JP2008147432A - Electronic circuit device, power converter and method for manufacturing the electronic circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit device, a power converter and a method for manufacturing the electronic circuit device, wherein the reliability for a surrounding environment is enhanced in a small size and at low cost. <P>SOLUTION: A control circuit board 60 is hermetically sealed by a cover 16 with which a metal circuit pattern 17 fixable to a circuit part of an external circuit device is integrated and to which a first connection terminal 7 is fixed; a metal circuit board 50; and a case 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic circuit device such as a power hybrid electronic device, a power conversion device using the electronic circuit device, and a method for manufacturing the electronic circuit device.

  FIG. 8 shows a conventional electronic circuit device such as a power hybrid electronic device. In FIG. 8, the metal circuit board 31 is fixed to the case 38 of the electronic circuit device, the power control element 34 is mounted on the circuit wiring pattern 33 formed on the metal circuit board 31, and the control circuit board 35 is connected to the metal circuit board 31. Various control elements 36 that are disposed on the upper side with a certain space therebetween and that control the power control element 34 are mounted on the circuit wiring pattern 33 of the control circuit board 35. The metal circuit board 31 and the control circuit board 35 are electrically connected by connection terminals 37 formed integrally with the case 38, and the signal terminals 40 and the connection terminals 37 connected to the control circuit board 35 are connected by the lead wires 24 to the circuit board 25. It is electrically connected to the external circuit element 18 via. In addition, the metal circuit board 31 on which the power control element 34 is mounted is filled with a resin having electrical insulation properties such as silicon resin, and the surface side of the control circuit board 35 on which the control element 36 is mounted is similarly filled with the resin. Thus, the reliability of the power control element 34 and the control element 36 can be improved, the withstand voltage between the circuit wiring patterns 33 can be improved, and the insulation between the substrates can be ensured.

Conventionally, an electronic circuit device such as a power hybrid electronic device is disclosed in Patent Document 1. In Patent Document 1, a metal circuit board and a control circuit board are arranged so as to overlap each other in a case where an upper surface and a lower surface are opened, and a signal terminal to an external circuit device protrudes outside the case, A technique for miniaturizing the entire circuit device is disclosed.
Japanese Patent Laying-Open No. 2004-63604 (FIG. 5)

  In recent years, with the expansion of applications of various electronic devices using electronic circuit devices, electronic circuit devices are also required to be improved in reliability and downsized. However, in the above-described conventional technology, various elements and circuit boards are included in the case. Since the electronic circuit device and the external circuit are electrically connected by lead wires, it is difficult to reduce the size and the productivity is low. The cost decreased and the cost increased. Furthermore, an electrically insulating resin such as silicon resin has a large expansion force due to thermal fluctuation, and there is a problem in reliability that the connection portion between the connection terminal and the signal terminal and the circuit board is easily disconnected due to the expansion force. Further, in order to further improve the reliability, if not only the front surface of the circuit board but also the back surface is filled with the resin, the space between the other circuit board placed in an overlapping manner must be further separated, and the electronic circuit device Downsizing becomes even more difficult. Further, in the prior art shown in FIG. 8, a load is applied to the connection portion of the connection terminal 37 and the control circuit board 35 due to vibration applied to the apparatus together with the expansion force due to heat of the electrically insulating resin, and the connection is easily disconnected. There was a problem above. The present invention has been made to solve the above-described problems. The present invention is a low-cost electronic circuit device that is small and has improved reliability with respect to the surrounding environment, and power conversion using the electronic circuit device. An object of the present invention is to provide a device and a method for manufacturing an electronic circuit device.

