JP2007187619A - Wafer-type temperature sensor, temperature measuring device, thermal treatment apparatus and temperature measuring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer type temperature sensor where the measuring process of temperature can be automated and the accuracy of measurement will not degrade, even at a high temperature. <P>SOLUTION: The wafer-type temperature sensor 11 comprises a wafer 12, a plurality of temperature sensors 13a, 13b, ... (hereinafter, to be generically called "sensor 13") for dividing the area on the wafer 12 into a plurality of regions which are arranged at partitioned each regions X, Y, ..., and detect the temperature on the wafer 12, and a contact 15, which outputs the sensor output of each of the plurality of the temperature sensors 13 as an output signal. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wafer type temperature sensor, a temperature measurement apparatus using the wafer type temperature sensor, a heat treatment apparatus having a temperature measurement function, and a temperature measurement method, for example, an apparatus and method for measuring the temperature of a heating plate for heating a wafer.

  In the photolithography process in the manufacture of semiconductor devices, heat treatment (pre-baking) after applying a resist solution to the surface of a semiconductor wafer (hereinafter referred to as “wafer”), or heat treatment (post-posting) after pattern exposure. Various heat treatments such as exposure baking) and cooling treatment performed after each heat treatment are performed by, for example, a heating / cooling apparatus in which the wafer is maintained at a predetermined temperature.

  8 is a longitudinal sectional view of a conventional heating / cooling apparatus 101, FIG. 9 is a transverse sectional view taken along line AA in FIG. 8, and FIG. 10 is a sectional view seen from the right side of FIG.

  In FIG. 8, a cooling plate 103 for cooling and a heating plate 104 for heating are provided side by side in a housing 102 of the heating / cooling device 101. The cooling plate 103 and the heating plate 104 are formed in a thick disc shape. The cooling plate 103 incorporates, for example, a Peltier element (not shown) and can cool the cooling plate 103 to a predetermined temperature.

  Further, below the cooling plate 103, when the wafer is placed on the cooling plate 103, lift pins 105 are provided for supporting and lifting the wafer. The elevating pins 105 are movable up and down with respect to the elevating drive mechanism 106, and are configured to penetrate the cooling plate 103 from below the cooling plate 103 and protrude onto the cooling plate 103.

  On the other hand, the heating plate 104 includes a heater 107 and a heating plate temperature sensor 108. The temperature of the heating plate 104 is determined based on the temperature detected by the controller 109 by the heating plate temperature sensor 108. The set temperature is maintained by controlling the amount. Below the heating plate 104, as with the cooling plate 103, an elevating pin 110 and an elevating drive mechanism 111 are provided, and the elevating pin 110 allows the wafer to be placed on the heating plate 104.

  Further, as shown in FIG. 9, a transfer device 112 is provided between the cooling plate 103 and the heating plate 104 to transfer the wafer to the heating plate 104 and to transfer the wafer from the heating plate 104 to the cooling plate 103. It has been. On the cooling plate 103 side of the casing 102 of the heating / cooling device 101, a transfer port 113 for carrying the wafer into and out of the heating / cooling device 101 is provided.

  In addition, a shutter 114 for maintaining the atmosphere in the heating / cooling apparatus 101 at a predetermined atmosphere is provided at the transport port 113. A transfer arm 115 is provided so as to face the transfer port 113, and when the shutter 114 is opened, the wafer is transferred from the transfer port 113 by the transfer arm 115 and transferred onto the heating plate 104 by the transfer device 112. Is done.

  Such a heating / cooling device 101 measures the temperature distribution of the wafer placed on the heating plate 104 in advance to grasp the temperature characteristics on the heating plate 104, and corrects appropriately based on the result. It is important to uniformly heat the wafer on the heating plate 104. Therefore, a method for measuring the temperature distribution of the wafer on the heating plate 104 has been described in Japanese Patent Application Laid-Open No. 2002-124457 (Patent Document 1).

