Nothing Special   »   [go: up one dir, main page]

JP2008120700A - Sulfonium salt - Google Patents

Sulfonium salt Download PDF

Info

Publication number
JP2008120700A
JP2008120700A JP2006303368A JP2006303368A JP2008120700A JP 2008120700 A JP2008120700 A JP 2008120700A JP 2006303368 A JP2006303368 A JP 2006303368A JP 2006303368 A JP2006303368 A JP 2006303368A JP 2008120700 A JP2008120700 A JP 2008120700A
Authority
JP
Japan
Prior art keywords
carbon atoms
sulfonium salt
group
acid
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006303368A
Other languages
Japanese (ja)
Inventor
Atsushi Shiraishi
篤志 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
San Apro KK
Original Assignee
San Apro KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Apro KK filed Critical San Apro KK
Priority to JP2006303368A priority Critical patent/JP2008120700A/en
Publication of JP2008120700A publication Critical patent/JP2008120700A/en
Pending legal-status Critical Current

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sulfonium salt hardly migrating to a water phase in a resist for liquid immersion exposure. <P>SOLUTION: The sulfonium salt is represented by formula (1) [wherein, R<SB>1</SB>and R<SB>2</SB>are the same or different, and are each a 1-18C alkyl, a 1-18C alkoxy or a 1-8C perfluoroalkyl; m and n are the same or different and are each 1-5; m R<SB>1</SB>s and n R<SB>2</SB>s are the same or different; R<SB>3</SB>is a 1-18C alkyl, a 1-18C alkoxy, a 1-8C perfluoroalkyl or a group of formula (2); when R<SB>3</SB>is a 1-18C alkyl, a 1-18C alkoxy or a 1-8C perfluoroalkyl, k is 0-5; k R<SB>3</SB>s are the same or different, and when R<SB>3</SB>is a group of formula (2), k is 1; and X<SP>-</SP>is an anion]. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、スルホニウム塩に関し、さらに詳しくは、半導体のパターン形成に用いる化学増幅型レジスト用の光酸発生剤、特に水を液浸媒体とする液浸露光用に光酸発生剤として使用するのに好適なスルホニウム塩に関する。   The present invention relates to a sulfonium salt, and more particularly to a photoacid generator for a chemically amplified resist used for semiconductor pattern formation, particularly as a photoacid generator for immersion exposure using water as an immersion medium. It is related with the sulfonium salt suitable for.

半導体、特にLSIはますます配線が微細化、高密度化し、それに伴って半導体のパターン形成に用いるレジストが、従来のg線(438nm)やi線(365nm)で露光するものから、KrFエキシマレーザー(248nm)あるいはArFエキシマレーザー(193nm)で露光するものへと移行してきている。ここで、KrFエキシマレーザーやArFエキシマレーザー用のレジストは、いわゆる化学増幅型レジストといわれ、その原理は以下のとおりである。ポリヒドロキシスチレンのヒドロキシル基をtert−ブトキシカルボニル基で保護したもの、あるいはポリ(メタ)アクリル酸のカルボキシル基を脂環式炭化水素基(たとえばアダマンチル基)で保護したものなどの樹脂の有機溶剤溶液に光酸発生剤などを添加したもので構成され、この溶液をシリコン基板上に塗布し、溶剤を除去してできた塗膜をKrFエキシマレーザーやArFエキシマレーザーで露光すると、光酸発生剤から酸すなわちプロトン(H+)が発生し、樹脂の保護基を脱離させる。この結果、保護基により保護されていたフェノール性ヒドロキシル基やカルボキシル基が再生し、レジスト膜の光の当たった部分がアルカリ現像可能となる。   Semiconductors, especially LSIs, are becoming increasingly finer and denser, and the resist used for semiconductor pattern formation is exposed by conventional g-line (438 nm) and i-line (365 nm), so KrF excimer lasers are used. (248 nm) or an ArF excimer laser (193 nm). Here, the resist for KrF excimer laser or ArF excimer laser is called a so-called chemical amplification resist, and its principle is as follows. Organic solvent solutions of resins such as those in which the hydroxyl group of polyhydroxystyrene is protected with a tert-butoxycarbonyl group, or the carboxyl group of poly (meth) acrylic acid is protected with an alicyclic hydrocarbon group (for example, an adamantyl group) When a coating film formed by applying this solution on a silicon substrate and removing the solvent is exposed with a KrF excimer laser or an ArF excimer laser, the photoacid generator is used. An acid or proton (H +) is generated, which removes the protecting group of the resin. As a result, the phenolic hydroxyl group and carboxyl group protected by the protective group are regenerated, and the exposed portion of the resist film can be alkali-developed.

特に最近では、さらなる微細化のための露光技術として、レジスト膜と露光レンズとの空間に水などの液体を満たし屈折率を変化させて解像度を高める方法−液浸露光と呼ばれる−が検討されている。これに関し、液浸用プロセスに基づくパターン形成法(例えば特許文献1参照)、液浸露光工程を含むレジストパターン形成法に用いられるレジスト組成物(例えば特許文献2参照)、露光後の時間経過によるレジストパターンの倒れ等のプロファイルの劣化が改善されたポジ型レジスト組成物(例えば特許文献3参照)につき検討がなされている。   Particularly recently, as an exposure technique for further miniaturization, a method of increasing the resolution by filling the space between the resist film and the exposure lens with a liquid such as water and changing the refractive index, called immersion exposure, has been studied. Yes. In this regard, a pattern formation method based on an immersion process (see, for example, Patent Document 1), a resist composition used in a resist pattern formation method that includes an immersion exposure step (see, for example, Patent Document 2), and a time lapse after exposure. A positive resist composition (see, for example, Patent Document 3) in which deterioration of the profile such as resist pattern collapse is improved has been studied.

水を液浸液とする液浸露光技術では、レジスト膜と露光レンズとの間に水を満たしてしまうために、レジスト膜から光酸発生剤などの成分が水へ移行し光学系を汚染するおそれがある、という問題がある。特に光酸発生剤が水へ移行してしまうと、レジスト膜中に実質存在する光酸発生剤の量が減少し、パターン形成にも影響を及ぼすことになり、これらの問題を生じない光酸発生剤が望まれている(非特許文献1および2参照)。   In immersion exposure technology that uses water as the immersion liquid, water is filled between the resist film and the exposure lens, so components such as photoacid generators migrate from the resist film to the water and contaminate the optical system. There is a problem of fear. In particular, when the photoacid generator moves to water, the amount of the photoacid generator substantially present in the resist film is reduced, which affects the pattern formation, and does not cause these problems. A generator is desired (see Non-Patent Documents 1 and 2).

特公昭63−49893号公報Japanese Examined Patent Publication No. 63-49893 特開2005−208509号公報JP 2005-208509 A 特開2005−266799号公報JP 2005-266799 A 最新レジスト材料ハンドブック 情報機構 p.138−145 (2005)Latest resist material handbook Information organization p. 138-145 (2005) UV・EB硬化技術の最新動向 シーエムシー出版 p.73−74 (2006)Latest Trends in UV and EB Curing Technology CMC Publishing p. 73-74 (2006)

上記背景に照らし、本発明は、従来使用されてきたスルホニウム塩に比して、水を液浸液とする液浸露光用レジストにおいて、水相への移行が実質的に防止され、従って上記問題を防止することのできるスルホニウム塩を提供することを目的とする。   In light of the above background, the present invention substantially prevents the transition to the aqueous phase in the immersion exposure resist using water as an immersion liquid, compared to the conventionally used sulfonium salts. An object of the present invention is to provide a sulfonium salt capable of preventing the above.

本発明者らは上記課題を解決すべく鋭意検討した結果、特定の構造をもつスルホニウム塩が、上記目的に適う優れた性質を示し、水を使用した液浸露光用レジストにおいて、レジスト組成物からの水へのスルホニウム塩の溶出が実質的に避けられることを見出し、本発明を完成した。   As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that a sulfonium salt having a specific structure exhibits excellent properties suitable for the above-mentioned purpose, and in a resist for immersion exposure using water, from a resist composition. It was found that elution of the sulfonium salt in water was substantially avoided, and the present invention was completed.

