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JP2008028005A - Light-emitting diode module - Google Patents

Light-emitting diode module Download PDF

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JP2008028005A
JP2008028005A JP2006196544A JP2006196544A JP2008028005A JP 2008028005 A JP2008028005 A JP 2008028005A JP 2006196544 A JP2006196544 A JP 2006196544A JP 2006196544 A JP2006196544 A JP 2006196544A JP 2008028005 A JP2008028005 A JP 2008028005A
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emitting diode
light emitting
light
sensor
housing member
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JP5000939B2 (en
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Sumio Shimonishi
純雄 下西
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Avago Technologies International Sales Pte Ltd
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Avago Technologies ECBU IP Singapore Pte Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Liquid Crystal (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To highly and accurately perform feedback control of changes in chromaticity and luminance of a light-emitting diode module. <P>SOLUTION: The light-emitting diode module 1 is composed by including an RGB light-emitting diode 3; a housing member 4 which is composed of a material transmitting light emitted from the light-emitting diode 3, and is partially provided with a window 40 that is applied with a reflecting film or that has no reflecting film; a sensor 8 which is provided at a position beside the light-emitting diode 3 while being located in the housing member 4, so as to receive light from the light-emitting diode 3 through the window 40; and a controller that changes a current flowing in the light-emitting diode 3 corresponding to a difference between a light amount received by the sensor 8 and a prescribed reference value, when the light amount is compared with the prescribed reference value while monitoring the light amount. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、赤と緑と青（以下、「ＲＧＢ」とよぶ）の発光ダイオードを用いた液晶ディスプレイ用の発光ダイオードモジュールに関する。   The present invention relates to a light emitting diode module for a liquid crystal display using red, green and blue (hereinafter referred to as “RGB”) light emitting diodes.

発光ダイオードモジュールが使用される従来の液晶用バックライトとしては、図５Ａ〜図５Ｃに示される導光板（５２ａ、５２ｂ、５２ｃ）を用いた方式や、導光板が不要な図６Ａ〜図６Ｃに示される直下型方式のものが知られている。これらの方式では、発光ダイオードモジュールの基板上に発光ダイオードのみが実装されている。   As a conventional liquid crystal backlight using a light emitting diode module, a method using the light guide plates (52a, 52b, 52c) shown in FIGS. 5A to 5C, or FIGS. The direct type shown is known. In these systems, only the light emitting diode is mounted on the substrate of the light emitting diode module.

上記の液晶用バックライトには、発光ダイオードモジュールからの光の色度や輝度を補正できるように、バックライト内にセンサが埋め込まれている。そして、図７に示すように、このセンサからの出力はコントロールＩＣを介して発光ダイオードドライバに送られて、発光ダイオードの出力光量が決定される。この図７に示す方式はオプティカルフィードバック方式とよばれており、特許文献１などに記載されている。   In the liquid crystal backlight, a sensor is embedded in the backlight so that the chromaticity and luminance of light from the light emitting diode module can be corrected. Then, as shown in FIG. 7, the output from this sensor is sent to the light emitting diode driver via the control IC, and the output light quantity of the light emitting diode is determined. The method shown in FIG. 7 is called an optical feedback method, and is described in Patent Document 1 and the like.

ここで、特許文献１などに記載されているオプティカルフィードバック方式においては、センサを置く場所が問題となる。このことを、導光板方式のバックライトを示す図５を参照して説明する。ここで、図５は、導光板の側面方向から見た場合を示している。
図５では、ＲＧＢの発光ダイオード５０ａからの光を受光するようにセンサ５１ａを配置し、ＲＧＢの発光ダイオード５０ｂからの光を受光するようにセンサ５１ｂを配置し、ＲＧＢの発光ダイオード５０ｃからの光を受光するようにセンサ５１ｃを配置している。しかしながら、図５では、発光ダイオードモジュール５０ｂからの光は、センサ５１ｂだけでなくセンサＡによっても受光されうる。そのため、上記のオプティカルフィードバック方式を用いて、発光ダイオード５０ａ、５０ｂ、５０ｃに与えられる電流を高精度にそれぞれ制御するのは難しい。 Here, in the optical feedback system described in Patent Document 1 or the like, the place where the sensor is placed becomes a problem. This will be described with reference to FIG. 5 showing a light guide plate type backlight. Here, FIG. 5 shows the case of viewing from the side surface direction of the light guide plate.
In FIG. 5, the sensor 51a is disposed so as to receive the light from the RGB light emitting diode 50a, the sensor 51b is disposed so as to receive the light from the RGB light emitting diode 50b, and the light from the RGB light emitting diode 50c. The sensor 51c is disposed so as to receive light. However, in FIG. 5, the light from the light emitting diode module 50b can be received not only by the sensor 51b but also by the sensor A. Therefore, it is difficult to control each of the currents supplied to the light emitting diodes 50a, 50b, and 50c with high accuracy using the above optical feedback method.