  According to the publication, as shown in FIG. 11, a wafer type including a wafer 121, a plurality of temperature sensors 122 arranged on the upper surface of the wafer 121, and a cable 123 that outputs temperature information detected by each temperature sensor 122. As shown in FIG. 10, the temperature sensor 120 is placed on the transport device 112, and the cable 123 is connected to the transmission device 116 disposed outside the heating / cooling device 101. When the wafer type temperature sensor 120 is automatically conveyed onto the heating plate 104, temperature information on the wafer 121 detected by each temperature sensor 122 is transmitted to a measuring instrument (not shown) via the transmission device 116, and the wafer 121 is transmitted. The upper temperature distribution can be measured.

  As another example of measuring the temperature distribution on the heating plate 104, as shown in FIG. 12, for example, a transmission device 134 is provided on a temperature measurement wafer 131, and each temperature sensor 132 and the transmission device 134 are connected to a cable 133. The temperature information detected by each temperature sensor 132 is transmitted wirelessly by the wireless wafer-type temperature sensor 130 connected in the above, and a receiving device is provided inside or outside the heating / cooling device 101 to transmit the wirelessly transmitted data. It may be configured to receive.

Furthermore, as another example of measuring the temperature distribution on the heating plate 104, Japanese Patent Laid-Open No. 2002-124457 (Patent Document 1) discloses a first example in which a plurality of temperature sensors 142 are arranged as shown in FIG. An example of a wafer type temperature sensor 140 is described in which a wafer 141 and a second wafer 143 on which a transmission device 144 is arranged are connected by a cable 145.
JP 2002-124457 A

  When the temperature on the heating plate 104 shown in FIGS. 10 and 11 is measured, an operator must manually place the wafer type temperature sensor 120 on the transfer arm 115 and connect the cable 123 to the transmitter 116. Therefore, in order to measure the temperature distribution, it is necessary to temporarily stop the heating / cooling apparatus 101, which is inefficient. In addition, since the cable 123 connecting the transmitter 116 and the wafer temperature sensor 120 passes through the transfer port 113, there is a problem that the heating / cooling device 101 cannot be completely sealed.

  In addition, when the wafer type temperature sensor 130 as shown in FIG. 12 is used, the temperature data detected by each temperature sensor 132 is an analog value. It is necessary to incorporate an A / D converter for conversion into data. However, since the A / D converter has the characteristic that the conversion accuracy deteriorates when the temperature rises, even in the atmosphere where the temperature rises to 250 ° C., even if the temperature can be measured up to about 150 ° C. Cannot be used.

  Further, in the case of the wafer type temperature sensor 140 as shown in FIG. 13, only the temperature measurement wafer 141 is placed on the heating plate 104, and the information transmission wafer 143 is separated from the temperature measurement wafer 141. Since it can be separated from the heating plate 104, the conversion accuracy of the A / D converter built in the transmission device 144 does not deteriorate due to the high temperature.

  However, when the wafer type temperature sensor 140 is transported into the heating / cooling device 101, two automatic transport means for transporting the temperature measuring wafer 141 and the information transmitting wafer 143 are required, and the existing transport device 112 and There is a problem that the transfer arm 115 cannot be used.

  Accordingly, an object of the present invention is to provide a wafer type temperature sensor that can automate the temperature measurement process and that does not deteriorate the measurement accuracy even at high temperatures, a temperature measurement device using the wafer type temperature sensor, and a heat treatment having a temperature measurement function. An apparatus and a temperature measurement method are provided.

  The wafer type sensor according to the present invention includes a wafer, a wafer upper surface divided into a plurality of regions, a plurality of temperature sensors arranged in each of the divided regions, and a plurality of temperature sensors electrically connected to the wafer surface. And a contact that is connected to an external contact and outputs sensor outputs of a plurality of temperature sensors as output signals.

  By adopting the above-described configuration, it is possible to automate the process of loading and unloading the wafer type temperature sensor using an existing transfer device. As a result, it is possible to eliminate a manual process such as cable connection at the time of temperature measurement, thereby improving the working efficiency of the apparatus. Moreover, since a cable for connecting the inside and outside of the apparatus is not required, the apparatus can be sealed.