  In order to achieve the above object, the present invention provides a case, a metal circuit board fixed to the case and having a circuit wiring pattern formed on a metal base material through a heat-dissipating insulating layer, and fixed to the metal circuit board. A power control semiconductor element for performing power control; a control circuit board having a control circuit wiring pattern formed on an organic base; a control element fixed to the control circuit board for controlling the power control semiconductor element; and the control circuit board; A first connection terminal electrically connected and capable of energizing an external circuit device; a second connection terminal formed integrally with the case and electrically connecting the metal circuit board and the control circuit board; A metal circuit pattern capable of fixing circuit components of an external circuit device is integrally formed, the first connection terminal is fixed, and the control circuit board is formed by the metal circuit board and the case. Electronic circuit device, characterized in that it comprises a cover to seal the.

  According to this configuration, the control circuit board is housed inside the case, the metal circuit board, and the cover, and the control circuit board is connected to the external circuit device via the metal circuit pattern provided on the cover and the first connection terminal. Energization is possible.

  According to the present invention, in the electronic circuit device configured as described above, the power control semiconductor element and the control element are integrally filled with a resin having electrical insulation. According to this configuration, the metal circuit board to which the power control semiconductor element is fixed and the control circuit board to which the control element is fixed are blocked from the surrounding environment.

  According to the present invention, in the electronic circuit device configured as described above, the electronic circuit device has a signal terminal formed integrally with the cover, and the signal terminal is electrically connected to the first connection terminal and can be connected to an external circuit device. It is characterized by being. According to this configuration, the signal terminal is insulated by the cover, and the control circuit board and the external circuit device can be electrically connected.

  According to the present invention, in the electronic circuit device configured as described above, the electronic circuit device has a signal terminal formed integrally with the case, and the signal terminal is electrically connected to the metal circuit board and can be connected to an external circuit device. It is characterized by being. According to this configuration, the signal terminal is insulated by the case, and the metal circuit board and the external circuit device can be electrically connected.

  According to the present invention, in the electronic circuit device configured as described above, the first and second connection terminals sandwich the control circuit board between the front and back surfaces. According to this configuration, the control circuit board is held between the cover and the case via the first and second connection terminals, and is electrically connected to the first and second connection terminals.

  According to the present invention, in the electronic circuit device configured as described above, the electronic circuit device includes a first connector fixed to the control circuit board, and the first connector is electrically connected to the first connection terminal and is attached to the cover. It is characterized by contact. According to this configuration, the connection portion between the first connector and the first connection terminal is not exposed to the outside.

  According to the present invention, in the electronic circuit device configured as described above, the electronic circuit device includes a second connector fixed to the control circuit board, and the second connector is electrically connected to the second connection terminal and connected to the case. It is characterized by contact. According to this configuration, when the connection portion between the second connector and the second connection terminal is not exposed to the outside and the first connector is fixed to the control circuit board, the control circuit board connects the first and second connectors. And is held between the cover and the case.

  According to the present invention, in the electronic circuit device configured as described above, the first and second connectors are fixed at the same position on the front and back surfaces of the control circuit board. According to this configuration, the control circuit board is held between the cover and the case with a uniform force via the first and second connectors.

  According to the present invention, in the electronic circuit device configured as described above, the signal terminal is a cable having a connector, and the connector can be electrically connected to an external circuit device. According to this configuration, the electronic circuit device can be connected to the external circuit device within the movable range of the cable.

  According to the present invention, in the electronic circuit device configured as described above, the second connection terminal penetrates the control circuit board and is electrically connected to the first connector. According to this configuration, the connection portion between the second connection terminal and the first connector is not exposed to the outside, and the connection between the control circuit board and the external circuit device is easy.

  Moreover, this invention is an electric power converter characterized by using the electronic circuit apparatus of said structure. The power conversion device can be used for inverter devices of various electronic devices.

  The present invention is also a method for manufacturing an electronic circuit device having the above-described configuration, wherein the control circuit board having the power control semiconductor element fixed thereto is fixed to a case for fixing the metal circuit board to which the control element is fixed. After being held in the case so as to overlap with the metal circuit board with a space, the resin having electrical insulation is filled in the control element and the power control semiconductor element integrally, and after the filling The control circuit board is sealed by fixing the cover to the case. According to this configuration, the control element and the power control semiconductor element are filled with the resin in the same process, and the space between the metal circuit board and the control circuit board is integrally filled with the resin.