さらに、図６Ａおよび図６Ｂに示す直下型方式のバックライトの場合を説明する。ここで、図６Ａはバックライトをパネル側からみた場合を示し、図６Ｂはバックライトをパネル側面からみた場合を示している。このような直下型方式のバックライトの場合には、パネルエリア内にセンサ（図示せず）を置くと、パネル側からみたときにセンサ（図示せず）を置いた場所が影のようにみえてしまう。このことは、バックライトまたはディスプレイの画質を劣化させる。また、ＲＧＢの発光ダイオードからの光を混ぜて白色光が得られた場所にセンサを配置する必要があるため、図６Ｂに示すように、奥行きｘをある程度確保する必要がある。
特開２００１−９２４１４号公報 Furthermore, the case of the direct type backlight shown in FIGS. 6A and 6B will be described. Here, FIG. 6A shows a case where the backlight is viewed from the panel side, and FIG. 6B shows a case where the backlight is viewed from the side of the panel. In the case of such a direct type backlight, when a sensor (not shown) is placed in the panel area, the place where the sensor (not shown) is placed looks like a shadow when viewed from the panel side. End up. This degrades the image quality of the backlight or display. Further, since it is necessary to arrange a sensor at a place where white light is obtained by mixing light from RGB light emitting diodes, it is necessary to secure a certain depth x as shown in FIG. 6B.
JP 2001-92414 A

従って、発光ダイオードモジュールの色度や輝度の変化を、画質に悪影響を及ぼすことなく高精度にフィードバック制御できるようにすることが求められている。   Accordingly, there is a demand for feedback control of the chromaticity and brightness of the light emitting diode module with high accuracy without adversely affecting the image quality.

本発明は、ＲＧＢの発光ダイオードからの光をハウジング部材内に内蔵されたセンサによりモニタすることができる発光ダイオードモジュールを提供する。具体的には、本発明は、赤と緑と青との発光ダイオードと、前記発光ダイオードからの光を透過する材料からなり、反射膜が施されているか、反射膜がない窓部をその一部に備えるハウジング部材と、前記ハウジング部材中にあって、発光ダイオードの横の位置に設けられて、前記窓部を通じて前記発光ダイオードからの光を受光するセンサと、前記センサの受光した光量をモニタして所定の基準値と比較したときの差分に応じて、前記発光ダイオードに流れる電流を変更するコントローラとを含んでなる発光ダイオードモジュールを提供する。   The present invention provides a light emitting diode module capable of monitoring light from RGB light emitting diodes with a sensor built in a housing member. Specifically, the present invention includes a red, green, and blue light emitting diode and a material that transmits light from the light emitting diode, and includes a window portion that has a reflective film or no reflective film. A housing member provided in a portion, a sensor in the housing member, provided at a position beside the light emitting diode, for receiving light from the light emitting diode through the window portion, and monitoring a light amount received by the sensor And a controller that changes a current flowing through the light emitting diode according to a difference when compared with a predetermined reference value.

ここで、前記所定の基準値は、前記発光ダイオードの色度または輝度についての値である態様や、前記発光ダイオードを覆う保護部材をさらに含む態様であることが好ましい。また、この保護部材は、エポキシ樹脂またはシリコン樹脂であることがより好ましい。
さらに、前記発光ダイオードからの光の向きを前記センサの受光面へと曲げるための切り欠き部を前記ハウジング部材に備えている態様や、前記光学部材は、レンズまたはミラーである態様であることが好ましい。 Here, it is preferable that the predetermined reference value is an aspect that is a value about chromaticity or luminance of the light emitting diode, or an aspect that further includes a protective member that covers the light emitting diode. The protective member is more preferably an epoxy resin or a silicon resin.
Further, the housing member may be provided with a notch for bending the direction of light from the light emitting diode toward the light receiving surface of the sensor, or the optical member may be a lens or a mirror. preferable.

