JP2008224576A - Sample processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sample processing apparatus for efficiently implementing processes by successively implementing the process for a sample substrate from which one sample piece is cut and a process for the other sample piece held by a sample piece holding tool. <P>SOLUTION: The sample processing apparatus 1 comprises: a sample chamber 2; an ion beam irradiating means 4 connected to the sample chamber 2; a stage 17 disposed within the sample chamber 2; and a movement mechanism 10 for moving the stage 17. A sample substrate supporting means 8 and a sample piece holding means 6 are detachably placed on the stage 17. The sample substrate 7 supported by the sample substrate supporting means 8 on the stage 17 or the sample piece 5 held by the sample piece holding means 6 can be positioned on an optical axis of the ion beam irradiating means 4. The sample substrate 7 or the sample piece 5 can be processed by irradiating the sample substrate 7 or the sample piece 5 with an ion beam from the ion beam irradiating means 4. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a sample processing apparatus for creating a sample piece to be observed in an observation apparatus such as a transmission electron microscope.

  In many cases, a sample to be observed in an observation apparatus such as a transmission electron microscope (hereinafter referred to as “TEM”) is cut out from a sample substrate that is an original sample. In this case, a sample substrate is shaved with an ion beam using a sample processing apparatus provided with an ion beam irradiation means, and the sample piece shaved out is used as an observation target (observation sample) in the observation apparatus.

  A schematic configuration of the sample processing apparatus in the sample chamber is shown in FIG. In the drawing, a focused ion beam (FIB) is irradiated onto a sample substrate 104 from an ion beam column 101 serving as an ion beam irradiation means via an objective lens 101a constituting the ion beam column 101. . Here, the objective lens 101 a is disposed at the tip of the ion beam column 101 and is disposed so as to face the sample substrate 104. The tip of the objective lens 101 a is located in the sample chamber 100. Further, when the sample substrate 104 is irradiated with FIB, the atmosphere in the sample chamber 100 is evacuated to a predetermined degree of vacuum.

  The sample substrate 104 is placed on a support base 105 in the sample chamber 100. The support base 105 is disposed on a moving stage (not shown). By driving this moving stage, the support base 105 moves in the X, Y, and Z directions together with the sample substrate 104.

  In the sample substrate 104, the portion irradiated with the FIB from the ion beam column 101 is scraped off. Thereby, the sample substrate 104 is processed.

  Here, FIG. 2 shows an arrangement state of the sample substrate 104 on the support base 105. FIG. 2 corresponds to a view of the arrangement state of the sample substrate 104 on the support base 105 shown in FIG. 1 as viewed from above.

  When the sample piece is cut out from the sample substrate 104 using the sample processing apparatus having such a configuration, the following method is performed.

  FIB is irradiated to a contour portion (contour portion) of a portion to be cut out as a sample piece (a portion to be a sample piece) on the sample substrate 104. At this time, the FIB is appropriately deflected by a deflector (not shown) provided in the ion beam column 101. Further, the sample substrate 104 is moved by driving the moving stage as necessary. As a result, the outline of the sample substrate 104 irradiated with the FIB is scraped off, and a sample piece is formed on the sample substrate 104.

  The sample substrate 104 having the sample piece formed by cutting the contour portion in this way is taken out of the sample chamber 100 with the sample piece provided. As shown in FIG. 3, the sample piece 104a formed on the sample substrate 104 is moved away from the sample substrate 104 by a microhand device (manipulator) or the like (not shown) outside the sample chamber to hold the sample piece. It is held on the sample holding surface 102 a of the tool 102.

  Here, the sample piece holder 102 constitutes a sample holder used in the TEM, and the sample piece 104a held by the sample piece holder 102 is an observation target in the TEM observation. Note that the cut-out surface 104b of the sample piece 104a cut out from the sample substrate 104 in this way (the surface exposed by being cut by the irradiation of the ion beam) 104b is usually a surface to be observed in TEM observation.

  As a technique for creating a sample piece using the FIB in this way, there is a technique described in Patent Document 1, for example.

Japanese Patent Laid-Open No. 11-223588

  When creating a sample for TEM observation using a sample processing apparatus as shown in FIG. 1, a sample piece is cut out from a sample substrate in the sample chamber of the sample processing apparatus, and then the sample is removed from the sample substrate outside the sample chamber. The pieces are separated and moved and are held by the sample piece holder, whereby the sample piece held by the sample piece holder is an observation target (observation sample) in TEM observation.

