JP2007235123A - Electronic component conveying method and electronic component mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a device to convey and mount minute electronic components. <P>SOLUTION: In a first process, a pickup device with pickup surface to arrange the electronic component holding liquid 20 capable of adjusting a wet area of the electronic component holding liquid 20 on the pickup surface is prepared. Then, the electronic component holding liquid 20 is arranged on the pickup surface. In a second process, electronic components are held through the electronic component maintenance liquid 20 in a state where the wet area is expanded. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method and apparatus for transporting electronic components, and a method and apparatus for mounting electronic components.

  With recent downsizing, thinning, and high functionality of electronic equipment, electronic components mounted on a printed circuit board are being downsized. Currently, the size of a chip component (for example, a chip resistor, a chip capacitor, a chip inductor, etc.) is width 0.2 mm × 0.4 mm depth × height 0.2 mm, but in the future, width 0.05 mm × 0. It is expected to be 1 mm depth x 0.05 mm height. Also, the size of the semiconductor bare chip is currently 0.3 mm square, but it is expected to be 0.1 mm square in the future.

In the mounting process of such a small electronic component, as shown in Patent Document 1, the electronic component is transported in a state where the electronic component is gripped by a jig or is adsorbed by a head having a vacuum suction mechanism. After that, it is often mounted on a circuit board.
JP 2000-77438 A JP 2002-7720 A JP 2004-108907 A JP-A-2005-33014 JP-A-11-68388 JP 2003-109397

  However, even the current chip size (chip-type electronic components of width 0.2 mm x 0.4 mm depth x height 0.2 mm or semiconductor bare chip of 0.3 mm square) must be picked up, transported and mounted. Is said to have almost reached its technical limit. For this reason, even if miniaturization of electronic parts is promoted and an ultra-small electronic part is put into practical use, it may be impossible to pick it up and transport and mount it. In other words, apart from the problem of technological innovation for producing ultra-small electronic components, the problem of how to pick up, transport and mount the miniaturized electronic components is refraining in the future.

  The present invention has been made in view of such a point, and a main object thereof is to provide a method and an apparatus capable of carrying and mounting a minute electronic component.

In order to solve the above-described problems, an electronic component transport method according to the present invention is a method for transporting an electronic component, which has a pickup surface on which an electronic component holding liquid is provided and is coated with the electronic component holding liquid on the pickup surface. A first step of providing a pre-electronic component retentate on the pickup surface;
A second step of holding the electronic component on the pickup surface via the electronic component holding liquid with the spread area widened;
including.

In a preferred embodiment, in the first step,
As the pickup device, a device having a conductive layer and an insulating layer that is laminated on the conductive layer and whose surface constitutes the pickup surface is prepared, and as the electronic component holding liquid, between the conductive layer Prepare an electrolyte solution that can apply voltage,
In the second step,
The voltage is set on the low voltage side in the voltage application range to widen the area of the electrolyte applied to the insulating layer.

In a preferred embodiment, in the second step,
The electrolytic solution is applied to the electronic component in a state where the coating area of the electrolytic solution with respect to the insulating layer is widened by setting the voltage to a low voltage side in the voltage-applicable region and weakening the surface tension of the electrolytic solution. The electronic component is held on the pickup surface by the surface tension of the electrolytic solution by contacting the electronic component.

In a preferred embodiment, after performing the second step,
A third step of separating the electronic component from the pickup surface in a state where the paint area is narrowed,
In addition.

In a preferred embodiment, in the third step,
The voltage is set on the high voltage side in the applicable region to narrow the area where the electrolytic solution is applied.

In a preferred embodiment, in the third step,
The electronic component is separated from the pickup surface in a state where the applied area of the electrolytic solution is narrowed by increasing the surface tension of the electrolytic solution by setting the voltage to the high voltage side in the applicable region.

In a preferred embodiment, in the third step,
The electrolytic solution is brought into contact with the transport destination of the electronic component, and the electronic component is moved together with the electrolytic solution from the pickup surface to the transport destination.

In a preferred embodiment, after the pickup device is moved to the electronic component transport source, the second step is performed,
The third step is performed after moving the pickup device together with the electronic component from the transport source to the transport destination of the electronic component.

  In a preferred embodiment, the length of one side of the electronic component is 0.2 mm or less.

  In a preferred embodiment, the electronic component is a chip component, and one side of the chip component is 0.1 mm or less.

  In a preferred embodiment, the electronic component is a semiconductor bare chip, and one side of the semiconductor bare chip is 0.3 mm or less.

In a preferred embodiment, the transport destination is a wiring board on which the electronic component is mounted,
The electronic component is arranged on the mounting portion of the wiring board by the electronic component transport method of the present invention.

In a preferred embodiment, the method further includes a fourth step of providing droplets on the electronic component mounting site prior to the third step,
In the third step, the electronic component held by the electrolytic solution is brought into contact with the droplet and moved to the droplet.

  In a preferred embodiment, in the fourth step, a water-repellent layer is formed on the electronic component mounting site forming surface of the wiring board except for the electronic component mounting site, and then the electronic component mounting site forming surface is formed. The droplet is provided.

In a preferred embodiment, in the fourth step, the droplet is provided on the electronic component mounting site in a shape corresponding to the electronic component,
In the third step, the electronic component is disposed on the electronic component mounting site based on self-alignment along the shape of the droplet.

The electronic component pickup device of the present invention is an electronic component pickup device that detachably holds an electronic component,
A conductive layer;
An insulating layer having a pickup surface laminated on the conductive layer and holding the electronic component on the surface;
An electrolyte provided on the pickup surface;
A power supply unit that switches and applies a voltage between the electrolytic solution and the conductive layer;
With
The voltage supply unit applies an applied voltage higher than an applied voltage between the electrolytic solution and the conductive layer when holding the electronic component between the electrolytic solution and the conductive layer when separating the electronic component. .

In a preferred embodiment, the voltage supply unit is
The applied voltage is set to the low voltage side in the voltage application possible region of the voltage supply unit so that the surface tension of the electrolyte solution is weakened when the electronic component is held and the coating area of the electrolyte solution to the insulating layer is widened. The applied voltage is set on the high voltage side in the voltage applicable region so that the surface tension of the electrolyte is increased and the area of the electrolyte applied to the insulating layer is narrowed when the electronic component is separated.

In a preferred embodiment, the electronic component pickup device of the present invention,
A moving device for moving the electronic component pickup device from a transport source of the electronic component to a transport destination;
A storage unit for storing data related to conveyance in the electronic component;
A control unit for controlling the mobile unit based on the data stored in the storage unit;
With
The voltage supply unit
In the period in which the electronic component pickup device is at the transfer source and the period in which the electronic component pickup device is moved from the transfer source to the transfer destination, the applied voltage is set to the low voltage side in the voltage application possible region, At the transport destination, the applied voltage is set on the high voltage side in the voltage application possible region to constitute an electronic component transport device.

