JP2009049261A - Mounting device and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device and method which picks up and/or releases extremely thin chips without warping or damaging the chips in a mounting process of stacking the chips. <P>SOLUTION: A mounting device stacks chips, each of which has placement bumps on the front side and pads 32 on the back side (first pattern), at least on three points not in line with one another, and includes: a first droplet suction mechanism for sucking the back side of the chip with a first droplet; a moving mechanism for moving the chip to a destination position; a second droplet 76 discharging mechanism for dropping a second droplet onto the pads disposed on the back side of the stacked chip or onto a nozzle 73 at the destination; a mechanism for lowering the chip, which has the bumps disposed on the front side, to the back sides of the other stacked chips with the front side placed face down and holding the corresponding pads and bumps through the second droplet at a position where the surface tension of the second droplet is stabilized; and a mechanism for removing the chips. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting apparatus and a mounting method, for example, and more particularly to a mounting apparatus and a mounting method in three-dimensional mounting of a semiconductor.

  In the three-dimensional mounting of semiconductors, in recent years, chips have been stacked for the purpose of increasing the degree of integration and storing a plurality of functions in one package. In the conventional mounting technology, in order to pick up and release in a mounter that picks up a semiconductor chip or electronic component and places and joins it at a predetermined position such as a printed circuit board, vacuum suction by a nozzle having a vacuum collet at the tip is performed. ON / OFF operation. That is, the chip is sucked by vacuum suction, moved to a desired position, and then released to complete the mounting operation.

  However, in recent years, the above-described stacking of chips has become considerably advanced. At the same time, in order to increase the number of chips stacked, the chip thickness per chip is becoming increasingly thinner. So-called ultra-thin chips with a thickness of several tens of microns or less are becoming the mainstream of development sites. In addition to this, diversification and diversification of chips themselves are progressing, for example, chips of acceleration sensors have through portions.

Along with this trend, there is a need to mount ultra-thin semiconductor chips and micro electro mechanical systems (MEMS) chips with penetrating parts that are unprecedented in the technical fields of semiconductor manufacturing equipment and semiconductor manufacturing. Came out. In the former case, since it is extremely thin, there is a possibility that the vacuum suction method may not work if the chip is damaged by the vacuum suction method or the chip itself is warped due to film stress. Even in the latter case, there is a problem that the vacuum suction itself cannot be used due to the penetration portion.
JP 2005-33014 A

  In this way, when conventional semiconductor chip mounting technology such as vacuum suction is used for ultra-thin type chips, chip warping and breakage have not occurred so far with normal chips As a result, new problems and issues have arisen, which hinders the manufacture of ultra-thin chips with high needs.

  Therefore, the technical idea of picking up and releasing the chip using the surface tension of the liquid droplets was born as in Patent Document 1 instead of by vacuum suction. In this case, the droplet is used in a series of operations of lifting (picking up) the chip, bringing it to a predetermined position, and removing it. At this time, since such chips are stacked, naturally, if a shift of 1 micron occurs in a single-layer mount, for example, a stack of 16 layers will cause a maximum shift of 16 microns. Become.

  In other words, as the number of layers increases, the need for adopting a method other than vacuum adsorption (for example, a mounting method using droplets) increases as the chip becomes thinner, while minimizing errors in stacking is inevitably required. Will be. In the case of using this droplet, the precision of the plane (and elevation) position on the droplet contact surface of the chip is required. However, the technical idea of mounting a chip using droplets, including the above-mentioned conventional documents, has not come out of the idea. In other words, since the dimensional accuracy is not considered and countermeasures are taken in these presented items, it is practical to actually mount the chip using droplets in the field of semiconductor manufacturing equipment, for example. I had to say that it was difficult in terms of alignment.

  In other words, the target of mounting a semiconductor chip using droplets is not realistic about how this alignment is performed in mounting a semiconductor chip, although alignment accuracy is required in units of several microns. Therefore, it is difficult to say that mounting technology using droplets of semiconductor chips has been put to practical use, and a kind of intermolecular force called droplets is a practical level that requires accuracy of several tens of microns. At present, it has not been possible to control with this. Since accurate and precise pick-up and / or release operations at a micro-dimension level could not be performed, mounting a semiconductor chip by using droplets was not a practical level.

  The present invention has been made to solve such a problem in the prior art, and in the mounting process in which a plurality of ultrathin chips are stacked, chip pickup and / or release can be performed without causing warping or damage of the chip. An object of the present invention is to provide a mounting apparatus and a mounting method that can be performed.

  More specifically, the present invention enables a mounting apparatus and mounting method capable of achieving precise alignment when mounting ultra-thin chips in a plurality of layers, and enables pick-up and mounting operations of semiconductor chips and the like with a practical precision level. It is an object to provide a mounting apparatus and a mounting method.

  In order to solve the above-described problems, the mounting device according to the present invention has bumps arranged on a surface including at least three points that are not in the same straight line on the surface, and at least three points that are not in the same straight line ( In a mounting apparatus for stacking chips having pads placed on the back surface at the first pattern) position, the first liquid droplet adsorption that adsorbs the back surface of the chip to be mounted located at the transfer source position with the first liquid droplets A mechanism for moving the chip adsorbed by the first droplet from the transport source position to the transport destination position while maintaining the suction state; and on the back surface of the already stacked chips at the transport destination position A second droplet spring that suspends a second droplet on a pad disposed along the first pattern or on a nozzle disposed along the first pattern on the mount location. The mechanism and the chip to be mounted which has the bumps arranged on the surface along the second pattern corresponding to the first pattern are lowered toward the back surface of the stacked chip with the surface facing down. A mechanism in which the corresponding pad and bump are held at a position where the surface tension of the second droplet is stabilized via the second droplet, and when the desired number of stacked chips is stacked, And a removing mechanism for removing two droplets.

  Here, “chip” refers to a very small and thin object including a semiconductor chip or an electronic component, and particularly includes a semiconductor chip having a thickness of several microns or less (hereinafter the same).

  In addition, “at least three points that are not on the same straight line” means three points that are sufficient to form two axes of plane coordinates (they do not necessarily have to be orthogonal to each other). As a result, coordinates on the plane are determined, and position control is possible.

  Furthermore, “lyophilicity with respect to a droplet” refers to a property having affinity for such a droplet.

  According to the present invention having such a configuration, when a small piece (for example, a semiconductor chip; the same applies hereinafter) is mounted on the mount destination place, the small piece is placed at a temporary position on the liquid droplet ejected from the second liquid droplet ejection mechanism. When placed, this drop is preferably forced in a direction that minimizes its surface tension (because the bumps located on the underside of the small piece have lyophilicity to such drop). Work. At this time, the bumps are arranged in accordance with a first pattern in which a plurality of points including at least three points that are not on the same straight line are arranged, and are to be paired with the material (on the upper surface of the stacked pieces). Since the pat (or the nozzle at the mounting position in the case of the mount of the first layer) is arranged according to the second pattern corresponding to the first pattern, the surface tension of the droplet is not affected by two non-parallel axes. It is possible to specify the direction (and coordinates) of the force. In other words, by first forming the first pattern and the second pattern at a precise level, the direction of the surface tension acting when a small piece is placed on the second droplet is controlled in a plane coordinate system. can do. In addition, since there are a plurality of such second droplets, the suction force of the chip by such second droplets is increased as compared to the case where the number of the droplets is single, and this force is used for pickup. It becomes easy to peel off the mount target chip from the adsorption force of the first droplet.