  At this time, the sample piece held by the sample piece holder may be reworked such as further reducing the thickness for TEM observation.

  In this case, the sample piece holder holding the sample piece is disposed in the sample chamber of the sample processing apparatus, and the sample piece is reprocessed in the sample chamber while being held by the sample piece holder. Become.

  Here, a plurality of types of sample pieces are prepared by cutting sample pieces from different sample substrates, and a plurality of sample piece holders corresponding to these sample pieces are prepared, and each of the plurality of sample pieces is individually provided. The sample pieces held by the respective sample piece holders are sequentially subjected to TEM observation. As described above, the above-described sample piece may be re-processed for each sample piece that has been cut out from different sample substrates and individually held by the sample holder.

  In such a case, in the conventional sample processing apparatus, only one of the sample substrate or the sample piece to be processed (the sample piece is held by the sample holder) can be arranged in the sample chamber. Because of this configuration, for example, the sample substrate from which one sample piece is cut out and the other sample piece held by the sample piece holder cannot be placed in the sample chamber at the same time.

  For this reason, after finishing the process of scraping one sample piece from the sample substrate placed in the sample chamber in a vacuum atmosphere, the sample chamber is once returned to the atmospheric pressure state, and then the sample substrate is removed from the sample chamber. It was necessary to remove and place another sample piece (held by the sample piece holder) in the sample chamber, and to process the other sample piece after the atmosphere in the sample chamber was evacuated. .

  In this case, when the processing of the sample substrate from which one sample piece is cut out is completed and the process proceeds to processing of another sample piece (held by the sample piece holder), the inside of the sample chamber is once brought into a vacuum state. Return to the atmospheric pressure state, take out the sample substrate from the sample chamber and place the sample piece, and then evacuate the sample chamber to make it a vacuum state. In processing these sample substrate and sample piece, The processing process of the sample substrate and the sample piece could not be performed efficiently.

  The present invention has been made in view of such points, and when performing processing of a sample substrate from which one sample piece is cut out and processing of another sample piece held by a sample piece holder. An object of the present invention is to provide a sample processing apparatus capable of continuously and efficiently performing these processing steps.

  A sample processing apparatus according to the present invention includes a sample chamber, an ion beam irradiation means connected to the sample chamber, a stage disposed in the sample chamber, and a moving mechanism for moving the stage. The sample substrate support means and the sample piece holding means can be detachably mounted, and the sample held by the sample substrate support means on the stage or the sample held by the sample piece holding means by moving the stage by the moving mechanism The piece can be positioned on the optical axis of the ion beam irradiation means, and the sample substrate or sample piece can be processed by irradiating the sample substrate or sample piece with the ion beam from the ion beam irradiation means. And

  In the present invention, the sample substrate support means and the sample piece holding means can be detachably mounted on the stage disposed in the sample chamber of the sample processing apparatus, and the stage is supported by moving the stage by the moving mechanism. The sample substrate supported by the means or the sample piece held by the sample piece holding means can be positioned on the optical axis of the ion beam irradiation means. The sample substrate or sample piece can be processed by irradiating the sample substrate or sample piece with the ion beam from the ion beam irradiation means.

  Thereby, the sample substrate and the sample piece can be simultaneously arranged on the stage in the sample chamber via the sample substrate support means and the sample piece holding means. Therefore, the sample substrate from which one sample piece is shaved and the other sample piece can be simultaneously arranged in the sample chamber, and after the processing of the sample substrate is completed, the atmosphere in the sample chamber is returned to atmospheric pressure. It is possible to proceed to the processing of the sample piece without changing the vacuum atmosphere.

  As a result, when processing the sample substrate from which one sample piece is cut out and processing of another sample piece, the atmosphere in the sample chamber must be returned to atmospheric pressure and then the sample must be replaced and then evacuated. These processes can be performed continuously and efficiently.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 4 is a schematic configuration diagram showing a sample processing apparatus according to the present invention.

  In the figure, an electron optical column 3 is placed on the upper part of a sample chamber 2 constituting the sample processing apparatus 1. The electron optical column 3 is for irradiating the sample substrate 7 or the sample piece 5 arranged in the sample chamber 2 with an electron beam. Here, an objective lens 3 a is disposed at the tip of the electron optical column 3.

