JP2007306068A - Crystal device - Google Patents
Crystal device Download PDFInfo
- Publication number
- JP2007306068A JP2007306068A JP2006129645A JP2006129645A JP2007306068A JP 2007306068 A JP2007306068 A JP 2007306068A JP 2006129645 A JP2006129645 A JP 2006129645A JP 2006129645 A JP2006129645 A JP 2006129645A JP 2007306068 A JP2007306068 A JP 2007306068A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal plate
- metal film
- tuning fork
- container body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 73
- 238000003466 welding Methods 0.000 claims abstract description 16
- 239000010453 quartz Substances 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000000149 penetrating effect Effects 0.000 claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
【目的】容器本体の貫通部を閉塞して真空度を良好に維持した水晶デバイス特に音叉型振動子を提供する。
【構成】絶縁性の容器本体２に少なくとも水晶片１を収容してカバーを被せ、前記容器本体２に設けられた段差を有する貫通部７を真空雰囲気中で金属にて閉塞し、真空封止とした水晶デバイスにおいて、前記貫通部７における前記段差の表面にはＡuからなる金属膜が設けられ、前記金属膜上にはＮiメッキされた金属板９の外周に設けられた周回する環状突起９ａを当接し、前記金属膜と前記金属板９との間を通電する抵抗溶接によって前記金属膜と前記金属板９の環状突起９ａとを接合して、前記貫通部７を閉塞する。
【選択図】図１[Objective] To provide a quartz device, particularly a tuning fork type vibrator, in which a penetrating portion of a container body is closed to maintain a good degree of vacuum.
[Structure] At least a crystal piece 1 is accommodated in an insulating container body 2 and covered, and a stepped portion 7 provided in the container body 2 is closed with a metal in a vacuum atmosphere, and vacuum sealed. In the quartz crystal device described above, a metal film made of Au is provided on the surface of the step in the penetrating portion 7, and an annular protrusion 9 a that circulates provided on the outer periphery of the Ni-plated metal plate 9 on the metal film. The metal film and the annular protrusion 9a of the metal plate 9 are joined by resistance welding that energizes between the metal film and the metal plate 9 to close the through portion 7.
[Selection] Figure 1
Description
本発明は真空封止（真空封入）とした水晶デバイスに関し、特に水晶片を音叉状とした音叉型水晶振動子（以下、音叉型振動子とする）に関する。 The present invention relates to a crystal device that is vacuum-sealed (vacuum sealed), and more particularly to a tuning-fork crystal resonator (hereinafter referred to as a tuning-fork resonator) having a crystal piece as a tuning fork.
（発明の背景）
音叉型振動子は特に歩度を刻む基準源として知られる一方で、同期信号源としても利用される。このようなものでは、一対の音叉腕が水平方向に音叉振動することから、例えば気体内に封入した場合は摩擦抵抗を生じて、クリスタルインピーダンス（ＣＩ）を悪化させる。このことから、真空封止とすることによって、ＣＩを小さくすることが行われている。
(Background of the Invention)
While the tuning fork vibrator is known as a reference source for measuring the rate, it is also used as a synchronization signal source. In such a case, since a pair of tuning fork arms vibrate in the horizontal direction, for example, when encapsulated in gas, a frictional resistance is generated, and crystal impedance (CI) is deteriorated. For this reason, the CI is reduced by vacuum sealing.
（第１及び第２従来技術の一例）
第３図（ａ）は第１従来技術の、同図（ｂ）は第２従来技術の一例を示す音叉型振動子の断面図、同図（ｃ）は水晶片の正面図である。
(Example of the first and second prior arts)
3A is a sectional view of a tuning fork vibrator showing an example of the second prior art, FIG. 3B is a front view of a crystal piece, and FIG.
