JP2007066718A - Lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting system allowing optical axes of a semiconductor light emitting element and an optical path control means to be correctly positioned and capable of preventing degradation of luminous efficiency by efficiently radiating heat of the semiconductor light emitting element. <P>SOLUTION: This lighting system is composed by including: the semiconductor light emitting element 11; a body case 12 for housing the semiconductor light emitting element; a cover member 13 having a light-transmissive part 13c covering the body case and transmitting the light of the semiconductor light emitting element; and an optical unit 16 comprising an optical path control means 14 for controlling the light of the semiconductor light emitting element and a support body 15 for supporting the optical path control means at a predetermined position with respect to the body case 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an illumination device using a semiconductor light emitting element such as a light emitting diode as a light source.

  In recent years, a light-emitting diode, which is a semiconductor light-emitting element with a long life and low power consumption, has been used in place of a filament light bulb, such as a downlight installed on a ceiling surface as shown in Patent Document 1 below, and a store show. It has come to be used as a light source for various types of illumination such as spotlights that illuminate merchandise displayed on windows and the like.

  A light-emitting diode has the performance of a narrow-angle light distribution light source, and generally requires a lens that controls light distribution with good straightness of light. It is necessary to align the optical axes of the diode and lens accurately.

  On the other hand, the light emitting diode generates a relatively large amount of heat when it is turned on, and there is a problem that a predetermined luminous intensity cannot be obtained due to a decrease in luminous efficiency due to this temperature rise and a decrease in luminous flux.

  In particular, in a spotlight that illuminates an exhibit such as a store window in a store, an initial emission color cannot be obtained due to a decrease in luminous flux, resulting in a color shift and a desired color rendering effect on the exhibit cannot be obtained.

In order to solve this problem, in an illuminating device using this type of light emitting diode as a light source, a heat dissipation characteristic of the light emitting diode is improved to prevent a decrease in light emission efficiency.
JP 2003-86006 A

  In Patent Document 1, a Fresnel lens is provided so as to cover a light emitting diode as a light source so that light is diffused to the surroundings. However, the lens is configured separately from the light emitting diode, and the base It is configured to be screwed into a screw portion formed on the plate.

  For this reason, the lens is separate from the light emitting diode, the positional relationship between the light emitting diode and the lens is not regulated, and the positional relationship between the light emitting diode and the lens changes depending on the degree of screwing. As a result, the optical axes of the light emitting diode and the lens are not accurately positioned, and there is a problem that the desired light distribution control cannot be performed reliably.

  On the other hand, in order to improve the heat dissipation characteristics, the main body case in which the light emitting diode is installed and stored is generally made of a metal such as aluminum having good thermal conductivity, and the heat of the light emitting diode is externally transmitted through the main body case. It is done to dissipate heat.

  However, in recent years, light emitting diodes have become increasingly brighter and more powerful, and the amount of heat generated is increasing. To dissipate this heat, the body case is enlarged to increase the heat dissipation area. However, there is a problem that the whole lighting device is enlarged while using a light emitting diode which is a small light source.

  Therefore, in an illuminating device that uses a semiconductor light emitting element such as a light emitting diode as a light source, it is possible to accurately position the optical axis of the optical path control means composed of the semiconductor light emitting element and a lens, and the like. An important issue is how to provide a miniaturized lighting device that efficiently dissipates heat from a semiconductor light emitting element to prevent a reduction in light emission efficiency.

  The present invention provides a lighting device capable of accurately positioning the optical axis of a semiconductor light emitting element and an optical path control means, and efficiently radiating the heat of the semiconductor light emitting element to prevent a decrease in luminous efficiency. The purpose is to provide.

  The invention of the lighting device according to claim 1 includes: a semiconductor light-emitting element; a main body case that houses the semiconductor light-emitting element; a cover member that covers the main body case and has a translucent portion that transmits light from the semiconductor light-emitting element; And an optical unit composed of a support that supports the optical path control means at a predetermined position with respect to the main body case.

  According to the first aspect of the present invention, the optical axis of the semiconductor light emitting element and the optical path control means can be accurately positioned by the support that supports the optical path control means at a predetermined position with respect to the main body case. A lighting device is configured.

  The “semiconductor light emitting device” is a light emitting device made of a semiconductor having no filament, and for example, a light emitting diode or a semiconductor laser is allowed.

  “The main body case that houses the semiconductor light-emitting element” is allowed to be composed of a metal having good thermal conductivity such as aluminum, but the material of the synthetic resin is coated with a metal film such as aluminum, or an aluminum foil or the like is used. What was covered may be sufficient and the material is not limited to a specific thing.

