JP2009123058A - Non-contact type ic tag and production method for non-contact type ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact type IC (Integrated Circuit) tag or the like allowing communication from a horizontal and/or vertical direction without being affected by a direction of an electric wave of an antenna regardless of positional relation of transmission/reception by use of an IC chip having a diversity function. <P>SOLUTION: This secondary antenna-equipped non-contact type IC tag 1 is formed by nearly vertically disposing a first loop antenna 4 and a second loop antenna 5 on a base film 2 through the IC chip 3 having the diversity function, disposing a first secondary antenna 6 near the first loop antenna 4 to form a non-contact type IC tag 10, and superposedly attaching a second secondary antenna 7 onto the non-contact type IC tag 10 near the second loop antenna 5 from the outside. The secondary antenna-equipped non-contact type IC tag 1 changes over between the first loop antenna 4 and the second loop antenna 5 and performs selection according to reception intensity by the diversity function of the IC chip 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a contactless IC (Integrated Circuit) tag that performs contactless information communication, and more particularly, to a contactless IC tag formed from a loop antenna and a secondary antenna connected to an IC chip with a diversity function, and the same It relates to a manufacturing method.

  In recent years, non-contact type IC tags used for information storage and display in contact with reader / writers in process management, logistics management, distribution fields, etc. in factories such as manufacturing have become IC tag labels, packages, and cases. It is used for a wide range of purposes as tags to be attached.

In recent years, in addition to the conventional 13.56 MHz band or microwave band (2.45 GHz) non-contact IC tag, it has become possible to use the UHF band (952 M to 955 MHz) in Japan due to the revision of the law. UHF band non-contact IC tags are being put to practical use.
The UHF band IC tag can be collectively read from a long distance (3 to 5 meters) as compared to the electromagnetic induction type 13.56 MHz band non-contact IC tag. Further, the microwave band IC tag can communicate at a distance of 1 to 1.5 meters, and is expected to be widely used in applications that take advantage of these features in the future.

  Incidentally, in recent years, IC chips having a diversity function have been supplied. The diversity function means that a switching mechanism for the antenna is built in the chip, and has a function (circuit) that determines the strength of the input power of the two antennas and automatically selects the stronger one. The diversity function is generally used for mobile phone devices, in-vehicle antennas, various mobile communication terminals, and the like (see, for example, Patent Document 1).

FIG. 9 is a block diagram showing an internal structure of an antenna control circuit using a conventional diversity function.
The IC chip 93 in FIG. 9 has a diversity function, has two or more antenna input terminals, is connected to the antenna 91 and the antenna 92, and the antenna 91 and the antenna 92 can be switched by a switch 94. When the IC chip 93 having the switch 94 is used (when the diversity function is used), either the antenna 91 or the antenna 92 is used with the other being cut off even in the state before disconnection. , 92, and the antenna design becomes easy.

JP 2001-298385 A

  The non-contact type IC tag receives a predetermined signal from the reader / writer and transmits a reply signal to be returned to communicate information with the reader / writer. The non-contact type IC tag and the reader / writer Depending on the positional relationship, the communication sensitivity is significantly reduced. The transmission / reception of various data of the non-contact type IC tag by R / W is affected by the reading direction of horizontal radio waves, vertical radio waves and the like with respect to the antenna, and communication may be impossible depending on radio waves. For example, when performing batch reading of data of non-contact type IC tags attached to a plurality of packages, products, etc., there is a problem that non-contact type IC tags that cannot be read at a time are generated.

  The present invention has been made in view of the above points, and using an IC chip having a diversity function, communication from horizontal and vertical directions is not affected by the direction of radio waves of the antenna regardless of the positional relationship of transmission and reception. An object of the present invention is to provide a non-contact type IC tag or the like that can be used.