  Therefore, a desired alignment operation at the time of mounting can be precisely controlled. Therefore, even when picking up an extremely thin chip that is warped or damaged by vacuum suction, it prevents excessive stress from being generated on the chip, and warps or breaks the chip. It is possible to perform alignment precisely while preventing the above.

  Alternatively, the present invention alternatively has bumps disposed on the surface at positions of at least three points (first pattern) that are not in the same straight line, and has at least three points that are not in the same straight line as the first. In a mounting apparatus for stacking mount target chips having pads on the back surface, which are arranged at second pattern positions corresponding to patterns, a first droplet that adsorbs the surface of a chip to be mounted located at a transfer source position with a first droplet. A droplet adsorbing mechanism, a moving mechanism for moving the chip adsorbed by the first droplet from the conveyance source position to the conveyance destination position while maintaining the adsorption state, Second droplets on the bumps arranged along the first pattern on the surface of the finished chip or on the nozzles arranged along the first pattern on the mounting location A second droplet squirting mechanism that hangs down, and a chip that is a mount target chip with a pad disposed on the back surface along the second pattern is lowered toward the surface of the stacked chip with the back surface facing downward A mechanism in which the corresponding bump and pad are held at a position where the surface tension of the second droplet is stabilized via the second droplet, and when the desired number of stacked chips is stacked, It is also possible to adopt a configuration including a removal mechanism for removing two droplets.

  According to the present invention having such a configuration, when the small piece is mounted on the mount target place, when the small piece is placed at the temporary position on the liquid droplet ejected from the second liquid droplet ejection mechanism (preferably Since the pad placed on the lower surface of the small piece is lyophilic with respect to such a droplet, a force acts on this droplet in a direction that minimizes its surface tension. At this time, this pad is arranged according to the second pattern in which a plurality of points including at least three points which are not on the same straight line are arranged, and is a target to be paired with the material (on the upper surface of the stacked pieces). Since the bumps (or nozzles at the mounting position in the case of the first layer mount) are arranged according to the first pattern corresponding to the second pattern, the surface tension of the liquid droplet is not affected by two parallel axes. It is possible to specify the direction (and coordinates) of the force. In other words, by first forming the first pattern and the second pattern at a precise level, the direction of the surface tension acting when a small piece is placed on the second droplet is controlled in a plane coordinate system. can do. In addition, since there are a plurality of such second droplets, the suction force of the chip by such second droplets is increased as compared to the case where the number of the droplets is single, and this force is used for pickup. It becomes easy to peel off the mount target chip from the adsorption force of the first droplet.

  In addition, when such a configuration is provided, the place where the second droplet is temporarily placed is on the pad that hits the concave bottom surface, so that the second droplet is more stably putted. Therefore, the mount with accurate alignment by using droplets, which is the original purpose, will be realized with higher probability.

  In these cases, it is preferable that the pad and the bump have lyophilicity with respect to the second droplet. That is, at least the surface of the bump and the pad is configured to have a molecular structure having high affinity with the molecules of the droplet. This “molecular structure having a high affinity with the molecules of the droplet” means that the so-called “wetting property” of the metal related to the bump and the pad with respect to the droplet is high. By adopting such a configuration, the control of the surface tension with respect to the droplet can be performed more powerfully and easily.

  Further, in these cases, the chip may further include a passivation layer having liquid repellency to the second droplet around the pad disposed on the back surface thereof. This “liquid repellency” is, for example, an anti-wetting property to a droplet, as represented by polyimide or the like, that is, having a repulsive property, or a crystal grain having a fine needle-like surface. It has the property of repelling droplet particles. By providing such a configuration, the droplet exhibits a behavior of “wetting” on a lyophilic bump or pad while repelling a liquid repellent material (for example, polyimide). In other words, the small piece is lyophilic with respect to the mounting droplet (second droplet) possessed by the bump or pad on the back surface thereof and repellent with respect to the mounting droplet (second droplet) possessed by the liquid repellent material. Since the position of the small piece is fixed after being moved by the liquid property, the operation of controlling the droplet through the surface tension can be performed more accurately, precisely and effectively.

  Furthermore, in these cases, it may be configured to further include a heating device and / or a decompression device. In the case where such a device is provided, the present invention can release the surface tension at the mount target position by promoting the evaporation (or lowering the vaporization point) of the droplets by evaporation by heating or by decompression. Therefore, the desired mounting operation is completed without delay.

  Furthermore, in these cases, the total surface tension of the second droplets for mounting may be larger than the total surface tension of the first droplets for pickup. With this configuration, the surface tension of the mounting droplet exceeds the surface tension of the pickup droplet, so that the surface tension of the pickup droplet is cut, thereby completing the mounting operation at a desired position. Is possible.

In addition, in the case of these configurations, two electrodes that are insulated from each other for controlling the first droplet by EWOD (Electrowetting on Dielectric) are installed in the first droplet adsorption mechanism. And / or EWOD (Electrowetting) for the second droplet
It may be configured such that two electrodes insulated from each other for performing control by on-dielectric) are installed on the bumps or pads or nozzles.

By further providing such a configuration, the first droplet adsorbing mechanism performs EWOD (Electrowetting on Dielectric) on the first droplet, and / or the bump or pad, or the nozzle on the second droplet. EWOD (Electrowetting
on Dielectric), these droplets undergo a change in wettability gradient due to the potential applied between the electrodes, so that the surface tension of the droplets can be controlled. Operations such as releasing tension can be achieved smoothly.

  In addition, the mounting method according to the present invention has bumps arranged on a surface including at least three points that are not in the same straight line on the surface, and at least three points (first pattern) that are not in the same straight line. The mount target chip having the placed pad on the back surface is adsorbed by the first droplet with the back surface facing up, and the mount target chip is held in the state adsorbed by the first droplet while being transported to the transport destination position. And is arranged along the first pattern on the pad or the mounting place of the stacked chip that is already laminated with the back surface up at the transport destination position. A second droplet is dropped on the nozzle, the chip to be mounted is lowered toward the stacked chip from the vicinity of the transfer destination position, and the second pattern corresponding to the first pattern is dropped. When the bump on the lower surface of the mount target chip arranged along the screen is adsorbed by the second droplet, the lowering stops and the surface tension of the second droplet is stabilized. And the second droplet is removed when the mount target chips are stacked in a desired number of layers.

  According to the present invention having such a configuration, when the small piece is mounted at the mount destination location, the bumps on the lower surface of the small piece to be mounted are arranged at a plurality of points including at least three points that are not on the same straight line. The pad on the upper surface of the stacked small piece, which is formed and arranged along the pattern, and where the second droplet at the mount point springs out, or the nozzle (in the case of the first mount) corresponds to the second pattern Since the small pieces are placed on the liquid droplets at the temporary position and at the same time, the bumps disposed on the lower surface of the small pieces have lyophilicity with respect to the liquid droplets. A force acts on the droplet in a direction that minimizes its surface tension. Therefore, it is possible to specify the direction of the surface tension force of the droplet by two axes that can define a plane coordinate position that is not parallel, thereby temporarily placing the liquid crystal in a place (temporary position) that is deviated from the original mount position. Even if it is done, it becomes possible to automatically move the small piece to the original position using the surface tension of the droplet.