  A moving stage mechanism (moving mechanism) 10 is provided in the sample chamber 2. The moving stage mechanism 10 includes a Z-direction driving unit 11, an inclination driving unit 12 supported by the Z-direction driving unit 11, and a moving stage unit 10 a mounted on the inclination driving unit 12.

  The Z direction driving means 11 is disposed on the inner side surface of the sample chamber 2, and coarsely moves (roughly moves) the tilt driving means 12 in the Z direction (vertical direction). Moreover, the moving stage means 10 a is placed on the tilt driving means 12. The tilt driving means 12 can tilt the moving stage means 10a by a predetermined angle.

  The moving stage means 10a placed on the tilt driving means 12 is composed of an X-direction driving unit 13, a Y-direction driving unit 14, a Z-direction driving unit 15 and a rotation driving unit 16, and each of the driving units 13 to 16 has a lower side. It is placed so as to overlap in this order from the top to the top. The rotation drive unit 16 positioned at the top includes a base 16a and rotates the base 16a. A stage 17 is placed on the base 16a. Further, the X direction driving unit 13 is placed on the tilt driving means 12. With this configuration, the stage 17 is moved by the moving stage mechanism 10.

  The X direction drive unit 13 is for moving the uppermost base 16a in the X direction. The Y direction driving unit 14 is for moving the base 16a in the Y direction. Here, the X direction and the Y direction are orthogonal to the Z direction and orthogonal to each other, and the XY plane is a horizontal plane orthogonal to the Z direction.

  The Z direction driving unit 15 is for finely moving (finely moving) the base 16a in the Z direction. The rotation drive unit 16 rotates the base 16a at a predetermined angle. As the base 16a moves, tilts, and rotates, the stage 17 is similarly moved.

  On the stage 17, a holding means (sample piece holding means) 6 and a substrate support means (sample substrate support means) 8 are detachably mounted. The substrate support means 8 is for supporting the sample substrate 7 serving as the original sample in the sample chamber 2. One sample piece is cut out from the sample substrate 7.

  The holding means 6 holds a holder (sample piece holder) 6a holding a sample piece (other sample piece) 5 cut out from another sample substrate (not shown). As the stage 17 moves, the holding means 6 and the substrate support means 8 also move.

  An ion beam irradiation means 4 is provided so as to communicate with the sample chamber 2. From this ion beam irradiation means 4, a focused ion beam (FIB) is irradiated onto the sample substrate 7 or the sample piece 5. In the sample substrate 7 or the sample piece 5, the portion irradiated with the FIB is etched and the portion is scraped off.

  Further, a secondary electron detector (not shown) is provided in the sample chamber 2. The secondary electron detector detects secondary electrons generated from the sample substrate 7 or the sample piece 5 based on the irradiation of the electron beam.

  The secondary electron detector outputs a detection signal based on detection of the secondary electrons. Based on the output detection signal, image forming means (not shown) arranged outside the sample chamber 2 forms image data. This image data is sent to a display device (not shown). The display device displays an image based on the image data.

  An exchange rod 9 is installed in the sample chamber 2. The tip 9a of the exchange rod 9 moves between the inside and the outside of the sample chamber 2 to arrange and replace the holding means 6 and the substrate support means 8 in the sample chamber 2. As a result, the holding means 6 and the substrate support means 8 are detachably mounted on the stage 17 in the sample chamber 2.

  Here, an enlarged view of the holding means 6 and the substrate support means 8 placed on the stage 17 is shown in FIG. As shown in the figure, the holding means 6 includes a support portion 33 that supports the holder 6a, a main body portion 32, and the like. The sample piece 5 is held by the holder 6a. A sample substrate 7 is supported by the substrate support means 8.

  A groove 17 b is formed on the lower surface of the stage 17. The groove portion 17b is engaged with the base 16a of the moving stage portion 10a. Thereby, the stage 17 is fixed on the base 16a.

  Further, FIG. 6 shows an arrangement relationship between the holding means 6 (holding the holding tool 6 a holding the sample piece 5) and the substrate support means 8 (supporting the sample substrate 7) on the stage 17. FIG. 6 corresponds to a diagram in which the arrangement relation on the stage 17 shown in FIG. 5 is viewed from above.

  As shown in the figure, a groove (groove) 15 is formed on the upper surface 17 c of the stage 17. The holding means 6 and the substrate support means 8 are detachably mounted on the upper surface 17 c of the stage 17 so as to engage with the groove 15.