  Preferably, the wafer type sensor is further provided with selection means for receiving sensor outputs of a plurality of temperature sensors and outputting the sensor output of any one of the temperature sensors to a contact in accordance with a selection signal given from an external device. Thereby, the number of contacts on the wafer surface can be reduced. At the same time, the number of contacts corresponding to the contacts provided on the apparatus side can be reduced.

  Preferably, the wafers are grouped into one or more groups each including one or more temperature sensors, and the selection unit is provided for each group and selects one or more groups for selecting sensor outputs of the temperature sensors in the group. A separate selection unit is included, and the contact point is provided for each group selection unit, and includes one or more group contact points to which the sensor output from the corresponding group selection unit is given. Although all the temperature sensors may be connected to one selection means, the wiring between the temperature sensor and the selection means can be simplified by providing a plurality of selection means for each group on the upper surface of the wafer.

  In one embodiment, the contact and the temperature sensor are provided on the same surface of the wafer. In another embodiment, the contact and the temperature sensor are provided on different surfaces of the wafer.

  The contact includes, for example, an output terminal that outputs the sensor output of the temperature sensor as an output signal, a selection signal terminal that receives a selection signal from an external device, and a power supply terminal that receives supply of a power supply voltage from an external power supply. When the contact configured as described above is connected to the external contact, the output terminal, the selection signal terminal, and the power supply terminal are respectively connected to corresponding terminals on the external contact side.

  The temperature measuring device according to the present invention divides the wafer, the wafer upper surface into a plurality of regions, and is electrically connected to the plurality of temperature sensors arranged in each divided region, and the plurality of temperature sensors on the wafer surface, A wafer type temperature sensor having a contact that outputs sensor outputs of a plurality of temperature sensors as an output signal, a contact that can contact the contact of the wafer type temperature sensor, and a plurality of contacts according to whether the contact is connected to the contact Discriminating means for discriminating the temperature of each region on the wafer based on the sensor output of the temperature sensor. In the temperature measuring apparatus having the above configuration, the temperature sensor and the discriminating means are connected by wire, so that a highly accurate measurement result can be obtained even at high temperatures.

  The heat treatment apparatus according to the present invention is a heat treatment apparatus having a temperature measurement function. Specifically, the wafer includes a wafer, a plurality of temperature sensors disposed on the wafer upper surface, and a contact that is electrically connected to the plurality of temperature sensors on the wafer surface and outputs sensor outputs of the plurality of temperature sensors as output signals. A housing that can accommodate a mold temperature sensor, a plate that heats or cools the wafer in the housing, a contact that is disposed inside the housing and that can contact the contacts of the wafer temperature sensor, and is disposed outside the housing. And a data management unit for managing the sensor output from the wafer type sensor.

An embodiment of the data management unit includes a determination unit that determines the temperature of each region on the wafer based on sensor outputs of a plurality of temperature sensors in response to the contact being connected to the contact. Another embodiment of the data management unit includes temperature correction means for correcting the temperature of the plate to keep the temperature distribution of each region on the wafer constant based on the determination result by the determination means.

With the above configuration, the temperature measurement of the wafer in the heat treatment apparatus can be automated. Further, since the wafer type temperature sensor and the data management unit outside the housing are connected by wire, it is not necessary to use an A / D converter, and a highly accurate measurement result can be obtained even at high temperatures.

  As one embodiment, the heat treatment apparatus further includes a lid member that can be moved up and down above the wafer temperature sensor. The contact is provided on the upper surface of the wafer, and the contact is provided on the lower surface of the lid member so as to face the contact, and contacts the contact when the lid member is lowered.

  In another embodiment, the heat treatment apparatus further includes pins that protrude from the plate and support the wafer type temperature sensor. The contact is provided at the tip of the pin, the contact is provided on the lower surface of the wafer so as to face the contact, and the contact contacts the contact when the wafer type temperature sensor is placed on the pin. .

