JP2009071214A - Device for treating substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for treating substrates, with which the device can be small sized and suppress throughput even when untreated substrate needs to be moved back and forth between two chambers. <P>SOLUTION: The device 11 for treating substrates includes the first chamber 15 with vacuum atmosphere and the second chamber 16 with nitrogen atmosphere. Since the first chamber 15 and the second chamber 16 have planar regular octagon shapes, when one side of each, 15a and 16a are arranged to be facing to each other, two areas A and B opening at 90° exist between the first chamber 15 and the second chamber 16. Further, in these areas A and B, the first connection room 41 and the second connection room 42, which can be communicated to the first chamber 15 and the second chamber 16 and store a multiple number of untreated substrates 12, are arranged. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus that processes a substrate to be processed in a plurality of atmospheres different from the atmosphere.

  The above-described substrate processing apparatus is used, for example, when manufacturing an organic EL (Electro Luminescence) device, a liquid crystal device, and a semiconductor device. For example, as described in Patent Document 1, the substrate processing apparatus performs processing on a substrate to be processed in a chamber having an atmosphere different from the atmosphere, and conveys the substrate to be processed between the atmosphere and the chamber. More specifically, the substrate processing apparatus, for example, connects a load lock chamber to a chamber in a reduced pressure helium atmosphere, and the substrate to be processed is connected between the chamber in the reduced pressure helium atmosphere and the atmospheric atmosphere via the load lock chamber. Are carried in and out.

JP 2001-118904 A

  However, the above-described substrate processing apparatus is an apparatus that carries in and out a substrate to be processed between a chamber in a reduced-pressure helium atmosphere and an atmospheric atmosphere, and as it is, for example, a process in a vacuum atmosphere, under a nitrogen atmosphere In the case of continuously performing the process in step 1 and in the vacuum atmosphere, or after carrying the substrate from the first chamber in the vacuum atmosphere to the second chamber in the nitrogen atmosphere, the substrate is returned from the second chamber to the first chamber, Thereafter, when the substrate is discharged from the first chamber, there is a problem that the throughput is lowered or the substrate processing apparatus is enlarged. More specifically, it is necessary to provide a communication chamber between the first chamber and the second chamber, and the substrate to be processed is transferred from the first chamber to the second chamber via this one communication chamber. Since the substrate to be processed is carried out from the second chamber to the first chamber, the throughput is lowered.

  Further, in addition to the first chamber and the second chamber, it is necessary to provide a communication chamber so as to protrude greatly on both sides from a region where these chambers are arranged, so that the substrate processing apparatus is increased in size. Furthermore, in order to transfer the substrate between the communication chamber provided so as to protrude greatly on both sides from the area where the chamber is disposed and the chamber, it is necessary to provide a large substrate transfer robot in the chamber. As a result, the chamber becomes larger, and as a result, the substrate processing apparatus becomes larger.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A substrate processing apparatus according to this application example includes a first chamber having a first atmosphere different from the atmosphere, and a second chamber having a second atmosphere different from the atmosphere and the first atmosphere. The first chamber and the second chamber have side portions that are continuous with an inner angle, and are disposed so that one side portion of the first chamber and the second chamber are opposed to each other, and between the first chamber and the second chamber. A connecting chamber for storing a plurality of substrates to be processed adjacent to the side portions of the first chamber and the second chamber and capable of communicating with the first chamber and the second chamber is disposed in the concave gap generated in It is characterized by being.

  According to this configuration, since the first chamber and the second chamber have side portions that are continuous with an inner angle, a concave gap exists when the first chamber and the second chamber are arranged so that one side portion faces each other. In other words, the chambers having the inner angles that allow the concave gap to be formed are arranged with each other. Therefore, by disposing the connection chamber in this gap, it is possible to prevent the connection chamber from greatly protruding laterally from the region where the first chamber and the second chamber are disposed. Therefore, an increase in the size of the substrate processing apparatus can be suppressed. Furthermore, since the connection chamber that connects the first chamber and the second chamber can store a plurality of substrates to be processed, the plurality of substrates to be processed are delivered to the first chamber or the second chamber at a time. be able to. Therefore, productivity can be improved without making the processing chamber empty (without stopping) while changing the atmosphere of the connection chamber to a different atmosphere. Further, the average transfer time per substrate to be processed can be shortened, and the throughput can be improved.

