JP2008141212A - Manufacture of laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacture of a laminated ceramic electronic component, in which productivity in a laminating process can be improved, occurrence of tear or wrinkles can be prevented in a ceramic green sheet, the ceramic green sheet can be formed with a uniform thickness, and no pin holes are generated in the ceramic green sheet. <P>SOLUTION: An internal electrode 104 is formed on a dielectric ceramic green sheet 102 on a carrier film 100. Another dielectric ceramic green sheet 102' is formed on another carrier film 100' having a release layer with a weaker peeling force of dielectric ceramic green sheet than that of a release layer of the carrier film 100. The dielectric ceramic green sheet 102' is thermocompression bonded to the dielectric ceramic green sheet 102. Then, the carrier film 100' is peeled off from the dielectric ceramic green sheet 102'. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component, and more particularly to a method for manufacturing a multilayer ceramic electronic component for manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor or a multilayer ceramic inductor.

  A conventional method for manufacturing a multilayer ceramic capacitor as the background of the present invention is disclosed in Japanese Patent Laid-Open Nos. 6-124848, 6-342736, 8-250370, 9-007883, and 11-300727. . In these multilayer ceramic capacitor manufacturing methods, two or more layers are formed on a carrier film in the order of dielectric ceramic green sheet, internal electrode, dielectric ceramic green sheet, internal electrode, etc. Laminated by sheet construction method. In this case, the dielectric ceramic green sheet is printed on the lower dielectric ceramic green sheet so as to cover the carrier film or the internal electrode, such as a gravure printing method, a screen printing method, a doctor blade method, a curtain coater method, etc. The coating method is used.

JP-A-6-124848 JP-A-6-342736 JP-A-8-250370 JP-A-9-007883 JP-A-11-300727

Multilayer ceramic capacitors are becoming thinner and multi-layered due to demands for large capacity, and in recent years, dielectric layers with a thickness of 5 μm or less and 200 or more dielectric layers are mass-produced. It has become.
However, an increase in the number of stacked sheets causes problems such as a decrease in productivity and an increase in cost in the stacking process. In addition, the thinning of the dielectric layer causes a problem of tearing and wrinkling of the dielectric ceramic green sheet during sheet handling for peeling and stacking from the carrier film.
In order to solve these problems, a method is proposed in which two or more layers of dielectric ceramic green sheets and internal electrodes are formed on a carrier film, and the unit sheets are laminated by a sheet method, as in the prior art described above. Has been.
Thereby, it is possible to improve productivity by reducing the number of stacked layers in the stacking process and to prevent the dielectric ceramic green sheet from being broken or wrinkled by improving the sheet strength.
However, in the above conventional technique, since the dielectric ceramic green sheet is formed using the printing method or the coating method after the internal electrode is formed, the thickness of the dielectric ceramic green sheet is not uniform, and the dielectric ceramic green sheet is not uniform. There is a problem that pinholes are easily generated in the ceramic green sheet, the generated pinholes cannot be detected, and the position of the internal electrode is distorted due to the effect of heat when the dielectric ceramic green sheet is dried. is there. These problems become more significant as the thickness of the dielectric layer becomes thinner. As a capacitor, there are problems such as an increase in short-circuit failure and breakdown voltage failure, IR deterioration, increased capacitance variation, and a decrease in life and reliability. cause.
The problem as described above also exists in a method for manufacturing another multilayer ceramic electronic component such as a multilayer ceramic inductor.

  Therefore, the main object of the present invention is to improve the productivity in the lamination process, to prevent the ceramic green sheet from being broken or wrinkled, and to form the ceramic green sheet with a uniform thickness. It is possible to provide a method for manufacturing a multilayer ceramic electronic component in which no pinhole is generated in the ceramic green sheet.