第１及び第２従来技術のいずれの場合も、音叉型振動子は音叉状とした水晶片１を容器本体２に収容する。容器本体２は積層セラミックからなり、凹状として内壁段部を有する。水晶片１は例えばＺカットとし、一対の音叉腕１（ａｂ）が音叉基部１ｃから延出してなる。各音叉腕の４面には音叉振動を励起する励振電極３が形成される。 In both cases of the first and second prior arts, the tuning fork type vibrator accommodates a crystal piece 1 in the shape of a tuning fork in a container body 2. The container body 2 is made of a laminated ceramic and has an inner wall step portion as a concave shape. The crystal piece 1 is, for example, a Z-cut, and a pair of tuning fork arms 1 (ab) are extended from the tuning fork base 1c. Excitation electrodes 3 for exciting tuning fork vibration are formed on the four surfaces of each tuning fork arm.
音叉基部１ｃの一主面には励振電極３から延出して共通接続された図示しない一対の引出電極を有する。各引出電極の延出した音叉基部１ｃの一主面は、容器本体１の内壁段部上に導電性接着剤４によって固着される。各引出電極は容器本体２の外底面の実装端子５に積層面を経て電気的に接続する。 One main surface of the tuning fork base 1c has a pair of extraction electrodes (not shown) extending from the excitation electrode 3 and connected in common. One main surface of the tuning fork base portion 1 c extending from each extraction electrode is fixed to the inner wall step portion of the container body 1 by the conductive adhesive 4. Each extraction electrode is electrically connected to the mounting terminal 5 on the outer bottom surface of the container body 2 through the laminated surface.
（第１従来技術）
そして、第１従来技術では、容器本体２の開口端面に設けられた金属リング２ａに、真空雰囲気中でのシーム溶接によって金属カバー６が接合される。シーム溶接は図示しない一対の電極ローラを金属カバー６の対向する両辺に当接して押圧するとともに、一対の電極ローラ間を通電する。
(First prior art)
In the first prior art, the metal cover 6 is joined to the metal ring 2a provided on the opening end surface of the container body 2 by seam welding in a vacuum atmosphere. In the seam welding, a pair of electrode rollers (not shown) are pressed against both opposite sides of the metal cover 6 and energized between the pair of electrode rollers.
そして、金属ローラを相対的に進行させ、通電によるジュール熱によって金属カバー６の一組の両辺を接合した後、他組の両辺を同様に接合する。通常では、金属カバー６の母材は膨張係数が容器本体２（セラミック)と接近したコバールとし、表面をＮiメッキとする。そして、Ｎiメッキがジュール熱によって溶融して接合される。これにより、密閉容器内に水晶片１を真空封入する。 Then, the metal roller is relatively advanced, and both sides of one set of the metal cover 6 are joined by Joule heat by energization, and then both sides of the other set are joined in the same manner. Normally, the base material of the metal cover 6 is Kovar whose expansion coefficient is close to the container body 2 (ceramic), and the surface is Ni plated. The Ni plating is melted and joined by Joule heat. Thereby, the crystal piece 1 is vacuum-sealed in the sealed container.
（第２従来技術）
また、第２従来技術では、大気中でのシーム溶接によって金属カバー６を容器本体２に接合する。そして、容器本体２内の大気を排気しての真空雰囲気中で、容器本体２の底面に設けられた貫通部７を金属８によって閉塞する。貫通部７は外表面側の第１貫通孔７ａと、これより直径の小さい内底面側の第２貫通孔７ｂからなり、これにより段差を形成する。そして、Ｗ（タングステン）やＭo（モリブテン）等のセラミックとの馴染みのよい金属膜が形成される。
(Second conventional technology)
In the second prior art, the metal cover 6 is joined to the container body 2 by seam welding in the atmosphere. Then, the through-hole 7 provided on the bottom surface of the container body 2 is closed by the metal 8 in a vacuum atmosphere in which the air inside the container body 2 is exhausted. The through portion 7 includes a first through hole 7a on the outer surface side and a second through hole 7b on the inner bottom surface side having a smaller diameter, thereby forming a step. Then, a metal film familiar with ceramics such as W (tungsten) and Mo (molybdenum) is formed.