  Here, a placement method when placing the holding means 6 and the substrate support means 8 on the stage 17 in the sample chamber 2 will be described with reference to FIGS. In these drawings, the sample piece 5 held by the holder 6a is not shown.

  In FIG. 7, the stage 17 is placed on a base 16a (in FIGS. 7 to 12, it is hidden by the stage 17 and the outline of the base 16a is not shown). The extending direction of the groove 15 formed in the stage 17 is made to coincide with the moving direction of the exchange rod 9. Then, the substrate support means 8 (the sample substrate 7 is supported on the upper surface) attached to the tip of the exchange rod 9 outside the sample chamber 2 is operated in the sample chamber 2 by operating the exchange rod 9. Introduce. At this time, the inside of the sample chamber 2 is in an atmospheric pressure atmosphere, and the substrate support means 8 is introduced into the sample chamber 2 via an open / close valve (not shown) provided in the sample chamber 2.

  In the figure, 21 is a lever means to be described later, and this lever means 21 is installed in the sample chamber 2. The stage 17 is formed with a screw hole 17c for engagement which will be described later.

  By operating the exchange rod 9 to further advance the exchange rod 9, the substrate support means 8 shown in FIG. 7 is engaged with one end of the groove 15 of the stage 17. Thereafter, the attachment of the substrate support means 8 to the exchange rod 9 is released, and the exchange rod 9 is retracted from the sample chamber 2 (see FIG. 8). As a result, the substrate support means 8 is detachably engaged with and mounted on the groove portion 15 of the stage 17.

  Thereafter, in the sample chamber 2, the base 16 a is rotated 180 ° by the rotation driving unit 16. The holding means 6 (holding the holding tool 6a holding the sample piece 5) attached to the tip of the exchange rod 9 outside the sample chamber 2 is opened and closed by operating the exchange rod 9. It introduce | transduces in the sample chamber 2 through a valve | bulb (refer FIG. 9).

  Then, by further moving the exchange rod 9 forward, the holding means 6 engages with the other end of the groove 15 of the stage 17. Thereafter, the attachment of the holding means 6 to the exchange rod 9 is released, and the exchange rod 9 is retracted from the sample chamber 2 (see FIG. 10). Thereby, the holding means 6 is detachably engaged with and placed on the groove portion 15 of the stage 17.

  Thereafter, in the sample chamber 2, the base 16a is rotated by 90 ° (counterclockwise in the figure) by the rotation drive unit 16 (see FIG. 11).

  Then, by operating the lever means 21, the lever means 21 rotates and engages with the engagement pin 22 provided on the holding means 6, thereby moving the engagement pin 22. Due to the movement of the engagement pin 22, the holder 6a rotates 90 ° (see FIG. 12).

  The rotation operation of the holder 6a at this time will be described with reference to FIGS. Here, FIG. 13 (A) corresponds to a view of the holding means 6 shown in FIG. 11 as viewed in the direction of arrow A in FIG. 11, and FIG. 13 (B) shows the holding means 6 shown in FIG. This corresponds to the view seen in the direction of arrow B. 14A corresponds to a view of the holding means 6 shown in FIG. 12 as viewed in the direction of the arrow A in FIG. 14, and FIG. 14B shows the holding means 6 shown in FIG. This corresponds to the view seen in the B direction. 13 and 14, the lever means 22 is not shown.

  First, as shown in FIGS. 13 and 14, the holding means 6 includes a holding tool 6a and a support portion 33 that supports the holding tool 6a. ) And FIG. 14 (A)).

  Further, the holding means 6 is provided on two guide plates 28, 29 disposed opposite to each other, a spring spring 23 disposed between the guide plates 28, 29, and an outer surface of the guide plate 28. Engagement pins 22 and the like are provided, and these are arranged on the right side in the drawings (FIGS. 13A and 14A) with respect to the main body portion 32.

  The two guide plates 28 and 29 are opposed to each other with the spring spring 23 interposed therebetween, and are fixed by screws 30 and 31. One end of the spring spring 23 is attached to the guide plate 29 by a screw 27. The other end of the spring spring 23 is attached to the side surface of the main body 32 via a fixing pin 26. The fixing pin 26 is fixed to the main body portion 32.