  The connection between the contact and the contact in the heat treatment apparatus according to the present invention employs a receptacle system in which the connection is made when both are in contact with each other and the connection is released when the both are separated. Thereby, the connection between the contact and the contact can be automated.

  The temperature measurement method according to the present invention is a method for measuring the temperature on a wafer placed in a heat treatment apparatus. Specifically, as a first step, recipe parameters including a heating time and a heating temperature are input to the heat treatment apparatus. As a second step, the wafer is divided into a plurality of regions on the upper surface of the wafer, a plurality of temperature sensors arranged in each of the divided regions, a plurality of temperature sensors electrically connected to the wafer surface, and a plurality of temperature sensors A wafer type temperature sensor having a contact for outputting the sensor output of the temperature sensor as an output signal is carried into the heat treatment apparatus. As a third step, the contact of the wafer type temperature sensor and the contact provided in the heat treatment apparatus are connected. As a fourth step, sensor outputs of a plurality of temperature sensors are transmitted via contact points to a determination unit that is provided outside the heat treatment apparatus and determines the temperature of each region on the wafer. As a fifth step, the connection between the contact and the contact is released, and the wafer type temperature sensor is carried out of the heat treatment apparatus.

  The above temperature measurement method does not require manual work by an operator, and can automatically perform all the steps. As a result, since it is not necessary to stop the heat treatment apparatus every time the temperature is measured, the work efficiency of the heat treatment apparatus is improved.

  According to the present invention, the temperature measurement process can be automated and the measurement accuracy does not deteriorate even at high temperatures, a temperature measurement device using the wafer temperature sensor, a heat treatment device having a temperature measurement function, and a temperature A measurement method can be obtained.

  1 to 6, a wafer type temperature sensor according to an embodiment of the present invention, a temperature measurement apparatus using the wafer type temperature sensor, a heat treatment apparatus having a temperature measurement function, and a temperature in such a heat treatment apparatus A measurement method will be described.

  First, FIG. 1 is a view showing a wafer type temperature sensor 11 according to an embodiment of the present invention. This wafer-type temperature sensor 11 divides the wafer 12 and the upper surface of the wafer 12 into a plurality of regions, and is arranged in each of the divided regions X, Y. 13a, 13b (hereinafter collectively referred to as "temperature sensor 13"), a multiplexer 14 as a selection means, and a contact 15 that outputs the sensor output of the temperature sensor 13 via the multiplexer 14 as an output signal. Prepare. The temperature sensor 13, the multiplexer 14, and the contact 15 are disposed on the upper surface of the wafer 12, and the temperature sensor 13 and the multiplexer 14, and the multiplexer 14 and the contact 14 are electrically connected to each other.

  FIG. 2 is a circuit diagram of the multiplexer 14 shown in FIG. The multiplexer 14 selects a plurality of sensor connection terminals 14 a to which the temperature sensor 13 is connected, an output terminal 14 b that outputs the sensor output of the selected arbitrary temperature sensor 13 as an output signal, and an arbitrary temperature sensor 13. A plurality of selection signal terminals 14c for receiving signals, a power supply terminal 14d for receiving supply of power supply voltage, and a ground terminal 14e are provided. The output terminal 14b, the selection signal terminal 14c, the power supply terminal 14d, and the ground terminal 14e are connected to the contact 15. The multiplexer 14 outputs the sensor output of the temperature sensor 13 connected to the predetermined sensor connection terminal 14a selected according to the selection signal input to the plurality of selection signal terminals 14c from the output terminal 14b.

  FIG. 3 is a schematic diagram showing terminals of the contact 15 shown in FIG. The contact 15 includes an output terminal 15b that outputs an output signal from the multiplexer 14, a selection signal terminal 15c that receives a selection signal to the multiplexer 14, a power supply terminal 15d that receives supply of a power supply voltage from an external power supply, and a ground terminal 15e. Is provided.