  Further, the shape may be a thin cylindrical disk shape, or a rectangular shape such as a rectangle or a square, or a polygonal shape such as a triangle or a hexagon in a plan view.

  "Cover member that covers the main body case" covers and closes the main body case, and as with the main body case, it is allowed to be made of a metal with good thermal conductivity, such as aluminum, It may be coated with a metal film such as aluminum or coated with an aluminum foil or the like.

  Moreover, the state which covers a main body case may be made airtight, or may be formed by forming air holes for heat dissipation and communicating with the outside.

  The material and shape of the main body case and the cover member are preferably the same, but may be different materials and shapes.

  “Translucent part that transmits light from the semiconductor light emitting device” is a transparent or semi-transparent light transmitting hole even if a through hole is provided to directly radiate the light from the semiconductor light emitting device to the outside. A window member made of glass or synthetic resin having a property may be provided, and light may be indirectly emitted to the outside through the window member.

  The “optical path control means for controlling the light of the semiconductor light emitting element” allows a transparent or translucent lens or reflector having a light input end and an output end, and allows light emitted from the semiconductor light emitting element to be transmitted in a desired manner. Any means may be used as long as it controls the optical path in the direction, and the controlling means may refract or reflect light, or may diffuse it.

  The “support for supporting the optical path control means at a predetermined position with respect to the main body case” is a means for enabling the optical axis of the semiconductor light emitting element and the optical path control means to be accurately positioned. The light output end of the optical path control means is disposed in the through hole of the cover member, the light input end is fixed to the main body case on the semiconductor light emitting element side, the optical path control means is supported at a predetermined position, and the semiconductor light emission Means capable of accurately positioning the optical axis of the element and the optical path control means.

  Further, a means for locking the support body supporting the optical path control means to a positioning member provided in the main body case is added to support the optical path control means at a predetermined position with respect to the main body case, and the semiconductor light emitting element and the optical path It may be a means that makes it possible to accurately position the optical axis of the control means.

  The invention of the lighting device according to claim 2 includes: a semiconductor light emitting element; a main body case that houses the semiconductor light emitting element; a cover member that covers the main body case and has a through hole that transmits light from the semiconductor light emitting element; An optical path control means for controlling the light of the element and a support for supporting the optical path control means, the light output end of the optical path control means is disposed in the through hole of the cover member via the support, and the light input end is a semiconductor And an optical unit fixed to the main body case on the light emitting element side.

  According to the second aspect of the present invention, the light output end of the optical path control means is disposed in the through hole of the cover member via the support, and the light input end is fixed to the main body case on the semiconductor light emitting element side. Thus, an illuminating device that can accurately position the optical axes of the semiconductor light emitting element and the optical path control means is configured.

  Here, the light output end of the optical path control means is disposed in the through hole of the cover member, and the means for fixing the light input end to the main body case on the semiconductor light emitting element side is a means for arranging or fixing by fitting, a convex portion A means for disposing or fixing by engaging the concave portion and a means for detachably disposing or fixing so as to be disassembled at the time of repair or the like are allowed.

  According to a third aspect of the present invention, in the illuminating device according to the first or second aspect, the support unit of the optical unit is supported by being supported by a positioning member provided in the main body case. .

  According to the third aspect of the present invention, the optical unit support is locked and supported by the positioning member provided in the main body case, so that the optical axis of the semiconductor light emitting element and the optical path control means can be accurately adjusted. An illuminating device that can be positioned is configured.

  According to a fourth aspect of the present invention, in the illuminating device according to any one of the first to third aspects, the main body case and the cover member are made of a metal member having thermal conductivity, and the semiconductor light emitting element is a thermal conductive sheet. The cover member is provided so as to cover the main body case in thermal contact with the heat conductive sheet.

  According to invention of Claim 4, the illuminating device which can thermally radiate the heat | fever of a semiconductor light-emitting element efficiently and can prevent the fall of luminous efficiency is comprised by the heat conductive sheet.

  The thermal conductive sheet preferably has good thermal conductivity such as silicon resin, good heat resistance, and elasticity, but it is not necessary to have all these characteristics, and at least the thermal conductivity. All sheets are allowed.

  According to the first aspect of the present invention, the optical path control means for controlling the light of the semiconductor light emitting element and the optical unit comprising the support for supporting the optical path control means at a predetermined position with respect to the main body case, the semiconductor light emitting element and the optical path control means. It is possible to provide an illumination device that can accurately position the optical axis.

  According to the invention of claim 2, the light output end of the light path control means is disposed in the through hole of the cover member via the support that supports the light path control means, and the light input end is the main body case on the semiconductor light emitting element side. Accordingly, it is possible to provide an illuminating device that can accurately position the optical axes of the semiconductor light emitting element and the optical path control means.