  The main body portion 32 is provided with a rotatable shaft 25 penetrating therethrough. A support portion 33 is attached to one end of the shaft 25. A guide plate 29 located on the inner side (main body side) is attached to the other end of the shaft 25.

  The guide plate 29 is formed with a cutout portion 24 having an arc shape (an arc having a central angle of about 90 °). The notch 24 is engaged with the fixing pin 26. Here, in the holding means 6 shown in FIG. 13, one end of the notch 24 is in contact with the fixing pin 26.

  In order to rotate the holder 6a of the holding means 6 having such a configuration, the lever means 21 is engaged with the engaging pin 22 of the holding means 6a from the state shown in FIG. Do. As the engaging pin 22 moves, the guide plates 28 and 29 rotate. At this time, the other end of the notch 23 formed in one guide plate 28 comes into contact with the fixing pin 26.

  As a result, the guide plates 28 and 29 rotate 90 ° together with the shaft 25. As the shaft 25 rotates, the support portion 33 and the holder 6a also rotate 90 °.

  Here, the state of the holding means 6 before the rotation is shown in FIGS. 11 and 13, and the state of the holding means 6 after the rotation is shown in FIGS. 12 and 14. In order to shift (return) from the state of the holding means 6 shown in FIGS. 12 and 14 to the state of the holding means 6 shown in FIGS. 11 and 13, the lever means 21 is operated in the reverse direction to hold the holding means 6. The engagement pin 22 may be moved in the reverse direction.

  Here, in the state of the holding means 6 shown in FIGS. 11 and 13, the sample placement surface 61 (see FIG. 14) of the holder 6a is a surface along the vertical plane, and FIGS. In the state of the holding means 6 shown in Fig. 1, the sample placement surface 61 of the holder 6a is a surface along the horizontal plane.

  In the above description, the example in which the substrate support means 8 and the holding means 6 are sequentially arranged on the stage 17 placed on the base 16a in the sample chamber 2 has been described. A stage 17 on which the sample substrate (supporting the sample substrate) and the holding means 6 (holding the holder 6a holding the sample piece 5) are placed is placed outside the sample chamber 2, In this state, the stage 17 may be moved into the sample chamber 2 and placed on the base 16a.

  That is, outside the sample chamber 2, the tip of the exchange rod 9 is engaged with the screw hole 17c of the stage 17 to fix the stage 17 to the tip of the exchange rod 9, and then the exchange rod 9 is operated to operate the stage. 17 is moved from outside the sample chamber 2 into the sample chamber 2 (see FIG. 15). Then, the stage 17 is detachably mounted on the base 16a so that the groove 17b formed on the lower surface of the stage 17 is engaged with the convex portion 16b provided on the base 16a.

  After placing the substrate support means 8 and the holding means 6 on the stage 17 in the sample chamber 2 by any one of the above methods, the open / close valve is closed and the sample chamber 2 is evacuated.

  Next, a method for processing the sample substrate 7 and the sample piece 5 arranged in the sample chamber 2 using the sample processing apparatus having the above-described configuration will be described.

  A substrate supporting means 8 (supporting the sample substrate 7) and a holding means 6 (holding the holding tool 6a holding the sample piece 5) are arranged on the stage 17 in the sample chamber 2, and the sample In a state where the chamber 2 is in a vacuum atmosphere, an electron beam is irradiated from the electron optical column 3 to the sample substrate 7 via the objective lens 3a. The electron beam is appropriately deflected by deflecting means provided in the electron optical column 3. As a result, the electron beam irradiated from the electron optical column 3 scans the sample substrate 7.

  Secondary electrons are generated from the sample substrate 7 irradiated with the electron beam. The secondary electrons are detected by a secondary electron detector installed in the sample chamber 2. The secondary electron detector outputs a detection signal based on the detected secondary electrons to the image forming unit. The image forming means forms image data based on the detection signal.

  At this time, since the electron beam scans the sample substrate 7, the image data becomes scanned image data. This scanned image data (the image data) is sent to the display means. The display means forms an image based on the scanned image data. This image becomes a scanning image (SEM image).

  An operator who operates the sample processing apparatus operates the moving stage mechanism 10 while confirming the scanning image of the sample substrate 7 displayed on the display device, and moves, tilts, and rotates the sample substrate 7 as necessary. Execute.

  The operator confirms the scanning image of the sample substrate 7 and searches for a portion (a portion to be a sample piece) to be cut out as an observation target in the sample substrate 7.

