed within a range of about 800 to 1600 ° C.

  The firing atmosphere varies depending on the ceramic powder and the conductor material, and is performed in the air, in a reducing atmosphere, in a non-oxidizing atmosphere or the like, and may contain water vapor or the like in order to effectively remove organic components.

  The ceramic substrate after firing has a good connection to the surface of the conductor layer 2 exposed on the surface of the ceramic substrate in order to prevent the conductor layer 2 from being corroded or to connect an external substrate such as solder or metal wire or an electronic component. Therefore, Ni (nickel) or Au plating may be applied.

  Examples of the present invention will be described in detail below.

  First, an alumina powder and an acrylic resin are mixed to prepare a ceramic slurry 3a. Similarly to the above, the ceramic slurry 3a is formed on the PET film support 1 on which the conductive layer 2 is formed by printing and drying the conductive paste 2a. Was applied at a thickness of 50 μm by a die coater method and dried to prepare a ceramic green sheet 3 with a conductor.

  As a procedure for producing the ceramic green sheet with conductor 3, first, an organic binder and a solvent shown in Table 1 were added to Cu powder and mixed using three rolls to produce a conductive paste 2a.

  The conductive paste 2a was adjusted to 10 Pa · s by appropriately adding a solvent.

  Then, the conductive paste 2a having a width and a gap of 75 μm was formed by applying the conductive paste 2a on the support 1 by screen printing.

Next, an organic binder and a solvent are added to the inorganic powder of SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ based glass powder 60% by mass and alumina powder 40% by mass, and mixed by a ball mill for 24 hours to prepare. The ceramic slurry 3a was applied on the support 1 on which the conductor layer 2 was formed so as to cover the conductor layer 2, and dried with a hot air dryer at 60 ° C. to obtain a ceramic green sheet 3 with a conductor layer. .

  The ceramic green sheet 3 with the conductor was peeled off from the support 1, and the state of the bleeding and peeling was evaluated by observing the conductor portion on the peeled surface with a binocular microscope.

  The results are shown in Table 1.

  Observation with a binocular microscope was 20 times.

  In Table 1, “○” in the column of “brightness” indicates that there is no problem when hot air drying is performed within 10 minutes after the application of the ceramic slurry 3a, but there is a case where it is observed when left for 10 minutes or longer. In the peeling column, “◯” indicates that a part of the ceramic green sheet and the conductor was peeled off although it was bonded by applying pressure after drying with hot air. On the other hand, “◎” in the column of “brightness or peeling of the conductor” indicates that there was no bleeding or peeling of the conductor regardless of the drying conditions.

  In Table 1, Examples 1, 4, and 8, which are examples of the present invention, were excellent without any blurring or peeling of the conductors regardless of the drying conditions.

  On the other hand, in Examples 2, 3, 5, 6, and 7, there were cases where the conductor was smeared or peeled off depending on the drying conditions.

  As described above, the first organic binder having a difference of 1 or less from the solubility parameter of the solvent contained in the ceramic slurry 3 a and the second organic binder having a difference of 2 or more in the solubility parameter are used for the conductor layer 2. When the ceramic slurry 3a and the conductor layer 2 are melted to each other, the degree of blurring of the conductor layer 2 can be improved, and the ceramic green sheet 3 on which the conductor layer 2 is formed is peeled off from the support 1. Moreover, peeling of the conductor layer 2 from the ceramic green sheet 3 can be prevented.

  Next, an alumina resin is mixed with an acrylic resin to prepare a ceramic slurry 3a. Similarly to the above, the ceramic paste 3a is formed on the PET film support 1 on which the conductive layer 2 is formed by printing and drying the conductive paste 2a. Was applied at a thickness of 50 μm by a die coater method and dried to prepare a ceramic green sheet 3 with a conductor.

  As a procedure for producing the ceramic green sheet 3 with conductor, first, an acrylic acid ester polymer as a first binder is added to Cu powder, and then an acrylic acid-methacrylic acid copolymer having a glass transition point as shown in Table 2 is used. Toluene was added as a coalescence and a solvent, and the mixture was mixed using three rolls to produce a conductive paste 2a.