  Application Example 2 In the substrate processing apparatus according to the application example described above, the connection chamber includes a first connection chamber disposed in one concave region generated between the first chamber and the second chamber, and the other It is preferable that the second connection chamber is disposed in the concave region.

  According to this configuration, the first connection chamber is disposed in one of the two concave regions, and the second connection chamber is disposed in the other. Therefore, for example, when transporting from the first chamber to the second chamber, the first connection chamber When transporting from the chamber and the second chamber to the first chamber, the transport direction can be dedicated as in the second connection chamber. Therefore, even when the processing time differs between the first chamber side and the second chamber side, the substrate to be processed can be transported at different timings.

  Application Example 3 In the substrate processing apparatus according to the application example described above, the connection chamber includes a cassette on which the substrate to be processed is placed and stored, and the cassette normalizes a plurality of the substrates to be processed. It is preferable to store them side by side in the direction.

  According to this configuration, since the plurality of substrates to be processed are stored side by side in the normal direction, it is possible to prevent the space in the plane direction from being widened.

  Application Example 4 In the substrate processing apparatus according to the application example described above, it is preferable that the first chamber and the second chamber have a regular octagonal planar shape having substantially the same size.

  According to this configuration, since the first chamber and the second chamber are regular octagons and the number of sides is large, many processing chambers can be connected to the sides of each chamber. Further, since the first chamber and the second chamber have regular octagons of substantially the same size, if they are arranged so that one side of each other faces, the space between the first chamber and the second chamber. Has a concave gap opening at 90 °. Therefore, by arranging the square connection chamber so as to be adjacent to the side portion in the gap, the connection chamber is not greatly protruded from the side where the first chamber and the second chamber are disposed. Can do.

  Application Example 5 In the substrate processing apparatus according to the application example described above, the first chamber is disposed in a first processing station together with a first storage chamber that stores the plurality of substrates to be processed, and the second chamber is It is preferable that the second processing chamber is disposed in the second processing station together with the second storage chamber for storing the plurality of substrates to be processed.

  According to this configuration, the first storage chamber is disposed in the first processing station, and the second storage chamber is disposed in the second processing station, so that the first storage chamber is delivered from the first connection chamber or the second connection chamber. A plurality of substrates to be processed and a plurality of substrates to be processed gathered at a processing station can be stored. Therefore, it is possible to perform processing on a plurality of substrates to be processed while the atmosphere in the first connection chamber and the second connection chamber is converted to another atmosphere.

  FIG. 1 is a schematic plan view showing the structure of the substrate processing apparatus. FIG. 2 is a schematic cross-sectional view showing the structure of the connection chamber constituting the substrate processing apparatus. Hereinafter, the structure of the substrate processing apparatus and the connection chamber will be described with reference to FIGS. 1 and 2.

  As shown in FIG. 1, the substrate processing apparatus 11 is an apparatus used for manufacturing an organic EL device, a liquid crystal device, a semiconductor device and the like provided with a substrate to be processed 12, and includes a first processing station 13 and a second processing station. 14. The substrate processing apparatus 11 is not limited to the first processing station 13 and the second processing station 14. For example, a plurality of processing stations (not shown) are connected to the respective processing stations 13 and 14. Yes.

  The first processing station 13 includes a first chamber 15 having a first atmosphere different from the atmosphere. In addition, the second processing station 14 includes a second chamber 16 having a second atmosphere different from the first atmosphere. That is, since the substrate 12 to be processed is subjected to a plurality of processes under an atmosphere different from the atmosphere, the substrate 12 to be processed is reciprocated between the first chamber 15 and the second chamber 16.

