JP2007281341A - Lid for electronic component and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent irradiation of a laser beam on a portion other than a processing target outside an electronic component body. <P>SOLUTION: In a vibrating gyro-sensor 30, a gyro-sensor element 10 is housed in a package 32. In the package 32, a lid 36 is hermetically joined to an upper end of a package body 34, and its inside is vacuum-sealed. The gyro-sensor element 10 has a balance adjuster made of a gold thin-film on a driving arm 16. The lid 36 is formed of a transparent glass and has a convex lens 68 positioned immediately above the balance adjuster 28. The convex lens 68 further condenses an incident laser beam 70 to irradiate the balance adjuster 28 with the laser beam 70. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component lid that is bonded to a package body that accommodates an electronic component, and more particularly to an electronic component lid and an electronic component that are suitable for use in a package body that houses an electronic component to be laser processed.

  Conventionally, it has been often performed to detect a rotational motion of an electronic device or apparatus by an angular velocity sensor. In recent years, along with miniaturization and high performance of electronic devices, portable electronic devices are also equipped with an angular velocity sensor to prevent camera shake based on detected acceleration. An angular velocity sensor mounted on a portable electronic device is desired to be small and light, and a vibration gyro sensor using a piezoelectric material is widely used. Many types of vibration gyro sensors have been developed. For example, there is one using the gyro sensor element shown in FIG.

  In FIG. 6, the gyro sensor element 10 is formed from a quartz substrate which is a piezoelectric substrate, for example, and has a base 12 formed in a square shape at the center. In the gyro sensor element 10, the left and right sides are formed symmetrically with respect to the center of the base 12, and the support arms 14 are integrally formed on the left and right sides of the base 12. At the tips of these support arms 14, drive arms 16 (16 a to 16 d) are provided in the vertical direction of the support arms 14 so as to be orthogonal to the support arms 14. In addition, the vibration gyro sensor element 10 is vertically symmetrical with respect to the center of the base 12, and detection arms 18 (18 a, 18 b) are integrally formed on the upper and lower sides of the base 12.

  Each drive arm 16 is provided with a drive electrode, and the detection arm 18 is provided with a detection electrode (both not shown). When a voltage is applied to the drive electrode, each drive arm 16 vibrates at the same frequency in a plane formed by each drive arm 16 as indicated by arrows 20 to 26. And the vibration of each drive arm 16 is synchronizing, and the front-end | tip part of each drive arm 16 bends inside simultaneously, and bends outside simultaneously.

  In the gyro sensor element 10, the detection arm 18 does not vibrate when an angular velocity in a plane parallel to the paper surface of FIG. However, due to variations associated with the manufacture of the gyro sensor element 10, the frequency of each drive arm 16 may differ, and the thickness and thickness may differ. For this reason, the vibration balance of each drive arm 16 is lost, the vibrations of the upper, lower, left and right drive arms 16 are not canceled out at the base 12, and the detection arm 18 vibrates and the angular velocity does not act. A detection signal is output.

Therefore, a balance adjustment unit 28 made of a thin gold film or the like is formed at the tip of each drive arm 16, and the balance adjustment unit 28 is irradiated with laser light to evaporate a part of the balance adjustment unit 28, and an angular velocity acts. The balance of each drive arm 16 is adjusted (tuned) so that the detection arm 18 does not vibrate in the absence state. This tuning is preferably performed after the gyro sensor element 10 is vacuum-sealed in the package so that no tuning deviation occurs. In a tuning fork type piezoelectric vibrator or the like, a tuning fork type piezoelectric vibrating piece is enclosed in a package, and then laser light is irradiated through a glass lid (for example, Patent Document 1). .
JP 2002-359536 A

