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JP2009114039A - Method for producing honeycomb segment joined body - Google Patents

Method for producing honeycomb segment joined body Download PDF

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JP2009114039A
JP2009114039A JP2007291057A JP2007291057A JP2009114039A JP 2009114039 A JP2009114039 A JP 2009114039A JP 2007291057 A JP2007291057 A JP 2007291057A JP 2007291057 A JP2007291057 A JP 2007291057A JP 2009114039 A JP2009114039 A JP 2009114039A
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honeycomb segment
honeycomb
bonding material
segments
segment
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Nobuyuki Kashiwagi
伸之 柏木
Hirotake Yamada
裕丈 山田
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NGK Insulators Ltd
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NGK Insulators Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a honeycomb segment joined body which prevents the phenomenon that variation is caused in the structure of each joining material layer between a plurality of honeycomb segments integrally joined, so as to deteriorate strength properties. <P>SOLUTION: Honeycomb segments 10 formed by a conductive ceramic, each having a plurality of cells partitioned by bulkheads and passing through to an axial direction are laminated via joining materials, and a higher voltage is applied to the honeycomb segment 10 located at the inside of the honeycomb segment 10 than those located at the outermost circumference of the honeycomb segment 10 among the plurality of laminated honeycomb segments 10. By flowing electric current from either edge face in the axial direction of each honeycomb segment 10 to the other edge face, the honeycomb segments 10 generate heat, thus the joining materials are dried, so as to adhesively fix and join the honeycomb segments 10 to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ハニカムセグメントの複数が接合材層によって一体的に接合されたハニカムセグメント接合体の製造方法に関する。   The present invention relates to a method for manufacturing a joined honeycomb segment in which a plurality of honeycomb segments are integrally joined by a joining material layer.

環境改善、公害防止等のため、排ガス用の捕集フィルタとしてハニカム構造体が多用されている。現在、例えば、SiC製DPF(ディーゼルパティキュレートフィルタ)は、熱衝撃による割れを防止するために分割した基材(ハニカムセグメント)を、例えば、熱風乾燥、マイクロ波乾燥、自然乾燥等により接合材(セラミックスセメント)を乾燥して一体化して作製している(例えば特許文献1参照)が、接合箇所により乾燥後の接合材層組織に違いが生じ、その特性にもばらつきが生じるため耐熱試験時に特性の低い箇所に割れが生じる問題があった。   In order to improve the environment and prevent pollution, honeycomb structures are frequently used as collection filters for exhaust gas. At present, for example, SiC DPF (Diesel Particulate Filter) is used to bond a base material (honeycomb segment) divided to prevent cracking due to thermal shock by, for example, hot air drying, microwave drying, natural drying, etc. (Ceramic cement) is dried and integrated (see, for example, Patent Document 1), but the bonding material layer structure after drying varies depending on the bonding location, and the characteristics also vary. There was a problem that cracks occurred at low locations.

特開2000−7455号公報JP 2000-7455 A

一般に接合体においては接合材の乾燥が各接合箇所において同様におこることが理想的であるが、複数の基材(ハニカムセグメント)を接合材で接合する場合、外側の接合材が先に乾燥して固化し、その後内部の接合材が固化するため、接合体の外側の接合材と内部の接合材では乾燥の仕方が異なり、それに伴う接合材の乾燥収縮及び硬化の挙動が外側と内部とで異なることとなる。先に乾燥して固化する外側の接合材は、接合材の乾燥収縮及び硬化に伴い基材が比較的均質に移動しながら固化するため接合材層の組織のばらつきが小さく、その特性もばらつきが小さい。それに対して内部の接合材においては、接合材の乾燥収縮および硬化に伴うハニカムセグメントの動きが均質でないため、接合材層の形成の仕方にばらつきが生じ、その特性にもばらつきが生じる。   In general, in a bonded body, it is ideal that the bonding material is dried in the same manner at each bonding point. However, when bonding a plurality of base materials (honeycomb segments) with a bonding material, the outer bonding material is dried first. Then, the bonding material inside solidifies, and the drying method differs between the bonding material outside the bonded body and the bonding material inside, and the drying shrinkage and hardening behavior of the bonding material is different between the outside and the inside. It will be different. The outer bonding material that dries and solidifies first is solidified while the base material moves relatively homogeneously as the bonding material shrinks and cures, so there is little variation in the structure of the bonding material layer, and its characteristics also vary. small. On the other hand, in the internal bonding material, the movement of the honeycomb segments accompanying the drying shrinkage and curing of the bonding material is not uniform, so that the method of forming the bonding material layer varies and the characteristics also vary.

