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JP2007242867A - Electronic-circuit apparatus - Google Patents

Electronic-circuit apparatus Download PDF

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Publication number
JP2007242867A
JP2007242867A JP2006062855A JP2006062855A JP2007242867A JP 2007242867 A JP2007242867 A JP 2007242867A JP 2006062855 A JP2006062855 A JP 2006062855A JP 2006062855 A JP2006062855 A JP 2006062855A JP 2007242867 A JP2007242867 A JP 2007242867A
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Prior art keywords
circuit board
circuit boards
case member
support column
circuit
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JP2006062855A
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Japanese (ja)
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Masaaki Takahashi
正明 高橋
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Shindengen Electric Manufacturing Co Ltd
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Shindengen Electric Manufacturing Co Ltd
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Priority to JP2006062855A priority Critical patent/JP2007242867A/en
Publication of JP2007242867A publication Critical patent/JP2007242867A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent both of two circuit boards from generating stresses by an external force, and to improve its manufacturing efficiency, in an electronic-circuit apparatus having a plurality of circuit boards. <P>SOLUTION: The electronic-circuit apparatus 1 has two circuit boards 5, 7 connected electrically with each other, and also has a box-form case member 3 storing these two circuit boards 5, 7 therein by laminating them successively from the side of a bottom surface 9a. Pole braces 15 extending from the bottom surface 9a integrally with the case member 3 are formed, and each step surface 15b facing the end side of each pole brace 15 is formed in the intermediate portion in the extending direction of each pole brace 15, and the circuit board 5 of one of both the circuit boards has each inserting hole 21 for passing therethrough each pole brace 15 in its thickness direction so as to insert thereinto each pole brace 15. It is constituted so as to abut on each step surface 15b, and the other circuit board 7 is fastened to the end of each pole brace 15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、電子部品を搭載した複数の回路基板を備える電子回路装置に関する。   The present invention relates to an electronic circuit device including a plurality of circuit boards on which electronic components are mounted.

一般に、大電力電子部品モジュールとして使用される電子回路装置としては、例えば、パワートランジスタモジュールやスイッチング電源モジュール等がある。
従来、この種の電子回路装置においては、多数の電子部品を搭載する必要がある一方で搭載面積の制約があるため、上記多数の電子部品を搭載した2つの回路基板をその厚さ方向に隙間を介して相互に連結することが考えられている(例えば、特許文献1参照。)。これら2つの回路基板の連結は、2つの回路基板の間に支柱を配すると共に各回路基板と支柱とをネジで締結することで行われている。
なお、従来の電子回路装置は、連結された2つの回路基板を箱状のケース部材に収容して構成されるが、この収容の際には別個のネジを用いて一方の回路基板をケース部材に固定している。
特開平5−175628号公報
In general, examples of an electronic circuit device used as a high-power electronic component module include a power transistor module and a switching power supply module.
Conventionally, in this type of electronic circuit device, it is necessary to mount a large number of electronic components, but there is a limitation in the mounting area. Therefore, there are gaps in the thickness direction between two circuit boards mounted with the large number of electronic components. It is considered that they are connected to each other via a pin (see, for example, Patent Document 1). The connection of these two circuit boards is performed by arranging a support between the two circuit boards and fastening each circuit board and the support with a screw.
The conventional electronic circuit device is configured by accommodating two connected circuit boards in a box-shaped case member. When this accommodation is performed, one circuit board is attached to the case member using a separate screw. It is fixed to.
JP-A-5-175628

しかしながら、上記従来の電子回路装置においては、他方の回路基板が一方の回路基板を介してケース部材に固定されているため、外力によって他方の回路基板を撓ませるような応力が発生した際には、この外力が他方の回路基板及び支柱を介して一方の回路基板に伝達される。そして、この外力に基づいて一方の回路基板にも応力が発生する虞がある。
また、上記従来の電子回路装置においては、2つの回路基板及びケース部材の他に、2つの回路基板の間に配置される支柱や、各回路基板を支柱に固定するためのネジが必要となるため、電子回路装置を構成する部品点数が多くなり、電子回路装置を製造する工程数が多くなるという問題もある。
However, in the above-described conventional electronic circuit device, since the other circuit board is fixed to the case member via the one circuit board, when a stress that causes the other circuit board to be bent by an external force is generated. The external force is transmitted to one circuit board via the other circuit board and the support column. And there is a possibility that stress is also generated in one of the circuit boards based on the external force.
Further, in the above-described conventional electronic circuit device, in addition to the two circuit boards and the case member, a post disposed between the two circuit boards and a screw for fixing each circuit board to the post are required. Therefore, there is a problem that the number of parts constituting the electronic circuit device increases and the number of steps for manufacturing the electronic circuit device increases.

この発明は、上述した事情に鑑みてなされたものであって、外力によって2つの回路基板の両方に応力が発生することを防止できると共に、製造効率の向上も図ることができる電子回路装置を提供することを目的としている。   The present invention has been made in view of the above-described circumstances, and provides an electronic circuit device that can prevent stress from being generated on both of the two circuit boards by an external force and can also improve the manufacturing efficiency. The purpose is to do.

上記課題の解決手段として、請求項1に記載した発明は、相互に電気的に接続される少なくとも2つの回路基板と、これら少なくとも2つの回路基板を底面側から順次重ねて収容する箱状のケース部材とを備える電子回路装置であって、該ケース部材に、前記底面から一体的に延びる支柱が形成されており、該支柱の延出方向の中途部に、先端側と面する段差面が形成され、一方の回路基板が、その厚さ方向に貫通して前記支柱を挿通させる挿通孔を備えると共に前記段差面に当接するように構成され、他方の回路基板が、前記支柱の先端側に固定されることを特徴とする。   As a means for solving the above-mentioned problems, the invention described in claim 1 is a box-shaped case for accommodating at least two circuit boards electrically connected to each other and stacking at least two circuit boards sequentially from the bottom side. The case member is formed with a support column that integrally extends from the bottom surface, and a stepped surface that faces the front end side is formed in a midway portion of the support column in the extending direction. One circuit board is configured to have an insertion hole that penetrates in the thickness direction thereof and allows the post to pass therethrough, and is configured to abut against the step surface, and the other circuit board is fixed to the front end side of the post. It is characterized by being.