  After the operator searches for and determines the portion to be cut out, the contour (contour portion) of the portion on the sample substrate 7 is designated. Thereafter, irradiation of the electron beam onto the sample substrate 7 is stopped, and the ion beam is irradiated from the ion beam irradiation means 4 onto the contour portion on the sample substrate 7. At this time, the ion beam irradiated to the sample substrate 7 is deflected by a deflection unit (not shown), and the ion beam is irradiated along the contour portion on the sample substrate 7. At this time, the sample substrate 7 is located on the optical axis of the ion beam irradiation means 4.

  The contour portion irradiated with the ion beam is scraped off. As a result, in the sample substrate 7, the remaining part located inside the contour portion is cut out as a sample piece (one sample piece). Thereby, the processing of the sample substrate 7 from which one sample piece is cut out is completed.

  Subsequently, when processing the sample piece (other sample piece) 5 held by the holder 6 a held by the holding means 6, the stage 17 is moved by driving the moving stage mechanism 10. The sample piece 5 is positioned on the optical axis of the ion beam irradiation means 4. Here, the holder 6a and the holding means 6 are in the state shown in FIGS. The sample piece 5 is held on the sample mounting surface 61 of the holder 6a. At this time, the atmosphere in the sample chamber 2 is not returned to atmospheric pressure, and the vacuum atmosphere is maintained.

  Then, an ion beam is irradiated onto the sample piece 5 from the ion beam irradiation means 4. The ion beam is deflected by deflecting means provided with ion beam irradiating means, and scans the surface to be processed of the sample piece 5. Thereby, the to-be-processed surface of the sample piece 5 is shaved, and the sample piece 5 is processed.

  Here, when it is desired to observe (inspect) the processed surface of the sample piece 5 after the above processing, it is also possible to perform secondary electron image observation based on electron beam irradiation.

  In this case, the lever means 21 is engaged with the engaging pin 22 of the holding means 6, and the shaft 25 constituting the holding means 6 is rotated by 90 °. Thereby, the holder 6a and the sample piece 5 rotate 90 degrees. At this time, the operation is performed in the direction opposite to the operation direction of the lever means 21 described above.

  As a result, the holding means 6 is in the state shown in FIGS. Thereafter, if necessary, the moving stage means 10 is driven to move the stage 17 and the like, and the surface to be processed of the sample piece 5 is positioned on the optical axis of the electron beam irradiated from the electron optical column 3. Like that. An enlarged view of the holder 6a and the sample piece 5 in this state is shown in FIG. As shown in the figure, the processing surface 5a of the sample piece 5 is located on the optical axis of the electron beam 50 and is orthogonal to the optical axis (axis along the vertical direction).

  Thus, after making the processing surface 5a of the sample piece 5 orthogonal to the optical axis of the electron beam 50, the processing surface 5a is irradiated with the electron beam 50. In response to the irradiation with the electron beam 50, secondary electrons are generated from the processed surface 5 a of the sample piece 5. Secondary electrons generated thereby are detected by a secondary electron detector.

  The secondary electron detector outputs a detection signal based on detection of the secondary electrons. Based on the output detection signal, image forming means (not shown) arranged outside the sample chamber 2 forms image data. This image data is sent to a display device (not shown). The display device displays an image based on the image data.

Thus, the operator can visually inspect the processing surface 5a of the sample piece 5 by checking the image displayed on the display device. Here, the inspection of the processing surface 5a of the sample piece 5 is performed. As a result, if it is determined that further processing of the processing surface 5a is necessary, the processing surface 5a is irradiated with an ion beam using the ion beam irradiation means 4 as described above. That's fine. Even after irradiation of the ion beam, if the electron beam 50 is irradiated from the electron optical column 3, the processed surface 5a of the sample piece 5 after the ion beam irradiation can be reinspected.

  In the above example, when the inspection of the processing surface 5a of the sample piece 5 is performed, secondary electrons are used as a secondary signal obtained in response to the irradiation of the electron beam 50. However, the present invention is not limited to this. Never happen. As the secondary signal, a reflected electron or a transmitted electron may be used instead of or in addition to the secondary electron. At this time, it is necessary to install a reflected electron detector for detecting reflected electrons or a transmitted electron detector for detecting transmitted electrons in the sample chamber 2.