そして、銀ロウや半田等の封止剤を溶融して金属板を接合する。あるいは、金属自体を加熱溶融して閉塞する。これらは、例えばレーザや電子ビームの照射によって、加熱装置によって封止剤や金属を溶融する。これにより、密閉容器内に水晶片１を真空封入する。
（従来技術の問題点）
しかしながら、第１従来技術の音叉型振動子では、一対の金属ローラを回転して順次に接合する真空雰囲気中でのシーム溶接とする。したがって、ジュール熱によって金属カバー６が加熱され、不要ガスが発生する。そして、不要ガスは密閉容器内に閉じ込められ、真空度を低下させる問題があった。
(Problems of conventional technology)
However, in the tuning fork vibrator according to the first prior art, seam welding is performed in a vacuum atmosphere in which a pair of metal rollers are rotated and sequentially joined. Therefore, the metal cover 6 is heated by Joule heat, and unnecessary gas is generated. And unnecessary gas was confined in the airtight container, and there existed a problem of reducing a vacuum degree.
第２従来技術では、シーム溶接時の金属カバー６からの不要ガスによる影響は軽減されるものの、封止剤や金属自体を溶融する。したがって、これらから発生する不要ガスによって依然として真空度を低下させる問題があった。これらにより、いずれの場合でも、音叉型振動子のＣＩを上昇させてしまう問題があった。 In the second prior art, the effect of unnecessary gas from the metal cover 6 during seam welding is reduced, but the sealant and the metal itself are melted. Accordingly, there is still a problem that the degree of vacuum is still lowered by the unnecessary gas generated from these. Accordingly, in any case, there is a problem that the CI of the tuning fork vibrator is increased.
（発明の目的）
本発明は貫通部を閉塞して真空度を良好に維持した水晶デバイス特に音叉型振動子を提供することを目的とする。
(Object of invention)
An object of the present invention is to provide a crystal device, particularly a tuning fork type vibrator, in which a penetrating portion is closed to maintain a good degree of vacuum.
本発明は、特許請求の範囲（請求項１）に示したように、積層セラミックからなる容器本体に少なくとも水晶片を収容してカバーを被せ、前記容器本体に設けられた段差を有する貫通部を真空雰囲気中で金属にて閉塞し、真空封止とした水晶デバイスにおいて、前記貫通部における前記段差の表面にはＡuからなる金属膜が設けられ、前記金属膜上にはＮiメッキされた金属板の外周に設けられた周回する環状突起を当接し、前記金属膜と前記金属板との間を通電する抵抗溶接によって前記金属膜と前記金属板の環状突起とを接合して、前記貫通部を閉塞した構成とする。 In the present invention, as shown in the claims (Claim 1), at least a crystal piece is accommodated in a container body made of laminated ceramic and covered, and a through portion having a step provided in the container body is provided. In a quartz device sealed with metal in a vacuum atmosphere and vacuum sealed, a metal film made of Au is provided on the surface of the step in the penetrating portion, and a metal plate plated with Ni on the metal film An annular projection provided on the outer periphery of the metal plate is abutted, and the metal film and the annular projection of the metal plate are joined by resistance welding that energizes between the metal film and the metal plate, and the through portion is formed. The configuration is closed.
このような構成であれば、抵抗溶接によって金属板の環状突起のＮiメッキが溶融して金属膜に接合するので、銀ロウや半田等の封止剤及び金属自体を加熱溶融した場合に比較し、不要ガスの発生をさらに抑制する。したがって、真空度を良好に維持して、音叉型振動子のＣＩを小さくできる。 In such a configuration, the Ni plating of the annular projections of the metal plate is melted and joined to the metal film by resistance welding, so compared with the case where the sealant such as silver solder or solder and the metal itself are heated and melted. Furthermore, the generation of unnecessary gas is further suppressed. Accordingly, the CI of the tuning fork vibrator can be reduced while maintaining a good degree of vacuum.
（実施態様項）
本発明の請求項２では、請求項１において、前記金属板の中央領域には位置決用の突出部が設けられる。同請求項３では、請求項１において、前記容器本体には水晶片のみが収容された水晶振動子とする。また、同請求項４では、請求項３において、前記水晶片は音叉状とした音叉型水晶振動子とする。これらにより、本発明がさらに具体的になる。
(Embodiment section)
According to claim 2 of the present invention, in claim 1, a protrusion for positioning is provided in a central region of the metal plate. In the third aspect of the present invention, in the first aspect, the container main body is a crystal resonator in which only a crystal piece is accommodated. In the fourth aspect of the present invention, in the third aspect, the crystal piece is a tuning fork type crystal resonator having a tuning fork shape. These make the present invention more concrete.