  In the case of adjusting the frequency by irradiating laser light through a glass lid (lid) as in Patent Document 1, the laser light is squeezed so that it hits only a target location. In recent years, with the miniaturization of electronic devices, piezoelectric devices such as piezoelectric vibrators and piezoelectric vibration gyros have become very small, and the spot diameter of laser light used for frequency adjustment must be extremely small. I must. However, in the current general laser processing apparatus, the spot diameter of the obtained laser beam is larger than the desired spot diameter. And the lid (lid body) which consists of conventional glass is formed in the flat form of uniform thickness, as described in patent document 1. FIG. Therefore, when the laser beam is irradiated through the glass lid, the laser beam having a large spot diameter is directly irradiated into the package. For this reason, the laser light is applied to an integrated circuit mounted in a package other than the crystal vibrating piece, the bottom surface of the package body, or the like. Therefore, the integrated circuit is damaged by the laser beam, or the bottom of the package is melted and impurities are scattered in the package, and the scattered impurities adhere to the vibrating piece and deteriorate the characteristics.

  The present invention has been made to solve the above-described drawbacks of the prior art, and has an object to reduce the spot diameter of laser light to a size necessary for processing.

  Another object of the present invention is to prevent laser light from hitting parts other than the processed part outside the electronic component.

  Another object of the present invention is to enable accurate processing of the electronic component main body.

  In order to achieve the above object, an electronic component lid according to the present invention is characterized in that a convex lens portion is provided at a predetermined position of a lid body made of a light-transmitting member. It is desirable that the convex lens portion has a size equal to or larger than the obtained laser spot diameter.

  When the laser light is incident on the convex lens part, it is narrowed down by the convex lens part. For this reason, even when the laser light incident on the convex lens portion is not sufficiently narrowed down, it is further narrowed down by the convex lens, so that a smaller spot diameter can be obtained. Therefore, by arranging the lens portion of the lid at a position corresponding to the laser processing portion of the electronic component main body housed in the package, it is possible to irradiate the processing portion with laser light having a spot diameter suitable for processing. Accordingly, it is possible to prevent the laser light from being irradiated on portions other than the laser processed portion of the electronic component main body. For this reason, the semiconductor integrated circuit and the bottom of the package body that are mounted together are irradiated to damage the semiconductor integrated circuit, and impurities are scattered in the package and adhere to the electronic component body to deteriorate the characteristics. Can be prevented. If the size of the convex lens portion is set to be equal to or larger than the laser spot to be obtained, it is possible to reliably prevent the laser light from being irradiated to the portion other than the portion to be processed.

  A plurality of convex lens portions can be provided according to the laser processing location of the electronic component main body. The convex lens portion can be formed in a cylindrical lens shape. When a plurality of locations to be laser-processed are arranged in a line, the lens portion can be easily formed by forming a cylindrical lens shape (cylindrical lens shape). The convex lens portion may be formed in a Fresnel lens shape. When the convex lens portion is formed in a Fresnel lens shape, the convex lens portion can be thinned and the electronic component can be thinned.

  The electronic component lid according to the present invention is a lid to be joined to the package body, and is characterized by comprising a convex lens. The light incident on the convex lens obliquely with the optical axis and passing through the focal point is emitted from the convex lens as light parallel to the optical axis. Further, light that is incident on the convex lens obliquely to the optical axis and passes through the center of the convex lens goes straight as it is and is emitted from the convex lens. Therefore, if the relationship between the incident angle of the laser beam to the convex lens and the irradiation position of the laser beam emitted from the convex lens is obtained, by making the lid itself a convex lens, the laser processing of the electronic component body is desired. Laser light having a smaller spot diameter than incident light can be irradiated. In addition, by forming the lid itself as a convex lens, the lid can be easily formed. The convex lens can be formed as a normal spherical lens, cylindrical lens, or Fresnel lens.

  The electronic component according to the present invention is mounted on the package main body and has an electronic component main body having a processed part to be laser processed, and the electronic component main body is bonded to the package main body and hermetically seals the periphery of the electronic component main body And any one lid. With such an electronic component, the laser spot obtained from the laser processing machine can be irradiated with a smaller spot diameter to the processed portion of the electronic component main body. Thereby, it can prevent that a laser beam is irradiated to area | regions other than a to-be-processed part.