  The present invention is also a method for manufacturing an electronic circuit device having the above-described configuration, wherein the control circuit board is tilted and held with respect to the metal circuit board, and then the resin having the electrical insulating property is added to the control element. And the power control semiconductor element are integrally filled. According to this configuration, the bubbles generated in the resin move upward along the inclined back surface of the control circuit board by the buoyancy, and the bubbles are reduced in the resin.

  According to the present invention, the control circuit board is hermetically sealed with the cover in which the metal circuit pattern that can fix the circuit components of the external circuit device is integrally formed and the first connection terminal is fixed, and the metal circuit board and the case. The reliability of the control circuit board with respect to the surrounding environment such as humidity can be improved. In addition, since the control circuit board can be energized to the external circuit device through the metal circuit pattern provided on the cover and the first connection terminal, the number of electrical connection points can be reduced, the productivity is increased, and the electronic The circuit device can be made inexpensive.

  In addition, according to the present invention, since the power control semiconductor element and the control element are integrally filled with the electrically insulating resin, the reliability of each element is improved, the withstand voltage between the circuit wiring patterns is improved, and between the substrates The electrical insulation can be improved.

  In addition, according to the present invention, since the signal terminal formed integrally with the cover can be connected to the external circuit device, the number of electrical connection points can be reduced, the productivity is increased, and the electronic circuit device is inexpensive. Can be.

  Further, according to the present invention, since the signal terminal formed integrally with the case can be connected to the external circuit device, the number of electrical connection points can be reduced, the productivity is increased, and the electronic circuit device is inexpensive. Can be.

  Further, according to the present invention, since the first and second connection terminals sandwich the control circuit board, the control circuit board is securely fixed to the electronic circuit device, and the control circuit board and each connection terminal against vibration of the device. It is possible to secure a sufficient electrical connection. Furthermore, when the control circuit board is filled with an electrically insulating resin, even if an expansion force of the resin due to thermal fluctuations is generated, sufficient electrical connection between the control circuit board and each connection terminal can be ensured. .

  Further, according to the present invention, since each connection terminal is electrically connected to each connector fixed to the control circuit board, when the control circuit board is filled with an electrically insulating resin, the resin is connected to the connector and the connection terminal. Even if the expansion force of the resin due to thermal fluctuation is generated without entering the connection portion, the electrical connection between the control circuit board and the connection terminal can be ensured. In addition, since each connector comes into contact with the cover or case, the control circuit board is securely fixed to the electronic circuit device, and electrical connection between the control circuit board and each connection terminal is sufficiently secured against vibration of the device. be able to.

  Further, according to the present invention, since the first and second connectors are fixed at the same position on the front and back surfaces of the control circuit board, the control circuit board is more securely fixed to the electronic circuit device, and the vibration of the device is prevented. Electrical connection can be ensured. In addition, when the control circuit board is filled with an electrically insulating resin, the electrical connection between the control circuit board and the connection terminal can be ensured even if an expansion force of the resin due to thermal fluctuation occurs.

  In addition, according to the present invention, the signal terminal is a cable having a connector, and the connector can be electrically connected to the external circuit device. Therefore, even if the mounting accuracy of the electronic circuit device is low, the connection work with the external circuit device is possible. The electronic circuit device can be made inexpensive.

  Further, according to the present invention, since the second connection terminal penetrates the control circuit board and is electrically connected to the first connector, an expansion force of the electrically insulating resin is generated due to vibration of the device and thermal fluctuation. Also, electrical connection with each connection terminal can be ensured.

