JP2009267565A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance efficiency in developing an electronic apparatus, such as, portable telephone set, by adjusting the angle of an infrared module, without having to change the specifications of a case body, after the manufacture of the case body. <P>SOLUTION: The portable telephone set 1 includes: a lower case body 2; a flexible board FPC 1 arranged in the lower case body 2; a flexible board FPC 2 connected to the flexible board FPC 1; the infrared module 8 arranged on the flexible board FPC 2; and a side-surface plate 23 for adjusting the angle θ between the flexible board FPC 1 and the flexible board FPC 2, by adjusting the arrangement position of the flexible board PC 2 inside the lower case body 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device such as a folding mobile phone.

  In an electronic device such as a mobile phone, in addition to a straight-type mobile phone configured with a single housing, a foldable mobile phone capable of folding two housings is widely used. There are many mobile phones and the like on which an infrared module is mounted so that infrared communication can be performed with other mobile phones and the like.

  By the way, in the infrared communication by the infrared module, a certain radio wave intensity is required for stable transmission and reception. For this reason, after the design of the mobile phone or the like is completed, the installation angle of the infrared module installed in the casing is adjusted in consideration of the influence of the folding angle of the casing (for example, see Patent Documents 1 and 2).

  Here, with reference to FIG. 8 to FIG. 10, angle adjustment of the conventional folding mobile phone and the infrared module will be described. FIG. 8 is a cross-sectional view schematically showing an open state of a conventional folding mobile phone or the like. FIG. 9 is a cross-sectional view of the storage unit in which the infrared module is stored. FIG. 10 is a cross-sectional view schematically showing a closed state of a conventional folding mobile phone or the like. In FIG. 9, only the main part of the storage unit is shown.

  As shown in FIG. 8, the mobile phone 100 includes a lower housing 110 and an upper housing 120, and the upper and lower housings are folded at the hinge portion 130. For example, the lower housing 110 near the hinge unit 130 is provided with a storage unit 110A in which an infrared module is stored.

  As shown in FIG. 9, the storage portion 110A is formed by a back plate 150 on the back 110B (see FIG. 8) side, a front plate 160 on the front 100F (see FIG. 8) side, and a side plate 170. The infrared module 1200 is mounted on the circuit board 1100 supported by the back plate ribs 180 formed on the back plate 150 and the front plate ribs 190 formed on the front plate 160.

The side plate 170 near the infrared module 1200 is provided with a light emitting / receiving window (not shown) so that infrared rays transmitted and received by the infrared module can be transmitted. As shown in FIG. 8, when infrared communication is performed in a closed state in which the housing is folded, infrared rays are emitted with an infrared module 1200 and an infrared light receiving / emitting angle α. In other words, in order to perform infrared communication, it is necessary to secure the infrared light receiving / emitting angle α.
JP-A-11-014878 JP 2005-142575 A

  As shown in FIG. 8, when the casing is in the closed state, it is easy to ensure the infrared light receiving / emitting angle α. However, as shown in FIG. 10, the infrared communication is often performed in an open state in which the upper and lower housings are opened, and it may be difficult to secure the infrared light receiving / emitting angle α depending on the position of the upper housing 120. .

  Even if it is attempted to adjust the installation angle of the infrared module 1200 in order to secure the infrared light receiving / emitting angle α, the circuit board 1100 itself is fixed by the back plate rib 180 and the front plate rib 190. It is difficult to adjust the installation angle of the module 1200. In such a case, in order to adjust the installation angle, it is necessary to change the design of the upper and lower housings, and there is a disadvantage that the development efficiency of a mobile phone or the like is lowered.

  The present invention is capable of adjusting the angle of the infrared module without changing the specifications of the casing after the casing is manufactured, and improving the development efficiency of electronic devices such as mobile phones.

  An electronic device according to the present invention includes a housing, a first member provided in the housing, a second member connected to the first member, and an infrared ray disposed on the second member. The module includes an adjustment unit that adjusts an angle between the first member and the second member by adjusting an installation position of the second member in the housing.