In a preferred embodiment, the mobile unit is
In the transport source, the electrolytic solution is brought into contact with the electronic component so that the electronic component is held on the pickup surface by the electrolytic solution having a wide wet area, and the wet area is narrowed in the transport destination. The electrolytic solution is brought into contact with the transport destination so that the electronic component is separated from the pickup surface together with the electrolytic solution and moves to the transport destination.

In a preferred embodiment, the voltage supply unit has an electrode for applying a voltage on the surface of the insulating layer, and the electrode has a plurality of linear electrode units arranged radially,
And the said voltage supply part supplies a voltage to the said linear electrode part according to the direction of the said electronic component desired at the time of electronic component holding | maintenance.

In a preferred embodiment, the electronic component transport device of the present invention,
A stage mover that moves relative to the electronic component transfer device, the wiring board that is provided at the transfer destination and on which the electronic component is mounted;
An electronic component mounting apparatus is configured.

  According to the present invention, since the electronic component pickup device that picks up the electronic component by the surface tension of the electrolyte is moved together with the electronic component, even a small electronic component can be easily transported. In addition, the electronic component can be released by changing the area where the electrolytic solution is applied. In addition, the present invention makes it possible to pick up and release at a higher speed than a so-called mechanical configuration that is grasped by a vacuum suction method or a jig, and electronic components can be mounted very efficiently.

  Preferred embodiments of the present invention will be described below with reference to the drawings. The inventor of the present application examined a problem that will occur in the future with the acceleration of downsizing of electronic parts, that is, a problem of transporting and mounting of minute electronic parts. As a result of the study, in the future, miniaturization of electronic components will be promoted to a level where it is almost impossible to grasp the chip with a jig, and similarly, electronic components will be picked up, transported and mounted by a vacuum suction mechanism. It turned out to be very difficult.

  If today's technology is further improved and there is a technical breakthrough, it will not necessarily be impossible to pick up, transport and mount as electronic components become smaller than their current size. However, the inventor of the present application has sought a new technology, not an improvement on the extension of the current technology. As a result of various studies, it has been recognized that a method for picking up, transporting and mounting a minute electronic component using the surface tension of a liquid is promising. However, even if the electronic component can be adsorbed using the surface tension of the liquid, there remains a problem that it is difficult to release it.

  Furthermore, in an actual process, working time control in one step is also a big problem. That is, it is not possible to put it into practical use simply by enabling the suction and release of electronic components by surface tension, and a control technology that suppresses suction and release within a reasonable work time is required.

  Based on such studies, the inventor of the present application made use of the surface tension of the liquid and intensively studied a method for rapidly controlling the liquid to arrive at the present invention. Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity. In addition, this invention is not limited to the following embodiment. An electronic component conveying method according to an embodiment of the present invention will be described with reference to FIGS. 1A, 1B, and 2.

  1A and 1B schematically show a configuration of an electronic component pickup apparatus 100 used in the present embodiment. The electronic component pickup device 100 here refers to a dedicated device that picks up and holds small electronic components such as chip-type electronic components. The electronic component pickup device 100 includes a conductive layer 10, an insulating layer 12, an electrolytic solution 20, a power source 16, a power source control unit 17, and electrodes 15A and 15B. The insulating layer 12 is laminated on the conductive layer 10 and its surface constitutes a pickup surface that holds the electronic component. The electrolytic solution 20 is applied on the conductive layer 10 with the insulating layer 12 interposed. The power supply 16 supplies power to the electronic component pickup apparatus 100, and electrodes 15A and 15B are connected to both output ends via wirings 14. The electrode 15A is connected to the conductive layer 10, and the electrode 15B is in contact with the electrolytic solution 20. As a result, a voltage is applied to the conductive layer 10 and the electrolytic solution 20 from the power supply 16 via the electrodes 15A and 15B. The power supply control unit 17 adjusts the applied voltage of the power supply 16. In the present embodiment, a voltage supply unit is configured by the power supply 16 and the power supply control unit 17, and an electronic component holding liquid is configured by the electrolytic solution 20.

  The electronic component pickup apparatus 100 controls the area (wetting) of the electrolytic solution 20 on the insulating layer 12 using an electrowetting phenomenon. The electrowetting phenomenon is a change in the surface tension between the electrolyte solution and the substrate surface due to a change in the charge density in the vicinity of the substrate surface with which the electrolyte solution is in contact. This is a phenomenon in which the area of wettability (wetting) with the material changes.

  In the electronic component pickup device 100 having a structure for generating the electrowetting phenomenon, a voltage (preferably a direct current voltage) is applied between the electrodes 15A and 15B, whereby the electrolytic solution 20 and the base material (in this case, the insulating layer 12). ), The contact area of the electrolyte solution 20 on the substrate can be changed. The response speed of the electrowetting phenomenon (electrolyte height adjustment speed) is as fast as 10 ms or less, and the wettability can be controlled at a higher speed than in electrophoresis.

In the state shown in FIG. 1A, a low level voltage V ₁ located between the conductive layer 10 and the electrolytic solution 20 in the electronic component pickup apparatus 100 from the power source 16 on the low voltage side of the voltage application region of the power source 16. Alternatively, a high level voltage V ₂ (V ₁ <V ₂ ) located on the high voltage side is applied. Then, as shown in FIG. 1B, when the voltage fluctuates from V ₁ to V ₂ and increases, the charge state on the insulating layer (dielectric layer) 12 changes, and the electrolyte 20 and the insulating layer 12 The surface tension between them increases. Therefore, the wetted area (wetting property) of the electrolytic solution 20 is reduced, and the contact area of the electrolytic solution 20 on the substrate is reduced. In the electronic component pickup apparatus 100 of the present embodiment, the application area of the electrolytic solution 20 is controlled by such an action, and the electronic component is picked up and released. The operation of picking up and releasing the electronic component by the electronic component pickup device 100 will be described in the following description regarding the electronic component transport device 200 in which the electronic component pickup device 100 is incorporated.

