JP2007329813A - Solid-state imaging apparatus and imaging apparatus provided with the solid-state imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the manufacturing process of a solid-state imaging apparatus is complicated in order to make the solid-state imaging apparatus thin. <P>SOLUTION: The solid-state imaging apparatus 1 includes: a solid-state imaging element (hereinafter called as an element) 2; a substrate 3 to one principal side 3a of which the element 2 is fitted; a transparent plate 5 for sealing a micro lens array 4 of the element 2 fitted to the substrate 3; bonding wires 8 connecting connection pads 6 of the element 2 and connection lands 6 of the substrate 3 to each other; and a resin sealing member 9 for sealing the bonding wires 8. The substrate 3 includes a light receiving opening 11 for housing the micro lens array 4 of the element 2, and pad openings 12 to which the connection pads 6 of the element 2 are inserted, the element is fitted to the one principal side 3a of the substrate 3 in a state that the micro lens array 4 is located in the light receiving opening 11 and the connection pads 6 are located at the pad openings 12, and the transparent plate 5 is adhered to the other principal side 3b of the substrate 3 in a state of closing the light receiving opening 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device using a solid-state imaging device such as a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor, and an imaging device including the solid-state imaging device. .

  Solid-state image sensors such as CCD-type image sensors and CMOS-type image sensors used in solid-state image pickup devices are formed by forming microlenses on individual light-receiving pixels to reduce the size of the light-receiving pixels as the size of the pixels increases. Ingenuity has been made to compensate for the decrease in sensitivity.

  On the other hand, the solid-state imaging device is required to be made as thin as possible as the equipment on which it is mounted becomes thinner. For this reason, it has been difficult to meet the above requirements by using a conventional ceramic package or resin mold package.

  Therefore, it has been common to reduce the size and thickness by mounting a semiconductor image sensor chip on which a microlens is formed as it is on a printed circuit board constituting an imaging apparatus, and then assembling and integrating an optical system. In this case, if dust adheres to the microlens during the assembly process, the light to the light receiving pixels may be blocked, causing a problem that the subject image data is hindered.

  As an example of this, a layer having a lower refractive index than the microlens is formed on the microlens array, and a transparent plate is disposed on the layer having the lower refractive index, and a transparent plate is disposed on the microlens array via a spacer. An air layer between the microlens array and the transparent plate is disclosed. (For example, refer to Patent Document 1).

Furthermore, a transparent plate processed into a concave shape is arranged on a microlens array, and an air layer is disclosed between the microlens array and the transparent plate. (For example, refer to Patent Document 2).
JP 2003-31782 A JP 2005-109092 A

  In the solid-state imaging device described in Patent Document 1, since the microlens array portion is covered with a transparent plate from the initial stage of the process until the imaging device is completed and is isolated from the outside air, it passes through various processes. Thus, dust does not adhere to the microlens, and even if it adheres to the transparent plate, it can be easily wiped off.

  However, in the method of forming a low refractive index layer on the microlens array, it is difficult to control the thickness of the low refractive index layer, and the process for forming the low refractive index layer increases, resulting in an increase in cost. There is a problem of attracting.

  Further, in the method of disposing a transparent plate on a microlens array via a spacer, a step of forming a spacer, or a spacer member and its incorporation are added during the step, and the cost increases as described above. There is a problem of attracting.

  Moreover, the solid-state imaging device described in Patent Document 2 includes a transparent member in which a protrusion is integrally formed on a microlens array at a position on the surface facing the microlens array so as not to overlap the light receiving pixel group. Therefore, there is a problem that the cost for forming the transparent member is increased.

  In view of the above problems, the present invention provides a solid-state image pickup device in which a solid-state image pickup device is packaged without increasing the number of manufacturing steps while maintaining a low thickness, that is, at a low cost, and an image pickup device including the solid-state image pickup device. It was made for the purpose of obtaining.

