JP2007160769A - Removing plate for reverse offset printing and method for forming conductive pattern lising the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a removing plate, which enables the formation of a pattern, in which low resolution parts and high resolution parts exist under the state being mixed with one another in the formation of conductive pattern by reverse offset printing. <P>SOLUTION: In the removing plate 44 used for the formation of the conductive pattern by the reverse offset printing, a plurality of same shaped projections 44b, the height of each of which is equal to the depth of a recess, are regularly arranged in recess regions 44a under the condition that the shape of the projection 44b at the plane of a type is made to be a circular form. In addition, the inequality: 0.01≤(S2/S1)≤0.2 is satisfied, wherein S1 is the area of the recess regions 44a and S2 is the sum total of the areas of the surface, which makes the plate surface of the projections 44b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a removal plate used for forming a conductive pattern by reverse offset printing and a method for forming a conductive pattern by reverse offset printing.

In recent years, attempts have been made to form a conductive pattern by a printing method in order to cope with cost reduction and miniaturization of electronic components.

A reverse offset printing method has been proposed as a printing method capable of forming a fine pattern. (See Patent Document 1)

In addition, it has been proposed to form an electromagnetic wave shield by forming a conductive pattern by a reverse offset printing method. (See Patent Document 2)

The reverse offset printing method will be described with reference to FIG.

First, an ink 12 containing a transfer product is applied and dried on a blanket 11a having a peelable surface to form a transfer product 13a on the surface of the blanket 11a. (Fig. 2 (b))

Next, the transfer product 13a is brought into intimate contact with the removal plate 14, thereby forming the transfer product 13c on the blanket 11a. (Fig. 2 (f))

Next, a pattern is formed on the transfer object 15 by bringing the transfer object 13c into close contact with the transfer object 15 (FIG. 2 (i)).

JP 2000-289320 A JP 2005-175061 A

However, in the reverse offset printing method, it is difficult to form a conductive pattern in which a low resolution portion and a high resolution portion are mixed.

This will be described with reference to FIGS.

FIG. 3 is a cross-sectional view for explaining a state in which the blanket 21b is in contact with the removal plate 24 in which the wall surfaces of the concave and convex portions are formed substantially perpendicular to the plate surface.

The blanket 21b is deformed by the pressure at the time of contact with the removal plate 24.
When the plate depth of the concave portion is smaller than the opening width of the concave portion of the low resolution portion 28, the blanket 21 b comes into contact with most of the intaglio region in the low resolution portion 28.
As a result, the transferred portion of the blanket 21b in contact with the recessed portion of the removal plate 24 is removed from the blanket 21b, and most of the pattern is removed.

When the plate depth of the removal plate 24 is increased in order to avoid contact between the intaglio area of the low resolution portion 28 and the blanket 21b, the aspect ratio (plate depth ÷ opening width) of the convex portion of the high resolution portion 29 is increased. The problem that intensity falls will arise.

FIG. 4 is a cross-sectional view for explaining an example of a removal plate forming method.

A resist 37 is formed on the substrate 36 to be a removal plate, and the removal plate is formed by wet etching.
Wet etching is isotropic and side etching occurs to the same extent as the plate depth.
If the plate depth of the low resolution portion 28 is deepened, the resolution of the high resolution portion 29 is impaired.

An object of the present invention is to provide a removal plate capable of forming a conductive pattern in which a low resolution portion and a high resolution portion are mixed, and a method of forming a conductive pattern using the same.

The invention according to claim 1 is a removal plate used for reversal offset printing, wherein a plurality of protrusions whose distance in the height direction is equal to or less than the distance in the depth direction of the recess region are formed in the recess region of the removal plate. The removal plate is characterized in that a portion is formed.

According to a second aspect of the present invention, the distance in the height direction of the convex portion is equal to the distance in the depth direction of the concave portion region, the area of the concave portion is S1, and the area of the surface forming the plate surface of the convex portion is The removal plate according to claim 1, wherein 0.01 ≦ (S2 ÷ S1) ≦ 0.2 is satisfied when the sum is S2.

The invention according to claim 3 is the removal plate according to claim 1 or 2, wherein the shape of the convex portion on the plate surface is a circle.

The invention according to claim 4 is characterized in that the shapes of the convex portions are the same, and the convex portions are regularly arranged in the concave portions. It is a removal version as described in item 1.

The invention according to claim 5 is a pattern forming method by a reverse offset printing method, wherein patterning is performed using the removal plate according to any one of claims 1 to 4. Is the method.

