JP2007227129A - Organic electroluminescent device, and manufacturing method of the organic electroluminescent device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL device in which a manufacturing cost is suppressed by a simple and easy method and which is superior in display quality, and to provide a manufacturing method of the organic EL device. <P>SOLUTION: This is the organic EL device which has an organic functional layer, formed corresponding to a plurality of pixels on a substrate, and is provided with a plurality of first electrodes 14, formed corresponding to the plurality of the pixels, a barrier rib 17 formed by zoning the plurality of the first electrodes 14, the organic functional layer 15 formed at least a pixel region 3 interior and on the barrier rib 17 zoned by the barrier rib 17; a second electrode 21 formed on the organic functional layer 15 and on the barrier rib 17; a protective layer 25, formed at least on the second electrode 21 on the barrier rib 17 electrically connected to the second electrode 21, and comprises a conductive material and an auxiliary wiring 4 formed on the protection layer 25. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an organic EL device and a method for manufacturing the organic EL device.

  In recent years, attention has been paid to an organic EL device including an electroluminescence (hereinafter referred to as EL) element as a display device including a self-luminous element that does not require a light source such as a backlight. An organic EL device has a structure in which a plurality of light emitting elements each having a light emitting layer made of an organic EL material sandwiched between a pair of electrodes are provided within a substrate surface. It is classified into a bottom emission structure in which light is extracted from the side and a top emission structure in which light is extracted from the counter substrate side such as a sealing substrate and a color filter substrate.

  In an organic EL device having a top emission structure, a common electrode is generally arranged on the light emission side of a pair of electrodes sandwiching a light emitting layer. The common electrode is formed of a light-transmitting conductive material such as an ITO (indium tin oxide) film or an IZO (indium zinc oxide) film. Since such an ITO film or an IZO film has a higher resistance than a metal film, the voltage in the common electrode may be nonuniform and display quality may be deteriorated. For this reason, particularly in a large organic EL device having a top emission structure, an auxiliary electrode having a small resistance is formed on a substrate, and the voltage drop of the common electrode is established by electrically connecting the auxiliary electrode and a middle portion of the common electrode. Has been proposed (see, for example, Patent Document 1).

  In the method of manufacturing an organic EL device described in Patent Document 1, an insulating layer is formed on the entire surface of a substrate, and then a first electrode and an auxiliary electrode are formed on the insulating layer. Then, a partition wall is formed on the auxiliary electrode, and a contact portion that exposes the auxiliary electrode is formed on the partition wall. Then, an organic light emitting material is discharged into the partition wall at positions corresponding to R, G, and B. Thereafter, the second electrode is formed on the entire surface of the substrate.

In addition, a method of forming the auxiliary wiring before the organic film is formed has been proposed (for example, see Patent Document 2). In the manufacturing method of the organic EL device described in Patent Document 2, tantalum is deposited as an auxiliary cathode on the surface on the pixel interval wall side by a sputtering method, and then photolithography is performed so that the same pattern as the pixel interval wall is obtained. The auxiliary electrode is formed by patterning and etching according to the process. And after forming an auxiliary electrode, an organic luminescent material is discharged to the position corresponding to R, G, B in a partition by a vapor deposition method.
JP 2002-318556 A JP 2003-123988 A

By the way, in recent years, since it is not necessary to separately coat the regions partitioned by the partition walls into R, G, and B, and manufacturing is easy, there is a technique for manufacturing a color organic EL device using a white organic layer and a color filter. Proposed. That is, in the method of manufacturing an organic EL device described in Patent Document 1, when a white organic layer (light emitting layer) is deposited on the entire surface, the auxiliary electrode is exposed, and thus the organic layer is formed on the auxiliary electrode. It will be. Therefore, even if a cathode is formed on the organic layer, there arises a problem that the auxiliary electrode and the cathode cannot be conducted.
Moreover, in the manufacturing method of the organic EL device described in Patent Document 2, since each organic layer is formed by a vapor deposition method, it depends on the accuracy of the vapor deposition position and the production and management method of a mask used for vapor deposition. Problems such as rising costs occur.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide an organic EL device having a good display quality and a manufacturing method of the organic EL device with a simple method, suppressing the manufacturing cost. And

In order to achieve the above object, the present invention provides the following means.
The organic EL device of the present invention is an organic EL device having an organic functional layer formed corresponding to a plurality of pixels on a substrate, and a plurality of first electrodes formed corresponding to the plurality of pixels. A partition formed by partitioning the plurality of first electrodes, at least the inside of the pixel region partitioned by the partition and the organic functional layer formed on the partition, the organic functional layer, and the partition A second electrode formed on the second electrode; and a protective layer formed on at least the second electrode on the partition wall and electrically connected to the second electrode and made of a conductive material; and on the protective layer And an auxiliary wiring formed on the substrate.