  The electronic component body may be a piezoelectric vibration gyro sensor element. The piezoelectric vibration gyro sensor element can be tuned in a state where the piezoelectric vibration gyro sensor element is vacuum-sealed in the package. For this reason, unlike vacuum sealing after tuning, it is possible to prevent the occurrence of tuning deviation and to obtain a piezoelectric vibration gyro sensor with excellent detection sensitivity that is tuned with high accuracy.

  Preferred embodiments of an electronic component lid and an electronic component according to the present invention will be described in detail with reference to the accompanying drawings. In addition, about the part corresponding to the part demonstrated in background art, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  FIG. 1 is a cross-sectional view schematically showing a piezoelectric vibration gyro sensor which is an electronic component according to an embodiment of the present invention. In FIG. 1, the vibration gyro sensor 30 has a gyro sensor element 10 that is an electronic component main body housed inside a package 32. The package 32 includes a package body 34 and a lid 36. The package body 34 is formed, for example, by laminating and sintering a plurality of ceramic sheets, and has a box shape having an accommodation space 38. The lid 36 is made of transparent glass, and is hermetically bonded to the upper end of the package body 34 via a low-melting glass 39, and the housing space 38 of the package body 34 is vacuum-sealed.

  A semiconductor integrated circuit 40 is housed in the housing space 38 of the package body 34 together with the gyro sensor element 10. The semiconductor integrated circuit 40 includes a drive circuit that drives (vibrates) the drive arm 16 of the gyro sensor element 10, and includes a detection circuit that processes a detection signal output from the detection arm and outputs an angular velocity signal (whicheverever is required). (Not shown). The semiconductor integrated circuit 40 is fixed to the bottom surface 42 of the package body 34 with an adhesive (not shown). In the semiconductor integrated circuit 40, a plurality of pads (not shown) are electrically connected to bonding pads (not shown) provided on the bottom surface 42 via bonding wires 44.

  The package main body 34 has a stepped portion 46 at an intermediate portion in the vertical direction of the accommodation space 38. The gyro sensor element 10 is mounted on the step 46 via a film carrier tape (so-called TAB tape) 50. A film carrier tape (hereinafter referred to as TAB tape) 50 has a device hole 54 in the center of a base material 52 made of a polyimide film. The TAB tape 50 has an inner lead portion 56 made of copper foil disposed in a device hole 54.

  The inner lead part 56 is bent in a crank shape in the upper part of the figure, and a tip is a joint support part 58 substantially parallel to the base material 52. The base portion 12 of the gyro sensor element 10 is bonded to the upper surface of the bonding support portion 58 via the conductive adhesive 60. That is, the lower surface of the base 12 of the gyro sensor element 10 is provided with a connection electrode electrically connected to a drive electrode provided on the drive arm 16 and a detection electrode provided on the detection arm 18. An electrode is bonded to the bonding support portion 58. Further, the outer lead portion 62 integral with the inner lead portion 56 is formed on the lower surface of the base material 52 and is electrically connected to a pad (not shown) provided on the step portion 46 via a conductive adhesive 64 such as silver paste. Connected. The pads provided in the stepped portion 46 are electrically connected to the semiconductor integrated circuit 40 through through holes, wiring patterns, etc. (not shown) provided in the package body 34.

  In the lid 36, the lid body 66 is formed in a plate shape from transparent glass, and a plurality of convex lens portions 68 are provided at predetermined positions of the lid body 66. As shown in FIG. 1, the convex lens portion 68 is formed so as to be positioned immediately above the balance adjusting portion 28 that is a processed portion provided in the gyro sensor element 10. That is, as shown in the bottom view in FIG. 2, the lid 36 has four convex lens portions 68 corresponding to the balance adjusting portions 28 provided in the drive arms 16 a to 16 d of the gyro sensor element 10. . These convex lens portions 68 are located immediately above the balance adjusting portion 28 when the lid 36 is joined to the upper end of the package body 34. The lid 36 having such a convex lens portion 68 is formed by injecting molten glass into a mold cavity, and after placing the glass material in the mold, the mold is heated to soften the glass material. It can be obtained by pressing.

