JP2009130054A - 配線基板及びその製造方法 - Google Patents
配線基板及びその製造方法 Download PDFInfo
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- JP2009130054A JP2009130054A JP2007302007A JP2007302007A JP2009130054A JP 2009130054 A JP2009130054 A JP 2009130054A JP 2007302007 A JP2007302007 A JP 2007302007A JP 2007302007 A JP2007302007 A JP 2007302007A JP 2009130054 A JP2009130054 A JP 2009130054A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H05K1/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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- H01—ELECTRIC ELEMENTS
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2203/03—Metal processing
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】配線層を含む絶縁層が積層された配線部材30と、配線部材30上の接続パッド18部周辺に設けられた補強層50とを有した配線基板において、補強層50に複数の凹凸条部50aを設ける。
【選択図】図2
Description
配線層を含む絶縁層が積層された配線部材と、
該配線部材上の接続パッド部周辺に設けられた補強層とを有した配線基板であって、
前記補強層は、複数の凹凸条部を有する配線基板により解決することができる。
支持体上に配線層を含む絶縁層を積層して配線部材を形成する工程と、
前記配線部材から前記支持体の一部を除去して、前記配線層の表面が露出する工程とを有する配線基板の製造方法であって、
前記支持体の一部を除去することによって複数の凹凸条部を有する補強層を形成する工程を有する配線基板の製造方法により解決することができる。
支持体上に配線層を含む絶縁層を積層して配線部材を形成する工程と、
前記配線部材から前記支持体を除去する工程とを有する配線基板の製造方法であって、
前記支持体が除去された配線部材上に、複数の凹凸条部を有する補強層を接着剤を介在させて配置する工程とを有する配線基板の製造方法により解決することができる。
10 支持体
11 半導体チップ
15〜17 レジスト膜
18 第1配線層(接続パッド)
18a 第2配線層
18b 第3配線層
18c 第4配線層
19 ニッケル層
20 第1絶縁層
20a 第2絶縁層
20b 第3絶縁層
22 ソルダーレジスト
30 配線部材
50 補強層
50a〜50s 凹凸条部
60 接続部材
80 ヒートスプレッダ
Claims (4)
- 配線層を含む絶縁層が積層された配線部材と、
該配線部材上の接続パッド部周辺に設けられた補強層とを有した配線基板であって、
前記補強層は、複数の凹凸条部を有する配線基板。 - 前記複数の凹凸条部は、複数の異なる方向に延出するように設けられる請求項1記載の配線基板。
- 支持体上に配線層を含む絶縁層を積層して配線部材を形成する工程と、
前記配線部材から前記支持体の一部を除去して、前記配線層の表面が露出する工程とを有する配線基板の製造方法であって、
前記支持体の一部を除去することによって複数の凹凸条部を有する補強層を形成する工程を有する配線基板の製造方法。 - 支持体上に配線層を含む絶縁層を積層して配線部材を形成する工程と、
前記配線部材から前記支持体を除去する工程とを有する配線基板の製造方法であって、
前記支持体が除去された配線部材上に、複数の凹凸条部を有する補強層を接着剤を介在させて配置する工程とを有する配線基板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007302007A JP2009130054A (ja) | 2007-11-21 | 2007-11-21 | 配線基板及びその製造方法 |
KR1020080115571A KR20090052814A (ko) | 2007-11-21 | 2008-11-20 | 배선기판 및 이의 제조방법 |
US12/274,719 US20090134530A1 (en) | 2007-11-21 | 2008-11-20 | Wiring substrate and method of manufacturing the same |
TW097145075A TW200924596A (en) | 2007-11-21 | 2008-11-21 | Wiring substrate and method of manufacturing the same |
EP08169709A EP2066156A3 (en) | 2007-11-21 | 2008-11-21 | Wiring substrate and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007302007A JP2009130054A (ja) | 2007-11-21 | 2007-11-21 | 配線基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009130054A true JP2009130054A (ja) | 2009-06-11 |
JP2009130054A5 JP2009130054A5 (ja) | 2010-10-21 |
Family
ID=40409951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007302007A Pending JP2009130054A (ja) | 2007-11-21 | 2007-11-21 | 配線基板及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090134530A1 (ja) |
EP (1) | EP2066156A3 (ja) |
JP (1) | JP2009130054A (ja) |
KR (1) | KR20090052814A (ja) |