すなわち本発明は、以下を提供するものである。
1.一般式(1)
That is, the present invention provides the following.
1. General formula (1)

Figure 2008120700
Figure 2008120700

(式(1)中、R1およびR2は、互いに同一または異なって、炭素数1〜18のアルキル基、炭素数1〜18のアルコキシ基、又は炭素数1〜8のパーフルオロアルキル基を表し、mおよびnは、互いに同一または異なって、1〜5の整数を表し、m個のR1は互いに同一であっても異なっていてもよく、n個のR2は互いに同一であっても異なっていてもよく、R3は、炭素数1〜18のアルキル基、炭素数1〜18のアルコキシ基、炭素数1〜8のパーフルオロアルキル基または式(2) (In the formula (1), R 1 and R 2 are the same or different from each other, alkyl group having 1 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms, or a perfluoroalkyl group having 1 to 8 carbon atoms M and n are the same as or different from each other and represent an integer of 1 to 5, m R 1 s may be the same or different from each other, and n R 2 s are the same as each other R 3 may be an alkyl group having 1 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms, a perfluoroalkyl group having 1 to 8 carbon atoms, or the formula (2)

Figure 2008120700
Figure 2008120700

で示される基を表し、R3が炭素数1〜18のアルキル基、炭素数1〜18のアルコキシ基または炭素数1〜8のパーフルオロアルキル基を表すときはkは0〜5の整数であり、k個のR3は互いに同一であっても異なっていてもよく、R3が式(2)で示される基を表すときはkは1であり、X-はスルホニウムと対をなすアニオンを表し、式(2)中、R1、R2、m、nおよびX-は、上記定義に同じである。)で示されるスルホニウム塩。
2.X-が、フッ素化アルカンスルホン酸、フッ素化アレーンスルホン酸、フッ素化アルカンスルホニルイミドおよびフッ素化アルカンスルホニルメチドから選ばれる、少なくとも1種の化合物の共役塩基たるアニオン部分である、上記1のスルホニウム塩。
3.m個のR1の少なくとも1個は炭素数4〜18のアルキル基であり、n個のR2の少なくとも1個は炭素数4〜18のアルキル基であることを特徴とする上記1または2のスルホニウム塩。
4.水(20℃)に対する溶解度が100ppm以下であることを特徴とする上記1ないし3何れかのスルホニウム塩。
5.上記1ないし4の何れかのスルホニウム塩を含んでなる、化学増幅型フォトレジスト用光酸発生剤。
When R 3 represents an alkyl group having 1 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms or a perfluoroalkyl group having 1 to 8 carbon atoms, k is an integer of 0 to 5. And k R 3 s may be the same as or different from each other. When R 3 represents a group represented by the formula (2), k is 1, and X is an anion paired with sulfonium. In formula (2), R 1 , R 2 , m, n and X are the same as defined above. The sulfonium salt shown by this.
2. The sulfonium of 1 above, wherein X is an anion moiety as a conjugate base of at least one compound selected from fluorinated alkanesulfonic acid, fluorinated arenesulfonic acid, fluorinated alkanesulfonylimide and fluorinated alkanesulfonylmethide salt.
3. 1 or 2 above, wherein at least one of m R 1 is an alkyl group having 4 to 18 carbon atoms, and at least one of n R 2 is an alkyl group having 4 to 18 carbon atoms. The sulfonium salt.
4). The sulfonium salt according to any one of 1 to 3 above, wherein the solubility in water (20 ° C.) is 100 ppm or less.
5. A photoacid generator for a chemically amplified photoresist, comprising the sulfonium salt according to any one of 1 to 4 above.

本発明によれば、実質的に水へ溶解しないスルホニウム塩が得られる。したがって、本発明で得られるスルホニウム塩は、半導体微細加工用の化学増幅型レジストにおいて、水を液浸液とする液浸露光用レジストの光酸発生剤として使用したとき水相への光酸発生剤の移行が実質的に防止されるから、光学系の汚染の防止及び良好なパターン形成を行う上で有利である。   According to the present invention, a sulfonium salt that is substantially insoluble in water is obtained. Therefore, the sulfonium salt obtained by the present invention is a photo-acid generator for a water phase when used as a photoacid generator for a resist for immersion exposure using water as an immersion liquid in a chemically amplified resist for semiconductor microfabrication. Since migration of the agent is substantially prevented, it is advantageous in preventing contamination of the optical system and forming a good pattern.

本発明の置換スルホニウム塩は下式(1)で表される。   The substituted sulfonium salt of the present invention is represented by the following formula (1).

Figure 2008120700
Figure 2008120700

式(1)中、R1およびR2は、炭素数1〜18(好ましくは炭素数1〜12、より好ましくは炭素数1〜10、特に好ましくは炭素数1〜8)のアルキル基、炭素数1〜18(好ましくは炭素数1〜10、より好ましくは炭素数1〜4、特に好ましくは炭素数1〜2)のアルコキシ基、または炭素数1〜8(好ましくは炭素数1〜4、特に好ましくは炭素数1〜2)のパーフルオロアルキル基を示す。 In formula (1), R 1 and R 2 are each an alkyl group having 1 to 18 carbon atoms (preferably 1 to 12 carbon atoms, more preferably 1 to 10 carbon atoms, particularly preferably 1 to 8 carbon atoms), carbon An alkoxy group having 1 to 18 carbon atoms (preferably 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms, particularly preferably 1 to 2 carbon atoms), or 1 to 8 carbon atoms (preferably 1 to 4 carbon atoms, Particularly preferably, it represents a perfluoroalkyl group having 1 to 2 carbon atoms.

上記炭素数1〜18のアルキル基の具体例としては、メチル、エチル、n−プロピル、n−ブチル、n−ペンチル、n−オクチル、n−デシル、n−ドデシル、n−テトラデシル、n−ヘキサデシル、n−オクタデシルなどの直鎖アルキル基、イソプロピル、イソブチル、sec−ブチル、tert−ブチル、イソペンチル、ネオペンチル、tert−ペンチル、イソヘキシル、2−エチルヘキシル、1,1,3,3−テトラメチルブチルなどの分岐アルキル基、シクロプロピル、シクロブチル、シクロペンチル、シクロヘキシルなどの環式アルキル基、ノルボルニル、アダマンチル、ピナニルなどの架橋環式アルキル基などが挙げられる。   Specific examples of the alkyl group having 1 to 18 carbon atoms include methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-octyl, n-decyl, n-dodecyl, n-tetradecyl and n-hexadecyl. Linear alkyl groups such as n-octadecyl, isopropyl, isobutyl, sec-butyl, tert-butyl, isopentyl, neopentyl, tert-pentyl, isohexyl, 2-ethylhexyl, 1,1,3,3-tetramethylbutyl, etc. Examples include branched alkyl groups, cyclic alkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl, and cyclohexyl, and bridged cyclic alkyl groups such as norbornyl, adamantyl, and pinanyl.

上記炭素数1〜18のアルコキシ基の具体例としては、メトキシ、エトキシ、メトキシ、エトキシ、プロポキシ、イソプロポキシ、ブトキシ、イソブトキシ、sec−ブトキシ、tert−ブトキシなどが挙げられる。   Specific examples of the alkoxy group having 1 to 18 carbon atoms include methoxy, ethoxy, methoxy, ethoxy, propoxy, isopropoxy, butoxy, isobutoxy, sec-butoxy, tert-butoxy and the like.

上記炭素数1〜8のパーフルオロアルキル基の具体例としては、トリフルオロメチル、ペンタフルオロエチル、ノナフルオロブチル、パーフルオロオクチルなどが挙げられる。   Specific examples of the perfluoroalkyl group having 1 to 8 carbon atoms include trifluoromethyl, pentafluoroethyl, nonafluorobutyl, perfluorooctyl and the like.

これら具体例のうち、好ましいのは、メチル、n−ブチル、n−オクチル、n−デシル、n−ドデシル、n−テトラデシル、n−ヘキサデシル、n−オクタデシルなどの直鎖アルキル基;tert−ブチル、ネオペンチル、tert−ペンチル、1,1,3,3−テトラメチルブチルなどの分岐アルキル基;シクロプロピル、シクロブチル、シクロペンチル、シクロヘキシルなどの環式アルキル基;ノルボルニル、アダマンチル、ピナニルなどの架橋環式アルキル基;メトキシ、エトキシ、tert−ブトキシなどのアルコキシ基;トリフルオロメチル、ノナフルオロブチル、パーフルオロオクチルなどのパーフルオロアルキル基であり、さらに好ましいのは、tert−ブチル、tert−ペンチル、1,1,3,3−テトラメチルブチル、1−アダマンチルなどの第3級炭素をもつアルキル基;およびトリフルオロメチル、ノナフルオロブチル、パーフルオロオクチルなどのフッ素化アルキル基である。   Of these specific examples, preferred are linear alkyl groups such as methyl, n-butyl, n-octyl, n-decyl, n-dodecyl, n-tetradecyl, n-hexadecyl, n-octadecyl; tert-butyl, Branched alkyl groups such as neopentyl, tert-pentyl, 1,1,3,3-tetramethylbutyl; cyclic alkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl and cyclohexyl; bridged cyclic alkyl groups such as norbornyl, adamantyl and pinanyl Alkoxy groups such as methoxy, ethoxy and tert-butoxy; perfluoroalkyl groups such as trifluoromethyl, nonafluorobutyl and perfluorooctyl, more preferably tert-butyl, tert-pentyl, 1,1, 3,3-tetramethylbutyl, 1-adamantyl, etc. Alkyl group having grade carbons; and trifluoromethyl, nonafluorobutyl, a fluorinated alkyl group, such as perfluorooctyl.