The method for manufacturing a multilayer ceramic electronic component according to the present invention includes a first step of forming a ceramic green sheet on a carrier film, a second step of printing an internal electrode and an alignment mark on the ceramic green sheet, and drying. A third step of forming another ceramic green sheet on another carrier film, a fourth step of pressing another ceramic green sheet on the ceramic green sheet on the carrier film, and another carrier film from the other ceramic green sheet And a sixth step of reading an alignment mark printed on the ceramic green sheet through another ceramic green sheet with an image sensor and printing another internal electrode on the other ceramic green sheet. And ceramic green sheet, internal power And a seventh step of producing a unit sheet comprising a plurality of ceramic green sheets and comprising a plurality of ceramic green sheets and comprising a plurality of unit sheets, and a release layer of the carrier film as another carrier film. A method for producing a multilayer ceramic electronic component in which a carrier film having a release layer having a weaker peeling force of the ceramic green sheet is used.
In the method for manufacturing a multilayer ceramic electronic component according to the present invention, a ceramic paste for eliminating a step due to an internal electrode is printed on a ceramic green sheet and dried, and a ceramic paste for eliminating a step due to another internal electrode May be printed on another ceramic green sheet and dried.
Further, in the method for manufacturing a multilayer ceramic electronic component according to the present invention, during the printing of the ceramic paste, through the carrier film and the ceramic green sheet or through another ceramic green sheet for the alignment of the internal electrode and the ceramic paste. The alignment mark may be read by an image sensor.
Furthermore, in the method for manufacturing a multilayer ceramic electronic component according to the present invention, the ceramic green sheet is a dielectric ceramic green sheet, the other ceramic green sheet is another dielectric ceramic green sheet, and the multilayer ceramic electronic component is a multilayer ceramic green sheet. A capacitor may be used.
According to another method of manufacturing a multilayer ceramic electronic component according to the present invention, a first step of forming a ceramic green sheet on a carrier film, an internal electrode and an alignment mark printed on the ceramic green sheet, and dried. A second step, a third step of forming another ceramic green sheet on another carrier film, a fourth step of pressing another ceramic green sheet on the ceramic green sheet on the carrier film, and another ceramic green sheet. A fifth step of peeling another carrier film; and a sixth step of reading an alignment mark through the carrier film and the ceramic green sheet with an image sensor and printing another internal electrode on the other ceramic green sheet based on this. , Ceramic green sheet, A unit sheet comprising a part electrode, another ceramic green sheet, and another internal electrode, and a seventh step of laminating a plurality of unit sheets, wherein the ceramic green sheet is separated from the release layer of the carrier film as another carrier film. A method for producing a multilayer ceramic electronic component in which a carrier film having a release layer having a weak peeling force is used.
In another method of manufacturing a multilayer ceramic electronic component according to the present invention, a unit sheet composed of three or more sets of ceramic green sheets and internal electrodes is formed on a carrier film by repeating the third to sixth steps a plurality of times. You may make it do.
Further, in another method for manufacturing a multilayer ceramic electronic component according to the present invention, a step of printing and drying a ceramic paste on a ceramic green sheet for eliminating a step due to the internal electrode and a step due to another internal electrode are eliminated. Printing and drying a ceramic paste on another ceramic green sheet, and aligning the internal electrode with the ceramic paste through the carrier film and the ceramic green sheet when printing the ceramic paste The mark may be read by an image sensor.
Further, in another method for manufacturing a multilayer ceramic electronic component according to the present invention, the ceramic green sheet is a dielectric ceramic green sheet, the other ceramic green sheet is another dielectric ceramic green sheet, and the multilayer ceramic electronic component is A multilayer ceramic capacitor may be used.
Further, in another method of manufacturing a multilayer ceramic electronic component according to the present invention, a plurality of ceramic green sheets are stacked between internal electrodes in a unit sheet by repeating the third to fifth steps a plurality of times. Also good. In this case, the plurality of ceramic green sheets are formed on another carrier film by forming another ceramic green sheet on another ceramic green sheet formed on another carrier film in the third step, for example. After being sequentially laminated, the layers are laminated on the internal electrode at once.
Furthermore, in another method for producing a laminated ceramic electronic component according to the present invention, a plurality of ceramic green sheets may be laminated between unit sheets by laminating ceramic green sheets as the uppermost layer of unit sheets. Alternatively, a plurality of ceramic green sheets may be laminated between unit sheets by laminating a plurality of ceramic green sheets as a lower layer including the lowermost layer of the unit sheets.
Furthermore, in the method for manufacturing a multilayer ceramic electronic component according to the present invention and the method for manufacturing another multilayer ceramic electronic component according to the present invention, it is preferable that the unit sheet is pressure-bonded with a roll.

In the method for manufacturing a multilayer ceramic electronic component according to the present invention, unit sheets including two or more ceramic green sheets are stacked. It is possible to prevent sheet tearing and wrinkle generation.
Furthermore, in the method for manufacturing a multilayer ceramic electronic component according to the present invention, the ceramic green sheet and another ceramic green sheet are separately formed and dried, so that the thickness of these ceramic green sheets can be formed uniformly. No pinholes are generated in the ceramic green sheet. Therefore, distortion of the position of the internal electrode is unlikely to occur due to the influence of heat when the ceramic green sheet is dried. Therefore, for example, it is possible to prevent problems such as an increase in short-circuit failure or breakdown voltage failure, IR deterioration, increase in capacitance variation, and reduction in life and reliability as a multilayer ceramic capacitor.

  The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.

  FIG. 1 is an illustrative view showing one example of a multilayer ceramic capacitor to which the present invention is applied. A multilayer ceramic capacitor 10 shown in FIG. 1 includes a rectangular parallelepiped multilayer body 12. The stacked body 12 includes a plurality of dielectric layers 14 to be stacked. Internal electrodes 16 are respectively formed between the plurality of dielectric layers 14. Two external electrodes 18 and 20 are formed on both sides of the laminate 12. One external electrode 18 is connected to the internal electrodes 16 every other layer, and the other external electrode 20 is connected to the remaining internal electrodes 16.

  Next, a method for manufacturing the multilayer ceramic capacitor 10 shown in FIG. 1 will be described.

(Example 1)
First, a belt-like carrier film 100 is prepared. The carrier film 100 has a release layer (not shown) on the surface. This release layer is for facilitating peeling of a dielectric ceramic green sheet 102 described later from the carrier film 100.
As shown in FIG. 2, a dielectric ceramic green sheet 102 is formed on a carrier film 100 by, for example, a die coater, a doctor blade coater, a reverse roll coater, and the like, and dried.