  Next, processing performed on the substrate 12 to be processed will be described. For example, in the case of manufacturing an organic EL device, a metal film forming process and a sealing process such as a CVD (Chemical Vapor Deposition) method, a sputtering method, and a vapor deposition method in a vacuum atmosphere with respect to an element substrate as the substrate 12 to be processed. A patterning process using a photolithography technique, an organic film sealing process under a nitrogen atmosphere, and a printing process using an inkjet technique are performed. Hereinafter, the structure of the substrate processing apparatus 11 when the atmosphere of the first chamber 15 is a vacuum atmosphere and the atmosphere of the second chamber 16 is a nitrogen atmosphere will be described.

As described above, the first processing station 13 includes the first chamber 15 in a vacuum atmosphere. Specifically, for example, a vacuum atmosphere of 10 ⁻⁵ Pa is set. The first chamber 15 is formed in, for example, a regular octagonal planar shape having eight sides 15a. The side portions 15a are connected to each other with an internal angle of 135 °. Thus, since the 1st chamber 15 has a regular octagonal planar shape, the number of the side parts 15a is large, and many process chambers can be connected to the side parts 15a.

  A first substrate transfer chamber 18 is disposed on one of the eight side portions 15a via an opening / closing device 17a including a gate valve or a shutter. In the first substrate transfer chamber 18, the substrate 12 to be processed is transferred between the first processing station 13 and another processing station connected to the first processing station 13 in the same vacuum atmosphere.

  Moreover, the 1st process chamber 21 in which the process in a vacuum atmosphere is performed is arrange | positioned through the opening / closing apparatus 17b in one side part 15a among the eight side parts 15a. In the first processing chamber 21, for example, a metal film sealing process is performed. By changing the open / close devices 17a and 17b from the closed state to the open state, the substrate 12 to be processed can be moved back and forth between the first chamber 15 and the first substrate transfer chamber 18 or the first processing chamber 21.

  In addition, the first storage chamber 22 and the fourth storage chamber 23 that can store a plurality of substrates to be processed 12 are arranged on two of the eight side portions 15a via the opening / closing devices 17c and 17d. Has been. The first storage chamber 22 and the fourth storage chamber 23 are provided with cassettes (not shown) capable of mounting a plurality of substrates 12 to be processed at regular intervals in the normal direction. . For example, ten substrates to be processed 12 can be placed on the cassette. In the first storage chamber 22, for example, the substrate 12 to be processed that has been processed on the first processing station 13 side in a vacuum atmosphere is stored. In the fourth storage chamber 23, for example, the substrate 12 to be processed transferred from the second processing station 14 is stored.

  A first substrate transfer robot 24 is disposed near the center of the first chamber 15. The first substrate transfer robot 24 is configured such that, for example, two arms 24a and 24b (double arm and twin arm) operate independently. Specifically, each of the two arms 24a and 24b can transport, pick up, and place the substrate 12 to be processed. A vacuum evacuation mechanism (not shown) for making a vacuum atmosphere is connected to the first chamber 15. The first chamber 15 is not limited to the first processing chamber 21 and a plurality of processing chambers may be connected.

  As described above, the second processing station 14 includes the second chamber 16 having a nitrogen atmosphere. Specifically, it is set to a nitrogen atmosphere with a very low moisture concentration, for example, 10 ppm. For example, the second chamber 16 is formed to have substantially the same size as the first chamber 15. Similar to the first chamber 15, the second chamber 16 is formed in, for example, a regular octagonal planar shape having eight side portions 16a. The side portions 16a are connected to each other with an internal angle of 135 °.