  In the organic EL device according to the present invention, since the second electrode is connected to the auxiliary wiring via the protective layer, for example, when the auxiliary wiring is formed on the protective layer by the droplet discharge method, the organic function The damage on the layer is protected by the protective layer. Therefore, by forming the auxiliary wiring on the protective layer, the resistance of the entire second electrode can be lowered via the protective layer, and an organic EL device with excellent display quality can be provided.

In the organic EL device of the present invention, it is preferable that the protective layer is formed only on the partition wall.
In the manufacturing method of the organic EL device according to the present invention, since the protective layer is formed only on the partition wall, the formation of the protective layer can be minimized and the cost can be reduced.

  In the organic EL device of the present invention, it is preferable that a groove is formed on the partition wall, and the organic functional layer, the second electrode, and the protective layer are formed in that order in the groove.

  In the organic EL device according to the present invention, after forming a groove on the partition, an organic functional layer is formed inside the region partitioned by the partition and on the partition. And after forming a 2nd electrode on this organic functional layer, a protective layer is formed on a 2nd electrode. Thereafter, auxiliary wiring is formed on the protective layer in the groove. Thus, by forming the groove portion, for example, when forming the auxiliary wiring by the droplet discharge method, it is possible to prevent the material forming the auxiliary wiring from flowing down into the region partitioned by the partition wall.

In the organic EL device of the present invention, it is preferable that an insulating film having a recess is formed on the substrate, and the partition having the groove is formed in the recess of the insulating film.
In the organic EL device according to the present invention, since the partition having the groove is formed in the recess of the insulating film, for example, when the auxiliary wiring is formed by a droplet discharge method, the material for forming the auxiliary wiring Can be surely prevented. Therefore, it is possible to obtain an organic EL device with better display quality.
Furthermore, since the height of the partition can be reduced, it becomes easy to uniformly form the organic functional layer in the region partitioned by the partition.

  The method for manufacturing an organic EL device according to the present invention is a method for manufacturing an organic EL device having an organic functional layer formed corresponding to a plurality of pixels on a substrate, and a step of forming a plurality of first electrodes. Forming a partition for partitioning the plurality of first electrodes, forming the organic functional layer at least on the inside of the pixel region partitioned by the partition and on the partition, and on the organic functional layer and the partition Forming a second electrode thereon, forming a protective layer made of a conductive material electrically connected to the second electrode on at least the second electrode on the partition; and discharging a droplet And a step of forming an auxiliary wiring on the protective layer by a method.

  In the manufacturing method of the organic EL device according to the present invention, the organic functional layer is formed inside the region partitioned by the partition and on the partition. Then, after forming the second electrode on the organic functional layer, a protective layer is formed on the second electrode, and then an auxiliary wiring is formed on the protective layer by a droplet discharge method. Thus, after forming the protective layer, the protective layer protects the organic functional layer from damage to the material forming the auxiliary wiring by the droplet discharge method by forming the auxiliary wiring by the droplet discharge method. Become. Therefore, by using the droplet discharge method, the second electrode and the auxiliary wiring can be satisfactorily interconnected by a simple method with reduced manufacturing costs. By forming such auxiliary wiring on the protective layer, the resistance of the entire second electrode can be lowered via the protective layer, and an organic EL device having excellent display quality can be manufactured.

  In addition, since a white light emitting layer can be used as the organic functional layer, the mask alignment and the position of the organic light emitting material can be compared with the case where the organic light emitting material is ejected to the position corresponding to R, G, B in the partition wall by vapor deposition. Further, since there is no need to manufacture a mask, the cost can be reduced.

In the method for manufacturing an organic EL device of the present invention, it is preferable that the conductive material forming the protective layer has resistance to a solvent used when the auxiliary wiring is formed by a droplet discharge method.
In the manufacturing method of the organic EL device according to the present invention, when the auxiliary wiring is formed on the protective layer by the droplet discharge method, the protective layer has resistance to the solvent used for the auxiliary wiring. It is possible to reliably suppress damage to the.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
This embodiment relates to a method of manufacturing an organic EL device that performs full color display by using a white light emitting organic EL material for a light emitting layer and using a color filter substrate for a counter substrate.

