JP2007281042A - Airtight package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an airtight package having a package size reduced to realize an easy manufacturing process with small number of man-hours, and to provide a manufacturing method of the airtight package. <P>SOLUTION: The airtight package is constituted of a device substrate 1 and a lid substrate 3 joined via an oxide film. The package includes a cavity 2 for sealing and storing one or a plurality of electronic devices between both substrates, an electrode connected with the device substrate 1 and electrically connected with a terminal of each electronic device, a through-hole 4 formed on the lid substrate 3 for exposing part of the electrode when both substrates are joined, and a mounting electrode 8 in contact with the through hole 4. By thus sealing and storing the electronic devices in a space formed of the two substrates, the package size of the airtight package can be reduced. In addition, the manufacturing process can be easy and man-hours can be reduced as the package can be sealed by joining the two substrates. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a hermetic package for housing an electronic device such as a semiconductor element in a hermetically sealed manner and a method for manufacturing the hermetic package.

Generally, an electronic device such as a bare chip of a semiconductor element is sealed in a hermetic package and mounted on a product.
Hereinafter, the structure of a hermetic package for sealing and housing a conventional electronic device will be described with reference to FIG.

FIG. 4 is a conceptual diagram showing the structure of a conventional hermetic package.
In FIG. 4, reference numeral 13 denotes a semiconductor element, 15 denotes a base portion on which the semiconductor element 13 is mounted, 16 denotes a side wall for forming a space for housing the semiconductor element 13, and 17 denotes an external terminal electrically connected to the semiconductor element 13. , 19 is a cap fixed to the upper surface of the side wall 16, and 20 is a fusing agent for sealing the side wall 16 and the cap 19.

The semiconductor element 13 is mounted on the base portion 15. The terminals of the semiconductor element 13 are wire-bonded to the terminals of the base portion 15 and are electrically connected to the external terminals 17 via the internal wiring of the base portion 15. A side wall 16 is formed around the semiconductor element 13 mounting region of the base portion 15 to form a space for sealingly housing the semiconductor element 13. A cap 19 is sealed in the upper opening of the side wall 16 with a fusion agent 20 to form an airtight package for hermetically sealing the semiconductor element 13 with the base portion 15, the side wall 16 and the cap 19 (for example, Patent Document 1). reference).
JP 2002-246492 A

  However, the conventional hermetic package has a problem in that the package size increases because a side wall is formed around the semiconductor element mounting region to form a space for sealing and housing. In addition, since the side walls are formed and the side walls and the cap are fused with a fusing agent, the manufacturing process becomes complicated and the number of steps increases.

  An object of the airtight package and the airtight package manufacturing method of the present invention is to reduce the package size and realize an easy and small manufacturing process.

  In order to achieve the above object, an airtight package according to claim 1 of the present invention is an airtight package that hermetically seals and accommodates one or more electronic devices, and the electronic devices are mounted in a mounting area. A device substrate, a device electrode that is electrically connected to a terminal included in the electronic device and formed on the device substrate, and a lid substrate that includes a recess that can accommodate the electronic device in the mounting region; A through-hole formed in the lid substrate corresponding to the device electrode, and the mounting region and the device electrode surface are exposed on the device substrate to form the mounting region of the device substrate and the lid substrate. The oxide film for sealingly housing the electronic device with the recess, and the device substrate and the lid substrate are connected to the device electrode when bonded. A substrate electrode formed in the through hole and a mounting electrode formed in contact with the substrate electrode, wherein the device substrate and the lid substrate are bonded via the oxide film, To do.

  3. The hermetic package according to claim 2, wherein the hermetic package is a hermetically sealed package for housing one or more electronic devices in a hermetically sealed manner, a device substrate on which the electronic device is mounted in a mounting region, and terminals provided in the electronic device. A device electrode electrically connected to the device substrate and formed on the device substrate; a lid substrate having a through hole corresponding to the device electrode; and the mounting region and the surface of the device electrode are exposed on the device substrate. A film thickness is equal to or greater than the electronic device thickness, and an oxide film that seals and accommodates the electronic device by forming a cavity that can accommodate all the electronic devices in the mounting region of the device substrate and the lid substrate; A substrate electrode formed in the through hole to connect to the device electrode when the device substrate and the lid substrate are joined; and And a mounting electrode formed in contact with the plate electrode, the lid substrate and the device substrate is characterized in that it is joined.