  The second substrate transfer chamber 25 is disposed on one side portion 16a of the eight side portions 16a via an opening / closing device 17e including a gate valve or a shutter. In the second substrate transfer chamber 25, the substrate 12 to be processed is transferred between the second processing station 14 and another processing station connected to the second processing station 14 under the same nitrogen atmosphere.

  Moreover, the 2nd process chamber 31 in which the process in a nitrogen atmosphere is performed is connected to one side part 16a among the eight side parts 16a via the switchgear 17f. In the second processing chamber 31, for example, an organic film sealing process is performed. By changing the open / close devices 17e and 17f from the closed state to the open state, the substrate 12 to be processed can be moved back and forth between the second chamber 16 and the second substrate transfer chamber 25 or the second processing chamber 31.

  In addition, the second storage chamber 32 and the third storage chamber 33 that can store a plurality of substrates to be processed 12 are arranged in two of the eight side portions 16a via the opening / closing devices 17g and 17h. Has been. Similarly to the first storage chamber 22 and the fourth storage chamber 23, the second storage chamber 32 and the third storage chamber 33 place a plurality of substrates to be processed 12 at regular intervals in the normal direction. A cassette (not shown) is provided. For example, ten substrates to be processed 12 can be placed on the cassette. In the second storage chamber 32, for example, the substrate 12 to be processed transferred from the first processing station 13 is stored. In the third storage chamber 33, for example, the substrate 12 to be processed that has been processed on the second processing station 14 side in a nitrogen atmosphere is stored.

  Near the center of the second chamber 16, a second substrate transfer robot 34 is disposed. Similar to the first substrate transfer robot 24, the second substrate transfer robot 34 is configured such that, for example, two arms 34a and 34b operate independently. The second chamber 16 is connected to an atmosphere replacement device (not shown) for making a nitrogen atmosphere. The second chamber 16 is not limited to the second processing chamber 31 and a plurality of processing chambers may be connected.

  The first chamber 15 and the second chamber 16 are adjacently arranged so that one side 15a of the first chamber 15 and one side 16a of the second chamber 16 face each other. By arranging in this way, there are regions A and B as concave gaps surrounded by the first chamber 15 and the second chamber 16. Using these areas A and B, the first connection chamber 41 and the second connection chamber 42 having a square shape are arranged.

  The first connection chamber 41 is arranged to be able to communicate with the first chamber 15 via the first gate valve 43. Further, the first connection chamber 41 is arranged to be able to communicate with the second chamber 16 via the second gate valve 44. The first connection chamber 41 is provided with, for example, an atmosphere replacement mechanism including a vacuum evacuation mechanism, and can be switched between a vacuum atmosphere and a nitrogen atmosphere. That is, when the gate valves 43 and 44 are opened, it is necessary to have the same atmosphere as that of the communicating chamber. The first connection chamber 41 is used, for example, when delivering the substrate 12 to be processed from the first chamber 15 to the second chamber 16.

  The second connection chamber 42 is arranged to be able to communicate with the second chamber 16 via the third gate valve 45. Further, the second connection chamber 42 is arranged to be able to communicate with the first chamber 15 via the fourth gate valve 46. Similarly to the first connection chamber 41, the second connection chamber 42 is provided with, for example, an atmosphere replacement mechanism including a vacuum evacuation mechanism, and can be switched between a vacuum atmosphere and a nitrogen atmosphere. The second connection chamber 42 is used, for example, when delivering the substrate 12 to be processed from the second chamber 16 to the first chamber 15.

  In the first connection chamber 41 and the second connection chamber 42, a multi-stage cassette 47 (see FIG. 2) capable of mounting a plurality of substrates to be processed 12 at regular intervals in the normal direction. Is provided. For example, ten substrates to be processed 12 can be placed on the cassette 47. The number of substrates to be processed 12 that can be stored in the cassette 47 is desirably determined according to the processing capability of the substrate 12 to be processed in a vacuum atmosphere or the processing capability in a nitrogen atmosphere.