[Configuration of organic EL device]
First, the organic EL device manufactured according to this embodiment will be described.
FIG. 1 is a diagram showing a wiring structure of an organic EL display device (organic EL device) 1 according to the first embodiment of the present invention.
The organic EL display device 1 is an active matrix EL display device using a thin film transistor (hereinafter abbreviated as TFT) as a switching element.
In the following description, each scale and each layer film constituting the organic EL display device 1 are made different in scale so that they can be recognized.

The organic EL display device 1 includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction perpendicular to each scanning line 101, and a plurality of power supply lines 103 extending in parallel to each signal line 102. Each pixel region X is provided in the vicinity of each intersection of the scanning line 101 and the signal line 102 while having a wired configuration.
A data line driving circuit 100 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 102. Further, a scanning line driving circuit 80 including a shift register and a level shifter is connected to the scanning line 101.

  Further, in each pixel region X, a switching TFT 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel signal to be supplied from the signal line 102 via the switching TFT 112 are held. A capacitor 113, a driving TFT 5 to which a pixel signal held by the holding capacitor 113 is supplied to the gate electrode, and driving from the power line 103 when electrically connected to the power line 103 through the driving TFT 5 A pixel electrode (first electrode; anode) 14 through which a current flows and an organic EL element (organic functional layer) 15 sandwiched between the pixel electrode 14 and a common electrode (second electrode; cathode) 21 are provided. .

  According to the organic EL display device 1, when the scanning line 101 is driven and the switching TFT 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor 113, and according to the state of the holding capacitor 113. Thus, the on / off state of the driving TFT 5 is determined. Then, a current flows from the power supply line 103 to the pixel electrode 14 via the channel of the driving TFT 5, and further a current flows to the common electrode 21 via the organic functional layer 15. The organic functional layer 15 emits light according to the amount of current flowing through it.

Next, a specific configuration of the organic EL display device 1 will be described with reference to FIGS.
As shown in FIG. 2, the organic EL display device 1 includes a substrate 2 having electrical insulation and pixel electrodes connected to switching TFTs (not shown) arranged in a matrix on the substrate 2. A pixel electrode region (not shown), a power supply line (not shown) arranged around the pixel electrode region and connected to each pixel electrode, and a substantially rectangular pixel in a plan view located at least on the pixel electrode region It is of an active matrix type configured to include a part G (inside the one-dot chain line frame in FIG. 2).

The pixel portion G includes an actual display area L in the center (inside the two-dot chain line in FIG. 2) and a dummy area D (area between the one-dot chain line and the two-dot chain line) arranged around the actual display area L. It is divided into.
In the actual display region L, display regions R, G, and B each having a pixel electrode are arranged in a matrix in such a manner as to be separated from each other in the AB direction and the CD direction.
Further, on both sides of the actual display region L in FIG. These scanning line driving circuits 80 are arranged below the dummy area D.

  Further, an inspection circuit 90 is disposed above the actual display area L in FIG. The inspection circuit 90 is a circuit for inspecting the operating state of the EL display device 1 and includes, for example, inspection information output means (not shown) for outputting the inspection result to the outside, and is displayed during manufacture or at the time of shipment. The apparatus is configured to be able to inspect the quality and defect of the apparatus. The inspection circuit 90 is also arranged below the dummy area D.

FIG. 3 is a plan view showing the configuration of the organic EL device 1 manufactured according to this embodiment, and FIG. 4 is a cross-sectional view taken along the line XX in the plan view.
As shown in FIG. 3, the organic EL display device 1 has an elliptical pixel region 3 corresponding to each of the three primary colors (R, G, B) on a substrate 2 in a matrix (X direction and Y direction). A plurality of strip-like auxiliary wirings 4 extending in the other direction (X direction) orthogonal to one direction are arranged between the pixel regions 3 arranged in one direction (Y direction). .