  The hermetic package according to claim 3 is a hermetic package that hermetically seals and accommodates one or more electronic devices, the device substrate including a recess having a depth that can accommodate the electronic device, and the electronic device. A device electrode electrically connected to a terminal included in the device and formed on the device substrate; a lid substrate including a through hole corresponding to the device electrode; and the recess and the device electrode surface exposed on the device substrate. An oxide film that seals and accommodates the electronic device with the concave portion of the device substrate and the lid substrate, and the through-hole to connect to the device electrode when the device substrate and the lid substrate are joined A substrate electrode formed in the hole and a mounting electrode formed in contact with the substrate electrode, wherein the device substrate and the lid substrate are closely bonded to each other; I am characterized in.

  The hermetic package according to claim 4 is a single-layer structure in which the substrate electrode is formed by metal sputtering, vapor deposition, or plating in the hermetic package according to claim 1, claim 2, or claim 3. It is characterized by being.

  The hermetic package according to claim 5 is a multi-layered structure in which the substrate electrode is formed by sputtering, vapor deposition or plating of metal in the hermetic package according to claim 1 or claim 2 or claim 3. It is characterized by being.

The hermetic package according to claim 6 is the hermetic package according to claim 1, 2, 3, 4, or 5, wherein the oxide film is a SiO ₂ film. It is characterized by.

  The hermetic package according to claim 7 is the hermetic package according to claim 1, 2, 3, 4, 5, or 6, wherein the through hole is tapered. The size of the opening that is provided and is in contact with the device electrode is smaller than the size of the device electrode.

An airtight package according to claim 8 is the airtight package according to any one of claims 1, 2, 3, 4, 5, 6, or 7. The substrate is LiTaO ₃ and the lid substrate is quartz.

  10. The method of manufacturing an airtight package according to claim 9, wherein the electronic device is hermetically sealed and accommodated by joining a device substrate on which one or more electronic devices are mounted to a lid substrate, and the lid Forming a recess serving as a cavity for accommodating the electronic device in the substrate, forming a through hole corresponding to a device electrode formed in the device substrate in the lid substrate, and the electronic device on the device substrate Forming the oxide film by exposing the region where the device is mounted and the surface of the device electrode, aligning the device electrode and the through hole, and joining the device substrate and the lid substrate to bond the oxide film and the device A step of sealingly housing the electronic device in a region of the substrate on which the electronic device is mounted and the concave portion of the lid substrate; And having a step of forming a substrate electrode in the through hole so as to be connected to the device electrodes, and forming a mounting electrodes in contact with the substrate electrode.

  As described above, the package size can be reduced, and an easy and man-hour manufacturing process can be realized.

  As described above, the package size of the hermetic package can be reduced by sealingly housing the electronic device in the space formed by the two substrates, and sealing is performed by joining the two substrates. Therefore, the manufacturing process can be facilitated and man-hours can be reduced.

  The hermetic package of the present invention is configured by bonding a device substrate and a lid substrate via an oxide film, and is connected to the device substrate with a space for sealingly housing one or more electronic devices between the two substrates. The electrode is electrically connected to the terminals of each electronic device, the through hole is formed on the lid substrate and exposes a part of the electrode when the two substrates are joined, and the mounting electrode is in contact with the through hole. .

  As described above, the package size of the hermetic package can be reduced by sealingly accommodating the electronic device in the space formed by the two substrates, and sealing is performed by joining the two substrates. Therefore, the manufacturing process can be facilitated and man-hours can be reduced.

Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
Hereinafter, the configuration of the airtight package according to the first embodiment will be described with reference to FIG.

FIG. 1 is a cross-sectional view showing the structure of an airtight package according to Embodiment 1 of the present invention. In FIG. 1, the same components as those in FIG.
First, a device substrate 1 formed of LiTaO ₃ or the like and serving as one substrate is formed. On the device substrate 1, a mounting region for mounting one or a plurality of semiconductor elements 13 as an electronic device, and device electrodes 5 connected to the electrodes of the semiconductor elements 13 by wiring inside the device substrate 1 are formed.

  Next, a lid substrate 3 made of quartz or the like and serving as the other substrate is formed. In the lid substrate 3, the semiconductor element 13 is sealed with a through hole 4 formed at a position where the device electrode 5 is bonded to the device substrate 1 and a mounting region of the device substrate 1 when bonded to the device substrate 1. A recess for forming the cavity 2 serving as a receiving region is formed.

Next, one or a plurality of semiconductor elements 13 are mounted on the mounting region of the device substrate 1 as an example of an electronic device.
Next, for example, a SiO ₂ film 7 is deposited as an oxide film on the entire surface other than the region to be the cavity 2 of the device substrate 1 so that the surface of the device electrode 5 is exposed.