  According to the present invention, the control circuit board is held in the case for fixing the metal circuit board so as to overlap the metal circuit board with a space therebetween, and then the control element and the power control semiconductor element are integrated with the electric power. Since the insulating resin is filled, the reliability of each element is improved, the withstand voltage between the circuit wiring patterns is improved, and the electrical insulation between the substrates can be improved, and the metal circuit board and the control circuit Since the distance from the substrate is shortened, the electronic circuit device can be reduced in size. Further, since the resin is filled into each element only once, the production process is shortened, and the electronic circuit device can be made inexpensive.

  Further, according to the present invention, since the control circuit board and the power control semiconductor element are integrally filled with the electrically insulating resin after the control circuit board is tilted and held with respect to the metal circuit board, the resin is contained in the resin. Since the generated bubbles move upward along the inclined back surface of the control circuit board and the bubbles are reduced, it is possible to suppress bonding and peeling between the control circuit board and the connection terminal.

  Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments. The embodiment of the present invention shows the most preferable form of the invention, and the use of the invention and the terms shown here are not limited thereto.

(First embodiment)
A power hybrid electronic device that is an electronic circuit device is used in a power conversion device of an inverter device such as an air conditioner, a refrigerator, an automobile, and a solar battery. FIG. 1 is a cross-sectional view showing the electronic circuit device of the first embodiment. The electronic circuit device has a rectangular parallelepiped shape, a case 5 made of synthetic resin, a cover 16 of synthetic resin fixed to the upper side of the case 5 with screws or welding, and an epoxy on the lower side of the case 5. The inside is sealed with a metal circuit board 50 fixed with an adhesive such as resin or silicon resin. The control circuit board 60, the power control semiconductor element 4, the control element 12, and the like are mounted therein.

  In the metal circuit board 50, the circuit wiring pattern 3 is formed on the metal base 1 through the heat-dissipating insulating layer 2. The power control semiconductor element 4 mounted and fixed on the circuit wiring pattern 3 via the heat spreader 15 is inserted into the case 5 through one end of the second connection terminal 6 (formed integrally) via the wire 8. It is electrically connected by soldering. After the power control semiconductor element 4 is fixedly mounted on the metal circuit board 50 and connected to the wire 8, the power control semiconductor element 4 on the metal circuit board 50 is provided with an electrically insulating resin 9 such as silicon resin or epoxy resin. Fill. The second connection terminals 6 are arranged in at least three locations of the case 5 and have a pin shape in which the other end 6a protrudes from the case 5 into the electronic circuit device and has a sharp tip.

  The control circuit board 60 is disposed on the upper side so as to overlap the metal circuit board 50 with a space therebetween, and the control circuit wiring pattern is formed on both surfaces of the organic base material 10 such as a multilayer board using a glass epoxy resin or a composite base material. 11 is formed. A control element 12 for controlling the power control semiconductor element 4 is mounted and fixed on the control circuit pattern 11. The control element 12 mounted and fixed to the control circuit board 60 is filled with the electrically insulating resin 9.

  In addition, the control circuit board 60 is positioned by fitting the other end portion 6a of the second connection terminal 6 into the through hole portion 60a of the control circuit board 60, and the other end portion 6a is held in the through hole portion 60a. Are electrically connected to the power control semiconductor element 4.