  In order to achieve the above-mentioned object, a first invention includes a first loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the first loop antenna, and the IC An inlet formed by a second loop antenna connected to a chip and disposed perpendicular to the first loop antenna, and disposed on one surface of the base film base material at a position close to the first loop antenna A non-contact type IC tag comprising a first secondary antenna, wherein the second secondary antenna, which is a conductive pattern, is connected to the non-contact IC tag from the outside at a position close to the second loop antenna. A non-contact type IC tag that is attached to a contact type IC tag in a superimposed manner and switches between the first loop antenna and the second loop antenna according to reception intensity. .

Further, it is desirable to match the impedance of the first secondary antenna / secondary secondary antenna close to the selected first loop antenna / second loop antenna with the impedance of the IC chip 3.
The second secondary antenna is formed on an object, and the non-contact type IC tag is mounted so that the second secondary antenna and the second loop antenna are arranged in parallel at close positions. It is desirable to do.
Moreover, it is desirable that the first secondary antenna and the second secondary antenna have a linear shape at a portion juxtaposed with the inlet.
Further, it is desirable that the first secondary antenna is disposed on a surface on the first loop antenna side or on the opposite side of the first loop antenna, in parallel with one side of the loop antenna.

The “IC chip” includes a control unit, a memory unit for storing information, a non-contact type IC wireless communication unit, and the like.
The “inlet” is a primary processed member before the exterior base material is disposed.
“Diversity function” means that a switch mechanism for an antenna is built in a chip, and has a function (circuit) that determines the strength of input power of two antennas and automatically selects the stronger one. .

  A non-contact type IC tag according to a first aspect of the present invention is a first loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the first loop antenna, and connected to the IC chip. An inlet formed by a second loop antenna disposed perpendicular to the first loop antenna, and a first secondary disposed at a position close to the first loop antenna on one surface of the base film substrate A non-contact IC tag including an antenna, and a second secondary antenna, which is a conductive pattern, is superimposed and attached to the non-contact IC tag from the outside at a position close to the second loop antenna. The first loop antenna and the second loop antenna are switched and selected in accordance with the reception intensity.

In the first aspect of the invention, even when the contact signal is arranged regardless of the positional relationship between the non-contact type IC tag and the reader / writer, the direction of the radio wave is received regardless of whether the received signal is vertically polarized wave, horizontally polarized wave, or circularly polarized wave. The communication from the vertical direction and the horizontal direction can be performed without being affected by the high-sensitivity communication. Matching to the polarization of the antenna is possible, and highly sensitive communication can be realized.
To reduce the reading loss of data of the non-contact type IC tag in batch reading for the non-contact type IC tag provided for the article, and to reduce the work burden and time required for specifying the non-contact type IC tag that could not be read. Is possible.

  According to a second aspect of the present invention, there is provided a loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the loop antenna, and an antenna connected to the IC chip and arranged vertically to the loop antenna. A secondary antenna, which is a conductive pattern, is superimposed and attached to the non-contact IC tag from the outside at a position close to the loop antenna, according to the reception strength. The contactless IC tag is characterized in that the loop antenna and the antenna are switched and selected.

  A non-contact type IC tag according to a second invention is a loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the loop antenna, and a vertical connection to the loop antenna connected to the IC chip. A non-contact type IC tag formed with an antenna that is connected to the non-contact type IC tag from the outside by superimposing a secondary antenna as a conductive pattern on the non-contact type IC tag at a position close to the loop antenna. The loop antenna and the antenna are switched and selected accordingly.

  Further, the third invention is a first loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the first loop antenna, connected to the IC chip, A step (a) of forming an inlet with a second loop antenna disposed vertically to the first loop antenna; and a first surface on the base film substrate, the first loop antenna being positioned close to the first loop antenna. (B) forming a non-contact type IC tag by arranging a secondary antenna of No. 1, and a non-contact type IC tag from the outside at a position close to the second loop antenna. And a step (c) of superimposing and attaching to the non-contact type IC tag.

  The third invention is an invention relating to the method of manufacturing the non-contact type IC tag of the first invention.