  Specifically, for example, it is assumed that it takes 10 minutes to replace the first connection chamber 41 from the nitrogen atmosphere to the vacuum atmosphere. Further, it is assumed that one substrate 12 to be processed in a vacuum atmosphere including the first processing station 13 takes 1 minute (including a transfer time). In this case, 10 substrates 12 can be processed for 10 minutes while the atmosphere in the first connection chamber 41 is replaced with another atmosphere. That is, by transporting the 10 substrates to be processed 12 to the vacuum atmosphere side at a time, the first processing chamber 21 on the vacuum atmosphere side and the like can be operated without stopping (with no free time). it can. The same applies to the second connection chamber 42. Further, the average transfer time per substrate 12 to be processed can be shortened (for example, about 1 minute), and the throughput can be improved.

  Next, the transfer operation of the substrate processing apparatus 11 will be described with reference to FIGS. 1 and 2. Hereinafter, after the target substrate 12 is processed in a vacuum atmosphere including the first processing station 13, the processing is performed in a nitrogen atmosphere including the second processing station 14, and again includes the first processing station 13. A case will be described in which the substrate 12 to be processed is transported in a reciprocating manner so that processing is performed in a vacuum atmosphere.

  First, the substrate 12 to be processed that has been processed in a vacuum atmosphere is transferred from the first substrate transfer chamber 18 to the first storage chamber 22. The substrate 12 to be processed is transferred by the first substrate transfer robot 24. The first storage chamber 22 stores a plurality of substrates to be processed 12 that have been processed in a vacuum atmosphere.

  Next, the substrate 12 to be processed is transferred from the first storage chamber 22 to the first connection chamber 41. The first connection chamber 41 is set in a vacuum atmosphere before the first gate valve 43 is opened. The second gate valve 44 is in a closed state. Specifically, two substrates to be processed 12 are simultaneously transferred using the two arms 24 a and 24 b of the first substrate transfer robot 24. Ten substrates to be processed 12 are placed in the cassette 47 of the first connection chamber 41.

  Next, the atmosphere of the first connection chamber 41 is replaced from a vacuum atmosphere to a nitrogen atmosphere. First, the first gate valve 43 is closed. Next, the atmosphere is replaced from a vacuum atmosphere to a nitrogen atmosphere using an atmosphere replacement mechanism.

  Next, the substrate 12 to be processed is transferred from the first connection chamber 41 to the second storage chamber 32 of the second processing station 14. First, the second gate valve 44 of the first connection chamber 41 is opened. Next, using the second substrate transfer robot 34, the ten substrates to be processed 12 are transferred from the first connection chamber 41 to the second storage chamber 32 via the second chamber 16. In addition, the one to-be-processed substrate 12 is directly conveyed from the 1st connection chamber 41 to the 2nd process chamber 31, and the process in nitrogen atmosphere is performed.

  Next, the substrate 12 to be processed is transferred from the second processing chamber 31 to another processing station via the second substrate transfer chamber 25, and processing is performed in a nitrogen atmosphere. The substrate 12 to be processed that has been processed under the nitrogen atmosphere is sequentially stored in the third storage chamber 33. The empty first connection chamber 41 is replaced with a vacuum atmosphere from a nitrogen atmosphere in preparation for the next transfer operation.

  Next, the substrate 12 to be processed is transferred from the third storage chamber 33 to the second connection chamber 42. In the second connection chamber 42, a nitrogen atmosphere is set before the third gate valve 45 is opened. The fourth gate valve 46 is in a closed state. Specifically, two substrates to be processed 12 are simultaneously transferred using the two arms 34 a and 34 b of the second substrate transfer robot 34. Ten substrates to be processed 12 are placed in the cassette 47 of the second connection chamber 42.

  Next, the atmosphere of the second connection chamber 42 is replaced from a nitrogen atmosphere to a vacuum atmosphere. First, the third gate valve 45 is closed. Next, a nitrogen atmosphere is replaced with a vacuum atmosphere using an atmosphere replacement mechanism.