また、請求項2に記載した発明は、前記底面と同じ方向に面する前記他方の回路基板の上面に、押下操作可能な操作スイッチが搭載されていることを特徴とする。   The invention described in claim 2 is characterized in that an operation switch capable of being pressed is mounted on the upper surface of the other circuit board facing in the same direction as the bottom surface.

これらの発明に係る電子回路装置を製造する際には、一方の回路基板を支柱に挿通させると共にケース部材の底面に対向する裏面を段差面に当接させ、その後、他方の回路基板を支柱の先端に固定すればよい。すなわち、ケース部材に形成された同一の支柱によってケース部材に対する2つの回路基板の位置決めが行われることになる。なお、2つの回路基板同士の間隔は、支柱の先端から段差面までの長さを適宜調整することで容易に設定することが可能である。
また、2つの回路基板は各々ケース部材の支柱に取り付けられているため、操作スイッチを押下操作する等して、この押下操作に基づく外力によって他方の回路基板を撓ませるような応力が発生しても、上記外力が一方の回路基板に伝達されることがない。
When manufacturing the electronic circuit device according to these inventions, one circuit board is inserted into the support column and the back surface facing the bottom surface of the case member is brought into contact with the step surface, and then the other circuit board is mounted on the support column. What is necessary is just to fix to a front-end | tip. That is, the two circuit boards are positioned with respect to the case member by the same column formed on the case member. The interval between the two circuit boards can be easily set by appropriately adjusting the length from the tip of the support column to the step surface.
In addition, since the two circuit boards are each attached to the support column of the case member, a stress that causes the other circuit board to bend by an external force based on the pressing operation is generated by pressing the operation switch. However, the external force is not transmitted to one circuit board.

また、請求項3に係る発明は、前記他方の回路基板に対向する前記一方の回路基板の対向面から、前記他方の回路基板まで延びる棒状の接続部材が設けられ、該接続部材によって前記2つの回路基板が相互に電気接続されることを特徴とする。
この発明に係る電子回路装置によれば、他方の回路基板を支柱の先端に固定した状態においては、接続部材の一端が他方の回路基板に到達するため、他方の回路基板と接続部材の一端とを半田付け等で接合するだけで2つの回路基板を電気接続することができる。
According to a third aspect of the present invention, there is provided a rod-like connecting member extending from the facing surface of the one circuit board facing the other circuit board to the other circuit board, and the two connecting members provide the two circuit boards. The circuit boards are electrically connected to each other.
According to the electronic circuit device according to the present invention, in the state where the other circuit board is fixed to the tip of the support column, one end of the connection member reaches the other circuit board. The two circuit boards can be electrically connected by simply joining them together by soldering or the like.

また、請求項4に係る発明は、前記ケース部材が、前記接続部材の線膨張係数と略等しい樹脂材料により形成されていることを特徴とする。
この発明に係る電子回路装置によれば、ケース部材が熱に応じて膨張収縮した際には、支柱も伸縮してその先端と当接面との距離が変化する、すなわち、2つの回路基板同士の間隔が変化するが、ケース部材は接続部材の線膨張係数と略等しい樹脂材料により形成されているため、接続部材も支柱と同様に伸縮する。したがって、支柱の伸縮に基づいて接続部材と各回路基板との接合部分や接続部材自体に応力が発生することを防止できる。
The invention according to claim 4 is characterized in that the case member is formed of a resin material substantially equal to a linear expansion coefficient of the connection member.
According to the electronic circuit device of the present invention, when the case member expands and contracts in response to heat, the column also expands and contracts, and the distance between the tip and the contact surface changes. However, since the case member is formed of a resin material substantially equal to the linear expansion coefficient of the connection member, the connection member expands and contracts similarly to the support column. Therefore, it is possible to prevent stress from being generated at the joint portion between the connection member and each circuit board and the connection member itself based on the expansion and contraction of the support column.

請求項1及び請求項2に係る発明によれば、2つの回路基板はそれぞれケース部材に形成された同一の支柱に取り付けられているため、外力によって他方の回路基板を撓ませるような応力が発生しても、一方の回路基板に応力が発生することを防止できる。
また、2つの回路基板を各々ケース部材に固定するだけでケース部材に形成された同一の支柱に対する2つの回路基板の位置決めができ、相互に隙間を介して配置された2つの回路基板を備える電子回路装置を製造することが可能となる。したがって、電子回路装置の製造効率向上を図ることができる。すなわち、従来のように、2つの回路基板の間に配される別途支柱や各回路基板を支柱に締結するネジが不要となり、電子回路装置の構成部品点数を削減することができるため、電子回路装置の製造工程数の削減を図ることができる。
According to the first and second aspects of the present invention, since the two circuit boards are attached to the same support column formed on the case member, a stress that causes the other circuit board to be bent by an external force is generated. Even so, it is possible to prevent stress from being generated on one of the circuit boards.
In addition, it is possible to position the two circuit boards with respect to the same column formed on the case member simply by fixing the two circuit boards to the case member, and an electronic device including two circuit boards arranged with a gap therebetween. A circuit device can be manufactured. Therefore, the manufacturing efficiency of the electronic circuit device can be improved. That is, as in the prior art, there is no need for a separate support disposed between two circuit boards or screws for fastening each circuit board to the support, and the number of components of the electronic circuit device can be reduced. The number of manufacturing steps of the device can be reduced.