例えば、ある箇所では接合材の収縮に伴いハニカムセグメントの接合間隔が小さくなる方向の動きをしながら硬化し、他の箇所ではハニカムセグメントの片側が既に硬化した状態にあるため接合材の収縮に見合う程の動きができずに硬化したり、あるいは反対に接合間隔が開く方向に動いたりして接合材層の組織にばらつきが生じ、その特性にもばらつきが生じる。   For example, it hardens while moving in such a direction that the bonding interval of the honeycomb segments becomes smaller as the bonding material shrinks in some places, and one side of the honeycomb segment is already hardened in the other places, which is commensurate with the shrinkage of the bonding material. The structure of the bonding material layer varies due to curing without being able to move as much as possible, or on the contrary, the bonding interval moves, and the characteristics of the bonding material also vary.

本発明の課題は、一体的に接合された複数のハニカムセグメント間の接合材層の組織にばらつきが生じて強度特性が低下することを防止するハニカムセグメント接合体の製造方法を提供することにある。   It is an object of the present invention to provide a method for manufacturing a joined honeycomb segment that prevents the structure of a bonding material layer between a plurality of integrally joined honeycomb segments from being varied to reduce strength characteristics. .

上記課題を解決するために、ハニカムセグメントに通電し、これにより接合材を乾燥させることにより、接合材を均一に乾燥させて、強度特性が低下することを防止しうることを見出した。すなわち、本発明によれば、以下のハニカムセグメント接合体の製造方法が提供される。   In order to solve the above-mentioned problems, it has been found that, by energizing the honeycomb segments and thereby drying the bonding material, the bonding material can be dried uniformly and the strength characteristics can be prevented from being lowered. That is, according to the present invention, the following method for manufacturing a joined honeycomb segment is provided.

[1] 隔壁により仕切られ軸方向に貫通する複数のセルを有する導電性セラミックスにより形成されたハニカムセグメントを接合材を介して積層し、前記ハニカムセグメントに通電することにより、前記接合材を乾燥させて前記ハニカムセグメントどうしを密着固定して接合するハニカムセグメント接合体の製造方法。 [1] A honeycomb segment formed of conductive ceramics having a plurality of cells partitioned by partition walls and penetrating in the axial direction is laminated through a bonding material, and the bonding material is dried by energizing the honeycomb segment. A method for manufacturing a joined honeycomb segment, in which the honeycomb segments are firmly fixed and joined together.

[2] 複数積層された前記ハニカムセグメントの最外周に位置する前記ハニカムセグメントよりも、内側に位置する前記ハニカムセグメントに高電圧を印加する前記[1]に記載のハニカムセグメント接合体の製造方法。 [2] The method for manufacturing a joined honeycomb segment according to [1], wherein a higher voltage is applied to the honeycomb segment positioned on the inner side than the honeycomb segment positioned on the outermost periphery of the plurality of stacked honeycomb segments.

[3] 個々の前記ハニカムセグメントの前記軸方向の一方の端面から他方の端面に電流を流すことにより、前記ハニカムセグメントを発熱させ、これにより前記接合材を乾燥させる前記[1]または[2]に記載のハニカムセグメント接合体の製造方法。 [3] The above [1] or [2], in which an electric current is passed from one end face in the axial direction of each honeycomb segment to the other end face to generate heat in the honeycomb segment, thereby drying the bonding material. A method for producing a bonded honeycomb segment assembly according to claim 1.

[4] 前記導電性セラミックスは、SiCを含んだ前記[1]〜[3]のいずれかに記載のハニカムセグメント接合体の製造方法。 [4] The method for manufacturing a joined honeycomb segment according to any one of [1] to [3], wherein the conductive ceramic includes SiC.

ハニカムセグメントに通電することにより発生する熱によって、接合材を乾燥させることができる。内側の接合材もハニカムセグメントによって外側の接合材と同様に乾燥させることができるため、接合材を均一に乾燥させることができ、収縮歪、クラック、はがれ、ボイド等の発生を防止し、接合強度の低下を防止することができる。また、ハニカムセグメントに通電することにより接合材を乾燥させるため、局所的な乾燥が可能であり、乾燥速度の制御も容易に行うことができる。   The bonding material can be dried by heat generated by energizing the honeycomb segments. The inner bonding material can also be dried by the honeycomb segment in the same manner as the outer bonding material, so that the bonding material can be dried uniformly, preventing the occurrence of shrinkage strain, cracks, peeling, voids, etc., and bonding strength Can be prevented. Further, since the bonding material is dried by energizing the honeycomb segments, local drying is possible, and the drying speed can be easily controlled.