  Next, the substrate 12 to be processed is transferred from the second connection chamber 42 to the fourth storage chamber 23 of the first processing station 13. First, the fourth gate valve 46 of the second connection chamber 42 is opened. Next, using the first substrate transfer robot 24, 10 substrates 12 to be processed are transferred from the second connection chamber 42 to the fourth storage chamber 23 via the first chamber 15. In addition, the one to-be-processed substrate 12 is directly conveyed from the 2nd connection chamber 42 to the 1st process chamber 21, and the process in a vacuum atmosphere is performed.

  Next, the substrate 12 to be processed is transferred from the first processing chamber 21 to another processing station. Then, after performing a predetermined process on the plurality of substrates to be processed 12, for example, the substrate to be processed 12 is discharged to the outside.

  As described above, since the plurality of substrates to be processed 12 can be stored in the first connection chamber 41 and the second connection chamber 42, the first processing station 13 side (in a vacuum atmosphere) 2 A plurality of substrates to be processed 12 can be delivered to the processing station 14 side (under a nitrogen atmosphere) at a time. Therefore, while the first connection chamber 41 and the second connection chamber 42 are replaced with the respective atmospheres, it is possible to reduce the time (waiting time) during which the processing chamber is stopped, and the plurality of substrates 12 to be processed. Can be processed efficiently.

  Further, the first connection chamber 41 is dedicated to loading the substrate 12 to be processed from the first chamber 15 to the second chamber 16, and the second connection chamber 42 is the substrate to be processed from the second chamber 16 to the first chamber 15. Therefore, the first connection chamber 41 and the second connection chamber 42 can be operated at different timings. Therefore, even if there is a difference between the processing time in the vacuum atmosphere and the processing time in the nitrogen atmosphere, the atmosphere can be replaced at each timing in each of the connection chambers 41 and 42, and the transfer can be efficiently performed. It can be performed.

  As described above in detail, according to the substrate processing apparatus 11 of the present embodiment, the following effects can be obtained.

  (1) According to the present embodiment, when the first chamber 15 and the second chamber 16 are viewed in plan, the first chamber 15 and the second chamber 16 both have a regular octagon. When facing 16a, a wide region A and a region B exist between the first chamber 15 and the second chamber 16. Therefore, by arranging the first connection chamber 41 so as to be adjacent to the side portions 15a, 16a in the region A and arranging the second connection chamber 42 so as to be adjacent to the region B, the first connection chamber 41 and It is possible to prevent the second connection chamber 42 from greatly protruding laterally from the region where the first chamber 15 and the second chamber 16 are disposed. In addition, since the first connection chamber 41 and the second connection chamber 42 do not protrude largely laterally from the arrangement region of the first chamber 15 and the second chamber 16, the substrate transfer robots 24 and 34 should be small in size. Therefore, it is not necessary to increase the size of the first chamber 15 and the second chamber 16.

  (2) According to this embodiment, when the substrate to be processed 12 is reciprocated between the two chambers 15 and 16, the first connection chamber 41 and the second connection chamber 42 store a plurality of substrates to be processed 12. Therefore, a plurality of substrates to be processed 12 can be delivered to the first chamber 15 side (in a vacuum atmosphere) and the second chamber 16 side (in a nitrogen atmosphere) at a time. Therefore, while the first connection chamber 41 and the second connection chamber 42 are replaced with the respective atmospheres, it is possible to reduce the time (waiting time) during which the processing chamber is stopped, and the plurality of substrates 12 to be processed. Can be processed efficiently. Further, the average transfer time per substrate 12 to be processed can be shortened, and the throughput can be improved.

  (3) According to the present embodiment, the angle formed by the side portions 15a and 16a of the first chamber 15 and the second chamber 16 in the region A and the region B is approximately 90 °. On the other hand, the transport direction of the substrate 12 to be processed is 90 °, and the substrate 12 to be processed can be transported only by causing the substrate transport robots 24 and 34 to perform simple operations.