請求項3に係る発明によれば、一方の回路基板の対向面に立設された棒状の接続部材の一端と、支柱の先端に固定された他方の回路基板とを接合するだけで2つの回路基板を電気接続することができるため、さらに簡便に電子回路装置を製造することが可能となる。   According to the invention of claim 3, two circuits can be obtained simply by joining one end of a rod-like connecting member standing on the opposing surface of one circuit board and the other circuit board fixed to the tip of the column. Since the substrates can be electrically connected, the electronic circuit device can be more easily manufactured.

請求項4に係る発明によれば、熱に応じた支柱の伸縮に基づいて接続部材と各回路基板との接合部分や接続部材自体に応力が発生することが無いため、上記接合部分で破断したり接続部材が断線することを防止できる。したがって、2つの回路基板間の電気接続を確実に保持することができる。   According to the fourth aspect of the present invention, since no stress is generated in the connection portion between the connection member and each circuit board or the connection member itself based on the expansion and contraction of the support column in response to heat, the connection portion itself is broken. It is possible to prevent the connection member from being disconnected. Therefore, the electrical connection between the two circuit boards can be reliably maintained.

図1はこの発明に係る一実施形態を示す。この実施の形態に係る電子回路装置1は、図1に示すように、上方に開口する箱状のケース部材3と、ケース部材3内に収容される2つの回路基板5,7とを備えている。ケース部材3は、略板状に形成された底壁部9と、底壁部9の底面9aから一体的に立設して該底面9aを取り囲む側壁部11とを備えている。また、底壁部9には、その底面9aから一体的に延びる2種類の支柱13,15が相互に間隔をおいて複数形成されている。   FIG. 1 shows an embodiment according to the present invention. As shown in FIG. 1, the electronic circuit device 1 according to this embodiment includes a box-shaped case member 3 that opens upward, and two circuit boards 5 and 7 that are accommodated in the case member 3. Yes. The case member 3 includes a bottom wall portion 9 formed in a substantially plate shape, and a side wall portion 11 that stands integrally from the bottom surface 9a of the bottom wall portion 9 and surrounds the bottom surface 9a. The bottom wall portion 9 is formed with a plurality of two types of support columns 13 and 15 extending integrally from the bottom surface 9a at intervals.

複数の第1の支柱13は、それぞれ底面9aの周縁に配されており、底面9aから各第1の支柱13の先端面13aまでの高さ寸法は互いに略等しい。各第1の支柱13の先端には、第1の回路基板(一方の回路基板)5を固定するための雌ねじ部17が設けられている。この雌ねじ部17は、第1の支柱13の先端面13aから窪んだ穴に固定された金属製の筒状部材(不図示)によって構成されている。すなわち、上記筒状部材の内周面に雌ねじ部17が形成されている。   The plurality of first support columns 13 are respectively disposed on the periphery of the bottom surface 9 a, and the height dimensions from the bottom surface 9 a to the tip surface 13 a of each first support column 13 are substantially equal to each other. A female screw portion 17 for fixing the first circuit board (one circuit board) 5 is provided at the tip of each first support column 13. The female screw portion 17 is configured by a metallic cylindrical member (not shown) fixed to a hole recessed from the distal end surface 13 a of the first support column 13. That is, the internal thread part 17 is formed in the internal peripheral surface of the said cylindrical member.

複数の第2の支柱15は、第1の支柱13の内側に配置されており、底面9aから各第2の支柱15の先端面15aまでの高さ寸法は互いに略等しい。
また、これら第2の支柱15は、第1の支柱13よりも高く形成されている。そして、各第2の支柱15の先端には、第2の回路基板(他方の回路基板)7を固定するための雌ねじ部19が設けられている。この雌ねじ部19は、第1の支柱13の雌ねじ部17と同様に、第2の支柱15の先端面15aから窪んだ穴に固定された金属製の筒状部材(不図示)によって構成されている。
The plurality of second support columns 15 are arranged inside the first support column 13, and the height dimensions from the bottom surface 9 a to the tip end surface 15 a of each second support column 15 are substantially equal to each other.
Further, these second support columns 15 are formed higher than the first support columns 13. A female screw portion 19 for fixing the second circuit board (the other circuit board) 7 is provided at the tip of each second support column 15. The female thread portion 19 is configured by a metal cylindrical member (not shown) fixed in a hole recessed from the distal end surface 15a of the second strut 15 in the same manner as the female thread portion 17 of the first strut 13. Yes.

各第2の支柱15の延出方向の中途部には、第2の支柱15の先端側に面する段差面15bが形成されている。すなわち、この段差面15bよりも底壁部9の底面9a側に位置する第2の支柱15の基端部は、段差面15bよりも先端面15a側に位置する第2の支柱15の先端部よりも大きく形成されている。なお、底壁部9の底面9aから段差面15bまでの高さ寸法は、第1の支柱13の先端面13aの高さ寸法と略等しくなっている。
以上のように構成されたケース部材3は、例えばPBT(ポリブチレンテレフタレート)等のように線膨張係数が20〜80ppm/℃となる樹脂材料によって形成されている。
2つの回路基板5,7は、ケース部材3の底面9a側から順次重ねて収容されており、ケース部材3内において相互に隙間を介して配されている。なお、各回路基板5,7は、その両面に各種電子部品(不図示)等を搭載して構成されている。
A stepped surface 15 b facing the tip side of the second support column 15 is formed in the middle of the extending direction of each second support column 15. That is, the base end portion of the second support column 15 positioned on the bottom surface 9a side of the bottom wall portion 9 with respect to the step surface 15b is the front end portion of the second support column 15 positioned on the front end surface 15a side of the step surface 15b. It is formed larger than. Note that the height dimension from the bottom surface 9 a of the bottom wall portion 9 to the step surface 15 b is substantially equal to the height dimension of the tip surface 13 a of the first support column 13.
The case member 3 configured as described above is formed of a resin material having a linear expansion coefficient of 20 to 80 ppm / ° C. such as PBT (polybutylene terephthalate).
The two circuit boards 5 and 7 are sequentially accommodated from the bottom surface 9a side of the case member 3 and are arranged in the case member 3 with a gap therebetween. The circuit boards 5 and 7 are configured by mounting various electronic components (not shown) or the like on both surfaces.