  In the vibration gyro sensor 30 of the embodiment configured as described above, the gyro sensor element 10 can be tuned by laser light through the lid 36 after the gyro sensor element 10 is vacuum-sealed in the package 32. That is, the convex lens portion 68 is irradiated with the laser beam 70 from above the lid 36. The convex lens portion 68 further collects the incident laser beam 70 and forms a small beam spot on the balance adjusting portion 28.

  As a result, a part of the gold thin film constituting the balance adjusting unit 28 is evaporated by the energy of the laser beam, and the mass of the tip of the drive arm 16 changes. Therefore, the balance of each drive arm 16 can be adjusted. In addition, since the laser beam 70 is further condensed at the convex lens portion 68, the balance adjusting portion 28 is irradiated even when the spot diameter of the laser beam 70 output from the laser processing apparatus is not sufficiently small. The spot diameter can be made sufficiently small. Therefore, it is possible to avoid the laser light from hitting parts other than the balance adjusting unit 28, the mounted semiconductor integrated circuit 40 is damaged by the laser light, the bottom of the package body 34 is melted, and impurities are scattered. Trouble can be eliminated. Further, since tuning is performed after the gyro sensor element 10 is vacuum-sealed, it is possible to eliminate a tuning deviation that has occurred because the gyro sensor element 10 has been vacuum-sealed after the gyro sensor element 10 has been tuned. In the embodiment, the diameter of the convex lens portion 68 is set to be equal to or larger than the spot diameter of the laser beam 70 obtained by the laser processing apparatus. As a result, it is possible to reliably prevent the laser light from being applied to the area other than the balance adjustment unit 28.

  Note that the size of the beam spot irradiated on the balance adjustment unit 28 can be adjusted by adjusting the spot diameter of the laser beam 70 incident on the convex lens unit 68. Further, according to the inventor's research, when the gyro sensor element 10 is mounted using the TAB tape 50 made of a polyimide film, the balance adjustment unit 28 is irradiated with laser light in a state where the package 32 is vacuum-sealed to form a gold thin film. When evaporated, it was found that even if a long time elapses, the gold particles hardly adhere to the gyro sensor element 10. This is presumably because the gold particles evaporated by the laser light are adsorbed on the polyimide film of the TAB tape 50 and re-scattering is prevented. Therefore, the vibration gyro sensor 30 according to the embodiment can avoid tuning deviation due to reattachment of gold particles even after a long time has passed after tuning, and can be a highly accurate gyro sensor.

  In the above-described embodiment, the case where the convex lens portion 68 is a plano-convex lens in which only the lower surface of the lid 36 is convex has been described, but a biconvex lens in which the upper surface of the lid 36 is also convex, and a flat surface in which only the upper surface is convex. It may be a convex lens. In the embodiment, the case where the electronic component main body is the vibration gyro sensor element 10 has been described. However, the electronic component main body may be a tuning fork type vibration piece, an integrated circuit having a resistor or a capacitor for laser trimming, or the like. Good. In the embodiment, the case where the lid 36 is made of transparent glass has been described. However, the lid may be formed of a member that transmits laser light and is not damaged by the laser light.

  FIG. 3 is an explanatory diagram of a lid according to the second embodiment, wherein (1) is a bottom view and (2) is a cross-sectional view taken along line AA of (1). In the lid 72 according to the second embodiment, the convex lens portion 74 is formed in a cylindrical lens (cylindrical lens) shape. That is, the lid 72 is formed as an integral convex lens portion 74 by connecting convex lens portions corresponding to the balance adjusting portion 28 of the drive arm 16 (for example, the drive arms 16A and 16c) on one side. Even when the convex lens portion is formed in a cylindrical shape in this way, the same effect as in the above embodiment can be obtained. Further, by forming the convex lens portion in a cylindrical shape, the convex lens portion can be easily formed.