以下、図面を参照しつつ本発明の実施の形態について説明する。本発明は、以下の実施形態に限定されるものではなく、発明の範囲を逸脱しない限りにおいて、変更、修正、改良を加え得るものである。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiments, and changes, modifications, and improvements can be added without departing from the scope of the invention.

図1に、本発明のハニカムセグメント接合体1の製造方法が適用されるハニカムセグメント10を示す。ハニカムセグメント10は、セラミックによって形成され、外周壁7と、外周壁7の内側に配置された隔壁2と、隔壁2により仕切られた複数のセル3とを有する。   FIG. 1 shows a honeycomb segment 10 to which the method for manufacturing a joined honeycomb segment assembly 1 of the present invention is applied. The honeycomb segment 10 is made of ceramic and includes an outer peripheral wall 7, partition walls 2 disposed inside the outer peripheral wall 7, and a plurality of cells 3 partitioned by the partition walls 2.

更に、本発明のハニカムセグメント接合体1をフィルタとして用いる場合には、図1に示すように、一部のセル3がハニカムセグメント10の端面8において目封じされていることが好ましい。特に、隣接するセル3が互いに反対側となる端面8において交互に目封じされており、端面8が市松模様状に目封じされていることが好ましい。この様に目封じすることにより、例えば一の端面8から流入した被処理流体は隔壁2を通って、他の端面8から流出し、被処理流体が隔壁2を通る際に多孔質の隔壁2がフィルタの役目をはたし、目的物を除去することができる。   Furthermore, when the joined honeycomb segment assembly 1 of the present invention is used as a filter, it is preferable that some cells 3 are plugged on the end face 8 of the honeycomb segment 10 as shown in FIG. In particular, it is preferable that the adjacent cells 3 are alternately sealed at the end faces 8 on the opposite sides, and the end faces 8 are sealed in a checkered pattern. By sealing in this manner, for example, the fluid to be treated which flows from one end face 8 passes through the partition wall 2 and flows out from the other end face 8, and when the fluid to be treated passes through the partition wall 2, the porous partition wall 2. Can act as a filter and remove the object.

本発明において、ハニカムセグメント10は、DPFに用いる場合には、強度、耐熱性等の観点から、炭化珪素又は珪素−炭化珪素系複合相を用いることが好ましい。また、本発明において、ハニカムセグメント接合体1が金属珪素(Si)と炭化珪素(SiC)とからなる場合、ハニカムセグメント接合体1のSi/(Si+SiC)で規定されるSi含有量が少なすぎるとSi添加の効果が得られないため強度が弱く、50質量%を超えるとSiCの特徴である耐熱性、高熱伝導性の効果が得られない。Si含有量は、5〜50質量%であることが好ましく、10〜40質量%であることが更に好ましい。ハニカムセグメント10は、SiC以外であっても導電性セラミックスであればよい。   In the present invention, when the honeycomb segment 10 is used for a DPF, it is preferable to use silicon carbide or a silicon-silicon carbide based composite phase from the viewpoint of strength, heat resistance, and the like. In the present invention, when the honeycomb segment bonded body 1 is made of metal silicon (Si) and silicon carbide (SiC), the Si content defined by Si / (Si + SiC) of the honeycomb segment bonded body 1 is too small. Since the effect of addition of Si cannot be obtained, the strength is weak, and when it exceeds 50% by mass, the effects of heat resistance and high thermal conductivity, which are the characteristics of SiC, cannot be obtained. The Si content is preferably 5 to 50% by mass, and more preferably 10 to 40% by mass. The honeycomb segment 10 may be made of conductive ceramics other than SiC.

上記原料にメチルセルロース及びヒドロキシプロポキシルメチルセルロース等のバインダー、有機造孔材、界面活性剤及び水等を添加して、可塑性の坏土を作製し、坏土を、例えば押出成形し、隔壁2により仕切られた軸方向に貫通する多数のセル3を有する四角柱形状のハニカム成形体を成形する。これを、例えばマイクロ波及び熱風などで乾燥した後、仮焼してバインダーや有機造孔材を除去し、その後焼成することにより、ハニカムセグメント10を製造することができる。   A binder such as methylcellulose and hydroxypropoxylmethylcellulose, an organic pore former, a surfactant and water are added to the above raw materials to produce a plastic clay, and the clay is extruded, for example, and partitioned by partition walls 2. A rectangular pillar-shaped honeycomb formed body having a large number of cells 3 penetrating in the axial direction is formed. The honeycomb segment 10 can be manufactured by drying this with, for example, microwaves and hot air, and then calcining to remove the binder and the organic pore former, followed by firing.