ケース部材3の底面9a側に配置される第1の回路基板5は、第1の支柱13の先端面13a及び第2の支柱15の段差面15bに当接して配置されている。すなわち、第1の回路基板5には、その厚さ方向に貫通して第2の支柱15を各々挿通させる複数の挿通孔21が形成されている。各挿通孔21は、第2の支柱15の先端部を挿通させる程度の大きさを有しており、段差面15bに当接するように第2の支柱15の基端部よりも小さく形成されている。
また、第1の支柱13の先端面13aに当接する第1の回路基板5の周縁には、雌ねじ部17に対応する固定用孔23が貫通して形成されている。そして、固定用ネジ25を上記固定用孔23に挿通させると共に第1の支柱13の雌ねじ部17に螺合させることで、第1の回路基板5がケース部材3に固定されることになる。この状態において、第1の回路基板5はケース部材3の底面9aとの間に隙間を介して配置されている。
The first circuit board 5 disposed on the bottom surface 9 a side of the case member 3 is disposed in contact with the tip surface 13 a of the first column 13 and the step surface 15 b of the second column 15. That is, the first circuit board 5 is formed with a plurality of insertion holes 21 that penetrate the second support column 15 in the thickness direction. Each insertion hole 21 has a size that allows the distal end portion of the second support column 15 to be inserted, and is formed to be smaller than the proximal end portion of the second support column 15 so as to contact the stepped surface 15b. Yes.
Further, a fixing hole 23 corresponding to the female screw portion 17 is formed through the peripheral edge of the first circuit board 5 in contact with the front end surface 13 a of the first support column 13. The first circuit board 5 is fixed to the case member 3 by inserting the fixing screw 25 into the fixing hole 23 and screwing the fixing screw 25 into the female screw portion 17 of the first support column 13. In this state, the first circuit board 5 is disposed between the bottom surface 9 a of the case member 3 with a gap.

ケース部材3の開口側に配置される第2の回路基板7は、第1の回路基板5よりも小さく形成されており、その周縁が第2の支柱15の先端面15aに当接して固定されている。すなわち、雌ねじ部19に対応する位置に厚さ方向に貫通する固定用孔27を形成して構成されている。そして、固定用ネジ29を上記固定用孔27に挿通させると共に第2の支柱15の雌ねじ部19に螺合させることで、第2の回路基板7がケース部材3に固定されることになる。この状態において、第2の回路基板7は第1の回路基板5との間に隙間を介して配置されている。
なお、ケース部材3の底面9aと同じ方向に面する第2の回路基板7の上面7aには、押下操作可能な操作ボタン31aを有する操作スイッチ31が搭載されている。この操作スイッチ31の搭載位置は、第2の支柱15の近傍とすることが好ましい。また、第2の回路基板7を固定する固定用ネジ29には、ケース部材3の開口側に雌ねじ部33が形成されている。
The second circuit board 7 disposed on the opening side of the case member 3 is formed to be smaller than the first circuit board 5, and its peripheral edge is in contact with and fixed to the tip surface 15 a of the second support column 15. ing. That is, a fixing hole 27 that penetrates in the thickness direction is formed at a position corresponding to the female screw portion 19. Then, the second circuit board 7 is fixed to the case member 3 by inserting the fixing screw 29 into the fixing hole 27 and screwing the fixing screw 29 into the female screw portion 19 of the second support column 15. In this state, the second circuit board 7 is disposed between the first circuit board 5 and a gap.
An operation switch 31 having an operation button 31a that can be pressed is mounted on the upper surface 7a of the second circuit board 7 facing in the same direction as the bottom surface 9a of the case member 3. The mounting position of the operation switch 31 is preferably in the vicinity of the second support column 15. The fixing screw 29 for fixing the second circuit board 7 is formed with a female screw portion 33 on the opening side of the case member 3.

これら2つの回路基板5,7は、略棒状に形成した接続部材35を介して相互に電気接続されている。この接続部材35は、第2の回路基板7に対向する第1の回路基板5の対向面5aに立設されており、その一端が第2の回路基板7まで延びている。接続部材35の両端は、半田付け等により各回路基板5,7に接合されている。
さらに、接続部材35の中途部には屈曲部35aが形成されている。この屈曲部35aは、接続部材35の両端を各回路基板5,7に接合した状態で2つの回路基板5,7の隙間に変化が生じた際に弾性変形するようになっており、各回路基板5,7と接続部材35との接合部分に応力が発生することを抑制する役割を果たしている。
この接続部材35は、導電性の良好な黄銅によって形成されている。すなわち、上述したケース部材3の線膨張係数は黄銅からなる接続部材35と略等しくなっている。
These two circuit boards 5 and 7 are electrically connected to each other via a connecting member 35 formed in a substantially rod shape. The connection member 35 is erected on the facing surface 5 a of the first circuit board 5 facing the second circuit board 7, and one end thereof extends to the second circuit board 7. Both ends of the connection member 35 are joined to the circuit boards 5 and 7 by soldering or the like.
Further, a bent portion 35 a is formed in the middle portion of the connection member 35. The bent portion 35a is elastically deformed when a change occurs in the gap between the two circuit boards 5 and 7 with both ends of the connection member 35 being joined to the circuit boards 5 and 7, respectively. It plays the role which suppresses that stress generate | occur | produces in the junction part of the board | substrates 5 and 7 and the connection member 35. FIG.
The connection member 35 is made of brass having good conductivity. That is, the linear expansion coefficient of the case member 3 described above is substantially equal to that of the connection member 35 made of brass.