  Next, as shown in FIG. 3, a plurality of internal electrodes 104 are printed on the dielectric ceramic green sheet 102 by a printing method such as a screen printing method or a gravure printing method and dried. In this case, on the dielectric ceramic green sheet 102, an alignment mark 106, which becomes a reference when printing another internal electrode 104 ′ to be described later, is printed simultaneously with the internal electrode 104 using the same material as the internal electrode 104.

Further, another belt-like carrier film 100 'is prepared. This carrier film 100 'has a release layer (not shown) on its surface. This release layer is for facilitating peeling of another dielectric ceramic green sheet 102 ′, which will be described later, from the carrier film 100 ′. As the release layer of the other carrier film 100 ′, a material having a weaker peeling force of the dielectric ceramic green sheet than the release layer of the carrier film 100 is selected. Specifically, as the peeling force of another dielectric ceramic green sheet 102 ′ from the release layer of another carrier film 100 ′, the peeling force of the ceramic green sheet 102 from the release layer of the carrier film 100 is 70% or less is desirable.
As shown in FIG. 4, another dielectric ceramic green sheet 102 'is formed on another carrier film 100' using, for example, a die coater or a doctor blade coater, and dried. In this case, another dielectric ceramic green sheet 102 ′ is formed with the same composition and thickness as the dielectric ceramic green sheet 102.

  Next, as shown in FIG. 5, another dielectric ceramic green sheet 102 ′ is thermocompression bonded to the dielectric ceramic green sheet 102.

  Then, as shown in FIG. 6, another carrier film 100 ′ is peeled from another dielectric ceramic green sheet 102 ′.

  As described above, in order to thermocompression bond another dielectric ceramic green sheet 102 'to the dielectric ceramic green sheet 102, as shown in FIG. 7, there are two carrier films 100 and the like and another carrier film 100' and the like. The carrier films 100 and 100 'are fed while being sandwiched between the rolls 200 and 200, and the rolls 200 and 200 are rotated. At the same time, heat and pressure are applied to the dielectric ceramic green sheets 102 and 102'. The pressure-bonding strength is preferably at least enough to prevent another dielectric ceramic green sheet 102 'from peeling off in the next step.

  In order to separate another carrier film 100 ′ from another dielectric ceramic green sheet 102 ′ as described above, another carrier film 100 ′ passes between the rolls 200 and 200 as shown in FIG. Pulled upwards.

  Next, as shown in FIG. 8, a plurality of other internal electrodes 104 'are printed on another dielectric ceramic green sheet 102' by a printing method such as a screen printing method or a gravure printing method and dried. Is done. In this case, the plurality of other internal electrodes 104 ′ are formed so as to generate a capacitance relative to the plurality of internal electrodes 104. In this case, the alignment mark 106 is read by the image sensor through another dielectric ceramic green sheet 102 ′ for alignment between the plurality of internal electrodes 104 and another plurality of internal electrodes 104 ′. For alignment between the plurality of internal electrodes 104 and another plurality of internal electrodes 104 ′, the alignment mark 106 may be read by the image sensor through the carrier film 100 and the dielectric ceramic green sheet 102. .

  Then, as shown in FIG. 9, a unit sheet 108 including two layers of dielectric ceramic green sheets 102 and 102 ′ on the carrier film 100 is peeled from the carrier film 100 and laminated. In this case, the unit sheet 108 is laminated after being peeled from the carrier film 100. The unit sheet 108 may be peeled off from the carrier film 100 after being laminated. Further, outer layers 110 and 110 similar to the above-described dielectric ceramic green 102 are thermocompression bonded to the upper and lower sides of the laminated unit sheets 108, respectively. Thereby, a laminated body 112 such as the unit sheet 108 is formed.

  Thereafter, the multilayer body 112 is cut into a predetermined size, fired, and an external electrode is formed, whereby the multilayer ceramic capacitor 10 is manufactured.

In the method for manufacturing the multilayer ceramic capacitor 10 described above, since the unit sheets 108 including the two layers of dielectric ceramic green sheets 102 and 102 'are stacked, the productivity in the stacking process can be improved by reducing the number of unit sheets 108 stacked. It becomes possible to improve.
Further, since the thickness of the unit sheet 108 is more than twice the thickness of the dielectric ceramic green sheet 102 (102 '), the sheet strength is improved, and the dielectric ceramic green sheets 102 and 102' are not torn or wrinkled. It becomes possible to prevent.
Furthermore, since all the dielectric ceramic green sheets 102 and 102 'are formed by the same construction method (sheet forming), the thickness can be uniform and there can be no pinholes, and the performance as a capacitor is deteriorated. Do not invite.
Further, by weakening the peeling force of the release layer of the carrier film 100 ′ on the side to be bonded, the dielectric ceramic green sheets 102 and 102 ′ are placed on the carrier film 100 side when the carrier film 100 ′ is released after the pressing. Can be prevented from being broken.
Further, by adopting a pressure bonding method in which a sheet superposed on two rolls 200, 200 is sandwiched, the sheet is fed while rotating the rolls 200, 200, and heat and pressure are applied simultaneously, High speed pressure bonding of 20 m / min or more is possible without generating an air trap. In addition, by finishing the parallelism, roundness, and diameter of the two rolls 200, 200 with high accuracy, it is possible to perform pressure bonding with small variation in sheet thickness after pressure bonding.
Moreover, since the alignment mark 106 is printed on the dielectric ceramic green sheet 102, it is excellent in printability compared with the case where it prints on the carrier film 100 which has a release layer.
Furthermore, since the alignment mark 106 can be provided at any location on the dielectric ceramic green sheet 102, the alignment accuracy is improved. Note that. In JP-A-6-124848 and JP-A-11-300727, it is necessary to provide an alignment mark on the edge of the carrier film, and there is a problem that it is easily affected by local stretch distortion caused by heat during drying.
Further, since the alignment mark 106 is printed on the dielectric ceramic green sheet 102, it is not necessary to provide an unnecessary space in the carrier film 100 as compared with the case of printing on the carrier film 100. Use efficiency improves.