  In this case, alternatively, bumps arranged at positions of at least three points (first pattern) that are not in the same straight line are provided on the surface, and at least three points that are not in the same straight line are provided in the first pattern. A chip to be mounted having a pad arranged at the corresponding second pattern position on the back surface is adsorbed by the first droplet with the front side facing up, and the state in which the chip is adsorbed by the first droplet is maintained. The mount target chip is moved to the transfer destination position, and the first on the bump or the mount place of the stacked chip that is already stacked with the surface facing up at the transfer destination position. A second droplet is dropped on the nozzles arranged along the pattern, the mount target chip is lowered toward the stacked chip from the vicinity of the transfer destination position, and the second pattern is dropped. When the pad on the lower surface of the mount target chip arranged along the screen adsorbs to the second droplet, the descent is stopped and the mount target chip is at a position where the surface tension of the second droplet is stabilized. And the second droplet may be removed when the mount target chips are stacked in a desired number of layers.

  In the case of having such a configuration, the place where the second droplet is temporarily placed is on the pad which hits the concave bottom surface, so that the second droplet is more stably adsorbed to the pad. As a result, the mount with accurate alignment by using droplets, which is the original purpose, will be realized with higher probability.

  In other words, by forming the first pattern and the second pattern in advance at a precise level, the direction of the surface tension acting when a small piece is placed on the second droplet is expressed in a plane coordinate. Can be controlled. In addition, since there are a plurality of such second droplets, the suction force of the chip by the second droplets is increased as compared to the case where the number of the droplets is single, and this force is used for pick-up. It becomes easy to peel off the mount target chip from the adsorption force of one droplet.

  In other words, when a small piece picked up using the second droplet and moved by the transport mechanism is mounted on the mount destination location, if there are small pieces stacked in advance, a plurality of bumps or pads on the upper surface of the small piece. If there are no pre-stacked small pieces on the top or alternatively, the small pieces are placed in a temporary position on the mounted mounting droplets (second droplets) on a plurality of mounting surface nozzles. The bump or pad on the lower surface of the small piece to be mounted is formed and arranged along the first pattern in which a plurality of points including at least three points that are not on the same straight line are arranged, and the pad of the stacked chip that is the mounting destination Alternatively, bumps (mounting surface nozzles when there are no stacked ones) are formed and arranged along the second pattern having an arrangement corresponding to the first pattern. At the same time that the small piece is placed on the droplet (second droplet) at the temporary position, preferably (depending on the lyophilicity with respect to the mounting droplet of the bump or pad disposed on the lower surface of the small piece) A force acts on the mounting droplet in a direction that minimizes its surface tension. Therefore, it is possible to specify the direction of the surface tension force of the second droplet by two axes that can define a plane coordinate position that is not parallel, and thus, in a place (temporary position) deviated from the original mount position. Even if temporarily placed, the small piece can be automatically moved to the original position by using the surface tension of the droplet.

  In other words, by forming the first pattern and the second pattern in advance at a precise level, the direction of the surface tension acting when a small piece is placed on the mounting droplet (second droplet). Can be controlled in plane coordinates, and alignment accuracy can be ensured. In addition, since there are a plurality of such mounting droplets, the suction force of the chip by the mounting droplets is increased as compared to the case of a single droplet. It becomes easy to peel off the mount target chip.

  At this time, preferably, the total surface tension of the mounting droplet (second droplet) is larger than the total surface tension of the pickup droplet (first droplet) (such dimensions). Or a combination of materials), the pickup droplets may be heated and evaporated by a heating device, or the surroundings of the pickup droplets may be depressurized appropriately or in combination. In the case of such a configuration, since the surface tension of the mounting droplet at the desired mounting destination is superior to the surface tension of the pickup droplet (or because the surface tension of the pickup droplet is scattered), the pickup The chip that has been removed is scraped from the pickup droplet and released at the mounting droplet site, which is the desired mounting destination. It does not occur and can be easily performed. Thereby, the mounting operation at the mounting target position can be completed stably and reliably.

  Therefore, it is possible to precisely control a desired alignment operation when the picked-up piece is transported to a desired position and mounted. Therefore, even when performing pick-up and mount operations for ultra-thin chips that cause warping or breakage when vacuum suction is used, it is possible to prevent excessive stress from being applied to the chip and to prevent warping of the chip. It is possible to mount with precise alignment while preventing damage and damage.

Further, in these configurations, the first droplet is controlled by EWOD (Electrowetting on Dielectric) by two electrodes insulated from each other installed in the first droplet adsorption mechanism, and / Or EWOD (Electrowetting) for the second droplet by means of two electrodes which are installed on the bump or pad or nozzle and insulated from each other.
on Dielectric).

  As described above, in the present invention, the picking up of the small piece is performed by using the surface tension of water or other liquid instead of vacuum suction. That is, after making a micro droplet on the nozzle surface, it is made to contact and adsorb | suck to a small piece. Thereafter, the picked-up small piece is transported / moved to the vicinity of the desired mounting position (temporary position), and the back surface of the small piece is adsorbed by droplets from the nozzle associated with the mount destination at the temporary position. Next, preferably, the adsorption (surface tension) of the droplet used for the pickup is released so that only the adsorption force from the droplet (second droplet) at the mount point acts only on the back surface of the small piece. Further, the material of the bump or pad, which is the target of contact with the droplet on the back surface, is made lyophilic with the droplet (for example, metal), so that the surface tension is minimized. Will work even more powerfully. At this time, a precise planar position control is performed by arranging the droplets and their contacts along the first pattern and the second pattern having at least three points previously taken on the coordinates of the two plane axes. It becomes possible.

  At this time, for example, a metal such as aluminum, gold, or copper is used as the bump or pad, and as the liquid droplet (first liquid droplet, second liquid droplet), these bump or pad is a lyophilic liquid. It is possible to achieve a desired effect by using a material having properties. In these cases, a material having liquid repellency for such (mounting) droplets, for example, polyimide (preferably convex in a sectional view from the pad surface) is disposed at a position adjacent to the pad. Therefore, it is possible to control such droplets to “wet” the bumps while avoiding this liquid-repellent material (the function of surface tension). It will be more reliable and efficient.

  In the present invention, picking up and releasing a small piece is not only performed by vacuum adsorption but using the surface tension of water or other liquids, and the small piece mounting operation is lyophilic with a droplet related to the mount. By arranging bumps or pads having, along the first pattern and the second pattern having at least three points previously taken on the coordinates of two axes on the plane, the surface tension can be minimized. Use it to create movement. At this time, if the pattern is set strictly in advance, it is possible to control to converge to a precise planar position. Therefore, it is possible to precisely control the alignment at the time of mounting using the surface tension of the droplets of the small pieces.

  The best mode for carrying out the invention will be described below with reference to the drawings.

