JP2007301416A - Treatment method for pcb waste and its treatment facility - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment method for a PCB waste capable of accomplishing volume-reduction and recycling of an object to be treated while accomplishing simplification of an apparatus for dismantling/sorting the PCB waste or miniaturization of a scale of a liquid treatment apparatus for treating PCB and safely treating the PCB, and to provide its treatment facility. <P>SOLUTION: The treatment method for PCB waste has a pre-treatment step for removing the PCB from a vessel of the PCB waste, taking out the content stored in the vessel and washing/treating the vessel by a solvent, a plasma treatment step for melting/treating the content by a plasma melting decomposition furnace 17 and decomposing/treating the PCB remained/deposited on the content, and a liquid treatment step for decomposing the PCB removed from the vessel in the pre-treatment step and the PCB recovered in the washing treatment of the vessel. The treatment facility for the PCB waste has a pre-treatment apparatus for performing the pre-treatment step, a plasma treatment apparatus 10 for performing the plasma treatment step, and a liquid treatment apparatus for performing the liquid treatment step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a PCB waste processing method and processing equipment suitable for detoxifying PCB waste, in particular, PCB-containing electrical equipment (for example, a transformer or a capacitor) for recycling.

PCB (polychlorinated biphenyl) is a non-flammable substance that is extremely stable chemically, and has excellent heat resistance, thermal stability, and insulating properties. Therefore, it is mainly used as a transformer (transformer) or a capacitor ( It has been widely used as an insulating oil for electric devices such as electric storage devices, and as a heat medium in chemical processes.
However, it has become clear that PCB has an impact on the living environment, and its use is now prohibited. For this reason, it has been necessary to detoxify a transformer or a capacitor, which is a PCB waste that has been used in the past.

Therefore, as such a method for treating PCB waste, for example, in Patent Document 1, PCB is deoiled from PCB waste, the PCB-impregnating member is processed by a vacuum heating separation apparatus, and the PCB non-impregnating member is A method is disclosed in which a PCB that has been cleaned by a solvent cleaning apparatus and deoiled, and a PCB that has been separated by a vacuum heating separation apparatus and a solvent cleaning apparatus are processed by an existing liquid processing apparatus.

JP 2003-117517 A

However, the above PCB waste processing method still has the following problems to be solved.
The liquid processing equipment must process the PCB drained from the PCB waste and the PCB separated by the vacuum heating separation device and the solvent cleaning device, and the processing capacity corresponding to the total amount of PCB in the PCB waste to be processed It is necessary to.
In addition, the processed material that has been put into the vacuum heating separation device and processed is a mixture of metals and combustible materials that are difficult to separate, and even if the metal components are separated, the remaining residue is landfilled as industrial waste as it is. It will be disposed of and it will be necessary to secure a vast disposal site.
And since the product (solid substance and processing agent oil) in a liquid processing apparatus cannot be processed with a vacuum heating separation apparatus, industrial waste disposal, such as incineration or landfill, will be made as it is.
In addition, secondary contaminants (eg, waste activated carbon, masks, gloves, or waste) generated when processing PCB waste are sealed until they are detoxified (eg, drums or pail cans). However, the vacuum heating separation apparatus cannot process the secondary contaminants together with the enclosing container. For this reason, when processing the secondary contaminants, it is necessary for an operator to take out the contaminants from the sealed container and put them into the vacuum heating separation apparatus, which may be exposed to the PCB.

The present invention has been made in view of such circumstances. For example, while simplifying an apparatus for disassembling and separating PCB waste, or minimizing the scale of a liquid processing apparatus for processing PCB, the number of processing objects can be reduced. It is an object of the present invention to provide a PCB waste processing method and processing equipment that can increase the volume and resources, and can safely process PCBs.