  FIG. 4 is a schematic view of a heat treatment apparatus according to one embodiment of the present invention. The heat treatment apparatus 21 has a basic structure similar to that of the conventional heating / cooling apparatus 101, and includes a cooling plate 23 having elevating pins 25, elevating drive mechanisms 26, and wafer support pins 23 a inside the housing 22, Heater 27, heating plate temperature sensor 28, controller 35, elevating pin 29, elevating drive mechanism 30, and heating plate 24 having wafer support pins 24a, lid 31 disposed above and below heating plate 24, and lid 31 A power supply voltage is applied to the wafer type temperature sensor 11, a lift drive device 31 a that lifts and lowers 31, a contact 32 provided on the lower surface of the lid 31, a data management unit 36 including a logger 33 and a computer 34 outside the housing 22 The heating / cooling device 21 includes an external power supply (not shown) to be supplied. Further, the transport device, the transport port, the shutter, and the transport arm are also provided as in FIG. 9, but illustration thereof is omitted.

  The contact 32 is provided at a position facing the contact 15 when the wafer temperature sensor 11 is placed on the heating plate 24, and has terminals corresponding to the terminals 15b to 15e of the contact 15 shown in FIG. Further, the wiring extending from the contact 32 passes through the inside of the lid 31 and is connected to the logger 33 outside the housing 22 and an external power source.

  The data management unit 36 determines the temperature information collected from the wafer type temperature sensor 11, discriminates the temperature information collected from the wafer type temperature sensor 11, detects unevenness in the temperature distribution on the wafer 12, and detects the temperature of the cooling plate 23 and the heating plate 24. In addition to functioning as a temperature correction means for correcting the above, the data transmission / reception with the wafer type temperature sensor 11 is supervised outside the heating / cooling device 21 such as transmitting a selection signal to the wafer type temperature sensor 11.

  FIG. 5 is a view for explaining a temperature measuring method in one embodiment of the present invention. Referring to FIGS. 5A to 5C, a wafer placed on heating plate 24 using wafer type temperature sensor 11 shown in FIG. 1 and heating / cooling device 21 shown in FIG. A method of measuring the temperature distribution of will be described. In FIG. 5, only the temperature measurement device 37 including the wafer type temperature sensor 11, the contact 32, and the data management unit 36 and some components of the heating / cooling device 21 are illustrated for the sake of simplicity. .

  As a first step of the temperature measuring method, first, recipe parameters are input to the heating / cooling device 21. Specifically, the heating temperature of the heating plate 24, the heating time, the atmosphere in the heating / cooling device 21 or the like is set.

  Next, as a second step, as shown in FIG. 5A, the wafer temperature sensor 11 is transported to the position of the heating plate 24 by the transport device (S1). At this time, the alignment of the wafer-type temperature sensor 11 is adjusted so that the contact 15 is positioned directly below the contact 32. The lift pins 29 protrude from the surface of the heating plate 24, and the wafer type temperature sensor 11 is placed on the lift pins 29.

  Next, as a third step, the contact 15 and the contact 32 are connected. Specifically, the elevating pins 29 are lowered (S2) and placed on the wafer support pins 24a fixed on the heating plate 24. Subsequently, the lid 31 is lowered until the contact 32 contacts the contact 15. At this time, the contact corresponding to each terminal shown in FIG. 3 contacts. In order to make the heat transmitted to the wafer temperature sensor 11 uniform, the wafer support pins 24 a protrude from the surface of the heating plate 24 by about 100 μm.

  Next, as a fourth step, the temperature information of the wafer 12 detected by the wafer type temperature sensor 11 is transmitted to the data management unit 36. Specifically, the heating plate 24 is heated by the heater 27. The temperature of the heating plate 24 is adjusted by the controller 35 based on the temperature of the heating plate temperature sensor 28.