また、この電子回路装置1は、ケース部材3内に充填されてケース部材3及び2つの回路基板5,7を一体的に固定する樹脂モールド部37を備えている。この樹脂モールド部37は、ウレタン樹脂により形成されており、2つの回路基板5,7やこれらに搭載された各種電子部品を埋設している。すなわち、この樹脂モールド部37は、回路基板5,7や各種電子部品からなる電子回路装置1の電気回路の防湿対策として形成されるものであり、回路基板5,7や各種電子部品を保護する役割を果たしている。なお、第2の回路基板7を固定する固定用ネジ29の雌ねじ部33及び第2の回路基板7に搭載された操作スイッチ31の操作ボタン31aは、樹脂モールド部37の外側に配置されている。   The electronic circuit device 1 further includes a resin mold portion 37 that is filled in the case member 3 and integrally fixes the case member 3 and the two circuit boards 5 and 7. The resin mold part 37 is made of urethane resin, and embeds two circuit boards 5 and 7 and various electronic components mounted on them. That is, the resin mold portion 37 is formed as a moisture-proof measure for the electric circuit of the electronic circuit device 1 including the circuit boards 5 and 7 and various electronic components, and protects the circuit boards 5 and 7 and various electronic components. Playing a role. The female screw portion 33 of the fixing screw 29 for fixing the second circuit board 7 and the operation button 31 a of the operation switch 31 mounted on the second circuit board 7 are disposed outside the resin mold portion 37. .

以下、上記のように構成された電子回路装置1の製造方法について説明する。
はじめに、樹脂材料からなるケース部材3を所定の金型(不図示)を用いて成形する。この際には、第1の支柱13及び第2の支柱15の雌ねじ部17,19を構成する筒状部材を上記金型内の所定位置に設けた状態で、溶融した樹脂を金型内部に流し込む。これにより、各筒状部材が第1の支柱13及び第2の支柱15の先端面13a,15aから窪んだ穴に固定されることになる。
また、第1の回路基板5の対向面5aに接続部材35の他端を半田付け等により接合させて、接続部材35を上記対向面5aに立設させる。
Hereinafter, a method for manufacturing the electronic circuit device 1 configured as described above will be described.
First, the case member 3 made of a resin material is molded using a predetermined mold (not shown). At this time, in a state where the cylindrical members constituting the female thread portions 17 and 19 of the first support column 13 and the second support column 15 are provided at predetermined positions in the mold, the molten resin is put into the mold. Pour. Thereby, each cylindrical member is fixed to the hole recessed from the front end surfaces 13a and 15a of the first support column 13 and the second support column 15.
Further, the other end of the connecting member 35 is joined to the facing surface 5a of the first circuit board 5 by soldering or the like, and the connecting member 35 is erected on the facing surface 5a.

次いで、第1の回路基板5の挿通孔21に第2の支柱15を挿通させて、第1の回路基板5を第1の支柱13の先端面13a及び第2の支柱15の段差面15bに当接させる。これにより、ケース部材3に対して第1の回路基板5が位置決めされることになる。その後、固定用ネジ23を第1の支柱13の雌ねじ部17に螺合させることで、第1の回路基板5がケース部材3に固定されることになる。
上記第1の回路基板5の位置決めが完了した後には、第2の支柱15の先端面15aに第2の回路基板7を配置すると共に固定用ネジ29を第2の支柱15の雌ねじ部19に螺合させる。これにより、第2の回路基板7がケース部材3に固定される、すなわち、ケース部材3に対して第2の回路基板7が位置決めされることになる。
Next, the second support column 15 is inserted into the insertion hole 21 of the first circuit board 5, and the first circuit board 5 is inserted into the tip surface 13 a of the first support column 13 and the step surface 15 b of the second support column 15. Make contact. As a result, the first circuit board 5 is positioned with respect to the case member 3. Thereafter, the first circuit board 5 is fixed to the case member 3 by screwing the fixing screw 23 into the female screw portion 17 of the first support column 13.
After the positioning of the first circuit board 5 is completed, the second circuit board 7 is disposed on the distal end surface 15a of the second support column 15, and the fixing screw 29 is attached to the female screw portion 19 of the second support column 15. Screw together. Thereby, the second circuit board 7 is fixed to the case member 3, that is, the second circuit board 7 is positioned with respect to the case member 3.

以上により、2つの回路基板5,7が相互に間隔を隔てた状態でケース部材3に固定されることになる。なお、上記間隔は、第2の支柱15の先端面15aから段差面15bまでの長さを適宜調整することで容易に設定することができる。
また、第2の回路基板7を先端面15aに固定した状態においては、接続部材35の一端が第2の回路基板7に到達しており、この接続部材35の一端を第2の回路基板7に半田付け等により接合させる。これにより、2つの回路基板5,7が相互に電気接続されることになる。
これら2つの回路基板5,7をケース部材3に取り付けた後には、ケース部材3内にウレタン樹脂を充填して、2つの回路基板5,7やこれらに搭載された各種電子部品を埋設する。以上により、電子回路装置1の製造が終了する。
As described above, the two circuit boards 5 and 7 are fixed to the case member 3 in a state of being spaced apart from each other. In addition, the said space | interval can be easily set by adjusting suitably the length from the front end surface 15a of the 2nd support | pillar 15 to the level | step difference surface 15b.
Further, in a state where the second circuit board 7 is fixed to the distal end surface 15 a, one end of the connection member 35 reaches the second circuit board 7, and one end of the connection member 35 is connected to the second circuit board 7. To be joined by soldering or the like. As a result, the two circuit boards 5 and 7 are electrically connected to each other.
After these two circuit boards 5 and 7 are attached to the case member 3, the case member 3 is filled with urethane resin, and the two circuit boards 5 and 7 and various electronic components mounted thereon are embedded. Thus, the manufacture of the electronic circuit device 1 is completed.