  The cover 16 is disposed above the control circuit board 60 with a space therebetween, and a plurality of metal circuit patterns 17 are insert-molded. The signal terminals 13 and the first connection terminals 7 are mounted on one metal circuit pattern 17. A discrete circuit component 18 having a large shape such as a capacitor or a resistor of an external circuit device and the first connection terminal 7 are mounted and fixed to another metal circuit pattern 17. The first connection terminals 7 are arranged in at least three places of the cover 16, one end thereof is fixed to the metal circuit pattern 17, and the other end 7 a protrudes into the electronic circuit device and has a pin shape with a sharp tip. . The signal terminal 13 protrudes outside from the cover 16 and can be connected to an external circuit device. When the cover 16 is fitted into the case 5, the other end portion 7 a of the first connection terminal 7 is fitted into the through hole portion 60 a of the control circuit board 60, and the control circuit board 60 is connected to the signal terminal 13 via the first connection terminal 7. Electrically connected. Further, when the cover 16 is fixed to the case 5 with screws, welding, or the like, the front and back surfaces of the control circuit board 60 (the upper surface and the lower surface of the control circuit board 60 in FIG. 1) are sandwiched between the first connection terminal 7 and the second connection terminal 6. Thus, the control circuit board 60 is held inside the electronic circuit device. If the metal circuit pattern 17 is insert-molded so as to be along the lower surface of the cover 16, the outer side of the cover 16 becomes thick, and the cover 16 is less likely to be broken by external force.

  According to the first embodiment, the cover 16 integrally formed with the metal circuit pattern 17 for fixing the signal terminal 13 that can be connected to the external circuit device and the first connection terminal 7, the metal circuit board 50, and the case 5 By sealing the control circuit board 60, the reliability of the control circuit board 60 with respect to the surrounding environment such as humidity can be improved. Further, by making it possible to connect the signal terminal 13 formed integrally with the cover 16 to the external circuit device, it is possible to reduce the number of electrical connections, increase productivity, and reduce the cost of the electronic circuit device. Can do.

  Further, by filling the power control semiconductor element 4 and the control element 12 integrally with the electrically insulating resin 9, the reliability of the elements 4 and 12 is improved, the withstand voltage between the circuit wiring patterns is improved, and between the substrates. The electrical insulation can be improved.

  Further, by sandwiching the front and back surfaces of the control circuit board 60 between the first and second connection terminals 6 and 7, the control circuit board 60 is securely fixed to the electronic circuit device, and the control circuit board 60 and Electrical connection with each of the connection terminals 6 and 7 can be ensured. Further, when the control circuit board 60 is filled with the electrically insulating resin 9, the electrical connection between the control circuit board 60 and each of the connection terminals 6 and 7 is established even if an expansion force of the resin 9 is generated due to thermal fluctuation. Can be secured.

(Second Embodiment)
FIG. 2 is a cross-sectional view showing the electronic circuit device of the second embodiment. The signal terminal 19 and the first connector 20 different from the first embodiment will be described, and the description of the same configuration as the first embodiment will be omitted hereinafter.

  The signal terminal 19 is insert-molded in the case 5, one end of which is electrically connected to the power control semiconductor element 4 through a wire or the like, and the other end protrudes to the outside through the hole 16 a of the cover 16. Can be connected to. When the cover 16 is attached to the case 5, the signal terminal 19 is positioned between the case 5 and the cover 16. The first connector 20 is fixed to the control circuit board 60 by pressure contact so as to face the first connection terminal 7, and when the cover 16 is attached to the case 5, the upper surface portion of the first connector 20 contacts the cover 16, A contact spring inside the connector 20 is electrically connected to the first connection terminal 7.

  According to the second embodiment, by making the signal terminal 19 formed integrally with the case 5 connectable to the external circuit device, the number of electrical connection points can be reduced, the productivity is increased, and the electronic circuit device is The price can be reduced.

  In addition, when the control circuit board 60 is filled with the electrically insulating resin 9 by electrically connecting the first connection terminal 7 to the first connector 20 fixed to the control circuit board 60, the resin 9 becomes the first connector. The electrical connection between the control circuit board 60 and the first connection terminal 7 is ensured even if the expansion force of the resin 9 is generated due to thermal fluctuations without entering the connection portion between the control circuit board 60 and the first connection terminal 7. be able to. Further, when the first connector 20 abuts against the cover 16, the second connection terminal 6 holds the control circuit board 60, so that the control circuit board 60 is securely held by the electronic circuit device, and the vibration of the device. In contrast, the electrical connection between the control circuit board 60 and the connection terminals 6 and 7 can be sufficiently secured.