また、式(1)中の置換基R1とR2の個数を示すmおよびnは、それぞれ1〜5の整数である。R1とR2とは互いに同一でも異なっていてもよい。また、m個のR1はそれぞれ互いに同一でも異なっていてもよく、n個のR2もそれぞれ互いに同一でも異なっていてもよい。 Further, m and n represents the number of substituents R 1 and R 2 in the formula (1) is an integer of 1 to 5, respectively. R 1 and R 2 may be the same as or different from each other. Further, m R 1 s may be the same as or different from each other, and n R 2 s may be the same as or different from each other.

式(1)中の置換基R3は、炭素数1〜18(好ましくは炭素数1〜12、より好ましくは炭素数1〜10、特に好ましくは炭素数1〜8)のアルキル基、炭素数1〜18(好ましくは炭素数1〜10、より好ましくは炭素数1〜4、特に好ましくは炭素数1〜2)のアルコキシ基、炭素数1〜8(好ましくは炭素数1〜4、特に好ましくは炭素数1〜2)のパーフルオロアルキル基、または下式(2)で表される基を示す。 The substituent R 3 in the formula (1) is an alkyl group having 1 to 18 carbon atoms (preferably 1 to 12 carbon atoms, more preferably 1 to 10 carbon atoms, particularly preferably 1 to 8 carbon atoms), 1 to 18 (preferably 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms, particularly preferably 1 to 2 carbon atoms) alkoxy group, 1 to 8 carbon atoms (preferably 1 to 4 carbon atoms, particularly preferably Represents a perfluoroalkyl group having 1 to 2 carbon atoms or a group represented by the following formula (2).

Figure 2008120700
Figure 2008120700

式(2)中、R1、R2、mおよびnは式(1)中における定義に同じである。X-はスルホニウムと対をなすアニオンを表す。 In formula (2), R 1 , R 2 , m and n are the same as defined in formula (1). X represents an anion paired with sulfonium.

置換基R3が炭素数1〜18のアルキル基、炭素数1〜18のアルコキシ基または炭素数1〜8のパーフルオロアルキル基のときは、kは0〜5の整数であり、その具体例は本明細書に記載のとおりである。また、置換基R3が式(2)で示されるを表すときはkは1である。 When the substituent R 3 is an alkyl group having 1 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms, or a perfluoroalkyl group having 1 to 8 carbon atoms, k is an integer of 0 to 5, and specific examples thereof Is as described herein. When the substituent R 3 is represented by the formula (2), k is 1.

式(1)および式(2)中のX-は、スルホニウムと対をなすアニオンを示し、例としては、フッ素化アルカンスルホン酸、フッ素化アレーンスルホン酸、フッ素化アルカンスルホニルイミド、フッ素化アルカンスルホニルメチドなどの化合物の共役塩基たるアニオン部分が挙げられる。 X − in formula (1) and formula (2) represents an anion paired with sulfonium, and examples thereof include fluorinated alkanesulfonic acid, fluorinated arenesulfonic acid, fluorinated alkanesulfonylimide, and fluorinated alkanesulfonyl. An anion portion which is a conjugate base of a compound such as methide.

上記フッ素化アルカンスルホン酸の具体例としては、例えば炭素数1〜20のパーフルオロアルキル基をもつスルホン酸などが挙げられ、そのうち経済的に入手し得る炭素数1〜10のものが好ましい。炭素数1〜10のパーフルオロアルキル基としては、直鎖状、分岐鎖状または環状のもの、あるいはこれらパーフルオロアルキル基の一つ以上のフッ素原子が炭素数1〜4のパーフルオロアルキルアルコキシ基でさらに置換されたものが挙げられる。具体例として、トリフルオロメタンスルホン酸、ペンタフルオロエタンスルホン酸、ノナフルオロブタンスルホン酸、パーフルオロオクタンスルホン酸、パーフルオロシクロへキサンスルホン酸、パーフルオロエトキシエタンスルホン酸などが挙げられる。特に好ましいのは、トリフルオロメタンスルホン酸、ペンタフルオロエタンスルホン酸、ノナフルオロブタンスルホン酸である。   Specific examples of the fluorinated alkanesulfonic acid include, for example, sulfonic acids having a perfluoroalkyl group having 1 to 20 carbon atoms, and those having 1 to 10 carbon atoms that are economically available are preferable. The perfluoroalkyl group having 1 to 10 carbon atoms is linear, branched or cyclic, or a perfluoroalkylalkoxy group in which one or more fluorine atoms of these perfluoroalkyl groups are 1 to 4 carbon atoms. And further substituted. Specific examples include trifluoromethanesulfonic acid, pentafluoroethanesulfonic acid, nonafluorobutanesulfonic acid, perfluorooctanesulfonic acid, perfluorocyclohexanesulfonic acid, perfluoroethoxyethanesulfonic acid, and the like. Particularly preferred are trifluoromethanesulfonic acid, pentafluoroethanesulfonic acid, and nonafluorobutanesulfonic acid.

上記のフッ素化アレーンスルホン酸としては、炭素数6〜20の、少なくともフッ素原子もしくはトリフルオロメチル基が一つ以上置換した芳香族基をもつスルホン酸が挙げられ、このうち炭素数6〜10のものが好ましい。具体例としては、2−フルオロベンゼンスルホン酸、4−フルオロベンゼンスルホン酸、2,4−ジフルオロベンゼンスルホン酸、3,5−ジフルオロベンゼンスルホン酸、2,6−ジフルオロベンゼンスルホン酸、2,4,6−トリフルオロベンゼンスルホン酸、パーフルオロベンゼンスルホン酸、パーフルオロナフタレンスルホン酸、2−(トリフルオロメチル)ベンゼンスルホン酸、4−(トリフルオロメチル)ベンゼンスルホン酸、3,5‐ビス(トリフルオロメチル)ベンゼンスルホン酸などが挙げられる。特に好ましいのは、4−フルオロベンゼンスルホン酸、2,4,6−トリフルオロベンゼンスルホン酸、パーフルオロベンゼンスルホン酸、4−(トリフルオロメチル)ベンゼンスルホン酸である。   Examples of the fluorinated arene sulfonic acid include sulfonic acids having 6 to 20 carbon atoms and having an aromatic group substituted with at least one fluorine atom or trifluoromethyl group, and of these, 6 to 10 carbon atoms. Those are preferred. Specific examples include 2-fluorobenzenesulfonic acid, 4-fluorobenzenesulfonic acid, 2,4-difluorobenzenesulfonic acid, 3,5-difluorobenzenesulfonic acid, 2,6-difluorobenzenesulfonic acid, 2,4, 6-trifluorobenzenesulfonic acid, perfluorobenzenesulfonic acid, perfluoronaphthalenesulfonic acid, 2- (trifluoromethyl) benzenesulfonic acid, 4- (trifluoromethyl) benzenesulfonic acid, 3,5-bis (trifluoro) And methyl) benzenesulfonic acid. Particularly preferred are 4-fluorobenzenesulfonic acid, 2,4,6-trifluorobenzenesulfonic acid, perfluorobenzenesulfonic acid, and 4- (trifluoromethyl) benzenesulfonic acid.

上記フッ素化アルカンスルホニルイミドおよびフッ素化アルカンスルホニルメチドそれぞれ次式(3)および(4)で表される。   The fluorinated alkanesulfonylimide and the fluorinated alkanesulfonylmethide are represented by the following formulas (3) and (4), respectively.

(CfSO22NH ・・・・(3)
(CfSO23CH ・・・・(4)
(C f SO 2 ) 2 NH (3)
(C f SO 2 ) 3 CH (4)

式(3)および(4)中のCfは炭素数1〜10のパーフルオロアルキル基を示し、直鎖状であっても分岐状であってもよく、複数あるパーフルオロアルキル基が互いに環を形成していてもよい。 C f in the formulas (3) and (4) represents a perfluoroalkyl group having 1 to 10 carbon atoms, which may be linear or branched, and a plurality of perfluoroalkyl groups may be mutually linked. May be formed.