  Next, an electronic component transport apparatus 200 incorporating the electronic component pickup apparatus 100 will be described with reference to FIG. FIG. 2 is a block diagram illustrating a configuration of the electronic component transport apparatus 200. In the following drawings including FIG. 2, the conductive layer 10, the insulating layer 12, the electrolytic solution 20, and the electrodes 15 </ b> A and 15 </ b> B are collectively described as the pickup device body 18. The electronic component conveying device 200 includes an electronic component pickup device 100, a pickup device main body moving motor (hereinafter abbreviated as a motor) 101, a component coordinate storage unit 102, a component storage unit 103, and a component orientation storage unit 104. And a control unit 105. In the present embodiment, a moving device is configured from the pickup apparatus main body moving motor 101, and a storage unit is configured from the component coordinate storage unit 102, the component storage unit 103, and the component orientation storage unit 104.

  The motor 101 repeatedly moves the pickup apparatus main body 18 between a plurality of transport positions. The plurality of transport positions are a preparation position of each electronic component (a storage position or the like and hereinafter referred to as a transport source α) and a transport position of each electronic component (an electronic component mounting position or the like, hereinafter referred to as a transport destination). β)). The component coordinate storage unit 102 stores position information of each electronic component. The position information here includes coordinate information of the transport source α of each electronic component and coordinate information of the transport destination β of each electronic component. The component storage unit 103 includes shape data, pickup conditions, release conditions, and the like of each electronic component. The component orientation storage unit 104 stores information related to the arrangement orientation of the electronic component 30 at the transport source α and the transport destination β. The control unit 105 controls the operation of the motor 101 and the operation of the pickup apparatus main body 18 based on the information group stored in the component coordinate storage unit 102, the component storage unit 103, and the component orientation storage unit 104. Note that the component orientation storage unit 104 is omitted when information regarding the arrangement direction of the electronic component 30 at the transport source α and the transport destination β is unnecessary.

The operation of the electronic component transport apparatus 200, that is, the operation of picking up, transporting and releasing the electronic component will be described below. FIG. 3 is a process diagram for explaining the operation of transporting the electronic component 30 by the electronic component transport apparatus 200. First, the control unit 105 controls the power source 16 via the power source control unit 17 to apply the low level voltage V ₁ between the electrolytic solution 20 and the conductive layer 10 as a pretreatment when piping up the electronic component 30. To do. The applied low level voltage V ₁ may be a ground voltage. As a result, the charge state changes, and the surface tension of the electrolytic solution 20 is reduced. As a result, the wetted area with respect to the insulating layer 12 becomes electronic components on the surface (pickup surface) of the insulating layer 12 via the electrolytic solution 20 It becomes an area which can hold 30. In this state, as shown in FIG. 3A, the motor 101 is operated to bring the pickup device body 18 close to the transport source α of the electronic component 30, and the electrolytic solution 20 of the pickup device body 18 contacts the electronic component 30. The electronic component 30 is taken into the electrolytic solution 20 by the surface tension and held on the surface (pickup surface) of the insulating layer 12 (see arrow 35).

  After picking up the electronic component 30, the control unit 105 operates the motor 101 to move the pickup device body 18 from the transport source α of the electronic component 30 to the transport destination β as shown in FIG. At this time, the low level voltage application state is maintained. At the transport destination β, the pickup apparatus main body 18 is arranged at a position directly above the transport destination β of the electronic component 30. In addition, as conveyance destination (beta), there exists an electronic component mounting pattern location in the circuit board which mounts the electronic component 30, for example.

After performing the above transport operation, the control unit 105 controls the power supply control unit 17 to change the voltage applied between the electrolytic solution 20 and the conductive layer 10 from the low level voltage V ₁ to the high level voltage V ₂ . To do. As a result, the charge state changes and the surface tension of the electrolytic solution 20 increases, and as a result, the wet area of the insulating layer 12 causes the electronic component 30 to pass through the electrolytic solution 20 to the surface (pickup surface) of the insulating layer 12. ) Makes it difficult to hold. Then, as shown in FIG. 3C, the electronic component 30 is separated from the surface of the insulating layer 12 and moved to the transport destination β. This completes the release.

  When picking up, transporting, and releasing the electronic component 30, the control unit 105 mounts information (coordinate information, etc.) related to the transport source α and transport destination β of the electronic component 30 to be mounted from the component coordinate storage unit 102. The 30 pickup conditions and release conditions are read from the component storage unit 103, and the motor 101 is driven and controlled based on the information.

The principle of picking up and releasing an electronic component using the electrowetting phenomenon will be described. The wetted area of the electrolytic solution 20 in a state where the low-level voltage V ₁ is applied to the pickup device main body 18 is approximately equal to or larger than the size of the electronic component 30. The dropping amount of the electrolytic solution 20 is set so as to have such a wet area.

When the pickup apparatus main body 18 is brought into contact with the electronic component 30 in the state where the low level voltage is applied (V ₁ ) at the transport source α, the electronic component 30 is adsorbed by the pickup apparatus main body 18 due to the wettability of the electrolytic solution 20 with respect to the electronic component 30. The On the other hand, in a state where the high-level voltage V ₂ is applied to the pickup device body 18, the surface tension of the electrolytic solution 20 increases, and as a result, the wetted area between the electrolytic solution 20 and the insulating layer 12 is as much as possible. Becomes smaller than the electronic component 30. Therefore, when the high level voltage application state (V ₂ ) is set at the transport destination β, the electronic component 30 is hardly held on the surface (pickup surface) of the insulating layer 12 via the electrolytic solution 20 and is released to the transport destination β.

Contrary to the above, the pickup device main body 18 in a state where the high level voltage V ₂ is applied at the transport source α cannot be picked up even if it is brought close to the electronic component 30. In the transport source α, the electronic component 30 can be picked up only when the low level voltage V ₁ is applied.

Next, as shown in FIG. 3B, the pickup apparatus main body 18 is transported from the transport source α to the transport destination β in a state where the electronic component 30 is adsorbed by the surface tension of the electrolytic solution 20 (see arrow 36). At this time, the low level voltage V ₁ application state is maintained. In the illustrated example, the pickup device body 18 is transported to above the wiring board 40.

Thereafter, as shown in FIG. 3C, the electronic component 30 that has reached the conveyance destination β is released from the pickup device body 18. In this example, the electronic component 30 is released on the land (electrode) 42 a of the wiring board 40. At the time of release, the voltage control unit 17 raises the voltage applied to the electrolytic solution 20 from the low level voltage V ₁ to the high level voltage V 2. As a result, the surface tension of the electrolytic solution 20 increases, and the wetted area between the electrolytic solution 20 and the insulating layer 12 becomes smaller than the size of the electronic component 30. Therefore, the electronic component 30 is difficult to be held on the surface (pickup surface) of the insulating layer 12 via the electrolytic solution 20, and is separated from the insulating layer 12 due to its weight or wettability of the wiring substrate 40 to the electrolytic solution 20. It moves to the transport destination β (land 42a of the wiring board 40, etc.). Note that if the transport destination β is in a state where the wettability of the electrolytic solution 20 is good, the electronic component 30 together with the electrolytic solution 20 can be easily moved to the transport destination β (land 42a). Then, the electronic component 30 is released from the pickup apparatus main body 18 to the transport destination β in a state where the impact applied to the electronic component 30 and the transport destination β (the land 42a of the wiring board 40, etc.) due to the movement of the electronic component 30 is reduced. Can do.

