JP2007227261A - Compact self-ballasted fluorescent lamp and lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact self-ballasted fluorescent lamp capable of improving reliability by suppressing temperature rise of a circuit element of a lighting device; and to provide a lighting system. <P>SOLUTION: This compact self-ballasted fluorescent lamp is provided with: a cover 13 having a base 12; an arc tube 14 with a pair of electrodes 36, 36 attached to the cover sealed therein; and a lighting device 17 housed in the cover and having a double-sided board 58 on which a low-heat-resistance electronic component 60ba relatively low in heat resistance and temperature margin is mounted on a surface on the side where it is separated from the pair of electrodes 36, 36 of the arc tube as compared with the other circuit elements. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a bulb-type fluorescent lamp and an illumination device including the bulb-type fluorescent lamp.

  Conventionally, as this type of bulb-type fluorescent lamp and lighting device, an arc tube having a bent bulb, a cover with a base attached at one end and a fluorescent lamp supported at the other end, a lighting device accommodated in the cover, And a glove or the like that covers the arc tube and is attached to the other end of the cover (see, for example, Patent Documents 1, 2, and 3).

In recent years, such a bulb-type fluorescent lamp has been miniaturized to a size close to that of a general lighting bulb defined in JIS, and a lighting device housed in a cover has also been miniaturized.
Japanese Patent Laid-Open No. 2002-8403 JP-A-2005-340100 Japanese Utility Model Publication No. 2-29106

  However, in such a conventional bulb-type fluorescent lamp, since the circuit board disposed in a narrow space in the small cover is a single-sided mounting board on which a plurality of circuit elements are mounted on one side, the circuit board can be downsized. Is not easy. In addition, there is a problem that the heat dissipating property of the heat generated by the circuit elements is lowered due to an increase in mounting density of the circuit elements.

  Further, in recent years, the circuit element itself has been downsized. For example, when the rated lamp power of the arc tube is 60 W, two switching elements included in the inverter circuit that drives the arc tube are combined into one package. A chip component (surface mount component) having a size of SOP 8 or less accommodated therein has been proposed.

  However, such a circuit element has a new problem that the reliability of the circuit element and thus the lighting device is lowered because the heat capacity is reduced due to the reduction of the surface area accompanying the downsizing of the package, and the temperature rises easily. To do.

  The present invention has been made in view of such circumstances, and provides a bulb-type fluorescent lamp and an illuminating device that can improve the heat dissipation of the circuit elements of the lighting device, suppress the temperature rise, and improve the reliability. The purpose is to do.

  The bulb-type fluorescent lamp according to claim 1 is a cover having a base; an arc tube in which a pair of electrodes attached to the cover is sealed; and housed in the cover, and having relatively low heat resistance or temperature tolerance. And a lighting device having a double-sided board mounted on a surface farther from the pair of electrodes of the arc tube than the other circuit elements.

  The bulb-type fluorescent lamp according to claim 2 is characterized in that at least a part of the double-sided substrate is accommodated in the base.

  The bulb-type fluorescent lamp according to claim 3, wherein the circuit element having a relatively low heat resistance or temperature tolerance is a main package housing a plurality of switching elements included in an inverter circuit for driving the arc tube. It is a switching element.

  5. The light bulb shaped fluorescent lamp according to claim 4, wherein a double-sided board on which a circuit element having a relatively low heat resistance or temperature tolerance is mounted and a plurality of boards on which other circuit elements are mounted are connected to a base of the base. It is characterized by being juxtaposed along the direction.

  According to a fifth aspect of the present invention, there is provided an illuminating device comprising: the light bulb shaped fluorescent lamp according to any one of the first to fourth aspects; and an instrument body to which the light bulb shaped fluorescent lamp is attached.

  According to the light bulb-type fluorescent lamp according to claim 1, among the circuit elements of the lighting device, the circuit element having a relatively low heat resistance or temperature tolerance is selected from the circuit elements having a relatively high heat resistance or temperature tolerance. However, since it is mounted on the double-sided board on the side far from the electrode of the arc tube, which is the main heat source, circuit elements with relatively low heat resistance or temperature tolerance are heated by the electrode because of the distance from this electrode. Can be suppressed. For this reason, the reliability of these circuit elements and thus the lighting device can be improved. Moreover, since the circuit board of the lighting device is a double-sided board, circuit elements can be mounted on both sides. For this reason, since the mounting density of circuit elements can be reduced as compared with a single-sided substrate, the temperature rise of these circuit elements can be further suppressed.

  According to the light bulb shaped fluorescent lamp according to the second aspect, by extending at least a part of the double-sided substrate into the base, the double-sided substrate is easily radiated through the base. For this reason, even if the packaging density of circuit elements is increased, the temperature rise of the circuit elements can be suppressed.

  According to the light bulb-type fluorescent lamp according to claim 3, since the circuit element having relatively low heat resistance or temperature tolerance is the main switching element, the temperature rise of these main switching elements is suppressed, and the reliability is improved. be able to.

  According to the light bulb shaped fluorescent lamp according to claim 4, the double-sided board on which the circuit element having low heat resistance or low temperature tolerance is mounted and the board on which the other circuit element is mounted are arranged in the axial direction of the base. Since these substrates are separated by being arranged in parallel, the amount of heat conducted from one circuit board to the other circuit board can be suppressed.

  For this reason, the temperature rise of the circuit element with low heat resistance or low temperature tolerance can be further suppressed, and the reliability can be improved.

  According to the illuminating device according to claim 5, since the light bulb shaped fluorescent lamp according to any one of claims 1 to 4 is provided, it is possible to provide an illuminating device having the effect of these light bulb shaped fluorescent lamps. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 to FIG. 9 show a first embodiment. FIG. 1 is a longitudinal sectional view as seen from the direction in which bulbs are arranged in a bulb-type fluorescent lamp. FIG. FIG. 3 is a cross-sectional view seen from the base side with the cover and globe of the light bulb shaped fluorescent lamp removed, FIG. 4 is a perspective view of the holder of the light bulb shaped fluorescent lamp, and FIG. FIG. 6 is a circuit diagram of a lighting device for a bulb-type fluorescent lamp. FIG. 6 is a perspective view of the inside of the holder combined with the arc tube of the fluorescent lamp.