  Preferably, the adjusting portion includes a plurality of engaging portions that are formed on a wall surface of the housing and engage the second member, and the second member is the The said angle is adjusted with the position engaged with an engaging part.

  Suitably, the said housing | casing has a holding part holding the said 1st member.

  Preferably, at least one of the first member and the second member is a flexible substrate.

  Preferably, the rigidity of the second member is higher than that of the first member.

  Preferably, a reinforcing portion is formed on the second member, and the rigidity of the second member is higher than the rigidity of the first member.

  Preferably, one flexible substrate is formed by the first member and the second member, and the second member is formed by the flexible substrate and the reinforcing portion.

  Preferably, the casing includes a transmission / reception unit that transmits light so that the infrared module performs at least one of transmission and reception of light, and the adjustment unit is connected to the transmission / reception unit on the casing. Adjacent to each other.

  Preferably, the casing includes a transmission / reception unit that transmits light so that the infrared module performs at least one of transmission and reception of light, and the casing opens and closes around a hinge portion. A first housing and a second housing, wherein the transmission / reception unit includes a hinge portion of one of the first housing and the second housing in which the hinge portion is formed. It is formed at the side end.

  According to the present invention, the angle of the infrared module can be adjusted without changing the specifications of the casing after the casing is manufactured, and the development efficiency of electronic devices such as mobile phones can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
A first embodiment according to the present invention will be described. FIG. 1 is a perspective view showing an example of the appearance of the mobile phone according to the first embodiment. 1A shows the opened state of the housing, and FIG. 1B shows the closed state of the housing.

  As shown in FIG. 1A, a mobile phone 1 as an electronic device is composed of a lower housing 2 and an upper housing 3, and a folding type (folder) in which the upper and lower housings can be folded at a hinge portion 4. Type) mobile phone. The lower housing 2 corresponds to the housing of the present invention.

  On the front surface 2F side of the lower housing 2, an operation unit 7 composed of a numeric keypad, direction keys, and the like is provided, and below the operation unit 7, a telephone microphone 13b (see FIG. 5) is provided. . On the back surface 3B side of the upper housing 3, a display unit 6 composed of a display device such as a liquid crystal display panel or an organic EL (Electro-Luminescence) panel is provided. 13a (see FIG. 5) is provided.

  When the upper and lower casings are opened (see FIG. 1A), when the upper and lower casings are folded by the hinge portion 4, the upper and lower casings illustrated in FIG. 1B are closed. The lower housing 2 and the upper housing 3 are each formed in a substantially thin rectangular parallelepiped, and in the closed state, the contours of the lower housing 2 and the upper housing 3 substantially coincide with each other when viewed from the other housing side. On the side surface 2S of the lower housing 2 in the vicinity of the hinge portion 4, a light receiving / emitting window (corresponding to the transmitting / receiving portion of the present invention) 5 for an infrared module 8 (see FIG. 2) described later is provided. Inside the lower housing 2, a storage unit 2 </ b> A for storing the infrared module 8 is provided near the light emitting / receiving window 5.

  Next, the internal structure of the storage unit 2A in the lower housing 2 will be described with reference to FIGS. FIG. 2 is a cross-sectional view showing the storage portion of the lower housing according to the first embodiment. FIG. 3 is a plan view showing a storage unit in the lower housing according to the first embodiment. 2 and 3 show only the main part of the storage unit.

  As shown in FIG. 2, the storage portion 2A of the lower housing 2 includes a back plate 21 on the back 2B side (see FIG. 1), a front plate 22 on the front 2F (see FIG. 1), and a side 2S side (see FIG. 1). ) Side plate 23, back plate rib 24, front plate rib 25, and light receiving / emitting window 5 (see FIG. 3), in which flexible substrate FPC 1, flexible substrate FPC 2, and infrared module 8 are provided. ing. The side plate 23 corresponds to the adjustment portion of the present invention, the flexible substrate FPC1 corresponds to the first member of the present invention, the flexible substrate FPC2 corresponds to the second member of the present invention, and the back plate. The rib 24 corresponds to the holding portion of the present invention.

