JP2007157858A - Mounting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component of which the impact at punching with a die is absorbed for improved reliability of a substrate with a simple substrate structure. <P>SOLUTION: A dummy wiring is provided at least in the region of a mounting substrate 6 which is punched out with a die. A resist and resin 9 arranged at the upper part of the dummy wiring are removed. So, the impact at punching out with a die is absorbed and dispersed. Thus, even with a simple substrate structure, no problem of warping or deflection of a frame-like mounting substrate 6 occurs, and cracking can be prevented that accompanies punching by the die with the mounting substrate 6 for improved reliability of electronic components. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mounting board that is mounted into a single electronic component device unit by mounting a plurality of electronic components and punching them using a mold.

  Conventionally, as one method of dividing a frame-shaped mounting board having a plurality of electronic component mounting parts into one electronic component device unit, a mounting method (for example, a method of punching a mounting board into pieces by a mold) , Refer to the prior art of Patent Document 1).

As described above, the punching method using a conventional mold and the mounting substrate in the separation of the electronic component device will be described below with reference to FIGS. 6, 7, and 8.
FIG. 6 is a plan view showing a mounting substrate punched out by a conventional mold, FIG. 7 is a sectional view for explaining punching of the conventional mounting substrate by a mold, and is a cross-sectional view taken along line AA ′ of FIG. FIG. 8 is a cross-sectional view showing an electronic component device divided into pieces by punching with a conventional mold.

As shown in FIGS. 6 and 7, the mounting substrate 6 includes one or more layers of wirings 16 and a resin 9 provided between the layers of the wirings, and the entire surface of the substrate is solder resist 7 and solder. This configuration is protected by the resist 11. The mounting substrate 6 has a die pad region for mounting electronic components, and solder balls 12 are formed as external terminals on the back surface thereof. A through hole or the like is used between the wirings of each layer and electrical connection between each wiring 16 and the solder ball 12. A plurality of slits 13 are arranged on the mounting substrate 6 at locations to be cut by punching, and a portion where the substrate is left between the slits 13 is punched by a punching die 5 held by a die holding portion 17 to obtain individual pieces. It becomes. In the example of FIG. 8, the semiconductor chip 3 is fixed as an electronic component on the mounting substrate 6 by the die attach material 4, and the semiconductor chip 3 and the wiring 16 of the mounting substrate 6 are electrically connected by the metal wire 2 and sealed. It is protected by the resin 1 and is separated into pieces by the punching die 5 to form a semiconductor device as an electronic component device.
JP-A-9-181406

  However, in the conventional singulation with a die in the conventional substrate structure as described above, when the mounting substrate 6 is punched by the punching die 5 as shown in FIG. Therefore, a crack 18 is generated at the interface between the mounting substrate 6 and the sealing resin 1 and the wiring 16 of the mounting substrate 6 is cut, resulting in an electrical open phenomenon, which has a serious problem in terms of substrate reliability. It was.

  Moreover, with respect to the above problems, in the conventional mounting substrate (see, for example, Patent Document 1), a large slit is provided in the corner portion to reduce the impact generated in the corner portion. Since there is a mounting substrate that is punched in the peripheral portion, a crack due to cutting damage caused by the mold occurs in that portion, and the problem of cutting the wiring on the substrate is also the same. In addition, if the slits are placed large in the corner, warping and deflection of the frame-shaped mounting board are likely to increase, and there are processes where heat etc. is applied during the manufacture of electronic components, causing warpage and deflection, resulting in stability. Will also have problems.

  The present invention solves the above-described conventional problems, and can be used for punching a mounting board with a mold without causing problems such as warping and deflection of the frame-like mounting board, while having a simple board structure. The purpose is to prevent the occurrence of accompanying cracks and increase the reliability of electronic components.

  In order to achieve the above object, a mounting substrate according to claim 1 of the present invention is a mounting substrate that is separated into electronic component devices by mounting a plurality of electronic components and punching them using a mold. One or more layers of wiring, resin provided between and around each of the wiring, a die pad region for mounting the electronic component, an external terminal electrically connected to the wiring, and an individual by punching A slit formed in a part of a region to be separated, a dummy wiring provided between the slits of the region to be separated, and a solder resist for protecting a surface layer, and the resin on the dummy wiring Further, the electronic device is separated into pieces by punching out the dummy wiring exposed by removing the solder resist using the mold.