TW (1) | TW200924596A (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5120342B2 (ja) * | 2009-06-18 | 2013-01-16 | ソニー株式会社 | 半導体パッケージの製造方法 |
US8127979B1 (en) * | 2010-09-25 | 2012-03-06 | Intel Corporation | Electrolytic depositon and via filling in coreless substrate processing |
KR102079256B1 (ko) * | 2013-09-13 | 2020-02-20 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
JP2017017238A (ja) * | 2015-07-03 | 2017-01-19 | 株式会社ジェイデバイス | 半導体装置及びその製造方法 |
US20180190596A1 (en) * | 2016-12-30 | 2018-07-05 | Intel Corporation | Standoff members for semiconductor package |
KR101938104B1 (ko) * | 2018-01-25 | 2019-01-14 | 주식회사 기가레인 | 접합 평탄도가 개선된 연성회로기판 |
CN112038242A (zh) * | 2020-09-10 | 2020-12-04 | 华进半导体封装先导技术研发中心有限公司 | 先重布线扇出型封装方法及结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1050877A (ja) * | 1996-07-30 | 1998-02-20 | Toshiba Corp | 半導体パッケージ |
JP2001060648A (ja) * | 1999-08-23 | 2001-03-06 | Dainippon Printing Co Ltd | リードフレーム及びその製造方法並びに半導体装置 |
JP2002299495A (ja) * | 2001-03-30 | 2002-10-11 | Fuji Electric Co Ltd | 半導体回路基板 |
JP2005302922A (ja) * | 2004-04-09 | 2005-10-27 | Ngk Spark Plug Co Ltd | 配線基板およびその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6552267B2 (en) * | 2001-08-13 | 2003-04-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Microelectronic assembly with stiffening member |
SG102637A1 (en) * | 2001-09-10 | 2004-03-26 | Micron Technology Inc | Bow control in an electronic package |
KR100516795B1 (ko) | 2001-10-31 | 2005-09-26 | 신꼬오덴기 고교 가부시키가이샤 | 반도체 장치용 다층 회로 기판의 제조 방법 |
JP3615727B2 (ja) * | 2001-10-31 | 2005-02-02 | 新光電気工業株式会社 | 半導体装置用パッケージ |
JP4094494B2 (ja) * | 2002-08-23 | 2008-06-04 | 新光電気工業株式会社 | 半導体パッケージ |
WO2004086498A1 (ja) * | 2003-03-26 | 2004-10-07 | Fujitsu Limited | 半導体装置 |
JP2006186136A (ja) * | 2004-12-28 | 2006-07-13 | Toshiba Corp | 両面部品実装回路基板及びその製造方法 |
-
2007
- 2007-11-21 JP JP2007302007A patent/JP2009130054A/ja active Pending
-
2008
- 2008-11-20 KR KR1020080115571A patent/KR20090052814A/ko not_active Application Discontinuation
- 2008-11-20 US US12/274,719 patent/US20090134530A1/en not_active Abandoned
- 2008-11-21 EP EP08169709A patent/EP2066156A3/en not_active Withdrawn
- 2008-11-21 TW TW097145075A patent/TW200924596A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1050877A (ja) * | 1996-07-30 | 1998-02-20 | Toshiba Corp | 半導体パッケージ |
JP2001060648A (ja) * | 1999-08-23 | 2001-03-06 | Dainippon Printing Co Ltd | リードフレーム及びその製造方法並びに半導体装置 |
JP2002299495A (ja) * | 2001-03-30 | 2002-10-11 | Fuji Electric Co Ltd | 半導体回路基板 |
JP2005302922A (ja) * | 2004-04-09 | 2005-10-27 | Ngk Spark Plug Co Ltd | 配線基板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2066156A2 (en) | 2009-06-03 |
US20090134530A1 (en) | 2009-05-28 |
KR20090052814A (ko) | 2009-05-26 |
TW200924596A (en) | 2009-06-01 |
EP2066156A3 (en) | 2009-12-02 |
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