  As shown in FIGS. 1 and 2, a bulb-type fluorescent lamp 11 includes a cover 13 having a base 12 at one end in the height direction (tube axis direction), an arc tube 14 supported at the other end of the cover 13, The holder 15 attached to the cover 13 while supporting one end side of the arc tube 14, the globe 16, the base 12 and the cover 13 attached to the cover 13 covering the arc tube 14 and covering the periphery of the holder 15 on one end side. A lighting device 17 housed inside is provided. And it is formed in the external appearance close | similar to the light bulbs for general illumination, such as a 40W type, 60W type, and 100W type incandescent lamp. This general lighting bulb is defined in JIS C 7501.

  The base 12 is an Edison type E26 type, and includes a cylindrical shell 21 having a thread and an eyelet 23 provided on the top of one end side of the shell 21 via an insulating portion 22. The other end of the shell 21 is placed on one end of the cover 13 and fixed by an adhesive or caulking.

  The cover 13 is formed of a heat-resistant synthetic resin such as polybutylene terephthalate (PBT), for example. A cylindrical base mounting portion 26 to which the shell 21 of the base 12 is attached is formed on one end side, and the other end side is formed. An expanded annular cover portion 27 is formed, and a holder attaching portion 28 for attaching the holder 15 is formed inside.

  The arc tube 14 has at least three U-shaped bent valves 31, 32, 33, and these valves 31, 32, 33 are sequentially connected by a communication pipe 34 to form one continuous discharge path 35. Is formed. Each communication pipe 34 is formed by joining the openings formed by blowing and breaking the vicinity of the end where the valves 31, 32, and 33 are connected, and then blowing them.

  The bulbs 31, 32, and 33 are formed in a substantially U shape in which a tube section having a substantially cylindrical shape made of glass having a tube outer diameter of 3 to 8 mm is curved at the middle portion and has a top portion. That is, each of the valves 31, 32, and 33 includes a bent portion that is curved and a pair of straight pipe portions that are continuous with the bent portion and are parallel to each other.

  As shown in FIG. 2, the height of the valve 32 at the center of the parallel arrangement direction of the valves 31 to 33 is higher than the height of the valves 31 and 33 on both sides. The valves 31, 32, and 33 are juxtaposed so that their U-shaped surfaces face each other in parallel.

  For example, a three-wavelength phosphor is formed on the inner surface of the arc tube 14, and the arc tube 14 is filled with a noble gas such as argon (Ar) or krypton (Kr), or a gas containing mercury. .

  A pair of electrodes 36 are sealed by stem seals or pinch seals at one end portions of the bulbs 31 and 33 located on both ends of the discharge path 35. Each electrode 36 has a filament coil, and this filament coil is supported by a pair of linear wells. Each well is, for example, a pair of wires 37 that are led out from one end of the bulbs 31 and 33 on both sides via a jumet wire sealed to one end of the bulbs 31 and 33 on both sides and connected to the lighting device 17. (See FIG. 5).

  Cylindrical narrow tubes 38, which are also called exhaust pipes, are connected to each end portion where the electrodes 36 of the valves 31 and 33 on both sides are sealed, and to both end portions of the central valve 32 by a stem seal or pinch seal. Projected. These thin tubes 38 are sequentially sealed by fusing in the manufacturing process of the light emitting tube 14, and the inside of the light emitting tube 14 is exhausted through a part of each thin tube 38 that is not sealed, and a sealed gas is sealed. After being replaced, the capillaries 38 are sealed by fusing unsealed portions of the capillaries 38.

  Of the narrow tubes 38 at both ends of the central valve 32, one narrow tube 38 is formed in a long shape so that the tip portion extends to the inside of the base 12 and is in a straight line shape parallel to the straight tube portion of the valve 32. The main amalgam 39 as an amalgam is enclosed at the tip portion when sealing. The main amalgam 39 is an alloy composed of bismuth, tin and mercury, is formed in a substantially spherical shape, and has an action of controlling the mercury vapor pressure in the arc tube 14 within an appropriate range. In addition, as the main amalgam 39, you may use what was formed with the alloy which combined indium, lead, etc. other than bismuth and tin. Further, auxiliary amalgam having mercury adsorption / release action is attached and sealed in the wells of the electrodes 36 of the bulbs 31 and 33 at both ends. Further, an auxiliary amalgam similar to the auxiliary amalgam provided in the valves 31 and 33 at both ends is enclosed at the other end of the central valve 32.

  In the arc tube 14, a pair of electrode side end portions 40 in which a pair of electrodes 36 of the bulbs 31, 32, and 33 are sealed are located on one end side in the height direction. The bulbs 31, 32, and 33 have a tube outer diameter of 3 to 8 mm and a maximum width b1 in the width direction intersecting the height direction of 30 mm or less.

  Further, as shown in FIGS. 1 to 5, the holder 15 is formed of a heat-resistant synthetic resin material such as polybutylene terephthalate (PBT), for example, and has a disk-like substrate portion 42 and a peripheral portion of the substrate portion 42. A cylindrical tube portion 43 protruding from one end to the one end side is provided.

  A protrusion 44 that can be inserted between the bulbs 31, 32, and 33 of the arc tube 14 is formed at the center of the substrate portion 42. Arc-shaped depressions 45 are formed as bulb mounting parts that are fitted to the end faces of the arc tube 14 and the peripheral surface part facing the center side of the arc tube 14, and these depressions 45 are formed inside the holder 15. A mounting hole 46 that communicates is formed.

  The substrate portion 42 is formed with respective insertion holes 47 facing the end faces of the valves 31, 32, 33, and the wires 37 projecting from the end portions of the valves 31, 32, 33 and the respective wires 37 and The thin tube 38 is inserted. The diameter of the insertion hole 47 is smaller than the diameter of the valves 31, 32, 33, and the end portions of the valves 31, 32, 33 do not enter the insertion hole 47.

  Then, after the arc tube 14 is combined with the holder 15, by injecting an adhesive such as silicone resin or epoxy resin from the inside of the holder 15 through the mounting holes 46 and the insertion holes 47, the bulbs 31, 32, The inner peripheral surface side facing the center side of the arc tube 14 and the end surfaces of the bulbs 31, 32, 33 are bonded and fixed to the holder 15.