本発明によれば、ＲＧＢの発光ダイオードを個別にセンサにより制御することができるので、色度や輝度の変化を高精度にフィードバック制御することができる。また、センサがハウジング部材に内蔵されているので、導光板方式や直下型方式などの方式に依存することなく適用できる。さらに、導光板方式や直下型方式において問題であったセンサの置く位置やこれに伴う画質の劣化を解消することができる。   According to the present invention, since RGB light emitting diodes can be individually controlled by sensors, changes in chromaticity and luminance can be feedback controlled with high accuracy. Further, since the sensor is built in the housing member, the sensor can be applied without depending on a light guide plate method or a direct type method. Furthermore, it is possible to eliminate the position where the sensor is placed and the associated deterioration in image quality, which are problems in the light guide plate method and the direct type method.

図１は、本発明の実施に用いられる発光ダイオードモジュール１の斜視図である。この発光ダイオードモジュール１は、ＰＣＢまたはメタルコアＰＣＢでありうる基板２と、基板２上に設けられた発光ダイオード３と、発光ダイオード（発光素子）３からの光を受けるセンサを内蔵したハウジング部材４と、発光ダイオード３に電流を供給し、センサからの信号をコントローラ（図示せず）に送信するための接続部コネクタ５とを含む。ここで、ハウジング部材４は、アクリル樹脂などの透明樹脂を射出成形などでモールディングしたものを使用している。ハウジング部材４の表面には金属メッキ７が施されている。また、ハウジング部材４を基板２に固定するねじ用のねじ穴６をハウジング部材４に備えている。   FIG. 1 is a perspective view of a light emitting diode module 1 used in the practice of the present invention. The light-emitting diode module 1 includes a substrate 2 that can be a PCB or a metal core PCB, a light-emitting diode 3 provided on the substrate 2, a housing member 4 that incorporates a sensor that receives light from the light-emitting diode (light-emitting element) 3. A connection connector 5 for supplying a current to the light emitting diode 3 and transmitting a signal from the sensor to a controller (not shown). Here, the housing member 4 is formed by molding a transparent resin such as an acrylic resin by injection molding or the like. A metal plating 7 is applied to the surface of the housing member 4. Further, the housing member 4 is provided with screw holes 6 for screws for fixing the housing member 4 to the substrate 2.

次に、図１の断面II−IIで切断したときの断面図を図２に示す。ここで、ＲＧＢの各発光ダイオードに対して図２に示す構造を設けることができる。発光ダイオードモジュール１は、発光ダイオード３と発光ダイオード３からの光を受けるセンサ８とが基板２上に形成されている。基板２に結合しているハウジング部材４は、発光ダイオード３からの光に対して透明であるアクリル樹脂により成形加工されており、発光ダイオード３からの光をセンサ８に与えるための窓部４０を有している。ここで、ハウジング部材４の形状は、発光ダイオード３の光放射のための反射面やセンサ８を実装するスペース等を考慮して決定される。また、ハウジング部材４の外面には、窓部４０を除き、ニッケルなどの金属メッキ７が施されており、発光ダイオード３から放射された光を上方へと向けている。また、発光ダイオード３およびその配線（金線）は、エポキシまたはシリコンなどの樹脂９により覆われて保護されている。   Next, FIG. 2 shows a cross-sectional view taken along section II-II in FIG. Here, the structure shown in FIG. 2 can be provided for each light emitting diode of RGB. In the light emitting diode module 1, a light emitting diode 3 and a sensor 8 that receives light from the light emitting diode 3 are formed on a substrate 2. The housing member 4 coupled to the substrate 2 is molded by an acrylic resin that is transparent to the light from the light emitting diode 3, and has a window 40 for giving the light from the light emitting diode 3 to the sensor 8. Have. Here, the shape of the housing member 4 is determined in consideration of a reflection surface for light emission of the light emitting diode 3, a space for mounting the sensor 8, and the like. Further, the outer surface of the housing member 4 is provided with a metal plating 7 such as nickel except for the window portion 40 so that the light emitted from the light emitting diode 3 is directed upward. The light emitting diode 3 and its wiring (gold wire) are covered and protected by a resin 9 such as epoxy or silicon.