  FIG. 4 is a cross-sectional view of the convex lens portion of the lid according to the third embodiment. In the lid 76 according to this embodiment, the convex lens portion 68 is formed as a Fresnel lens. When the convex lens portion 68 is formed as a Fresnel lens, the convex lens portion 68 can be formed thin, and the vibration gyro sensor 30 can be thinned.

  FIG. 5 is a cross-sectional view schematically showing a vibration gyro sensor including a lid according to the fourth embodiment. In the vibration gyro sensor 30, the lid 80 is formed by a convex lens. That is, the lid 80 is a plano-convex lens having a flat upper surface. The lid 80 is a flat flange portion 82 whose upper and lower surfaces are parallel so that the peripheral edge portion can be airtightly bonded to the upper end of the package body 34 via the low melting point glass 39.

  The thus configured lid 80 obliquely intersects with the optical axis 84 of the convex lens, and the laser light 86 incident on the lid 80 through the focal point F of the convex lens becomes laser light parallel to the optical axis 84 and becomes the lid 80. It is emitted from. On the other hand, the laser beam 88 incident on the lid 80 so as to pass through the center of the convex lens goes straight as it is and is emitted from the lid 80. Therefore, by obtaining in advance the incident angle of the laser beam on the lid 80 for irradiating the balance adjustment unit 28 with the laser beam, the balance adjustment unit 28 can be reliably irradiated with the laser beam. Similar effects can be obtained. Moreover, since the lid itself is a convex lens, the lid can be easily formed. In the lid 80 of this embodiment, the convex lens can be formed as a cylindrical lens or a Fresnel lens.

1 is a cross-sectional view schematically showing a piezoelectric vibration gyro sensor according to an embodiment of the present invention. It is a bottom view of the lid concerning a 1st embodiment. It is explanatory drawing of the lid which concerns on 2nd Embodiment. It is sectional drawing of the convex lens part of the lid concerning 3rd Embodiment. It is sectional drawing typically shown of the vibration gyro sensor provided with the lid which concerns on 4th Embodiment. It is a top view showing an example of a piezoelectric vibration gyro sensor element.

Explanation of symbols

  10 ......... Electronic component body (gyro sensor element), 12 ......... Base, 16, 16a to 16d ......... Drive arm, 18, 18a, 18b ... Detection arm, 28 ......... Worked part (balance) Adjustment unit), 30 ......... Electronic components (vibration gyro sensor), 32 ......... Package, 34 ......... Package body, 36 ......... Lid, 40 ......... Semiconductor integrated circuit, 50 ......... Film carrier tape , 68... Convex lens part, 70... Laser beam, 72, 76, 80... Lid, 74 ... Convex lens part, 86, 88.

Claims (8)

  A lid for electronic parts, wherein a convex lens portion is provided at a predetermined position of a lid body made of a translucent member. In the lid for electronic components according to claim 1,
An electronic component lid comprising a plurality of convex lens portions. In the lid for electronic components according to claim 1 or 2,
The lid for electronic parts, wherein the convex lens portion has a cylindrical lens shape. In the lid for electronic components in any one of Claim 1 thru | or 3,
The convex for the electronic component, wherein the convex lens portion is formed in a Fresnel lens shape.   A lid for an electronic component, which is a lid to be joined to a package body and is made of a convex lens. In the lid for electronic components according to claim 5,
The lid for electronic parts, wherein the convex lens is a cylindrical lens or a Fresnel lens. The package body;
An electronic component body mounted on the package body and having a workpiece to be laser processed;
The lid according to any one of claims 1 to 5, wherein the lid is bonded to the package body and hermetically seals the periphery of the electronic component body.
An electronic component comprising: The electronic component according to claim 7,
The electronic component main body is a piezoelectric vibration gyro sensor element.

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