また、セル3が端面8において目封じされている場合の目封じ部は、ハニカムセグメント接合体1の主結晶相と同様の種類の結晶相を主結晶相として含むことが好ましい。   Moreover, it is preferable that the plugged portion in the case where the cell 3 is plugged at the end face 8 includes a crystal phase of the same type as the main crystal phase of the joined honeycomb segment assembly 1 as the main crystal phase.

図2は、ハニカムセグメント接合体1の接合方法を示す。まず、隔壁2により仕切られ軸方向に貫通する多数のセル3を有するセラミック多孔質体のハニカムセグメント10が、接合材による接合材層5を介して複数個結束される。   FIG. 2 shows a method for joining the joined honeycomb segment assembly 1. First, a plurality of honeycomb segments 10 of a porous ceramic body having a large number of cells 3 that are partitioned by partition walls 2 and penetrate in the axial direction are bundled through a bonding material layer 5 made of a bonding material.

具体的には、図2に示すように、縦受板20と横受板21とにより、L字状断面に形成された収容エリアA内にハニカムセグメント10の各々が、各々の外周壁7を接合面として、その接合面間に接合材層5を介在させて積層される。この積層は、2面を縦受板20および横受板21に沿わせて行われる。   Specifically, as shown in FIG. 2, each of the honeycomb segments 10 in the housing area A formed in an L-shaped cross section by the vertical receiving plate 20 and the horizontal receiving plate 21, and the outer peripheral wall 7. The bonding surfaces are laminated with a bonding material layer 5 interposed between the bonding surfaces. This lamination is performed with the two surfaces along the vertical receiving plate 20 and the horizontal receiving plate 21.

接合材層5を形成する接合材は、無機粒子、無機接着剤を主成分とし、副成分として、有機バインダー、界面活性剤、発泡樹脂、水等を含んで構成される。無機粒子としては、板状粒子、球状粒子、塊状粒子、繊維状粒子、針状粒子等を利用でき、無機接着剤としては、コロイダルシリカ(SiOゾル)、コロイダルアルミナ(アルミナゾル)、各種酸化物ゾル、エチルシリケート、水ガラス、シリカポリマー、りん酸アルミニウム等を利用できる。主成分としては導電性を生じる程度でなければ(接合材導電率は、セグメント導電率の1/50〜1/200程度であることが好ましい)、ハニカムセグメント10の構成成分と共通のセラミックス粉を含むものが好ましく、また健康問題等からは、セラミックスファイバー等の繊維状粒子を含まないものが好ましく、板状粒子を含有する方が好ましい。板状粒子としては、例えば、マイカ、タルク、窒化ホウ素及びガラスフレーク等を利用することができる。この接合材をハニカムセグメント10の接合面に付着させることにより接合材層5を形成することができる。この接合材層5の形成は、積層前のハニカムセグメント10に対して行ってもよく、あるいは既に積層されているハニカムセグメント10の露出している接合面に対して行ってもよい。また積層は、ハニカムセグメント10を1個ずつ積み重ねることにより行われる。 The bonding material forming the bonding material layer 5 includes inorganic particles and an inorganic adhesive as main components, and includes an organic binder, a surfactant, a foamed resin, water, and the like as subcomponents. As the inorganic particles, plate-like particles, spherical particles, massive particles, fibrous particles, needle-like particles, etc. can be used, and as the inorganic adhesive, colloidal silica (SiO 2 sol), colloidal alumina (alumina sol), various oxides Sol, ethyl silicate, water glass, silica polymer, aluminum phosphate and the like can be used. As long as the main component does not generate conductivity (the bonding material conductivity is preferably about 1/50 to 1/200 of the segment conductivity), the ceramic powder common to the constituent components of the honeycomb segment 10 is used. From the viewpoint of health problems, those containing no fibrous particles such as ceramic fibers are preferred, and those containing plate-like particles are preferred. As the plate-like particles, for example, mica, talc, boron nitride, glass flakes and the like can be used. The bonding material layer 5 can be formed by attaching the bonding material to the bonding surface of the honeycomb segment 10. The bonding material layer 5 may be formed on the honeycomb segment 10 before lamination or on the exposed bonding surface of the honeycomb segment 10 that has already been laminated. Lamination is performed by stacking the honeycomb segments 10 one by one.