  Here, the sample processing apparatus 1 provided with the transmission electron detector 70 in the sample chamber 2 is shown in FIG. In the figure, a transmission electron detector 70 is provided in the sample chamber 2. The transmission electron detector 70 includes a fluorescent screen 71, a light guide plate 72, and a detection unit 73.

  Moreover, each drive part 13-16 and the inclination drive part 12 which comprise the movement stage means 10a are each formed with the hole (through-hole). These holes are located below the sample piece 5 held by the sample piece 5. The configuration of other parts in the sample processing apparatus 1 is the same as that of the sample processing apparatus 1 shown in FIG.

  When the sample piece 5 cut out from the sample substrate 7 is inspected using the sample processing apparatus 1 having such a configuration (see FIG. 18), the sample piece 5 held by the holder 6a is electronically attached. The sample piece 5 is irradiated with the electron beam 50 by the optical barrel 3.

  Through the irradiation of the electron beam 50, the transmitted electrons 50 a transmitted through the sample piece 5 pass through the holes formed in the driving units 13 to 16 and the inclined driving unit 12, and are transmitted to the phosphor screen 71 of the transmission electron detector 70. Incident.

  From the phosphor screen 71, fluorescence 50b is generated in response to irradiation with the transmitted electrons 50a. The fluorescence 50 b passes through the light guide plate 72 and reaches the detection unit 73. The detection unit 73 detects the fluorescence 50b. In this way, the transmission electron detector 70 detects the transmission electrons 50 a that are secondary signals from the sample piece 5.

  As described above, after the processing of the sample substrate 7 and the processing of the sample piece 5 are continuously performed in the sample chamber 2 in the vacuum atmosphere, the inside of the sample chamber 2 is returned to the atmospheric pressure atmosphere, and the exchange rod By the operation of 9, the sample substrate 7 and the sample piece 5 are taken out from the sample chamber 2 through the opening / closing valve.

  Thus, the sample processing apparatus 1 according to the present invention moves the sample chamber 2, the ion beam irradiation means 4 connected to the sample chamber 2, the stage 17 disposed in the sample chamber 2, and the stage 17. The sample substrate support means 8 and the sample piece holding means 6 can be detachably mounted on the stage 17, and the stage 17 is moved by the movement mechanism 10, so that the sample substrate on the stage 17 can be moved. The sample substrate 7 supported by the support means 8 or the sample piece 5 held by the sample piece holding means 6 via the sample piece holder 6a can be positioned on the optical axis of the ion beam irradiation means 4, and the ion beam The sample substrate 7 or the sample piece 5 can be processed by irradiating the sample substrate 7 or the sample piece 5 with the ion beam from the irradiation means 4.

  Here, the sample substrate support means 8 and the sample piece holding means 6 are engaged with a groove 15 formed in the stage 17, and the sample substrate support means 8 and the sample piece holding means 6 are attached and detached from the stage 17 in the same manner. This is done by operating the exchange rod 9.

  The stage 17 is detachably mounted on the moving mechanism 10, and the attachment / detachment of the sample substrate support means 8 and the sample piece holding means 6 from the stage 17 and the attachment / detachment of the stage 17 from the movement mechanism 10 are the same. This is performed by operating the exchange rod 9.

  Furthermore, an electron beam irradiation means 3 connected to the sample chamber 2 and a signal detection means for detecting at least a secondary signal generated from the sample piece 5 irradiated with the electron beam 50 from the electron beam irradiation means 3 are provided. When the sample piece 5 is rotated by the sample piece holding means 6, the electron beam 50 can be irradiated to a predetermined processed surface 5 a of the sample piece 5, and thereby the sample piece 5 corresponding to the processed surface 5 a can be irradiated. Secondary signals can be detected. At this time, secondary electrons, reflected electrons, or transmitted electrons can be used as secondary signals.

  Thus, in the present invention, the sample substrate support means 8 and the sample piece holding means 6 can be detachably placed on the stage 17 disposed in the sample chamber 2 of the sample processing apparatus 1, and the stage 17 is moved by the moving mechanism 10. By moving, the sample substrate 7 supported by the sample substrate support means 8 on the stage 17 or the sample piece 5 held by the sample piece holding means 6 can be positioned on the optical axis of the ion beam irradiation means 4. . Then, the sample substrate 7 or the sample piece 5 can be processed by irradiating the sample substrate 7 or the sample piece 5 with the ion beam from the ion beam irradiation means 4.