  According to a fourth aspect of the present invention, there is provided a loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the loop antenna, and an antenna connected to the IC chip and arranged vertically to the loop antenna. Forming a non-contact type IC tag (a), and a step (b) of superimposing and attaching a secondary antenna to the non-contact type IC tag from the outside at a position close to the loop antenna. This is a method for manufacturing a non-contact type IC tag.

  4th invention is invention regarding the manufacturing method of the non-contact-type IC tag of 2nd invention.

  The present invention has been made in view of the above points, and using an IC chip having a diversity function, communication from horizontal and vertical directions is not affected by the direction of radio waves of the antenna regardless of the positional relationship of transmission and reception. It is possible to provide a non-contact type IC tag or the like that enables the above.

  Hereinafter, preferred embodiments of a non-contact type IC tag according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

  FIG. 1 is a diagram showing a non-contact IC tag 1 with a secondary antenna according to the first embodiment.

  FIG. 1 shows an example of a non-contact type IC tag 1 with a secondary antenna. As shown in FIG. 1, the non-contact type IC tag 1 with a secondary antenna includes a base film 2, an IC chip 3, and a first loop. An antenna 4, a second loop antenna 5, a first secondary antenna 6, a second secondary antenna 7 and the like are provided.

A substantially square loop-shaped first loop antenna 4 is disposed on the base film 2, and the IC chip 3 electrically connected to the first loop antenna 4 is connected to the IC chip 3. The inlet 20 of the non-contact type IC tag 10 is formed from a second loop antenna having a substantially square loop shape disposed substantially perpendicular to the one loop antenna 4.
The IC chip 3 has a diversity function, and amplifies the received waves of the first loop antenna 4 and the second loop antenna 5 to determine their strengths and performs switching by a switch mechanism. The two amplifier circuits of the IC chip 3 are required to have the same electrical characteristics such as amplification characteristics and frequency characteristics in order to accurately perform the determination.

  A non-contact type IC tag 10 is formed by arranging a first secondary antenna 6 having a linear shape in a portion juxtaposed with the inlet 20 at a position close to the first loop antenna 4 on the upper surface of the inlet 20. The first secondary antenna 6 may have any shape other than the portion juxtaposed with the inlet 20. The first secondary antenna 6 is disposed at a position (1 mm to 3 mm) adjacent to one side of the outer periphery of the first loop antenna 4.

At a position close to the second loop antenna 5 (1 mm to 3 mm), the second secondary antenna 7 is externally attached to the non-contact IC tag 10 and attached to the non-contact IC tag 1 with the secondary antenna. Form. The second secondary antenna 7 is a conductive pattern in which a portion juxtaposed with the inlet 20 is a linear shape.
The non-contact type IC tag 1 with a secondary antenna switches and selects the first loop antenna and the second loop antenna by the switch mechanism according to the reception strength by the diversity function of the IC chip 3. The impedance of the first secondary antenna / secondary secondary antenna close to the selected first loop antenna / second loop antenna and the impedance of the IC chip 3 are adjusted to be matched, The impedance between the secondary antenna and the IC chip 3 is matched.

  Next, a method for attaching the second secondary antenna 7 from the outside in the non-contact IC tag 1 with a secondary antenna will be described by way of example.

FIG. 2 is a diagram for explaining a method for attaching the second secondary antenna 7 to the non-contact IC tag 1 with a secondary antenna (attaching the second secondary antenna 7 formed on the object 8).
As shown in FIG. 2, a second secondary antenna 7 that is a conductive pattern is formed on the packaging surface of the article 8, and the second loop antenna 5 of the non-contact type IC tag 10 is formed on the packaging surface of the article 8. The non-contact type IC tag 10 that is temporarily attached to the release paper 14 is attached so as to be placed so as to be parallel to the position close to the second secondary antenna 7.
In the present embodiment, the second secondary antenna 7 is formed on the packaging surface of the article 8, but may be formed on the packaging rear surface of the article. Thereby, there is little erosion to surface printing.

