JP2008124077A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP2008124077A JP2008124077A JP2006303139A JP2006303139A JP2008124077A JP 2008124077 A JP2008124077 A JP 2008124077A JP 2006303139 A JP2006303139 A JP 2006303139A JP 2006303139 A JP2006303139 A JP 2006303139A JP 2008124077 A JP2008124077 A JP 2008124077A
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Abstract
【解決手段】基板の半導体チップに相当する領域に形成された電極パッド上に、ボンディングワイヤによってバンプを形成する工程と、第1の主面に導電層が形成された、前記基板に積層する積層用基板の第2の主面から該導電層に到達するビアホールを形成し、該ビアホールを導電性ペーストで埋設する工程と、前記積層用基板を、絶縁層を介して前記基板上に貼り付け、前記導電層と前記バンプを前記導電性ペーストにより接合する工程と、前記基板を個片化する工程と、を有することを特徴とする半導体装置の製造方法。
【選択図】図1H
Description
101A 基板
101a 領域
102 保護層
103 電極パッド
104 バンプ
105 絶縁層
201 積層用基板
201a 第1の主面
201b 第2の主面
201A,201B,201C,201D,201E 導電層
201C ビアホール
202 導電性ペースト
203 はんだバンプ
204,205 絶縁層
206,207,208,209 導電層
301,301A,305,306 導電層
301A 導電層
302 接続パターン
302A 転写層
302B スキージ装置
303 支持層
304 絶縁層
304A ビアプラグ
Claims (9)
- 基板の半導体チップに相当する領域に形成された電極パッド上に、ボンディングワイヤによってバンプを形成する工程と、
第1の主面に導電層が形成された、前記基板に積層する積層用基板の第2の主面から該導電層に到達するビアホールを形成し、該ビアホールを導電性ペーストで埋設する工程と、
前記積層用基板を、絶縁層を介して前記基板上に貼り付け、前記導電層と前記バンプを前記導電性ペーストにより接合する工程と、
前記基板を個片化する工程と、を有することを特徴とする半導体装置の製造方法。 - 前記導電層をエッチングしてパターニングする工程をさらに有することを特徴とする請求項1記載の半導体装置の製造方法。
- 前記導電層を給電層とする電解メッキにより、パターンメッキを行う工程をさらに有することを特徴とする請求項1記載の半導体装置の製造方法。
- 基板の半導体チップに相当する領域に形成された電極パッド上に、ボンディングワイヤによってバンプを形成する工程と、
前記基板に積層する導電層上に、導電性ペーストよりなる接続パターンを形成する工程と、
前記導電層を、絶縁層を介して前記基板上に貼り付け、前記導電層と前記バンプを前記接続パターンにより接合する工程と、
前記基板を個片化する工程と、を有することを特徴とする半導体装置の製造方法。 - 前記導電層をエッチングしてパターニングする工程をさらに有することを特徴とする請求項4記載の半導体装置の製造方法。
- 前記導電層を給電層とする電解メッキにより、パターンメッキを行う工程をさらに有することを特徴とする請求項4記載の半導体装置の製造方法。
- 前記導電層は、該導電層を支持する支持層上に積層されて、前記絶縁層を介して前記基板上に貼り付けられ、該導電層が前記基板上に貼り付けられた後で前記支持層が除去されることを特徴とする請求項4乃至6のいずれか1項記載の半導体装置の製造方法。
- 前記基板に積層する前記導電層は、多層配線構造を構成する導電層であることを特徴とする請求項4記載の半導体装置の製造方法。
- 基板の半導体チップに相当する領域に形成された電極パッド上に、ボンディングワイヤによってバンプを形成する工程と、
前記バンプの先端を導電性ペーストよりなる層に接触させ、該先端に該導電性ペーストを転写する工程と、
前記基板に積層する導電層を、絶縁層を介して該基板上に貼り付け、前記導電層と前記バンプを前記導電性ペーストにより接合する工程と、
前記基板を個片化する工程と、を有することを特徴とする半導体装置の製造方法。
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JP2006303139A JP4758869B2 (ja) | 2006-11-08 | 2006-11-08 | 半導体装置の製造方法 |
KR1020070105924A KR20080041991A (ko) | 2006-11-08 | 2007-10-22 | 반도체 장치의 제조 방법 |
US11/923,096 US20080182400A1 (en) | 2006-11-08 | 2007-10-24 | Manufacturing method of semiconductor device |
TW096141633A TW200824082A (en) | 2006-11-08 | 2007-11-05 | Manufacturing method of semiconductor device |
EP07021716A EP1921670A2 (en) | 2006-11-08 | 2007-11-08 | Manufacturing method of semiconductor device |
CNA2007101637924A CN101179036A (zh) | 2006-11-08 | 2007-11-08 | 半导体器件的制造方法 |
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EP (1) | EP1921670A2 (ja) |