  As described above, in the present embodiment, the pickup and release process of the electronic component 30 is performed by adjusting the area of the electrolytic solution 20 applied to the pickup device body 18 by utilizing the electrowetting phenomenon. The electronic component 30 adsorbed by the electrolytic solution 20 is released to the transport destination β (wiring board 40) due to a change in the painted area. When releasing, it is preferable to drop droplets (liquid) 22 selectively around the transport destination β and its surroundings. Then, in the release process, the electronic component 30 can be moved from the electrolytic solution 20 to the droplet (liquid) 22 in a state where the impact caused by the dropping of the electronic component 30 is further reduced. However, even if the droplet 22 is not provided on the transport destination β (land 42a) as described above, the electrolyte 20 can be easily obtained if the transport destination β is in a state in which the electrolyte 20 has good wettability. The electronic component 30 can be placed on the transport destination β (land 42a).

Next, the pickup process will be further described with reference to FIGS. 4A to 4C. First, as shown in FIG. 4A, the electronic component 30 is stocked on the transport source α (for example, on the substrate 32 of the transport source), and the pickup device body 18 is moved toward one of the electronic components 30 therein. . At this time, the power supply control unit 17 applies the low level voltage V ₁ between the electrode 15A on the conductive layer 10 side and the electrode 15B on the insulating layer 12 side. Note that only one electronic component 30 may be arranged on the substrate 32, or a plurality of electronic components 30 may be arranged side by side. In the configuration of the illustrated example, the pickup apparatus main body 18 is moved downward as indicated by an arrow 51 so that the electrolytic solution 20 is brought closer to the electronic component 30.

  Next, as shown in FIG. 4B, the pickup device body 18 is lowered to bring the electrolytic solution 20 into contact with the electronic component 30. Then, the electrolytic solution 20 wraps around the electronic component 30 due to the surface tension, and thereby the electronic component 30 is attracted and held by the pickup device body 18 (specifically, the insulating layer 12) via the electrolytic solution 20. Is done.

Thereafter, as shown in FIG. 4C, when the pickup device body 18 is lifted upward as indicated by an arrow 52, the electronic component 30 moves away from the substrate 32 while being held by the electrolytic solution 20. At this time, the application state of the low level voltage V ₁ is maintained. If the pickup apparatus body 18 is moved in this state, the electronic component 30 can be transported accordingly.

  Next, the release process will be further described with reference to FIGS. 5A to 5C. First, as shown in FIG. 5A, the pickup apparatus main body 18 holding the electronic component 30 is moved to the transport destination β (for example, on the transport destination substrate 34), and then aligned with the transport destination β. An example of the substrate 34 serving as the transfer destination β is the wiring substrate 40 shown in FIG. In addition, it is preferable that the droplet (liquid) 22 is selectively dropped on the transport destination β (for example, a component placement location on the substrate 34). The droplet 22 is preferably a liquid having characteristics that can be assimilated with the electrolytic solution 20.

Next, as shown in FIG. 5B, the pickup apparatus main body 18 is moved in the direction indicated by the arrow 53 (downward in the drawing) to bring the pickup apparatus main body 18 into contact with the droplets 22 on the substrate 34. Immediately before this, the voltage applied to the pickup device body 18 is raised from the low level voltage V ₁ to the high level voltage V ₂ . As a result, the surface tension of the electrolytic solution 20 is reduced, and the wetted area between the electrolytic solution 20 and the insulating layer 12 is reduced. As a result, the adhesive strength between the two is reduced. Therefore, when the electrolytic solution 20 comes into contact with the droplet 22, the electrolytic solution 20 is assimilated into the droplet (liquid) 22 that is in contact with the insulating layer 12 and moves to the substrate 34 side. As the electrolytic solution 12 moves, the electronic component 30 moves to the droplet (liquid) 22 side of the substrate 34.

  Next, the pickup apparatus main body 18 is completely separated from the electronic component 30 by moving the pickup apparatus main body 18 in the direction indicated by the arrow 54 (upward in the drawing). Thereby, the release of the electronic component 30 is completed. The mounting process can be executed by evaporating the liquid droplet (liquid) 22 surrounding the electronic component 30.

  Thus, if the electrowetting phenomenon is used, the shape of the electrolytic solution 20 can be changed by adjusting the surface energy (surface tension) of the electrolytic solution 20 with respect to the insulating layer 12. In the present embodiment, the pickup and release of the electronic component 30 are realized by adjusting the wetted area of the electrolytic solution 20 with respect to the insulating layer 12 and the component holding force by the electrolytic solution 20 by utilizing this fact.

  In the pickup process shown in FIGS. 5A to 5C, the shape of the electrolytic solution 20 can be changed by an electrowetting phenomenon. However, in the pickup process, the electrolytic solution 20 and the electronic component 30 are brought into contact with each other to perform electrolysis. The purpose is to incorporate the electronic component 30 into the liquid 20. Therefore, if the electronic component 30 can be taken in, the electrowetting phenomenon may or may not be used.

  The pickup device body 18 is made of, for example, the following material. The conductive layer 10 is made of a metal such as a copper plate or a stainless steel plate. In this embodiment, it is comprised from a metal stainless steel (SUS) board. The insulating layer 12 is made of resin, epoxy resin, polyimide resin or the like. In this embodiment, it is composed of a copper foil coated with an epoxy resin. The electrodes 15A and 15B (particularly the electrode 15B) are formed by bonding and curing a copper foil coated with an epoxy resin to the conductive layer (SUS plate) 10 and removing a part of the resin.