FIG. 3 is a view for explaining a method of attaching the second secondary antenna 7 of the non-contact type IC tag 1 with a secondary antenna (attaching the seal type second secondary antenna 7).
As shown in FIG. 3, the second secondary antenna 7 is disposed on the base material 9, and is temporarily attached to the back surface of the base material 9 while applying an adhesive to the release paper 14. On the upper surface of the non-contact type IC tag 10, the seal-type second secondary antenna 7 is attached in parallel to a position close to the second loop antenna 5. By making the secondary antenna 5 into a seal type antenna that can be freely affixed to the inlet 20 like a general seal, the manufacturing and affixing operation of the non-contact type IC tag can be simplified.

  Next, a manufacturing method and a usage method of the non-contact type IC tag 1 with the secondary antenna according to the present embodiment will be described with reference to FIGS.

FIG. 4 is a flowchart showing a method for manufacturing the non-contact type IC tag 1 with a secondary antenna.
FIG. 5 is a cross-sectional view of the manufacturing process of the non-contact type IC tag 1 with a secondary antenna, and FIG. 5A is a cross-sectional view after the first secondary antenna 6 is arranged in the inlet 20. (B) is a cross-sectional view of the non-contact type IC tag 10 after laminating the surface protective film, and FIG. 5 (c) is a cross-sectional view of the non-contact type IC tag 10 temporarily attached to the release paper 14, FIG. 5D is a cross-sectional view in which the second secondary antenna 7 is formed on the packaging surface of the article 8, and FIG. 5E is a non-contact with the second secondary antenna formed on the object 8. FIG. 3 is a cross-sectional view of a mold IC tag 10 mounted thereon.

  First, the first loop antenna 4 and the second loop antenna 5 are disposed on the base film 2, and the IC chip 3 having a diversity function is mounted and connected to form the inlet 20. The first loop antenna and the second loop antenna 5 are vertically arranged via the IC chip 3 (step S401).

  Next, as shown to Fig.5 (a), the 1st secondary antenna 6 is arrange | positioned in the position (1 mm-3 mm) close | similar to the 1st loop antenna 4 on the base film 2 (step S402).

  Next, as shown in FIG. 5 (b), a surface protective film 19 made of a white film / paper substrate is applied to the entire upper surface of the inlet 20 formed through an adhesive layer 18 made of an adhesive on the IC chip 3 side. Lamination is performed to form the non-contact type IC tag 10 (step S403).

  Next, as shown in FIG. 5C, the adhesive film 18 is temporarily attached to the inlet 20 through the adhesive layer 18 while applying the adhesive material to the release paper 14 on the surface of the base film 2 opposite to the IC chip 3. (Step S404).

  Next, as shown in FIG. 5D, the second secondary antenna 7 is formed on the packaging surface of the object 8 (for example, a packaging body such as a cardboard box) (step S405). The second secondary antenna 7 is a conductive pattern having a linear shape in a portion juxtaposed with the inlet 20, for example, a pattern printed with conductive ink or a pattern obtained by etching a metal foil laminated on the base film 2. Yes.

  Next, as shown in FIG. 5 (e), the second loop antenna 5 of the inlet 20 is positioned close to and parallel to the second secondary antenna 7 on the object 8, and the non-contact type IC tag 10 is attached. (Step S406).

  Next, various constituent materials used for the non-contact IC tag 1 with a secondary antenna of the present invention will be described.

  The base film 2 that is the base material of the inlet 20 includes PET (polyethylene terephthalate), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), PP (polypropylene), PE (polyethylene), and PC (polycarbonate). ), PA (polyamide), PPS (polyphenylene sulfide), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylate, polyethylene, polyurethane, etc. Is used.

  The first loop antenna 4, the second loop antenna 5, the first secondary antenna 6, and the second secondary antenna 7 are conductor wires, and materials such as aluminum and silver paste are used.

  As the surface protective film 19, a white film, a paper base material, or the like is used. As the white film, those mentioned in the above base film 2 can be used, and as the paper base material, high-quality paper, coated paper, craft paper, glassine paper, synthetic paper, latex, melamine-impregnated paper, and the like can be used.