(Example 2)
In the second embodiment, as compared with the first embodiment, another dielectric ceramic green sheet 102 ′ is formed on another carrier film 100 ′ and dried, and the dielectric ceramic green sheet 102 (102) on the carrier film 100 is dried. ′) A step of thermocompression bonding another dielectric ceramic green sheet 102 ′, a step of peeling another carrier film 100 ′ from another dielectric ceramic green sheet 102 ′, and another dielectric ceramic green sheet 102 ′. The process of printing and drying another internal electrode 104 'on the top is repeated five times. Therefore, in Example 2, as shown in FIG. 10, six sets of dielectric ceramic green sheets 102 (102 ′) and unit sheets 108 of internal electrodes 104 (104 ′) are formed on a carrier film 100. Therefore, in Example 2, the unit sheet 108 including the six layers of dielectric ceramic green sheets 102 and 102 ′ is peeled from the carrier film 100 and laminated.

The second embodiment has the same effects as the first embodiment.
Further, in the second embodiment, the unit sheet 108 includes six layers of dielectric ceramic green sheets 102 and 102 ′ as compared with the first embodiment. Therefore, the number of unit sheets 108 to be stacked is further reduced to produce in the stacking process. It is possible to further improve the performance.
Furthermore, in Example 2, the thickness of the unit sheet 108 is six times that of the dielectric ceramic green sheet 102 (102 ') as compared with Example 1, so that the sheet strength is further improved and the dielectric ceramic green is increased. It is possible to prevent tearing and wrinkling from occurring on the sheets 102 and 102 '.

(Example 3)
In the third embodiment, as compared with the first embodiment, as shown in FIG. 11, a step of printing and drying a ceramic paste 114 for eliminating a step due to the internal electrode 104 on the dielectric ceramic green sheet 102 by a screen printing method. Have
Further, in the third embodiment, compared with the first embodiment, as shown in FIG. 12, a ceramic paste 114 ′ for eliminating a step due to another internal electrode 104 ′ is formed on another dielectric ceramic green sheet 102 ′. It has the process of printing and drying by a screen printing method.
Therefore, in Example 3, as shown in FIG. 13, a laminated body 112 such as a unit sheet 108 having ceramic pastes 114 and 114 ′ is formed.

The third embodiment has the same effects as the first embodiment.
Further, compared to the first embodiment, the third embodiment eliminates a step due to the internal electrode 104, and thus has an effect that printing can be performed with high accuracy with less blurring when another internal electrode 104 'is printed.

Example 4
In Example 4, as compared with Example 3, another dielectric ceramic green sheet 102 ′ is formed on another carrier film 100 ′ and dried, and the dielectric ceramic green sheet 102 (102 on the carrier film 100) is dried. ′) A step of thermocompression bonding another dielectric ceramic green sheet 102 ′, a step of peeling another carrier film 100 ′ from another dielectric ceramic green sheet 102 ′, and another dielectric ceramic green sheet 102 ′. A process of printing another internal electrode 104 ′ on top and drying, and a ceramic paste 114 ′ for eliminating a step caused by the other internal electrode 104 ′ on another dielectric ceramic green sheet 102 ′ by screen printing. And the process of drying is repeated 5 times. Therefore, in Example 4, as shown in FIG. 14, units of six sets of dielectric ceramic green sheets 102 (102 ′), internal electrodes 104 (104 ′), and ceramic paste 114 (114 ′) are formed on a carrier film 100. A sheet 108 is formed. Therefore, in Example 4, the unit sheet 108 including the six layers of dielectric ceramic green sheets 102 and 102 ′ is peeled from the carrier film 100 and laminated.

The fourth embodiment has the same effects as the third embodiment.
Further, in the fourth embodiment, the unit sheet 108 includes six layers of dielectric ceramic green sheets 102 and 102 ′ as compared with the third embodiment. Therefore, the production in the stacking process is further reduced by further reducing the number of stacked unit sheets 108. It is possible to further improve the performance.
Further, in Example 4, the thickness of the unit sheet 108 is 6 times the thickness of the dielectric ceramic green sheet 102 (102 ') as compared with Example 3, so that the sheet strength is further improved and the dielectric ceramic green is increased. It is possible to prevent tearing and wrinkling from occurring on the sheets 102 and 102 '.