  A claw portion 48 attached to the holder attachment portion 28 of the cover 13 is formed at one end portion of the cylindrical portion 43. A pair of substrate mounting portions 50 having a pair of substrate mounting grooves 49 facing each other at positions offset from the center line of the holder 15 are formed inside the cylindrical portion 43. The substrate mounting groove 49 is formed in parallel with the center line of the holder 15 and is formed to be open on one end side of the cylindrical portion 43. In addition, a pair of notches 51 are formed in the cylinder portion 43 on the opposite side to the side where the pair of substrate mounting portions 50 are formed offset.

  The globe 16 is formed of a material such as transparent or light diffusing glass or synthetic resin into a smooth curved surface that is close to the shape of a glass bulb of a general lighting bulb such as an incandescent bulb. An opening 54 is formed at one end of the globe 16, and an edge 55 of the opening 54 is fitted inside the cover portion 27 of the cover 13 and bonded and fixed by an adhesive such as silicone resin or epoxy resin. Yes.

  In addition, the lighting device 17 includes a double-sided board 58 having solder layers formed on both front and back surfaces, and a plurality of electronic components 60 of circuit elements constituting the lighting circuit 59 are mounted on the double-sided board 58. The double-sided substrate 58 is formed in a rectangular shape having a width dimension that can be inserted inside the base 12 and having a height that is long relative to the width dimension. It is inserted into and engaged with the substrate mounting groove 49 and is arranged vertically (vertically) along the direction of the central axis of the holder 15, and is arranged at a position offset with respect to the center line of the holder 15. That is, in a state in which the base 12, the cover 13, and the holder 15 are combined, the double-sided substrate 58 is arranged vertically along the direction of the center line of the base 12 with respect to the inside of the base 12, and It is arranged at a position offset with respect to the center line. The position of the double-sided substrate 58 in the direction intersecting the height direction is temporarily fixed by the substrate mounting portion 50 of the holder 15, and the connection between the wire 37 of the arc tube 14 and the wrapping pin 61, or between the base 12 and the holder 15. The position in the height direction is positioned and held by sandwiching between them.

  The electronic component 60 is mounted as a circuit element on both sides of the double-sided substrate 58, but a ballast as a current-limiting inductor of the electronic component 60 is provided on one surface 58 a of the space side where the distance from the base 12 of the double-sided substrate 58 is wide. A lead component 60a having a large outer dimension such as a transformer CT such as a choke, a capacitor C1, and an electrolytic capacitor C2 as a smoothing capacitor is mounted.

  Further, the other surface 58b on the side of the space where the distance between the double-sided substrate 58 and the base 12 is narrow is located on the side farther from the pair of electrodes 36 of the arc tube 14 than the back surface 58a. A surface mounting type (chip) component 60b such as a transistor 60 having a low height, a chip type capacitor or a rectifying element is mounted.

  And as this surface mounting type electronic component 60b, heat resistance or temperature tolerance is relatively lower than low heat resistance electronic component 60ba having relatively low heat resistance or relatively low temperature tolerance. The high heat resistant electronic component 60bb is mounted on the end of the double-sided substrate 58 on the base 12 side of the other surface 58b of the double-sided substrate 58.

  In other words, the other surface 58b of the double-sided substrate 58 is the back surface of the one surface 58a that is thermally closer to the pair of electrodes 36, 36 that are the heat source of the arc tube 14, and the pair of electrodes 36, The ratio facing 36 is small, and the distance affected by the heat is far away. That is, the double-sided substrate 58 is arranged such that the edge portion thereof faces each end face of the bulbs 31, 32, and 33 of the arc tube 14. In the boundary region partitioned by the edge portion of the double-sided substrate 58, the electrode 36 is arranged. , 36 is the substrate surface on the side close to the electrodes 36, 36, which faces the region where many end surfaces of the bulb end portion are arranged. In the case of the present embodiment, as shown in FIG. 3, the double-sided substrate 58 is partitioned so as to bisect substantially the middle part of the one electrode 36. The valve end surface sealed with about 1.5 is about 0.5 and the region on the other surface 58b side is about 0.5. Therefore, the other surface 58b is a surface far from the electrode 36. Also, on the other surface 58b side of the double-sided substrate 58, the end portion on the base 12 side is located farther from the pair of electrodes 36 than the holder 15 side on the opposite side. Accordingly, the low heat resistant electronic component 60ba is mounted at a position where it is most difficult to be heated from the pair of electrodes 8.

  As this low heat resistant electronic component 60ba, for example, there is an electronic component 60b of SOP8 size or less. This includes one MOS-type N-channel field effect transistor Q1 and one MOS-type P-channel field effect transistor Q2 used as the main switching (SW) element of the inverter circuit of the lighting circuit 17 shown in FIG. And is formed in a surface mount semiconductor electronic component 60b having a size of SOP8 or less.

  Another low heat resistant electronic component 60ba includes a surface mount type chip capacitor, etc., and these heat resistant temperatures are, for example, when the rated lamp power of the arc tube 14 is 60 W, the chip capacitor is 125 ° C. or lower, the semiconductor The electronic component 60b is 150 ° C. or lower.

  The smoothing electrolytic capacitor C <b> 2 is mounted in the widthwise central region of one surface of the double-sided substrate 58 in a direction perpendicular to the double-sided substrate 58. Thereby, the mounting efficiency of the double-sided substrate 58 is improved, and the double-sided substrate 58 can be downsized. The surface-mounted component 60bb having relatively high heat resistance is surface-mounted on one surface 58a of the double-sided substrate 58.

  For example, the capacitor C <b> 1 is inclined toward the width direction center portion side of the double-sided substrate 58 as the electronic component 60 positioned on the side in the widthwise direction of the double-sided substrate 58 approaching the base 12. As a result, the capacitor C1 can be inserted without hitting the inside of the base 12, and the lighting device 17 can be efficiently stored inside the base 12. The electronic component 60 to be inclined, such as the capacitor C1, is a discrete component and is a radial component that is mounted on the double-sided substrate 58 with two lead wires.

  On the double-sided substrate 58, four wrapping pins 61 projecting from and connected to the other end side, which is the arc tube 14 side, are a pair of wires of the electrodes 36 of the arc tube 14.

  A thin tube 38 enclosing the main amalgam 39 is disposed between the side surface of the double-sided substrate 58 that is close to the base 12 and having a small distance. Thereby, the lighting device 17 and the thin tube 38 are efficiently arranged inside the base 12.