Next, the device electrode 1 and the through hole 4 are aligned, and the device substrate 1 and the lid substrate 3 are joined. In this way, the cavity 2 can be hermetically sealed with the concave portion of the lid substrate 3, the mounting region of the device substrate 1, and the SiO ₂ film 7. Here, the depth of the recess is adjusted in advance so that the semiconductor element 13 and the recess of the lid substrate 3 do not contact each other. Further, the film thickness and the like of the SiO ₂ film 7 are adjusted so that the cavity 2 is hermetically sealed by bonding. Further, by providing the through hole 4 with a taper so that the size of the opening contacting the device electrode 5 is smaller than the size of the device electrode 5, the device electrode 5 protrudes from the through hole 4. The SiO ₂ film 7 can be prevented from flowing out from the opening.

  Finally, a substrate electrode 6 such as a metal sputtered film is formed on the surface of the through hole 4, and metal plating is performed thereon to form a mounting electrode 8 such as a protruding electrode. The mounting electrode 8 realizes a structure that can be easily mounted on a printed board.

  The mounting electrode 8 can also be formed by supplying a conductive material such as solder or Ag paste to the substrate electrode 6 formed in the through hole 4 by a printing method, a dispensing method or the like. The substrate electrode 6 can also be formed by metal vapor deposition or plating. Furthermore, the substrate electrode 6 may have a single layer structure or a multilayer structure.

As described above, the electronic device is sealed and accommodated by the oxide film in the space formed on the two substrates, so that it is not necessary to newly form a sealing region by the side wall or the like, thereby reducing the package size of the hermetic package. In addition, since sealing is performed by joining two substrates, it is not necessary to newly form a sealing region by a side wall or the like, so that the manufacturing process can be facilitated and man-hours can be reduced. .
(Embodiment 2)
Next, the configuration of the hermetic package in the second embodiment will be described with reference to FIG.

FIG. 2 is a sectional view showing the structure of the hermetic package according to the second embodiment of the present invention. In FIG. 2, the same components as those in FIG.
As shown in FIG. 2, also in the second embodiment, as in the first embodiment, the device substrate 1 on which one or a plurality of semiconductor elements 13 are mounted and the lid substrate 3 are bonded to form the semiconductor element 13 in the cavity. 2 is hermetically sealed. The difference from the first embodiment is the configuration of the cavity 2. In the first embodiment, the concave portion is formed in the lid substrate 3 to form the cavity 2 hermetically sealed by the SiO ₂ film 7 together with the mounting region of the device substrate 1. However, in the present embodiment, the lid substrate 3 The cavity 2 is formed by adjusting the film pressure of the SiO ₂ film 7 and bonding the device substrate 1 and the lid substrate 3 so that all the mounted semiconductor elements 13 are not bonded to the lid substrate 13. The semiconductor element 13 is mounted in the cavity 2 hermetically sealed by the SiO ₂ film 7.

  As described above, the electronic device is sealed and accommodated by the oxide film in the space formed on the two substrates, so that the package size of the hermetic package can be reduced, and the two substrates are sealed by bonding. Since it can stop, a manufacturing process can be made easy and a man-hour can be reduced. Furthermore, the airtight package can be manufactured more easily by forming the cavity for sealing and accommodating by adjusting the oxide film thickness without forming the recess in the substrate for the area to be sealed and accommodated.

(Embodiment 3)
Next, the configuration of the hermetic package in the third embodiment will be described with reference to FIG.
FIG. 3 is a cross-sectional view showing the structure of the hermetic package according to the third embodiment of the present invention. In FIG. 3, the same components as those in FIG. 1 or FIG.

As shown in FIG. 3, also in the first embodiment, as in the first embodiment, the device substrate 1 on which one or a plurality of semiconductor elements 13 are mounted and the lid substrate 3 are joined to form the semiconductor element 13 in the cavity. 2 is hermetically sealed. The difference from the first embodiment is the configuration of the cavity 2. In the first embodiment, the concave portion is formed in the lid substrate 3 to form the cavity 2 hermetically sealed by the SiO ₂ film 7 together with the mounting region of the device substrate 1. However, in the present embodiment, the lid substrate 3 A cavity is formed by forming a recess in the device substrate 1 and forming the recess as a mounting region, and adjusting the depth of the recess so that all mounted semiconductor elements 13 are not bonded to the lid substrate 13. The semiconductor element 13 is mounted in the cavity 2 that is hermetically sealed by forming the substrate ₂ and tightly bonding the device substrate 1 and the lid substrate 3 via the SiO ₂ film 7.