  In addition, as shown in FIG. 4, a driving TFT 5 is formed on the substrate 2. The driving TFT 5 includes a source region 5a, a drain region 5b, a channel region 5c formed in the semiconductor film 6, and a gate facing the channel region 5c via a gate insulating film 7 formed on the surface of the semiconductor film 6. It is mainly comprised by the electrode 5d. Further, a first interlayer insulating film 8 is formed to cover the semiconductor film 6 and the gate insulating film 7, and drains are respectively formed in the contact holes 9 and 10 that penetrate the first interlayer insulating film 8 and reach the semiconductor film 6. An electrode 11 and a source electrode 12 are embedded, and these electrodes are electrically connected to the drain region 5b and the source region 5a.

  A second planarizing insulating film 13 is formed on the first interlayer insulating film 8, and a pixel electrode (first electrode) 14 is formed on the second planarizing insulating film 13. A part of the pixel electrode 14 is buried in a contact hole penetrating the second planarization insulating film 13 and is conductively connected to the drain electrode 11. In addition, an inorganic partition 16 made of an inorganic insulating material is formed so as to partially run on the peripheral edge of the pixel electrode 14. A partition wall 17 made of an organic material is laminated on the inorganic partition wall 16.

The organic EL element (organic functional layer) 15 includes a pixel electrode 14, a hole injection / transport layer 18 formed on the pixel electrode 14, and a white light emitting layer formed on the hole injection / transport layer 18. 19, an electron injection / transport layer 20 formed on the light emitting layer 19 and a common electrode (second electrode) 21 formed on the electron injection / transport layer 20. These hole injection / transport layer 18, light emitting layer 19 and electron injection / transport layer 20 constitute an organic functional layer.
A hole injection / transport layer 18, a light emitting layer 19, an electron injection / transport layer 20, and a common electrode 21 are sequentially formed over the entire surface of the partition wall 17 and on the partition wall 17.

  Furthermore, a protective layer 25 is formed on the common electrode 21 over the entire surface. The protective layer 25 is an ITO (indium tin oxide) film. Further, the conductive material constituting the protective layer 25 has resistance to the solvent used when the auxiliary wiring 4 is formed by the droplet discharge method. An auxiliary wiring 4 is formed on the protective layer 25 on the partition wall 17, and the common electrode 21 is electrically connected to the auxiliary wiring 4 through the protective layer 25. Further, silver (Ag) is used as the material of the auxiliary wiring 4.

  In the case of an organic EL device having a so-called top emission structure, the substrate 2 is configured to extract light from the side on which the organic EL element 15 is disposed. Therefore, in addition to a transparent substrate such as glass, an opaque substrate can also be used. . Examples of opaque substrates include ceramics such as alumina, metal sheets such as stainless steel that have been subjected to insulation treatment such as surface oxidation, thermosetting resins and thermoplastic resins, and films thereof (plastic films). It is done. Further, the pixel electrode 14 does not need to be translucent in the case of a top emission structure, and can be formed of an appropriate conductive material such as a metal material.

  The organic EL element 15 in the present embodiment employs a top emission structure in which light emitted from the light emitting layer 19 is emitted from the common electrode 21 side by using a material having optical transparency for the common electrode 21. As such a material, for example, an aluminum thin film, a magnesium silver thin film, or the like can be used. Moreover, the thickness of the common electrode 21 of this embodiment is about 10 nm, and is formed of MgAg (magnesium silver). The common electrode 21 has a thickness that allows light emitted from the light emitting layer 19 to pass therethrough.

  Further, a color filter substrate 22 is provided to face the substrate 2. On the color filter substrate 22, a color filter 23 corresponding to each of the three primary colors (R, G, B) and a light-shielding BM (Black Matrix) pattern 24 are formed. The color filter substrate 22 is provided so that the pixel region 3 on the substrate 2 side and the color filter 23 face each other. The color filter substrate 22 is a transparent substrate such as glass.

[Method for Manufacturing Organic EL Device]
Next, a method for manufacturing the organic EL device 1 will be described. In this embodiment, various wirings, a driving TFT 5 and the like are formed on a substrate 2 such as glass, a pixel electrode 14 is formed on the driving TFT 5, and a partition wall (inorganic partition wall 16 and A step of forming a partition wall 17), a step of forming an organic functional layer on the partition wall, a step of forming the common electrode 21 on the organic functional layer, and a step of forming the auxiliary wiring 4 on the common electrode 21 Thus, the organic EL device 1 is manufactured. Among these steps, the steps for forming various wirings, driving TFTs 5 and the like are the same as well-known steps, and the subsequent steps will be described in detail.