  The offset amount of the double-sided substrate 58 with respect to the central axis of the base 12 is preferably in a range up to a position that is 3/4 of the inner diameter of the base 12. When the offset amount is closer to the inner surface side of the base 12 than the position of 3/4, the width of the double-sided board 58 is narrowed, the mounting area of the double-sided board 58 is reduced, and the mounting efficiency of the electronic component 60 is reduced. This is not preferable.

  Further, a heat conductive member such as a heat conductive silicone resin is injected inside the base 12, and at least the electronic component 60 such as a transformer CT having a large calorific value and the base 12 side are thermally transferred by this heat conductive member. It is connected to the. The heat conductive member may be filled so that the entire inner side of the base 12 covers the double-sided substrate 58 and the electronic component 60 of the lighting device 17.

  FIG. 6 shows a circuit diagram of the lighting device 17. A capacitor C1 constituting a filter is connected to the commercial AC power source e via a fuse F1, and an input terminal of a full-wave rectifier 71 is connected to the capacitor C1 via an inductor L1 constituting the filter. A smoothing electrolytic capacitor C2 is connected to the output terminal of the full-wave rectifier 71 to form an input power supply circuit E. The smoothing electrolytic capacitor C2 of the input power supply circuit E has an AC power supply that generates a high frequency. The inverter main circuit 73 of the half bridge type inverter circuit 72 is connected.

  The inverter main circuit 73 includes a field effect transistor Q1 as a MOS type N-channel transistor that is complementary to each other as switching elements and a MOS type P-channel transistor in parallel with the smoothing electrolytic capacitor C2. A field effect transistor Q2 as a transistor is connected in series. The sources of the N-channel field effect transistor Q1 and the P-channel field effect transistor Q2 are connected to each other.

  A series circuit of a primary winding L2 of a transformer CT constituting a ballast choke as a resonant inductor, a DC cut capacitor C3, and a resonant capacitor C4 is connected between the drain and source of the field effect transistor Q2, and this resonant capacitor C4 Are connected to one ends of electrode filament coils FLa and FLb as filaments at both ends of a fluorescent lamp FL as the arc tube 14, and between the other end of one electrode filament coil FLa and the other electrode filament coil FLb. A starting capacitor C5 that contributes to resonance is connected to the resonance capacitor C4. The electrode filament coils FLa and FLb are coated with an emitter. In addition, a positive temperature characteristic resistor PTC1 is connected in parallel to the resonance capacitor C4.

  A starting resistor R1 constituting the starting circuit 75 is connected between the smoothing electrolytic capacitor C2, the gate of the field effect transistor Q1, and the gate of the field effect transistor Q2. A series circuit of a capacitor C6 and a capacitor C7 is connected between the gate of the field effect transistor Q1 and the gate of the field effect transistor Q2 and the source of the field effect transistor Q1 and the field effect transistor Q2.

  A series circuit of a Zener diode ZD1 and a Zener diode ZD2 for protecting the gates of the field effect transistor Q1 and the field effect transistor Q2 is provided in parallel to the series circuit of the capacitor C6 and the capacitor C7 of the gate control circuit 76 as a gate control means. It is connected.

  In addition, a secondary winding L3 is magnetically coupled to the primary winding L2 of the transformer CT, and one end of the secondary winding L3 is connected to the connection point between the capacitor C6 and the capacitor C7. Is connected to the connection point between the other end of the capacitor and the discharging resistor R2. The capacitor C6 also constitutes a trigger element of the starting circuit 75, and the discharging resistor R2 of the starting circuit 75 is connected in parallel to the series circuit of the capacitor C6 and the inductor L4.

  Further, a parallel circuit of a resistor R3 of the starting circuit 75 and a capacitor C8 for improving switching is connected between the drain and source of the field effect transistor Q2.

  Moreover, negative temperature characteristic resistance elements (Negative Temperature Coefficients) NTC1, NTC2 are connected between one end and the other end of each of the electrode filament coils FLa, FLb of the fluorescent lamp FL.

  The positive temperature characteristic resistance element PTC1 and the negative temperature characteristic resistance elements NTC1, NTC2 and the like may be wound around the wrapping pin 61 of the double-sided substrate 58 and connected so as to be close to the arc tube 14.

  Next, the operation of the lighting device 17 will be described.

  First, when the power is turned on, the voltage of the commercial AC power source e is full-wave rectified by the full-wave rectifier 71 and smoothed by the smoothing electrolytic capacitor C2.

  Further, a voltage is applied to the gate of the N-channel field effect transistor Q1 through the resistor R1, and the field effect transistor Q1 is turned on. When the field effect transistor Q1 is turned on, a voltage is applied to the closed circuit of the primary winding L2, the capacitor C3, the resonant capacitor C4, and the capacitor C5 of the transformer CT, and the primary winding L2, the capacitor C3, the resonant capacitor C4, and the capacitor C5 of the transformer CT. Resonates. At this time, the impedance component of the positive temperature characteristic resistance element PTC1 is also included as part of the resonance synthesis component.

  In addition, a voltage corresponding to the resonance waveform of the inductance component of the primary winding L2 of the transformer CT is induced in the secondary winding L3 of the transformer CT, and the LC series circuit of the capacitor C7 and the inductor L4 of the gate control circuit 76 is inherently resonant. Thus, a voltage for turning on the field effect transistor Q1 and turning off the field effect transistor Q2 at a substantially constant frequency is generated.

  Next, when the resonant voltage of the primary winding L2, transformer C3, resonant capacitor C4, and capacitor C5 of the transformer CT is inverted, a voltage opposite to the previous voltage is generated in the secondary winding L3, and the gate control circuit 76 uses the field effect transistor Q1. Is turned off, and a voltage for turning on the field effect transistor Q2 is generated.

  Further, when the resonant voltage of the primary winding L2, transformer C3, resonant capacitor C4, and capacitor C5 of the transformer CT is inverted, the field effect transistor Q1 is turned on and the field effect transistor Q2 is turned off. Thereafter, similarly, the field effect transistor Q1 and the field effect transistor Q2 are alternately turned on and off, a resonance voltage is generated, and a resonance current flows.