According to a second aspect of the present invention, in the mounting substrate according to the first aspect, the dummy wiring is provided on a surface layer of the punched side.
The mounting board according to claim 3 is the mounting board according to claim 1, wherein the dummy wiring is provided in an inner layer of the punching side, and the dummy wiring of the inner layer of the punching side is exposed from the punching side. And the solder resist is removed.

  According to a fourth aspect of the present invention, in the mounting substrate according to the first, second, or third aspect, the dummy wiring is provided on the surface layer of the substrate opposite to the punching.

  The mounting board according to claim 5 is the mounting board according to claim 3, wherein the dummy wiring is provided on the inner layer of the substrate opposite to the punching, and the dummy wiring of the inner layer of the substrate opposite to the punching is performed from the opposite side of the punching. The resin and the solder resist are removed so as to be exposed.

  The mounting board according to claim 6 is the mounting board according to claim 1, claim 2, claim 3, claim 4, or claim 5, wherein the dummy wiring is mesh-shaped. To do.

  As described above, while having a simple board structure, it does not cause problems such as warping and deflection of the frame-shaped mounting board, and prevents the occurrence of cracks due to the punching of the mounting board with a mold, thereby improving the reliability of electronic components. Can increase the sex.

  As described above, according to the present invention, the dummy wiring is provided in at least the region to be punched out by the mold of the mounting substrate, and the resist, resin, and the like arranged on the dummy wiring are removed. It can absorb and disperse the impact when punching in the mold, increase the thickness of the substrate by multilayering the wiring of the board, and even when the impact when punching with the mold is relatively increased By removing the resin at the top of the wiring with a laser, etc., the thickness of the punched part in the mold can be reduced, and the impact can be mitigated along with the shock absorption by the dummy wiring. However, without causing problems such as warping and deflection of the frame-shaped mounting board, it prevents the occurrence of cracks due to punching of the mounting board with a mold, and the reliability of electronic components It can be increased.

  The mounting substrate of the present invention is formed by forming dummy wirings in a region to be separated by punching, and by removing the resin and solder resist on the dummy wirings and punching them out from the dummy wirings with a mold. Although it has a simple board structure, it does not cause problems such as warping and deflection of the frame-shaped mounting board, and prevents the occurrence of cracks due to punching of the mounting board with a mold, thereby improving the reliability of electronic components. be able to.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, the mounting substrate in the first embodiment will be specifically described with reference to FIGS.

  FIG. 1 is a cross-sectional view for explaining punching of a mounting board by a mold according to Embodiment 1 of the present invention, and is a cross-sectional view along B-B ′ in the plan view of FIG. 2. FIG. 2 is a plan view showing a mounting substrate punched out by the mold of the present invention.

  As shown in FIGS. 1 and 2, the mounting substrate 6 includes one or more layers of wirings 16 and a resin 9 provided between the wirings and around the wirings. In this configuration, the resist 7 and the solder resist 11 are protected. The mounting board 6 has a die pad area for mounting electronic components, and solder balls 12 are formed on the back surface thereof as external terminals, for example. A through hole or the like is used between the wirings of each layer and electrical connection between each wiring 16 and the solder ball 12. A plurality of slits 13 are formed in the mounting substrate 6 at locations to be cut by punching, and the portion where the substrate between the slits 13 remains is punched by the punching die 5 held by the die holding portion 17 to obtain individual pieces. It becomes. In the present invention, a punching-side surface layer dummy wiring 8 is provided on the surface layer of the mounting substrate cut by the punching die 5 between the slits 13 to the conventional mounting substrate. The solder resist 7 on the upper surface 8 is removed to expose the surface layer dummy wiring 8 on the punching side.

  For example, a semiconductor chip 3 is fixed as an electronic component on the mounting substrate 6 by a die attach material 4, and the semiconductor chip 3 and the wiring 16 of the mounting substrate 6 are electrically connected by a metal wire 2 and protected by a sealing resin 1. Then, it is separated into pieces by the punching die 5 and becomes a semiconductor device as an electronic component device.