In Examples 1 to 4 described above, the unit sheet 108 includes a two-layer or six-layer dielectric ceramic green sheet. In the present invention, the unit sheet has three layers, four layers, five layers, or seven layers or more. A dielectric ceramic green sheet may be included.
Moreover, although the above-mentioned Examples 1-4 are the manufacturing methods of the multilayer ceramic capacitor using a dielectric ceramic green sheet, this invention is other ceramic green sheets, such as a multilayer ceramic inductor using a magnetic body ceramic green sheet. The present invention can also be applied to a method for manufacturing other multilayer ceramic electronic components using the above.

(Example 5)
In Example 5, as in Example 1, as shown in FIG. 15, a dielectric ceramic green sheet 102 was formed on a carrier film 100 having a release layer (not shown) on the surface, dried, Next, a plurality of internal electrodes 104 and alignment marks 106 are printed on the dielectric ceramic green sheet 102.

  Further, in Example 5, in the same manner as in Example 1, another dielectric ceramic green sheet 102 ′ is formed on another carrier film 100 ′ having a release layer (not shown) on the surface and dried. The

  Next, as shown in FIG. 16, another dielectric ceramic green sheet 102 ′ is thermocompression bonded to the dielectric ceramic green sheet 102.

  Then, as shown in FIG. 17, another carrier film 100 ′ is peeled from another dielectric ceramic green sheet 102 ′.

  In the same manner, another dielectric ceramic green sheet 102 'is formed on another carrier film 100' having a release layer (not shown) on the surface and dried.

  Next, as shown in FIG. 18, another dielectric ceramic green sheet 102 ′ is thermocompression bonded to another dielectric ceramic green sheet 102 ′ on the dielectric ceramic green sheet 102.

Then, as shown in FIG. 19, another carrier film 100 ′ is peeled from another dielectric ceramic green sheet 102 ′.
As another dielectric ceramic green sheet 102 ′, a sheet thinner than the dielectric ceramic green sheet 102 may be used. For example, when another dielectric ceramic green sheet 102 ′ is formed in two layers, the overall thickness is the same as that of the dielectric ceramic green sheet 102 by setting it to half the thickness of the dielectric ceramic green sheet 102. Therefore, the capacity design becomes easy.

  Next, as shown in FIG. 20, a plurality of other internal electrodes 104 'are printed on another dielectric ceramic green sheet 102' and dried.

  In the same manner, another dielectric ceramic green sheet 102 'is formed on another carrier film 100' having a release layer (not shown) on the surface and dried.

  Next, as shown in FIG. 21, another dielectric ceramic green sheet 102 ′ is thermocompression bonded to another upper dielectric ceramic green sheet 102 ′ on the dielectric ceramic green sheet 102.

  Then, as shown in FIG. 22, another carrier film 100 ′ is peeled from another dielectric ceramic green sheet 102 ′.

  Then, as shown in FIG. 23, a unit sheet 108 including four layers of dielectric ceramic green sheets 102 and 102 'on the carrier film 100 is peeled from the carrier film 100 and laminated. In this case, the unit sheet 108 is laminated after being peeled from the carrier film 100. The unit sheet 108 may be peeled off from the carrier film 100 after being laminated. Further, outer layers 110 and 110 similar to the above-described dielectric ceramic green sheet 102 are thermocompression bonded to the upper side and the lower side of the laminated unit sheets 108, respectively. Thereby, a laminated body 112 such as the unit sheet 108 is formed.

  Thereafter, the multilayer body 112 is cut into a predetermined size, fired, and an external electrode is formed, whereby the multilayer ceramic capacitor 10 is manufactured.

The fifth embodiment has the same effects as the first embodiment.
In the fifth embodiment, since a plurality of dielectric ceramic green sheets 102 'are laminated between the internal electrodes 104 (104'), even if pinholes are generated in the plurality of dielectric ceramic green sheets 102 '. The pin holes of the plurality of dielectric ceramic green sheets 102 'are difficult to overlap, and the internal electrodes 104 (104') are not easily short-circuited via the pin holes.
Furthermore, in Example 5, since the dielectric ceramic green sheets 102 and 102 'are directly stacked in the stacking process of the unit sheets 108, the dielectric ceramic green sheets 102 and 102' are connected via the internal electrode 104 '. Compared to, for example, Example 1 in which the unit sheets are stacked, the adhesion between the unit sheets 108 becomes stronger, and the unit sheets 108 can be prevented from being stacked and delaminated.