上記フッ素化アルカンスルホニルイミドおよびフッ素化アルカンスルホニルメチドの具体例としては、ビスパーフルオロブタンスルホニルイミド、ビストリフルオロメタンスルホニルイミド、トリフルオロメチルペンタフルオロエチルスルホニルイミド、ヘキサフルオロトリメチレンスルホニルイミド、トリストリフルオロメタンスルホニルメチド、トリスペンタフルオロエチルスルホニルメチドなどが挙げられ、好ましいのは、ビスパーフルオロブタンスルホニルイミド、ヘキサフルオロトリメチレンスルホニルイミド、トリストリフルオロメタンスルホニルメチドである。   Specific examples of the fluorinated alkanesulfonylimide and the fluorinated alkanesulfonylmethide include bisperfluorobutanesulfonylimide, bistrifluoromethanesulfonylimide, trifluoromethylpentafluoroethylsulfonylimide, hexafluorotrimethylenesulfonylimide, tristrifluoride. Examples include lomethanesulfonylmethide, trispentafluoroethylsulfonylmethide, and the like. Bisperfluorobutanesulfonylimide, hexafluorotrimethylenesulfonylimide, and tristrifluoromethanesulfonylmethide are preferable.

ジアリールスルホキシドとジアリールスルフィドからのスルホニウム塩の合成及びアニオン置換の方法自体は、当業者に周知である(例えば、特開昭61−100557号、特開平5−4996号公報、Chem. Pharm. Bull. 29(12) 3753(1981))。従って、本発明のスルホニウム塩の製造は、それらに準じて、例えば、目的のスルホニウム塩に対応した置換基を有するジアリールスルホキシドとジアリールスルフィドとを、脱水剤存在下、硫酸などの強酸を使用して縮合させることにより行うことができる。使用する強酸は、スルホニウム塩を構成する対アニオンと同じ構造のものでもよく、異なっていてもよい。異なる構造の酸を用いる場合は、適宜アニオン交換反応により目的の構造をもつスルホニウム塩を得ることもできる。   The synthesis of sulfonium salts from diaryl sulfoxides and diaryl sulfides and the method of anion substitution are well known to those skilled in the art (for example, JP-A-61-100557, JP-A-5-4996, Chem. Pharm. Bull. 29 (12) 3753 (1981)). Accordingly, the production of the sulfonium salt of the present invention can be carried out in accordance with, for example, diaryl sulfoxide having a substituent corresponding to the target sulfonium salt and diaryl sulfide using a strong acid such as sulfuric acid in the presence of a dehydrating agent. This can be done by condensation. The strong acid to be used may have the same structure as the counter anion constituting the sulfonium salt or may be different. When acids having different structures are used, a sulfonium salt having the desired structure can be obtained by an anion exchange reaction as appropriate.

上記スルホニウム塩の製造において、ジアリールスルホキシドはたとえば次式(5)で与えられる化合物である。   In the production of the sulfonium salt, diaryl sulfoxide is, for example, a compound given by the following formula (5).

Figure 2008120700
Figure 2008120700

式(5)において、R1、R2、m及びnは、上記に同じである。 In the formula (5), R 1 , R 2 , m and n are the same as described above.

上記スルホニウム塩の製造において、ジアリールスルフィドは例えば次式(6)で与えられる化合物である。   In the production of the sulfonium salt, the diaryl sulfide is, for example, a compound given by the following formula (6).

Figure 2008120700
Figure 2008120700

式(6)において、R3、kは、上記定義に同じである。 In the formula (6), R 3 and k are the same as defined above.

上記スルホニウム塩の製造において、使用する酸としては、硫酸、メタンスルホン酸、トリフルオロメタンスルホン酸、上述のフッ素化アルカンスルホン酸、フッ素化アレーンスルホン酸、フッ素化アルカンスルホニルイミド、フッ素化アルカンスルホニルメチドなどが挙げられる。   In the production of the sulfonium salt, the acid used is sulfuric acid, methanesulfonic acid, trifluoromethanesulfonic acid, the above-mentioned fluorinated alkanesulfonic acid, fluorinated arenesulfonic acid, fluorinated alkanesulfonylimide, fluorinated alkanesulfonylmethide. Etc.

上記スルホニウム塩の製造において、脱水剤としては、無水酢酸、無水プロピオン酸、無水トリフルオロ酢酸などのカルボン酸無水物、あるいはトリフルオロメタンスルホン酸無水物、ポリ燐酸、五酸化二リンなどを使用することができる。これら脱水剤は単独で使用してもよく、また2種以上を併用してもよい。   In the production of the sulfonium salt, as the dehydrating agent, carboxylic acid anhydrides such as acetic anhydride, propionic anhydride, trifluoroacetic anhydride, trifluoromethanesulfonic anhydride, polyphosphoric acid, diphosphorus pentoxide, etc. should be used. Can do. These dehydrating agents may be used alone or in combination of two or more.

上記スルホニウム塩の製造は、必要により溶剤の存在下で実施できる。その場合に用いる溶媒としては、例えば、ジエチルエーテル、ジプロピルエーテル等のエーテル類、クロロホルム、ジクロロメタン等の塩素系有機溶剤、メタノール、エタノール等のアルコール類、アセトン、メチルエチルケトン等のケトン類、酢酸、プロピオン酸等の有機酸、無水酢酸、無水プロピオン酸等の有機酸無水物、アセトニトリル等のニトリル類およびその他の極性有機溶剤が挙げられる。これらの溶媒は、単独で使用してもよく、また2種以上を併用してもよい。   The production of the sulfonium salt can be carried out in the presence of a solvent if necessary. Examples of the solvent used in this case include ethers such as diethyl ether and dipropyl ether, chlorinated organic solvents such as chloroform and dichloromethane, alcohols such as methanol and ethanol, ketones such as acetone and methyl ethyl ketone, acetic acid, propion, and the like. Examples thereof include organic acids such as acids, acetic anhydride, organic acid anhydrides such as propionic anhydride, nitriles such as acetonitrile, and other polar organic solvents. These solvents may be used alone or in combination of two or more.

塩交換法によりアニオン交換を行う場合は、目的とするアニオン構造をもつ塩類、例えばナトリウム塩、カリウム塩、アンモニウム塩のような無機塩類を水溶液とし、上記反応で得られたスルホニウム塩を含む溶剤溶液と混合することで得られる。あらかじめ、アニオン交換前のスルホニウム塩を単離、精製してもよい。この場合は改めてアニオン交換前のスルホニウム塩を上記の溶剤に溶解させ、目的とするアニオン構造をもつ塩類の水溶液と混合させるとよい。   When anion exchange is performed by the salt exchange method, a salt solution having a target anion structure, for example, an inorganic salt such as sodium salt, potassium salt or ammonium salt as an aqueous solution, and a solvent solution containing the sulfonium salt obtained by the above reaction It is obtained by mixing with. The sulfonium salt before anion exchange may be isolated and purified in advance. In this case, the sulfonium salt before anion exchange may be dissolved again in the above solvent and mixed with an aqueous solution of a salt having the target anion structure.