The PCB waste processing method according to the first invention that meets the above-mentioned object is a pretreatment in which the PCB is deoiled from the PCB waste container, the contents stored in the container are taken out, and the container is washed with a solvent. Process,
A plasma treatment step of melting the content in a plasma melting and decomposing furnace and decomposing the PCB remaining on the content;
In the pretreatment step, there is a PCB that has been deoiled from the container and a liquid treatment step that decomposes the PCB that has been recovered by the washing process of the container.

The PCB waste processing method according to the second aspect of the present invention, wherein the PCB is deoiled from the PCB waste container, the contents stored in the container are taken out, and the impregnated material in which the PCB has permeated the contents And a non-impregnated material that remains adhered, and a pretreatment step of washing the container and the non-impregnated material with a solvent,
A plasma treatment step of melting the impregnated material in a plasma melting and decomposing furnace and decomposing the PCB that has penetrated the impregnated material;
In the pretreatment step, there is a PCB that has been deoiled from the container, and a liquid treatment step that decomposes the PCB that has been recovered by the washing treatment of the container and the non-impregnated material.

According to a third aspect of the present invention, there is provided a method for treating PCB waste, wherein the PCB is drained from each container of a capacitor and a transformer, and the contents stored in the containers are respectively taken out. A pretreatment for separating the contents of the transformer into an impregnated material infiltrated with PCB and a non-impregnated material adhering to the residue, and washing the capacitor, each transformer container, and the non-impregnated material in the transformer with a solvent. Process,
A plasma treatment step of melting the contents of the capacitor and the impregnation of the transformer in a plasma melting and decomposing furnace, and decomposing the PCB that remains on the contents of the capacitor and the PCB that has penetrated the impregnation; ,
The pre-treatment step includes a PCB that has been deoiled from each of the containers, and a liquid treatment step of decomposing the PCBs that have been collected by the washing treatment of the non-impregnated materials of the containers and the transformer.

In the PCB waste processing method according to the first to third inventions, the material to be processed in the plasma processing step is preferably placed in a sealed container in advance and processed in the plasma melting decomposition furnace together with the sealed container. .
In the PCB waste processing methods according to the first to third aspects of the present invention, it is preferable that secondary contaminants generated during the processing of the PCB waste are processed in the plasma processing step.
In the method for treating PCB waste according to the first to third inventions, it is preferable that the treated oil and solids produced by detoxifying PCB in the liquid treatment step are treated in the plasma treatment step.
In the method for treating PCB waste according to the first to third inventions, treated oil produced by treating PCB in the liquid treatment step is used as a heat source for raising temperature when starting up the plasma melting cracking furnace, and The solid material generated by processing PCB in the liquid processing step is used for either 1 or 2 of temperature maintaining burner fuel in a constant temperature chamber disposed downstream of the plasma melting cracking furnace. It is preferably used as an auxiliary heat source for raising the temperature when the cracking furnace is started up.

The PCB waste treatment facility according to the first invention that meets the above object is a pretreatment in which PCB is deoiled from a PCB waste container, the contents stored in the container are taken out, and the container is washed with a solvent. Equipment,
A plasma processing apparatus for melting the content in a plasma melting and decomposing furnace and decomposing the PCB remaining on the content;
The pretreatment device includes a PCB that has been deoiled from the container and a liquid treatment device that decomposes the PCB recovered by the washing process of the container.

The PCB waste treatment facility according to the second aspect of the present invention, wherein the PCB waste is drained from the PCB waste container, the contents stored in the container are taken out, and the impregnated material into which the PCB has permeated. And a pretreatment device for cleaning the container and the non-impregnated material with a solvent.
A plasma processing apparatus for melting the impregnated material in a plasma melting and decomposing furnace and decomposing the PCB that has penetrated the impregnated material;
The pretreatment device includes a PCB that has been deoiled from the container, and a liquid treatment device that decomposes the PCB collected by the washing treatment of the container and the non-impregnated material.