(Example 6)
In Example 6, as compared with Example 5, another dielectric ceramic green sheet 102 ′ is formed on another carrier film 100 ′ and dried, and the dielectric ceramic green sheet 102 (102) on the carrier film 100 is dried. ′) A step of thermocompression bonding another dielectric ceramic green sheet 102 ′, a step of peeling another carrier film 100 ′ from another dielectric ceramic green sheet 102 ′, and another dielectric ceramic green sheet 102 ′. Printing and drying another internal electrode 104 ′ thereon, forming and drying another dielectric ceramic green sheet 102 ′ on another carrier film 100 ′, and dielectric ceramic green on the carrier film 100 Another dielectric ceramic green sheet 102 ′ is added to the sheet 102 (102 ′). A step of thermocompression bonding, and a step of peeling the 'another carrier film 100 from the' another dielectric ceramic green sheets 102, repeated three times. Therefore, in Example 6, as shown in FIG. 24, units of four sets of dielectric ceramic green sheets 102 (102 ′), internal electrodes 104 (104 ′), and dielectric ceramic green sheets 102 ′ are formed on a carrier film 100. A sheet 108 is formed. Therefore, in Example 6, the unit sheet 108 including the 8 layers of dielectric ceramic green sheets 102 and 102 ′ is peeled from the carrier film 100 and laminated.

In Example 6, the same effect as Example 5 is produced.
Further, in the sixth embodiment, the unit sheet 108 includes eight layers of dielectric ceramic green sheets 102 and 102 ′ as compared with the fifth embodiment. It is possible to further improve the performance.
Furthermore, in Example 6, compared with Example 5, the thickness of the unit sheet 108 is 8 times the thickness of the dielectric ceramic green sheet 102 (102 '), so that the sheet strength is further improved, and the dielectric ceramic green It is possible to prevent tearing and wrinkling from occurring on the sheets 102 and 102 '.

(Example 7)
In Example 7, compared to Example 5, as shown in FIG. 25, a ceramic paste 114 for eliminating a step due to the internal electrode 104 is printed on the dielectric ceramic green sheet 102 by a screen printing method and dried. Have
Furthermore, in Example 7, compared with Example 5, as shown in FIG. 26, a ceramic paste 114 ′ for eliminating a step due to another internal electrode 104 ′ is formed on another dielectric ceramic green sheet 102 ′. It has the process of printing and drying by a screen printing method.
Therefore, in Example 7, as shown in FIG. 27, the unit sheet 108 having the ceramic pastes 114 and 114 ′ is formed.
And in Example 7, as shown in FIG. 28, the laminated body 112, such as the unit sheet | seat 108 which has the ceramic paste 114,114 ', is formed.

In Example 7, the same effect as Example 5 is produced.
Further, in the seventh embodiment, as compared with the fifth embodiment, since the step due to the internal electrode 104 is eliminated, there is an effect that printing can be performed with high accuracy with less blurring when another internal electrode 104 ′ is printed.

  In Example 7, another dielectric ceramic green sheet 102 ′ is formed on another carrier film 100 ′ and dried, and another dielectric ceramic green sheet 102 ′ on the carrier film 100 is formed on another dielectric ceramic. A step of thermocompression bonding the green sheet 102 ′, a step of peeling another carrier film 100 ′ from another dielectric ceramic green sheet 102 ′, and another internal electrode 104 ′ on the other dielectric ceramic green sheet 102 ′. A step of printing and drying a ceramic paste 114 'for eliminating a step due to another internal electrode 104' on another dielectric ceramic green sheet 102 'by a screen printing method; Another dielectric ceramic green sheet 102 'on the carrier film 100' Forming and drying, thermocompression bonding another dielectric ceramic green sheet 102 ′ to the dielectric ceramic green sheet 102 ′ on the carrier film 100, and another carrier film from the other dielectric ceramic green sheet 102 ′. The step of peeling 100 ′ may be repeated a plurality of times.

(Example 8)
In Example 8, as in Example 1, a dielectric ceramic green sheet 102 is formed on a carrier film 100 having a release layer (not shown) on the surface and dried.

  Furthermore, in Example 8, as in Example 1, another dielectric ceramic green sheet 102 'was formed on another carrier film 100' having a release layer (not shown) on the surface and dried. The

  Next, another dielectric ceramic green sheet 102 ′ is thermocompression bonded to the dielectric ceramic green sheet 102.

  Then, as shown in FIG. 29, another carrier film 100 ′ is peeled from another dielectric ceramic green sheet 102 ′.

  Next, as shown in FIG. 30, a plurality of internal electrodes 104 and alignment marks 106 are printed on the dielectric ceramic green sheet 102 '.

  Then, in Example 8, as in Example 5, as shown in FIG. 31, another dielectric ceramic green sheet 102 ′ on the dielectric ceramic green sheet 102 was separated into another two layers of dielectric ceramic green. Sheets 102 'and 102' and a plurality of internal electrodes 104 'are formed in that order.

  Then, as shown in FIG. 32, the unit sheet 108 including four layers of dielectric ceramic green sheets 102 and 102 ′ on the carrier film 100 is peeled from the carrier film 100 and laminated. Further, outer layers 110 and 110 similar to the dielectric ceramic green 102 are thermocompression bonded to the upper and lower sides of the laminated unit sheets 108, respectively. Thereby, a laminated body 112 such as the unit sheet 108 is formed.

  Thereafter, the multilayer body 112 is cut into a predetermined size, fired, and an external electrode is formed, whereby the multilayer ceramic capacitor 10 is manufactured.

  The eighth embodiment has the same effect as the fifth embodiment.

Example 9
In Example 9, as in Example 8, as shown in FIG. 33, a dielectric ceramic green sheet 102 and another dielectric ceramic were formed on a carrier film 100 having a release layer (not shown) on the surface. A green sheet 102 ', a plurality of internal electrodes 104, and alignment marks 106 are formed.