  According to the invention of claim 3, since the support of the optical unit is locked and supported by the positioning member provided in the main body case, the optical axes of the semiconductor light emitting element and the optical path control means are accurately set. An illumination device that can be positioned can be provided.

  According to the invention of claim 4, it becomes possible to accurately position the optical axis of the semiconductor light emitting element and the optical path control means, and the semiconductor light emitting element is installed and stored in the main body case via the heat conductive sheet. In addition, since the cover member is provided so as to cover the main body case in thermal contact with the heat conductive sheet, the illumination device capable of efficiently radiating the heat of the semiconductor light emitting element and preventing a decrease in the light emission efficiency Can be provided.

Hereinafter, an embodiment of a lighting device according to the present invention will be described.

  1 to 4 show an illuminating device according to an embodiment of the present invention. FIG. 1 is a longitudinal sectional view of the illuminating device (longitudinal sectional view taken along line AA in FIG. 2), FIG. 2 is a plan view, and FIG. The top view which shows the state which removed the member and the lens, FIG. 4 is a perspective view which decomposes | disassembles and shows the principal part.

  The illuminating device of this embodiment is configured as a spotlight that illuminates exhibits such as store windows and showcases of stores, and the illuminating device 10 is a main body for installing and storing the semiconductor light emitting element 11 and the semiconductor light emitting element. The case 12, the cover member 13 covering the main body case, the optical unit 16 including the optical path control means 14 and the support 15, and the heat conduction sheet 17 are included.

  Reference numeral 11 denotes a semiconductor light emitting device according to the present invention, which is composed of light emitting diodes (hereinafter referred to as “LEDs”) in the present embodiment. A plurality of LEDs 11 are provided in the same color, and in this embodiment, three white LEDs are prepared. Each LED is composed of the same kind of performance in which light is mainly emitted in one direction, that is, the optical axis aa of the LED.

  Each LED 11 is mounted on a disc-shaped printed wiring board 11b with a chip element having a primary lens 11a as a central part, and is thermally conductive such as aluminum provided in contact with the back surface of the printed wiring board. It has the heat sink 11c which consists of a favorable metal.

  The heat radiating plate 11c is formed in a disk shape having the same shape as that of the printed wiring board 11b, and a pair of through holes 11d and 11d for attaching to a main body case 12 to be described later with screws are formed facing each other in the diameter direction of the disk ( FIG. 4).

  The printed wiring board 11b is formed with notches 11e and 11e corresponding to the through holes 11d and 11d of the heat radiating plate 11c.

  In the present embodiment, three identical LEDs 11 configured as described above are prepared with the chip element having the primary lens 11a, the printed wiring board 11b, and the heat sink 11c.

  The body case 12 is made of a metal having good thermal conductivity such as aluminum, and is configured to have a short bottomed cylindrical box shape having an opening 12a at one end, and a large number of outer peripheral surfaces along the cylindrical axis direction. The protrusion 12b is formed integrally.

  Reference numeral 12c denotes a pair of support holes formed so as to face each other in the diametrical direction in order to install the three LEDs 11 on the inner bottom surface of the main body case 12, and each of the support holes 12c has a cylindrical pair of holes. Three sets are formed at approximately equal intervals so that the opening angle starting from the center of the circle is approximately 120 degrees.

  The through holes 11d and 11d formed in the heat dissipation plate 11c of the LED 11 described above are formed so as to correspond to the support holes 12c and 12c, and the LED 11 is fixed to the main body case 12 in each of the through holes and the support holes. Screw 12e is inserted.

  12f is three pillars provided at a substantially central portion of the main body case 12, and the cross section forms a substantially isosceles triangle so as to stand up integrally from the bottom surface of the main body case 12, and becomes an apex angle of the isosceles triangle. The protruding portion 12g is integrally formed in the portion in the vertical direction. The three column bodies 12f are also formed with an angle of about 120 degrees at substantially equal intervals.

  Further, on the inner peripheral surface of the main body case 12, the three column bodies 12h are integrally formed so as to face the three column bodies 12f, and the protrusions 12i similar to the column bodies 12f are integrally formed.

  The three column bodies 12f and the three column bodies 12h facing each other constitute a positioning member in the present invention, and position the optical unit 16 described later with respect to the main body case 12.

  12 j is a through hole formed in the center of the bottom surface of the main body case, and is a hole through which a screw 12 k for fixing a cover member 13 to be described later to the main body case 12 is inserted.

  The cover member 13 is made of a metal having a good thermal conductivity such as aluminum and closes the opening 12a of the main body case 12, and has a short bottomed cylindrical box shape having an opening 13a at one end. An annular locking step portion 13b having a reduced diameter is integrally formed on the outer peripheral surface of the end portion of the opening portion 13a.