The PCB waste treatment facility according to the third invention in accordance with the above object is to drain the PCB from each capacitor and transformer container, which is PCB waste, to take out the contents stored in each container, A pretreatment for separating the contents of the transformer into an impregnated material infiltrated with PCB and a non-impregnated material adhering to the residue, and washing the capacitor, each transformer container, and the non-impregnated material in the transformer with a solvent. Equipment,
A plasma processing apparatus for melting the contents of the capacitor and the impregnation of the transformer in a plasma melting and decomposing furnace, and decomposing the PCB remaining on the contents of the capacitor and the PCB permeating the impregnation; ,
The pretreatment device includes a PCB that has been deoiled from the containers, and a liquid treatment device that decomposes the PCBs recovered by the cleaning treatment of the non-impregnated materials of the containers and the transformer.

The PCB waste processing method according to claim 1 and the PCB waste processing facility according to claims 8 to 10 perform plasma processing on a part or all of the contents stored in the PCB waste container. Therefore, the PCB can be decomposed without separating the PCB from the contents as in the prior art. Thereby, for example, the amount of PCB sent to the liquid processing step can be reduced by plasma processing, and the processing capacity of the apparatus used in the liquid processing step can be minimized.
Moreover, since a part or all of the contents are plasma-treated, the ash content in the contents is melted to form slag, so that a significant volume reduction can be achieved even when it is recycled or landfilled.

In particular, the PCB waste processing method according to claims 2 and 3 and claims 4 to 7 dependent thereon and the PCB waste processing facility according to claims 9 and 10 are accommodated in a PCB waste container. Therefore, if the amount of non-impregnated material such as iron or copper is maximized and the amount of plasma treatment is suppressed, the amount of slag can be minimized when landfilled.
In the method for treating PCB waste according to claim 4, since the material to be treated in the plasma treatment step is put in a sealed container in advance and processed in a plasma melting decomposition furnace together with the sealed container, it is put in the sealed container as in the conventional case. The waste can be processed as it is without being processed, and the worker's PCB exposure can be minimized.

In the method for treating PCB waste according to claim 5, since secondary contaminants can also be treated in the plasma treatment process, for example, an increase in the amount of PCB sent to the liquid treatment process can be prevented.
Since the processing method of the PCB waste of Claim 6 processes the processed oil and solid which are produced | generated at a liquid processing process at a plasma processing process, the further industrial waste disposal amount can be further minimized.
In the method for treating PCB waste according to claim 7, since the treated oil and solids produced in the liquid treatment process can be effectively used as a heat source for the plasma treatment process, the amount of industrial waste disposal can be minimized and the fuel cost can be reduced. Can be reduced.

Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
Here, FIG. 1 is an explanatory diagram of a PCB waste processing method according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a plasma processing apparatus used in the PCB waste processing method, and FIG. 3 is a modified example. It is explanatory drawing of the processing method of the PCB waste concerning.

As shown in FIG. 1, a PCB waste processing method according to an embodiment of the present invention is a method of processing PCB from a container of PCB-containing electrical equipment (for example, a transformer, a reactor, or a capacitor) that is an example of PCB waste. Remove the oil and take out the contents stored in this container (for example, if the PCB waste is a transformer, its core, if it is a capacitor, its element), and clean the container with a solvent. A plasma processing step in which the PCB is melted in the plasma melting and decomposing furnace 17 and the PCB is decomposed, and in the pre-processing step, the PCB that has been deoiled from the container and the PCB that has been recovered by cleaning the container are decomposed and detoxified. Process. In addition, the PCB withdrawn from the PCB waste container means only PCB or oil containing PCB.
The pretreatment process is performed by a pretreatment apparatus, the plasma treatment process is performed by the plasma treatment apparatus 10, and the liquid treatment process is performed by the liquid treatment apparatus. The pretreatment device, the plasma treatment device 10, and the liquid treatment device constitute a PCB waste treatment facility. This will be described in detail below.