  The back plate 21 and the front plate 22 are made of, for example, a nonconductive resin. The back plate 21 and the front plate 22 are joined to the side plate 23 so as to sandwich the flexible substrates FPC1 and FPC2 to form the storage portion 2A.

  The side plate 23 is made of, for example, a nonconductive resin, and forms the side surface 2S of the lower housing 2. As shown in FIG. 2, a part of the side wall of the side plate 23 is formed in an uneven shape. The unevenness forms a first groove 231 as an engaging portion and a second groove 232 as an engaging portion. Since the grooves 231 and 232 are formed in a part of the side plate 23, the side plate 23 has a function of adjusting an angle θ formed by the flexible substrates FPC1 and FPC2.

  One end of the flexible board FPC2 is engaged (or fitted) by the groove 231 or the groove 232, and the angle θ can be adjusted in two steps. The width H of the grooves 231 and 232 is a width that can be fixed by engaging one end of the flexible substrate FPC2.

  The back plate rib 24 is formed on the inner side of the storage portion 2A of the back plate 21, and the front plate rib 25 is formed on the inner side of the storage portion 2A of the front plate at a position where the flexible board FPC1 can be held. That is, the back plate rib 24 and the front plate rib 25 hold the flexible substrate FPC1.

  The flexible board FPC1 is a flexible printed board on which a plurality of circuit patterns are printed and has flexibility with respect to board strength. In the description of the embodiment, the flexible printed board is simply referred to as a flexible board. As shown in FIG. 3, one end of the flexible substrate FPC1 is joined to one end of the flexible substrate FPC2 by a joint portion JOI.

  The flexible substrate FPC1 and the flexible substrate FPC2 are joined using, for example, an anisotropic conductive adhesive film (ACF). Of course, other joining members other than the ACF can be used for this joining.

  The flexible board FPC2 is a flexible printed board on which a plurality of circuit patterns are printed. One end S <b> 1 of the flexible substrate FPC <b> 2 is joined to one end of the flexible substrate FPC <b> 1 by a joint JOI, and the other end S <b> 2 of the flexible substrate FPC <b> 2 is engaged by either the groove 231 or the groove 232. On the substrate of the flexible substrate FPC 2, an infrared module 8 is mounted in the vicinity of the light emitting / receiving window 5 as shown in FIG. As described above, the flexible substrate FPC 2 is reinforced by the reinforcing plate 26 as the reinforcing portion of the present invention in order to mount the infrared module 8. Accordingly, the rigidity of the flexible substrate FPC2 is higher than that of the flexible substrate FPC1.

  As shown in FIG. 3, the light receiving / emitting window 5 is formed in a part of the side plate 23 with a material that transmits infrared rays transmitted and received by the infrared module 8.

  The infrared module 8 is an infrared module that performs infrared communication of an IrDA (Infrared Data Association) standard with an external device. As shown in FIG. 2, the mounting position of the infrared module 8 is on the side facing the front plate 22 on the flexible substrate FPC 2, and as shown in FIG. 3, the light emitting / receiving window 5 capable of infrared communication with an external device. It is the neighborhood.

  Next, angle adjustment of the infrared module 8 by the side plate 23 as an adjustment unit will be described. FIG. 4 is a schematic cross-sectional view of the mobile phone in the open state for explaining the infrared light receiving and emitting angles according to the first embodiment.