When cutting into individual pieces, the punching die 5 is formed by punching the exposed dummy layer 8 on the punching side, so that Cu of the wiring is excellent in ductility. Although it is a board structure, it can prevent the occurrence of cracks caused by punching the mounting board with a mold without causing problems such as warping and deflection of the frame-like mounting board, and improve the reliability of electronic components it can. Furthermore, by having a structure in which the surface layer dummy wiring 10 opposite to the punching is provided and the solder resist 11 is opened, the impact at the time of punching can be further reduced, absorbed, and dispersed.
(Embodiment 2)
Next, the mounting substrate in the second embodiment will be specifically described with reference to FIG.

  The second embodiment can be applied to a mounting board having three or more wiring layers, and is characterized in that the solder resist and the resin on the punched region are removed until the inner dummy wiring is exposed.

  FIG. 3 is a cross-sectional view for explaining punching of a mounting board with a mold according to Embodiment 2 of the present invention. The mounting board includes three or more wiring layers in the mounting board, and four wiring layers in the example of FIG. FIG.

  As shown in FIG. 3, the mounting substrate 6 includes three layers of wiring 16 inside and a resin 9 provided between the layers of each wiring, and the substrate surface layer is protected by the solder resist 7 and the solder resist 11. This is a configuration. The mounting board 6 has a die pad area for mounting electronic components, and solder balls 12 are formed on the back surface thereof as external terminals, for example. A through hole or the like is used between the wirings of each layer and electrical connection between each wiring 16 and the solder ball 12. As in the first embodiment, a plurality of slits 13 are formed in the mounting substrate 6 at locations to be cut by punching, and the portion where the substrate remains between the slits 13 is held by the mold holder 17. They are punched out by the mold 5 and separated into individual pieces. In the present invention, an inner layer dummy wiring 14 on the punching side is further provided inside the mounting substrate cut by the punching die 5 between the slits 13 with respect to such a conventional mounting substrate, and the inner layer dummy wiring 14 on the punching side is provided. The upper resin 9 and the solder resist 7 are removed with a laser or the like to expose the inner-layer dummy wiring 14 on the punched side.

  For example, a semiconductor chip 3 is fixed as an electronic component on the mounting substrate 6 by a die attach material 4, and the semiconductor chip 3 and the wiring 16 of the mounting substrate 6 are electrically connected by a metal wire 2 and protected by a sealing resin 1. Then, it is separated into pieces by the punching die 5 and becomes a semiconductor device as an electronic component device.

  When cutting into individual pieces, the punching die 5 punches the exposed inner layer dummy wiring 14 on the punching side, so that the Cu of the wiring is excellent in ductility, so that the impact at the time of punching is relaxed, absorbed, and dispersed, The thickness of the punched portion of the mounting substrate 6 can be reduced, and the die can be punched into the mounting substrate without causing problems such as warpage and deflection of the frame-shaped mounting substrate while having a simple substrate structure. It is possible to prevent the accompanying cracks and improve the reliability of the electronic component. Furthermore, by having a structure in which the surface layer dummy wiring 10 opposite to the punching is provided and the solder resist 11 is opened, the impact at the time of punching can be further reduced, absorbed, and dispersed.

In the above description, the mounting substrate having three wiring layers has been described. However, even when the wiring layer has four or more wiring layers, by providing inner layer dummy wirings in part or all of the inner wiring layer, There is an effect.
(Embodiment 3)
Next, the mounting substrate in the third embodiment will be specifically described with reference to FIG.

  The third embodiment can be applied to a mounting board having four or more wiring layers, and is characterized in that the solder resist and the resin in the punched area are removed from the upper and lower sides of the mounting board until the inner dummy wiring is exposed.

FIG. 4 is a cross-sectional view for explaining punching of a mounting board by a mold according to Embodiment 3 of the present invention, and is a cross-sectional view of a mounting board in which the wiring layer of the mounting board includes four wiring layers.
As shown in FIG. 4, in the third embodiment, in the mounting substrate of the second embodiment, an inner layer dummy wiring 15 opposite to the punching side is provided in addition to the inner layer dummy wiring 14 on the punching side, and the surface layer opposite to the punching is provided. The dummy wiring 10 is not provided, and the resin 9 on the inner layer dummy wiring 15 on the side opposite to the punching is also removed by a laser or the like on the side opposite to the punching.