以上のように製造された電子回路装置1の使用に際して、操作スイッチの操作ボタンを押下した場合には、この押下操作に基づく外力によって第2の回路基板7を撓ませるような応力が第2の回路基板7に発生する。ここで、2つの回路基板5,7は各々独立してケース部材3に固定されているため、また、ウレタン樹脂からなる樹脂モールド部37が弾性変形してその応力を吸収するため、上記応力が第1の回路基板5に伝達されることはない。
また、第2の回路基板7が撓む際には2つの回路基板5,7の間隔が変化するが、この間隔の変化に追従するように接続部材35の屈曲部35aが弾性変形するため、接続部材35と各回路基板5,7との接合部分に応力が発生することを防止できる。
When the electronic circuit device 1 manufactured as described above is used, when the operation button of the operation switch is pressed, a stress that causes the second circuit board 7 to bend by an external force based on the pressing operation is the second. It occurs on the circuit board 7. Here, since the two circuit boards 5 and 7 are each independently fixed to the case member 3 and the resin mold portion 37 made of urethane resin is elastically deformed to absorb the stress, the stress is There is no transmission to the first circuit board 5.
Further, when the second circuit board 7 bends, the interval between the two circuit boards 5 and 7 changes, but the bent portion 35a of the connecting member 35 elastically deforms so as to follow the change in the interval. It is possible to prevent stress from being generated at the joint portion between the connection member 35 and the circuit boards 5 and 7.

また、この電子回路装置1において、ケース部材3が熱に応じて膨張収縮した際には、第2の支柱15も伸縮するため、その先端面15aと段差面15bとの距離が変化する、すなわち、2つの回路基板5,7同士の間隔が変化する。ここで、ケース部材3は、接続部材35の線膨張係数と略等しい樹脂材料により形成されているため、接続部材35も第2の支柱15と同様に伸縮する。したがって、この第2の支柱15の伸縮に基づいて接続部材35と各回路基板5,7との接合部分や接続部材35自体に応力が発生することを防止できる。   Further, in the electronic circuit device 1, when the case member 3 expands and contracts in response to heat, the second support column 15 also expands and contracts, so that the distance between the tip surface 15a and the step surface 15b changes. The interval between the two circuit boards 5 and 7 changes. Here, since the case member 3 is formed of a resin material substantially equal to the linear expansion coefficient of the connection member 35, the connection member 35 expands and contracts similarly to the second support column 15. Therefore, it is possible to prevent stress from being generated in the joint portion between the connection member 35 and the circuit boards 5 and 7 and the connection member 35 itself based on the expansion and contraction of the second support column 15.

上記のように、この電子回路装置1によれば、2つの回路基板5,7はケース部材3に形成された第2の支柱に各々独立して取り付けられているため、外力によって第2の回路基板7を撓ませるような応力が発生しても、第1の回路基板5に応力が発生することを防止できる。
また、2つの回路基板5,7を各々ケース部材3に固定するだけでケース部材3に形成された第2の支柱15に対する2つの回路基板5,7の位置決めができ、相互に隙間を介して配置された2つの回路基板5,7を備える電子回路装置1を製造することが可能となる。したがって、電子回路装置1の製造効率向上を図ることができる。すなわち、従来のように、2つの回路基板の間に配される別途支柱や各回路基板を支柱に締結するネジが不要となり、電子回路装置1の構成部品点数を削減することができるため、電子回路装置1の製造工程数の削減を図ることができる。
As described above, according to the electronic circuit device 1, the two circuit boards 5 and 7 are independently attached to the second support column formed on the case member 3, so that the second circuit is generated by an external force. Even if a stress that causes the substrate 7 to bend is generated, it is possible to prevent the stress from being generated on the first circuit board 5.
In addition, the two circuit boards 5 and 7 can be positioned with respect to the second support column 15 formed on the case member 3 by simply fixing the two circuit boards 5 and 7 to the case member 3 respectively, with a gap therebetween. The electronic circuit device 1 including the two circuit boards 5 and 7 arranged can be manufactured. Therefore, the manufacturing efficiency of the electronic circuit device 1 can be improved. That is, as in the prior art, there is no need for a separate support disposed between two circuit boards or screws for fastening each circuit board to the support, and the number of components of the electronic circuit device 1 can be reduced. The number of manufacturing steps of the circuit device 1 can be reduced.

さらに、第1の回路基板5の対向面5aに立設された接続部材35の一端と、第2の支柱15の先端に固定された第2の回路基板7とを接合するだけで2つの回路基板5,7を電気接続することができるため、さらに簡便に電子回路装置1を製造することが可能となる。
また、熱に応じた第2の支柱15の伸縮に基づいて接続部材35と各回路基板5,7との接合部分や接続部材35自体に応力が発生することが無いため、上記接合部分で破断したりや接続部材35が断線することを防止できる。したがって、2つの回路基板5,7間の電気接続を確実に保持することができる。
Furthermore, two circuits can be obtained simply by joining one end of the connecting member 35 erected on the facing surface 5 a of the first circuit board 5 and the second circuit board 7 fixed to the tip of the second support column 15. Since the substrates 5 and 7 can be electrically connected, the electronic circuit device 1 can be more easily manufactured.
In addition, since no stress is generated in the connection portion between the connection member 35 and the circuit boards 5 and 7 and the connection member 35 itself based on the expansion and contraction of the second support column 15 corresponding to heat, the connection member 35 itself is broken. Or disconnection of the connection member 35 can be prevented. Therefore, the electrical connection between the two circuit boards 5 and 7 can be reliably maintained.