  The temperature measuring device 37 issues a selection signal for selecting an arbitrary temperature sensor 13 from the computer 34. This selection signal is input to the selection signal terminal 14 c of the multiplexer 14 via the selection signal terminal 15 c of the contact 15. From this selection signal, the multiplexer 14 outputs the sensor output of the predetermined temperature sensor 13 as an output signal from the output terminal 14b to the contact 15. This signal is transmitted from the output terminal 15 b of the contact 15 to the logger 33 via the contact 32. The logger 33 calculates and displays the temperature based on the received signal, and outputs the calculated temperature data to the computer 34.

  The computer 34 incorporates a program for calculating a correction value for adjusting the temperature of the heating plate 24 based on the set temperature T of the heating plate 24 and the calculated temperature data, and receives temperature data from the logger 33. For example, the program is automatically executed, and the correction value is calculated according to a certain algorithm. The computer 34 outputs the calculated correction value to the controller 35. The correction value is, for example, an offset value of the temperature detected by the heating plate temperature sensor 28 built in the heating plate 24. In the controller 35 to which the correction value is transmitted, the heating plate temperature sensor 28 is based on the correction value. The heating plate temperature sensor 28 recognizes the same temperature as the measurement temperature of the temperature sensor 13 on the wafer 12.

  Therefore, the controller 35 adjusts the heater 27 built in the heating plate 24 based on the temperature of the heating plate temperature sensor 28 that displays the same temperature as the temperature sensor 13, and finally, in each region on the wafer 13. The temperature detected by the arranged temperature sensor 13 is adjusted so as to approach the set temperature T.

  As a fifth step, the connection between the contact 15 and the contact 32 is released, and the wafer type temperature sensor 11 is carried out. Specifically, by raising the lid 31, the contact 32 is separated from the contact 15 and the connection is released (S5). Thereafter, the elevating pins 29 are raised to a predetermined position (S6), and the wafer type temperature sensor 11 is carried out of the heating / cooling device 21 by the carry-in device (S7).

  FIG. 1 shows an example in which the temperature sensor 13 and the contact 15 are arranged on the same surface of the wafer 12. Next, referring to FIG. 6, the temperature sensor 43 and the contact 45 are arranged on different surfaces of the wafer 42. A wafer type temperature sensor 41 according to another embodiment of the present invention will be described.

  FIG. 6 is a view of the wafer-type temperature sensor 41 as viewed from the lower surface. The wafer type temperature sensor 41 divides the wafer 42 and the upper surface of the wafer 42 into a plurality of regions, and is arranged in each of the divided regions X, Y. 43a, 43b (hereinafter collectively referred to as "temperature sensor 43"), a multiplexer 44 as three selection means provided on the lower surface of the wafer 42, and three contacts connected to each multiplexer 44 45.

  The wafers 42 are grouped into three groups for convenience, and one or more temperature sensors 43, one multiplexer 44, and contacts 45 are arranged in each group. Note that the multiplexer 44 and the contact 45 are the same as those shown in FIGS.

  Next, a temperature measurement device 51 according to another embodiment of the present invention will be described with reference to FIG. The basic configuration of the temperature measuring device 51 is the same as that of the temperature measuring device 37 shown in FIG. 5, and includes a wafer type sensor 41, a contact 55, and a data management unit 56, and heating as shown in FIG. 4. • Located in the cooling device. In FIG. 7, only the heating plate 52 and the wafer support pins 53 are shown as components of the heating / cooling device for the sake of simplicity.

  In the temperature measuring device 51 configured as described above, the contact 55 is provided at the tip of the wafer support pin 53 and is connected to the data management unit 56 arranged outside the heating / cooling device by wiring. Further, the wafer support pins 53 are provided at positions corresponding to the contacts 54 of the wafer type temperature sensor 41 shown in FIG. 6, and as shown in FIG. 7, the wafer type temperature sensor 41 adjusts the alignment by the transfer device. When placed on the heating plate 52, the contact 55 is connected to the contact 43.