図２に示すように、発光ダイオード３からの光は、ハウジング部材４の窓部４０を介してハウジング部材４の内部を透過してセンサ８に達する。ここで、上記のセンサ８は、センサ機能と発光ダイオード３の電流制御機能とを統合した一体型センサを使用している。そして、センサ８は、発光ダイオード３からの光の色度または輝度に応じた値を求め、この光の色度または輝度に応じた値と所定の基準値とを比較して差分を求め、その差分に応じて発光ダイオード３に与える電流を変更するようオプティカルフィードバック制御を行うことができる。
なお、上記の場合に限らず、例えば、センサ８と発光ダイオード３の電流を制御するコントローラとが別々に設けられていてもよい。 As shown in FIG. 2, the light from the light emitting diode 3 passes through the inside of the housing member 4 through the window 40 of the housing member 4 and reaches the sensor 8. Here, the sensor 8 uses an integrated sensor in which the sensor function and the current control function of the light emitting diode 3 are integrated. Then, the sensor 8 obtains a value according to the chromaticity or luminance of the light from the light emitting diode 3, compares the value according to the chromaticity or luminance of the light with a predetermined reference value, obtains a difference, and Optical feedback control can be performed so as to change the current applied to the light emitting diode 3 according to the difference.
For example, the sensor 8 and a controller for controlling the current of the light emitting diode 3 may be provided separately.

このように、発光ダイオードユニット１は、センサ８をＲＧＢの発光ダイオード３の近くに置いているので、他の発光ダイオードからの光の影響が少ない。また、発光ダイオードユニット１をバックライトに用いた場合でも、センサの置き場所が発光ダイオードの横にあるので、センサの影による画質の劣化がおきない。   Thus, since the light emitting diode unit 1 has the sensor 8 placed near the RGB light emitting diodes 3, the influence of light from other light emitting diodes is small. Further, even when the light emitting diode unit 1 is used as a backlight, since the sensor is placed next to the light emitting diode, the image quality is not deteriorated due to the shadow of the sensor.

なお、窓部４０の大きさや形状は、センサ８の感度や発光ダイオード３の種類に応じて定めることができる。窓部４０は、横に長いスリットであってもよく、個々の発光ダイオード素子３に対応した四角または丸い形状であってもよい。また、光を散乱させる必要がある場合には、ハウジング部材４がアクリル樹脂により成形されていることから、窓部４０の表面を荒らす加工をすることも容易に行うことができる。   The size and shape of the window 40 can be determined according to the sensitivity of the sensor 8 and the type of the light emitting diode 3. The window 40 may be a slit that is long in the side, or may have a square or round shape corresponding to each light emitting diode element 3. Moreover, when it is necessary to scatter light, since the housing member 4 is shape | molded with the acrylic resin, the process which roughens the surface of the window part 40 can also be performed easily.

次に、本発明の実施に用いられる別の発光ダイオードモジュール１Ａの断面図を示す。図３に示す発光ダイオードモジュール１Ａは、図２の発光ダイオードモジュール１と比較して、ハウジング部材４の内部に切り欠き部４２を備えている点において異なる。このような切りか基部４２を設けることは、ハウジング部材４がアクリルなどの樹脂により成形されているため容易に行える。そして、切り欠き部４２の約４５度の傾斜面によって、センサ８の受光面に直角になるように、窓部４０からの光の向きを変更することができる。
なお、ハウジング部材４に集光レンズを設けることにより、センサ８への集光効率をさらに高めることもできる。 Next, sectional drawing of another light emitting diode module 1A used for implementation of this invention is shown. The light emitting diode module 1A shown in FIG. 3 is different from the light emitting diode module 1 shown in FIG. 2 in that a notch 42 is provided inside the housing member 4. Providing such a cut base 42 is easy because the housing member 4 is formed of a resin such as acrylic. Then, the direction of light from the window 40 can be changed by the inclined surface of the cutout portion 42 of about 45 degrees so as to be perpendicular to the light receiving surface of the sensor 8.
In addition, the condensing efficiency to the sensor 8 can further be improved by providing the housing member 4 with a condensing lens.