  Further, similarly, as shown in FIG. 34, two other dielectric ceramic green sheets 102 'and 102' are formed on another carrier film 100 'having a release layer (not shown) on the surface. It is formed.

  Next, as shown in FIG. 35, another dielectric ceramic green sheet 102 ′ on another carrier film 100 ′ is thermocompression bonded to another dielectric ceramic green sheet 102 ′ on the dielectric ceramic green sheet 102. Is done.

  Then, another carrier film 100 ′ is peeled from another dielectric ceramic green sheet 102 ′.

  Next, as shown in FIG. 36, a plurality of internal electrodes 104 'are formed on the dielectric ceramic green sheet 102'.

  Then, in the same manner as in Example 8, as shown in FIG. 37, the unit sheet 108 including the four layers of dielectric ceramic green sheets 102 and 102 ′ on the carrier film 100 is peeled from the carrier film 100 and laminated. . Further, outer layers 110 and 110 similar to the dielectric ceramic green 102 are thermocompression bonded to the upper and lower sides of the laminated unit sheets 108, respectively. Thereby, a laminated body 112 such as the unit sheet 108 is formed.

  Thereafter, the multilayer body 112 is cut into a predetermined size, fired, and an external electrode is formed, whereby the multilayer ceramic capacitor 10 is manufactured.

  In Example 9, the same effect as Example 5 is produced.

In Examples 5 to 9 described above, two layers of dielectric ceramic green sheets are laminated between the internal electrodes, but in this invention, three or more dielectric ceramic green sheets are laminated between the internal electrodes. May be.
In Examples 5 to 9 described above, the unit sheet 108 includes a dielectric ceramic green sheet having 4 layers or 8 layers. However, in the present invention, the unit sheet may include a dielectric ceramic green sheet having 5 layers or more. .
Furthermore, although the above-mentioned Examples 5-9 are the manufacturing methods of the multilayer ceramic capacitor using a dielectric ceramic green sheet, this invention is other ceramic green sheets, such as a multilayer ceramic inductor using a magnetic ceramic green sheet. The present invention can also be applied to a method for manufacturing other multilayer ceramic electronic components using the above.
In Examples 1 to 9 described above, the dielectric ceramic green sheet 102 and another dielectric ceramic green sheet 102 'are formed to have the same composition and the same thickness. In consideration of the solubility and the pressure bonding property with the internal electrode, the composition and thickness thereof may be changed as appropriate.

  According to the present invention, for example, in a method of manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor, the productivity in the stacking process can be improved, and the ceramic green sheet can be prevented from being broken or wrinkled. The thickness of the green sheet can be formed uniformly, and no pinhole is generated in the ceramic green sheet. Therefore, a multilayer ceramic electronic component such as a multilayer ceramic capacitor having good quality and reliability can be manufactured.

It is an illustration figure which shows an example of the multilayer ceramic capacitor to which this invention is applied. FIG. 3 is an illustrative view showing one process of Example 1. FIG. 6 is an illustrative view showing another process of Example 1. FIG. 10 is an illustrative view showing still another process of Example 1. FIG. 10 is an illustrative view showing still another process of Example 1. FIG. 10 is an illustrative view showing still another process of Example 1. FIG. 10 is an illustrative view showing still another process of Example 1. FIG. 10 is an illustrative view showing still another process of Example 1. FIG. 10 is an illustrative view showing still another process of Example 1. FIG. 6 is an illustrative view showing one process of Example 2. FIG. 10 is an illustrative view showing one process of Example 3. 10 is an illustrative view showing another process of Example 3. FIG. 10 is an illustrative view showing still another process of Example 3. FIG. FIG. 10 is an illustrative view showing one process of Example 4; FIG. 10 is an illustrative view showing one process of Example 5. FIG. 10 is an illustrative view showing another process of Example 5. 10 is an illustrative view showing still another process of Example 5. FIG. 10 is an illustrative view showing still another process of Example 5. FIG. 10 is an illustrative view showing still another process of Example 5. FIG. 10 is an illustrative view showing still another process of Example 5. FIG. 10 is an illustrative view showing still another process of Example 5. FIG. 10 is an illustrative view showing still another process of Example 5. FIG. 10 is an illustrative view showing still another process of Example 5. FIG. FIG. 10 is an illustrative view showing one process of Example 6. FIG. 10 is an illustrative view showing one process of Example 7. 10 is an illustrative view showing another process of Example 7. FIG. FIG. 10 is an illustrative view showing still another process of Example 7. FIG. 10 is an illustrative view showing still another process of Example 7. FIG. 10 is an illustrative view showing one process of Example 8. 10 is an illustrative view showing another process of Example 8. FIG. FIG. 10 is an illustrative view showing still another process of Example 8. FIG. 10 is an illustrative view showing still another process of Example 8. FIG. 10 is an illustrative view showing one process of Example 9. FIG. 10 is an illustrative view showing another process of Example 9. FIG. 10 is an illustrative view showing still another process of Example 9. FIG. 10 is an illustrative view showing still another process of Example 9. FIG. 10 is an illustrative view showing still another process of Example 9.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Multilayer ceramic capacitor 12 Laminated body 14 Dielectric layer 16 Internal electrode 18, 20 External electrode 100 Carrier film 100 'Another carrier film 102 Dielectric ceramic green sheet 102' Another dielectric ceramic green sheet 104 Internal electrode 104 'Another Internal electrode 106 Alignment mark 108 Unit sheet 110 Outer layer 112 Laminated body 114, 114 'Ceramic paste