In the electrowetting phenomenon, in order to greatly reduce the surface tension between the liquid and the insulating film by applying a relatively low voltage as the high level voltage V ₂ , a large amount of charge is applied to the interface between the electrolytic solution 20 and the insulating layer 12. Need to be generated. Therefore, the electrolytic solution 20 is provided in the present invention. The electrolytic solution 20 is composed of a water-soluble electrolytic solution (for example, 1 mM KCl) or an organic solvent. Alternatively, a mixture of an aqueous solution and an organic solvent (for example, water and alcohol) or a two-phase system (for example, ethanol, propanol, butanol, pentanol, hexanol, ethylene glycol, glycerin, alcohol, ethylene glycol ethyl ether, ethylene) The electrolyte solution 20 can also be composed of an ether such as glycol monobutyl ether, a ketone such as methyl ethyl ketone, or an alkane such as hexane, octane, or nonane. In addition to the above, examples of the water-soluble electrolyte include NaCl aqueous solution, NaBr aqueous solution, NH ₄ Cl aqueous solution, and buffer solutions containing various salts. In the case of an electrolytic solution using an organic solvent, acetic anhydride, methanol, tetrahydrofuran, propylene carbonate, nitromethane, acetonitrile, dimethylformamide, dimethyl sulfoxide, hexamethylphosphoamide can be used as the solvent, and NaClO ₄ , LiClO as the electrolyte. ₄ , KOH, KOCH ₃ , NaOCH ₃ , LiCl, NH ₄ Cl, n- (CH ₃ C ₃ H ₆ ) ₄ Ni, Mg (ClO ₄ ) ₂ , NaBF _{4 and the} like can be used. Also, alcohol solvents, various esters, aliphatic hydrocarbons, alicyclic hydrocarbons, aromatic hydrocarbons, halogenated hydrocarbons and other various oils containing a trace amount of water-soluble electrolyte can be used. The abundance of the salt or electrolyte is not particularly limited as long as the electrowetting phenomenon can be expressed, but is, for example, in the range of 10 ⁻⁴ mass% to 30 mass%.

  The droplet 22 may be composed of an electrolytic solution, but may be a liquid that is not an electrolytic solution. As the droplets 22, the same or similar ones as the electrolytic solution 20 of the pickup device main body 18 can be used. In addition, if it is desired to evaporate relatively quickly after moving the electronic component 30, a volatile liquid (for example, alcohol) can be used.

  Further, as shown in FIG. 6A, by providing a multiple pickup 180 in which a plurality of pickup device bodies 18 are provided in a series, a plurality of electronic components 30 can be picked up, transported and released simultaneously. In this case, a plurality of voltage control units 17 are provided according to the plurality of pickup device main bodies 18 to constitute a voltage control unit group 170. Further, in order to individually control the orientation and position of each pickup apparatus main body 18 constituting the multiple pickup 180, the control unit 105 includes a position control unit 105A that controls the coordinate centers of the plurality of electronic components 30 and a plurality of electronic components. And a component placement control unit 105B that controls the direction of 30. As the multiple pickup 180, as shown in FIG. 6B, a configuration in which a plurality of pickup device bodies 18 are bundled and connected in a cylindrical shape can be cited as an example. FIG. 6B is a bottom view of the multiple pickup 180.

  Next, an electronic component mounting apparatus 300 in which the transport apparatus 200 is incorporated will be described with reference to FIG. The electronic component mounting apparatus 300 includes a transfer device 200, an operation / display unit 301, and a stage moving motor 302. The operation / display unit 301 receives an operation of an operator who operates the electronic component mounting apparatus 300 and displays various types of information necessary for the operation by the operator. The stage moving motor 302 moves the stage 303 on which the wiring board 40 on which the electronic component 30 is mounted is moved relative to the pickup apparatus main body 18. In the present embodiment, a stage moving device is constituted by the stage moving motor 302.

  The operation of transporting and mounting the electronic component 30 on the wiring board 40 by the electronic component mounting apparatus 300 will be described with reference to FIGS. 8A to 8D. First, as shown in FIG. 8A, a wiring board 40 to be a transport destination (mounting) of the electronic component 30 is prepared. A wiring pattern 42 is formed in advance on the wiring board 40. The wiring board 40 may be a rigid board or a flexible board. The wiring board 40 is not limited to a single-sided wiring board or a double-sided wiring board, but may be a multilayer wiring board. A wiring board such as a rigid flexible board or a component built-in board may be used as the wiring board 40. Of course, a circuit board on which electronic components are already mounted may be used as the wiring board 40.

  Next, as shown in FIG. 8B, a water-repellent layer (water-repellent pattern) 43 is formed on the wiring board 40 except for the transport destination β (mounting position). The water repellent layer 43 is formed in order to reliably and simply form the droplet 22 on the transport destination β.

  The water repellent layer 43 is made of, for example, a photosensitive water / oil repellent resin. The water repellent layer 43 in the present embodiment is composed of a UV curable resist film made by Nippon Paint. This material is made of silicone and an acrylic block polymer, and more specifically, has a structure of silicone and acrylic sea-island structure (so-called silicone island). Here, silicone has a characteristic of low surface tension, and acrylic plays a role for controlling modification, hardness, adhesion, and UV curability of the resin. The contact angle between the formed water-repellent layer 43 and water becomes 100 ° to 105 °, and the liquid (water or the like) disposed on the water-repellent layer 43 tilts the water-repellent layer 43 so that the falling angle is 20 It will be 40 °. In the wettability of the liquid (water or the like) in the region where the water repellent layer 43 has been removed, the contact angle is 40 ° to 45 °.

The water repellent layer 43 is formed as follows, for example. First, a water repellent material is applied to the entire surface of the wiring board 40. Specifically, the water repellent material is applied to a thickness of 1 to 2 μm by using spin coating. Next, the applied water-repellent material is pre-baked (at 120 ° C. for 30 minutes) and then exposed to form a predetermined pattern. The exposure is performed at 300 mj / cm ² using UV. Next, baking is performed at 120 ° C. for 30 minutes, and the film is developed by being immersed in toluene for 1 to 2 minutes. Finally, when post baking is performed at 120 ° C. for 10 minutes, the water repellent layer 43 is formed.

  In addition, when a fluorine / acrylic block polymer manufactured by Asahi Glass Co., Ltd. is used as the photosensitive water / oil repellent resin, a water / oil repellent water repellent layer (water repellent pattern) 43 is formed by a photolithographic process using i-line. You can also

  Next, as shown in FIG. 8C, droplets 22 are formed on the wiring substrate 40 on which the water repellent layer 43 is formed. The droplet 22 can be formed as follows. When the liquid for the droplets 22 is sprayed on the entire wiring board 40 by spraying, the droplets 22 are formed in places other than the water repellent layer 43. The droplet 22 does not cause a problem in mounting electronic components.

  Moreover, it is also possible to form the droplet 22 by the method shown in FIG. 9 instead of spraying mist. That is, after the liquid 24 to be the droplet 22 is dropped on the entire surface of the wiring board 40, the slide plate (for example, slide glass) 26 is brought into contact with the liquid 24. The slide plate 26 is arranged in parallel to the wiring board 40 and with a predetermined minute gap formed therebetween. Thereby, the liquid 24 spreads over the entire surface of the wiring board 40. In this state, the slide plate 26 is slid parallel to the wiring board 40 (see arrow 27). Thereby, the droplet 22 is formed in a place other than the water repellent layer 43.