  Thereby, the sample substrate 7 and the sample piece 5 can be simultaneously disposed on the stage 17 in the sample chamber 2 via the sample substrate support means 8 and the sample piece holding means 6. Therefore, the sample substrate 7 from which one sample piece is shaved and the other sample piece 5 can be simultaneously arranged in the sample chamber 2, and after the processing of the sample substrate 7 is completed, It is possible to proceed to the processing of the sample piece 5 in the vacuum atmosphere without returning the atmosphere to atmospheric pressure.

  As a result, the processing of the sample substrate 7 from which one sample piece is cut out and the processing of the other sample piece 5 can be performed continuously, and the atmosphere in the sample chamber 2 is once returned to atmospheric pressure to replace the sample. There is no need to evacuate after the process, and these processes can be performed continuously and efficiently.

It is a schematic block diagram which shows the sample preparation apparatus in a prior art. It is a figure which shows the arrangement | positioning relationship of the sample board | substrate on the support stand in FIG. It is a figure explaining the movement to the holder of the sample piece cut out from a sample board | substrate. It is a schematic block diagram which shows the sample processing apparatus in this invention. It is an enlarged view which shows the board | substrate support means and holding means currently mounted in the stage. It is a figure which shows the arrangement | positioning relationship of the board | substrate support means and the holding means on the stage in this invention. It is a figure explaining the mounting method of the board | substrate support means and holding means on a stage. It is a figure explaining the mounting method of the board | substrate support means and holding means on a stage. It is a figure explaining the mounting method of the board | substrate support means and holding means on a stage. It is a figure explaining the mounting method of the board | substrate support means and holding means on a stage. It is a figure explaining the mounting method of the board | substrate support means and holding means on a stage. It is a figure explaining the mounting method of the board | substrate support means and holding means on a stage. It is a figure which shows the structure of a holding means. It is a figure which shows the structure of a holding means. It is a figure explaining the mounting method to the base of the stage in which the board | substrate support means and the holding means are arrange | positioned. It is a figure explaining the mounting method to the base of the stage in which the board | substrate support means and the holding means are arrange | positioned. It is a figure which shows the state which irradiates an electron beam to the to-be-processed surface of the sample piece hold | maintained at the holder. It is a schematic block diagram which shows the modification of the sample processing apparatus in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Sample processing apparatus, 2 ... Sample chamber, 3 ... Electron optical column, 4 ... Ion beam column, 5 ... Sample piece (other sample piece), 5a ... Work surface, 6 ... Holding means, 6a ... Holding 7 ... Sample substrate (sample substrate from which one sample piece is cut out), 8 ... Substrate support means, 16a ... Base, 17 ... Stage, 15 ... Groove

Claims (7)

A sample chamber, an ion beam irradiation unit connected to the sample chamber, a stage disposed in the sample chamber, and a moving mechanism for moving the stage are provided. The stage includes a sample substrate support unit and a sample piece holding unit. The sample substrate supported by the sample substrate support means on the stage or the sample piece held by the sample piece holding means can be placed on the optical axis of the ion beam irradiation means by moving the stage by the moving mechanism. A sample processing apparatus which can be positioned above and can process a sample substrate or sample piece by irradiating the sample substrate or sample piece with an ion beam from an ion beam irradiation means. 2. The sample processing apparatus according to claim 1, wherein the sample substrate support means and the sample piece holding means are engaged with a groove formed in the stage. The sample processing apparatus according to claim 1 or 2, wherein the sample substrate support means and the sample piece holding means are detached from the stage by operating the same exchange rod. The sample processing apparatus according to claim 1, wherein the stage is detachably mounted on the moving mechanism. 5. The sample processing apparatus according to claim 4, wherein the attachment / detachment of the sample substrate support means and the sample piece holding means from the stage and the attachment / detachment from the stage moving mechanism are performed by operating the same exchange rod. An electron beam irradiation means connected to the sample chamber; and a signal detection means for detecting at least a secondary signal generated from the sample piece irradiated with the electron beam from the electron beam irradiation means; The electron beam can be irradiated onto a predetermined processing surface of the sample piece by rotating the sample piece, whereby a secondary signal from the sample piece corresponding to the processing surface can be detected. The sample processing apparatus according to any one of 5 to 5. The sample processing apparatus according to claim 6, wherein the secondary signal is a secondary electron, a reflected electron, or a transmitted electron.

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