  As described above, according to the embodiment of the present invention, the non-contact type IC tag 1 with a secondary antenna has the first loop antenna 4 disposed on the base film 2 and the first loop. An IC chip 3 electrically connected to the antenna 4 and a second loop antenna connected to the IC chip 3 having a diversity function and arranged substantially perpendicularly to the first loop antenna 4 are non-attached with a secondary antenna. The inlet 20 of the contact type IC tag 1 is formed. The first secondary antenna 6 is arranged at a position close to the first loop antenna 4 on the upper surface of the inlet 20 to form a non-contact type IC tag 10. At a position close to the second loop antenna 5, the second secondary antenna 7 is attached to the non-contact type IC tag 10 from the outside so as to form a non-contact type IC tag 1 with a secondary antenna. The non-contact type IC tag 1 with a secondary antenna switches and selects the first loop antenna 4 and the second loop antenna 5 according to the reception strength by the diversity function of the IC chip 3, and selects the selected first The impedance of the first secondary antenna 5 / secondary secondary antenna 6 adjacent to the second loop antenna 4 / second loop antenna 5 and the impedance of the IC chip 3 are matched.

As a result, even when the non-contact type IC tag and the reader / writer are arranged irrespective of the positional relationship, the received signal is either vertically polarized or horizontally polarized, regardless of the direction of radio waves. Enables communication from the direction and realizes high-sensitivity communication. Matching to the polarization of the antenna is possible, and highly sensitive communication can be realized.
To reduce the reading loss of data of the non-contact type IC tag in batch reading for the non-contact type IC tag provided for the article, and to reduce the work burden and time required for specifying the non-contact type IC tag that could not be read. Is possible.

Next, the non-contact type IC tag 21 with the secondary antenna according to the second embodiment will be described. The non-contact type IC tag 21 with a secondary antenna according to the present embodiment includes a non-contact type IC tag 30 formed by connecting a loop antenna 24 and a direct connection type antenna 25 to an IC chip 3 having a diversity function. A secondary antenna 27 is attached.
FIG. 6 is a diagram showing a non-contact type IC tag 21 with a secondary antenna according to the second embodiment.

  As shown in FIG. 6, the non-contact type IC tag 21 with a secondary antenna includes a base film 2, an IC chip 3, a loop antenna 24, an antenna 25, a secondary antenna 27, and the like.

As shown in FIG. 6, the non-contact type IC tag 30 includes an IC chip 3 in which a loop antenna 24 having a substantially square loop shape is disposed on the base film 2 and electrically connected to the loop antenna 24. The non-contact type IC tag 30 is formed from a substantially square loop-shaped antenna 25 connected to the IC chip 3 and arranged substantially perpendicular to the loop antenna 24.
The IC chip 3 has a diversity function, amplifies the received waves of the loop antenna 24 and the antenna 25, determines the strength thereof, and performs switching. The two amplifier circuits of the IC chip 3 are required to have the same electrical characteristics such as amplification characteristics and frequency characteristics in order to accurately perform the determination.

A non-contact type IC tag 21 with a secondary antenna is attached by attaching a secondary antenna 27 to the non-contact type IC tag 30 from the outside at a position (1 mm to 3 mm) close to the loop antenna 24 of the non-contact type IC tag 30. Form. The secondary antenna 27 is a conductive pattern in which a portion juxtaposed with the loop antenna 24 is a linear shape.
The non-contact type IC tag 21 with the secondary antenna switches and selects the loop antenna 24 and the antenna 25 according to the reception strength by the diversity function of the IC chip 3. When the loop antenna 24 is selected, the impedance of the secondary antenna 27 close to the loop antenna 24 and the impedance of the IC chip 3 are adjusted so as to be matched. Match impedance.

  Next, a method for attaching the secondary antenna 27 from the outside in the non-contact IC tag 21 with a secondary antenna will be described.