  In the wafer type temperature sensor according to the present invention, all the temperature sensors 13 may be connected to one multiplexer 14 like the wafer type temperature sensor 11 shown in FIG. 1, or the wafer type temperature sensor 41 shown in FIG. As described above, the wafers 42 may be grouped into one or more groups, and the temperature sensors 43 belonging to each group may be connected to the multiplexer 44 for each group. Furthermore, a contact may be provided for every sensor without using a multiplexer. At this time, the same number of contacts provided on the lower surface of the lid 31 shown in FIG. 4 and the tips of the wafer support pins 53 shown in FIG. 7 are required at positions corresponding to the respective contacts.

  In each of the above embodiments, as a temperature sensor arranged on the wafer, a conventionally used temperature sensor such as a thermocouple or a resistance temperature detector can be used.

  Furthermore, in each of the above embodiments, an example of measuring the temperature distribution of the wafer placed on the heating plate has been shown, but the temperature distribution of the wafer placed on the cooling plate can also be measured. .

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to the thing of embodiment shown in figure. Various modifications and variations can be made to the illustrated embodiment within the same range or equivalent range as the present invention.

  The present invention is advantageously used for measuring the temperature distribution of a wafer in a semiconductor manufacturing apparatus or the like.

It is a figure which shows the wafer type temperature sensor which concerns on one Embodiment of this invention. It is a circuit diagram of the multiplexer shown in FIG. It is the schematic which shows the terminal of the contact shown in FIG. It is a figure which shows the heat processing apparatus which concerns on one Embodiment of this invention. It is a figure which shows the temperature measuring method which concerns on one Embodiment of this invention, Comprising: (A) is the process of carrying in a wafer type temperature sensor in a heat processing apparatus, (B) is the process of measuring the temperature on a wafer, (C) These are figures which show the process of carrying out a wafer type temperature sensor from a heat processing apparatus. It is a figure which shows the wafer type temperature sensor which concerns on other embodiment of this invention. It is a figure which shows the temperature measuring apparatus which concerns on other embodiment of this invention. It is a longitudinal cross-sectional view of the conventional heating / cooling device. It is a cross-sectional view in AA of FIG. It is the longitudinal cross-sectional view which looked at FIG. 8 from the right side surface. It is a figure which shows an example of the conventional wafer type wired type temperature sensor. It is a figure which shows an example of the conventional wafer type | mold radio | wireless type temperature sensor. It is a figure which shows the other example of the conventional wafer type | mold radio | wireless temperature sensor.

Explanation of symbols

11, 41, 120, 130, 140 Wafer type temperature sensor, 12, 42, 121, 131, 141, 143 Wafer, 13, 13a, 13b, 43, 43a, 43b, 122, 132, 142 Temperature sensor, 14, 44 Multiplexer, 14a Sensor connection terminal, 14b, 15b Output terminal, 14c, 15c Selection signal terminal, 14d, 15d Power supply terminal, 14e, 15e Ground terminal, 15,45 contact, 21,101 Heating / cooling device, 22,102 Housing , 23, 103 Cooling plate, 24, 52, 104 Heating plate, 25, 29, 105, 110 Lifting pin, 26, 30, 31a, 106, 111 Lifting drive device, 27, 107 Heater, 28, 108 Heating plate temperature sensor , 31 Lid, 32, 55 Contact, 33 Logger, 34 Computer, 35, 109 Contro La, 36, 56 Data management unit, 23a, 24a, 53 Wafer support pins, 37, 51 Temperature measuring device, 112 Transfer device, 113 Transfer port, 114 Shutter, 115 Transfer arm, 116, 134, 144 Transmitter, 123 145 cable.