(1) Pixel Electrode As shown in FIG. 5A, a driving TFT 5, a semiconductor film 6, a gate insulating film 7, a first interlayer insulating film 8, a drain electrode 11, a source electrode 12, and a second flat surface are formed on a substrate 2. When the insulating insulating film 13 is formed, indium tin oxide (ITO) is formed on the entire surface of the second planarizing insulating film 13 by vapor deposition, and this film is patterned by photolithography. As shown in FIG. 5B, the pixel electrode 14 is formed. Since the organic EL display device 1 of the present embodiment is a top emission type as described above, the pixel electrode 14 does not need to be transparent, and thus is not limited to the indium tin oxide, and is appropriate. It can be formed of a conductive material.

(2) Partition Formation Step Next, as shown in FIG. 5C, an inorganic partition 16 is formed as a first partition on the second planarization insulating film 13 and the pixel electrode 14, and FIG. As shown in FIG. 5, a partition wall 17 is formed as a second partition wall. The inorganic barrier 16 is formed by forming an inorganic film such as SiO ₂ , TiO ₂ or SiN on the entire surface of the second planarization insulating film 13 and the pixel electrode 14 by, for example, CVD, sputtering, vapor deposition, or the like. It is formed by patterning by photolithography. The inorganic partition 16 is provided only on the second planarization insulating film 13 and on the peripheral edge of the pixel electrode 14, and the electrode surface 14 a located near the center of the pixel electrode 14 is exposed.

  Next, a partition wall 17 is formed on the inorganic partition wall 16. The partition wall 17 can be made of, for example, an organic resin having heat resistance and solvent resistance such as acrylic resin and polyimide resin. The partition wall 17 is formed by applying an organic resin such as acrylic resin or polyimide resin dissolved in a solvent by spin coating, dip coating, or the like. Then, the partition wall 17 is patterned by photolithography to provide an opening. The opening of the partition wall 17 is preferably formed slightly wider than the opening of the inorganic partition wall 16 as shown in FIG.

  When the partition wall 17 is formed in this way, plasma processing is subsequently performed. This plasma treatment activates the electrode surface 14a of the pixel electrode 14, and is performed mainly for the purpose of cleaning the surface of the electrode surface 14a of the pixel electrode 14, adjusting the work function, and further making it lyophilic.

(3) Organic Functional Layer Forming Step Next, as shown in FIG. 6, a hole injection / transport layer 18 is formed on the entire surface of the pixel electrode 14, the inorganic barrier 16 and the barrier 17, and a light emitting layer 19 is further formed thereon. The organic functional layer is formed by forming the electron injection / transport layer 20 thereon. The hole injection / transport layer 18, the light emitting layer 19, and the electron injection / transport layer 20 are formed by depositing a deposition material suitable for each layer based on a well-known deposition method.

  As a deposition material for the light emitting layer 19, a known low molecular weight material capable of emitting white fluorescence or phosphorescence can be used. For example, anthracene, pyrene, 8-hydroxyquinoline aluminum, bisstyrylanthracene derivative, tetraphenyl A butadiene derivative, a coumarin derivative, an oxadiazole derivative, a distyrylbenzene derivative, a pyrrolopyridine derivative, a perinone derivative, a cyclopentadiene derivative, a thiadiazolopyridine derivative, or a low molecular weight material such as rubrene, a quinacridone derivative, a phenoxazone derivative, DCM, DCJ, perinone, perylene derivatives, coumarin derivatives, diazaindacene derivatives and the like can be used by doping. Further, as a vapor deposition material for the electron injection / transport layer 20, an alkali metal fluoride or oxide such as LiF or an alloy such as magnesium lithium can be used.

(4) Common Electrode Formation Step Then, as shown in FIG. 6, the common electrode 21 is formed on the entire surface of the electron injection / transport layer 20. In this common electrode formation step, a magnesium silver thin film is formed by vapor deposition to form the common electrode 21 in order to realize a top emission structure.
Next, indium tin oxide (ITO) is formed on the entire surface of the common electrode 21 by vapor deposition to form the protective layer 25.