このような発光ダイオードユニット１、１Ａをバックライトや照明機器に使用した場合には、別の発光ダイオードからの光がセンサに入るのを窓部４０により減らすことができるので、別の発光ダイオードの影響を減少させ、バックライトやディスプレイの一部の領域だけを暗くまたは明るくするように制御することができる。
また、発光ダイオードユニット１、１Ａを複数個配置した直下型方式のバックライトでは、省電力のために各発光ダイオード・ストリップを人間の目に見えない速さで順次点灯（または順次消灯）するシーケンシャル方式を採用することができる。この場合には、発光ダイオードユニット１、１Ａの発光ダイオードからの光をセンサ８で受光して、光のセンシングや制御をより容易に行うことができる。ここで、発光ダイオードユニット１、１Ａに占めるセンサ８の面積を小さくするために、ＲＧＢの各発光ダイオードの光量をモニタするセンサ８の個数を減らすこともできる。なお、センサ８の数は、ＬＥＤのパワー、窓部の大きさ、センサの感度に応じて変更することができる。 When such a light emitting diode unit 1 or 1A is used in a backlight or a lighting device, the light from another light emitting diode can be reduced by the window 40 because the light from the other light emitting diode enters the sensor. It can be controlled to reduce the impact and only darken or brighten some areas of the backlight and display.
In addition, in a direct type backlight having a plurality of light emitting diode units 1 and 1A arranged, the light emitting diode strips are sequentially turned on (or turned off sequentially) at a speed invisible to human eyes for power saving. A scheme can be adopted. In this case, light from the light emitting diodes of the light emitting diode units 1 and 1A can be received by the sensor 8, and light sensing and control can be performed more easily. Here, in order to reduce the area of the sensor 8 occupying the light emitting diode units 1 and 1A, the number of the sensors 8 that monitor the light amounts of the RGB light emitting diodes can be reduced. The number of sensors 8 can be changed according to the power of the LED, the size of the window, and the sensitivity of the sensor.

最後に、図４を参照して、発光ダイオードユニット１、１Ａの製造工程を説明する。最初に、ステップＡでは、発光ダイオード３とセンサ８とを基板２上に設置して所定の配線を行う。ステップＢでは、透明樹脂を加工して、ハウジング部材４を成形する。このときに必要に応じて、光学部材４２などを成形する。ステップＣでは、ハウジング部材４の窓部とセンサを覆う内側部分とにマスキングを施してから、ニッケルメッキ槽に浸してハウジング部材４の外面に金属メッキ７を施す。ステップＤでは、マスキングを剥離してハウジング部材に窓部４０を形成する。ステップＥでは、窓部４０を備えたハウジング部材４を、基板２に取り付ける。最後に、ステップＦでは、発光ダイオード３と配線とを保護するように、エポキシまたはシリコンなどの樹脂９を注入して固定する。   Finally, with reference to FIG. 4, the manufacturing process of the light emitting diode units 1 and 1A will be described. First, in step A, the light emitting diode 3 and the sensor 8 are installed on the substrate 2 and predetermined wiring is performed. In step B, the transparent resin is processed to mold the housing member 4. At this time, the optical member 42 and the like are molded as necessary. In Step C, the window portion of the housing member 4 and the inner portion covering the sensor are masked, and then immersed in a nickel plating bath to apply the metal plating 7 to the outer surface of the housing member 4. In Step D, the masking is removed to form the window 40 in the housing member. In step E, the housing member 4 having the window 40 is attached to the substrate 2. Finally, in step F, a resin 9 such as epoxy or silicon is injected and fixed so as to protect the light emitting diode 3 and the wiring.

図１は、本発明の実施に用いられる発光ダイオードモジュール１の斜視図である。FIG. 1 is a perspective view of a light emitting diode module 1 used in the practice of the present invention. 図１の断面ＩＩ−ＩＩで切断したときの断面図である。It is sectional drawing when cut | disconnecting in the cross section II-II of FIG. 本発明の実施に用いられる別の発光ダイオードモジュール１Ａを示す断面図である。It is sectional drawing which shows another light emitting diode module 1A used for implementation of this invention. 発光ダイオード１、１Ａの製造工程を示すフローチャートである。It is a flowchart which shows the manufacturing process of the light emitting diodes 1 and 1A. 従来技術の導光板方式のバックライトにおける発光ダイオードとセンサとの配置を示す概略図である。It is the schematic which shows arrangement | positioning of the light emitting diode and sensor in the backlight of a prior art light-guide plate system. Ａ〜Ｃは、従来技術の直下型方式のバックライトにおける発光ダイオードとセンサとの配置を示す概略図である。FIGS. 8A to 8C are schematic views illustrating arrangements of light emitting diodes and sensors in a conventional direct-type backlight. 従来技術である液晶用バックライトのオプティカルフィードバック方式を示す概略図である。It is the schematic which shows the optical feedback system of the backlight for liquid crystals which is a prior art.