上記スルホニウム塩の製造において、必要により、得られるスルホニウム塩を精製してもよい。この精製は、上記スルホニウム塩を含む溶液に対して直接、あるいは所望の濃度にまで濃縮した後、貧溶剤を加えてスルホニウム塩を析出させることにより行うことができる。ここで用いる貧溶剤としては、ジエチルエーテル、ジプロピルエーテルなどのエーテル類、酢酸エチル、酢酸ブチルなどのエステル類、へキサン、シクロヘキサンなどの脂肪族炭化水素類、トルエン、キシレンなどの芳香族炭化水素類などが挙げられる。析出物が油状物の場合は、油層を分離し、減圧下溶剤を除いて目的のスルホニウム塩を得ることができる。析出物が固体の場合は、析出した固体をろ過、乾燥させて目的物を得ることができる。さらに目的のスルホニウム塩が固体である場合、再結晶によって精製することができる。すなわち、得られた固体を溶剤、例えばクロロホルム、ジクロロメタン等の塩素系有機溶剤、メタノール、エタノール等のアルコール類、アセトン、メチルエチルケトン等のケトン類、アセトニトリル等のニトリル類に溶解させ、冷却するなど温度による溶解度の差を利用して結晶を析出させるか、あるいは、スルホニウム塩を含む溶剤溶液に対して上記で例示したような貧溶剤を徐々に加えて結晶を析出させることによって精製することができる。   In the production of the sulfonium salt, the obtained sulfonium salt may be purified as necessary. This purification can be carried out by directly or directly concentrating the solution containing the sulfonium salt to a desired concentration and then adding a poor solvent to precipitate the sulfonium salt. Examples of the poor solvent used herein include ethers such as diethyl ether and dipropyl ether, esters such as ethyl acetate and butyl acetate, aliphatic hydrocarbons such as hexane and cyclohexane, and aromatic hydrocarbons such as toluene and xylene. And the like. When the precipitate is an oily substance, the oil layer is separated, and the target sulfonium salt can be obtained by removing the solvent under reduced pressure. When the deposit is a solid, the precipitated solid can be filtered and dried to obtain the target product. Further, when the target sulfonium salt is a solid, it can be purified by recrystallization. That is, the obtained solid is dissolved in a solvent, for example, a chlorinated organic solvent such as chloroform or dichloromethane, an alcohol such as methanol or ethanol, a ketone such as acetone or methyl ethyl ketone, or a nitrile such as acetonitrile, and is cooled. The crystal can be purified by utilizing the difference in solubility, or can be purified by gradually adding a poor solvent as exemplified above to the solvent solution containing the sulfonium salt to precipitate the crystal.

本発明のスルホニウム塩は、半導体のパターン形成に用いる化学増幅型レジスト用の光酸発生剤として好適に使用される。すなわちフォトレジストの基本樹脂、添加剤、溶剤、および光酸発生剤として本発明で得られたスルホニウム塩からなるレジスト組成物を用いてパターン形成を行った場合、良好なレジストパターンが得られる。   The sulfonium salt of the present invention is suitably used as a photoacid generator for a chemically amplified resist used for semiconductor pattern formation. That is, when pattern formation is performed using the resist composition comprising the sulfonium salt obtained in the present invention as the basic resin, additive, solvent, and photoacid generator of a photoresist, a good resist pattern is obtained.

以下、実施例を参照して本発明をさらに具体的に説明するが、本発明がこれにより限定されることは意図しない。 Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not intended to be limited thereby.

実施例1:(4−フェニルチオフェニル)−ジ[2−メトキシ−5−(1,1,3,3−テトラメチル)ブチル]フェニルスルホニウムノナフルオロブタンスルホナートの合成 Example 1: Synthesis of (4-phenylthiophenyl) -di [2-methoxy-5- (1,1,3,3-tetramethyl) butyl] phenylsulfonium nonafluorobutanesulfonate

Figure 2008120700
Figure 2008120700

100mlの反応容器にジクロロメタン30.0g、ジ[2−メトキシ−5−(1,1,3,3−テトラメチル)ブチル]フェニルスルホキシド10.19g(20.9mmol)、ジフェニルスルフィド4.02g(21.6mmol)、および無水酢酸6.60g(64.8mmol)を仕込み、均一に混合した後、ノナフルオロブタンスルホン酸7.77g(25.9mmol)を室温で40分間かけて滴下した。滴下中液温は、発熱により45℃まで上昇した。さらに45℃で4時間攪拌後、反応液をイオン交換水30.0gで4回洗浄し、有機層と水層を分液した。有機層を濃縮し、これにジエチルエーテルを徐々に加えていくと、溶液が白濁し白色粉末が析出した。これを濾別し減圧下55℃で乾燥させて、11.4g(収率57%)の白色粉末を得た。これをスルホニウム塩A−1とする。
1H−NMR、13C−NMR、IRおよびHPLC(高速液体クロマトグラフ装置 L−7000使用、日立製作所製、商品名、以下、同様)による分析の結果、このものは、目的物である上記式の(4−フェニルチオフェニル)−ジ[2−メトキシ−5−(1,1,3,3−テトラメチル)ブチル]フェニルスルホニウムノナフルオロブタンスルホナートであり純度99.2%であった。1H-NMR (300 MHz, DMSOd-6)δppm: 0.59(s,18H), 1.15(d, 12H), 1.55(t, 4H), 3.85(s, 3H), 6.75(d, 2H), 7.40(d, 2H), 7.44-7.58(m, 7H), 7.62(d, 2H), 7.89(dd, 2H)
In a 100 ml reaction vessel, 30.0 g of dichloromethane, 10.19 g (20.9 mmol) of di [2-methoxy-5- (1,1,3,3-tetramethyl) butyl] phenyl sulfoxide, 4.02 g of diphenyl sulfide (21 .6 mmol) and 6.60 g (64.8 mmol) of acetic anhydride were added and mixed uniformly. Then, 7.77 g (25.9 mmol) of nonafluorobutanesulfonic acid was added dropwise at room temperature over 40 minutes. During the dropping, the liquid temperature rose to 45 ° C. due to heat generation. Further, after stirring at 45 ° C. for 4 hours, the reaction solution was washed 4 times with 30.0 g of ion-exchanged water, and the organic layer and the aqueous layer were separated. When the organic layer was concentrated and diethyl ether was gradually added thereto, the solution became cloudy and a white powder precipitated. This was filtered off and dried at 55 ° C. under reduced pressure to obtain 11.4 g (yield 57%) of white powder. This is designated as sulfonium salt A-1.
As a result of analysis by 1 H-NMR, 13 C-NMR, IR, and HPLC (using high-performance liquid chromatograph L-7000, manufactured by Hitachi, trade name, hereinafter the same), this is the above-mentioned formula which is the target product (4-phenylthiophenyl) -di [2-methoxy-5- (1,1,3,3-tetramethyl) butyl] phenylsulfonium nonafluorobutanesulfonate having a purity of 99.2%. 1 H-NMR (300 MHz, DMSOd-6) δppm: 0.59 (s, 18H), 1.15 (d, 12H), 1.55 (t, 4H), 3.85 (s, 3H), 6.75 (d, 2H), 7.40 (d, 2H), 7.44-7.58 (m, 7H), 7.62 (d, 2H), 7.89 (dd, 2H)

実施例2:(4−フェニルチオフェニル)−ジ(3−tert−ブチル−4−メトキシ−5−メチル)フェニルスルホニウムノナフルオロブタンスルホナートの合成 Example 2: Synthesis of (4-phenylthiophenyl) -di (3-tert-butyl-4-methoxy-5-methyl) phenylsulfonium nonafluorobutanesulfonate

Figure 2008120700
Figure 2008120700

ジ[2−メトキシ−5−(1,1,3,3−テトラメチル)ブチル]フェニルスルホキシドに代えて、ジ(3−tert−ブチル−4−メトキシ−5−メチル)フェニルスルホキシド8.41g(20.9mmol)を用いた以外は、実施例1と同様にして、白色粉末13.8g(収率76%)を得た。1H−NMR、13C−NMR、IRおよびHPLCによる分析の結果、このものは、目的物である上記式の(4−フェニルチオフェニル)−ジ(3−tert−ブチル−4−メトキシ−5−メチル)フェニルスルホニウムノナフルオロブタンスルホナートであり純度99.1%であった。これをスルホニウム塩A−2とする。1H-NMR (300 MHz, DMSOd-6)δppm: 1.26(s, 18H), 2.32(s, 6H), 3.81(s, 6H), 7.36(d, 2H), 7.40(d, 2H), 7.50-7.58(m, 5H), 7.60(d, 2H), 7.66(d, 2H) Instead of di [2-methoxy-5- (1,1,3,3-tetramethyl) butyl] phenyl sulfoxide, 8.41 g of di (3-tert-butyl-4-methoxy-5-methyl) phenyl sulfoxide ( 13.8 g (yield 76%) of white powder was obtained in the same manner as in Example 1 except that 20.9 mmol) was used. As a result of analysis by 1 H-NMR, 13 C-NMR, IR, and HPLC, this product was found to be (4-phenylthiophenyl) -di (3-tert-butyl-4-methoxy-5) of the above formula. -Methyl) phenylsulfonium nonafluorobutanesulfonate with a purity of 99.1%. This is designated as sulfonium salt A-2. 1 H-NMR (300 MHz, DMSOd-6) δppm: 1.26 (s, 18H), 2.32 (s, 6H), 3.81 (s, 6H), 7.36 (d, 2H), 7.40 (d, 2H), 7.50 -7.58 (m, 5H), 7.60 (d, 2H), 7.66 (d, 2H)