(5) Auxiliary Wiring Formation Step Next, as shown in FIG. 6, the auxiliary wiring 4 is formed on the protective layer 25 by a droplet discharge method as a liquid process. First, a liquid composition L formed by containing a silver material as a composition constituting the auxiliary wiring 4 is discharged from the nozzle N of the discharge head 30. At this time, the discharge head 30 is moved relative to the substrate 2 along the arrangement direction of the pixel region 3 along the guide rail 31 provided on the discharge head 30 and extending along the front and back of the sheet. The liquid composition L is discharged sequentially. Thereby, the liquid composition L is applied on the protective layer 25. The width of the auxiliary wiring 4 is substantially the same as the interval between the pixel regions 3.

  In the organic EL device and the manufacturing method of the organic EL device according to the present embodiment, after forming the protective layer 25, the auxiliary wiring 4 is formed by the droplet discharge method, thereby forming the auxiliary wiring 4 by the droplet discharge method. The protective layer 25 absorbs the impact of the silver material to the organic EL element 15. Therefore, by using the droplet discharge method, the common electrode 21 and the auxiliary wiring 4 can be satisfactorily interconnected by a simple method with reduced manufacturing costs. By forming such auxiliary wiring 4 on the protective layer 25, the resistance of the entire common electrode 21 can be lowered via the protective layer 25, and the organic EL device 1 having excellent display quality can be manufactured. It becomes.

  Further, since the auxiliary wiring 4 can be formed by a droplet discharge method, a pixel can be directly drawn, so that the auxiliary wiring 4 can be formed without a mask. Therefore, a high-definition display can be manufactured. Moreover, since it is a liquid phase process and does not require a vacuum, it is advantageous in terms of energy cost and material cost, and is particularly effective for patterning of a large area.

  Furthermore, in the present embodiment, it is possible to separately coat the regions partitioned by the partition walls 17 into R, G, and B. However, as in the present embodiment, the light emitting layer 19 emits white fluorescence or phosphorescence. By using a material that can be used, it is not necessary to align the mask or manufacture the mask as compared with the case where the region partitioned by the partition wall 17 is separately applied to R, G, and B, thereby reducing the cost. Is possible.

  Further, since the conductive material constituting the protective layer 25 has resistance to the solvent used when the auxiliary wiring 4 is formed by the droplet discharge method, the auxiliary wiring is formed on the protective layer 25 by the droplet discharge method. When forming 4, the damage to the organic EL element 15 can be reliably suppressed.

Next, a second embodiment according to the present invention will be described with reference to FIG. In each embodiment described below, portions having the same configuration as those of the organic EL device 1 according to the first embodiment described above are denoted by the same reference numerals and description thereof is omitted.
The organic EL device 40 according to the present embodiment differs from the first embodiment in that when the partition wall 17 is formed, a groove 45 is formed on the partition wall 17.

  As shown in FIG. 7, the hole injection / transport layer 18, the light emitting layer 19, the electron injection / transport layer 20, the common electrode 21, and the protective layer 25 are sequentially formed in the groove 45, as in the partition 17. Is formed. An auxiliary wiring 41 is formed on the protective layer 25 inside the groove 45.

Next, a method for manufacturing the organic EL device 40 of this embodiment will be described.
First, as in the first embodiment, after the pixel electrode 14 and the partition wall 17 are formed, the groove portion 45 is provided on the upper surface 17a of the partition wall 17 by patterning using a photolithography method and an etching method. The depth L of the groove 45 is about 1/3 of the depth M of the partition wall 17. Thereafter, similarly to the first embodiment, the organic EL element 15, the common electrode 21, and the protective layer 25 are formed. Then, by forming the auxiliary wiring 41 on the protective layer 25 inside the groove 45, the organic EL device 40 shown in FIG. 7 is manufactured.

  In the organic EL device and the method for manufacturing the organic EL device according to the present embodiment, when forming the auxiliary wiring 41 by the droplet discharge method by forming the groove 45, the material for forming the auxiliary wiring 41 is within the partition wall 17. Can be prevented from flowing down.

Next, a third embodiment according to the present invention will be described with reference to FIG.
In the organic EL device 50 according to the present embodiment, the second planarization insulating film 53 having the recesses 53a is formed on the substrate 2, and the partition walls 54 having the groove portions 51 are formed in the recesses 53a of the second planarization insulation film 53. This is different from the first embodiment. That is, the depth Q of the groove 51 is deeper than the depth P of the partition wall 54.