As shown in FIG. 1, a transformer (or reactor), which is a PCB-containing electrical device, is carried into a PCB processing plant using, for example, a transport vehicle, temporarily stored, and then paid out to a preprocessing device. Hereinafter, the pretreatment process performed by the pretreatment apparatus will be described.
The transformer container is, for example, perforated and drained by vacuum suction through an oil draining tube. As described above, after the PCB in the container is drained, a cleaning solvent is poured into the container using, for example, an oil drain pipe to perform rough cleaning. And the upper cover of a container is removed, the core (an example of the contents) of the transformer accommodated in the container is taken out, and the container and the core are separated. This container is further cleaned with a cleaning solvent.
Here, the container cleaned with the solvent is dispensed if it passes after its graduation determination (determination of whether the PCB residual concentration is below the reference value). However, when the graduation determination result is unacceptable, the re-washing is repeated until the determination of acceptance is made.

Moreover, when processing the capacitor | condenser which is a PCB containing electrical equipment at a pre-processing process, the container of a capacitor | condenser is first punctured and the PCB in a container is deoiled. And the upper part of a container is cut | disconnected, the element (an example of the content) of the capacitor | condenser accommodated in the container is taken out, and a container and an element are isolate | separated. The separated container, lid, and element are each roughly cleaned with a cleaning solvent. Furthermore, the container and the lid are precisely cleaned with a cleaning solvent. On the other hand, the extracted element may be crushed or cut as necessary.

Next, the transformer core (or capacitor element) separated in the pretreatment step is put into a sealed container and sent to the plasma processing apparatus 10 to perform plasma processing. Hereinafter, after describing the plasma processing apparatus 10, a plasma processing process using the plasma processing apparatus 10 will be described.
As shown in FIG. 2, the plasma processing apparatus 10 includes a plasma melting and decomposing means 11, a constant temperature chamber 12, a temperature reducing tower 13, a bag filter 14, a catalytic reaction tower 15, and an activated carbon tank 16. This plasma melting and decomposing means 11 has a plasma melting and decomposing furnace (hereinafter also simply referred to as “melting and decomposing furnace”) 17 and a processed material input chamber 18.
The processed material input chamber 18 is provided adjacent to the melting / disassembling furnace 17 in order to transfer a sealed container (for example, a drum can or a pail can) 19 enclosing the processed object to the melting / disassembling furnace 17. This is a room in which the enclosed container 19 filled with the contents taken out from the container or the PCB contaminant of the secondary contaminant is charged as it is.

The melting cracking furnace 17 is a furnace for generating a plasma arc, and a plasma torch 20 that is inserted into the furnace from the outside is mounted on the ceiling of the melting cracking furnace 17. A gas arc (for example, air) is continuously sent to the plasma torch 20 and electric energy is added to the plasma torch 20 so that the plasma arc has a high temperature and a center temperature of 10,000 ° C. or higher. Can be generated.
In addition, the melting cracking furnace 17 can be provided with a camera for observing the inside of the furnace as necessary, and the plasma torch 20 can be moved according to the processing state of PCB contaminants in the furnace. It is also possible to make it.
Thereby, the PCB contaminant can be efficiently irradiated with the plasma arc and the PCB contaminant can be treated.

In use, the in-furnace temperature of the melt cracking furnace 17 is maintained at about 1400 ° C., for example, and the PCB is decomposed in the melt cracking furnace 17.
One or a plurality of slag discharge containers 21 are provided in the lower part of the melting cracking furnace 17, and the generated slag is configured to be discharged into the slag discharge containers 21. Reference numerals 33 and 34 denote a pusher and a slag bath, respectively.
The constant temperature chamber 12 is a chamber to which exhaust gas from the melting cracking furnace 17 of the plasma melting cracking means 11 is supplied. The constant temperature chamber 12 is maintained at, for example, about 1200 ° C. by the burner 22, and the gas supplied into the constant temperature chamber 12 is configured to stay for several seconds, for example. Therefore, even if dioxins are present in the exhaust gas, they can be decomposed by the constant temperature chamber 12.
Here, the burner 22 is exemplified as the heat source of the constant temperature chamber 12, but a plasma torch may be used as a heat source instead of the burner.
The temperature-decreasing tower 13 cools the exhaust gas supplied from the thermostatic chamber 12 with, for example, water or air, and this cooling can prevent dioxins from being re-synthesized.