A solid-state imaging device, a substrate for mounting the solid-state imaging device on one main surface side, a transparent plate for sealing a light-receiving microlens array of the solid-state imaging device to be mounted on the substrate, a connection pad of the solid-state imaging device, and the In a solid-state imaging device comprising a bonding wire for connecting a connection land of a substrate, and a resin sealing material for sealing the bonding wire,
The substrate is provided with a light receiving opening for receiving the microlens array of the solid-state imaging device and a connection pad opening for receiving the connection pad of the solid-state imaging device, and the microlens array is positioned in the light receiving opening. The solid-state imaging device is attached to one main surface of the substrate with the connection pad positioned in the connection pad opening, and the light receiving opening is blocked on the other main surface of the substrate. The transparent plate was bonded in the state. Then, the connection pad of the solid-state imaging device and the connection land of the substrate were connected by a bonding wire through the connection pad opening. The adhesive layer which adhered the board | substrate and the transparent plate was provided in the resin sealing material. In addition, the resin sealing material was provided with an adhesive layer for bonding the substrate and the transparent plate and a covering layer for covering the peripheral edge of the connection pad opening.

  By attaching a solid-state imaging device to one main surface of the substrate, the microlens array of the solid-state imaging device is accommodated in the light receiving opening of the substrate, and a transparent plate is attached to the other main surface side of the substrate Then, by closing the light receiving opening, the microlens array of the solid-state imaging device is enclosed and protected in the light receiving opening. Accordingly, there is no need to form a spacer for protecting the microlens array, or a spacer member and its incorporation, and it is not necessary to process and bond a transparent member or the like in which the protrusions are integrally formed. This makes it possible to realize a thin solid-state imaging device that is inexpensive and requires no additional processes.

  In particular, by bonding the transparent plate to the substrate using the resin sealing material, it is not necessary to use a special adhesive for bonding the transparent plate to the substrate. Accordingly, a process of supplying an adhesive and curing it becomes unnecessary, and a cheaper and thinner solid-state imaging device can be realized. Furthermore, by controlling the thixotropy (viscoelasticity) of the resin that forms the resin sealing material, it is possible to increase the thickness of the bonding surface between the transparent plate and the substrate, and the space between the microlens array and the transparent plate can be sufficiently increased. Obtaining it makes it possible to suppress image formation (image noise) due to dust adhering to the transparent plate. Further, by using the resin sealing material to cover the light receiving opening of the substrate, it is possible to suppress the generation of dust from the end surface of the substrate. Also in this case, it is possible to prevent the resin from flowing into the microlens array by controlling the thixotropy (viscoelasticity) of the resin forming the resin sealing material.

  1 is a perspective view of a solid-state imaging device 1 according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, FIG. 3 is an exploded perspective view of the main part of the solid-state imaging device 1, and FIG. 3 is a cross-sectional view.

  As shown in FIGS. 1 and 2, the solid-state imaging device 1 includes a solid-state imaging device 2, a substrate 3 on which the solid-state imaging device 2 is attached to one main surface side, and a solid-state imaging device 2 attached to the substrate 3. A transparent plate 5 that seals the microlens array 4 for receiving light, a bonding wire 8 that connects the connection pad 6 of the solid-state imaging device 2 and the connection land 7 of the substrate 3, and a resin seal that seals the bonding wire 8 And a stop material 9.

  As shown in FIGS. 3 and 4, the solid-state imaging device 2 includes the light-receiving microlens array 4 and the connection pads 6 on an attachment surface 2 a to the substrate 3. The connection pad 6 is provided on the periphery of the mounting surface 2a so as to surround the light receiving microlens array 4.

  The substrate 3 includes a light receiving opening 11 in which the microlens array 4 is accommodated (facing) and a connection pad opening 12 in which the connection pad 6 is accommodated (facing). The connection land 7 is provided along the outer edge of the connection pad opening 12.

  The transparent plate 5 is attached to a main surface (upper surface) 3b opposite to one main surface (lower surface) 3a of the substrate 3 to which the solid-state imaging device 2 is mounted in a state where the light receiving opening 11 is closed. .

  As shown in FIG. 2, the bonding wire 8 has one end connected to the connection pad 6 of the solid-state imaging device 2 and the other end connected to the connection land 7 of the substrate 3.