第１図は本発明の一実施形態を説明する図で、同図（ａ）は音叉型振動子の断面図、同図（ｂ）は点線丸で示す部分の拡大断面図、同図（ｃ）は抵抗溶接を説明する一部拡大断面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。 FIG. 1 is a view for explaining an embodiment of the present invention. FIG. 1 (a) is a sectional view of a tuning fork type vibrator, FIG. 1 (b) is an enlarged sectional view of a portion indicated by a dotted circle, and FIG. ) Is a partially enlarged cross-sectional view illustrating resistance welding. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.
音叉型振動子は前述したように容器本体２の内壁段部に引出電極の延出した音叉基部１ｃの一主面を固着し、シーム溶接等によって金属カバー６を接合する。そして、本発明では、容器本体２の底面に設けられた段差を有する貫通部７を金属板９の抵抗溶接によって閉塞する。貫通部７は前述のように第１貫通孔７ａと第２貫通孔７ｂからなり、これにより段差を形成する。 As described above, in the tuning fork vibrator, one main surface of the tuning fork base 1c with the extraction electrode extended is fixed to the inner wall step portion of the container body 2, and the metal cover 6 is joined by seam welding or the like. And in this invention, the penetration part 7 which has the level | step difference provided in the bottom face of the container main body 2 is obstruct | occluded by the resistance welding of the metal plate 9. FIG. As described above, the through portion 7 includes the first through hole 7a and the second through hole 7b, thereby forming a step.
ここでは、容器本体２の貫通部７の段差表面にはＷやＭoを下地層として、メッキによるＮi及びＡuの金属膜１０を積層する。金属膜１０は貫通部７を周回する環状とする。ＷやＭoの下地層は積層セラミックを形成するグリーンシートの状態で印刷によって形成され、一体的に焼成される。 Here, the Ni and Au metal films 10 are laminated on the stepped surface of the penetrating portion 7 of the container body 2 using W or Mo as a base layer. The metal film 10 has an annular shape that goes around the through portion 7. The underlayer of W or Mo is formed by printing in the form of a green sheet forming a multilayer ceramic, and is fired integrally.
金属板９は円板状とし、一主面の外周に周回する環状突起９ａを有する。そして、中央部には第２貫通孔７ｂの直径と同等以下の突出部９ｂが設けられる。これらは、金属平板のプレス加工やエッチングによって形成される。金属板９は母材をコバールとして表面をＮiメッキとする。 The metal plate 9 is disc-shaped and has an annular protrusion 9a that circulates around the outer periphery of one main surface. And the protrusion part 9b below the diameter of the 2nd through-hole 7b is provided in the center part. These are formed by pressing or etching a metal flat plate. The surface of the metal plate 9 is Ni plating with the base material being Kovar.
このようなものでは、先ず、金属板９の突出部９ｂを第２貫通孔７ｂに挿入して、外周の環状突起９ａを貫通部７の段差表面上の金属膜１０に当接する。この場合、突出部９ｂによって、金属板９の位置決めを容易にする。次に、棒状の中央電極１１ａと円筒状の外周電極１１ｂとからなる溶接電極棒１１を貫通部７の段差表面に当接して押圧するとともに通電する。但し、溶接電極棒１１の中央電極１０ａの先端は金属板９に、外周電極１１ｂの先端は金属膜１０に当接する。 In such a case, first, the protruding portion 9 b of the metal plate 9 is inserted into the second through hole 7 b, and the outer peripheral annular protrusion 9 a is brought into contact with the metal film 10 on the stepped surface of the through portion 7. In this case, the metal plate 9 can be easily positioned by the protruding portion 9b. Next, the welding electrode rod 11 composed of the rod-shaped central electrode 11a and the cylindrical outer peripheral electrode 11b is pressed against the stepped surface of the penetrating portion 7 and energized. However, the tip of the central electrode 10 a of the welding electrode rod 11 is in contact with the metal plate 9, and the tip of the outer peripheral electrode 11 b is in contact with the metal film 10.