  The edge S2 of the flexible substrate FPC2 is formed in the groove 231 or the groove 232 so that the infrared module 8 can secure an infrared light receiving / emitting angle α (see FIG. 4) that enables infrared transmission / reception through the light receiving / emitting window 5 (see FIG. 3). Adjustment is made to engage. In the example of FIG. 2, the end S <b> 2 of the flexible substrate FPC <b> 2 is engaged with the groove 232. 2 indicates the case where the end S2 of the flexible substrate FPC2 is engaged with the groove 231. Thereby, even when the upper and lower housings are in the open state, as shown in FIG. 4, a sufficient infrared light receiving / emitting angle α is secured.

  By the way, the above-described mobile phone 1 is realized by the following configuration. FIG. 5 is a block diagram illustrating a configuration example of the mobile phone according to the first embodiment.

  The mobile phone 1 includes a display unit 6, an operation unit 7, an infrared module 8, an antenna 9, a communication unit 10, a control unit (CPU) 11, a storage unit 12, a voice input / output unit 13, a speaker (SP) 13a, and a microphone ( MIC) 13b.

  The mobile phone 1 is connected to a network via a base station (not shown), and via the connected base station, voice call, creation of e-mail and transmission / reception, WEB site and content data (for example, moving image, still image) It has a function of browsing.

  The display unit 6 displays various information according to the video signal supplied from the control unit 11.

  The operation unit 7 has a plurality of keys to which various functions such as a power key, a call key, a numeric key, a character key, a direction key, a determination key, and a call key are assigned, and these keys are operated by the user. Then, a signal corresponding to the operation content is generated and output to the control unit 11 as a user instruction.

  The antenna 9 transmits or receives electromagnetic waves in a predetermined frequency band toward a base station (not shown).

  The communication unit 10 performs wireless communication with a base station connected to data communication such as voice data such as a call, character information such as an electronic mail, and moving image data. The communication unit 10 modulates the transmission signal output from the control unit 11 to a predetermined modulation method, transmits the signal as a radio signal via the antenna 9, and demodulates the radio signal received via the antenna 9 according to the modulation method. And output as a received signal to the control unit.

  The control unit 11 comprehensively controls the overall operation of the mobile phone 1. That is, the control unit 11 performs various processes of the mobile phone 1 (control of voice calls performed via the network, creation and transmission / reception of e-mails, browsing of the WEB site, etc.) according to the operation of the operation unit 7 by the user. The operation of each component (transmission / reception of radio signals in the communication unit 10, access to the storage unit 12, input / output of audio in the audio input / output unit 13, and display of images on the display unit 6 are performed according to appropriate procedures. Etc.).

  The storage unit 12 includes a nonvolatile storage device (flash memory), a randomly accessible storage device such as an SRAM or a DRAM, and stores various data.

  The audio input / output unit 13 processes an audio signal output to the speaker 13a and an audio signal input from the microphone 13b. That is, the voice input / output unit 13 amplifies the voice input from the microphone 13b, performs analog / digital (A / D) conversion, further performs processing such as encoding, and converts it into digital voice data for control. To the unit 11. The audio input / output unit 13 performs signal processing such as encoding, digital / analog (D / A) conversion, amplification, and the like on the audio data supplied from the control unit 11 and converts the audio data into an analog audio signal, which is then sent to the speaker 13a Output.

  According to the present embodiment, the mobile phone 1 is disposed on the lower housing 2, the flexible substrate FPC1 provided in the lower housing 2, the flexible substrate FPC2 connected to the flexible substrate FPC1, and the flexible substrate FPC2. Since the infrared module 8 and the side plate 23 that adjusts the angle θ between the flexible substrate FPC1 and the flexible substrate FPC2 by adjusting the installation position in the lower housing 2 of the flexible substrate FPC2, Without changing the specification later, it is possible to adjust the installation angle of the infrared module, that is, the infrared light receiving / emitting angle α after the housing is manufactured. Therefore, in the case where the infrared light receiving / emitting angle α cannot be ensured, there is a benefit that a back-end process of remanufacturing the housing mold is not required, and the development efficiency can be improved.