実施例3:(4−フェニルチオフェニル)−ジ(4−tertブチル)フェニルスルホニウムノナフルオロブタンスルホナートの合成 Example 3: Synthesis of (4-phenylthiophenyl) -di (4-tertbutyl) phenylsulfonium nonafluorobutanesulfonate

Figure 2008120700
Figure 2008120700

ジ[2−メトキシ−5−(1,1,3,3−テトラメチル)ブチル]フェニルスルホキシドに代えて、ジ(4−tertブチル)フェニルスルホキシド6.57g(20.9mmol)を用いた以外は、実施例1と同様にして、白色粉末11.4g(収率70%)を得た。1H−NMR、13C−NMR、IRおよびHPLCによる分析の結果、このものは、目的物である上記式の(4−フェニルチオフェニル)−ジ(4−tertブチル)フェニルスルホニウムノナフルオロブタンスルホナートであり純度95.1%であった。これをスルホニウム塩A−3とする。1H-NMR (300 MHz, DMSOd-6)δppm: 1.30(s, 18H), 7.39(d, 3H), 7.49-7.60(m, 4H), 7.66-7.81(m, 10H) Except that instead of di [2-methoxy-5- (1,1,3,3-tetramethyl) butyl] phenyl sulfoxide, 6.57 g (20.9 mmol) of di (4-tertbutyl) phenyl sulfoxide was used. In the same manner as in Example 1, 11.4 g (yield 70%) of white powder was obtained. As a result of analysis by 1 H-NMR, 13 C-NMR, IR, and HPLC, this product was found to be (4-phenylthiophenyl) -di (4-tertbutyl) phenylsulfonium nonafluorobutanesulfoform having the above formula. It was naruto and had a purity of 95.1%. This is designated as sulfonium salt A-3. 1 H-NMR (300 MHz, DMSOd-6) δppm: 1.30 (s, 18H), 7.39 (d, 3H), 7.49-7.60 (m, 4H), 7.66-7.81 (m, 10H)

実施例4:フェニル−[4−(4−トリフルオロフェニルチオ)フェニル]−(4−トリフルオロメチル)フェニルスルホニウムノナフルオロブタンスルホナートの合成 Example 4: Synthesis of phenyl- [4- (4-trifluorophenylthio) phenyl]-(4-trifluoromethyl) phenylsulfonium nonafluorobutanesulfonate

Figure 2008120700
Figure 2008120700

実施例1のジ[2−メトキシ−5−(1,1,3,3−テトラメチル)ブチル]フェニルスルホキシドに代えて、(4−トリフルオロメチル)フェニルスルホキシド5.65g(20.9mmol)、ジフェニルスルフィドに代えて(4−トリフルオロメチル)フェニルスルホキシド5.49g(21.6mmol)を用いた以外は、実施例1と同様にして目的物13.0g(収率77%)を得た。1H−NMR、13C−NMR、IRおよびHPLCによる分析の結果、このものは、目的物であるフェニル−[4−(4−トリフルオロフェニルチオ)フェニル]−(4−トリフルオロメチル)フェニルスルホニウムノナフルオロブタンスルホナートであり純度98.1%であった。これをスルホニウム塩A−4とする。1H-NMR (300 MHz, DMSOd-6)δppm:7.33(d, 1H), 7.43-7.53(m, 3H), 7.58(d, 1H), 7.65(d, 1H), 7.68-7.91(m, 8H), 7.94-8.03(m, 2H), 8.13(d, 1H) Instead of di [2-methoxy-5- (1,1,3,3-tetramethyl) butyl] phenyl sulfoxide of Example 1, 5.65 g (20.9 mmol) of (4-trifluoromethyl) phenyl sulfoxide, 13.0 g (yield 77%) of the desired product was obtained in the same manner as in Example 1 except that 5.49 g (21.6 mmol) of (4-trifluoromethyl) phenyl sulfoxide was used instead of diphenyl sulfide. As a result of analysis by 1 H-NMR, 13 C-NMR, IR, and HPLC, this product was obtained as phenyl- [4- (4-trifluorophenylthio) phenyl]-(4-trifluoromethyl) phenyl, which is the target product. It was sulfonium nonafluorobutanesulfonate and had a purity of 98.1%. This is designated as sulfonium salt A-4. 1 H-NMR (300 MHz, DMSOd-6) δppm: 7.33 (d, 1H), 7.43-7.53 (m, 3H), 7.58 (d, 1H), 7.65 (d, 1H), 7.68-7.91 (m, 8H), 7.94-8.03 (m, 2H), 8.13 (d, 1H)

実施例5:スルホニウム塩の水への溶解度
実施例1〜5の各スルホニウム塩、及び比較例1のスルホニウム塩としてトリフェニルスルホニウムトリフルオロメタンスルホナート塩を用いて、20℃における水への溶解度を次のようにして測定した。
Example 5: Solubility of sulfonium salt in water Using each of the sulfonium salts of Examples 1 to 5 and trisulfone sulfonium trifluoromethanesulfonate salt as the sulfonium salt of Comparative Example 1, the solubility in water at 20 ° C was as follows. It measured as follows.

〔水への溶解度の測定方法〕
実施例1〜4、比較例1のスルホニウム塩各0.5gをそれぞれ30mlキャップ付きガラス容器にとり、イオン交換水20gと攪拌子を加えた。20℃に温調し30分間攪拌し、その後6時間20℃で静置した。それぞれの上澄みを3.0ml注射器で採り、メンブレンフィルター(0.2μm)を通してろ過し、このろ液に溶解しているスルホニウム塩の濃度をHPLCにて測定することにより、水に対する溶解度(ppm)を求めた。
[Method of measuring solubility in water]
0.5 g of each of the sulfonium salts of Examples 1 to 4 and Comparative Example 1 was put in a glass container with a 30 ml cap, and 20 g of ion-exchanged water and a stirrer were added. The temperature was adjusted to 20 ° C., stirred for 30 minutes, and then allowed to stand at 20 ° C. for 6 hours. Each supernatant is taken with a 3.0 ml syringe, filtered through a membrane filter (0.2 μm), and the concentration of the sulfonium salt dissolved in this filtrate is measured by HPLC, whereby the solubility (ppm) in water is determined. Asked.

結果を表1に示す。この結果から、比較例1のスルホニウム塩に比して、本発明のスルホニウム塩は非常に水溶性が低く、実質的に水に溶解しないことが判明した。従って、水を液浸液とする液浸露光用レジストにおいて、本発明のスルホニウム塩を光酸発生剤として使用すれば、レジスト膜から水へのスルホニウム塩の溶出が実質的に防止できることがわかる。   The results are shown in Table 1. From this result, it was found that the sulfonium salt of the present invention was very low in water solubility and substantially insoluble in water as compared with the sulfonium salt of Comparative Example 1. Therefore, it can be seen that in a resist for immersion exposure using water as an immersion liquid, if the sulfonium salt of the present invention is used as a photoacid generator, elution of the sulfonium salt from the resist film into water can be substantially prevented.

Figure 2008120700
Figure 2008120700

本発明によれば、実質的に水に溶解しないスルホニウム塩を提供することができる。したがって、本発明で得られるスルホニウム塩は、半導体微細加工用の化学増幅型レジスト、特に水を液浸液とする液浸露光用レジストのための光酸発生剤として好適である。 According to the present invention, a sulfonium salt that is substantially insoluble in water can be provided. Therefore, the sulfonium salt obtained by the present invention is suitable as a photoacid generator for a chemically amplified resist for semiconductor microfabrication, particularly a resist for immersion exposure using water as an immersion liquid.