  In a state where this resonance current has flowed out, the positive temperature characteristic resistance element PTC1 has a low temperature and thus has a resistance value as low as, for example, about 3 kΩ to 5 kΩ, and a large current flows through the positive temperature characteristic resistance element PTC1. At this time, the resonance voltage generated between both ends of the resonance capacitor C4 becomes low.

  When current flows through the positive temperature characteristic resistance element PTC1, Joule heat is generated, and when the resistance value of the positive temperature characteristic resistance element PTC1 increases and the current flowing through the positive temperature characteristic resistance element PTC1 decreases, the resonance composite component changes. Therefore, the resonance operation changes so that the current flowing through the resonance capacitor C4 increases, and the soft start operation is performed so that the resonance voltage gradually increases.

  A part of the resonance current also flows through the capacitor C5, which is a part of the resonance capacitor, via the electrode filament coils FLa and FLb of the fluorescent lamp FL. Therefore, the electrode filament coils FLa and FLb are sufficient until the resonance voltage rises. It is preheated directly over a long time.

  Further, by providing the resonance capacitor C5 separately from the resonance capacitor C4, the resonance capacitance is divided, and the capacitance of the capacitor C5 is preheated to the electrode filament coils FLa and FLb and the fluorescent lamp FL is turned on. It is possible to make the current flowing occasionally appropriate, and the electrode filament coils FLa and FLb can be preheated efficiently, and the current flowing to the capacitor C5 can be reduced after the fluorescent lamp FL is turned on. Can also be prevented.

  Further, the resistance value of the positive temperature characteristic resistance element PTC1 increases, the resonance current increases due to the change of the resonance component, the primary winding L2 of the transformer CT constituting the ballast choke is saturated, and the voltage required for starting the lamp is reached. When the voltage rises, the fluorescent lamp FL starts discharging, starts and lights up.

  After the fluorescent lamp FL is lit, the resonance voltage decreases because the resistance value of the positive temperature characteristic resistance element PTC1 is about several tens of kΩ and the equivalent resistance value of the fluorescent lamp FL is sufficiently smaller than the resistance value of the positive temperature characteristic resistance element PTC1. Thus, the fluorescent lamp FL is kept on. In addition, by connecting the positive temperature characteristic resistance element PTC1 in parallel to the resonant capacitor C4 instead of the capacitor C5 as described above, the current flowing through the electrode filament coils FLa and FLb can be reduced. Can be suppressed.

  As described above, since the preheating of the electrode filament coils FLa and FLb of the fluorescent lamp FL can be made appropriate by the change in the resistance value of the positive temperature characteristic resistance element PTC1, it is possible to prevent the emitter from scattering (sputtering) undesirably. The number of flashing lifetimes of the fluorescent lamp FL can be improved.

  In addition, when the temperature of the negative temperature characteristic resistance elements NTC1 and NTC2 is low before the fluorescent lamp FL is started, the resistance values of the negative temperature characteristic resistance elements NTC1 and NTC2 are high. Flows through the electrode filament coils FLa and FLb, and preheats the electrode filament coils FLa and FLb appropriately.

  Further, as the resonance current increases, the negative temperature characteristic resistance elements NTC1 and NTC2 generate heat due to Joule heat due to a part of the resonance current that has also flowed in the negative temperature characteristic resistance elements NTC1 and NTC2, and further from the fluorescent lamp FL. The temperature rises under the influence of the heat and the resistance values of the negative temperature characteristic resistance elements NTC1, NTC2 fall. As a result, the current flowing through the electrode filament coils FLa and FLb gradually flows into the negative temperature characteristic resistance elements NTC1 and NTC2.

  Further, when the temperature of the negative temperature characteristic resistance elements NTC1 and NTC2 rises after the fluorescent lamp FL is turned on and the resistance value decreases as much as possible, most of the resonance current flows to the negative temperature characteristic resistance elements NTC1 and NTC2, and the electrode filament Since the coils FLa and FLb hardly flow, the power loss due to the electrode filament coils FLa and FLb can be reduced as much as possible.

  The double-sided substrate 58 includes an input power supply circuit E connected to the base 12 and an inverter circuit 72 connected to the input power supply circuit E from one end side on the base 12 side to the other end side on the arc tube 14 side. The output part of the inverter circuit 72 connected to the arc tube 14 is formed in order. Thereby, the wiring pattern formed on the double-sided substrate 58 is arranged in order in one direction from the input side to the output side, and the double-sided substrate 58 can be miniaturized.

  Next, in order to assemble the bulb-type fluorescent lamp 11, one end side of the arc tube 14 and the holder 15 are combined, and an adhesive is injected from the inside of the holder 15 through the mounting holes 46 and the insertion holes 47. One end side and the holder 15 are bonded and fixed. Subsequently, both side edges of the double-sided substrate 58 are inserted into the pair of substrate mounting grooves 49 of the holder 15, the double-sided substrate 58 is inserted inside the holder 15, and each of the arc tubes 14 drawn out inside the holder 15. The wire 37 is wound around and connected to each wrapping pin 61 of the double-sided substrate 58 (illustration of this wound state is omitted). Subsequently, the holder 15 and the cover 13 are combined and combined. Subsequently, an unillustrated electric wire connected in advance from the input part side of the double-sided substrate 58 is connected to the shell 21 and the eyelet 23 of the base 12, and the base 12 is fitted into the cover 13 and fixed by caulking or bonding. Subsequently, by injecting a heat conductive member into the base 12 through the notch 51 of the holder 15 with the base 12 facing down and the arc tube 14 facing upward, at least the notch 51 side of the holder 15 A heat conductive member is filled between the electronic component 60 such as a transformer CT located opposite to the base 12 and the cover 13 side, or the entire inside of the base 12 is filled with a heat conductive member. Subsequently, the luminous bulb 14 is covered with a globe 16 and the globe 16 is fixed to the cover 13 with an adhesive.

  As shown in FIG. 7, for example, a lighting device 81 that is a downlight has a lighting fixture body 82, and a socket 83 and a reflector 84 are attached to the lighting fixture body 82. A fluorescent lamp 11 is mounted.

  In the bulb-type fluorescent lamp 11, the double-sided substrate 58 formed in a width dimension that can be inserted inside the base 12 is arranged vertically along the direction of the center line of the base 12 and is also relative to the center line of the base 12. Since the large electronic component 60 of the electronic components 60 can be arranged on one surface having a large distance from the base 12 of the double-sided substrate 58, the lighting device 17 is efficiently installed inside the base 12. The cover 13 can be stored well, whereby the cover 13 can be miniaturized.