  After the droplet 22 is formed, as shown in FIG. 8D, the electronic component 30 is transferred from the transport source α to the transport destination β (the portion where the water repellent layer 43 is not formed in the wiring board 40) using the electronic component mounting apparatus 300. Transport to. After that, the electronic component 30 is loaded into the transfer destination β of the wiring board 40 and mounted by the method described with reference to FIGS. 5A to 5C. In mounting, the electronic component 30 can be mounted on the wiring board 40 by evaporating the droplet (liquid) 22 surrounding the electronic component 30 carried into the transport destination β. In mounting, the wiring board 40 is moved relative to the pickup apparatus main body 18 by the stage moving motor 302, so that the electronic component 30 and the wiring board 40 held by the pickup apparatus main body 18 are positioned with high accuracy. Can be combined.

  In the mounting method of this embodiment, the electronic component 30 is mounted on the wiring board 40 using the droplets 22, so that mounting based on self-alignment can be realized. This will be described with reference to FIGS. 10A and 10B. 10A and 10B are top views of the main part of the wiring board 40, in which the water-repellent layer 43 and the droplets 22 are shown.

  First, as shown in FIG. 10A, when the opening 43a of the water repellent layer 43 is formed corresponding to the shape of the electronic component 30, the droplet 22 is also formed in the same shape as the opening 43a. To correspond to the shape of the electronic component 30, the length dimension L3 of the long side of the opening 43a is made larger than the length dimension L1 in the longitudinal direction of the electronic component 30 and the length dimension L2 of the short side of the opening 43a. Is made smaller than the length dimension L1. By forming the opening 43a in such a shape, the electronic component 30 can be arranged in a desired direction in the droplet 22, that is, in the transport destination β.

  In the configuration shown in FIG. 10A, the electronic component 30 housed in the droplet 22 moves and rotates as indicated by the arrow 60 by the surface tension of the droplet 22, and the droplet is self-aligned as shown in FIG. 10B. 22 (or the center of the opening 43a). Thereby, the position of the electronic component 30 is adjusted so that the direction of the electronic component 30 matches the direction of the opening 43a. Therefore, even if the accuracy of the holding position when the electronic component pickup apparatus 100 picks up the electronic component 30 is somewhat poor, the electronic component 30 can be mounted and mounted at a predetermined position by the self-alignment action by the droplet 22. .

  The orientation control of the electronic component 30 described with reference to FIG. 10A and FIG. 10B is performed by adjusting the shape of the droplet 22 arranged at the carry-in destination β. In addition, the orientation control of the electronic component 30 can be realized by improving the structure of the pickup device 19 and the voltage application control to the pickup device 19 by the voltage controller 17 as shown in FIGS. 11A to 11C.

The improved pickup device 19 ′ has the greatest feature in the shape of the electrode 15C provided on the insulating layer 12 side. 11A to 11C are views of the electrode 15C as viewed from the electrolyte side (the pickup surface side of the electronic component). Electrode 15C includes a circular body electrode 15C _1, a satellite electrodes 15C ₂ ~15C ₉ a plurality (eight pieces in this example), and a connection electrode 15C _10. The main electrode 15C ₁ and the satellite electrodes 15C ₂ ~15C ₉ has a circular or polygonal shape (circular in the drawing), the size of the apparatus electrode 15C ₁ is greater than the size of the satellite electrodes 15C ₂ ~15C _9. The satellite electrodes 15C _{2 to} 15C ₉ are radially arranged at equal angles (in this example, at 45 ° intervals) with the main body electrode 15C ₁ as the center. All the main electrode 15C ₁ separation distance between each satellite electrode 15C ₂ ~15C ₉ are equal. Connection electrodes 15C ₁₀ connects individually both be in between each satellite electrode 15C ₂ ~15C ₉ and the main electrode 15C _1. The voltage control unit 17 ′ individually supplies a voltage to the main body electrode 15C ₁ and the satellite electrodes 15C _{2 to} 15C ₉ . Thus, the pair of satellite electrodes 15C _{2 to} 15C ₉ located on the diagonal line with the main body electrode 15C1 as the center, the main body electrode 15C1, and the connection electrode 15C ₁₀ connecting them constitute a linear electrode portion. A plurality of linear electrode portions configured in this manner are provided radially around the body electrode 15C1.

When dropping the electrolytic solution 20 to electrode 15c across the electrode 15C while applying a low level voltage V ₁ (or voltage non-applied state) and the body electrode 15C ₁ and each satellite electrode 15C ₂ ~15C ₉ and the connection electrodes 15C ₁₀ The electrolytic solution 20 adheres evenly. FIG. 11A shows this state. In this state, when the pickup device 19 ′ is moved to the transport source α and the electronic component 30 is brought into contact with the electrolytic solution 20, the electronic component 30 is moved depending on the orientation of the electronic component 30 at the time of initial pickup, various pickup conditions, environmental conditions, and the like. The pick-up device 19 picks up in a random state without determining the direction. That is, the electronic component 30, primarily but is adsorbed by the body electrodes 15c _1, since the satellite electrodes 15C ₂ ~15C ₉ electrolytic solution 20 all are attached, the electronic components 30 on the basis of the above-mentioned conditions body electrode 15C Rotate around ₁ and the direction is not constant. FIG. 11B shows this state.

Therefore, the voltage applied to the electrode 15C is adjusted by the voltage controller 17 ′ as follows. Here, as shown in FIG. 11C, voltage application adjustment by the voltage control unit 17 ′ is performed on the assumption that the orientation of the rectangular electronic component 30 is adjusted so that its longitudinal direction is along the vertical direction in the figure. explain. In this case, the voltage control unit 17 ′ has a high level on the remaining satellite electrodes 15C ₃ -15C ₅ , 15C ₇ -15C ₉ leaving the satellite electrodes 15C ₂ , 15C ₆ and the main body electrode 15C ₁ facing vertically in the figure. A voltage V ₂ is applied. The satellite electrodes 15C ₂ and 15C ₆ and the main body electrode 15C ₁ maintain the low-level voltage V ₁ application state. As a result, the satellite electrodes 15C ₃ -15C ₅ , 15C ₇ -15C ₉ to which the high level voltage V ₂ is applied selectively exhibit water repellency and adhere to the satellite electrodes 15C ₃ -15C ₅ , 15C ₇ -15C ₉ . The electrolyte solution 20 thus moved moves to the linear electrode portion including the satellite electrodes 15C ₂ and 15C ₆ and the main body electrode 15C ₁ that do not exhibit water repellency. Therefore, the electronic component 30 having good wettability with the electrolytic solution 20 is oriented in the longitudinal direction in the figure (the direction along the linear electrode portion that does not exhibit water repellency) in accordance with the deformation of the electrolytic solution 20. Change. Thereby, the electronic components 30 are aligned in the vertical direction in the figure.