Claims (5)

一般式(1)
Figure 2008120700


(式(1)中、R1およびR2は、互いに同一または異なって、炭素数1〜18のアルキル基、炭素数1〜18のアルコキシ基、又は炭素数1〜8のパーフルオロアルキル基を表し、mおよびnは、互いに同一または異なって、1〜5の整数を表し、m個のR1は互いに同一であっても異なっていてもよく、n個のR2は互いに同一であっても異なっていてもよく、R3は、炭素数1〜18のアルキル基、炭素数1〜18のアルコキシ基、炭素数1〜8のパーフルオロアルキル基または式(2)
Figure 2008120700


で示される基を表し、R3が炭素数1〜18のアルキル基、炭素数1〜18のアルコキシ基または炭素数1〜8のパーフルオロアルキル基を表すときはkは0〜5の整数を表し、k個のR3は互いに同一であっても異なっていてもよく、R3が式(2)で示される基を表すときはkは1を表し、X-はスルホニウムと対をなすアニオンを表し、式(2)中、R1、R2、m、nおよびX-は、上記定義に同じである。)で示されるトリアリールスルホニウム塩。
General formula (1)
Figure 2008120700


(In the formula (1), R 1 and R 2 are the same or different from each other, alkyl group having 1 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms, or a perfluoroalkyl group having 1 to 8 carbon atoms M and n are the same as or different from each other and represent an integer of 1 to 5, m R 1 s may be the same or different from each other, and n R 2 s are the same as each other R 3 may be an alkyl group having 1 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms, a perfluoroalkyl group having 1 to 8 carbon atoms, or the formula (2)
Figure 2008120700


When R 3 represents an alkyl group having 1 to 18 carbon atoms, an alkoxy group having 1 to 18 carbon atoms or a perfluoroalkyl group having 1 to 8 carbon atoms, k represents an integer of 0 to 5. And k R 3 s may be the same as or different from each other. When R 3 represents a group represented by the formula (2), k represents 1 and X represents an anion paired with sulfonium. In formula (2), R 1 , R 2 , m, n and X are the same as defined above. ) A triarylsulfonium salt represented by
-が、フッ素化アルカンスルホン酸、フッ素化アレーンスルホン酸、フッ素化アルカンスルホニルイミドおよびフッ素化アルカンスルホニルメチドから選ばれる、少なくとも1種の化合物の共役塩基たるアニオン部分である、請求項1のスルホニウム塩。 X is an anion moiety as a conjugate base of at least one compound selected from fluorinated alkanesulfonic acid, fluorinated arenesulfonic acid, fluorinated alkanesulfonylimide and fluorinated alkanesulfonylmethide. Sulfonium salt. m個のR1の少なくとも1個は炭素数4〜18のアルキル基であり、n個のR2の少なくとも1個は炭素数4〜18のアルキル基であることを特徴とする請求項1または2のスルホニウム塩。 The at least one of m R 1 is an alkyl group having 4 to 18 carbon atoms, and at least one of the n R 2 is an alkyl group having 4 to 18 carbon atoms. 2 sulfonium salts. 水(20℃)に対する溶解度が100ppm以下であることを特徴とする請求項1ないし3何れかのスルホニウム塩。   The sulfonium salt according to any one of claims 1 to 3, wherein the solubility in water (20 ° C) is 100 ppm or less. 請求項1ないし4の何れかのスルホニウム塩を含んでなる、化学増幅型フォトレジスト用光酸発生剤。   A photoacid generator for a chemically amplified photoresist, comprising the sulfonium salt according to claim 1.
JP2006303368A 2006-11-08 2006-11-08 Sulfonium salt Pending JP2008120700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006303368A JP2008120700A (en) 2006-11-08 2006-11-08 Sulfonium salt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006303368A JP2008120700A (en) 2006-11-08 2006-11-08 Sulfonium salt

Publications (1)

Publication Number Publication Date
JP2008120700A true JP2008120700A (en) 2008-05-29

Family

ID=39505845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006303368A Pending JP2008120700A (en) 2006-11-08 2006-11-08 Sulfonium salt

Country Status (1)

Country Link
JP (1) JP2008120700A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010152341A (en) * 2008-11-27 2010-07-08 Sumitomo Chemical Co Ltd Chemically amplified type photoresist composition for liquid immersion exposure
WO2010095385A1 (en) * 2009-02-20 2010-08-26 サンアプロ株式会社 Sulfonium salt, photo-acid generator, and photosensitive resin composition
JP2010215616A (en) * 2009-02-20 2010-09-30 San Apro Kk Sulfonium salt, photo-acid generator, photocurable composition, and cured product thereof
JP2010244034A (en) * 2009-03-18 2010-10-28 San Apro Kk Chemically amplified positive photoresist composition and method of producing resist pattern
JP2011063796A (en) * 2009-08-20 2011-03-31 San Apro Kk Photo-acid generator, photo-curable composition, and positive type photoresist composition
JP2011102269A (en) * 2009-11-11 2011-05-26 San Apro Kk Sulfonium salt, photo acid-generating agent, curable composition and positive photoresist composition
KR20180100186A (en) * 2016-03-07 2018-09-07 후지필름 가부시키가이샤 Active radiation-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, manufacturing method of electronic device
WO2021095356A1 (en) * 2019-11-12 2021-05-20 東洋合成工業株式会社 Sulfonium salt, acid generator, resist composition, and method for producing device
WO2021186846A1 (en) * 2020-03-17 2021-09-23 サンアプロ株式会社 Sulfonium salt, photoacid generator, curable composition, and resist composition

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115367A (en) * 1989-06-22 1991-05-16 General Electric Co <Ge> Peelable coating composition comprising ultraviolet-curing nontoxic epoxysilicowe and its manufacture
JPH07228041A (en) * 1994-02-18 1995-08-29 Sanko Chem Co Ltd Coupler composition and pressure-sensitive recording material
JPH10282669A (en) * 1996-03-11 1998-10-23 Fuji Photo Film Co Ltd Positive photosensitive composition
JPH1180118A (en) * 1997-09-05 1999-03-26 Nippon Kayaku Co Ltd New sulfonium salt, cation-polymerizable composition and its cured product
JP2002006480A (en) * 2000-06-22 2002-01-09 Fuji Photo Film Co Ltd Positive type resist composition
JP2002049151A (en) * 2000-01-17 2002-02-15 Fuji Photo Film Co Ltd Negative type resist composition
JP2002131897A (en) * 2000-10-20 2002-05-09 Fuji Photo Film Co Ltd Positive resist composition
JP2002202607A (en) * 2000-12-28 2002-07-19 Fuji Photo Film Co Ltd Positive type photoresist composition for exposure with far ultraviolet ray
JP2002311584A (en) * 2001-04-11 2002-10-23 Fuji Photo Film Co Ltd Negative type resist composition for use in electron beam or x-ray
JP2003316005A (en) * 2002-04-24 2003-11-06 Fuji Photo Film Co Ltd Positive resist composition
JP2004091698A (en) * 2002-09-02 2004-03-25 Konica Minolta Holdings Inc Actinic-radiation-curing composition, actinic-radiation-curing ink, and image formation method and inkjet recorder using the same
JP2004091558A (en) * 2002-08-30 2004-03-25 Konica Minolta Holdings Inc Active ray-curable ink and method for forming image therewith and inkjet recording device
JP2004188679A (en) * 2002-12-09 2004-07-08 Fuji Photo Film Co Ltd Cellulose acylate film, its manufacturing method, optical film using the film, liquid crystal display device and silver halide photosensitive material
JP2004203858A (en) * 2002-08-26 2004-07-22 Sumitomo Chem Co Ltd Acid-generating agent and resist composition
JP2005075885A (en) * 2003-08-29 2005-03-24 Konica Minolta Medical & Graphic Inc Photo cation-curing resin composition, sealing material for liquid crystal display or electroluminescent display, liquid crystal display or electroluminescent display using the sealing material, sealing method and production method
JP2005239877A (en) * 2004-02-26 2005-09-08 Konica Minolta Medical & Graphic Inc Composition of agent generating acid by active energy ray, active energy ray-curable composition, ink composition for inkjet, and image-forming method
JP2006037086A (en) * 2004-06-23 2006-02-09 Sekisui Chem Co Ltd Photocurable resin composition, adhesive for display device, method for manufacturing display device and electroluminescent device
JP2006058842A (en) * 2004-07-23 2006-03-02 Tokyo Ohka Kogyo Co Ltd Resist composition and method of forming resist pattern
JP2006227632A (en) * 2003-02-20 2006-08-31 Tokyo Ohka Kogyo Co Ltd Immersion lithography process-use resist protection film forming material, composite film and resist pattern forming method
JP2006257078A (en) * 2005-02-16 2006-09-28 Sumitomo Chemical Co Ltd Salt for acid generator of chemically amplified type resist composition
JP2006276458A (en) * 2005-03-29 2006-10-12 Fuji Photo Film Co Ltd Positive photoresist composition and pattern forming method using the same
JP2006276851A (en) * 2005-03-04 2006-10-12 Fuji Photo Film Co Ltd Positive resist composition and pattern-forming method using the same