FIG. 7 is a diagram for explaining a method for attaching the secondary antenna 27 to the non-contact IC tag 21 with a secondary antenna (attaching the secondary antenna 27 formed on the object 8).
As shown in FIG. 7, the secondary antenna 27 that is a conductive pattern is formed on the packaging surface of the article 8, and the loop antenna 24 of the non-contact type IC tag 30 is connected to the secondary antenna 27 on the packaging surface of the article 8. The non-contact type IC tag 30 is pasted so as to be placed so as to be parallel to the adjacent position.
In this embodiment, the secondary antenna 27 is formed on the packaging surface of the article 8, but may be formed on the packaging back surface of the article. Thereby, there is little erosion to surface printing.

  FIG. 8 is a diagram for explaining a method of attaching the second secondary antenna 7 to the non-contact type IC tag 21 with a secondary antenna (attaching a seal type secondary antenna 27).

  As shown in FIG. 8, the secondary antenna 27 is disposed on the base material 9 and is temporarily attached to the back surface of the base material 9 while applying the adhesive to the release paper 14. A seal-type secondary antenna 27 is attached to the top surface of the non-contact type IC tag 30 in parallel to a position close to the loop antenna 24. The secondary antenna 27 is configured as a seal type antenna that can be freely attached to the non-contact type IC tag 30 like a general seal.

  Next, a method for manufacturing and using the non-contact type IC tag 21 with the secondary antenna according to the present embodiment will be described.

First, the non-contact type IC tag 30 has the loop antenna 24 disposed on the base film 2, the IC chip 3 having a diversity function is mounted, connected, connected to the IC chip 3, and vertically disposed on the loop antenna 24. Form. The non-contact type IC tag 30 is provided with a surface protection base material around it. The adhesive film 18 is temporarily attached to the surface of the base film 2 opposite to the IC chip 3 through the adhesive layer 18 while being applied to the release paper 14.
Next, the secondary antenna 27 which is a conductive pattern is attached to the packaging surface of the object 8. The non-contact type IC tag 21 with the secondary antenna is formed by attaching the non-contact type IC tag 30 to the loop antenna 24 close to and parallel to the secondary antenna 27 on the object 8 and attaching it.

  The preferred embodiments of the contactless IC tags 1 and 21 with the secondary antenna according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

The figure which shows non-contact type IC tag 1 with a secondary antenna which concerns on 1st Embodiment The figure for demonstrating the 2nd secondary antenna 7 attachment method (The 2nd secondary antenna 7 formed in the object 8 is attached) of the non-contact-type IC tag 1 with a secondary antenna. The figure for demonstrating the attachment method of the 2nd secondary antenna 7 of the non-contact type IC tag 1 with a secondary antenna (attaching the seal type 2nd secondary antenna 7) Flowchart showing a method for manufacturing a non-contact IC tag 1 with a secondary antenna Sectional drawing of the manufacturing process of the non-contact type IC tag 1 with a secondary antenna The figure which shows the non-contact-type IC tag 21 with a secondary antenna which concerns on 2nd Embodiment. The figure for demonstrating the secondary antenna 27 attachment method (attaching the secondary antenna 27 formed in the object 8) of the non-contact-type IC tag 21 with a secondary antenna. The figure for demonstrating the 2nd secondary antenna 7 attachment method (attached the seal type secondary antenna 27) of the non-contact-type IC tag 21 with a secondary antenna. Block diagram showing internal structure of antenna control circuit using conventional diversity function

Explanation of symbols

1, 21... Non-contact IC tag with secondary antenna 10, 30 ... Non-contact IC tag 2 ... Base film 3 ... IC chip 4 ... First loop antenna 5 ... ... second loop antenna 6 ......... first secondary antenna 7 ......... second secondary antenna 8 ......... object 9 ......... base material 14 ......... release paper 18 ......... adhesive layer 19 ……… Surface protection film 24 ……… Loop antenna 25 ……… Antenna 27 ……… Secondary antenna

Claims (17)