The voltage application control for the main body electrode 15C ₁ , the satellite electrodes 15C ₃ -15C ₅ , 15C ₇ -15C _9, and the connection electrode 15C _{10 described above} is performed by, for example, the position control unit 105A and the component placement control unit 105B shown in FIG. And carried out.

In the above description, the shape of the body electrode 15C ₁ and the satellite electrodes 15C ₂ -15C ₉ is circular or polygonal shape may be any shape. Further, although the separation angle of the satellite electrodes 15C ₂ -15C ₉ is 45 ° and the direction control of the electronic component 30 is 45 °, the other angle arrangement may be used. For example, in FIG. 12, the separation angle of the satellite electrodes 15C _{2 to} 15C ₅ is 90 °, and the orientation control of the electronic component 30 is 90 °.

  In carrying out the orientation control of the electronic component 30 described above, it is preferable that not only the electrode 15C but also the conductive layer 10 and the insulating layer 12 have the same structure as the electrode 15C. However, only the electrode 15C is configured as described above. The same effect can be obtained.

  The electronic component 30 used in the method of the present embodiment is preferably a small electronic component. For example, an electronic component having a side length of 0.2 mm or less is suitable. The electronic component 30 is a chip component (for example, a chip capacitor, a chip inductor, a chip resistor) or a semiconductor element (for example, a semiconductor bare chip).

  When the electronic component 30 is a chip component, the method of the present embodiment is not limited to “0402”, which is currently the smallest size, but is smaller than that, for example, one side of the chip component is 0.1 mm or less. It can be suitably applied to things (such as “01005”). In addition, when the electronic component is a semiconductor bare chip, it is applicable to one of the smallest size of 0.3 mm square and a smaller size, for example, one side of the semiconductor bare chip of 0.1 mm or less. can do.

  Of course, the present invention has a remarkable effect on the electronic component 30 of a minute size that was very difficult or impossible to pick up by the conventional technology, but the invention is not limited to such a minute size. In addition, since the present invention can also use effects such as the high response speed of the electronic component pickup apparatus 100 and the movement between the electrolytic solution 20 and the droplet 22, the electronic component 30 is not necessarily limited to a minute one. Absent. In particular, an electronic component pickup apparatus that holds a chip with a jig may damage the electronic component. However, the configuration of the present invention can be mounted with high accuracy without damaging the electronic component.

  As mentioned above, although this invention was demonstrated by suitable embodiment, such description is not a limitation matter and of course, various modifications are possible. In the above-described embodiment, the method of using the electrolytic solution 20 in the pickup and transport method using the electrowetting phenomenon has been described. However, when solder powder is added in addition to the electrolytic solution, reflow is performed after mounting the electronic component. The electrolytic solution is volatilized, and the electronic component and a desired wiring pattern on the wiring board can be electrically connected by melting solder powder. Further, by applying solder plating such as Sn to the electrodes on the wiring board in advance, the solder plating of the electronic component electrodes can be dissolved during reflow and electrically connected to the electrodes on the wiring board.

  The configuration of the embodiment of the present invention is essentially different from that of the embodiment of the present invention. However, as a component conveying apparatus using the surface tension of a liquid, Japanese Published Patent Document (Japanese Patent Laid-Open No. 11-68388, Japanese Patent Laid-Open No. 2004-108907 and JP-A-2005-33014). However, none of these hold and convey parts by electrowetting, and the technical idea is different from the embodiment of the present invention.

  ADVANTAGE OF THE INVENTION According to this invention, the method and apparatus which can convey or mount a minute electronic component can be provided.

1 is a cross-sectional view schematically showing a configuration of an electronic component pickup device according to an embodiment of the present invention. 1 is a cross-sectional view schematically showing a configuration of an electronic component pickup device according to an embodiment of the present invention. The block diagram which shows the structure of the electronic component conveying apparatus which concerns on embodiment of this invention. Process drawing explaining the electronic component conveyance and mounting method which concerns on embodiment of this invention. The process sectional drawing 1 explaining the pick-up process in the electronic component conveyance and mounting method which concerns on embodiment of this invention. The process sectional drawing 2 explaining the pick-up process in the electronic component conveyance and mounting method which concerns on embodiment of this invention. The process sectional drawing 3 explaining the pick-up process in the electronic component conveyance and mounting method which concerns on embodiment of this invention. The process sectional drawing 1 explaining the release process in the electronic component conveyance and mounting method which concerns on embodiment of this invention. 2 of process sectional drawing explaining the release process in the electronic component conveyance and mounting method which concerns on embodiment of this invention. The process sectional drawing 3 explaining the release process in the electronic component conveyance and mounting method which concerns on embodiment of this invention. The block diagram which shows the structure of other embodiment of the electronic component conveying apparatus of this invention. The figure which shows the structure of the pick-up apparatus main body in other embodiment of the electronic component conveying apparatus of this invention. The block diagram which shows the structure of the electronic component mounting apparatus which concerns on embodiment of this invention. 1 of process sectional drawing which conveys and mounts an electronic component on a wiring board. 2 of process sectional drawing which conveys and mounts an electronic component on a wiring board. 3 of process sectional drawing which conveys and mounts an electronic component on a wiring board. 4 of process sectional drawing which conveys and mounts an electronic component on a wiring board. Process sectional drawing for demonstrating a droplet formation process. FIG. 1 is a first diagram illustrating an alignment process based on self-alignment of electronic components. FIG. 2 illustrates a positioning process based on self-alignment of electronic components. The figure 1 explaining the structure of the pick-up apparatus main body in other embodiment of this invention, and the alignment process of an electronic component. The figure 2 explaining the structure of the pick-up apparatus main body in other embodiment of this invention, and the alignment process of an electronic component. The figure 3 explaining the structure of the pick-up apparatus main body in other embodiment of this invention, and the alignment process of an electronic component. The figure which shows the structure of the pick-up apparatus main body in other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Conductive layer 12 Insulating layer 14 Wiring 15A, 15B Electrode 16 Power supply 17 Power supply control part 18 Pickup main body 20 Electrolytic solution 22 Droplet 30 Electronic component 32 Substrate (conveyance origin board) 34 Substrate (conveyance destination board)
40 Wiring Board 42 Wiring Pattern 42a Land 43 Water-Repellent Layer 43a Opening 70 Electronic Component Supply Cassette 72 Container 100 Electronic Component Pickup Device 101 Motor 102 Component Coordinate Storage Unit 103 Component Storage Unit 104 Control Unit 200 Electronic Component Conveying Device α Preparatory Position β mounting position