  The outer diameter of the locking step 13b is substantially the same as the inner diameter of the opening 12a of the main body case 12, and the locking step 13b is configured to fit into the opening 12a of the main body case.

  Three through holes 13c constituting the light transmitting portion of the present invention are formed in the portion of the cover member 13 that becomes the bottom surface of the cylinder. The three through holes are formed by penetrating the circular holes at approximately equal intervals of approximately 120 degrees so that the opening angle starting from the center of the cylindrical circle is approximately 120 degrees.

  The center of the circular through hole 13c coincides with the axis cc of the cylinder formed by the support 15 of the optical unit 16, which will be described later, and the diameter of the through hole is substantially the same as the diameter of the cylinder formed by the support 15. It forms so that.

  13d is a boss that is erected and integrally formed at the center of the inner bottom surface. A screw hole 13e is formed along the axial direction of the boss, and the cover member 13 is attached to the main body case 12 by screwing a screw 12k into the screw hole. Fix it.

  The optical unit 16 is composed of a lens 14 constituting the optical path control means of the present invention and a support 15 for supporting the lens. The lens 14 is made of a synthetic resin such as colorless and transparent polycarbonate, and the longitudinal section has a mortar shape and a transverse section. Is formed in a circular shape, one end surface of which is a light output end 14a and the bottom surface of the other end is a light input end 14b.

  An annular flange 14c is integrally formed on the outer periphery of one end surface serving as the light output end 14a, and a cylindrical recess 14d directed inward is formed integrally on the bottom surface serving as the light input end 14b.

  The concave portion 14d is formed along the optical axis bb of the lens 14 so that the optical axis bb and the cylindrical central axis of the concave portion exactly coincide with each other. The diameter dimension of the recess 14d is substantially the same as the diameter dimension of the primary lens 11a provided in the chip element of the LED 11, and the depth is formed to be deeper than the thickness dimension of the primary lens 11a.

  When the primary lens 11a of the LED 11 is inserted into the recess 14d of the lens 14, the optical axis aa of the LED and the optical axis bb of the lens completely coincide.

  The support 15 that supports the lens 14 is a synthetic resin having heat resistance, light resistance, and electrical insulation, such as polybutylene terephthalate (PBT), and is configured in a shape having a bottomed cylindrical shape with one end open, and The structure is divided into two parts vertically divided by a line passing through the center of the cylinder.

  An annular groove 15a for fitting the flange 14c formed on the lens 14 is integrally formed on the inner peripheral surface of the opening of the support 15 that is open at one end.

  When the collar portion 14c of the lens is fitted into the concave groove 15a, the cylindrical axis cc formed by the support 15 and the optical axis bb of the lens accurately coincide with each other.

  A through-hole 15b for inserting the primary lens 11a of the LED 11 is formed on the bottom surface of the support 15, and further along the cylindrical axis cc on the inner peripheral surface and in the diametrical direction with the dividing line divided by two. Oppositely, two vertically long ribs 15c are integrally formed, and screw holes 15d are formed on the bottom surfaces of the ribs.

  The screw holes 15d are formed corresponding to the pair of support holes 12c and 12c formed on the bottom surface of the main body case 12, and screws 12e for fixing the LED 11 to the main body case 12 are screwed in.

  Furthermore, two vertically long concave grooves 15e and 15f are integrally formed on the outer peripheral surface of the support body 15 along the cylindrical axis cc and opposed to each other in the diametrical direction with the dividing line as a boundary.

  The two concave grooves 15e and 15f are respectively fitted and inserted into the protruding portions 12g and 12i of the column bodies 12f and 12h of the main body case 12 described above.

  As a result, the optical unit 16 including the lens 14 and the support 15 is guided to a predetermined mounting location of the main body case 12, accurately positioned, and supported by the main body case 12.

  When the support 15 supporting the lens 14 is positioned and supported at a predetermined mounting position with respect to the main body case 12, the cylindrical axis cc formed by the support 15, in other words, the optical axis b- of the lens. b is exactly aligned with the center of the through-hole 13c of the cover member 13, and the through-hole 13c of the cover member is disposed so that it can be fitted to the support 15 in a correctly aligned state.

  At the same time, a screw hole 15d of the support body 15, a notch 11e of the printed wiring board 11b of the LED 11, a through hole 11d of the heat sink 11c, and a support hole 12c of the main body case 12 are formed correspondingly to form one through hole. The positional relationship is such that the screw 12e can be screwed in.