符号の説明Explanation of symbols

１ 発光ダイオードモジュール
２ 基板
３ 発光ダイオード（発光素子）
４ ハウジング部材
５ 接合部コネクタ
６ ねじ穴
７ 金属メッキ
８ センサ 1 Light Emitting Diode Module 2 Substrate 3 Light Emitting Diode (Light Emitting Element)
4 Housing member 5 Joint connector 6 Screw hole 7 Metal plating 8 Sensor

Claims (7)

赤と緑と青との発光ダイオードと、
前記発光ダイオードからの光を透過する材料からなり、反射膜が施されているか、反射膜がない窓部をその一部に備えるハウジング部材と、
前記ハウジング部材中にあって、発光ダイオードの横の位置に設けられて、前記窓部を通じて前記発光ダイオードからの光を受光するセンサと、
前記センサの受光した光量をモニタして所定の基準値と比較したときの差分に応じて、前記発光ダイオードに流れる電流を変更するコントローラと
を含んでなる発光ダイオードモジュール。 Red, green and blue light emitting diodes;
A housing member that is made of a material that transmits light from the light emitting diode and is provided with a reflection film or a window portion that does not have a reflection film in a part thereof;
A sensor in the housing member, provided at a position beside the light emitting diode, for receiving light from the light emitting diode through the window;
A light emitting diode module comprising: a controller that changes a current flowing through the light emitting diode in accordance with a difference when the amount of light received by the sensor is monitored and compared with a predetermined reference value. 前記ハウジング部材は、アクリル樹脂からなる請求項１に記載の発光ダイオードモジュール。   The light emitting diode module according to claim 1, wherein the housing member is made of an acrylic resin. 前記所定の基準値は、前記発光ダイオードの色度または輝度についての値である請求項１または２に記載の発光ダイオードモジュール。   3. The light emitting diode module according to claim 1, wherein the predetermined reference value is a value for chromaticity or luminance of the light emitting diode. 前記発光ダイオードを覆う保護部材をさらに含む請求項１から３のいずれかに記載の発光ダイオードモジュール。   The light emitting diode module according to claim 1, further comprising a protective member that covers the light emitting diode. 前記保護部材は、エポキシ樹脂またはシリコン樹脂である請求項４に記載の発光ダイオードモジュール。   The light emitting diode module according to claim 4, wherein the protective member is an epoxy resin or a silicon resin. 前記発光ダイオードからの光の向きを前記センサの受光面へと曲げる切り欠き部を前記ハウジング部材に備えている請求項１から５のいずれかに記載の発光ダイオードモジュール。   6. The light emitting diode module according to claim 1, wherein the housing member includes a notch that bends the direction of light from the light emitting diode toward a light receiving surface of the sensor. 前記光学部材は、レンズまたはミラーである請求項１から６のいずれかに記載の発光ダイオードモジュール。   The light emitting diode module according to claim 1, wherein the optical member is a lens or a mirror.
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009187888A (en) * 2008-02-08 2009-08-20 Metropolitan Expressway Co Ltd Led illumination lamp
JP2009266974A (en) * 2008-04-23 2009-11-12 Mitsubishi Electric Corp Light-emitting device and light-emitting apparatus
US9726347B2 (en) 2008-09-10 2017-08-08 Samsung Electronics Co., Ltd. Light emitting device and system providing white light with various color temperatures
US9739449B2 (en) 2008-09-10 2017-08-22 Samsung Electronics Co., Ltd. Light emitting device and system providing white light with various color temperatures
JP2011108925A (en) * 2009-11-19 2011-06-02 Ushio Inc Light-emitting module
JP2011146523A (en) * 2010-01-14 2011-07-28 Panasonic Electric Works Co Ltd Light emitting device
KR20170009035A (en) * 2015-07-15 2017-01-25 엘지이노텍 주식회사 A light emitting device package
KR102408616B1 (en) 2015-07-15 2022-06-14 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 A light emitting device package
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JPWO2017073776A1 (en) * 2015-10-29 2018-08-30 京セラ株式会社 Light irradiation apparatus and light irradiation system
US10441937B2 (en) 2015-10-29 2019-10-15 Kyocera Corporation Light irradiation device and light irradiation system
WO2017208606A1 (en) * 2016-06-01 2017-12-07 シャープ株式会社 Optical sensor and electrical device
JP2022188768A (en) * 2021-06-09 2022-12-21 ジェヒョン チョン Light emitting device capable of adjusting sensitivity and curing apparatus employing the same

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