  FIG. 1 is a configuration conceptual diagram showing an overall schematic configuration of a chip mount apparatus according to an embodiment of the present invention. In the figure, only the portions necessary for the description of the present invention are shown, and conventionally known techniques are adopted for other matters. In the figure, the thickness of the chip 3 is neglected, but the chip 3 actually has a very thin thickness.

  As shown in the figure, the chip mount device 1 of the present invention controls the overall control unit 10 that controls the operation of the entire device and the various functions related to the pickup of the chip 3 that is the object of manufacture, and controls the first droplet 26. A pickup device 20 including a mechanism to be generated, a transport mechanism 40 for transporting the picked-up chip 3 to the mount target location 7, a heating mechanism 50 for heating and evaporating the droplet 26 at the mount destination, and vaporization of the droplet 26 The pressure reducing mechanism 60 that lowers the point and promotes evaporation and the second droplet squirting mechanism 70 that generates the second droplet 76 used for adsorbing the chip 3 at the mount target point 7 are configured.

  Note that the heating mechanism 50 and the decompression mechanism 60, which are mechanisms for (substantially) removing the first droplet 26 (and possibly the second droplet 76 in some cases), are not necessarily provided. It is not necessary, and it is possible to achieve the object of the present application even with a configuration in which only some of them are selectively provided or a configuration without these.

  As shown in FIG. 2 (which is a conceptual cross-sectional view showing a partial cross section of an example of the configuration of the semiconductor chip 3 according to the present application), the chip 3 has a second surface on its lower surface. A protrusion 32 having a lyophilic property to the liquid droplet 76, for example, a metal, and the lower surface of the chip 3 so as to surround the protrusion 32. The second liquid And a passivation portion 34 having liquid repellency with respect to the droplet 76. Here, the term “lyophilic” refers to a property having a so-called “wetting” property with a liquid related to a droplet, or a property having an affinity with the liquid. In contrast, “liquid repellency” refers to the property of repelling such liquid. At the molecular level, there are various combinations depending on the combination of molecular structures between the liquid molecules, bump molecules, and passivation molecules, and there are various possibilities other than the above-mentioned combinations of metal and polyimide. It can be applied to all cases.

  As a material for the protrusion (pad) portion 32, a metal such as aluminum, copper, or gold is preferably used, but the material has a molecular structure having a high affinity with the molecules of the droplet 76 at the molecular level. . The passivation unit 34 is preferably an organic film such as polyimide, or has a fine needle-like surface with crystal grains, a material that repels droplet particles, or a material with droplets at the molecular level. Those having a molecular structure with low affinity for molecules are preferred. The passivation unit 34 is not essential, and may be configured without the passivation unit 34.

  As will be described later, the protrusions (pads) 32 are precisely arranged / positioned at least at three locations (four locations in this example), which are pre-patterned (for example, printed) positions that can form two coordinate axes on a plane. It is fixed. The arrangement position pattern of the protrusions (pads) 32 is a second liquid droplet arrangement position pattern (that is, an arrangement pattern of bumps 73 of a stacked chip or a stacking pattern) by a second liquid droplet ejection mechanism 70 (described later). When mounting in a place where it has not been done yet, this corresponds to the nozzle arrangement pattern (second pattern) at the mount destination.

  In addition to the overall control of the apparatus, the overall control unit 10 performs detailed operation control and operation timing of each mechanism / apparatus of the pickup device 20, the transport mechanism 40, the heating mechanism 50, the decompression mechanism 60, and the second droplet discharge mechanism 70. This is a portion having a function of performing control / management by, for example, control software or a control circuit, and this is realized as a circuit, device, software, a storage medium equipped with software, or the like that performs such a function.

  The pickup device 20 having the pickup nozzle 20A at the tip is configured to include a first droplet generation mechanism 22 and a first droplet suspension mechanism 24 in or near the inside. The first droplet generation mechanism 22 has a function of generating water or an organic material or other liquid supplied from a liquid supply source (not shown) as minute droplets. In this case, the type of droplets only needs to have sufficient performance (lyophilicity / liquid repellency with the surface of the semiconductor chip 3, safety, ease of operation, etc.) to perform chip adsorption, The type is not limited. The first droplet suspending mechanism 24 has a function of suspending the droplet 26 generated by the first droplet generating mechanism 22 from the tip. Also, here, an example is shown in which the first droplet generation mechanism 22 and / or the first droplet suspension mechanism 24 is included in the pickup device 20, but these are all or part of the pickup device 20. May be outside. In addition, here, the case where the first droplet suspension mechanism 24 (and the pickup device 20) is single, that is, the single droplet 26 for pickup is illustrated as an example. Good.

  The transport mechanism 40 has a function of transporting the chip 3 picked up by the pickup device 20 to a desired mount destination position (main position) or its vicinity (temporary position) while maintaining the suction by the surface tension of the droplet 26. And includes a conventional arm (not shown), a roller, a power source, and the like.

  The heating mechanism 50 is installed in the vicinity of the mount point 7 of the chip 3 and has a function of evaporating the droplet 26 and / or the droplet 76 by heating.

  The decompression mechanism 60 defines a certain range (not shown) of the tip of the pickup device 20 and / or the second droplet squirting mechanism 70 and has a function of decompressing this range.

  The second droplet squirting mechanism 70 includes a syringe 72 that is connected to the second spilling mechanism and stores a second droplet, and a needle 74 that squeezes the second droplet by receiving the fluid pressure from the syringe 72. The The second droplet squirting mechanism 70 has a function of generating the second droplet 76 for adsorbing the chip 3 (the lower surface thereof) at the mount target location, and squirting the second droplet 76 from the tip of the needle 74. Have. Immediately after the second droplet 76 is spouted, the chip 3 is sandwiched between the droplet 26 that abuts on its upper surface and the droplet 76 that abuts on its lower surface and receives surface tension from both sides. It becomes.

  Next, the arrangement position pattern of the protrusions (pads) 32 and the bumps that are the arrangement of the second droplets by the second droplet discharge mechanism 70 to ensure the alignment accuracy when mounting the chip 3 The arrangement position pattern of 73 (or the nozzle 72 at the mount location 7 when there is no laminated chip yet) will be described. FIG. 3 shows a first pattern which is an arrangement position pattern of the protrusion (pad) portion 32 and a bump 73 (or a nozzle 72 at the mount location 7 when there is no laminated chip yet) via the second droplet squirting mechanism 70. ) Is an explanatory diagram schematically showing a second pattern which is an arrangement position pattern.

  3, (a) to (c) are for explaining the arrangement position pattern of the protrusions (pads) 32 of the chip 3, and (d) to (f) are for explaining the arrangement position pattern of the bumps 73. (G) and (h) are diagrams for explaining the points corresponding to the first pattern and the second pattern, and (i) to (k) are for explaining the arrangement position pattern of the nozzles 72. It is. (A) is a perspective view of the arrangement position pattern (first pattern) of the protrusion (pad) portion 32 of the chip 3, (b) is a bottom view seen in the A direction, and (c) is a cross-sectional view taken along line AA. (D) is a perspective view of the arrangement position pattern (second pattern) of the bump 73, (e) is a plan view, and (f) is a BB cross-sectional view. (I) is a perspective view of the arrangement position pattern (second pattern) of the nozzles 72 of the second droplet squirting mechanism 70, (j) is a plan view, and (k) is a CC cross-sectional view.