The bag filter 14 removes dust in the exhaust, and blows powdered activated carbon into its inlet, thereby adsorbing and removing a trace amount of harmful organic substances. Acidic components such as HCl can be adsorbed and removed. Thus, the bag filter 14 has not only the removal of dust in the exhaust gas but also a function of removing harmful organic substances and acidic components.
The catalytic reaction tower 15 includes a catalyst inside, and decomposes dioxins in the exhaust gas, and can also decompose NOx by adding ammonia gas to the inlet thereof.
The activated carbon tank 16 is filled with activated carbon, and if a harmful organic substance remains in the exhaust gas at the final stage of the plasma processing apparatus 10, it is a so-called safety net that adsorbs it. It has a function.

A first induction fan 27 is provided in the flow path 26 between the bag filter 14 and the catalytic reaction tower 15, and a second induction fan 29 is provided in the flow path 28 on the downstream side of the activated carbon tank 16. It has been. Further, a circulation passage 30 for returning exhaust gas to circulate from the passage between the first induction fan 27 and the catalytic reaction tower 15 to the passage between the temperature reducing tower 13 and the bag filter 14 is provided. A circulation fan 31 is provided in the circulation channel 30.
Note that the plasma processing apparatus used in the PCB waste processing method is not limited to the above-described apparatus configuration, and a plasma processing apparatus having another configuration is used as long as a plasma melting decomposition furnace is provided. Of course it is also possible.

The plasma processing apparatus 10 may process PCB contaminants such as waste, sludge, or small electrical equipment (eg, ballast). And, if there are secondary pollutants generated during the treatment of PCB waste, for example, waste activated carbon, mask, gloves, waste, cloth, paper, or sand with PCB attached, it can be treated in the plasma treatment process. preferable. In these processes, the entire sealed container in which PCB contaminants are sealed is processed by the plasma processing apparatus 10.
Moreover, graduation determination is performed for the slag and fly ash generated in the plasma processing apparatus 10 by the same method as in the case of the container described above. As a result, if it passes, it can be taken out and turned into resources, or can be properly disposed of as waste, and if it fails, plasma treatment is performed again. In addition, the fly ash determined to be acceptable in the graduation determination is further solidified by chemical treatment and discarded.

Further, as shown in FIG. 1, the PCB drained from the transformer container in the pretreatment step and the PCB recovered by the cleaning process of the container are each processed by an existing liquid processing apparatus. Hereinafter, the liquid treatment process performed by the liquid treatment apparatus will be described.
While the collected PCB is stirred in the processing container, the temperature is adjusted to, for example, 160 ° C. or more and about 170 ° C. or less under normal pressure, and a dechlorinating agent is added to dechlorinate and decompose. After measuring the PCB concentration in the processing liquid and confirming that the decomposition of the PCB is completed, the PCB is further sent into the processing tank. Then, while stirring in the treatment tank, the temperature is adjusted to, for example, about 80 ° C. to 90 ° C. under normal pressure, and solid-liquid separation is performed using, for example, a filter press.

Graduation determination is performed for the solid residue, which is a solid substance collected in this manner, and the processed oil, which is a liquid, by the same method as that for the container described above.
As a result, if it passes, it is determined that the PCB can be rendered harmless, the solid residue is disposed as industrial waste, and the treated oil is recycled as a recycled product. On the other hand, if it fails, it processes again by the method similar to the above-mentioned method.
In addition, you may process the processed oil and solid which produce | generate by detoxifying PCB in this liquid processing process at a plasma processing process. In particular, the generated processed oil is used as a heat source for raising the temperature of the plasma melting cracking furnace 17 and the fuel for the temperature maintaining burner 22 in the constant temperature chamber 12 arranged downstream of the plasma melting cracking furnace 17. It can be used for either 1 or 2, and the generated solid can also be used as an auxiliary heat source for raising the temperature when the plasma melting cracking furnace 17 is started up.