次に、図3に示すように、ハニカムセグメント10を所定の個数(本実施形態では、6列×6列の36個)積層後、最外層に位置するハニカムセグメント10を介して全体を同時に矢印F1およびF2方向に本加圧する(図2参照)。このときの本加圧は、積層体の2面が縦受板20および横受板21で覆われているので、他の2面の全体を同時に矢印F1およびF2方向に本加圧する。このときの加圧動力は、エアシリンダ、あるいは油圧シリンダ等が用いられる。   Next, as shown in FIG. 3, after stacking a predetermined number of honeycomb segments 10 (in this embodiment, 36 in 6 rows × 6 rows), the whole is simultaneously arrowed through the honeycomb segments 10 located in the outermost layer. The main pressure is applied in the directions F1 and F2 (see FIG. 2). Since the two surfaces of the laminated body are covered with the vertical receiving plate 20 and the horizontal receiving plate 21 at this time, the entire other two surfaces are simultaneously simultaneously pressed in the directions of arrows F1 and F2. For the pressurizing power at this time, an air cylinder or a hydraulic cylinder is used.

上記のように、ハニカムセグメント10を接合材を介して積層した後、ハニカムセグメント10に通電して接合材を乾燥することにより、ハニカムセグメント10どうしを密着固定して接合する。図4及び図5に本発明のハニカムセグメント接合体の製造方法における通電乾燥の一実施形態を示す。図4は、軸方向の断面図、図5は、一方の端面8側から見た平面図である。図4に示すように、ハニカムセグメント10の軸方向の両端面8に、電極25a、25bが取り付けられている。電極25aは、端面8の外側の領域、電極25bは、端面8の内側の領域に配置されている。電極材質としては、例えば、金属フェルト、カーボンフェルトなどの導電性フェルトや、導電性の板等を利用できる。また、導電性物質のセグメント表面への塗布などを行ってもよい。このような電極を取り付けることにより、ハニカムセグメント10は、導電性セラミックスにより形成されており、接合材は、絶縁性材料であるため、ハニカムセグメント10の一方の端面8から他方の端面8に通電することができる。すなわち、各々のハニカムセグメント10にのみ通電し、接合材層5には、通電させないことになる。   As described above, after the honeycomb segments 10 are stacked via the bonding material, the honeycomb segments 10 are energized to dry the bonding material, whereby the honeycomb segments 10 are firmly fixed and bonded. FIG. 4 and FIG. 5 show an embodiment of current drying in the method for manufacturing a joined honeycomb segment assembly of the present invention. 4 is a sectional view in the axial direction, and FIG. 5 is a plan view seen from one end face 8 side. As shown in FIG. 4, electrodes 25 a and 25 b are attached to both end surfaces 8 of the honeycomb segment 10 in the axial direction. The electrode 25 a is disposed in a region outside the end surface 8, and the electrode 25 b is disposed in a region inside the end surface 8. As the electrode material, for example, conductive felt such as metal felt or carbon felt, a conductive plate, or the like can be used. Moreover, you may perform application | coating to the segment surface of an electroconductive substance. By attaching such an electrode, the honeycomb segment 10 is formed of conductive ceramics, and the bonding material is an insulating material. Therefore, current is passed from one end face 8 of the honeycomb segment 10 to the other end face 8. be able to. That is, only the honeycomb segments 10 are energized, and the bonding material layer 5 is not energized.

そして、上記のように、外側に位置するハニカムセグメント10に通電するための電極25aと、内側に位置するハニカムセグメント10に通電するための電極25bとによって、複数積層されたハニカムセグメント10の最外周に位置するハニカムセグメント10よりも、内側に位置するハニカムセグメント10に高電圧を印加する。個々のハニカムセグメント10の軸方向の一方の端面8から他方の端面8に電流を流すことにより、ハニカムセグメント10を発熱させ、これにより接合材を乾燥させることができる。このように、内側のハニカムセグメント10に高電圧を印加することにより、乾燥しにくい内側の接合材を外側の接合材と同程度に乾燥させることができる。このようにすることにより、内側の接合材と外側の接合材との乾燥差による収縮歪、クラック、はがれ、ボイド等の発生を防止し、接合強度の低下を防止することができる。   Then, as described above, the outermost periphery of the plurality of honeycomb segments 10 stacked by the electrode 25a for energizing the honeycomb segment 10 located on the outer side and the electrode 25b for energizing the honeycomb segment 10 located on the inner side. A higher voltage is applied to the honeycomb segment 10 located on the inner side than the honeycomb segment 10 located on the inner side. By flowing an electric current from one end face 8 in the axial direction of each honeycomb segment 10 to the other end face 8, the honeycomb segment 10 can generate heat, thereby drying the bonding material. Thus, by applying a high voltage to the inner honeycomb segment 10, the inner bonding material that is difficult to dry can be dried to the same extent as the outer bonding material. By doing in this way, generation | occurrence | production of the shrinkage | contraction distortion by the drying difference of an inner side joining material and an outer side joining material, a crack, peeling, a void, etc. can be prevented, and the fall of joining strength can be prevented.