(Third embodiment)
FIG. 3 is a cross-sectional view showing the electronic circuit device of the third embodiment. The second connector 21 different from the first and second embodiments will be described.

  The second connector 21 is fixed to the back surface portion of the control circuit board 60 by pressing so as to face the second connection terminal 6. When the control circuit board 60 is placed on the case 5, the lower surface portion of the second connector 21 is placed on the case 5. The contact spring inside the second connector 21 is electrically connected to the second connection terminal 6.

  According to the third embodiment, when the second connector 21 abuts against the case 5, the first circuit board 20 abuts against the cover 16, so that the control circuit board 60 is securely held by the electronic circuit device. The electrical connection between the control circuit board 60 and each of the connection terminals 6 and 7 can be sufficiently secured against the vibration.

(Fourth embodiment)
FIG. 4 is a cross-sectional view showing the electronic circuit device of the fourth embodiment. The arrangement of the first and second connectors 20 and 21 and the filling method of the electrically insulating resin 9 different from the above embodiment will be described.

  The first and second connectors 20 and 21 are fixed at the same position on the front and back surfaces of the control circuit board 60. When the control circuit board 60 is placed on the case 5, the lower surface portion of the second connector 21 contacts the case 5, and the contact spring inside the second connector 21 is electrically connected to the second connection terminal 6. When the cover 16 is attached to the case 5, the upper surface portion of the first connector 20 contacts the cover 16, and the contact spring inside the first connector 20 is electrically connected to the first connection terminal 7.

  With respect to the filling method of the electrically insulating resin 9, the metal circuit board 50 to which the power control semiconductor element 4 is fixed is fixed to the case 5, and the control circuit board 60 to which the control element 12 is fixed has a space with respect to the metal circuit board 50. When the case 5 is filled with the electrically insulating resin 9 after being held in the case 5 on the upper side so as to overlap each other, the power control semiconductor element 4 and the control element 12 fixed to the back surface of the control circuit board 60 are sealed. When the resin 9 fills the gap between the metal circuit board 50 and the control circuit board 60 and the resin 9 is further filled, the control element 12 on the control circuit board 60 is sealed together with the metal circuit board 50. .

  According to the fourth embodiment, the first and second connectors 20 and 21 are provided at the same position on the front and back surfaces of the control circuit board 60, so that the control circuit board 60 can be more securely held in the electronic circuit device, and the device The electrical connection between the control circuit board 60 and each of the connection terminals 6 and 7 can be sufficiently secured against the vibration.

  Further, after holding the control circuit board 60 in the case 5 to which the metal circuit board 50 is fixed, the gap between the metal circuit board 50 and the control circuit board 60 is integrally filled with the electrically insulating resin 9, and the control element 12 is further filled. The control circuit board 60 is also filled and the control element 12 and the power control semiconductor element 4 are sealed, whereby the withstand voltage between the circuit wiring patterns can be improved and the electrical insulation between the boards can be improved. At the same time, the distance between the substrate 50 and the control circuit substrate 60 can be reduced to reduce the size of the electronic circuit device. Moreover, since the resin 9 is filled in each element of the control circuit board 60 and the metal circuit board 50 only once, the production process is shortened, and the electronic circuit device can be made inexpensive.

(Fifth embodiment)
FIG. 5 is a cross-sectional view showing an electronic circuit device of a fifth embodiment. A filling method of the electrically insulating resin 9 different from the fourth embodiment will be described.