  The support 15 is disposed to face the upper surfaces of the printed wiring board 11b and the heat sink 11c of the LED 11 when the LED 11 is installed in the main body case 12, and the printed wiring board 11b and the heat sink 11c are arranged on the ribs 15c of the support 15. It is clamped and fixed between the bottom surface and the inner bottom surface of the main body case 12.

  Three optical units 16 having the same configuration as described above are prepared as the optical unit 16 including the lens 14 and the support 15 configured as described above.

  The heat conductive sheet 17 is made of a material having good heat conductivity, such as silicon resin, good heat resistance, and elasticity, and has an inner diameter of the main body case so as to be in close contact with the inner bottom surface of the main body case 12 without gaps. And formed into a thin disk-like disk shape having substantially the same diameter.

  When the locking step 13b of the cover member 13 is fitted and fixed to the inner surface of the main body case 12, the bottom of the locking step 13b is pressed against the outer edge of the heat conductive sheet 17 against the elasticity of the sheet. The cover member 13 is in close thermal contact with the heat conductive sheet 17.

  The heat conductive sheet 17 is formed with a pair of through holes 17 a and 17 a at positions corresponding to the pair of support holes 12 c and 12 c of the main body case 12.

  Reference numeral 17b denotes a through hole through which the column 12f formed upright on the main body case 12 is inserted (FIG. 4).

  In the figure, 18 is a lead wire for electrically connecting three LEDs in series. The end portion is fixed by a lead wire retainer 18a and is led out from the bottom surface of the main body case 12 to a power supply unit (not shown). Connected.

  Next, a procedure for assembling the lighting device using the components such as LEDs configured as described above will be described.

  First, the optical unit 16 is assembled. That is, the flange 14c of the lens 14 is fitted into the concave groove 15a of the half-cylindrical support 15 configured in half, and the other semi-cylindrical support is fitted in the same manner. An optical unit 16 composed of the support 15 is configured.

  Thereby, the optical unit 16 in which the cylindrical axis cc formed by the support 15 and the optical axis bb of the lens exactly coincide with each other is configured, and three optical units 16 configured in this way are prepared.

  Next, the heat conductive sheet 17 is inserted into the inner bottom surface of the main body case 12 and supported so that the inner bottom surface of the main body case and the heat conductive sheet are in close contact with each other without a gap. The heat conduction sheet is inserted by aligning the through holes 17a and 17b with the support hole 12c and the column 12f of the main body case, respectively.

  Next, the LED 11 is positioned so that the pair of through holes 11d formed in the heat radiating plate 11c matches the through holes 17a of the heat conductive sheet 17, in other words, the pair of support holes 12c of the main body case 12. Deploy.

  Thereby, the through hole 17a of the heat conductive sheet 17, the through hole 11d of the heat sink 11c of the LED 11 and the notch 11e of the printed wiring board 11b correspond to the support hole 12c of the main body case 12 in order, and the three holes overlapped with each other. One notch is penetrated.

  The remaining two LEDs 11 are also positioned and arranged in the same manner as described above.

  In this state, the lead wire 18 of the LED 11 is led out from the bottom surface of the main body case 12.

  Next, the engaging step portion 13b of the cover member 13 is fitted to the inner surface of the main body case 12, and the cover member 13 is fixed to the main body case 12 by screwing the screw 12k into the screw hole 13e of the cover member from the support hole 12j at the center. To do.

  At this time, by screwing the screw 12k into the boss 13d, the bottom surface of the locking step portion 13b of the cover member 13 is pressed strongly against the outer edge portion of the heat conductive sheet 17 against the elasticity of the sheet and comes into close contact therewith.

  Next, the three optical units 16 configured in advance as described above are inserted one by one from the three through holes 13 c of the cover member 13 fixed to the main body case 12.

  That is, the concave grooves 15e and 15f of the support 15 are respectively matched with the projecting portions 12g and 12i of the opposing column bodies 12f and 12h, and the support 15 is gradually inserted from the through-hole 13c using the projecting portions as a guide. Then, the primary lens 11a of the LED 11 is inserted and fitted into the concave portion 14d at the bottom of the lens 14.

  Thereby, the cylindrical central axis of the recess 14d that coincides with the optical axis bb of the lens 14 coincides with the optical axis aa of the LED, and as a result, the optical axis aa of the LED and the optical axis bb of the lens 14 Are exactly matched.

  In this state, the center of the through-hole 13c and the optical axis bb of the lens and the optical axis aa of the LED exactly coincide with each other, and the upper surface of the lens 14 is substantially the same as the upper surface of the cover member 13. It is inserted.

  As a result, the output end 14a of the lens 14 constituting the optical unit 16 is disposed to be engaged with the through hole 13c of the cover member 13, and the input end 14b of the lens 14 is fixed to the body case 12 on the LED 11 side.