なお、電極形状は、図4及び図5に記載の実施形態に限定されず、個々のハニカムセグメント10に電極を取り付けてもよいし、所定の領域ごとに電極を取り付けてもよい。また、本発明の通電乾燥方法は、他の乾燥方法と併用も可能である。   The electrode shape is not limited to the embodiment described in FIGS. 4 and 5, and an electrode may be attached to each honeycomb segment 10 or an electrode may be attached to each predetermined region. In addition, the current drying method of the present invention can be used in combination with other drying methods.

そして、接合材の乾燥後、仮焼する。つまり、通電乾燥して、接合材の乾燥収縮および硬化に伴う、ハニカムセグメント10の動き方を均質にすることにより、接合材層5の形成の仕方のばらつきを低減し、各ハニカムセグメント接合体1間の接合材層5の特性のばらつきを低減することができる。つまり、通電乾燥により、内側と外側の接合材の局所的な乾燥速度を制御することができ、均一な乾燥を行うことにより、ハニカムセグメント接合体の耐熱衝撃性を向上させることができる。そして、さらに外周を円筒状に研削し、その外周面をコーティング材で塗布し、その後700℃程度で、2時間程度熱処理して、図6に示すようなハニカム構造体1を得ることができる。   Then, after the bonding material is dried, it is calcined. That is, by conducting current drying and making the movement of the honeycomb segment 10 uniform due to drying shrinkage and curing of the bonding material, variation in the method of forming the bonding material layer 5 is reduced, and each bonded honeycomb segment assembly 1 Variations in the characteristics of the bonding material layer 5 can be reduced. In other words, the local drying rate of the inner and outer bonding materials can be controlled by current drying, and the thermal shock resistance of the joined honeycomb segment can be improved by performing uniform drying. Then, the outer periphery is further ground into a cylindrical shape, and the outer peripheral surface is coated with a coating material, and then heat-treated at about 700 ° C. for about 2 hours, whereby a honeycomb structure 1 as shown in FIG. 6 can be obtained.

以下、本発明を実施例に基づいてさらに詳細に説明するが、本発明はこれらの実施例に限定されるものではない。   EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these Examples.

(ハニカムセグメントの作製)
ハニカムセグメントの原料として、SiC粉末及び金属Si粉末を80:20の質量割合で混合し、これに造孔材、有機バインダー、界面活性剤及び水を添加して、可塑性の坏土を作製した。この坏土を押出成形し、乾燥して隔壁の厚さが310μm、セル密度が約46.5セル/cm(300セル/平方インチ)、断面が一辺35mmの正四角形、長さが178mmのセラミックス成形体を得た。このセラミックス成形体を、端面が市松模様状を呈するように、セルの両端面を目封じした。すなわち、隣接するセルが、互いに反対側の端部で封じられるように目封じを行った。目封じ材としては、ハニカムセグメント原料と同様な材料を用いた。セルの両端面を目封じし、乾燥させた後、大気雰囲気中約400℃で脱脂し、その後、Ar不活性雰囲気にて約1450℃で焼成して、SiC結晶粒子をSiで結合させた、多孔質構造を有するハニカムセグメントを得た。
(Manufacture of honeycomb segments)
As a raw material for the honeycomb segment, SiC powder and metal Si powder were mixed at a mass ratio of 80:20, and a pore former, an organic binder, a surfactant and water were added thereto to produce a plastic clay. This kneaded clay is extruded and dried, and the partition wall thickness is 310 μm, the cell density is about 46.5 cells / cm 2 (300 cells / in 2 ), the cross section is a regular square with a side of 35 mm, and the length is 178 mm. A ceramic molded body was obtained. The ceramic molded body was plugged at both end faces of the cell so that the end faces had a checkered pattern. That is, the sealing was performed so that adjacent cells were sealed at opposite ends. As the plugging material, the same material as the honeycomb segment material was used. After sealing and drying both end faces of the cell, degreasing at about 400 ° C. in an air atmosphere, followed by firing at about 1450 ° C. in an Ar inert atmosphere to bond SiC crystal particles with Si. A honeycomb segment having a porous structure was obtained.