  In addition, embodiment is not limited above, It can also implement with the following forms.

(Modification 1)
As described above, the planar shape of each of the first chamber 15 and the second chamber 16 is a regular octagon. is not. Moreover, it is not limited to a regular octagon, for example, what is necessary is just a shape (for example, hexagon) which the clearance gap which arrange | positions the connection chambers 41 and 42 between the two chambers 15 and 16 produces.

(Modification 2)
As described above, the first connection chamber 41 is used exclusively for transporting the substrate 12 to be processed from the first chamber 15 to the second chamber 16, and the second connection chamber 42 is used from the second chamber 16 to the first chamber 15. Although the processing substrate 12 is used exclusively for transporting, the present invention is not limited to this. For example, the first chamber 15 and the second chamber 16 may be transported in both directions.

(Modification 3)
As described above, the substrate processing apparatus 11 is not limited to the processing stations 13 and 14 in a vacuum atmosphere and a nitrogen atmosphere, and may be configured to include other atmospheres or other atmospheres. Good.

(Modification 4)
As described above, the first processing chamber 21 and the second processing chamber 31 are not limited to performing the sealing process, and other processes may be performed.

The schematic plan view which shows the structure of a substrate processing apparatus. The schematic cross section which shows the structure of the connection chamber which comprises a substrate processing apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Substrate processing apparatus, 12 ... Substrate to be processed, 13 ... First processing station, 14 ... Second processing station, 15 ... First chamber, 15a ... Side, 16 ... Second chamber, 17a, 17b, 17c, 17d , 17e, 17f, 17g, 17h ... opening / closing device, 18 ... first substrate transfer chamber, 21 ... first processing chamber, 22 ... first storage chamber, 23 ... fourth storage chamber, 24 ... first substrate transfer robot, 25 2nd substrate transfer chamber, 31 ... 2nd processing chamber, 32 ... 2nd storage chamber, 33 ... 3rd storage chamber, 34 ... 2nd substrate transfer robot, 41 ... 1st connection chamber, 42 ... 2nd connection chamber, 43 ... 1st gate valve, 44 ... 2nd gate valve, 45 ... 3rd gate valve, 46 ... 4th gate valve, 47 ... Cassette.

Claims (5)

A first chamber having a first atmosphere different from the atmosphere;
A second chamber having a second atmosphere different from the atmosphere and the first atmosphere;
A substrate processing apparatus comprising:
The first chamber and the second chamber have side portions that are continuous with an inner angle and are arranged so that one side portion of the first chamber and the second chamber face each other.
A plurality of concave gaps formed between the first chamber and the second chamber are adjacent to the side portions of the first chamber and the second chamber and can communicate with the first chamber and the second chamber. A substrate processing apparatus, wherein a connection chamber for storing a plurality of substrates to be processed is disposed. The substrate processing apparatus according to claim 1,
In the connection chamber, a first connection chamber is disposed in one concave region generated between the first chamber and the second chamber, and a second connection chamber is disposed in the other concave region. A substrate processing apparatus. The substrate processing apparatus according to claim 1 or 2, wherein
The connection chamber has a cassette for placing and storing the substrate to be processed;
A substrate processing apparatus, wherein the cassette stores a plurality of substrates to be processed side by side in a normal direction. A substrate processing apparatus according to any one of claims 1 to 3, wherein
The substrate processing apparatus, wherein the first chamber and the second chamber have a regular octagonal planar shape having substantially the same size. The substrate processing apparatus according to any one of claims 1 to 4, wherein
The first chamber is disposed in a first processing station together with a first storage chamber for storing the plurality of substrates to be processed.
The substrate processing apparatus, wherein the second chamber is disposed in a second processing station together with a second storage chamber for storing the plurality of substrates to be processed.

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