これにより、金属板９の外周と電極膜１０との間には電流が生じ、特に環状突起９ａに電流が集中して表面のＮiメッキがジュール熱によって溶融する。そして、金属板９の環状突起９ａと金属膜１０とを接合する。この場合、環状突起９ａのＮiメッキが瞬間的に溶融して接合される。 As a result, a current is generated between the outer periphery of the metal plate 9 and the electrode film 10, and the current is concentrated particularly on the annular projection 9a, so that the Ni plating on the surface is melted by Joule heat. Then, the annular protrusion 9a of the metal plate 9 and the metal film 10 are joined. In this case, the Ni plating of the annular protrusion 9a is instantaneously melted and joined.
したがって、従来例のように、封止材としての半田や銀ロウを加熱によって溶融した場合や、金属自体を溶融した場合に比較して、不要ガスの発生を抑制する。これにより、密閉容器の真空度を高めて音叉型振動子のＣＩを小さくできる。なお、位置決用の突出部９ｂの外径が第２貫通孔７ｂの内径に接近するほど、例えば抵抗溶接によって金属屑が発生しても密閉容器内への侵入を防止できる。 Therefore, as in the conventional example, generation of unnecessary gas is suppressed as compared with the case where solder or silver solder as a sealing material is melted by heating or the metal itself is melted. Thereby, the degree of vacuum of the sealed container can be increased and the CI of the tuning fork vibrator can be reduced. As the outer diameter of the positioning projection 9b approaches the inner diameter of the second through-hole 7b, even if metal debris is generated by resistance welding, for example, entry into the sealed container can be prevented.
（他の事項）
上記実施形態では金属板９の中央部には位置決用とした突出部９ｂを設けたが、例えば第２図に示したようにしてもよい。すなわち、段差表面の金属膜１０を第２貫通孔７ｂから離間して無電極部１０ａを形成し、金属板９の中央領域に第１突出部９ｂと第２突出部９ｃを設ける。
(Other matters)
In the above embodiment, the protrusion 9b for positioning is provided at the center of the metal plate 9. However, for example, it may be as shown in FIG. That is, the metal film 10 on the surface of the step is separated from the second through hole 7 b to form the electrodeless portion 10 a, and the first protruding portion 9 b and the second protruding portion 9 c are provided in the central region of the metal plate 9.
そして、第１突出部９ｂを第２貫通孔７ｂに挿入し、第２突出部９ｃの表面を無電極部１０ａに当接する。このようにすれば、第２突出部９ｃは無電極部１０ａに当接して電流は生じないので、第２突出部９ｃから金属屑は発生しない。したがって、環状突起９ａを金属膜１０に抵抗溶接し、環状突起９ａから金属屑が発生しても密閉容器内への侵入を防止できる（所謂スプラッシュ対策）。 And the 1st protrusion part 9b is inserted in the 2nd through-hole 7b, and the surface of the 2nd protrusion part 9c is contact | abutted to the electrodeless part 10a. If it does in this way, since the 2nd protrusion part 9c will contact | abut to the non-electrode part 10a and an electric current will not arise, a metal scrap will not generate | occur | produce from the 2nd protrusion part 9c. Therefore, the annular protrusion 9a is resistance-welded to the metal film 10, and even if metal scraps are generated from the annular protrusion 9a, entry into the sealed container can be prevented (so-called splash countermeasure).
音叉型振動子を例として説明したが、例えばＡＴカットとした厚みすべり振動子であってもよく、いずれの振動子であっても適用できる。さらには、水晶片とともにＩＣチップを密閉封入して例えば発振器を構成した場合であってもよく、少なくとも水晶片を密閉封入した水晶デバイスに適用できる。 Although a tuning fork type vibrator has been described as an example, for example, an AT-cut thickness slip vibrator may be used, and any vibrator can be applied. Further, for example, an oscillator may be configured by hermetically enclosing the IC chip together with the crystal piece, and the present invention can be applied to a crystal device in which at least the crystal piece is hermetically sealed.