  Since the electronic component 60 positioned on the side in the width direction of the double-sided substrate 58 approaching the base 12 is inclined toward the center in the width direction of the double-sided substrate 58, the electronic component 60 hits the inside of the base 12. The lighting device 17 can be efficiently stored inside the base 12.

  The smoothing electrolytic capacitor C2 having a relatively high height among the electronic components 60 to be mounted on the double-sided board 58 can be mounted in the widthwise central region of one side of the double-sided board 58 in a direction perpendicular to the double-sided board 58. The mounting efficiency of the double-sided substrate 58 is improved, and the double-sided substrate 58 can be miniaturized.

  Since the output part of the input power circuit E, the inverter circuit 72, and the inverter circuit 72 is formed in this order from one end side of the double-sided substrate 58 on the base 12 side to the other end side of the double-sided substrate 58 on the arc tube 14 side, the double-sided substrate The wiring pattern formed in 58 can be arranged in order in one direction from the input side to the output side, and the double-sided substrate 58 can be miniaturized.

  The main amalgam 39 of the narrow tube 38 of the arc tube 14 is enclosed by arranging the double-sided substrate 58 formed in a width dimension that can be inserted inside the base 12 in a vertical shape along the direction of the center line of the base 12. The tip portion can be arranged between the base plate 12 and the double-sided substrate 58 inside the base 12, and the lighting device 17 and the thin tube 38 are provided inside the base 12 while reducing the thermal influence from the arc tube 14 during lighting on the main amalgam 39. Can be arranged efficiently, whereby the cover 13 can be miniaturized.

  Since the double-sided substrate 58 is disposed at a position offset with respect to the center line of the base 12 and the thin tube 38 is disposed between the side of the double-sided substrate 58 and the base 12 having a small distance from the base 12, The large electronic component 60 can be disposed on the side of the surface where the interval is wide, and the lighting device 17 and the thin tube 38 can be efficiently disposed inside the base 12.

  The double-sided substrate 58 is a back surface (other surface) 58 b on the opposite side of the electrode 36 that is the heat source of the arc tube 14, and at the end on the base 12 side that is opposite to the electrode 36 in the tube axis direction. Since the low heat resistant electronic component 60ba having low heat resistance or low heat margin is mounted and the distance between the electrode 36 and the low heat resistant electronic component 60ba is increased, even in the narrow holder 15 and the base 12 It is possible to prevent the low heat resistant electronic component 60ba from being heated by the electrode 36 and rising in temperature. For this reason, the reliability of the low heat resistant electronic component 60ba can be improved, and as a result, the reliability of the lighting device 17 can be improved.

  Furthermore, since the circuit board of the lighting device 17 is the double-sided board 58, the electronic component 60 can be mounted on both sides thereof. For this reason, since the packaging density of circuit elements can be reduced, the temperature rise of these circuit elements can be further suppressed. Further, since at least a part of the double-sided substrate 58 extends into the base 12, the double-sided substrate 58 can be increased in size accordingly. For this reason, since the mounting density of the circuit elements can be further reduced, the temperature rise of the circuit elements can be further suppressed.

  In addition, a heat conductive member is injected inside the base 12, and the electronic component 60 such as a transformer CT having a large calorific value is thermally connected to the base 12 side by this heat conductive member. Heat can be dissipated efficiently.

  As shown in FIG. 1, the bulb-type fluorescent lamp 11 having such a configuration has a tube outer diameter of 3 to 8 mm, preferably 6 to 7 mm, in the width direction of the arc tube 14 having bulbs 31, 32 and 33. The maximum width b1 is 30 mm or less, for example, 20 to 35 mm, the ratio of the dimension h2 of the cover 13 exposed from the base 12 to the lamp length h1 excluding the base 12 is 0 to 25%, and the maximum outside of the cover 13 The diameter b2 is 1.0 to 1.5 times the outer diameter dimension b3 of the base 12 or 0.48 to 0.73 times the maximum outer diameter b4 of the globe 16, and the outer diameter dimension (b2 The same) can be formed to 40 mm or less, for example, 30 to 35 mm.

  Thereby, substantially the same external appearance as a general lighting bulb such as an incandescent bulb can be obtained. For example, in the case of the present embodiment, the overall height including the base 12 is 105 to 115 mm, which is equivalent to the 60 W type incandescent bulb size. If the tube outer diameter of the bulbs 31, 32, 33 is smaller than 3 mm, the starting voltage is increased and the luminous efficiency is lowered, and the bulbs 31, 32, 33 are difficult to manufacture. It becomes difficult to reduce the maximum outer diameter of the cover 13.

  If the maximum width of the arc tube 14 is larger than 30 mm, it is difficult to reduce the maximum outer diameter of the cover 13. The lamp length dimension h1 excluding the base 12 is 80 to 90 mm, and the ratio of the dimension h2 of the cover 13 exposed from the base 12 to the dimension h1 is 0%. In this case, the edge 55 of the opening 54 of the glove 16 is fitted to the shell 21 of the base 12, and if it is larger than 25%, Appearance close to that of a lighting bulb and light distribution characteristics are difficult to obtain.

  In the case of the present embodiment, h2 is 6 to 11 mm, and optimally about 8 mm, and the holding of the globe 16 and the mechanical strength are ensured. If the maximum outer diameter b2 of the cover 13 is smaller than 1.0 times the outer diameter dimension b3 of the base 12 or 0.48 times the maximum outer diameter b4 of the globe 16, the support or lighting device on the one end side of the arc tube 14 is used. 17 is difficult to store, and on the other hand, if it is larger than 1.5 times the outer diameter of the base 12 or 0.73 times the maximum outer diameter of the globe 16, the appearance and light distribution characteristics close to those of a general lighting bulb can be obtained. It becomes difficult to be. The maximum outer diameter b4 of the globe 16 is 50 to 60 mm, optimally about 55 mm, and the outer diameter b3 of the base 12 is 26 to 28 mm.