  As shown in FIGS. 4A to 4C, the protrusion (pad) portion 32 of the chip 3 (however, in the drawing, the pad portion 32 is formed into a concave shape due to a relatively raised portion of the passivation portion 34. Are arranged in four places, ie, 32a, 32b, 32c, and 32d. These four places are set so that two coordinate axes on the plane, that is, the X axis and the Y axis can be formed (that is, they are not on the same straight line). Here, an example is given in which four points form a rectangle (rectangular shape), but the present invention is not limited to this, and may be three points or five points or more instead of four points. . Further, in a cross-sectional view, the protrusion (pad) portion 32 may be embedded in the chip 3, or may be adhered or fixed to the surface. Alternatively, this role can be played by a pad that appears on the surface of a circuit arrangement such as an LSI. These plural arrangement positions may be previously patterned (for example, printed) on the surface of the chip 3, and are precisely arranged and fixed at accurate positions. The figure shows a case in which a plurality of protrusions (pads) 32 are arranged and a passivation part 34 is provided around the protrusions 32. However, even in a structure without such a passivation part 34, FIG. Good.

  As for the arrangement position pattern (second pattern) of the bump 73, as shown in FIGS. 6D to 6F, the pattern corresponding to the arrangement position pattern (first pattern) of the protrusion (pad) portion 32 is shown. It is. Specifically, as shown in FIGS. 5 (g) and (h), for example, the XX axis and the YY axis are overlapped with the X axis and the Y axis, respectively, and each position (32a in this case) of the protrusion (pad) portion 32 is obtained. , 32b, 32c, and 32d), the positions of the bumps 73 are determined in advance at positions that exactly overlap the first pattern (here, the four positions 73a, 73b, 73c, and 73d). Note that the first pattern and the second pattern are not necessarily overlapped but also include those corresponding at a fixed ratio, and may be any one that can form a one-to-one relationship.

  Alternatively, when the stacked chip 3 does not exist at the mount target position, that is, when the first layer chip is mounted, the second liquid is used instead of the bump 73 as a second liquid drop discharge place. The nozzle 72 of the drip spring mechanism 70 is used. The arrangement position pattern (second pattern) of the nozzle 72 corresponds to the arrangement position pattern (first pattern) of the protrusion (pad) portion 32 as shown in FIGS. Is. Specifically, for example, the X1 axis and the Y1 axis are overlapped with the X axis and the Y axis, respectively, and each position of the protrusion (pad) portion 32 (here, four positions 32a, 32b, 32c, and 32d) is the first. An arrangement position of the nozzle 72 is determined in advance at a position that exactly overlaps the pattern or a corresponding position (the corresponding state is not shown).

  In the above, the technique focuses on planar alignment, but elevation correction, that is, alignment in the vertical direction, may be combined with this, and the existing technique is used for vertical alignment in this case. It may be used.

  Moreover, it can also be set as the structure which does not have the passivation part 34 instead of said structure (not shown). However, preferably, a passivation portion 34 made of polyimide, for example, is disposed at a position adjacent to the protrusion (pad) portion 32 of the chip 3 made of metal such as aluminum, gold, copper, and the like. The material of the protrusion (pad) portion 32 has lyophilicity (affinity) with the mount droplet 76, and the material of the passivation portion 34 has liquid repellency (anti-reactive property) with the mount droplet 76. Affinity). According to this configuration, the mounting droplet 76 has a force to be attracted to the protrusion (pad) portion 32 and a force to move away from the passivation portion 34, so the surface tension of the droplet is used. The technical idea of the present application called the alignment is achieved more efficiently.

  Next, the operation of the chip mounting apparatus 1 configured as described above will be described.

  FIG. 4 is a conceptual diagram for explaining the operation of the chip mounting apparatus 1 and shows the operations from the time before the chip is picked up to the completion of the picking up, alignment and mounting. In FIG. 4, the chip 3 has the protrusion (pad) portion 32 and the passivation portion 34 on the back surface and the bump portion 73 on the surface, and in other words, the protrusion 3 (pad) portion 32 and the passivation portion. Although an example in which the side with 34 is laminated upward is shown, it goes without saying that the bump portion 73 may be placed on the upper side. It is preferable that the protrusion (pad) portion 32 and the passivation portion 34 be on the side. This is because the passivation portion 34 is raised from the pad portion 32, the pad portion 32 is lyophilic, This is because the passivation part 34 has liquid repellency, and the second droplet 76 is stably seated on the pad part 32.

  4, (a) to (c) are mainly preparatory operations on the stacked (mounted) chip 3 side, and (d) is immediately after the mounting of the mounting target chip, and the bump portion 73 of the mounting target chip. And (e) the surface of the droplet 76 immediately after the protrusion (pad) portion 32 is adsorbed by the droplet 76. The stage moved by the tension is as follows. (F) is a state where the mount target chip is stabilized at an accurate position due to the surface tension by the droplet 76 and the chips are stacked and adsorbed by the droplet 76. The state in which a new second liquid droplet 76 is spouted to mount the chip to be mounted is schematically shown.

  First, in FIG. 5A, the mounted chip 3 that has already been mounted is placed on the desired mounting place 7 with the projection (pad) portion 32 and the passivation portion 34 on the side. Yes. Therefore, the bump portion 73 is installed on the lower surface. Next, as shown in (b), in this state, the syringe 72 is located at a position sufficient to cause the second liquid droplet 76 to spring out from the needle 74 at the tip thereof (for example, substantially at the top in the figure). Or the liquid droplet 76 is spouted onto the pad portion 32. As described with reference to FIG. 3, the number of the droplets 76 that are spouted is along the first pattern in plan view, and is four in the example shown in the figure.

  Next, in the state of FIG. 5C, the mount target chip 3 moved from the transport source position by the transport mechanism 40 is lowered toward the position where the droplet 76 is seated at the desired mount position. . Specifically, the pickup device 20 descends while the state where the mount target chip 3 is adsorbed by the first droplet 26 (as performed at the mount source position not shown), and the second liquid When the pickup nozzle 20A descends to a position sufficiently close to the upper surface of the droplet 76, the droplet 26 comes into contact with the chip 3 ((d) in the figure).

  In other words, when the transport mechanism 40 lowers the mount target chip 3, the second droplet 76 contacts the lower surface of the bump portion 73. At this time, since the second droplet 76 is set at four locations, the suction force is approximately four times as strong as that when the droplet is a single droplet. Therefore, it is possible to overcome the adsorption force by the first droplet 26 and peel off the bump portion 73 (and hence the mount target chip 3) on the mount destination side (ie, downward). In this case, alternatively, the second droplet 76 is made of a material having a relatively large surface tension, and the first droplet 26 is heated and evaporated by the heating mechanism 50 to adsorb the pickup droplet 26. A method of spraying a force, a method of spraying an adsorption force for pickup by depressurizing a certain range around the first droplet 26 by the decompression mechanism 60 and promoting the evaporation of the first droplet 26 (not shown) ) A method of removing the suction force by ejecting the wind force from the wind power generation mechanism and removing the droplets 26 may be used alternatively or in combination, and the present invention is technical in all cases. It is included as an idea.