１ 水晶片、２ 容器本体、３ 励振電極、４ 導電性接着剤、５ 実装端子、６ 金属カバー、７ 貫通部、８ 金属、９ 金属板、１０ 金属膜、１１ 溶接電極棒。 DESCRIPTION OF SYMBOLS 1 Crystal piece, 2 Container body, 3 Excitation electrode, 4 Conductive adhesive agent, 5 Mounting terminal, 6 Metal cover, 7 Penetration part, 8 Metal, 9 Metal plate, 10 Metal film, 11 Welding electrode rod
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006129645A JP2007306068A (en) | 2006-05-08 | 2006-05-08 | Crystal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006129645A JP2007306068A (en) | 2006-05-08 | 2006-05-08 | Crystal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2007306068A true JP2007306068A (en) | 2007-11-22 |
Family
ID=38839668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006129645A Pending JP2007306068A (en) | 2006-05-08 | 2006-05-08 | Crystal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007306068A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8018126B2 (en) | 2009-09-16 | 2011-09-13 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric devices exhibiting reduced CI degradation |
| JP2013219224A (en) * | 2012-04-10 | 2013-10-24 | Nec Corp | Vacuum package, manufacturing method of vacuum package, and sensor |
| JP2013219223A (en) * | 2012-04-10 | 2013-10-24 | Nec Corp | Vacuum package, sensor, and manufacturing method of vacuum package |
-
2006
- 2006-05-08 JP JP2006129645A patent/JP2007306068A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8018126B2 (en) | 2009-09-16 | 2011-09-13 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric devices exhibiting reduced CI degradation |
| JP2013219224A (en) * | 2012-04-10 | 2013-10-24 | Nec Corp | Vacuum package, manufacturing method of vacuum package, and sensor |
| JP2013219223A (en) * | 2012-04-10 | 2013-10-24 | Nec Corp | Vacuum package, sensor, and manufacturing method of vacuum package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010187054A (en) | Piezoelectric device | |
| JP2009182924A (en) | Piezoelectric device and method of manufacturing the same | |
| JP2015019142A (en) | Piezoelectric device and method for manufacturing piezoelectric device | |
| JP2009118302A (en) | Tuning fork piezoelectric resonating piece and tuning fork piezoelectric resonator | |
| JP2007306068A (en) | Crystal device | |
| JP2006086585A (en) | Surface-mounted piezoelectric resonating device | |
| JP2000223992A (en) | Piezoelectric vibrator and manufacture therefor | |
| TW201524119A (en) | Tuning fork-type piezoelectric vibrator part and tuning fork-type piezoelectric vibrator | |
| JP2007059736A (en) | Piezoelectric vibrator package, its manufacturing method, and physical value sensor | |
| JP2008205761A (en) | Piezoelectric vibration device | |
| JP4292575B2 (en) | Piezoelectric device and method of manufacturing lid | |
| JP4893578B2 (en) | Electronic component sealing method | |
| JP2009260644A (en) | Crystal device for surface mounting | |
| JP2001257279A (en) | Method of manufacturing package for electronic component | |
| JP2008057995A (en) | Manufacturing method of vibrator sealing body, vibrator sealing body, and physical quantity sensor | |
| JP2004007198A (en) | Piezoelectric device and package for piezoelectric device, method of manufacturing piezoelectric device, and mobile phone device using piezoelectric device and electronic device using piezoelectric device | |
| JP2001274649A (en) | Method for air-tightly sealing quartz vibration device | |
| JP2003060472A (en) | Piezoelectric vibrator | |
| JP2007318209A (en) | Surface mounted piezoelectric vibrating device, and manufacturing method thereof | |
| JP2009111124A (en) | Electronic device and package for the same | |
| JP2008167237A (en) | Crystal device | |
| JP2001267867A (en) | Method for manufacturing piezoelectric oscillator | |
| JP4363990B2 (en) | Surface mount crystal unit | |
| JP4599145B2 (en) | Piezoelectric diaphragm | |
| JP2001016069A (en) | Surface mounting type crystal vibrator |