  The impact at the time of punching is relaxed, absorbed, and dispersed, and the substrate thickness of the punched portion is determined from the front and back against the impact caused by the punching die 5 that relatively increases due to the increase in the thickness of the mounting substrate due to the multilayer mounting substrate. Because it can be made thin, it has a simple board structure, but without causing problems such as warping and deflection of the frame-like mounting board, preventing the occurrence of cracks due to punching with a mold to the mounting board, The reliability of electronic components can be increased.

  FIG. 5 is a plan view showing a mounting board in which the dummy wiring of the present invention is meshed. In the first embodiment, the exposed inner surface side dummy wiring 8 in the mesh is meshed, It is possible to adjust the burrs and sag at the time of cutting by adjusting the Cu occupation ratio of the wiring together with the impact absorption at the time of punching with the mold. In addition, the inner layer dummy wiring and the dummy wiring on the opposite side of the punching in Embodiment 1, Embodiment 2 and Embodiment 3 may be meshed, and the cut surface of the cut surface is absorbed together with the impact absorption at the time of punching with the mold. The state can be adjusted and optimized.

  Although the present invention has a simple substrate structure, it does not cause problems such as warping and deflection of the frame-shaped mounting substrate, and prevents the occurrence of cracks due to punching of the mounting substrate with a mold. The reliability can be improved, and it is useful for a mounting board or the like that is separated into one electronic component device unit by mounting a plurality of electronic components and punching them using a mold.

Sectional drawing explaining the punching by the metal mold | die of the mounting substrate in Embodiment 1 of this invention The top view which shows the mounting substrate punched out by the metal mold | die of this invention Sectional drawing explaining the punching by the metal mold | die of the mounting substrate in Embodiment 2 of this invention Sectional drawing explaining the punching by the metal mold | die of the mounting board in Embodiment 3 of this invention The top view which shows the mounting substrate which made the dummy wiring of this invention mesh shape Plan view showing a mounting board punched by a conventional mold Sectional drawing explaining the punching by the mold of the conventional mounting board Sectional drawing which shows the electronic component apparatus separated into pieces by the punching by the conventional metal mold | die

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sealing resin 2 Metal wire 3 Semiconductor chip 4 Die attach material 5 Punching die 6 Mounting substrate 7 Solder resist 8 Punching side surface layer dummy wiring 9 Resin 10 Punching side surface layer dummy wiring 11 Solder resist 12 Solder ball 13 Slit 14 Punching side inner layer dummy wiring 15 Punching and reverse side inner layer dummy wiring 16 Wiring 17 Mold holding part 18 Crack

Claims (6)

A mounting board that is mounted on a plurality of electronic components and is singulated into an electronic component device by punching using a mold,
One or more layers of wiring;
A resin provided between and around each wiring layer;
A die pad region for mounting the electronic component;
An external terminal electrically connected to the wiring;
A slit formed in a part of the region to be singulated by punching,
Dummy wiring provided between the slits in the region to be separated;
A solder resist that protects the surface layer surface, and the resin and the solder resist on the dummy wiring are removed, and the dummy wiring exposed is removed by using the mold and separated into electronic component devices. A mounting board characterized by that.   The mounting substrate according to claim 1, wherein the dummy wiring is provided on a substrate surface on a punching side.   2. The mounting according to claim 1, wherein the dummy wiring is provided in an inner layer of the punching side substrate, and the resin and the solder resist are removed so that the dummy wiring of the inner layer of the punching side is exposed from the punching side. substrate.   4. The mounting substrate according to claim 1, wherein the dummy wiring is provided on a substrate surface layer opposite to the punching.   The dummy wiring is provided in a substrate inner layer opposite to the punching, and the resin and the solder resist are removed so that the dummy wiring in the substrate inner layer opposite to the punching is exposed from the opposite side of the punching. The mounting board according to claim 3.   The mounting board according to claim 1, wherein the dummy wiring is mesh-shaped.

Images