  Further, the maximum outer diameter b5 of the holder 15 is formed at a ratio of 70 to 90% of the inner diameter dimension b6 in the portion of the globe 16 facing the end 15a on the other end side of the holder 15 that supports the arc tube 14. preferable. For example, when the outer diameter of the portion of the globe 16 facing the end 15a on the other end side of the holder 15 is about 38 to 42 mm and the inner diameter b6 is about 36 to 40 mm minus the thickness, the holder 15 If the maximum outer diameter b5 is about 30 to 35 mm, a gap of about 2.5 to 3 mm is formed between the periphery of the holder 15 and the inner surface of the globe 16.

  Due to this gap, the light from the arc tube 14 can easily reach the portion of the globe 16 facing the periphery of the holder 15, and the portion of the globe 16 can be prevented from shining and becoming a dark portion. If the ratio is less than 70%, it is difficult to manufacture when the holder 15 is thinned, and when the globe 16 is widened, it is difficult to obtain an appearance similar to a general lighting bulb, while 90% If it is larger, the gap becomes smaller, and it is difficult for light from the arc tube 14 to reach the part of the globe 16 facing the periphery of the holder 15, and the part of the globe 16 becomes a dark part and becomes conspicuous. The shape of the portion of the globe 16 that faces the periphery of the holder 15 is preferably a substantially cylindrical shape whose outer diameter does not change, but it is slightly larger in diameter toward the top in order to increase the gap. You may make the shape of a bowl-shaped rotary body which changes.

  Further, the bulb-type fluorescent lamp 11 has an adhesive on the inner peripheral surface side of one end side of the bulbs 31, 32, 33 in the recess 45 of the holder 15 facing the bulbs 31, 32, 33 from the center side of the arc tube 14. Since the outer peripheral surface side at one end side of the bulbs 31, 32, 33 is not blocked by the holder 15, light emitted from the outer peripheral surface side at one end side of the bulbs 31, 32, 33 can be used, and light emission Efficiency can be improved.

  FIG. 8 is a schematic bottom view of a main part of a bulb-type fluorescent lamp 11A according to the second embodiment of the present invention. 8 emphasizes the point that the surface mount type high heat resistance electronic component 60bb is mounted on one surface 58a of the double-sided substrate 58 and the surface mount type low heat resistance electronic component 60ba is mounted on the other surface. The number and mounting of the lead parts 60a are not shown. In this bulb-shaped fluorescent lamp 11A, three U-shaped bent bulbs 31 ', 32', and 33 'are arranged so as to be substantially along each side of a regular triangle, and are integrally connected by two connecting portions c and c. Thus, the two electrode sealing end surfaces, each of which is configured as a single arc tube 14 ′ and sealed with a pair of electrodes 36 ′ and 36 ′, are concentrated in the space on the one surface 58a side of the double-sided substrate 58, and on the other surface 58b side. It is characterized in that the electrode end face is not arranged in the space. Other configurations are substantially the same as those of the first embodiment.

  Therefore, according to this bulb-type fluorescent lamp 11A, the two electrode sealing end faces are located in the space on the one surface 58a side of the double-sided substrate 58. Therefore, the one surface 58a has low heat resistance or low temperature tolerance. A surface mount type high heat resistant electronic component 60bb higher than the heat resistant electronic component 60ba is mounted.

  The other surface 58b of the double-sided substrate 58 corresponds to a surface far from the pair of electrodes 36, 36, and is a surface that is not easily affected by the heat generated by the electrodes 36, 36. The low heat resistant electronic component 6ba is mounted. For this reason, the temperature rise of the low heat resistant electronic component 60ba can be suppressed.

  The number of bulbs 31, 32, 33 and 31 ', 32', 33 'of the arc tubes 14, 14' is not limited to three, but two or four or more are arranged in parallel to form a discharge path. The length can be made longer.

  FIGS. 9A, 9B, and 9C are enlarged schematic views of lighting devices 17A, 17B, and 17C according to the third embodiment of the present invention.

  The lighting device 17A shown in FIG. 9A is characterized in that a vertical second vertical substrate 58o is provided in addition to the double-sided substrate 58.

  The second vertical substrate 58o is made of a double-sided substrate or a single-sided substrate, and is arranged in parallel with the double-sided substrate 58 with a required gap therebetween. A surface-mounted chip component or discrete component is mounted as an electronic component 60 on one or both surfaces of the second vertical substrate 58o.

  According to the lighting device 17A, since the two lighting circuit boards are provided, the mounting area of the electronic component 60 can be increased as compared with the case of one. For this reason, since the mounting density of the electronic components 60 can be reduced, the heat dissipation of these electronic components 60 can be improved. Further, since one circuit board can be made smaller than one circuit board, both the double-sided board 58 and the second vertical board 58o can be accommodated in the narrow base 12. it can.

  In the lighting device 17B shown in FIG. 9B, a vertical discrete substrate 58p that exclusively mounts the discrete component 60d and a vertical chip substrate 58q that exclusively mounts the surface mounting component 60e are arranged with a predetermined gap therebetween. There is a feature in the set point. The surface mount component 60e may include the low heat resistant electronic component 60ba.

  Since the lighting device 17B also includes a plurality of circuit boards as in the lighting device 17A, the mounting area of the electronic component 60 can be increased, and the heat dissipation can be improved.

  In addition, the circuit board is divided into the discrete board 58p and the chip board 58q, and the discrete component and the surface mounting component (chip component) are not mixed on one circuit board. For example, the discrete component 60d is mounted by flow soldering, The surface mounting component (chip component) 60e can be mounted in parallel, for example, by reflow soldering. For this reason, the efficiency of the mounting operation of the electronic component 60 can be improved.

  The lighting device 17C shown in FIG. 9C is characterized in that the chip substrate 58p shown in FIG. 9B is formed on the double-sided substrate 58r.

  According to the lighting device 17C, since the chip substrate 58r is formed on the double-sided substrate, the number of surface-mounted components 60e can be increased. For this reason, it is possible to further reduce the size of the lighting device 17C by configuring the discrete component 60d, which is relatively easy to be made larger than the surface-mounted component 60e, as the surface-mounted component 60e that can be easily reduced in size.

  FIG. 10 is a partially cutaway longitudinal sectional view of a light bulb shaped fluorescent lamp 11B according to a fourth embodiment of the present invention. This bulb-type fluorescent lamp 11A uses a horizontal substrate 58s as the double-sided substrate 58, and the low heat-resistant electronic component 60ba is disposed on the back surface 58u side of the upper surface 58t in the drawing facing the electrode 36 of the arc tube 14. There are features.