  In addition to the above-described benefits, there is a benefit that the infrared light receiving / emitting angle α can be secured without the need for a computer simulation of the infrared light receiving / emitting angle α. Even when there is a sudden change in the housing design, the infrared light receiving / emitting angle α can be quickly adjusted.

  Since the angle θ is determined by the number of grooves provided in the side plate 23, the angle of the infrared module 8 may be adjusted more finely by increasing the number of grooves. A reinforcing plate similar to the flexible substrate FPC2 may be mounted on the flexible substrate FPC1.

(Second Embodiment)
Next, a second embodiment according to the present invention will be described. FIG. 6 is a cross-sectional view showing the storage portion of the lower housing according to the second embodiment. FIG. 6 shows only the main part of the storage unit.

  In the second embodiment, as a modification of the first embodiment, the infrared module 8 of the storage unit 2A-1 is mounted on the side facing the back plate 21 on the flexible substrate FPC2. Therefore, it is necessary to install the infrared module 8 at a position higher than the installation position of the first embodiment with respect to the back plate 21. Therefore, the height of the back plate rib 24a is higher than the height of the back plate rib 24 according to the first embodiment, and the height of the front plate rib 25a is lower than the height of the front plate rib 25 according to the first embodiment. Has been.

  A first groove 231a to a sixth groove 236a are formed in the side surface plate 23a as the adjusting portion. Therefore, the side plate 23a has a function of adjusting the angle θ formed by the flexible substrates FPC1 and FPC2 in six stages. Therefore, the infrared light receiving / emitting angle α can be finely and finely adjusted as compared with the adjusting unit according to the first embodiment.

  In the example of FIG. 6, the end S2 of the flexible substrate FPC2 is engaged with the groove 232a. 6 indicates a case where the end S2 of the flexible substrate FPC2 is engaged with the groove 231a.

  Also in the second embodiment, the same effect as in the first embodiment can be obtained.

(Third embodiment)
Next, a third embodiment according to the present invention will be described. FIG. 7 is a plan view showing a storage portion of the lower housing according to the third embodiment. FIG. 7 shows only the main part of the storage unit.

  In the third embodiment, as a modification of the first and second embodiments, the adjustment unit according to the present invention is formed on a different surface from the surface on which the light emitting and receiving window 5 is attached. Specifically, an adjustment portion is provided on the side plate 2C that is orthogonal to the side surface 2S of the storage portion 2A-2, and a groove as an engaging portion is formed on the side plate 2C. The number of grooves may be two as in the first embodiment, or may be six as in the second embodiment.

  Also in the third embodiment, the same effect as in the first and second embodiments can be obtained.

  In the present embodiment, the infrared module is stored in the lower casing, but the infrared module may be stored in the upper casing. The present invention can be applied even when an infrared module is stored in the upper housing.

  Although a mobile phone has been exemplified as the electronic device, the present invention can be applied to a PHS (Personal Handy-phone System), a PDA (Personal Digital Assistant), a game machine, and the like having the same configuration as that of the present embodiment. The present invention can also be applied to a slide-type mobile phone or the like in which the upper and lower housings slide relatively.

  In the above description of each embodiment, the case where the flexible substrate FPC1 and the flexible substrate FPC2 are joined by the joint portion JOI has been described as an example. However, the electronic apparatus of the present invention is limited to such a case. In the above embodiment, the flexible substrate FPC1 and the flexible substrate FPC2 may be formed of a single flexible substrate.

That is, for example, as shown in FIG. 2, the flexible substrate FPC1 and the flexible substrate FPC2 are portions of one flexible substrate, and the flexible substrate FPC2 also forms the reinforcing plate 26 and the flexible substrate FPC1. It is good also as a structure formed with the flexible substrate.
In this case, as illustrated in FIG. 3, the joint portion JOI is a boundary portion between the flexible substrate FPC1 and the flexible substrate FPC2.

  That is, in this embodiment, there are a portion (a portion of the flexible substrate FPC2) where the reinforcing plate 26 is pasted on one flexible substrate and a portion (a portion of the flexible substrate FPC1) as it is, and the joint portion JOI serving as a bending portion includes: The structure is such that no reinforcing plate is applied.