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03115367A (en) * 1989-06-22 1991-05-16 General Electric Co <Ge> Peelable coating composition comprising ultraviolet-curing nontoxic epoxysilicowe and its manufacture
JPH07228041A (en) * 1994-02-18 1995-08-29 Sanko Chem Co Ltd Coupler composition and pressure-sensitive recording material
JPH10282669A (en) * 1996-03-11 1998-10-23 Fuji Photo Film Co Ltd Positive photosensitive composition
JPH1180118A (en) * 1997-09-05 1999-03-26 Nippon Kayaku Co Ltd New sulfonium salt, cation-polymerizable composition and its cured product
JP2002049151A (en) * 2000-01-17 2002-02-15 Fuji Photo Film Co Ltd Negative type resist composition
JP2002006480A (en) * 2000-06-22 2002-01-09 Fuji Photo Film Co Ltd Positive type resist composition
JP2002131897A (en) * 2000-10-20 2002-05-09 Fuji Photo Film Co Ltd Positive resist composition
JP2002202607A (en) * 2000-12-28 2002-07-19 Fuji Photo Film Co Ltd Positive type photoresist composition for exposure with far ultraviolet ray
JP2002311584A (en) * 2001-04-11 2002-10-23 Fuji Photo Film Co Ltd Negative type resist composition for use in electron beam or x-ray
JP2003316005A (en) * 2002-04-24 2003-11-06 Fuji Photo Film Co Ltd Positive resist composition
JP2004203858A (en) * 2002-08-26 2004-07-22 Sumitomo Chem Co Ltd Acid-generating agent and resist composition
JP2004091558A (en) * 2002-08-30 2004-03-25 Konica Minolta Holdings Inc Active ray-curable ink and method for forming image therewith and inkjet recording device
JP2004091698A (en) * 2002-09-02 2004-03-25 Konica Minolta Holdings Inc Actinic-radiation-curing composition, actinic-radiation-curing ink, and image formation method and inkjet recorder using the same
JP2004188679A (en) * 2002-12-09 2004-07-08 Fuji Photo Film Co Ltd Cellulose acylate film, its manufacturing method, optical film using the film, liquid crystal display device and silver halide photosensitive material
JP2006227632A (en) * 2003-02-20 2006-08-31 Tokyo Ohka Kogyo Co Ltd Immersion lithography process-use resist protection film forming material, composite film and resist pattern forming method
JP2005075885A (en) * 2003-08-29 2005-03-24 Konica Minolta Medical & Graphic Inc Photo cation-curing resin composition, sealing material for liquid crystal display or electroluminescent display, liquid crystal display or electroluminescent display using the sealing material, sealing method and production method
JP2005239877A (en) * 2004-02-26 2005-09-08 Konica Minolta Medical & Graphic Inc Composition of agent generating acid by active energy ray, active energy ray-curable composition, ink composition for inkjet, and image-forming method
JP2006037086A (en) * 2004-06-23 2006-02-09 Sekisui Chem Co Ltd Photocurable resin composition, adhesive for display device, method for manufacturing display device and electroluminescent device
JP2006058842A (en) * 2004-07-23 2006-03-02 Tokyo Ohka Kogyo Co Ltd Resist composition and method of forming resist pattern
JP2006257078A (en) * 2005-02-16 2006-09-28 Sumitomo Chemical Co Ltd Salt for acid generator of chemically amplified type resist composition
JP2006276851A (en) * 2005-03-04 2006-10-12 Fuji Photo Film Co Ltd Positive resist composition and pattern-forming method using the same
JP2006276458A (en) * 2005-03-29 2006-10-12 Fuji Photo Film Co Ltd Positive photoresist composition and pattern forming method using the same

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010152341A (en) * 2008-11-27 2010-07-08 Sumitomo Chemical Co Ltd Chemically amplified type photoresist composition for liquid immersion exposure
WO2010095385A1 (en) * 2009-02-20 2010-08-26 サンアプロ株式会社 Sulfonium salt, photo-acid generator, and photosensitive resin composition
JP2010215616A (en) * 2009-02-20 2010-09-30 San Apro Kk Sulfonium salt, photo-acid generator, photocurable composition, and cured product thereof
CN102317258A (en) * 2009-02-20 2012-01-11 三亚普罗股份有限公司 Sulfonium salt, photo-acid generator, and photosensitive resin composition
US8617787B2 (en) 2009-02-20 2013-12-31 San-Apro, Ltd. Sulfonium salt, photo-acid generator, and photosensitive resin composition
CN102317258B (en) * 2009-02-20 2014-06-04 三亚普罗股份有限公司 Sulfonium salt, photo-acid generator, and photosensitive resin composition
TWI460152B (en) * 2009-02-20 2014-11-11 San Apro Ltd Sulfonium salt,photoacidgenerator and photosensitive resin composition
JP2010244034A (en) * 2009-03-18 2010-10-28 San Apro Kk Chemically amplified positive photoresist composition and method of producing resist pattern
JP2011063796A (en) * 2009-08-20 2011-03-31 San Apro Kk Photo-acid generator, photo-curable composition, and positive type photoresist composition
JP2011102269A (en) * 2009-11-11 2011-05-26 San Apro Kk Sulfonium salt, photo acid-generating agent, curable composition and positive photoresist composition
KR20180100186A (en) * 2016-03-07 2018-09-07 후지필름 가부시키가이샤 Active radiation-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, manufacturing method of electronic device
JPWO2017154345A1 (en) * 2016-03-07 2018-10-11 富士フイルム株式会社 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, and electronic device manufacturing method
US20180364571A1 (en) 2016-03-07 2018-12-20 Fujifilm Corporation Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device
US10802399B2 (en) 2016-03-07 2020-10-13 Fujifilm Corporation Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device
KR102229834B1 (en) * 2016-03-07 2021-03-19 후지필름 가부시키가이샤 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, electronic device manufacturing method
WO2021095356A1 (en) * 2019-11-12 2021-05-20 東洋合成工業株式会社 Sulfonium salt, acid generator, resist composition, and method for producing device
KR20220100924A (en) 2019-11-12 2022-07-18 도요 고세이 고교 가부시키가이샤 Sulfonium salt, acid generator, resist composition and device manufacturing method
WO2021186846A1 (en) * 2020-03-17 2021-09-23 サンアプロ株式会社 Sulfonium salt, photoacid generator, curable composition, and resist composition
CN114901638A (en) * 2020-03-17 2022-08-12 三亚普罗股份有限公司 Sulfonium salt, photoacid generator, curable composition, and resist composition
EP4122915A4 (en) * 2020-03-17 2023-09-06 San-Apro Ltd. Sulfonium salt, photoacid generator, curable composition, and resist composition
CN114901638B (en) * 2020-03-17 2024-10-29 三亚普罗股份有限公司 Sulfonium salt, photoacid generator, curable composition, and resist composition

Similar Documents

Publication Publication Date Title
JP2008120700A (en) Sulfonium salt
JP5100115B2 (en) Sulfonium salt and acid generator
US8853441B2 (en) Sulfonium compound, photoacid generator, and resist composition
KR101871500B1 (en) Salt and photoresist composition
JP5919122B2 (en) Resin composition and pattern forming method using the same
US20070015084A1 (en) Photoactive compounds
KR20070096977A (en) Positive resist composition and pattern formation method using the same
TW201444790A (en) Sulfonium salt and photoacid generator
JP6299914B2 (en) Resist composition and salt
WO2004065377A1 (en) Sulfonium salts, radiation-sensitive acid generators, and positive radiation-sensitive resin compositions
KR102162533B1 (en) Salt and photoresist composition comprising the same
TW201520193A (en) Salt and photoresist composition comprising the same
KR20120110038A (en) Photoresist composition
JP4378872B2 (en) Photoacid generator, chemically amplified resist composition, and pattern formation method using the same
KR20140042753A (en) Stabilized acid amplifiers
JPWO2009119784A1 (en) CYCLIC COMPOUND, PROCESS FOR PRODUCING CYCLIC COMPOUND, PHOTORESIST BASE COMPRISING CYCLIC COMPOUND, PHOTORESIST COMPOSITION, FINE PROCESSING METHOD, SEMICONDUCTOR DEVICE AND DEVICE
JP4996898B2 (en) Positive resist composition and pattern forming method using the same
KR102500716B1 (en) Salt, acid generator, photoresist composition, and method for producing photoresist pattern
KR101047372B1 (en) Monomer, resin, resist composition using this resin, and manufacturing method of semiconductor device using this resist composition
JP2010138109A (en) Cyclic compound and method for producing the same
JP2008189597A (en) Sulfonium salt
JP5088933B2 (en) Sulfonium salt
JP5084289B2 (en) Sulfonium salt
JP5933308B2 (en) Chemically amplified resist composition, resist film using the same, resist-coated mask blanks, resist pattern forming method, and electronic device manufacturing method
JP5084288B2 (en) Sulfonium salt

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091105

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120619

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120626

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121106