The invention of claim 1 of the present invention is a removal plate used for reversal offset printing, wherein the distance in the height direction is equal to or less than the distance in the depth direction of the recess region in the recess region of the removal plate. By forming the convex portion, it is possible to prevent the blanket and the removal plate from coming into contact with each other, and to form a conductive pattern in which the low resolution portion and the high resolution portion are mixed.

First, the removal plate of the present invention will be described with reference to FIG.

A plurality of convex portions 44b having a height direction distance equal to the depth direction distance of the concave region 44a are formed in the concave region 44a.

By providing the convex portion 44b, it is possible to prevent the blanket from coming into contact with the low resolution portion of the removed plate during reverse offset printing.
Since the convex portion 44b comes into contact with the blanket, this portion is removed from the desired pattern. However, when the desired pattern is a conductive pattern, there is no problem if the area ratio of the convex portion to the concave portion is reduced.

The area ratio of the convex portion 44b to the concave portion 44a is 0.01 ≦ (S2 ÷ S1) ≦ 0.2, where S1 is the area of the concave region and S2 is the total area of the surfaces forming the printing plate of the convex portion. Meet the relationship.
When (S2 ÷ S1) is smaller than this range, it is difficult to avoid contact of the blanket in most of the concave portions even if the shape and arrangement of the convex portions are optimized.
Further, when (S2 ÷ S1) is larger than this range, pattern omission due to contact of the convex portion with the blanket becomes large, which causes a problem.

In order to minimize the anisotropy as much as possible, the shape of the protrusions is preferably the same and circular as in this example, and the protrusions are preferably arranged regularly.
As a regular arrangement, there is a method of arranging at a lattice point of a two-dimensional lattice. Among them, a hexagonal lattice having many symmetric elements is preferable.

The size and number density of the convex portions are appropriately optimized depending on the depth of the concave portion and the size of the opening within a range satisfying the relationship of 0.01 ≦ (S2 ÷ S1) ≦ 0.2.

The removal plate 44 is made of a metal such as glass or stainless steel, various resist materials, or the like, and is processed by a method such as sand blasting, photolithography etching, or FIB (focused ion beam).

Next, a method for forming a conductive pattern according to the present invention will be described with reference to FIG.

First, the ink 12 is applied and dried on a blanket 11a having a peelable surface to form a transfer product 13a on the surface of the blanket 11a. (Fig. 2 (b))

As the material of the blanket 11 a, a material that can form the transfer product 13 a and can remove the transfer product 13 b by the removal plate 14 and transfer the transfer product 13 c to the printing material 15 is used.
Moreover, although a hard material with few deformation | transformation is preferable, a certain amount of softness | flexibility is required.
As such a material, silicone elastomer, butyl rubber, ethylene propylene rubber and the like can be used.
Further, in order to adjust the wettability of the blanket 11a surface, the blanket 11a surface may be subjected to a surface treatment such as coating of fluororesin and silicone, plasma treatment, UV ozone cleaning treatment, or the like.

As the material of the ink 12, a material in which various additives are added to a metal fine particle dispersion such as gold, silver, copper, nickel, platinum, palladium, rhodium or the like as required can be used.
The dispersion medium is preferably water or alcohol that does not swell and deform the blanket.

As a method for applying the conductive ink composition to the blanket 11a, a bar coating, a die coating, or a spin coating method can be used, but the method is not limited thereto.

The thickness of the transferred product 13a is usually 10 μm or less, although it depends on the pattern resolution.
When the film thickness is larger than 10 μm, the transfer product 13b is removed and the transfer product 13c is transferred.

Next, the transfer product 13a is brought into intimate contact with the removal plate 14, thereby forming the transfer product 13c on the blanket 11a. (Fig. 2 (f))

As a method of bringing the transfer product 13a into close contact with the removal plate 14, a method of rolling the blanket 11a wound around the blanket roll on the removal plate 14 while keeping the blanket 11a wound around the blanket roll in contact with the removal plate 14 is used. be able to.

Finally, the transfer product 13 c is brought into close contact with the transfer object 15 to form a pattern on the transfer object 15. (Fig. 2 (i))

As a method of bringing the transfer product 13 c into close contact with the transfer object 15, a method of winding the blanket 11 c on the transfer object 15 while winding the blanket 11 c around the transfer object 15 while using the blanket 11 c in contact with the transfer object 15 is used. Can do.

The material of the transfer object 15 may be any material that can transfer the transfer object 13c and can withstand heat treatment, such as soda lime glass, quartz, silicon wafer, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), A cycloolefin polymer, polyimide, polyethersulfone (PES), polymethyl methacrylate (PMMA), polycarbonate, polyallylate and the like can be used.