  The lengths of the plurality of first connectors 20 differ depending on the position where they are fixed to the control circuit board 60, and the left connector 20 in FIG. 5 is long and the right connector is short. Further, the lengths of the plurality of second connectors 21 are also different, with the connector 21 on the left side in FIG. 5 being short and the right side being long. When the control circuit board 60 is placed on the case 5, the second connector 21 comes into contact with the case 5 with the control circuit board 60 tilted, and the second connector 21 is electrically connected to the second connection terminal 6. When the electrically insulating resin 9 is filled in the case 5, the power control semiconductor element 4 and the control element 12 fixed to the back surface of the control circuit board 60 are sealed, and the resin 9 is sealed with the metal circuit board 50 and the control circuit board 60. When the resin 9 is filled, the control element 12 on the control circuit board 60 is sealed together with the metal circuit board 50.

  According to the fifth embodiment, after the control circuit board 60 is held while being inclined with respect to the metal circuit board 50, the electrical insulating resin 9 is filled into the control element 12 and the power control semiconductor element 4, thereby providing electrical insulation. The bubbles generated in the conductive resin 9 move upward along the inclined back surface of the control circuit board 60, and the bubbles are reduced in the resin 9, so that the control circuit board 60 and the connection terminals are bonded and peeled off. Can be suppressed.

(Sixth embodiment)
FIG. 6 is a cross-sectional view illustrating an electronic circuit device according to a sixth embodiment. The connector-attached cable 22 different from the above embodiment will be described.

  The connector-attached cable 22 has a connector 22a at one end that can be connected to an external circuit device, a connector 22b at the other end is fixed to the cover 16 at a position facing the first connector 20, and the connector 22b and the first connector 20 are connected. An electrically connected and flexible cable is embedded in the cover 16 to connect the connectors 22a and 22b.

  According to the sixth embodiment, the connector 22a of the cable 22 with the connector is electrically connected to the external circuit device, so that the connection work with the external circuit device is easy even when the mounting accuracy of the electronic circuit device is low, Electronic circuit devices can be made inexpensive.

(Seventh embodiment)
FIG. 7 is a cross-sectional view showing an electronic circuit device according to a seventh embodiment. Connection of the second connection terminal 6 different from the above embodiment will be described. The first connector 20 is provided on the control circuit board 60 at a position facing the second connection terminal 6. The second connection terminal 6 penetrates the control circuit board 6 and is electrically connected to the first connector 20.

  According to the seventh embodiment, when the second connection terminal 6 penetrates the control circuit board 60 and is electrically connected to the first connector 20, the expansion force of the electrically insulating resin 9 due to vibration of the device or thermal fluctuation is increased. Even if it occurs, electrical connection with each connection terminal can be ensured.

  In the first to seventh embodiments, the control circuit board 60 is sealed with the case 5, the metal circuit board 50, and the cover 16, and the control circuit board 60 is sealed with the first and second connection terminals 6, 7 or the first. In addition, the configuration in which the second connectors 20 and 21 are sandwiched is shown. However, the present invention is not limited to this, and the control circuit board 60 may be held on the case 5 by screws or adhesion. Also in this case, as described above, since the control circuit board 60 is sealed, the reliability of the control circuit board 60 with respect to the surrounding environment such as humidity can be improved.

  In the second embodiment, the first connector 20 and the second connection terminal 6 sandwich the control circuit board 60, and the control circuit board 60 is held in the electronic circuit device. Not limited to this, the first connection terminal 7 and the second connector 21 may sandwich the control circuit board 60. Also in this case, as described above, the control circuit board 60 can be securely held in the electronic circuit device, and electrical connection between the control circuit board 60 and the first and second connection terminals 6 and 7 can be ensured.

  Moreover, in the said 4th Embodiment, although the 1st and 2nd connectors 20 and 21 showed the structure which adheres in the same position in the front and back of the control circuit board 60, this invention is not limited to this structure, Control circuit board It may be fixed at any position on the front and back surfaces of 60. In this case as well, as described above, the control circuit board 60 can be securely fixed to the electronic circuit device to ensure electrical connection.