  As a method for forming the groove 51, first, the concave portion 53a is provided by patterning the second planarization insulating film 53 by a photolithography method. Then, similarly to the second embodiment, after forming the pixel electrode 14 and the partition wall 54, the groove portion 51 is formed on the upper surface 54 a of the partition wall 54 by patterning using a photolithography method. Then, by forming the auxiliary wiring 52 on the protective layer 25 inside the groove 51, the organic EL device 50 shown in FIG. 8 is manufactured.

In the organic EL device and the method for manufacturing the organic EL device according to the present embodiment, since the partition wall 54 having the groove 51 is formed in the recess 53a of the second planarization insulating film 53, the auxiliary wiring 52 is formed by a droplet discharge method. Can be reliably prevented from entering the partition wall 54 by the material forming the auxiliary wiring 52. Therefore, it is possible to manufacture the organic EL device 50 with better display quality.
Further, since the partition wall depth Q of this embodiment can be made lower than the partition wall depth M compared to the second embodiment, the organic EL element 15 is uniformly formed in the region partitioned by the partition wall 54. It becomes easy to do.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, the material for forming the auxiliary wiring 4 is not limited to silver (Ag), and a conductive material may be used.
The protective layer 25 is an ITO (indium tin oxide) film, but may be an IZO (indium zinc oxide) film, a zinc oxide film, etc., as long as it is formed of a transparent material. Also good. Further, although the protective layer 25 is formed over the entire surface of the common electrode 21, the protective layer 25 may be formed only on the common electrode 21 formed on at least the partition wall 17. With this configuration, the formation of the protective layer 25 can be minimized, and the cost can be reduced.
Moreover, since the damage of the organic EL element 15 can be protected by forming the protective layer 25, the conductive material constituting the protective layer 25 is used when the auxiliary wiring 4 is formed by the droplet discharge method. It is not always necessary to have resistance to a solvent.
Further, although the droplet discharge method is used as a method of forming the auxiliary wirings 4, 41, and 52, it is not limited to this.

It is a figure which shows the wiring structure of the organic electroluminescence display which concerns on 1st embodiment of this invention. It is a schematic diagram which shows the structure of the organic electroluminescence display which concerns on 1st embodiment of this invention. 1 is a plan view showing an organic EL device according to a first embodiment of the present invention. It is sectional drawing in the XX arrow of FIG. It is sectional drawing which shows the process of the manufacturing method of the organic electroluminescent apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the process of the manufacturing method of the organic electroluminescent apparatus which concerns on 1st Embodiment of this invention. It is sectional drawing which shows the organic electroluminescent apparatus which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows the organic electroluminescent apparatus which concerns on 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,40,50 ... Organic EL display apparatus (organic EL apparatus) 4,41,52 ... Auxiliary wiring, 14 ... Pixel electrode (1st electrode), 15 ... Organic EL element (organic functional layer), 17 ... Partition 21 ... Common electrode (second electrode)

Claims (6)

An organic EL device having an organic functional layer formed corresponding to a plurality of pixels on a substrate,
A plurality of first electrodes formed corresponding to the plurality of pixels;
A partition formed by partitioning the plurality of first electrodes;
The organic functional layer formed at least inside the pixel region partitioned by the partition and on the partition;
A second electrode formed on the organic functional layer and the partition;
A protective layer formed on at least the second electrode on the partition and electrically connected to the second electrode and made of a conductive material;
An organic EL device comprising: an auxiliary wiring formed on the protective layer.   The organic EL device according to claim 1, wherein the protective layer is formed only on the partition wall. A groove is formed on the partition;
The organic EL device according to claim 1, wherein the organic functional layer, the second electrode, and the protective layer are sequentially formed in the groove. An insulating film having a recess is formed on the substrate,
The organic EL device according to claim 3, wherein the partition wall having the groove is formed in a recess of the insulating film. A method of manufacturing an organic EL device having an organic functional layer formed corresponding to a plurality of pixels on a substrate,
Forming a plurality of first electrodes;
Forming a partition partitioning the plurality of first electrodes;
Forming the organic functional layer at least inside the pixel region partitioned by the partition and on the partition;
Forming a second electrode on the organic functional layer and the partition;
Forming a protective layer made of a conductive material electrically connected to the second electrode on at least the second electrode on the partition;
And a step of forming an auxiliary wiring on the protective layer by a droplet discharge method.   The method for manufacturing an organic EL device according to claim 5, wherein the conductive material constituting the protective layer has resistance to a solvent used when the auxiliary wiring is formed by a droplet discharge method.

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