First, a glass plate having a thickness of 0.7 mm was used as a substrate, and a removal plate was formed by a known wet etching method.
The removal plate is obtained by arranging 100 × 100 patterns shown in FIG. 1 near the center of a 100 mm × 100 mm plate.
The dimensions of each part of the pattern shown in FIG. 1 were an area of 250 μm × 250 μm, a high resolution part line / space width of 5 μm / 5 μm, a low resolution part rectangle of 140 μm × 210 μm, and a plate depth of 2 μm.
Further, the convex portions had a circular shape (radius 3 μm) on the printing plate, arranged in a hexagonal lattice shape, and (S2 ÷ S1) = 0.08.

Next, polyethylene oxide (average molecular weight 10,000, manufactured by Aldrich) is added to the silver particle aqueous dispersion (average particle size 20 nm, manufactured by Sumitomo Electric Industries), (polyethylene oxide / silver particles / water) = (1/8/31). Ink was prepared by dissolving so that the weight ratio was.

Next, a two-pack type silicone rubber manufactured by Toshiba GE was molded into a thickness of 2 mm and a size of 100 mm × 100 mm to produce a blanket.

Next, ink was applied to the blanket wound around the blanket roll with a bar coater (# 6) and then dried at room temperature for 3 minutes to form a transfer on the blanket.

Next, the transfer product on the blanket was brought into close contact with the removal plate and then peeled off, and the portion of the transfer product that contacted the removal plate was removed from the blanket to obtain a patterned blanket.

Next, the conductive pattern on the blanket was peeled off after being adhered onto a soda lime glass substrate having a thickness of 0.7 mm and a size of 100 mm × 100 mm, and transferred.

Next, this was heat-treated at 200 ° C. for 30 minutes to form a conductive pattern.

When the obtained conductive pattern was observed with an optical microscope, pattern omission in the low resolution portion was only a portion corresponding to the convex portion of the removed plate, and no overall pattern omission occurred.

<Comparative example>
The removal plate similar to that of Example 1 was used except that no convex portion was formed in the removal plate recess in the example.
Further, a conductive pattern was formed in the same manner as in the example except that the removal plate of the example was not used.

When the obtained conductive pattern was observed with an optical microscope, pattern omission in the low-resolution part reached the entire pattern area and did not function as a conductive pattern.

The reverse offset printing removal plate of the present invention and the conductive pattern forming method using the same can form a conductive pattern in which a low resolution portion and a high resolution portion are widely mixed. Available for electronic devices.

It is a figure for demonstrating the removal version of this invention. It is sectional drawing for demonstrating the process of reverse offset printing. It is sectional drawing for demonstrating the state which the removal plate and the blanket are contacting. It is sectional drawing for demonstrating the preparation method of the removal plate by wet etching.

Explanation of symbols

11a ... Blanket 11b ... Printing blanket with transfer 13a formed 11c ... Printing blanket with transfer 13c formed 12 ... (conductive) ink 13a ... (entire blanket) Transfer product 13b (transferred pattern is removed by removal plate) Transfer product 13c (transfer pattern formed on blanket) Transfer plate 14 ... Removal plate 15 ... Transfer target Material 21b: Blanket with the transfer material formed on the entire surface 24 .... Removal plate with concave / convex wall surfaces formed substantially perpendicular to the plate surface 28 .... Low resolution portion of removal plate 24 29.・ ・ ・ High resolution part of removal plate 24 36... Substrate to be removal plate 37... Resist 44 .. removal plate of the present invention 44 a. The Convex part

Claims (5)

A removal plate used for reverse offset printing, wherein a plurality of convex portions having a height direction distance equal to or less than a depth direction distance of the concave region are formed in the concave region of the removal plate. And removal version. When the distance in the height direction of the convex portion is equal to the distance in the depth direction of the concave portion, the area of the concave portion is S1, and the total area of the surfaces forming the plate surface of the convex portion is S2. The removal plate according to claim 1, wherein 01 ≦ (S2 ÷ S1) ≦ 0.2 is satisfied. The removal plate according to claim 1, wherein the shape of the convex portion on the plate surface is a circle. The shape of the said convex part is mutually the same, The said convex part is arrange | positioned regularly in the said recessed part, The removal plate of any one of Claim 1 thru | or 3 characterized by the above-mentioned. A pattern forming method using a reverse offset printing method, wherein patterning is performed using the removal plate according to any one of claims 1 to 4.