  As a result, the optical unit 16 is supported by the main body case 12 with the optical axis aa of the LED and the optical axis bb of the lens 14 positioned accurately.

  With this position, the screw hole 15d of the support body 15 has a support hole 12c of the main body case 12, a through hole 17a of the heat conductive sheet 17, a through hole 11d of the heat radiating plate 11c, and a notch 11e of the printed wiring board 11b. Since they match, the two screws 12e are inserted through the holes in the penetrating state and screwed.

  At this time, the printed wiring board 11 b and the heat radiating plate 11 c of the LED 11 are fixed in a state of being sandwiched between the bottom surface of the support 15 and the bottom surface of the main body case 12 via the heat conductive sheet 17.

  Thereby, the optical unit 16 is fitted and locked between the concave portion 14d of the bottom portion of the lens 14 and the primary lens 11a of the LED 11, in other words, the input end 14b of the lens 14 is fixed to the main body case 12 on the LED 11 side. The movement of the lens in the direction of the optical axis aa is restricted, and further, the upper portion of the support 15 that becomes the light output end 14a is fitted and locked in the through hole 13c, whereby the optical axis a- Movement in the direction orthogonal to a is restricted.

  Accordingly, the optical axis aa of the LED 11 and the optical axis bb of the optical unit 16 are not displaced, and the optical axes a-a and b are positioned and installed in a state where the optical axes are exactly coincident with each other. Light can be accurately emitted from the center of the matched through-hole 13c at a target light distribution angle.

  Similarly, the remaining two optical units 16 are inserted into the through-holes 13c of the cover member 13 and fixed by fitting.

  As described above, the three lenses 14 using the LEDs 11 as light sources are arranged on the upper surface of the cover member 13 at an equal interval of approximately 120 degrees, and the light distribution angle of the light emitted from each LED 11 is a predetermined angle. An illuminating device 10 having a disc shape set so as to be configured is configured.

  Incidentally, the illuminating device 10 has a size of about 70 mm in diameter and about 26 mm in height of the main body case 12 and the cover member 13, and a small and thin illuminating device as a spotlight is configured.

  The lead wire 18 of the illumination device 10 configured as described above is connected to a separate power supply unit to supply power to each LED 11.

  As a result, the three LEDs 11 are arranged at equal intervals with an angle of approximately 120 degrees, and the light distribution angle is set to a predetermined angle, and the light beam is emitted in a straight line downward, and is emitted. The desired spot lighting is performed by illuminating the exhibits inside.

  The heat generated from each LED 11 at the time of lighting is fixed by sandwiching the printed wiring board 11 b and the heat radiating plate 11 c of the LED 11 between the bottom surface of the support 15 and the bottom surface of the main body case 12 via the heat conductive sheet 17. Therefore, it is efficiently transmitted from the heat radiating plate 11c to the heat conductive sheet 17, transmitted from the heat conductive sheet 17 to the main body case 12 made of aluminum having good heat conductivity, and radiated from the outer surface of the main body case to the outside.

  At the same time, since the heat conductive sheet 17 and the bottom of the locking step portion 13b of the cover member 13 are in close contact with each other, heat is effectively transmitted to the cover member 13 made of aluminum having good thermal conductivity, Heat is also radiated from the outer surface of the cover member 13.

  Further, since the cover member 13 is fixed by fitting the locking step portion 13b to the inner surface of the main body case 12, the cover member 13 is in a state of fitting and contacting the main body case 12 in a state in which the concave and convex shapes are combined. The heat from 12 is effectively transmitted to the cover member 13 and radiated from the cover member.

  Further, since the cover member 13 is fixed to the main body case 12 and the screw 12k at the center, and the bottom surface of the boss 13d of the cover member 13 is tightened and fixed to the main body case 12 in close contact with the heat conducting sheet 17, the boss Heat is transmitted to the cover member 13 through 13d, and is radiated more efficiently.

  As a result, efficient heat dissipation is performed, and the temperature rise of each LED 11 can be suppressed to prevent a decrease in light emission efficiency, a decrease in luminous flux can be prevented, and a color shift of light does not occur. As a result, the exhibit can be illuminated with a desired color rendering effect.

  When the spotlight illumination device 10 installed as described above is disassembled for repair, inspection, or the like, the screw 12k at the center of the bottom surface of the main body case 12 is removed to separate the cover member 13 from the main body case 12. At this time, the light output end 14a at one end of the lens 14 is simply configured to be fitted and locked in the through hole 13c of the cover member 13, and the lens 14 and the cover member 13 can be easily removed.