  In this way, the package size of the hermetic package can be reduced by sealingly accommodating the electronic device in the space formed on the two substrates, and sealing is performed by joining the two substrates. Therefore, the manufacturing process can be facilitated and man-hours can be reduced.

  The present invention is capable of reducing the package size, facilitating the manufacturing process, reducing the number of man-hours, and hermetic package and hermetic package for hermetically sealing and housing electronic devices such as semiconductor elements. It is useful for the manufacturing method of this.

Sectional drawing which shows the structure of the airtight package in Embodiment 1 of this invention Sectional drawing which shows the structure of the airtight package in Embodiment 2 of this invention Sectional drawing which shows the structure of the airtight package in Embodiment 3 of this invention Conceptual diagram showing the structure of a conventional hermetic package

Explanation of symbols

1 device substrate 2 cavity 3 cover substrate 4 through holes 5 device electrode 6 substrate electrode 7 SiO ₂ film 8 mounted electrode 13 semiconductor element 15 base portion 16 side walls 17 external terminal 19 the cap 20 fusion agent

Claims (9)

An airtight package for hermetically sealing and housing one or more electronic devices,
A device substrate for mounting the electronic device in a mounting region;
A device electrode electrically connected to a terminal included in the electronic device and formed on the device substrate;
A lid substrate having a recess that forms a cavity capable of accommodating the electronic device with the mounting region;
A through hole formed in the lid substrate corresponding to the device electrode;
An oxide film that is formed on the device substrate so as to expose the surface of the mounting region and the device electrode and encloses the electronic device with the mounting region of the device substrate and the concave portion of the lid substrate;
A substrate electrode formed in the through-hole so as to connect to the device electrode when the device substrate and the lid substrate are joined;
An airtight package comprising: a mounting electrode formed in contact with the substrate electrode, wherein the device substrate and the lid substrate are bonded via the oxide film. An airtight package for hermetically sealing and housing one or more electronic devices,
A device substrate for mounting the electronic device in a mounting region;
A device electrode electrically connected to a terminal included in the electronic device and formed on the device substrate;
A lid substrate having a through hole corresponding to the device electrode;
The mounting area and the surface of the device electrode are exposed on the device substrate, and the film thickness is equal to or greater than the thickness of the electronic device. The mounting area and the lid substrate of the device substrate accommodate all the electronic devices. An oxide film that forms a possible cavity and encapsulates the electronic device;
A substrate electrode formed in the through-hole so as to connect to the device electrode when the device substrate and the lid substrate are joined;
An airtight package having a mounting electrode formed in contact with the substrate electrode, wherein the device substrate and the lid substrate are bonded. An airtight package for hermetically sealing and housing one or more electronic devices,
A device substrate comprising a recess having a depth that can be accommodated by the electronic device;
A device electrode electrically connected to a terminal included in the electronic device and formed on the device substrate;
Forming a cavity with the concave portion of the device substrate to enclose and store the electronic device, and a lid substrate including a through hole corresponding to the device electrode;
A substrate electrode formed in the through-hole so as to connect to the device electrode when the device substrate and the lid substrate are joined;
An airtight package comprising: a mounting electrode formed in contact with the substrate electrode, wherein the device substrate and the lid substrate are closely bonded.   4. The hermetic package according to claim 1, wherein the substrate electrode has a single layer structure formed by metal sputtering, vapor deposition, or plating.   4. The hermetic package according to claim 1, wherein the substrate electrode has a multilayer structure formed by metal sputtering, vapor deposition, or plating. 6. The hermetic package according to claim 1, wherein the oxide film is a SiO ₂ film.   The tapered portion is provided in the through-hole so that the size of the opening contacting the device electrode is smaller than the size of the device electrode. Item 7. The hermetic package according to any one of items 5 and 6. The device substrate is LiTaO ₃ , and the lid substrate is quartz, either of claims 1, 2, 3, 4, 5, 6, or 7. The airtight package described in Crab. An airtight package for hermetically sealing and housing the electronic device by bonding a device substrate on which one or more electronic devices are mounted to a lid substrate,
Forming a recess serving as a cavity for housing the electronic device in the lid substrate;
Forming a through hole corresponding to a device electrode formed on the device substrate in the lid substrate;
A step of exposing the region where the electronic device is mounted on the device substrate and the surface of the device electrode to form an oxide film;
The device electrode and the through hole are aligned, the device substrate and the lid substrate are joined, the oxide film, a region of the device substrate on which the electronic device is mounted, and the concave portion of the lid substrate. Sealing and housing
Forming a substrate electrode in the through hole to connect to the device electrode;
And a step of forming a mounting electrode in contact with the substrate electrode.

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