Claims (13)

A first step of forming a ceramic green sheet on a carrier film;
A second step of printing internal electrodes and alignment marks on the ceramic green sheet and drying;
A third step of forming another ceramic green sheet on another carrier film;
A fourth step of pressure-bonding the another ceramic green sheet to the ceramic green sheet on the carrier film;
A fifth step of peeling off the separate carrier film from the separate ceramic green sheet;
A sixth step of reading the alignment mark printed on the ceramic green sheet through the another ceramic green sheet with an image sensor and printing another internal electrode on the other ceramic green sheet; and the ceramic A unit sheet comprising a plurality of ceramic green sheets made of a green sheet, the internal electrode, the other ceramic green sheet, and the other internal electrode, and including a seventh step of laminating a plurality of the unit sheets;
A method for producing a laminated ceramic electronic component, wherein a carrier film having a release layer having a release strength of the ceramic green sheet weaker than that of the release layer of the carrier film is used as the another carrier film. Printing a ceramic paste for eliminating the step due to the internal electrode on the ceramic green sheet and drying; and printing a ceramic paste for eliminating the step due to the other internal electrode on the other ceramic green sheet. The manufacturing method of the multilayer ceramic electronic component of Claim 1 including the process dried and dried.   During the printing of the ceramic paste, for alignment between the internal electrode and the ceramic paste, the alignment mark is passed through the carrier film and the ceramic green sheet or through the other ceramic green sheet with an image sensor. The manufacturing method of the multilayer ceramic electronic component of Claim 2 read. The ceramic green sheet is a dielectric ceramic green sheet,
The another ceramic green sheet is another dielectric ceramic green sheet,
The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the multilayer ceramic electronic component is a multilayer ceramic capacitor. A first step of forming a ceramic green sheet on a carrier film;
A second step of printing internal electrodes and alignment marks on the ceramic green sheet and drying;
A third step of forming another ceramic green sheet on another carrier film;
A fourth step of pressure-bonding the another ceramic green sheet to the ceramic green sheet on the carrier film;
A fifth step of peeling off the separate carrier film from the separate ceramic green sheet;
6th process which reads the said alignment mark with an image sensor through the said carrier film and the said ceramic green sheet, and prints another internal electrode on the said another ceramic green sheet on the basis of this, and the said ceramic green sheet, the said interior A unit sheet comprising an electrode, the other ceramic green sheet and the other internal electrode is prepared, and includes a seventh step of laminating a plurality of the unit sheets,
A method for producing a laminated ceramic electronic component, wherein a carrier film having a release layer having a release strength of the ceramic green sheet weaker than that of the release layer of the carrier film is used as the another carrier film. By repeating the third to sixth steps a plurality of times,
6. The method for manufacturing a multilayer ceramic electronic component according to claim 5, wherein unit sheets comprising three or more sets of ceramic green sheets and internal electrodes are formed on the carrier film. Printing a ceramic paste for eliminating the step due to the internal electrode on the ceramic green sheet and drying; and printing a ceramic paste for eliminating the step due to the other internal electrode on the other ceramic green sheet. And drying step,
The alignment mark is read by an image sensor through the carrier film and the ceramic green sheet for alignment of the internal electrode and the ceramic paste during printing of the ceramic paste. The manufacturing method of the multilayer ceramic electronic component of description. The ceramic green sheet is a dielectric ceramic green sheet,
The another ceramic green sheet is another dielectric ceramic green sheet,
The method for manufacturing a multilayer ceramic electronic component according to claim 5, wherein the multilayer ceramic electronic component is a multilayer ceramic capacitor. By repeating the third to fifth steps a plurality of times,
The method for manufacturing a multilayer ceramic electronic component according to any one of claims 5 to 8, wherein a plurality of ceramic green sheets are stacked between internal electrodes in the unit sheet.   The plurality of ceramic green sheets are sequentially formed on another carrier film by forming another ceramic green sheet on the other ceramic green sheet formed on the other carrier film in the third step. The method for manufacturing a multilayer ceramic electronic component according to claim 9, wherein the multilayer ceramic electronic component is stacked on the internal electrode at a time after being stacked. By laminating a ceramic green sheet as the uppermost layer of the unit sheet,
The method for manufacturing a multilayer ceramic electronic component according to claim 9 or 10, wherein a plurality of ceramic green sheets are stacked between the unit sheets. By laminating a plurality of ceramic green sheets as a lower layer including the lowermost layer of the unit sheet,
The method for manufacturing a multilayer ceramic electronic component according to claim 9 or 10, wherein a plurality of ceramic green sheets are stacked between the unit sheets.   The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the unit sheet is pressure-bonded by a roll.

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