Claims (13)

A wafer,
Dividing the wafer upper surface into a plurality of regions, a plurality of temperature sensors arranged in each of the divided regions;
A wafer type temperature sensor comprising: a contact point electrically connected to the plurality of temperature sensors on the wafer surface and connected to an external contact to output sensor outputs of the plurality of temperature sensors as output signals.   The wafer type sensor further includes selection means for receiving sensor outputs of the plurality of temperature sensors and outputting the sensor output of any one of the temperature sensors to the contact point in response to a selection signal given from an external device. 2. The wafer type temperature sensor according to 1. The wafers are grouped into one or more groups each including one or more temperature sensors,
The selection means includes one or more group-specific selection means that are provided for each group and that select sensor outputs of temperature sensors in the group,
The wafer type temperature sensor according to claim 2, wherein the contact is provided for each of the group selection units, and includes at least one group contact that is provided with a sensor output from the corresponding group selection unit.   The wafer type temperature sensor according to claim 1, wherein the contact point and the temperature sensor are provided on the same surface of the wafer.   The wafer type temperature sensor according to claim 1, wherein the contact point and the temperature sensor are respectively provided on different surfaces of the wafer.   The contact includes an output terminal that outputs a sensor output of the temperature sensor as an output signal, a selection signal terminal that receives a selection signal from an external device, and a power supply terminal that receives a power supply voltage from an external power supply. The wafer type temperature sensor according to any one of 1 to 5. A wafer, a top surface of the wafer is divided into a plurality of regions, a plurality of temperature sensors arranged in each of the divided regions, and the plurality of temperature sensors electrically connected to the wafer surface; A wafer-type temperature sensor having a contact for outputting the sensor output as an output signal;
A contactor capable of contacting a contact of the wafer type temperature sensor;
A temperature measuring apparatus comprising: a determination unit configured to determine the temperature of each region on the wafer based on sensor outputs of the plurality of temperature sensors in response to the contact being connected to the contact. A heat treatment apparatus having a temperature measurement function,
Wafer type comprising a wafer, a plurality of temperature sensors arranged on the upper surface of the wafer, and a contact electrically connected to the plurality of temperature sensors on the wafer surface and outputting sensor outputs of the plurality of temperature sensors as output signals A housing capable of accommodating a temperature sensor;
A plate for heating or cooling the wafer in the housing;
A contact disposed inside the housing and capable of contacting a contact of the wafer-type temperature sensor;
A heat treatment apparatus comprising: a data management unit that is disposed outside the housing and manages sensor output from the wafer-type sensor.   The data management unit includes determination means for determining the temperature of each region on the wafer based on sensor outputs of the plurality of temperature sensors in response to the contact being connected to the contact. Item 9. The heat treatment apparatus according to Item 8.   The said data management part contains the temperature correction means which correct | amends the temperature of the said plate in order to maintain the temperature distribution of each area | region on the said wafer constant based on the determination result by the said determination means. Heat treatment equipment. The heat treatment apparatus further includes a lid member provided to be movable up and down above the wafer type temperature sensor,
The contact is provided on an upper surface of the wafer;
The heat treatment apparatus according to claim 8, wherein the contact is provided on a lower surface of the lid member so as to face the contact, and contacts the contact when the lid member is lowered. The heat treatment apparatus further includes a pin that protrudes from the plate and supports the wafer-type temperature sensor,
The contact is provided at the tip of the pin,
The contact is provided on the lower surface of the wafer so as to face the contact,
The said contactor is a heat processing apparatus in any one of Claims 8-10 which contacts the said contact, when the said wafer type temperature sensor is mounted on the said pin. A method for measuring a temperature on a wafer placed in a heat treatment apparatus,
Inputting recipe parameters including a heating time and a heating temperature for the heat treatment apparatus;
A plurality of temperature sensors which are divided into a plurality of regions on the wafer upper surface and are arranged in each of the divided regions; and the plurality of temperature sensors electrically connected to the plurality of temperature sensors on the wafer surface Carrying a wafer temperature sensor having a contact for outputting the sensor output as an output signal into the heat treatment apparatus;
Connecting the contact point of the wafer-type temperature sensor and a contact provided inside the heat treatment apparatus;
A step of transmitting sensor outputs of the plurality of temperature sensors through the contacts to a determination unit provided outside the heat treatment apparatus to determine the temperature of each region on the wafer;
And a step of releasing the connection between the contact and the contact and unloading the wafer type temperature sensor from the heat treatment apparatus.

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