さらに、第2の回路基板7を第1の回路基板5よりも小さく形成しておくことにより、第1の回路基板5に操作スイッチ31を設けた場合と比較して、押下操作に基づく回路基板の撓み量を小さくすることができる。さらに、操作スイッチ31を第2の支柱15の近傍に配置することで、第2の回路基板7の撓み量をさらに小さくすることができる。
また、第1の支柱13の先端面13aによって第1の回路基板5の周縁が支持されることに加えて、第2の支柱15の段差面15bによって第1の回路基板5の周縁の間も支持されているため、ケース部材3に固定された第1の回路基板5がその自重や搭載される各種電子部品によって撓むことも防止できる。
Furthermore, by forming the second circuit board 7 smaller than the first circuit board 5, the circuit board based on the pressing operation is compared with the case where the operation switch 31 is provided on the first circuit board 5. Can be reduced. Furthermore, the amount of bending of the second circuit board 7 can be further reduced by arranging the operation switch 31 in the vicinity of the second support column 15.
Further, in addition to the peripheral edge of the first circuit board 5 being supported by the tip surface 13 a of the first support column 13, the gap between the peripheral edges of the first circuit board 5 is also provided by the step surface 15 b of the second support column 15. Since it is supported, it is possible to prevent the first circuit board 5 fixed to the case member 3 from being bent by its own weight or various electronic components to be mounted.

さらに、第2の回路基板7をケース部材3に固定する固定用ネジに樹脂モールド部37から外方に露出する雌ねじ部33を形成しておくことにより、電子回路装置1を別個のフレームFに取り付ける際に、雌ねじ部33を利用してフレームFにネジ止めすることが可能となる。すなわち、電子回路装置1をフレームFに取り付けるための連結機構として雌ねじ部33を利用することができるため、上記連結機構を電子回路装置1に別個に設ける必要が無くなり、電子回路装置1の構成部品点数をさらに削減することができる。   Further, by forming a female screw portion 33 exposed outward from the resin mold portion 37 on a fixing screw for fixing the second circuit board 7 to the case member 3, the electronic circuit device 1 is mounted on a separate frame F. When attaching, it becomes possible to screw to the frame F using the female screw portion 33. That is, since the female screw portion 33 can be used as a connecting mechanism for attaching the electronic circuit device 1 to the frame F, it is not necessary to separately provide the connecting mechanism in the electronic circuit device 1, and the components of the electronic circuit device 1 are eliminated. The score can be further reduced.

なお、上記の実施の形態において、第1の支柱13及び第2の支柱15の雌ねじ部17,19を構成する筒状部材は、ケース部材3を成形すると同時に第1の支柱13及び第2の支柱15に固定されるとしたが、これに限ることはなく、例えば、ケース部材3を成形した後に、第1の支柱13及び第2の支柱15の先端面13a,15aに形成された穴にそれぞれ圧入するとしても構わない。
また、第1の支柱13及び第2の支柱15の雌ねじ部17,19は金属製の筒状部材により構成されるとしたが、これに限ることはなく、第1の支柱13及び第2の支柱15に直接形成するとしても構わない。
In the above-described embodiment, the cylindrical members constituting the female thread portions 17 and 19 of the first support column 13 and the second support column 15 form the case member 3 and simultaneously the first support column 13 and the second support member 13. Although it was fixed to the support | pillar 15, it is not restricted to this, For example, after shape | molding the case member 3, it is in the hole formed in the front end surfaces 13a and 15a of the 1st support | pillar 13 and the 2nd support | pillar 15. You may press-fit each.
Moreover, although the internal thread parts 17 and 19 of the 1st support | pillar 13 and the 2nd support | pillar 15 were comprised with the metal cylindrical members, it is not restricted to this, The 1st support | pillar 13 and the 2nd support | pillar It may be formed directly on the column 15.

さらに、ケース部材3は、PBT等のように線膨張係数が20〜80ppm/℃となる樹脂材料により形成されるとしたが、これに限ることはなく、少なくとも接続部材35の線膨張係数と略等しい樹脂材料によって形成されていればよい。
また、接続部材35の中途部には、屈曲部35aが形成されるとしたが、これに限ることはなく、特に形成されていなくてもよい。この構成の場合でも、ケース部材3を接続部材35と略等しい線膨張係数を有する樹脂材料により形成することで、ケース部材3が熱変形しても、各回路基板5,7と接続部材35との接合部分に応力が発生することを抑制できる。
Furthermore, the case member 3 is formed of a resin material having a linear expansion coefficient of 20 to 80 ppm / ° C. such as PBT. However, the case member 3 is not limited to this, and at least approximately the linear expansion coefficient of the connection member 35. What is necessary is just to be formed with the same resin material.
Moreover, although the bent part 35a was formed in the middle part of the connection member 35, it is not restricted to this, It does not need to be formed especially. Even in this configuration, the case member 3 is formed of a resin material having a linear expansion coefficient substantially equal to that of the connection member 35, so that even if the case member 3 is thermally deformed, the circuit boards 5 and 7 and the connection member 35 It can suppress that a stress generate | occur | produces in this junction part.

さらに、第1の回路基板5は、固定用ネジ25及び第1の支柱13の雌ねじ部17によりケース部材3に固定されるとしたが、第1の回路基板5を樹脂モールド部37内に埋設するだけでもケース部材3に固定することが可能であるため、上記固定用ネジ25及び第1の支柱13の雌ねじ部17を特に設けなくてもよい。
また、樹脂モールド部37は、ウレタン樹脂により形成されるとしたが、これに限ることはなく、少なくとも弾性変形可能な樹脂材料により形成されていればよい。また、回路基板5,7や各種電子部品の保護を考慮しない場合には、特に樹脂モールド部37を形成しなくても構わない。
Further, although the first circuit board 5 is fixed to the case member 3 by the fixing screw 25 and the female screw part 17 of the first support column 13, the first circuit board 5 is embedded in the resin mold part 37. The fixing screw 25 and the female thread portion 17 of the first support column 13 do not need to be provided in particular because it is possible to fix the case member 3 to the case member 3.
Moreover, although the resin mold part 37 was formed with urethane resin, it is not restricted to this, It should just be formed with the resin material which can be elastically deformed at least. In addition, when the protection of the circuit boards 5 and 7 and various electronic components is not taken into consideration, the resin mold portion 37 may not be particularly formed.