In addition, the transformer core taken out from the container may be further disassembled into an impregnated material infiltrated with PCB and a non-impregnated material adhering to the residue by using another pretreatment device (see the dotted line in FIG. 1). . In this case, for example, the paper of the coil constituting the core of the transformer becomes the impregnated material, and the iron core and the copper of the coil become the non-impregnated material.
The non-impregnated material described above is cleaned with a cleaning solvent together with the transformer container, and the above-described graduation determination is performed. Further, the impregnated product is sent to the plasma processing apparatus 10, and as described above, the impregnated product is melted in the plasma melting and decomposing furnace 17, and the PCB that has penetrated the impregnated product is decomposed.
In this case, the PCB recovered by the non-impregnated cleaning process is decomposed and detoxified in the liquid processing step together with the PCB drained from the container and the PCB recovered by the container cleaning process.

Also, as shown in FIG. 3, using a different pretreatment device, the PCB was drained from each transformer and condenser container by the above-described method, and each container was roughly cleaned, and then the transformer and condenser were each removed. Rough disassembly may be performed as follows.
The capacitor element separated from the capacitor container is sent to the plasma processing apparatus 10 as it is. Further, the core of the transformer separated from the transformer container is further separated into an impregnated material into which PCB has permeated and a non-impregnated material adhering to the residue. As described above, the impregnated material is the paper of the coil constituting the core, and the non-impregnated material is the iron core and the copper of the coil.
The non-impregnated material is cleaned with a cleaning solvent together with the transformer and capacitor containers, and the above-described graduation determination is performed. Further, the impregnated material is sent to the plasma processing apparatus 10, and as described above, the impregnated material and the element are melt-processed in the plasma melting decomposition furnace 17 together with the capacitor element, and the PCB that has penetrated the impregnated material and the element Decompose the remaining PCB.
The PCB recovered by the non-impregnated cleaning process is decomposed and detoxified in the liquid processing step together with the PCB drained from each container and the PCB recovered by the cleaning process of each container.

As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the configuration described in the above embodiment, and the matters described in the scope of claims. Other embodiments and modifications conceivable within the scope are also included. For example, the case where the PCB waste processing method and the processing equipment of the present invention are configured by combining a part or all of the above-described embodiments and modifications is also included in the scope of the present invention.

It is explanatory drawing of the processing method of the PCB waste which concerns on one embodiment of this invention. It is explanatory drawing of the plasma processing apparatus used for the processing method of the same PCB waste. It is explanatory drawing of the processing method of the PCB waste which concerns on a modification.

Explanation of symbols

10: Plasma processing apparatus, 11: Plasma melting and decomposing means, 12: Constant temperature chamber, 13: Temperature reducing tower, 14: Bag filter, 15: Catalytic reaction tower, 16: Activated carbon tank, 17: Plasma melting decomposition furnace, 18: Processing Material input chamber, 19: sealed container, 20: plasma torch, 21: slag discharge container, 22: burner, 26: flow path, 27: first induction fan, 28: flow path, 29: second induction fan, 30: Circulation flow path, 31: Circulation fan, 33: Pusher, 34: Slag bath

Claims (10)