  Alternatively, or in addition to these, a first electrode (not shown) and a second electrode (not shown) may be embedded in the first droplet suspension mechanism 24 while maintaining insulation from each other, and / Or the first electrode (not shown) and the second electrode are kept insulated from each other on the pad portion 32 (or on the bump portion 73 when the pad portion is disposed on the lower surface, or mounted) If the chip does not exist at the mount desired place 7, it may be embedded in the nozzle 72). With such a configuration, a potential is applied between two electrodes insulated from each other by a voltage application mechanism (not shown), and the EWOD (second droplet) is applied to the first droplet and the second droplet by the potential. Give control by Electrowetting on Dielectric). According to this control, the behavior of each droplet can be controlled. Therefore, precise alignment and mounting operation of the chip are given through increase / decrease, release, etc. of the surface tension of the droplet.

  Next, as a result of the adsorption force due to the surface tension of the droplet 26 acting on the bumps 73 on the back surface of the mount target chip 3 almost simultaneously with this contact, the mount target chip 3 is corrected to an accurate position ( (E) in FIG. In other words, when the pickup adsorption (by the first droplet 26 (not shown)) of the chip 3 is released and the bump portion 73 is adsorbed only by the second droplet 76, the droplet is almost instantaneously generated. A surface tension of 76 acts. That is, in combination with the lyophilicity of the surface of the bump portion 73 with respect to the droplet 76, the force acts in a direction in which the surface tension is minimized and the bump portion 73 is instantaneously moved. Is also moved ((e) in the figure). As a result, the droplet 76 can be moved to an accurate position of the mount by the surface tension of the droplet 76.

  In this case, the above operation may be performed with the surface having the bump portion 73 as the upper surface, upside down from FIG. In this case, at the stage where the mount target chip 3 is lowered and adsorbed to the second droplet 76 (immediately before (d) in the same figure), the chip 3 is spouted on the upper surface bump portion 73 of the mounted chip 3. The second droplet 76 avoids the passivation part 34 having liquid repellency with respect to the second droplet 76, and the force for adsorbing to the pad part 32 having lyophilicity acts more. In other words. Since the mounting droplet 76 has a force to be attracted to the pad portion 32 and a force to move away from the passivation portion 34, the technical idea of the present application called alignment using the surface tension of the droplet is It will be achieved more efficiently.

  Next, in FIG. 4F, the bump portion 73 thus moved to a precise position, and thus the position of the chip 3 is temporarily fixed, and in this fixed state, the next chip to be mounted is prepared. The operations c) to (e) are performed for the desired number of chips. When the desired number of chips are thus stacked, the second droplet is removed by the above-described method (not shown).

  A supplementary explanation will be given of the precise control of the above alignment. FIG. 5 is a plan view showing the concept of matching the first pattern and the second pattern related to the droplet mount / position for precise control of the alignment when mounting the chip 3 according to the present embodiment. is there. As shown in the figure, a first pattern ((a) and (b) in FIG. 3), which is an arrangement pattern of protrusions (pads) 32 that are accurately positioned in two axes by patterning, and a first pattern The second pattern ((d) and (e) or (i) and (j) in FIG. 3), which is the arrangement pattern of the bumps 73 (or the nozzles 72) determined in accordance with FIG. Thus, a position where the surface tension of the droplet 76 is minimized at such a position may be used. Thereby, the lyophilicity between the droplet and the pad part 32 toward the virtual positioning line shown in FIG. 5 (in the case where the passivation part 34 is provided, the lyophilicity of the pad part 32 and the lyophobic property of the passivation part 34). (Alternatively, when the bump part 73 is disposed on the lower surface, the lyophilicity of the bump part 73 will act), thereby achieving a precise alignment.

  FIG. 6 is a conceptual cross-sectional view for explaining the alignment adjustment in a cross-sectional manner. Here, a case is shown in which the chip 3 has a plurality of protrusions (pads) 32 on which a plurality of chips 3 are arranged and does not have a passivation part 34 surrounding the protrusions (pads (a) to (c)). . In the same figure, (a) to (c) are mainly stages before the pickup operation ((a) is a perspective view of an arrangement position pattern (first pattern) of the protrusion (pad) portion 32 of the chip 3, and (b) is A (C) is a cross-sectional view taken along the line A-A), and (d-1) is an adsorption stage by the first droplet 26 immediately after the chip 3 is picked up, (d-2). ) Shows a stage where the transfer mechanism 40 lowers the target chip 3 toward the place where the mounted chips are already stacked in the vicinity of the mount desired position while maintaining the pickup adsorption, and (e) shows the stage (d-2). ) In the stage immediately before the adsorption by the droplet 76 at the mount point related to the enlarged portion of the peripheral area of the projection (pad) portion 32 surrounded by the dotted line circumference in (), (f) is the projection (pat) portion 32 by the droplet 76. Moved by the surface tension of the droplet 76 immediately after the adsorption of the liquid In (g), the protrusion (pad) portion 32 is moved by the surface tension of the droplet 76, and after the desired number of chips are stacked (not shown), the surface tension of the droplet 76 is reduced by some means. The stage where the protrusion (pad) portion 32 and the chip 3 are stacked and stably arranged at the target mounting position is shown respectively (however, in (g), only two of the multilayers are shown). ).

  First, the pickup device 20 descends toward the chip 3 waiting in the state (a) to (c) of FIG. 2 (at the mount source position), and the pickup nozzle 20A reaches a position sufficiently close to the upper surface of the chip 3. Drops, the droplet 26 is ejected and suspended from the pickup nozzle 20A. When the droplet 26 comes into contact with the chip 3, the surface tension of the droplet 26 causes an adsorption force to act on the upper surface of the chip 3, so that the chip 3 Picked up ((d-1) in the figure). In the following description of FIG. 6, the portion surrounded by the dotted line circumference in FIG.

  Next, in a state where the picked-up state is maintained, the transport mechanism 40 transports / moves the pick-up device 20 (and the chip 3 adsorbed to the tip) to or near the mount desired position (not shown). Specifically, after the chip 3 is attracted, the pickup device 20 is moved upward and horizontally and stepwise or simultaneously.

  When the pickup device 20 (and the chip 3 adsorbed to the tip) arrives at substantially the top of the mount position (temporary position: in the vicinity of the exact mount target position), the transport mechanism 40 stops the horizontal movement, The descent starts toward the mount destination position ((d-2) in the figure).

  On the other hand, the second droplet squirting mechanism 70 removes the second droplet 76 from the tip 74 of the tip through the syringe 72 until the transport mechanism 40 has sufficiently lowered the protrusion (pad) portion 32 of the chip 3. On the bump portion 73 exposed on the upper surface of the stacked chip 3 (alternatively, when the bump portion 73 is on the lower surface, it is made on the pad portion 32: not shown) (FIG. 4E).