  If the cover member 13 is separated, the support 15 supporting the lens 14 is exposed, and repair and inspection are possible. Further, if it is necessary to remove the LED 11 from the main body case 12, the screw 12 e of the corresponding LED 11 is removed from the bottom surface of the main body case 12.

  As a result, the support 15 is removed together with the lens 14, and the LED 11 fitted in the recess 14d of the lens 14 and the printed wiring board 11b and the heat radiating plate 11c held by the support 15 are both removed to repair or replace the LED. I do.

  When replacement and repair are completed, the assembly may be performed according to the above assembly procedure.

  In the present embodiment, each LED 11 is configured in white, but may be configured in red, yellow, green, or a combination of various colors depending on the use of the lighting device.

  Furthermore, although each LED11 was comprised by the thing of the same kind performance by which a light ray is mainly radiated | emitted to the optical axis aa, it may have a different performance.

  Although the lens 14 is made of a colorless and transparent synthetic resin, it may be colored in various colors of the LED, or may be translucent, not completely transparent, and not limited to a synthetic resin. You may comprise with the tempered glass which has.

  Although the support 15 of the optical unit 16 is divided into two parts, it may be divided into three parts, four parts, etc., or may be integrated without being divided.

  The support 15 is configured such that the inner surface that houses and supports the lens 14 is a surface that reflects light, such as white or mirror surface, and reflects light leaking from the lens 14 into the support 15 and returns to the lens 14. However, the optical loss may be reduced.

  Moreover, although the heat sink 11c of each LED11 was made to contact the heat conductive sheet 17 thermally, and LED11 was installed in the main body case 12, you may make it comprise a heat conductive sheet with the heat sink 11c itself of LED.

  Although the power supply unit having the lighting circuit is separately provided, a DC power supply and a lighting circuit may be housed in the main body case 12.

  Although the lighting device of the present embodiment is configured as a spotlight, the number of LEDs used may be increased or decreased to be configured as various lighting devices for home use or for stores, facilities, business use, and the like.

  According to the present embodiment, the optical unit 16 is configured by the lens 14 and the support 15 that supports the lens, and the optical output end 14 a of the lens is fitted and locked to the through hole 13 c of the cover member 13 by the support 15. Since the light input end 14b is fitted and locked to the LED 11 and fixed to the main body case on the LED side, the optical axis aa of the LED and the optical axis bb of the lens are accurately positioned. can do.

  Furthermore, since the optical axis aa of the LED and the optical axis bb of the lens can be accurately positioned by the support 15, the cover member 13 is fixed to the main body case 12 and the case is configured. The support 15 is inserted into the through-hole 13c of the cover member 13 to support the optical unit 16 at a predetermined mounting position with respect to the main body case, and then the LED 11 and the optical unit 16 are fixed to the main body case 12 with screws 12e. The assembly order can be taken, and an illuminating device in which the optical axis aa of the LED and the optical axis bb of the lens are accurately positioned without tilting the LED 11 and the lens 14 can be provided.

  Incidentally, the conventional configuration and assembly order shown in FIG. 5, that is, the LED 11 ′ is previously supported by the main body case 12 ′ by two screws 12 e ′ 12 e ′, and the lens 14 ′ is supported by the supported primary lens 11 a ′ of the LED. The concave portion 14d ′ is inserted to align the optical axis aa of the LED with the optical axis bb of the lens.

  In this state, the through hole 13c ′ of the cover member 13 ′ is placed on the main body case 12 ′ while being aligned with the light output end 14a ′ at the upper end of the lens, and the lens 14 ′ is fitted and supported in the through hole 13 ′. Yes.

  For this reason, the LED 11 'may be inclined depending on the tightening condition of the two screws 12e' (the ee line in the figure), and the lens 14 'is fitted in the concave lens 14d' to the primary lens 11a 'of the LED. Since it is supported in the state, it is easy to tilt (f-f line in the figure), and the LED and the lens are fitted and supported in the through-hole 13c 'of the cover member in a tilted state, and the optical axis of the LED and the optical of the lens It will be in the state where the axis shifted.

  However, in this embodiment, after fixing the cover member 13 to the main body case 12, the support body 15 supporting the lens 14 is inserted into the through hole 13c of the cover member, and the optical axis aa of the LED and the optical of the lens. Since the LED 11 and the optical unit 16 are supported on the main body case 12 with the screw 12e in a state where the axis b-b is accurately positioned, the LED optical axis and the optical axis of the lens are not tilted. There is no slippage.

  If the LED 11 and the lens 14 are tilted and fitted into the through-hole 13c of the cover member 13 and supported, a gap is formed between the light output ends 14a of the lenses fitted into the through-hole 13c. Although the above problem occurs, according to the present embodiment, the through hole 13c and the lens 14 are not displaced, there is no possibility that a gap is formed, and an illumination device that is excellent in appearance can be provided.