A pre-treatment step of draining the PCB from the PCB waste container, taking out the contents stored in the container, and washing the container with a solvent;
A plasma treatment step of melting the content in a plasma melting and decomposing furnace and decomposing the PCB remaining on the content;
A PCB waste treatment method comprising: a PCB drained from the container in the pretreatment step; and a liquid treatment step for decomposing the PCB recovered by the washing treatment of the container. PCB is drained from the PCB waste container, the contents stored in the container are taken out, the contents are separated into the impregnated material infiltrated with PCB and the non-impregnated material remaining on the PCB, and the container and the non-impregnated material are separated. A pre-treatment step of washing the product with a solvent;
A plasma treatment step of melting the impregnated material in a plasma melting and decomposing furnace and decomposing the PCB that has penetrated the impregnated material;
A method for treating PCB waste, comprising: removing the PCB from the container in the pretreatment step; and a liquid treatment step for decomposing the PCB collected by the washing treatment of the container and the non-impregnated material. The PCB is drained from each container of the capacitor and the transformer, and the contents stored in the containers are respectively taken out. Further, the contents of the transformer are impregnated with the PCB and the non-impregnated substance which remains adhered to the transformer. And a pretreatment step of washing the capacitor and each container of the transformer and the non-impregnated product of the transformer with a solvent,
A plasma treatment step of melting the contents of the capacitor and the impregnation of the transformer in a plasma melting and decomposing furnace, and decomposing the PCB that remains on the contents of the capacitor and the PCB that has penetrated the impregnation; ,
PCB disposal characterized by comprising: a PCB drained from each container in the pre-treatment step; and a liquid treatment step for decomposing the PCB collected by the washing treatment of the non-impregnated material of each container and the transformer. How to handle things. The method for treating PCB waste according to any one of claims 1 to 3, wherein the material to be treated in the plasma treatment step is previously placed in a sealed container and processed in the plasma melting and decomposition furnace together with the sealed container. A method for treating PCB waste. The method for treating PCB waste according to any one of claims 1 to 4, wherein secondary contaminants generated during the treatment of the PCB waste are treated in the plasma treatment step. PCB waste disposal method. The method for treating PCB waste according to any one of claims 1 to 5, wherein treated oil and solids produced by detoxifying PCB in the liquid treatment step are treated in the plasma treatment step. A method for treating PCB waste. The method for treating PCB waste according to any one of claims 1 to 5, wherein the treated oil produced by treating the PCB in the liquid treatment step is heated when the plasma melting cracking furnace is started up. Used for either 1 or 2 of a heat source for heating and a temperature maintaining burner fuel in a constant temperature chamber disposed on the downstream side of the plasma melting and cracking furnace, and a solid material generated by processing PCB in the liquid processing step A method for treating PCB waste, which is used as an auxiliary heat source for raising temperature when starting up the plasma melting cracking furnace. A pretreatment device that drains PCB from a container of PCB waste, takes out the contents stored in the container, and cleans the container with a solvent;
A plasma processing apparatus for melting the content in a plasma melting and decomposing furnace and decomposing the PCB remaining on the content;
A PCB waste treatment facility comprising: a PCB drained from the container by the pretreatment device; and a liquid treatment device for decomposing the PCB recovered by the washing treatment of the container. PCB is drained from the PCB waste container, the contents stored in the container are taken out, the contents are separated into the impregnated material infiltrated with PCB and the non-impregnated material remaining on the PCB, and the container and the non-impregnated material are separated. A pre-treatment device for washing an object with a solvent;
A plasma processing apparatus for melting the impregnated material in a plasma melting and decomposing furnace and decomposing the PCB that has penetrated the impregnated material;
A PCB waste treatment facility, comprising: a PCB drained from the container by the pretreatment device; and a liquid treatment device for decomposing the PCB recovered by the washing treatment of the container and the non-impregnated material. The PCB is drained from each container of the capacitor and the transformer, and the contents stored in the containers are respectively taken out. Further, the contents of the transformer are impregnated with the PCB and the non-impregnated substance which remains adhered to the transformer. And a pre-processing device for washing the capacitor and each transformer container, and the non-impregnated product of the transformer with a solvent,
A plasma processing apparatus for melting the contents of the capacitor and the impregnation of the transformer in a plasma melting and decomposing furnace, and decomposing the PCB remaining on the contents of the capacitor and the PCB permeating the impregnation; ,
A PCB disposal comprising: a PCB drained from each container in the pretreatment device; and a liquid treatment device for decomposing the PCB collected by the washing treatment of the non-impregnated material in each container and the transformer. Material processing equipment.

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