  When the transport mechanism 40 further lowers the protrusion (pad) portion 32 (of the chip 3), the second droplet 76 contacts the lower surface of the protrusion (pad) portion 32. At this time, since the second droplets 76 are set at four locations, the suction force is about four times as strong as that when the droplets are single. Therefore, it is possible to overcome the adsorption force by the first droplet 26 and peel off the protrusion (pad) portion 32 (and thus the chip 3) on the mount destination side (73 side in the figure, ie, the lower side). In this case, alternatively, the second droplet 76 is made of a material having a relatively large surface tension, and the first droplet 26 is heated and evaporated by the heating mechanism 50 to adsorb the pickup droplet 26. A method of spraying a force, a method of spraying an adsorption force for pickup by depressurizing a certain range around the first droplet 26 by the decompression mechanism 60 and promoting the evaporation of the first droplet 26 (not shown) ) A method of removing the suction force by ejecting the wind force from the wind power generation mechanism and removing the droplets 26 may be used alternatively or in combination, and the present invention is technical in all cases. It is included as an idea.

  When the pick-up suction of the chip 3 is released in this way and the protrusion (pad) portion 32 is only sucked by the second droplet 76, the surface tension of the droplet 76 acts almost instantaneously. That is, due to the lyophilicity of the lower surface of the protrusion (pad) portion 32 with respect to the droplet 76, a force acts in a direction that minimizes the surface tension, and the protrusion (pat) portion 32 moves instantaneously. (Figure (f)). In other words, from the position temporarily placed near the correct and precise mounting position (temporary position, that is, the “C” position in FIG. 5F), the position where the surface tension is minimized (main position, that is, the figure). The force to move to (D) position (f) acts. As a result, the droplet 76 can be moved to an accurate position of the mount by the surface tension of the droplet 76.

  In this case, a configuration in which the passivation portion 34 is further provided around the pad portion 32 as described above may be used. In this configuration, as described above, the mount droplet 76 may be removed. As a result, the force that tries to adsorb to the protrusion (pad) portion 32 and the force to move away from the passivation portion 34 work, so that the technical idea of the present application of alignment using the surface tension of the droplets can be achieved more efficiently. Will be.

  Next, in FIG. 6 (f), the protrusion (pad) portion 32 thus moved to a precise position, and thus the position of the chip 3 is fixed by a fixing device (not shown), and this fixed position is temporarily held. The above stacking operation is repeated for the desired number of chips. While the desired number of chips are stacked and each chip is temporarily fixed at an accurate and precise position by the second droplet 76, the adsorption force of the second droplet 76 is removed by any of the means described above. To do. Accordingly, the protrusion (pad) portion 32, and thus the chip 3, is mounted at a proper and precise mounting position, and a series of (pickup,) alignment and mounting operations are completed ((g) in the figure).

  FIG. 7 is a view for explaining the operation of FIG. 6 in cross section. The explanation for this figure will be changed as described above.

  As described above in detail, according to the chip mounting apparatus of the present application, a small piece (for example, a semiconductor chip) picked up using the pickup droplet (first droplet) and moved by the transport mechanism is used as the mount destination. When mounting, a small piece is placed at a temporary position on a mounting droplet (second droplet) springed out from a plurality of syringes through a needle onto a bump or pad (alternatively, a mounting surface nozzle). The pad or bump on the bottom surface of the small piece to be mounted is formed and arranged along the first pattern in which a plurality of points including at least three points that are not on the same straight line are arranged, and the bump or pad that is the mounting destination (alternative The nozzle) is formed and arranged along the second pattern having an arrangement corresponding to the first pattern, so that a small piece is temporarily placed on the mounting droplet (second droplet). The lyophilicity to the mounting droplets of the pads or bumps placed on the lower surface of the small piece at the same time (alternatively, if the chip also has a passivation part, the lyophilicity of the pad part) In addition, due to the liquid repellency of the passivation portion, a force acts on the mount droplet in a direction that minimizes the surface tension. Therefore, it is possible to specify the direction of the surface tension force of the droplet by two axes that can define a plane coordinate position that is not parallel, thereby temporarily placing the liquid crystal in a place (temporary position) that is deviated from the original mount position. Even so, it is possible to automatically move the small pieces to the original location with a precision of several microns using the surface tension of the droplets.

  In other words, by forming the first pattern and the second pattern in advance at a precise level, the direction of the surface tension acting when the small piece is placed on the mount droplet is controlled in a plane coordinate. be able to. In addition, since there are a plurality of such mounting droplets, the suction force of the chip by the mounting droplets is increased as compared to the case of a single droplet. It becomes easy to peel off the mount target chip. At this time, for example, the surface tension of the mounting droplet is set to be larger than the surface tension of the pickup droplet, the pickup droplet is heated and evaporated by a heating device, the pressure around the pickup droplet is reduced, etc. It may be configured to be used selectively or in combination. In the case of such a configuration, since the surface tension of the mounting droplet at the desired mounting destination is superior to the surface tension of the pickup droplet (or because the surface tension of the pickup droplet is scattered), the pickup The chip that has been removed is scraped off from the pickup droplet and released at the mounting droplet site, which is the desired mounting destination. It does not cause warping or breakage and can be easily performed. Thereby, the mounting operation at the mounting target position can be completed stably and reliably.

  Therefore, it is possible to precisely control a desired alignment operation when the picked-up piece is transported to a desired position and mounted. Therefore, even when picking up an extremely thin chip that is warped or damaged by vacuum suction, it prevents excessive stress from being generated on the chip, and warps or breaks the chip. This makes it possible to mount with precise alignment.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

  Moreover, what was mentioned above only showed an example of embodiment for embodying the technical idea which concerns on this application, and the technical idea which concerns on this application is applicable also to other embodiment.

  Furthermore, even if an apparatus, a method, and a system that are produced using the invention of the present application are listed as a secondary product and commercialized, the value of the invention of the present application is not reduced at all.

  According to the chip mounting apparatus and the chip mounting method according to the present invention, not only the picking up and releasing of the small pieces are performed by using the surface tension of water or other liquid, but also the mounting operation of the small pieces. Bumps or pads having lyophilicity with such droplets are arranged in advance along the first pattern and the second pattern having at least three points taken on the coordinates of two axes on the plane (in some cases, further The surface tension is minimized by placing a liquid-repellent passivation portion around the pad and precisely matching (for example, matching) the first pattern and the second pattern in advance. It is possible to perform control so that the movement caused by the movement in a certain direction is converged to a precise planar position set in advance by a pattern. This makes it possible to precisely control alignment during mounting using the surface tension of the droplets of the small pieces. Therefore, in the manufacturing industry of semiconductor chips in which ultra-thin chips are stacked, precise manufacturing that prevents warping and breakage of the chips is possible, and this effect is not limited to the semiconductor manufacturing industry, but also in the information industry, electrical appliance industry, etc. It is extremely beneficial for all industries that manufacture and use secondary products using semiconductors.