  The resin sealing material 9 is applied in a state filled in the connection pad opening 12 to seal the bonding wire 8. The inner peripheral end of the resin sealing material 9 covers the outer peripheral surface of the transparent plate 5 and the inner peripheral surface of the connection pad opening 12. Further, the end portion on the outer peripheral side of the resin sealing material 9 covers (contacts) the upper surface of the substrate 3 across the connection pad opening 12 and the one end portion of the bonding wire 8 and the solid-state imaging. The connection part with the connection pad 6 of the element 2 is covered. A reinforcing resin material 10 is also provided between the lower surface of the substrate 3 and the outer peripheral surface of the solid-state imaging device 2 as necessary.

  Next, a method for manufacturing the solid-state imaging device 1 according to the first embodiment will be described with reference to FIGS. First, as shown in FIGS. 5 and 8A, the microlens array 4 is exposed in the light receiving opening 11 and the connection pad 6 is exposed in the connection pad opening 12. The solid-state image sensor 2 is bonded.

  Next, as shown in FIGS. 6 and 8B, the transparent plate 5 is attached to the upper surface of the substrate 3 to close the light receiving opening 11, the inside of the light receiving opening 11 is sealed, and the microlens array 4 is mounted. Protect from dust etc.

  Next, as shown in FIGS. 7 and 8C, the connection pads 6 of the solid-state imaging device 2 and the connection lands 7 of the substrate 3 are connected by bonding wires 8. Then, as shown in FIG. 2, a resin sealing material 9 is obtained by applying and filling a resin such as an ultraviolet curable resin in the connection pad opening 12 and curing the resin while covering the bonding wire 8. Form. Further, if necessary, a resin material 10 for reinforcement is formed on the lower surface side of the substrate 3 by applying and curing a resin such as an ultraviolet curable resin, so that the solid-state imaging device 1 of the first embodiment is formed. Manufactured. The reinforcing resin material 10 is formed integrally with the resin sealing material 9 by extending a part of the resin forming the resin sealing material 9 to the lower surface side of the substrate 3.

  FIG. 9 shows the solid-state imaging device 1 of the second embodiment. In this embodiment, the resin forming the resin sealing material 9 has a function as an adhesive for bonding the transparent plate 5 to the substrate 3. That is, after the resin forming the resin sealing material 9 is applied as an adhesive layer 9 a between the light receiving opening 11 and the connection pad opening 12 on the upper surface of the substrate 3, the transparent plate 5 is overlaid. In addition, the transparent plate 5 is bonded with the resin by curing the resin. Since the transparent plate 5 is bonded to the substrate 3 by using a part of the resin forming the resin sealing material 9 as an adhesive, the transparent plate 5 is bonded to the substrate 3, so that a special adhesive is used separately. No need to use. Therefore, a process such as supplying an adhesive and curing it is unnecessary, and a cheaper and thinner solid-state imaging device can be realized. Further, by controlling the thixotropy (viscoelasticity) of the resin, it becomes possible to increase the thickness of the adhesive layer 9a of the substrate 3 in the transparent plate 5, and the space distance between the microlens array 4 and the transparent plate 5 is sufficient. Thus, it is possible to suppress image formation noise (image noise) due to dust adhering to the transparent plate 5.

  FIG. 10 shows the solid-state imaging device 1 of the third embodiment. In this embodiment, the transparent plate 5 is bonded to the substrate 3 with a resin that forms the resin sealing material 9, and the inner periphery of the light receiving opening 11 is formed with a resin that forms the resin sealing material 9. A covering layer 9b is formed to cover the surface and the upper surface of the solid-state imaging device 2. The coating layer 9 b is formed by a method such as causing a part of the resin forming the resin sealing material 9 to flow down to the inner peripheral surface side of the light receiving opening 11. By controlling the thixotropy (viscoelasticity) of the resin, it is possible to prevent the resin that has flowed down from flowing into the microlens array 4. In the solid-state imaging device according to the third embodiment, since the covering layer 9b covers the vicinity of the light receiving opening 11 of the substrate 3, the generation of dust from the inner peripheral end face of the light receiving opening 11 can be reliably suppressed. .

  FIG. 11 shows a main part of the solid-state imaging device of the fourth embodiment. In this embodiment, the light receiving opening 11 and the connection pad opening 12 in the first to third embodiments are integrated to form a single light receiving and connection pad opening 13. Other configurations are substantially the same as those in the first to third embodiments, and thus redundant description is omitted.