A first loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the first loop antenna, and a vertical connection to the first loop antenna connected to the IC chip An inlet formed with a second loop antenna;
A non-contact type IC tag comprising a first secondary antenna disposed on one surface of the base film base material at a position close to the first loop antenna,
A second secondary antenna that is a conductive pattern is superimposed and attached to the non-contact IC tag from the outside at a position close to the second loop antenna, and the first loop antenna and the first loop antenna according to reception strength. A contactless IC tag, wherein the second loop antenna is switched and selected. The impedance of the first secondary antenna / secondary secondary antenna adjacent to the selected first loop antenna / second loop antenna and the impedance of the IC chip 3 are matched with each other. The non-contact type IC tag according to 1. The second secondary antenna is formed on an object, and the non-contact type IC tag is mounted so that the second secondary antenna and the second loop antenna are arranged in parallel at close positions. The non-contact type IC tag according to claim 1 or 2, wherein The contactless IC tag according to claim 1, wherein the first secondary antenna and the second secondary antenna have a linear shape in a portion juxtaposed with the inlet. 2. The first secondary antenna is disposed on a surface on the first loop antenna side or on the opposite side of the first loop antenna in parallel with one side of the loop antenna. The non-contact type IC tag according to claim 4. A non-contact type formed by a loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the loop antenna, and an antenna connected to the IC chip and arranged vertically to the loop antenna An IC tag,
A secondary antenna, which is a conductive pattern, is superimposed and attached to the non-contact IC tag from the outside at a position close to the loop antenna, and the loop antenna and the antenna are switched and selected according to reception strength. A non-contact type IC tag characterized. 7. The contactless IC tag according to claim 6, wherein the impedance of the secondary antenna close to the selected loop antenna is matched with the impedance of the IC chip. The non-contact type IC tag is mounted so that the secondary antenna is formed on an object, and the secondary antenna and the loop antenna are arranged in parallel at close positions. Item 8. The non-contact type IC tag according to Item 7. 9. The non-contact type IC tag according to claim 6, wherein a portion of the secondary antenna juxtaposed with the loop antenna has a linear shape. A first loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the first loop antenna, and a vertical arrangement with respect to the first loop antenna connected to the IC chip A step (a) of forming an inlet with the second loop antenna
A step (b) of forming a non-contact type IC tag by disposing a first secondary antenna at a position close to the first loop antenna on one surface on the base film substrate;
A step (c) of superimposing and attaching a second secondary antenna to the non-contact type IC tag from the outside at a position close to the second loop antenna;
A method for producing a non-contact type IC tag, comprising: In the step (c), the second secondary antenna is formed on an object, and the second secondary antenna and the second loop antenna are arranged in parallel so as to be in close proximity to each other. A non-contact type IC tag manufacturing method according to claim 10, wherein a type IC tag is attached. A step (d) of providing a surface protective substrate around the step (b) and the step (c);
12. The method of manufacturing a non-contact type IC tag according to claim 10 or 11, wherein the non-contact type IC tag is provided. 13. The method of manufacturing a non-contact type IC tag according to claim 10, wherein the first secondary antenna and the second secondary antenna have a linear shape in a portion juxtaposed with the inlet. . A non-contact type IC tag includes a loop antenna disposed on a base film substrate, an IC chip having a diversity function connected to the loop antenna, and an antenna connected to the IC chip and arranged vertically to the loop antenna. Forming (a);
A step (b) of superimposing and attaching a secondary antenna to the non-contact IC tag from the outside at a position close to the loop antenna;
A method for producing a non-contact type IC tag, comprising: In the step (b), the non-contact type IC tag is mounted so that the secondary antenna is formed on an object, and the secondary antenna and the loop antenna are arranged in parallel at close positions. The method of manufacturing a non-contact type IC tag according to claim 14. A step (c) of providing a surface protective substrate around the step (a) and the step (b);
16. The method of manufacturing a non-contact type IC tag according to claim 14 or 15, wherein the method is provided. 17. The method of manufacturing a non-contact type IC tag according to claim 14, wherein a portion of the secondary antenna juxtaposed with the loop antenna has a linear shape.

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