1 is a configuration conceptual diagram showing an overall schematic configuration of a chip mount device according to an embodiment of the present invention. It is the conceptual cross-section which showed the partial cross section about an example of a structure of the semiconductor chip 3 which concerns on this application. The 1st pattern which is the arrangement position pattern of the processus | protrusion (pad) part 32 which concerns on one Embodiment of this invention, and the 2nd pattern which is the arrangement position pattern of the bump part 73 (alternatively, the nozzle 72) are roughly shown. It is explanatory drawing shown. It is a conceptual diagram for demonstrating operation | movement of the chip mounting apparatus 1 which concerns on one Embodiment of this invention, Comprising: The figure which showed the operation | movement from pick-up before chip | tip pick-up, to pick-up, alignment, and completion of mounting in time series. It is. It is a top view which showed the concept which makes the 1st pattern and 2nd pattern which correspond to a droplet mount and arrangement position for performing the precise control of the alignment at the time of mounting of the chip | tip 3 which concerns on this embodiment match. It is a conceptual diagram for demonstrating operation | movement of the chip mounting apparatus 1 which concerns on one Embodiment of this invention, Comprising: The figure which showed the operation | movement from pick-up before chip | tip pick-up, to pick-up, alignment, and completion of mounting in time series. It is. It is a section conceptual diagram for explaining the state of alignment adjustment concerning one embodiment of the present invention in a section.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip mount apparatus 3 Chip 7 Mount target location 10 Whole control part 20 Pickup apparatus 20A Pickup nozzle 22 1st droplet generation mechanism 24 1st droplet suspension mechanism 26 1st droplet 32 Protrusion (pad) part 34 Passivation Portion 40 Transport mechanism 50 Heating mechanism 60 Depressurization mechanism 70 Second droplet squirting mechanism 72 Syringe 73 Nozzle 74 Needle 76 Second droplet

Claims (16)

A chip having bumps arranged at predetermined positions including at least three points not on the same straight line on the surface and pads on the back surface arranged at least three points (first pattern) not on the same straight line. In the stacking mounting device,
A first droplet adsorbing mechanism for adsorbing a back surface of a chip to be mounted located at a transfer source position with a first droplet;
A moving mechanism for moving the chip adsorbed by the first droplet from the conveyance source position to the conveyance destination position while maintaining the adsorption state;
At the transport destination position, the second droplet is applied on the pad arranged along the first pattern on the back surface of the already stacked chip or on the nozzle arranged along the first pattern on the mount location. A second drop spill mechanism that hangs;
A chip to be mounted that has bumps arranged on the front surface along the second pattern corresponding to the first pattern is lowered by facing down the surface toward the back surface of the stacked chip. A mechanism in which the pad and the bump are held at a position where the surface tension of the second droplet is stabilized via the second droplet;
And a removing mechanism that removes the second droplet when a desired number of stacked chips are stacked. There are bumps arranged on the surface at least three points (first pattern) that are not collinear, and at least three points that are not collinear at the second pattern position corresponding to the first pattern. In a mounting apparatus for stacking chips to be mounted having a placed pad on the back surface,
A first droplet adsorbing mechanism for adsorbing the surface of the chip to be mounted located at the transfer source position with the first droplet;
A moving mechanism for moving the chip adsorbed by the first droplet from the conveyance source position to the conveyance destination position while maintaining the adsorption state;
At the transport destination position, the second droplet is applied onto the bumps arranged along the first pattern on the surface of the already stacked chip or the nozzles arranged along the first pattern on the mount location. A second drop spill mechanism that hangs;
A chip to be mounted that has a pad disposed on the back surface along the second pattern is lowered toward the surface of the stacked chip with the back surface facing downward, and the corresponding bump and pad are A mechanism for holding at a position where the surface tension of the second droplet is stabilized via two droplets;
And a removing mechanism that removes the second droplet when a desired number of stacked chips are stacked.   The mounting apparatus according to claim 1, wherein the pad and the bump have lyophilicity with respect to the second droplet.   4. The mounting device according to claim 1, wherein the chip further includes a passivation layer having liquid repellency with respect to the second droplet around the pad disposed on the back surface thereof. 5. .   The mounting apparatus according to claim 1, further comprising a heating device that heats at least one of the first droplet and the second droplet.   The mounting apparatus according to claim 1, further comprising a decompression unit configured to decompress at least one of the first droplet and the second droplet.   5. The total sum of the surface tensions of the second droplets for mounting is larger than the sum of the surface tensions of the first droplets for pick-up. Mount device. The mounting apparatus according to claim 1 or 2,
Two electrodes insulated from each other for controlling the first droplet by EWOD (Electrowetting on Dielectric) are installed in the first droplet adsorption mechanism, and / or
2. A mounting device, wherein two electrodes insulated from each other for controlling the second droplet by EWOD (Electrowetting on Dielectric) are installed on the bump, pad, or nozzle. Mount target having bumps arranged on the surface including at least three points not in the same straight line on the surface, and pads placed on the back surface in at least three points (first pattern) positions not in the same straight line The chip is adsorbed by the first droplet with the back side up,
Keeping the state of being adsorbed by the first droplet, moving the mount target chip to the transport destination position;
On the pad arranged along the first pattern of the stacked chips already laminated with the back surface up at the transport destination position, or on the nozzle arranged along the first pattern on the mount location. Drop two drops,
The mount target chip is lowered from the vicinity of the transport destination position toward the stacked chip, and the bumps on the lower surface of the mount target chip arranged along the second pattern corresponding to the first pattern are the second Stops the descent when adsorbed to the droplet,
Holding the chip to be mounted at a position where the surface tension of the second droplet is stabilized,
A mounting method comprising: removing the second droplet when a mount target chip is stacked in a desired number of layers. There are bumps arranged on the surface at least three points (first pattern) that are not collinear, and at least three points that are not collinear at the second pattern position corresponding to the first pattern. A chip to be mounted having a placed pad on the back side is adsorbed by the first droplet with the front side facing up,
Keeping the state of being adsorbed by the first droplet, moving the mount target chip to the transport destination position;
First, on the bumps arranged along the first pattern of the stacked chip already laminated with the surface facing up at the transport destination position or on the nozzle arranged along the first pattern on the mount location. Drop two drops,
When the mount target chip is lowered from the vicinity of the transfer destination position toward the stacked chip, and a pad on the lower surface of the mount target chip arranged along the second pattern is adsorbed to the second droplet Stop descent,
Holding the mount target chip at a position where the surface tension of the second droplet is stabilized;
A mounting method comprising: removing the second droplet when a mount target chip is stacked in a desired number of layers.   11. The mounting method according to claim 9, wherein the pad and the bump have lyophilicity with respect to the second droplet.   12. The mounting method according to claim 9, wherein the chip further includes a passivation layer having liquid repellency with respect to the second droplet around the pad disposed on the back surface thereof. .   The mounting method according to claim 9 or 10, wherein at least one of the first droplet and the second droplet is further heated.   The mounting method according to claim 9 or 10, wherein a pressure is reduced on at least one of the first droplet and the second droplet.   13. The total sum of the surface tensions of the second droplets for mounting is larger than the sum of the surface tensions of the first droplets for pick-up. Mounting method. The mounting method according to claim 9 or 10,
EWOD (Electrowetting on Dielectric) control is given to the first droplet by two electrodes insulated from each other installed in the first droplet adsorption mechanism, and / or
A mounting method, wherein the second droplet is controlled by EWOD (Electrowetting on Dielectric) by two electrodes insulated from each other on the bump or pad or nozzle.

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