  FIG. 12 shows the main part of the solid-state imaging device of the fifth embodiment. In this embodiment, as in the case of the fourth embodiment, the light receiving opening 11 and the connection pad opening 12 in the first to third embodiments are integrated to form the light receiving and connection pad opening 13. In addition, the case where the connection pad 6 is provided only along a pair of opposing sides on the solid-state imaging device 2 is shown. Other configurations are substantially the same as in the case of the fourth embodiment, and a duplicate description is omitted.

  FIG. 13 shows an imaging device 21 on which the solid-state imaging device 1 is mounted. The imaging device 21 includes a lens barrel 22. A lens 23 and the solid-state imaging device 1 described in the first to fifth embodiments are attached to the lens barrel 22 so as to face the lens 23. The imaging device 21 is used for a so-called card-type thin camera, digital still camera, video camera, mobile phone, and the like.

The perspective view of the solid-state imaging device of 1st Example. AA sectional drawing of FIG. The perspective view of the solid-state image sensor of 1st Example, a board | substrate, and a transparent plate. Sectional drawing of the solid-state image sensor of 1st Example, a board | substrate, and a transparent plate. The perspective view which shows an assembly | attachment process. The perspective view which shows an assembly | attachment process. The perspective view which shows an assembly | attachment process. A, B, and C are sectional views showing an assembling process. Sectional drawing of the principal part of the solid-state imaging device of 2nd Example. Sectional drawing of the principal part of the solid-state imaging device of 3rd Example. The perspective view of the principal part of the solid-state imaging device of 4th Example. The perspective view of the principal part of the solid-state imaging device of 5th Example. Sectional drawing of the imaging device carrying a solid-state imaging device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Solid-state imaging device, 2 ... Solid-state image sensor, 3 ... Board | substrate, 4 ... Micro lens array, 5 ... Transparent plate, 6 ... Connection pad, 7 ... Connection land, 8 ... Bonding wire, 9 ... Resin sealing material, 9a DESCRIPTION OF SYMBOLS ... Adhesive layer, 9b ... Covering layer, 10 ... Reinforcing resin material, 11 ... Bonding wire, 11 ... Opening for light reception, 12 ... Opening for connection pad, 13 ... Opening for light reception and connection pad.

Claims (5)

A solid-state imaging device, a substrate for mounting the solid-state imaging device on one main surface side, a transparent plate for sealing a light-receiving microlens array of the solid-state imaging device to be mounted on the substrate, a connection pad of the solid-state imaging device, and the In a solid-state imaging device comprising a bonding wire for connecting a connection land of a substrate, and a resin sealing material for sealing the bonding wire,
The substrate includes a light receiving opening for accommodating the microlens array of the solid-state image sensor, and a connection pad opening for inserting the connection pad of the solid-state image sensor,
The solid-state imaging device is attached to one main surface of the substrate by positioning the microlens array in the light receiving opening and positioning the connection pad in the connection pad opening.
The solid-state imaging device, wherein the transparent plate is bonded to the other main surface of the substrate in a state where the light receiving opening is closed. The solid-state imaging device according to claim 1, wherein the resin sealing material includes an adhesive layer that adheres the substrate and the transparent plate. 2. The solid-state imaging device according to claim 1, wherein the resin sealing material includes an adhesive layer that bonds the substrate and the transparent plate, and a coating layer that covers a peripheral edge of the connection pad opening. . The solid-state imaging device according to claim 1, wherein the light receiving opening and the connection pad opening are integrated to form a single opening. A solid-state imaging device, a substrate for mounting the solid-state imaging device on one main surface side, a transparent plate for sealing a light-receiving microlens array of the solid-state imaging device to be mounted on the substrate, a connection pad of the solid-state imaging device, and the In an imaging device comprising a solid-state imaging device comprising a bonding wire for connecting a connection land of a substrate and a resin sealing material for sealing the bonding wire,
The substrate includes a light receiving opening for accommodating the microlens array of the solid-state image sensor, and a connection pad opening for inserting the connection pad of the solid-state image sensor,
The solid-state imaging device is attached to one main surface of the substrate by positioning the microlens array in the light receiving opening and positioning the connection pad in the connection pad opening.
The imaging apparatus, wherein the transparent plate is bonded to the other main surface of the substrate in a state where the light receiving opening is closed.

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