  Also with this bulb-type fluorescent lamp 11B, the low heat resistant component 60ba is disposed at a position far from the electrode 36 of the arc tube 14 as in the above embodiment, so that the temperature rise of the low heat resistant electronic component 60ba is suppressed. In addition, reliability can be improved.

  As shown in FIG. 11, a surface mounting component 60e such as a low heat resistant electronic component 60ba is mounted on any of the lighting circuit boards 58, 58o, 58p, 58q, and 58r of the lighting devices 17, 17A to 17C. A circuit pattern 58v may be formed on the lower surface of the mounting. According to any one of these circuit boards 58, 58o to 58r, the circuit pattern 58, 58o to 58r is formed on the lower surface of the mounting component 60e, which has conventionally been a dead space, so that the formation area of the circuit pattern 58v is increased. Alternatively, the circuit board 58v, 58o to 58r can be miniaturized by increasing the formation density of the circuit pattern 58v.

  Further, as shown in FIG. 12, a metal heat sink 90 having good thermal conductivity such as copper or its alloy is provided in a package Pa having a size of SOP8 or less of the surface mount component 60e such as the low heat resistance electronic component 60ba. May be. The metal heat radiating plate 90 is formed, for example, in a plane U shape, and has two side surfaces opposite to the plurality of one-side lead terminals 60ea, 60ea, ... of the flat rectangular package Pa, and two end surfaces in a direction perpendicular to the side surfaces. And at least a part of the bottom surface 60eb are mainly disposed so as to cover.

  According to this package Pa, since the heat dissipation of the package Pa can be improved by the heat dissipation plate 90, the heat dissipation of the semiconductor elements in the package Pa can be improved.

  Furthermore, as shown in FIG. 13, the heat radiating plate 90 may be divided into two left and right sheets 90a and 90b in the drawing. That is, when the two main switching elements Q1 and Q2 of the inverter circuit for the lighting circuit are accommodated in, for example, a flat rectangular tube package Pb of SOP8 size or less like the low heat resistant electronic component 60ba, both the switch elements Q1 and Q2 may be electrically insulated from each other, and the heat radiating plates 90a and 90b may be shared as input / output terminals of the switch elements Q1 and Q2, respectively.

  Also by this, the heat generated by the switching elements Q1 and Q2 can be radiated by the heat dissipation plates 90a and 90b, so that the heat dissipation of the package Pb can be improved.

  In the package Pb, the case where the two heat sinks 90a and 90b are provided on the same side surface of the package Pb has been described. However, the heat sinks 90a and 90b may be provided on different side surfaces of the package Pb. The mounting positions of the heat sinks 90a and 90b are not limited.

The longitudinal cross-sectional view seen from the juxtaposition direction of the bulb | bulb in the bulb-type fluorescent lamp which shows the 1st Embodiment of this invention. The longitudinal cross-sectional view seen from the direction which cross | intersects with the parallel arrangement direction of the bulb | bulb in the bulb-type fluorescent lamp shown in FIG. FIG. 3 is a cross-sectional view of the bulb-type fluorescent lamp shown in FIG. 1 and FIG. The perspective view of the holder of the lightbulb-type fluorescent lamp shown in FIG. The perspective view inside a holder combined with the arc tube of the bulb-type fluorescent lamp shown in FIG. The circuit diagram of the lighting device of the bulb-type fluorescent lamp shown in FIG. The schematic of the illuminating device using the lightbulb-type fluorescent lamp shown in FIG. The schematic principal part bottom view of the lightbulb-type fluorescent lamp which concerns on the 2nd Embodiment of this invention. (A) is the principal part enlarged view of the lighting device of the bulb-type fluorescent lamp concerning 3rd Embodiment of this invention, (B) is the principal part enlarged view of the other modification of the lighting device, (C) is the lighting The other principal part enlarged view of an apparatus. The longitudinal cross-sectional view of the lightbulb-type fluorescent lamp which concerns on the 4th Embodiment of this invention. The perspective view which shows an example of the attachment state of the low heat resistant electronic component which concerns on each embodiment of this invention, and a board | substrate. The perspective view of an example of the semiconductor electronic component concerning each embodiment of the present invention. The top view which shows an example of another electronic component.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11,11A ... Light bulb-type fluorescent lamp, 12 ... Base, 13 ... Cover, 14 ... Light-emitting tube, 15 ... Holder, 16 ... Globe, 17 ... Lighting device, 31, 32, 33 ... Bulb, 36 ... Electrode, 40 ... Electrode Side edges, 58o to 58r ... double-sided board, 58a, 58t ... one side of board, 58b, 58u ... other side of board, 58p ... board for lead component, 58q ... board for chip, 58v ... circuit pattern, 60 ... electronic component , 60a ... lead parts, 60b, 60e ... surface mount (chip) parts, 60ba ... low heat resistant electronic parts, 60bb ... high heat resistant electronic parts, Pa, Pb ... package for semiconductor electronic parts, 81 ... lighting device, 82 ... Lighting fixture body, 83 ... socket.

Claims (5)

A cover having a base;
A luminous tube sealed with a pair of electrodes attached to the cover;
A lighting device having a double-sided substrate housed in a cover and having a circuit element having a relatively low heat resistance or temperature tolerance mounted on a surface farther from the pair of electrodes of the arc tube than other circuit elements;
A bulb-type fluorescent lamp characterized by comprising: The bulb-type fluorescent lamp according to claim 1, wherein at least a part of the double-sided substrate is accommodated in the base. The circuit element having a relatively low heat resistance or temperature tolerance is a main switching element in which a plurality of switching elements included in an inverter circuit for driving an arc tube are accommodated in one package. The light bulb shaped fluorescent lamp according to 1 or 2. A double-sided board on which circuit elements with relatively low heat resistance or temperature tolerance are mounted and a plurality of boards on which other circuit elements are mounted are juxtaposed along the axial direction of the base. The bulb-type fluorescent lamp according to claim 1 or 2, characterized in that: A bulb-type fluorescent lamp according to any one of claims 1 to 4;
An instrument body to which a bulb-type fluorescent lamp is attached;
An illumination device comprising:

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