(接合材の調製)
接合材としてSiC微粒41質量%、SiC粗粒16.5質量%、マイカ22質量%、コロイダルシリカ20質量%、ベントナイト0.5質量%、有機造孔材1.5質量%(外配)、有機バインダー0.4質量%(外配)、分散剤0.04質量%(外配)を混合したものに水をさらに混合し、ミキサーにて30分間混練を行いペースト状の接合材を得た。このとき、ペースト粘度が20〜60Pa・sとなるように水の添加量を調整した。
(Preparation of bonding material)
As a bonding material, SiC fine particles 41% by mass, SiC coarse particles 16.5% by mass, mica 22% by mass, colloidal silica 20% by mass, bentonite 0.5% by mass, organic pore former 1.5% by mass (external), Water was further mixed with a mixture of organic binder 0.4% by mass (external) and dispersant 0.04% by mass (external), and kneaded for 30 minutes with a mixer to obtain a paste-like bonding material. . At this time, the amount of water added was adjusted so that the paste viscosity was 20 to 60 Pa · s.

(接合)
ハニカムセグメント接合面に接合材を塗布し、順次1個ずつ加圧しながら接合する工程を繰り返し、縦6列横6列に組み合わせた36個のハニカムセグメントからなる接合体を作製した。その後、両端面に電極を取り付けて、通電乾燥を行った。通電乾燥の条件は、最外周の一列のハニカムセグメントに20V、内側のハニカムセグメントに30Vの電圧を印加した(実施例1)。
(Joining)
A bonding material was applied to the bonded surfaces of the honeycomb segments, and the process of bonding while pressing one by one in order was repeated to produce a bonded body composed of 36 honeycomb segments combined in six rows and six rows. Thereafter, electrodes were attached to both end faces, and current drying was performed. As for the conditions for the electric drying, a voltage of 20 V was applied to the honeycomb segment in the outermost row and 30 V was applied to the inner honeycomb segment (Example 1).

また、同様にハニカムセグメントを作製し、熱風乾燥(比較例1)、マイクロ波乾燥(比較例2)、自然乾燥(比較例3)によって接合材を乾燥させた。乾燥条件は、表1に示す。   Similarly, honeycomb segments were prepared, and the bonding material was dried by hot air drying (Comparative Example 1), microwave drying (Comparative Example 2), and natural drying (Comparative Example 3). The drying conditions are shown in Table 1.

その後、電気炉にて700℃、2時間熱処理して接合体(実施例1、比較例1〜3)を得た。   Then, it heat-processed for 2 hours at 700 degreeC with the electric furnace, and obtained the joined body (Example 1, Comparative Examples 1-3).

(接合強度)
図7に示すように、一部のハニカムセグメントの両端面を固定し、残余のハニカムセグメントに荷重をかけて接合材層による接合強度を調べた。接合強度の測定に関しては、最外周ハニカムセグメントと最外周から2つめのハニカムセグメントとの接合部位で測定を実施した。結果を表1に示す。なお、表1の隙間比は、ハニカムセグメント一辺に接する接合材層の長さLに対する、接合材層内の隙間(デラミネーション)の長さlの比l/L×100(%)であり、図8に示すように、ハニカムセグメント10間の接合材層5内に発生したデラミネーション5dの割合を示している。
(Joint strength)
As shown in FIG. 7, both end faces of some of the honeycomb segments were fixed, and the remaining honeycomb segments were loaded to examine the bonding strength of the bonding material layer. Regarding the measurement of the bonding strength, the measurement was carried out at the bonding site between the outermost honeycomb segment and the second honeycomb segment from the outermost periphery. The results are shown in Table 1. The gap ratio in Table 1 is the ratio 1 / L × 100 (%) of the length l of the gap (delamination) in the bonding material layer to the length L of the bonding material layer in contact with one side of the honeycomb segment. As shown in FIG. 8, the ratio of delamination 5d generated in the bonding material layer 5 between the honeycomb segments 10 is shown.

Figure 2009114039
Figure 2009114039

表1に示すように、通電乾燥による実施例1は、比較例1〜3に比べ、接合強度が向上した。また、実施例1は、比較例1〜3に比べ、隙間比が小さく、デラミネーションが発生しにくかった。これは、従来の方法(比較例1〜3)では、内側の接合材と外側の接合材との間に乾燥速度の差が生じ、これにより接合強度が低下していたが、通電乾燥(実施例1)により、内側の接合材の乾燥と、外側の接合材の乾燥との差を少なくしたことにより、接合強度が向上したと考えられる。   As shown in Table 1, the bonding strength was improved in Example 1 by electrodrying compared to Comparative Examples 1 to 3. Further, in Example 1, the gap ratio was small compared to Comparative Examples 1 to 3, and delamination was difficult to occur. This is because, in the conventional method (Comparative Examples 1 to 3), there is a difference in drying speed between the inner bonding material and the outer bonding material, which decreases the bonding strength. In Example 1), it is considered that the bonding strength was improved by reducing the difference between the drying of the inner bonding material and the drying of the outer bonding material.