These are sectional drawings which show the electronic circuit apparatus which is 1st Embodiment of this invention. These are sectional drawings which show the electronic circuit apparatus which is 2nd Embodiment of this invention. These are sectional drawings which show the electronic circuit apparatus which is 3rd Embodiment of this invention. These are sectional drawings which show the electronic circuit apparatus which is 4th Embodiment of this invention. These are sectional drawings which show the electronic circuit apparatus which is 5th Embodiment of this invention. These are sectional drawings which show the electronic circuit apparatus which is 6th Embodiment of this invention. These are sectional drawings which show the electronic circuit apparatus which is 7th Embodiment of this invention. These are sectional drawings which show the conventional electronic circuit device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal base material 2 Heat dissipation insulating layer 3 Circuit wiring pattern 4 Power control semiconductor element 5 Case 6 2nd connection terminal 7 1st connection terminal 8 Wire 9 Electrical insulating resin 10 Organic base material 11 Control circuit wiring pattern 12 Control element 13 , 19 Signal terminal 15 Heat spreader 16 Cover 17 Metal circuit pattern 18 Circuit component 20 First connector 21 Second connector 22 Cable with connector 50 Metal circuit board 60 Control circuit board

Claims (13)

Case and
A metal circuit board fixed to the case and having a circuit wiring pattern formed on the metal base via a heat-dissipating insulating layer;
A power control semiconductor element that is fixed to the metal circuit board and performs power control;
A control circuit board having a control circuit wiring pattern formed on an organic substrate;
A control element that is fixed to the control circuit board and controls the power control semiconductor element;
A first connection terminal electrically connected to the control circuit board and capable of energizing an external circuit device;
A second connection terminal formed integrally with the case and electrically connecting the metal circuit board and the control circuit board;
A metal circuit pattern capable of fixing circuit components of an external circuit device is integrally formed, the first connection terminal is fixed, and a cover for sealing the control circuit board with the metal circuit board and the case is provided. An electronic circuit device comprising:   The electronic circuit device according to claim 1, wherein the power control semiconductor element and the control element are integrally filled with a resin having electrical insulation.   3. A signal terminal formed integrally with the cover, wherein the signal terminal is electrically connected to the first connection terminal and can be connected to an external circuit device. The electronic circuit device described.   4. A signal terminal integrally formed with the case, wherein the signal terminal is electrically connected to the metal circuit board and is connectable to an external circuit device. An electronic circuit device according to claim 1.   5. The electronic circuit device according to claim 1, wherein the first and second connection terminals sandwich the control circuit board between the front and back surfaces. 6.   5. The first connector according to claim 1, further comprising a first connector fixed to the control circuit board, wherein the first connector is electrically connected to the first connection terminal and abuts on the cover. The electronic circuit device according to any one of the above.   5. The apparatus according to claim 1, further comprising a second connector fixed to the control circuit board, wherein the second connector is electrically connected to the second connection terminal and abuts on the case. The electronic circuit device according to any one of the above.   8. The electronic circuit device according to claim 6, wherein the first and second connectors are fixed at the same position on the front and back surfaces of the control circuit board.   9. The electronic circuit device according to claim 3, wherein the signal terminal is a cable having a connector, and the connector is electrically connectable to an external circuit device.   The electronic circuit device according to claim 6, wherein the second connection terminal penetrates the control circuit board and is electrically connected to the first connector.   The power converter device using the electronic circuit device in any one of Claims 1-10. A method for manufacturing an electronic circuit device according to any one of claims 1 to 10,
The control circuit board to which the power control semiconductor element is fixed is held in the case so as to overlap the metal circuit board with a space in a case for fixing the metal circuit board to which the control element is fixed. Later, the control element and the power control semiconductor element are integrally filled with the resin having electrical insulation, and after the filling, the cover is fixed to the case and the control circuit board is sealed. Manufacturing method of electronic circuit equipment.   13. The control element and the power control semiconductor element are integrally filled with the electrically insulating resin after the control circuit board is tilted and held with respect to the metal circuit board. The manufacturing method of the electronic circuit apparatus of description.

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