  In such an embodiment, the labor of joining the flexible substrate FPC1 and the flexible substrate FPC2 to each other can be saved.

  In addition, when the flexible substrate FPC1 and the flexible substrate FPC2 are formed of one flexible substrate as described above, both are continuous in shape, but the flexible substrate FPC1 and the flexible substrate FPC2 are connected to each other. , Also expressed.

It is a perspective view which shows the example of an external appearance of the mobile telephone which concerns on 1st Embodiment. It is sectional drawing which shows the storage part of the lower housing | casing which concerns on 1st Embodiment. It is a top view which shows the storage part in the lower housing | casing which concerns on 1st Embodiment. It is typical sectional drawing of the mobile telephone in the open state for demonstrating the infrared rays light receiving / emitting angle which concerns on 1st Embodiment. It is a block diagram which shows the structural example of the mobile telephone which concerns on 1st Embodiment. It is sectional drawing which shows the storage part of the lower housing | casing which concerns on 2nd Embodiment. It is a top view which shows the storage part of the lower housing | casing which concerns on 3rd Embodiment. It is sectional drawing which shows typically the open state of the conventional folding type mobile telephone. It is sectional drawing of the storage part in which the infrared module was stored. It is sectional drawing which shows typically the closed state of the conventional folding type mobile telephone.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Mobile phone, 2 ... Lower housing | casing, 21 ... Back plate, 22 ... Front plate, 23 ... Side plate, 24 ... Back plate rib, 25 ... Front plate rib, 26 ... Reinforcement plate, 231 ... 1st groove | channel, 232: Second groove, 2A: Storage portion, 2B: Rear surface of lower housing, 2C: Side plate of lower housing, 2F: Front surface of lower housing, 2S: Side surface, 3: Upper housing, 3B: Upper Back surface of casing 4 ... hinge part, 5 ... light emitting and receiving window, 6 ... display part, 7 ... operation part, 8 ... infrared module, 9 ... antenna, 10 ... communication part, 11 ... control part, 12 ... storage part, 13 ... voice input / output unit, 13a ... speaker, 13b ... microphone, FPC1 ... flexible substrate, FPC2 ... flexible substrate

Claims (9)

A housing,
A first member provided in the housing;
A second member connected to the first member;
An infrared module disposed on the second member;
An electronic apparatus comprising: an adjustment unit that adjusts an angle between the first member and the second member by adjusting an installation position of the second member in the housing. The adjustment unit is
The adjustment portion is formed on the wall surface of the housing,
A plurality of engaging portions for engaging the second member;
The electronic device according to claim 1, wherein the angle is adjusted by a position at which the second member is engaged with the engaging portion. The housing is
The electronic device according to claim 1, further comprising a holding unit that holds the first member. The electronic device according to any one of claims 1 to 3, wherein at least one of the first member and the second member is a flexible substrate. The electronic apparatus according to claim 1, wherein the second member has higher rigidity than the first member. The electronic device according to claim 1, wherein a reinforcing portion is formed on the second member, and the rigidity of the second member is higher than the rigidity of the first member. One flexible substrate is formed by the first member and the second member,
The second member is
The electronic device according to claim 1, wherein the electronic device is formed by the flexible substrate and the reinforcing portion. The housing is
The infrared module has a transmission / reception unit that transmits light to perform at least one of transmission and reception of light,
The adjustment unit is
The electronic device according to claim 1, wherein the electronic device is formed adjacent to the transmission / reception unit on the housing. The housing is
The infrared module has a transmission / reception unit that transmits light to perform at least one of transmission and reception of light,
The casing includes a first casing and a second casing that open and close each other around a hinge portion,
The transmission / reception unit is formed at a hinge part side end portion of either the first casing or the second casing in which the hinge part is formed. The electronic device as described in any one.

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