  Further, since the optical unit 16 is configured by fitting the flange portion 14c formed on the light output end 14a of the lens 14 and the concave groove 15a formed on the support body 15, a cylindrical shape formed by the support body 15 is formed. The axis cc and the optical axis bb of the lens 14 can be made to coincide with each other accurately.

  The support 15 has the concave grooves 15e and 15f inserted into the protrusions 12g and 12i of the pillars 12f and 12h, which are positioning members of the main body case 12, respectively. The unit 16 can be accurately positioned and supported while being guided to a predetermined mounting location of the main body case 12.

  Further, the cylindrical axis c-c of the support 15, that is, the optical axis bb of the lens exactly coincides with the center of the through hole 13 c of the cover member 13, and the through hole 13 c of the cover member 13 matches the support 15. The optical unit 16 having the lens 14 can be accurately aligned.

  Further, the printed wiring board 11b and the heat radiating plate 11c of the LED 11 are fixed in a state of being sandwiched via the heat conductive sheet 17 between the bottom surface of the support 15 and the bottom surface of the main body case 12 in the state of being positioned as described above. Therefore, the heat generated from the LED 11 can be efficiently transmitted from the heat radiating plate 11c to the heat conductive sheet 17, and is transmitted from the heat conductive sheet 17 to the case 12 made of aluminum or the like having good heat conductivity. Heat can be dissipated from the outer surface of the case.

  At this time, since a large number of protrusions 12b are formed on the outer peripheral surface of the main body case, the heat dissipation area is increased and heat dissipation is performed more effectively.

  Further, since the cover member 13 is fixed by fitting the locking step portion 13b to the inner surface of the main body case 12, the concave and convex shapes are combined, and further, fixed at the center portion by the main body case 12 and the screw 12k. Moreover, since the bottom surface of the boss 13d of the cover member 13 is tightened and fixed to the main body case 12 in close contact with the heat conducting sheet 17, heat is effectively transmitted to the cover member 13 and radiated more efficiently.

  As a result, efficient heat dissipation is performed, and the temperature rise of each LED 11 can be suppressed to prevent a decrease in light emission efficiency, and thus a decrease in luminous flux can be prevented and no color misregistration of light occurs.

  Accordingly, it is possible to illuminate the exhibit with a desired color rendering effect, and it is possible to prevent an increase in size of the lighting device and to provide a small lighting device.

  In addition, since the lighting device of the present embodiment is configured with three LEDs 11 arranged at substantially equal intervals with an angle of approximately 120 degrees, and configured as a small and thin disk-like shape in plan view as a whole. It is possible to provide a lighting device that is advantageous in terms of cost without causing a problem of installation space or a restriction on design.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and various design changes can be made without departing from the scope of the present invention.

The longitudinal cross-sectional view of the illuminating device which concerns on embodiment of this invention (vertical cross-sectional view in alignment with line AA of FIG. 2). The top view of an illuminating device. The top view which similarly shows the state which removed the cover member and lens of the illuminating device. The perspective view which decomposes | disassembles and shows the principal part of an illuminating device. The longitudinal cross-sectional view which cuts off one part and shows the conventional illuminating device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Illuminating device 11 Semiconductor light emitting element 12 Main body case 13 Cover member 13c Light transmission part 14 Optical path control means 15 Support body 16 Optical unit 17 Thermal conduction sheet

Claims (4)

A semiconductor light emitting device;
A body case for housing a semiconductor light emitting element;
A cover member that covers the main body case and has a translucent portion that transmits the light of the semiconductor light emitting element;
An optical unit comprising an optical path control means for controlling light of the semiconductor light emitting element and a support for supporting the optical path control means at a predetermined position with respect to the main body case;
An illumination device comprising: A semiconductor light emitting device;
A body case for housing a semiconductor light emitting element;
A cover member that covers the main body case and has a through hole that transmits light from the semiconductor light emitting element;
An optical path control means for controlling the light of the semiconductor light emitting element and a support for supporting the optical path control means. The light output end of the optical path control means is disposed in the through hole of the cover member via the support, and the light input end An optical unit fixed to the main body case on the semiconductor light emitting element side;
An illumination device comprising: The lighting device according to claim 1, wherein the support of the optical unit is supported by being locked to a positioning member provided in the main body case. The main body case and the cover member are made of a metal member having thermal conductivity, and the semiconductor light emitting element is installed and stored in the main body case via the heat conductive sheet, and the cover member is in thermal contact with the heat conductive sheet. The illumination device according to claim 1, wherein the illumination device is provided so as to cover the main body case.

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