さらに、電子回路装置1は、2つの回路基板5,7を備えるとしたが、これに限ることはなく、3つ以上の回路基板を備えるとしても構わない。この構成の場合には、上記実施形態の段差面15bと同様に、第2の支柱15に複数の段差面を形成しておき、第2の支柱15の先端に固定される1つの回路基板を除いて、各段差面に回路基板を当接させればよい。
以上、本発明の実施形態について図面を参照して詳述したが、具体的な構成はこの実施形態に限られるものではなく、本発明の要旨を逸脱しない範囲の設計変更等も含まれる。
Furthermore, although the electronic circuit device 1 includes the two circuit boards 5 and 7, the electronic circuit device 1 is not limited thereto, and may include three or more circuit boards. In the case of this configuration, similarly to the step surface 15b of the above embodiment, a plurality of step surfaces are formed on the second support column 15, and one circuit board fixed to the tip of the second support column 15 is provided. Except for this, the circuit board may be brought into contact with each step surface.
As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.

この発明の実施形態に係る電子回路装置の側断面図である。1 is a side sectional view of an electronic circuit device according to an embodiment of the present invention.

符号の説明Explanation of symbols

1 電子回路装置
3 ケース部材
5 第1の回路基板(一方の回路基板)
5a 対向面
7 第2の回路基板(他方の回路基板)
7a 上面
9a 底面
15 第2の支柱
15b 段差面
21 挿通孔
31 操作スイッチ
35 接続部材

DESCRIPTION OF SYMBOLS 1 Electronic circuit apparatus 3 Case member 5 1st circuit board (one circuit board)
5a Opposing surface 7 Second circuit board (the other circuit board)
7a Upper surface 9a Bottom surface 15 Second support column 15b Stepped surface 21 Insertion hole 31 Operation switch 35 Connection member

Claims (4)

相互に電気的に接続される少なくとも2つの回路基板と、これら少なくとも2つの回路基板を底面側から順次重ねて収容する箱状のケース部材とを備える電子回路装置であって、
該ケース部材に、前記底面から一体的に延びる支柱が形成されており、
該支柱の延出方向の中途部に、先端側と面する段差面が形成され、
一方の回路基板が、その厚さ方向に貫通して前記支柱を挿通させる挿通孔を備えると共に前記段差面に当接するように構成され、
他方の回路基板が、前記支柱の先端側に固定されることを特徴とする電子回路装置。
An electronic circuit device comprising at least two circuit boards that are electrically connected to each other and a box-shaped case member that houses the at least two circuit boards stacked in order from the bottom side,
The case member is formed with struts extending integrally from the bottom surface,
A stepped surface facing the tip side is formed in the middle of the extending direction of the column,
One of the circuit boards is configured to have an insertion hole that penetrates in the thickness direction and allows the post to pass through, and is in contact with the stepped surface.
An electronic circuit device, wherein the other circuit board is fixed to a front end side of the support column.
前記底面と同じ方向に面する前記他方の回路基板の上面に、押下操作可能な操作スイッチが搭載されていることを特徴とする請求項1に記載の電子回路装置。   The electronic circuit device according to claim 1, wherein an operation switch that can be pressed is mounted on an upper surface of the other circuit board facing in the same direction as the bottom surface. 前記他方の回路基板に対向する前記一方の回路基板の対向面から、前記他方の回路基板まで延びる棒状の接続部材が設けられ、
該接続部材によって前記2つの回路基板が相互に電気接続されることを特徴とする請求項1又は請求項2に記載の電子回路装置。
A rod-shaped connecting member extending from the facing surface of the one circuit board facing the other circuit board to the other circuit board is provided;
The electronic circuit device according to claim 1, wherein the two circuit boards are electrically connected to each other by the connection member.
前記ケース部材が、前記接続部材の線膨張係数と略等しい樹脂材料により形成されていることを特徴とする請求項3に記載の電子回路装置。

The electronic circuit device according to claim 3, wherein the case member is formed of a resin material that is substantially equal to a linear expansion coefficient of the connection member.

JP2006062855A 2006-03-08 2006-03-08 Electronic-circuit apparatus Pending JP2007242867A (en)

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Publication number Priority date Publication date Assignee Title
JP2009158642A (en) * 2007-12-26 2009-07-16 Fuji Electric Device Technology Co Ltd Semiconductor device
US8063319B2 (en) 2008-10-28 2011-11-22 Sumitomo Wiring Systems, Ltd. Electrical junction box and method for assembling the same
JP2013038134A (en) * 2011-08-04 2013-02-21 Sony Computer Entertainment Inc Electronic apparatus
EP3833170A1 (en) * 2019-12-04 2021-06-09 Nabtesco Corporation Electronic device for aircraft and method of assembling the same

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JPH08213752A (en) * 1995-02-03 1996-08-20 Fujitsu Ten Ltd Connection structure for board
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JP2009158642A (en) * 2007-12-26 2009-07-16 Fuji Electric Device Technology Co Ltd Semiconductor device
US8063319B2 (en) 2008-10-28 2011-11-22 Sumitomo Wiring Systems, Ltd. Electrical junction box and method for assembling the same
JP2013038134A (en) * 2011-08-04 2013-02-21 Sony Computer Entertainment Inc Electronic apparatus
EP3833170A1 (en) * 2019-12-04 2021-06-09 Nabtesco Corporation Electronic device for aircraft and method of assembling the same
US11672097B2 (en) 2019-12-04 2023-06-06 Nabtesco Corporation Electronic device for aircraft and method of assembling the same

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