Claims (24)

A pickup device having a pickup surface on which an electronic component holding liquid is provided and capable of adjusting the area where the electronic component holding liquid is applied on the pickup surface is prepared, and a first electronic component holding liquid is provided on the pickup surface. Process,
A second step of holding the electronic component on the pickup surface via the electronic component holding liquid with the spread area widened;
including,
Electronic parts transport method. In the first step,
As the pickup device, a device having a conductive layer and an insulating layer that is laminated on the conductive layer and whose surface constitutes the pickup surface is prepared, and as the electronic component holding liquid, between the conductive layer Prepare an electrolyte solution that can apply voltage,
In the second step,
Setting the voltage on the low voltage side in the voltage application range to widen the coating area of the electrolyte solution to the insulating layer;
The method for conveying an electronic component according to claim 1. In the second step,
The electrolytic solution is applied to the electronic component in a state where the coating area of the electrolytic solution with respect to the insulating layer is widened by setting the voltage to a low voltage side in the voltage-applicable region and weakening the surface tension of the electrolytic solution. Contacting and holding the electronic component on the pickup surface by the surface tension of the electrolyte,
The method for conveying an electronic component according to claim 1. After performing the second step,
A third step of separating the electronic component from the pickup surface in a state where the paint area is narrowed,
In addition,
The method for conveying an electronic component according to claim 1. In the third step,
Setting the voltage on the high voltage side in the applicable region to reduce the area of the electrolyte applied;
The method for conveying an electronic component according to claim 4. In the third step,
The electronic component is separated from the pickup surface in a state where the applied area of the electrolytic solution is narrowed by increasing the surface tension of the electrolytic solution by setting the voltage on the high voltage side in the applicable region.
The method for conveying an electronic component according to claim 4. In the third step,
Bringing the electrolytic solution into contact with the transport destination of the electronic component and moving the electronic component together with the electrolytic solution from the pickup surface to the transport destination;
The method for conveying an electronic component according to claim 6. After the pickup device is moved to the electronic component transport source, the second step is performed,
The pickup device is moved together with the electronic component from the transfer source to the transfer destination of the electronic component, and then the third step is performed.
The method for conveying an electronic component according to claim 4. The length of one side of the electronic component is 0.2 mm or less.
The method for conveying an electronic component according to claim 1. The electronic component is a chip component, and one side of the chip component is 0.1 mm or less.
The method for conveying an electronic component according to claim 9. The electronic component is a semiconductor bare chip, and one side of the semiconductor bare chip is 0.3 mm or less.
The method for conveying an electronic component according to claim 9. The transport destination is a wiring board on which the electronic component is mounted,
The electronic component according to claim 8, wherein the electronic component is disposed at a mounting site of the wiring board.
Electronic component mounting method. A fourth step of providing droplets on the electronic component mounting site prior to the third step;
In the third step, the electronic component held by the electrolyte is brought into contact with the droplet and moved to the droplet.
The electronic component mounting method according to claim 12. In the fourth step, after forming the water repellent layer excluding the electronic component mounting portion on the electronic component mounting portion forming surface of the wiring board, the droplets are provided on the electronic component mounting portion forming surface.
The electronic component mounting method according to claim 13. In the fourth step, the droplet is provided in the electronic component mounting site in a shape corresponding to the electronic component,
In the third step, the electronic component is disposed at the electronic component mounting site based on self-alignment along the shape of the droplet.
The electronic component mounting method according to claim 14. An electronic component pick-up device that detachably holds an electronic component,
A conductive layer;
An insulating layer having a pickup surface laminated on the conductive layer and holding the electronic component on the surface;
An electrolyte provided on the pickup surface;
A power supply unit that switches and applies a voltage between the electrolytic solution and the conductive layer;
With
The voltage supply unit applies an applied voltage higher than an applied voltage between the electrolytic solution and the conductive layer when holding the electronic component between the electrolytic solution and the conductive layer when separating the electronic component. ,
Electronic component pickup device. The voltage supply unit
The applied voltage is set to the low voltage side in the voltage application possible region of the voltage supply unit so that the surface tension of the electrolyte solution is weakened when the electronic component is held and the coating area of the electrolyte solution to the insulating layer is widened. The applied voltage is set on the high voltage side in the voltage applicable region so that the surface tension of the electrolytic solution is increased at the time of separation of the electronic component and the coating area of the electrolytic solution to the insulating layer is narrowed.
The electronic component pickup device according to claim 16. The length of one side of the electronic component is 0.2 mm or less.
The electronic component pickup device according to claim 16. The electronic component is a chip component, and one side of the chip component is 0.1 mm or less.
The electronic component pickup device according to claim 18. The electronic component is a semiconductor bare chip, and one side of the semiconductor bare chip is 0.3 mm or less.
The electronic component pickup device according to claim 18. An electronic component pickup device according to claim 16,
A moving device for moving the electronic component pickup device from a transport source of the electronic component to a transport destination;
A storage unit for storing data related to conveyance in the electronic component;
A control unit for controlling the mobile unit based on the data stored in the storage unit;
With
The voltage supply unit
In the period in which the electronic component pickup device is at the transfer source and the period in which the electronic component pickup device is moved from the transfer source to the transfer destination, the applied voltage is set to the low voltage side in the voltage application possible region, In the transport destination, the applied voltage is set to the high voltage side in the voltage application possible region.
Electronic component transfer device. The mobile is
In the transport source, the electrolytic solution is brought into contact with the electronic component so that the electronic component is held on the pickup surface by the electrolytic solution having a wide wet area, and the wet area is narrowed in the transport destination. Bringing the electrolytic solution into contact with the transport destination so that the electronic component is separated from the pickup surface together with the electrolyte and moves to the transport destination;
The electronic component carrying device according to claim 21. The voltage supply unit has electrodes for voltage application on the surface of the insulating layer, and the electrodes have a plurality of linear electrode units arranged radially,
And the said voltage supply part supplies a voltage separately to the said linear electrode part according to the direction of the said electronic component desired at the time of electronic component holding | maintenance,
The electronic component carrying device according to claim 21. An electronic component conveying device according to claim 21,
A stage mover that moves relative to the electronic component transfer device, the wiring board that is provided at the transfer destination and on which the electronic component is mounted;
An electronic component mounting apparatus comprising:

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