本発明のハニカムセグメント接合体の製造方法は、排ガス用の捕集フィルタとして、例えば、ディーゼルエンジン等からの排ガスに含まれている粒子状物質(パティキュレート)を捕捉して除去するためのディーゼルパティキュレートフィルタ(DPF)の製造方法として有用である。   The method for manufacturing a joined honeycomb segment according to the present invention is a diesel particulate for capturing and removing particulate matter (particulates) contained in exhaust gas from, for example, a diesel engine as a collection filter for exhaust gas. This is useful as a method for producing a curated filter (DPF).

ハニカムセグメントを示す斜視図である。It is a perspective view which shows a honeycomb segment. ハニカムセグメントの接合方法を示す説明図である。It is explanatory drawing which shows the joining method of a honeycomb segment. 積層されたハニカムセグメントの端面を示す模式図である。It is a schematic diagram which shows the end surface of the laminated | stacked honeycomb segment. 通電乾燥を説明するための断面模式図である。It is a cross-sectional schematic diagram for demonstrating electroconductive drying. 通電乾燥を説明するための平面図である。It is a top view for demonstrating energization drying. ハニカム構造体の斜視図である。It is a perspective view of a honeycomb structure. 接合強度測定法を説明するための説明図である。It is explanatory drawing for demonstrating the joining strength measuring method. 隙間比を説明するための説明図である。It is explanatory drawing for demonstrating gap ratio.

符号の説明Explanation of symbols

1:ハニカムセグメント接合体(ハニカム構造体)、2:隔壁、3:セル、5:接合材層、5d:デラミネーション、7:外周壁、8:端面、10:ハニカムセグメント、20:縦受板、21:横受板、25a,25b:電極。 1: Honeycomb segment bonded body (honeycomb structure), 2: partition, 3: cell, 5: bonding material layer, 5d: delamination, 7: outer peripheral wall, 8: end face, 10: honeycomb segment, 20: vertical receiving plate , 21: horizontal receiving plate, 25a, 25b: electrodes.

Claims (4)

隔壁により仕切られ軸方向に貫通する複数のセルを有する導電性セラミックスにより形成されたハニカムセグメントを接合材を介して積層し、前記ハニカムセグメントに通電することにより、前記接合材を乾燥させて前記ハニカムセグメントどうしを密着固定して接合するハニカムセグメント接合体の製造方法。   A honeycomb segment formed of conductive ceramics having a plurality of cells that are partitioned by partition walls and penetrates in the axial direction is stacked via a bonding material, and the bonding material is dried by energizing the honeycomb segment, whereby the honeycomb A method for manufacturing a joined honeycomb segment, in which the segments are firmly fixed and joined together. 複数積層された前記ハニカムセグメントの最外周に位置する前記ハニカムセグメントよりも、内側に位置する前記ハニカムセグメントに高電圧を印加する請求項1に記載のハニカムセグメント接合体の製造方法。   The method for manufacturing a joined honeycomb segment according to claim 1, wherein a high voltage is applied to the honeycomb segment positioned on the inner side of the honeycomb segment positioned on the outermost periphery of the plurality of stacked honeycomb segments. 個々の前記ハニカムセグメントの前記軸方向の一方の端面から他方の端面に電流を流すことにより、前記ハニカムセグメントを発熱させ、これにより前記接合材を乾燥させる請求項1または2に記載のハニカムセグメント接合体の製造方法。   The honeycomb segment bonding according to claim 1 or 2, wherein an electric current is passed from one end surface in the axial direction of each of the honeycomb segments to the other end surface to generate heat in the honeycomb segment, thereby drying the bonding material. Body manufacturing method. 前記導電性セラミックスは、SiCを含んだ請求項1〜3のいずれか1項に記載のハニカムセグメント接合体の製造方法。   The method for manufacturing a bonded honeycomb segment assembly according to any one of claims 1 to 3, wherein the conductive ceramic contains SiC.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10596721B2 (en) 2014-11-25 2020-03-24 Corning Incorporated Apparatus and method of manufacturing ceramic honeycomb body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10596721B2 (en) 2014-11-25 2020-03-24 Corning Incorporated Apparatus and method of manufacturing ceramic honeycomb body

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