  The conductive paste 2a was adjusted to 10 Pa · s by appropriately adding a solvent.

  Then, the conductive paste 2a having a width and a gap of 75 μm was formed by applying the conductive paste 2a on the support 1 by screen printing.

Next, an organic binder and a solvent are added to the inorganic powder of SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ glass powder 60 mass% and alumina powder 40 mass%, and mixed for 24 hours by a ball mill to prepare. The ceramic slurry was applied on the support 1 on which the conductor layer 2 was formed, and dried with a hot air drier to obtain a ceramic green sheet 3 with the conductor layer 2.

  The ceramic green sheet 3 with the conductor layer 2 was peeled off from the support 1, and the state of the bleeding and peeling was evaluated by observing the peeled surface of the conductor with a binocular microscope.

  The results are shown in Table 2.

  Observation with a binocular microscope was 20 times.

In Table 2, “◯” in the column of “brightening” indicates that there is no problem when the hot air drying is performed within 10 minutes after applying the ceramic slurry 3a, but there is a case where it is observed when left standing for 10 minutes or more. “○” in the peeling column indicates that the ceramic green sheet and the conductor were partially peeled, although it was bonded by applying pressure after drying with hot air.
On the other hand, “◎” in the “Brightness or peeling of conductor” column indicates that the conductor was excellent without any bleeding or peeling regardless of the drying conditions.

  In Table 2, Examples 4, 5, and 6, which are examples of the present invention, were excellent without any blurring or peeling of the conductors regardless of the drying conditions.

  On the other hand, in Examples 1, 2, and 3, the conductor may melt or peel off depending on the drying conditions.

  Thus, the first organic binder having a difference from the solubility parameter of the solvent contained in the ceramic slurry 3a of 1 or less and the second organic binder having a difference of 2 or more in the solubility parameter are used for the conductor layer. By setting the glass transition temperature of the organic binder to 30 ° C. or higher, the ceramic slurry 3a and the conductor layer 2 can be dissolved together to prevent the conductor from blurring, and the ceramic green sheet 3 on which the conductor layer 2 is formed is supported. When peeled from the body 1, the peeling of the conductor from the ceramic green sheet 3 can be prevented.

It is sectional drawing which shows an example of embodiment of the manufacturing method of the ceramic substrate of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Support body 2 ... Conductive layer 2a ... Conductive paste 3 ... Ceramic green sheet 3a ... Ceramic slurry 4 ... Ceramic green sheet laminated body

Claims (5)

A first coating step of coating a conductive paste on a support; a second coating step of coating a ceramic slurry on the support so as to cover the conductive paste; and drying the ceramic slurry to produce a ceramic green sheet And the conductive paste contains at least two kinds of a first organic binder and a second organic binder having different solubility parameters, and the ceramic slurry contains the first organic binder. A method for producing a ceramic substrate, comprising a solvent having a solubility parameter that approximates the solubility parameter. The difference between the solubility parameter of the first organic binder and the solubility parameter of the solvent contained in the ceramic slurry is 1 or less, the solubility parameter of the second organic binder and the solvent contained in the ceramic slurry. The method for producing a ceramic substrate according to claim 1, wherein the difference from the solubility parameter is 2 or more. The method for producing a ceramic substrate according to claim 1 or 2, wherein the glass transition temperature of the second organic binder is 30 ° C or higher. After the drying step, a step of applying a conductive paste to the surface of the ceramic green sheet, a step of applying a ceramic slurry to the surface of the ceramic green sheet so as to cover the conductive paste, and drying the ceramic slurry 4. The method of manufacturing a ceramic substrate according to claim 1, further comprising a step of repeating the step of forming the ceramic green sheet laminate body a predetermined number of times. The method for producing a ceramic substrate according to any one of claims 1 to 3, further comprising a step of laminating a plurality of the ceramic green sheets obtained after the drying step.

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