JP (1) | JP4758869B2 (ja) |
KR (1) | KR20080041991A (ja) |
CN (1) | CN101179036A (ja) |
TW (1) | TW200824082A (ja) |
Cited By (2)
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US8247890B2 (en) | 2009-11-27 | 2012-08-21 | Nitto Denko Corporation | Wiring circuit structure and manufacturing method for semiconductor device using the structure |
KR20140044599A (ko) * | 2012-10-05 | 2014-04-15 | 한국전자통신연구원 | 회로보드, 그 제조방법, 및 이를 포함하는 반도체 패키지 |
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US8692135B2 (en) * | 2008-08-27 | 2014-04-08 | Nec Corporation | Wiring board capable of containing functional element and method for manufacturing same |
US9299661B2 (en) * | 2009-03-24 | 2016-03-29 | General Electric Company | Integrated circuit package and method of making same |
EP2563464B1 (en) * | 2010-04-30 | 2018-06-06 | Second Sight Medical Products, Inc. | Improved biocompatible bonding method |
TWI557855B (zh) * | 2011-12-30 | 2016-11-11 | 旭德科技股份有限公司 | 封裝載板及其製作方法 |
WO2014155619A1 (ja) * | 2013-03-28 | 2014-10-02 | 株式会社安川電機 | 半導体装置、電力変換装置および半導体装置の製造方法 |
CN105990288B (zh) | 2015-01-30 | 2019-03-12 | 日月光半导体制造股份有限公司 | 半导体衬底及其制造方法 |
JP2017126688A (ja) * | 2016-01-15 | 2017-07-20 | 株式会社ジェイデバイス | 半導体パッケージの製造方法及び半導体パッケージ |
US12107037B2 (en) * | 2021-11-03 | 2024-10-01 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor devices and methods of manufacturing electronic devices |
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- 2007-10-24 US US11/923,096 patent/US20080182400A1/en not_active Abandoned
- 2007-11-05 TW TW096141633A patent/TW200824082A/zh unknown
- 2007-11-08 CN CNA2007101637924A patent/CN101179036A/zh active Pending
- 2007-11-08 EP EP07021716A patent/EP1921670A2/en not_active Withdrawn
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JP2001339011A (ja) * | 2000-03-24 | 2001-12-07 | Shinko Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2002050716A (ja) * | 2000-08-02 | 2002-02-15 | Dainippon Printing Co Ltd | 半導体装置及びその作製方法 |
JP2004047725A (ja) * | 2002-07-11 | 2004-02-12 | Sumitomo Bakelite Co Ltd | 半導体装置及び製造方法 |
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US8247890B2 (en) | 2009-11-27 | 2012-08-21 | Nitto Denko Corporation | Wiring circuit structure and manufacturing method for semiconductor device using the structure |
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EP1921670A2 (en) | 2008-05-14 |
KR20080041991A (ko) | 2008-05-14 |
JP4758869B2 (ja) | 2011-08-31 |
US20080182400A1 (en) | 2008-07-31 |
CN101179036A (zh) | 2008-05-14 |
TW200824082A (en) | 2008-06-01 |
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